CN112186366A - Digital coding frequency reconfigurable super surface wave absorber - Google Patents
Digital coding frequency reconfigurable super surface wave absorber Download PDFInfo
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- CN112186366A CN112186366A CN202011034013.2A CN202011034013A CN112186366A CN 112186366 A CN112186366 A CN 112186366A CN 202011034013 A CN202011034013 A CN 202011034013A CN 112186366 A CN112186366 A CN 112186366A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
- H01Q17/007—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems with means for controlling the absorption
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
- H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
- H01Q15/0086—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices said selective devices having materials with a synthesized negative refractive index, e.g. metamaterials or left-handed materials
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Abstract
The invention discloses a super-surface wave absorber with reconfigurable digital coding frequency, which comprises a plurality of wave absorbing units; and the coding of each wave absorbing unit is realized by injecting bias current into each single wave absorbing unit, so that the digital coding frequency reconstruction of the super-surface wave absorber is realized. According to the invention, the active device PIN switch diode is loaded on the dielectric layer unit to realize the coding of the unit, so that the same wave absorber can realize a plurality of wave absorbing states, the digital coding frequency is reconfigurable, and the wave absorbing structure is easy to design, regulate and control, easy to process and low in cost.
Description
Technical Field
The invention belongs to the field of electromagnetic materials, and particularly relates to a super-surface wave absorber with reconfigurable digital coding frequency.
Background
The electromagnetic super surface belongs to a two-dimensional electromagnetic super material, and is a novel artificial electromagnetic material. Compared with the traditional wave-absorbing material, the wave-absorbing material has the characteristics of simple structure, thinness, lightness and convenience in regulation and control, so that the wave-absorbing material is rapidly developed in the field of wave absorption. In particular to a digital electromagnetic metamaterial, which corresponds the state of an array unit to digital coding, and can realize different functions by independently regulating and controlling the state of the unit and combining different coding sequences, so that the electromagnetic material in the field of 'simulation' is combined with 'digital coding'.
The existing digital coding metamaterial mainly has the function of beam control facing reflection and transmission. At present, a super surface wave absorber with reconfigurable digital coding frequency is not seen.
Disclosure of Invention
The invention aims to provide a digital coding frequency reconfigurable super surface wave absorber which can realize digital coding frequency reconfiguration, is easy to process and has low cost.
The invention provides a super-surface wave absorber with reconfigurable digital coding frequency, which comprises a plurality of wave absorbing units; and the coding of each wave absorbing unit is realized by injecting bias current into each single wave absorbing unit, so that the digital coding frequency reconstruction of the super-surface wave absorber is realized.
The super surface wave absorber with reconfigurable digital coding frequency comprises a bottom plate, a honeycomb layer and a dielectric layer; a honeycomb layer is arranged on the bottom plate; the honeycomb layer is used for separating the medium layer from the bottom plate and supporting the medium layer; a medium layer is arranged on the honeycomb layer; the upper surface of the dielectric layer is the surface of a super-surface wave absorber with reconfigurable digital coding frequency, and the lower surface of the dielectric layer is provided with a plurality of conductors and a plurality of PIN switch diodes; the PIN switch diode is connected between the conductors; by injecting current into the conductor, bias current is generated on the PIN switch diode, and the PIN switch diode is ensured to be in different resistance states; each PIN switch diode and the conductor connected with the PIN switch diode form a wave absorbing unit.
The digital coding frequency reconfigurable super surface wave absorber comprises a metal bottom plate, a honeycomb layer and a dielectric layer; a honeycomb layer is arranged on the metal bottom plate; the honeycomb layer is used for insulating and separating the dielectric layer from the metal bottom plate and supporting the dielectric layer; a medium layer is arranged on the honeycomb layer; the upper surface of the dielectric layer is the surface of a super-surface wave absorber with reconfigurable digital coding frequency; a plurality of parallel bias lines are printed on the lower surface of the dielectric layer; a plurality of PIN switch diodes are uniformly printed on the lower surface of the dielectric layer corresponding to the area between two adjacent bias lines along the length direction of the bias lines, and two ends of each PIN switch diode are connected with the bias lines through printed rectangular conducting strips; the rectangular conducting plate and the bias line form the conductor; by injecting current into the bias line, bias current is generated on the PIN switch diode, and the PIN switch diode is ensured to be in different resistance states; each PIN switch diode, the rectangular conducting plate connected with the PIN switch diode and the bias line of the corresponding section form a wave absorbing unit.
The dielectric layer is an FR4 dielectric plate; the conductor is printed on the lower surface of the dielectric layer in a printed circuit board mode.
The thickness of the honeycomb layer is 2.5 mm; the thickness of the dielectric layer is 0.8 mm.
The wave absorbing unit comprises a bottom plate, a honeycomb layer and a medium layer; a honeycomb layer is arranged on the bottom plate; the honeycomb layer is used for separating the medium layer from the bottom plate and supporting the medium layer; a medium layer is arranged on the honeycomb layer; the upper surface of the medium layer is the upper surface of the wave absorbing unit, and the lower surface of the medium layer is provided with a plurality of electric conductors and a plurality of PIN switch diodes; the PIN switch diode is connected between the conductors; by injecting current into the conductor, bias current is generated on the PIN switch diode, and the PIN switch diode is ensured to be in an impedance state; the wave absorbing units are connected with each other to form the digital coding frequency reconfigurable super surface wave absorber.
The wave absorbing unit comprises a metal bottom plate, a honeycomb layer and a medium layer; a honeycomb layer is arranged on the metal bottom plate; the honeycomb layer is used for insulating and separating the dielectric layer from the bottom plate and supporting the dielectric layer; a medium layer is arranged on the honeycomb layer; the upper surface of the medium layer is the upper surface of the wave absorbing unit, and the lower surface of the medium layer is printed with a first conductive bias line, a second conductive bias line, a first rectangular conductive sheet, a second rectangular conductive sheet and a PIN switch diode; the first conductive bias line and the second conductive bias line are printed in parallel; the first rectangular conducting plate is connected with the first conducting bias line, the second rectangular conducting plate is connected with the second conducting bias line, and a PIN switch diode is connected between the first rectangular conducting plate and the second rectangular conducting plate; the first conductive bias line, the second conductive bias line, the first rectangular conductive sheet and the second rectangular conductive sheet form a conductor; injecting current into the first conductive bias line and the second conductive bias line to generate bias current on the PIN switch diode, so that the PIN switch diode is ensured to be in an impedance state; the wave absorbing units are connected with each other to form the digital coding frequency reconfigurable super surface wave absorber.
Each wave absorbing unit is 3mm long and 3mm wide; the length of the first conductive bias line is 3mm, and the width of the first conductive bias line is 0.1 mm; the length of the second conductive bias line is 3mm, and the width of the second conductive bias line is 0.1 mm; the length of the first rectangular conducting strip is 2mm, and the width of the first rectangular conducting strip is 1.9 mm; the length of the second rectangular conducting strip is 2mm, and the width of the second rectangular conducting strip is 1.9 mm; the interval between the first rectangular conducting strip and the second rectangular conducting strip is 1 mm.
The dielectric layer is an FR4 dielectric plate; the conductor is printed on the lower surface of the dielectric layer in a printed circuit board mode.
The thickness of the honeycomb layer is 2.5 mm; the thickness of the dielectric layer is 0.8 mm.
The super-surface wave absorber with the reconfigurable digital coding frequency, provided by the invention, realizes the coding of the units by loading the PIN switch diode of the active device on the dielectric layer unit, so that the same wave absorber can realize a plurality of wave absorbing states, and the digital coding frequency is reconfigurable, and the super-surface wave absorber is easy to design, regulate and control, easy to process and low in cost.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a first embodiment of a digital encoding frequency reconfigurable super surface absorber according to the present invention.
FIG. 2 is a schematic top view of the overall structure of a first embodiment of the digitally encoded frequency reconfigurable super surface absorber of the present invention.
Fig. 3 is a schematic structural diagram of a wave-absorbing unit of a second embodiment of the digital encoding frequency reconfigurable super surface wave absorber of the invention.
Fig. 4 is a schematic top-view dimension diagram of a wave-absorbing unit of a second embodiment of the digital encoding frequency reconfigurable super-surface wave absorber.
Fig. 5 is a schematic diagram of a change curve of reflectivity along with frequency corresponding to the wave absorbing unit in different conduction states in the second embodiment of the digital encoding frequency reconfigurable super surface wave absorber.
FIG. 6 is a schematic structural diagram of a digital encoding frequency reconfigurable super surface absorber according to an embodiment of the present invention.
FIG. 7 is a schematic diagram of a wave absorber surface reflectivity curve corresponding to different conducting states of a specific embodiment of the digital encoding frequency reconfigurable super surface wave absorber of the present invention.
Detailed Description
The invention provides a super-surface wave absorber with reconfigurable digital coding frequency, which comprises a plurality of wave absorbing units; and the coding of each wave absorbing unit is realized by injecting bias current into each single wave absorbing unit, so that the digital coding frequency reconstruction of the super-surface wave absorber is realized.
Specifically, the digital coding frequency reconfigurable super surface wave absorber comprises a bottom plate, a honeycomb layer and a dielectric layer; a honeycomb layer is arranged on the bottom plate; the honeycomb layer is used for separating the medium layer from the bottom plate and supporting the medium layer; a medium layer is arranged on the honeycomb layer; the upper surface of the dielectric layer is the surface of a super-surface wave absorber with reconfigurable digital coding frequency, and the lower surface of the dielectric layer is provided with a plurality of conductors and a plurality of PIN switch diodes; the PIN switch diode is connected between the conductors; by injecting current into the conductor, bias current is generated on the PIN switch diode, and the PIN switch diode is ensured to be in different resistance states; each PIN switch diode and the conductor connected with the PIN switch diode form a wave absorbing unit.
FIG. 1 is a schematic diagram of an overall structure of a first embodiment of a digital encoding frequency reconfigurable super surface absorber of the present invention: the digital coding frequency reconfigurable super surface wave absorber comprises a metal bottom plate (black part at the lowest layer in the figure), a honeycomb layer (middle transparent layer) and a dielectric layer (upper transparent layer); a honeycomb layer is arranged on the metal bottom plate; the honeycomb layer is used for insulating and separating the dielectric layer from the metal bottom plate and supporting the dielectric layer; a medium layer is arranged on the honeycomb layer; the upper surface of the dielectric layer is the surface of a super-surface wave absorber with reconfigurable digital coding frequency; a plurality of parallel bias lines are printed on the lower surface of the dielectric layer; a plurality of PIN switch diodes are uniformly printed on the lower surface of the dielectric layer corresponding to the area between two adjacent bias lines along the length direction of the bias lines, and two ends of each PIN switch diode are connected with the bias lines through printed rectangular conducting strips; the rectangular conducting plate and the bias line form the conductor; by injecting current into the bias line, bias current is generated on the PIN switch diode, and the PIN switch diode is ensured to be in different resistance states; each PIN switch diode, the rectangular conducting plate connected with the PIN switch diode and the bias line of the corresponding section form a wave absorbing unit.
In this embodiment, to enable convenient injection of bias current, the control of all cells of each row is simultaneous: because all cells in each row are biased with the same current across the cell.
In the first embodiment shown in fig. 1, the dielectric layer is an integral dielectric plate, and the bias line, the rectangular conducting strip and the PIN switch diode are printed on the lower surface of the dielectric plate in a printed circuit board manner; meanwhile, the wave absorbing body actually comprises 64 wave absorbing units of 8 × 8.
FIG. 2 is a schematic top view of the overall structure of a first embodiment of the digitally encoded frequency reconfigurable super surface absorber of the present invention: by injecting a current I on a total of 9 bias lines1～I8Thereby ensuring that each PIN switch diode is in an impedance state.
Meanwhile, different on-resistances are set to correspond to different codes: a state in which the on-resistance is close to 0 is regarded as a code "0", and a state in which the on-resistance is large is regarded as a code "1"; the code "1" of one unit only corresponds to one on-resistance, the on-resistances corresponding to the codes "1" of different units can be different, and the on-resistances corresponding to the codes "0" of all the units are the same (all are close to 0).
The method comprises the steps of coding each unit by adding a specific bias current to each unit, and combining a plurality of coding states, wherein wave absorber surfaces with different coding sequences have different resonant frequencies, and when the coding sequences change along with the change of external bias, the wave absorber surfaces show the reconfigurable characteristic of wave absorbing frequency, namely the reconfiguration of the resonant frequency of the wave absorber is realized.
In specific implementation, the dielectric layer is an FR4 dielectric board; the conductor is printed on the lower surface of the dielectric layer in a printed circuit board mode; the thickness of the honeycomb layer is 2.5 mm; the thickness of the dielectric layer is 0.8 mm; under the laboratory condition, the honeycomb layer is directly placed on the metal bottom plate, and the medium layer is also directly placed on the honeycomb layer; meanwhile, the honeycomb layer can also be directly bonded on the metal bottom plate, and the medium layer is also directly bonded on the honeycomb layer.
As another embodiment:
the wave absorbing unit comprises a bottom plate, a honeycomb layer and a medium layer; a honeycomb layer is arranged on the bottom plate; the honeycomb layer is used for separating the medium layer from the bottom plate and supporting the medium layer; a medium layer is arranged on the honeycomb layer; the upper surface of the medium layer is the upper surface of the wave absorbing unit, and the lower surface of the medium layer is provided with a plurality of electric conductors and a plurality of PIN switch diodes; the PIN switch diode is connected between the conductors; by injecting current into the conductor, bias current is generated on the PIN switch diode, and the PIN switch diode is ensured to be in an impedance state; the wave absorbing units are connected with each other to form the digital coding frequency reconfigurable super surface wave absorber.
Fig. 3 is a schematic structural diagram of a wave-absorbing unit of a second embodiment of the digital encoding frequency reconfigurable super-surface wave absorber of the present invention: the wave absorbing unit comprises a metal bottom plate, a honeycomb layer and a medium layer; a honeycomb layer is arranged on the metal bottom plate; the honeycomb layer is used for insulating and separating the dielectric layer from the bottom plate and supporting the dielectric layer; a medium layer is arranged on the honeycomb layer; the upper surface of the medium layer is the upper surface of the wave absorbing unit, and the lower surface of the medium layer is printed with a first conductive bias line, a second conductive bias line, a first rectangular conductive sheet, a second rectangular conductive sheet and a PIN switch diode; the first conductive bias line and the second conductive bias line are printed in parallel; the first rectangular conducting plate is connected with the first conducting bias line, the second rectangular conducting plate is connected with the second conducting bias line, and a PIN switch diode is connected between the first rectangular conducting plate and the second rectangular conducting plate; the first conductive bias line, the second conductive bias line, the first rectangular conductive sheet and the second rectangular conductive sheet form a conductor; injecting current into the first conductive bias line and the second conductive bias line to generate bias current on the PIN switch diode, so that the PIN switch diode is ensured to be in an impedance state; the wave absorbing units are connected with each other to form the digital coding frequency reconfigurable super surface wave absorber.
Fig. 4 is a schematic top-view dimension diagram of a wave-absorbing unit of a second embodiment of the digital encoding frequency reconfigurable super-surface wave absorber of the present invention: each wave absorbing unit is 3mm long and 3mm wide; the length of the first conductive bias line is 3mm, and the width of the first conductive bias line is 0.1 mm; the length of the second conductive bias line is 3mm, and the width of the second conductive bias line is 0.1 mm; the length of the first rectangular conducting strip is 2mm, and the width of the first rectangular conducting strip is 1.9 mm; the length of the second rectangular conducting strip is 2mm, and the width of the second rectangular conducting strip is 1.9 mm; the interval between the first rectangular conducting strip and the second rectangular conducting strip is 1 mm.
Meanwhile, the dielectric layer is an FR4 dielectric plate; the conductor is printed on the lower surface of the dielectric layer in a printed circuit board mode. The thickness of the honeycomb layer is 2.5 mm; the thickness of the dielectric layer is 0.8 mm.
Fig. 5 is a schematic diagram showing a change curve of reflectivity along with frequency of a wave-absorbing unit in a second embodiment of the digital encoding frequency reconfigurable super-surface wave-absorber of the present invention in different conducting states: when the on-resistance is 3ohm, the surface of the wave absorbing unit shows total reflection to the incident electromagnetic wave; when the on-resistance is 400ohm, the reflectivity of the surface of the wave absorbing unit in 9-13.5 GHz is lower than-10 dB.
Under the condition of a laboratory, all the wave absorbing units are closely arranged and can be directly placed. But the individual wave absorbing elements may be bonded to each other for robustness. The bias line between adjacent wave-absorbing units requires short circuit: this embodiment is essentially the same as the first embodiment when the bias lines between adjacent absorbing elements are short-circuited.
Fig. 6 is a schematic structural diagram of a specific embodiment of the digital encoding frequency reconfigurable super surface absorber of the present invention: in this embodiment, four wave absorbing units are arranged in a row and combined to form a wave absorbing body. Fig. 6 shows the correspondence between the coding state and the on-resistance of each unit of the four-unit combination, wherein the on-resistance of the PIN switch diode corresponding to the coding state "1" of one unit is 1200 ohm.
FIG. 7 is a schematic diagram of the wave absorber surface reflectivity curves corresponding to different conducting states of a specific embodiment of the digital encoding frequency reconfigurable super-surface wave absorber of the present invention: 7(a) -7 (f) show the reflectivity of the absorber surface at 2-14GHz for each cell with different coding order by injecting current on the bias line. Wherein, the impedance of the first unit is 0 when being 3ohm, and the impedance of the first unit is 1 when being 1200 ohm; the impedance of the second unit to the fourth unit is 0 when 3ohm, and 1 when 400 ohm; wherein, when the coding sequence is '0000', the total reflection is approached in the frequency range. It can be seen from fig. 7(b) to 7(f) that the resonant frequency of the surface of the absorber gradually increases as the coding sequence changes. This means that the frequency reconfigurable characteristic of the wave absorber can be realized by changing the coding sequence of the wave absorbing units.
Claims (10)
1. A super surface wave absorber with reconfigurable digital coding frequency is characterized by comprising a plurality of wave absorbing units; and the coding of each wave absorbing unit is realized by injecting bias current into each single wave absorbing unit, so that the digital coding frequency reconstruction of the super-surface wave absorber is realized.
2. The digitally encoded frequency reconfigurable super surface absorber of claim 1, comprising a backplane, a honeycomb layer, and a dielectric layer; a honeycomb layer is arranged on the bottom plate; the honeycomb layer is used for separating the medium layer from the bottom plate and supporting the medium layer; a medium layer is arranged on the honeycomb layer; the upper surface of the dielectric layer is the surface of a super-surface wave absorber with reconfigurable digital coding frequency, and the lower surface of the dielectric layer is provided with a plurality of conductors and a plurality of PIN switch diodes; the PIN switch diode is connected between the conductors; by injecting current into the conductor, bias current is generated on the PIN switch diode, and the PIN switch diode is ensured to be in different resistance states; each PIN switch diode and the conductor connected with the PIN switch diode form a wave absorbing unit.
3. The digitally encoded frequency reconfigurable super surface acoustic wave device according to claim 2, comprising a metal substrate, a honeycomb layer and a dielectric layer; a honeycomb layer is arranged on the metal bottom plate; the honeycomb layer is used for insulating and separating the dielectric layer from the metal bottom plate and supporting the dielectric layer; a medium layer is arranged on the honeycomb layer; the upper surface of the dielectric layer is the surface of a super-surface wave absorber with reconfigurable digital coding frequency; a plurality of parallel bias lines are printed on the lower surface of the dielectric layer; a plurality of PIN switch diodes are uniformly printed on the lower surface of the dielectric layer corresponding to the area between two adjacent bias lines along the length direction of the bias lines, and two ends of each PIN switch diode are connected with the bias lines through printed rectangular conducting strips; the rectangular conducting plate and the bias line form the conductor; by injecting current into the bias line, bias current is generated on the PIN switch diode, and the PIN switch diode is ensured to be in different resistance states; each PIN switch diode, the rectangular conducting plate connected with the PIN switch diode and the bias line of the corresponding section form a wave absorbing unit.
4. The digitally encoded frequency reconfigurable super surface acoustic wave device according to claim 2 or 3, wherein said dielectric layer is an FR4 dielectric board; the conductor is printed on the lower surface of the dielectric layer in a printed circuit board mode.
5. The digitally encoded frequency reconfigurable super surface absorber according to claim 2 or 3, wherein said honeycomb layer is 2.5mm thick; the thickness of the dielectric layer is 0.8 mm.
6. The digitally encoded frequency reconfigurable super surface absorber of claim 1, wherein the wave absorbing element comprises a bottom plate, a honeycomb layer and a dielectric layer; a honeycomb layer is arranged on the bottom plate; the honeycomb layer is used for separating the medium layer from the bottom plate and supporting the medium layer; a medium layer is arranged on the honeycomb layer; the upper surface of the medium layer is the upper surface of the wave absorbing unit, and the lower surface of the medium layer is provided with a plurality of electric conductors and a plurality of PIN switch diodes; the PIN switch diode is connected between the conductors; by injecting current into the conductor, bias current is generated on the PIN switch diode, and the PIN switch diode is ensured to be in an impedance state; the wave absorbing units are connected with each other to form the digital coding frequency reconfigurable super surface wave absorber.
7. The digitally encoded frequency reconfigurable super surface absorber of claim 6, wherein said wave absorbing element comprises a metal base plate, a honeycomb layer and a dielectric layer; a honeycomb layer is arranged on the metal bottom plate; the honeycomb layer is used for insulating and separating the dielectric layer from the bottom plate and supporting the dielectric layer; a medium layer is arranged on the honeycomb layer; the upper surface of the medium layer is the upper surface of the wave absorbing unit, and the lower surface of the medium layer is printed with a first conductive bias line, a second conductive bias line, a first rectangular conductive sheet, a second rectangular conductive sheet and a PIN switch diode; the first conductive bias line and the second conductive bias line are printed in parallel; the first rectangular conducting plate is connected with the first conducting bias line, the second rectangular conducting plate is connected with the second conducting bias line, and a PIN switch diode is connected between the first rectangular conducting plate and the second rectangular conducting plate; the first conductive bias line, the second conductive bias line, the first rectangular conductive sheet and the second rectangular conductive sheet form a conductor; injecting current into the first conductive bias line and the second conductive bias line to generate bias current on the PIN switch diode, so that the PIN switch diode is ensured to be in an impedance state; the wave absorbing units are connected with each other to form the digital coding frequency reconfigurable super surface wave absorber; the wave absorbing units are connected with each other, and the bias lines of the adjacent wave absorbing units are directly connected to form the digital coding frequency reconfigurable super surface wave absorber.
8. The digitally encoded frequency reconfigurable super surface absorber according to claim 7, wherein each absorber element is 3mm long and 3mm wide; the length of the first conductive bias line is 3mm, and the width of the first conductive bias line is 0.1 mm; the length of the second conductive bias line is 3mm, and the width of the second conductive bias line is 0.1 mm; the length of the first rectangular conducting strip is 2mm, and the width of the first rectangular conducting strip is 1.9 mm; the length of the second rectangular conducting strip is 2mm, and the width of the second rectangular conducting strip is 1.9 mm; the interval between the first rectangular conducting strip and the second rectangular conducting strip is 1 mm.
9. The digitally encoded frequency reconfigurable super surface acoustic wave device according to any one of claims 6 to 8, wherein the dielectric layer is an FR4 dielectric board; the conductor is printed on the lower surface of the dielectric layer in a printed circuit board mode.
10. The digitally encoded frequency reconfigurable super surface absorber according to any of claims 6 to 8, wherein the thickness of the honeycomb layer is 2.5 mm; the thickness of the dielectric layer is 0.8 mm.
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| CN113067161A (en) * | 2021-03-26 | 2021-07-02 | 北京环境特性研究所 | Broadband reconfigurable material based on amplitude modulation |
| CN116864994A (en) * | 2023-08-04 | 2023-10-10 | 中南大学 | Double-impedance-layer high-performance wave-absorbing structure |
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