CN112179920A - Method and system for detecting chip bonding wire defects - Google Patents
Method and system for detecting chip bonding wire defects Download PDFInfo
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- CN112179920A CN112179920A CN202011365827.4A CN202011365827A CN112179920A CN 112179920 A CN112179920 A CN 112179920A CN 202011365827 A CN202011365827 A CN 202011365827A CN 112179920 A CN112179920 A CN 112179920A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
- G01N2021/95646—Soldering
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
- G01N2021/95661—Inspecting patterns on the surface of objects for PCB's for leads, e.g. position, curvature
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Abstract
The invention relates to a method and a system for detecting defects of bonding wires of a chip.A detection light source is used for uniformly irradiating the chip in an imaging view field of a detection camera, so that the bonding wires on the chip in the view field can receive light rays at a specific angle; the chip bonding wire part is divided into n areas according to the shape, wherein n is more than or equal to 3; the specific angle is set to enable the light rays irradiated by the m areas to be reflected to enter a detection lens connected with a detection camera when the light rays irradiate the n areas, and m is more than or equal to 1 and less than n; the m regions are imaged into bright regions in the detection camera, and the bright regions are used as characteristic point regions. And judging the defect type by analyzing and comparing the detected characteristic point area information of the chip bonding wire with the characteristic point area information of the qualified bonding wire. The wire bonding defect detection method and system do not need a 3D scheme, and are high in efficiency and low in cost.
Description
Technical Field
The invention relates to the technical field of chip detection, in particular to a method and a system for detecting defects of bonding wires of a chip.
Background
Due to the rapid development of machine vision technology, more and more industries have started to select machine vision technology to replace manual work for product quality detection. The wire bonding method of the chip is to weld a wire arc from the top end of the chip to the bracket by a wire bonding machine, the wire bonding process is very complex and immature, and the welded wire arc can often not meet the standard, such as forward inclination of the wire arc, backward pulling of the wire arc, wire collapse, wire warping, triangular line type and other defects. In the actual application process, due to the fact that bonding wires are out of standard, PN (positive-negative) extremely short circuit can be caused, the whole chip cannot be used, and therefore the chips with the wire arc defects need to be removed before packaging. The existing detection method is to detect whether defects exist by observing line arcs from all directions through human eyes, and the manual detection method is slow in efficiency, incapable of unifying detection standards and easy to be influenced by personal factors. Yet another approach is to use 3D detection schemes such as spectroscopic confocal, white light interferometry, and triangulation. The 3D detection scheme has high accuracy, but the detection efficiency is very slow and the equipment cost is high. And the existing 3D detection scheme can not carry out three-dimensional reconstruction on the whole arc, and partial arc information is lost, so that incomplete arc detection is caused, and the existing 3D detection scheme can not meet the actual requirement. An optical system and a detection method are designed, a characteristic point (a curved part of a wire arc) is found out through the reflection principle of light, different types of wire arc defects are detected through different expression forms of the characteristic point, and the optical system and the detection method are low in cost and high in efficiency.
Disclosure of Invention
Aiming at the defects of the prior art, the invention discloses a detection method and a detection system for judging the chip bonding wire defects through a characteristic point area, and compared with the existing manual detection mode or 3D scheme in the prior art, the detection method and the detection system are high in efficiency and low in cost.
The optical imaging system and the detection method for detecting the wire arc defects of the bonding wires are provided, and various wire arc defects can be detected through a 2D scheme.
The imaging detection system comprises a detection camera, a detection lens and a detection light source. The detection camera and the detection lens guarantee the imaging precision, and the characteristics of the bonding wires can be shot clearly. The detection camera and the detection lens also ensure the depth of field of the imaging system and ensure that the whole welding wire can be imaged clearly. The detection light source is determined according to an imaging system consisting of the detection camera and the detection lens and the type of a chip to be detected, so that products in the imaging field can be uniformly irradiated in the required field of view, and all the products can receive light beams at the same angle. The detection camera can be an area-array camera or a line-scan camera, and is preferably an area-array camera; the lens can be a common industrial lens or a telecentric lens, preferably the telecentric lens has excellent optical performance and quality, has larger depth of field than the common lens, high resolution, low distortion, no viewing angle error and higher measurement precision.
The invention discloses a method for detecting defects of bonding wires of a chip, which can detect the defects of the bonding wires through a 2D scheme, and the method for detecting the defects of the bonding wires of the chip comprises the following steps: using a detection light source to uniformly irradiate the chip in the imaging view of the detection camera, so that the bonding wires on the chip in the view can receive light rays at a specific angle;
the chip bonding wire part is divided into n areas according to the shape, wherein n is more than or equal to 3; the specific angle is set to enable the light rays irradiated by the m areas to be reflected to enter a detection lens connected with a detection camera when the light rays irradiate the n areas, and m is more than or equal to 1 and less than n; the m regions are imaged into bright regions in the detection camera, and the bright regions are used as characteristic point regions.
And judging the defect type by analyzing and comparing the detected characteristic point area information of the chip bonding wire with the characteristic point area information of the qualified bonding wire.
The defect types include: forward inclination of the line arc, backward drawing of the line arc, line collapse, line warping and triangular line type. The detection light source is preferably a custom ring light.
The chip may be an LED chip or an IC chip. And when the chip is an LED chip, the characteristic point region information is position and length. And when the chip is an IC chip, the characteristic point area information is length.
When the chip is an LED chip, the LED chip bonding wire is divided into four areas, wherein the four areas are an area I, an area II, an area III and an area IV respectively, the area I is an area from a first welding point of the bonding wire to a bending point at the top end of the bonding wire, the area II is an area from the bending point at the top end of the bonding wire, the area III is an area from the bending point at the top end of the bonding wire to a second bending point, and the area IV is an area from the second bending point to the second welding point; the feature point region comprises a first feature point region and a second feature point region, the second region is the first feature point region, and the fourth region is the second feature point region; during detection, if the position of the first characteristic point area is moved backwards and is lengthened compared with the position of the second characteristic point area of the qualified bonding wire of the LED chip, and the position and the length of the second characteristic point area are unchanged compared with the position and the length of the second characteristic point area of the qualified bonding wire of the LED chip, the defect type is judged to be a backward-pulling defect, and if the position of the first characteristic point area is moved forwards and the length of the first characteristic point area is shortened compared with the position and the length of the second characteristic point area of the qualified bonding wire of the LED chip, the defect type is judged to be a forward-tilting defect.
When the chip is an IC chip, the bonding wires of the IC chip are divided into three areas, the three areas are respectively an area I, an area II and an area III, the area I is an area from a first welding point of the bonding wire to a top end bending point of a wire arc, the area II is a smooth area from the top end of the wire arc of the bonding wire, the area III is an area from the top end bending point of the wire arc of the bonding wire to a second welding point, the area II is set as a characteristic point area, and when the defect type is judged to be a triangular defect if the length of the characteristic point area is shorter than that of the characteristic point area of the qualified bonding wire of the IC chip.
The invention also discloses a chip bonding wire defect detection system which can use the chip bonding wire defect detection method, the chip bonding wire defect detection system comprises a detection camera, a detection lens and a detection light source, the angle and the height of the detection light source are correspondingly adjusted according to an imaging system consisting of the detection camera and the detection lens and the type of the chip bonding wire to be detected, the detection light source uniformly irradiates the chip in the imaging field of view of the detection camera, so that the bonding wire on the chip in the field of view can receive the light with a specific angle.
Preferably, the detection camera is an area-array camera or a line-scan camera; the lens is a telecentric lens.
Compared with the prior art, the technical scheme provided by the invention has the following effects:
according to the method for detecting the bonding wire defects, a 3D scheme is not needed, the chip bonding wire defects can be detected through the 2D scheme, the judgment of the chip bonding wire quality can be completed only by analyzing the information of the characteristic point area and comparing the information of the characteristic point area with the information of the characteristic point area of an OK product, and compared with the existing manual detection mode or the 3D scheme in the prior art, the method is high in efficiency and low in cost. The bonding wire defect detection system comprises a detection camera, a detection lens and a detection light source, is simple in structure, easy to assemble and operate, high in detection efficiency, low in cost and wide in application range, and is suitable for chip bonding wires such as LED chip bonding wires or IC chip bonding wires.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic view illustrating a wire bonding defect detection system according to a first embodiment of the invention.
Fig. 2 is a schematic view of a bonding wire structure according to a first embodiment of the invention.
Fig. 3-1 shows a normal LED chip bonding wire actual imaging.
Fig. 3-2 is an actual image of a wire bonding of an LED chip with a wire loop pull-back defect.
FIG. 4 is a diagram of bonding wires of an IC chip according to a second embodiment.
FIG. 5-1 shows an actual image of bonding wires of a normal IC chip.
FIG. 5-2 is a diagram showing an actual image of a bonding wire of an IC chip with a triangular line defect.
1-1: detecting a camera; 1-2: detecting a lens; 1-3: detecting a light source; 2-1: a first area; 2-2: a second area; 2-3: a third area; 2-4: area four; 4-1: a first area; 4-2: a second area; 4-3: and a third area.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
EXAMPLE I (LED chip)
Because the bonding wire is ensured not to directly contact the LED chip to cause short circuit in practical application, the wire arc can be bent during the bonding wire, and a bending point exists. The light beams with specific angles are reflected when irradiating the bending points, part of the reflected light beams enter the lens, the bending points can be seen as bright points in imaging, and other arc areas without bending do not enter the lens after all the light beams are reflected, so that the areas are imaged as dark lines.
Next, we refer to the region of the bending point as a feature point region, and the bright point in imaging as a feature point region. In actual production, if a fault occurs in the wire bonding process, some wire arc defects, such as forward arc leaning and backward arc pulling, can occur. If the line arc is pulled backwards, the bending point moves backwards, and the bending vertex is usually stretched, so that the light beams of the light rays at a specific angle reflected by the bending vertex and entering the lens are increased, the characteristic point area is lengthened and the position moves backwards after imaging, and the line arc is judged to be the line arc pulling backwards defect by comparing with the characteristic point of the OK product. If the line arc is inclined forwards, the bending point moves forwards, so that the light rays of a specific angle reflected by the bending vertex and entering the lens are reduced, and the position of the characteristic point moves forwards and is reduced after imaging.
As shown in FIG. 1, the optical system is composed of a detection camera 1-1, a detection lens 1-2 and a detection light source 1-3. The detection camera is an area-array camera, the detection lens is a telecentric lens, and the detection light source is an annular light source.
One example of a detection light source in the detection system of the present invention uses a 70 ° ring light to ensure that the LEDs receive a 70 ° beam of light over a 19mm x 19mm field of view.
As shown in FIG. 2, the gold wire of the LED can be divided into four regions, wherein a region I2-1 represents a region from the first welding point of the bonding wire to the bending point of the top end of the wire arc, a region II 2-2 represents a region from the bending point of the top end of the wire arc of the bonding wire, a region III 2-3 represents a region from the bending point of the top end of the wire arc of the bonding wire to the bending point of the LED bracket, and a region IV 2-4 represents a region from the bending point of the LED bracket to the second welding point. As shown in fig. 2, the light beam emitted by the detection light source cannot be irradiated to the first area, which results in darkening of the first area. And the light beam emitted by the detection light source irradiates the second area to be reflected, and the reflected light beam part enters the camera, so that the second area is lightened. The light beam emitted by the detection light source irradiates the area III to be emitted, but the reflected light beam does not enter the lens, and the camera cannot receive the light beam reflected by the area III, so that the area III becomes dark. The light beam emitted by the detection light source irradiates the area four, and the reflected light beam part of the light beam part enters the camera, so that the area four is lightened. The actual imaging effect is shown in fig. 3-1, the area two and the area four are bright points, i.e., feature point areas, and the area one and the area three are dark areas. For region two and region four, the highlighted regions are called feature point region one and feature point region two, region two corresponds to feature point region one, and region four corresponds to feature point region two. If the product has the line arc back-drawing defect, the second characteristic point area is lengthened and relatively moved backwards, one position of the second characteristic point area is moved backwards and lengthened, the second characteristic point area is unchanged, and the actual effect graph is shown in fig. 3-2.
EXAMPLE two (IC product)
Another example of a detection light source in the detection system of the present invention is a 60 ° ring light, which ensures that the IC receives a 60 ° beam in a 6.7mm by 4.5mm field of view.
As shown in FIG. 4, the gold wire of the IC can be divided into three regions, region one 4-1 representing the region from the first bond to the tip bend point of the wire bond, region two 4-2 representing the region from the tip of the wire bond to the smooth region, and region three 4-3 representing the region from the tip bend point of the wire bond to the second bond. The light beam emitted by the detection light source cannot irradiate the first area, so that the first area is darkened. And the light beam emitted by the detection light source irradiates the second area to be reflected, and the reflected light beam part enters the camera, so that the second area is lightened. The light beam emitted by the detection light source irradiates the area III to be emitted, but the reflected light beam does not enter the lens, and the camera cannot receive the light beam reflected by the area III, so that the area III becomes dark. The actual imaging effect is shown in fig. 5-1, the area two is a bright point, i.e., a characteristic point area, and the area one and the area three are dark areas. If the product has triangular line type defects, the actual effect graph of the second shortened area is shown in fig. 5-2.
The appearance of the characteristic points is related to the height of the camera lens and the height of the detection light source, and the reflection of the light beam obeys the reflection law. The law of reflection of light is as follows:
(1) when light is reflected, the reflected light ray, the incident light ray and the normal are all in the same plane.
(2) When light is reflected, the reflected light and the incident light are separated at two sides of the normal.
(3) When light is reflected, the angle of reflection is equal to the angle of incidence.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that are within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. A method for detecting chip bonding wire defects is characterized in that: using a detection light source to uniformly irradiate the chip in the imaging view of the detection camera, so that the bonding wires on the chip in the view can receive light rays at a specific angle;
the chip bonding wire part is divided into n areas according to the shape, wherein n is more than or equal to 3; the specific angle is set to enable the light rays irradiated by the m areas to be reflected to enter a detection lens connected with a detection camera when the light rays irradiate the n areas, and m is more than or equal to 1 and less than n; the m regions are imaged into bright regions in a detection camera, and the bright regions are used as characteristic point regions;
and judging the defect type by analyzing and comparing the detected characteristic point area information of the chip bonding wire with the characteristic point area information of the qualified bonding wire.
2. The method of claim 1, wherein the method comprises: the defect types include: forward inclination of the line arc, backward drawing of the line arc, line collapse, line warping and triangular line type.
3. The method for detecting chip bonding wire defects according to claim 1 or 2, wherein: the detection light source is preferably a custom ring light.
4. The method for detecting chip bonding wire defects according to claim 1 or 2, wherein: the chip is an LED chip or an IC chip.
5. The method of claim 4, wherein the method comprises: and when the chip is an LED chip, the characteristic point region information is position and length.
6. The method of claim 4, wherein the method further comprises: and when the chip is an IC chip, the characteristic point area information is length.
7. The method of claim 5, wherein the step of detecting the die wire bonding defects comprises: when the chip is an LED chip, the LED chip bonding wire is divided into four areas, wherein the four areas are an area I, an area II, an area III and an area IV respectively, the area I is an area from a first welding point of the bonding wire to a bending point at the top end of the bonding wire, the area II is an area from the bending point at the top end of the bonding wire, the area III is an area from the bending point at the top end of the bonding wire to a second bending point, and the area IV is an area from the second bending point to the second welding point; the feature point region comprises a first feature point region and a second feature point region, the second region is the first feature point region, and the fourth region is the second feature point region; during detection, if the position of the first characteristic point area is moved backwards and is lengthened compared with the position of the second characteristic point area of the qualified bonding wire of the LED chip, and the position and the length of the second characteristic point area are unchanged compared with the position and the length of the second characteristic point area of the qualified bonding wire of the LED chip, the defect type is judged to be a backward-pulling defect, and if the position of the first characteristic point area is moved forwards and the length of the first characteristic point area is shortened compared with the position and the length of the second characteristic point area of the qualified bonding wire of the LED chip, the defect type is judged to be a forward-tilting defect.
8. The method of claim 6, wherein the method comprises: when the chip is an IC chip, the bonding wires of the IC chip are divided into three areas, the three areas are respectively an area I, an area II and an area III, the area I is an area from a first welding point of the bonding wire to a top end bending point of a wire arc, the area II is a smooth area from the top end of the wire arc of the bonding wire, the area III is an area from the top end bending point of the wire arc of the bonding wire to a second welding point, the area II is set as a characteristic point area, and when the defect type is judged to be a triangular defect if the length of the characteristic point area is shorter than that of the characteristic point area of the qualified bonding wire of the IC chip.
9. An inspection system capable of using the method of detecting die bond defects according to any one of claims 1 to 8, wherein: the detection light source irradiates a chip in the imaging field of the detection camera uniformly, so that the bonding wires on the chip in the field of view can receive light rays at a specific angle.
10. The detection system of claim 9, wherein: the detection camera is an area-array camera or a line-scan camera; the lens is preferably a telecentric lens.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112834529A (en) * | 2021-01-06 | 2021-05-25 | 深圳格兰达智能装备股份有限公司 | 3D defect detection system and method based on multi-angle imaging |
| CN113192027A (en) * | 2021-04-29 | 2021-07-30 | 华南理工大学 | Detection method and application of high-power LED module packaging defects |
| CN114813783A (en) * | 2022-03-31 | 2022-07-29 | 慧之安信息技术股份有限公司 | Chip surface flaw detection method |
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Application publication date: 20210105 Assignee: Suzhou Gaoshi Semiconductor Technology Co.,Ltd. Assignor: Gaoshi Technology (Suzhou) Co.,Ltd. Contract record no.: X2021990000430 Denomination of invention: A detection method and system for chip welding line defects Granted publication date: 20210413 License type: Common License Record date: 20210722 |
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