CN112179383A - Flexible sensor, preparation method thereof and method for simultaneously measuring rigidity and dielectric constant - Google Patents
Flexible sensor, preparation method thereof and method for simultaneously measuring rigidity and dielectric constant Download PDFInfo
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- CN112179383A CN112179383A CN202010873908.9A CN202010873908A CN112179383A CN 112179383 A CN112179383 A CN 112179383A CN 202010873908 A CN202010873908 A CN 202010873908A CN 112179383 A CN112179383 A CN 112179383A
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- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/24—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
- G01D5/241—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes
- G01D5/2417—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes by varying separation
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- G01M5/00—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings
- G01M5/0083—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings by measuring variation of impedance, e.g. resistance, capacitance, induction
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- G—PHYSICS
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- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
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Abstract
The invention relates to a flexible sensor, a preparation method thereof and a method for simultaneously measuring rigidity and dielectric constant thereof, which comprises a flexible substrate, a binding layer and a conducting layer which are sequentially arranged from bottom to top; the horizontal cross sections of the bonding layer and the conductive layer are the same in shape, and the bonding layer and the conductive layer form two electrodes which are insulated from each other in the same plane; the thickness of the bonding layer is less than the thickness of the conductive layer, and the conductivity of the bonding layer is less than the conductivity of the conductive layer. The method for simultaneously measuring the rigidity and the dielectric constant comprises the following steps of 1, adopting two flexible sensors to respectively cling to two sides of the same object to be measured; step 2, measuring the change of capacitance C between the two flexible sensors when the object to be measured is extruded and deformed, and calculating to obtain the rigidity of the object to be measured; and measuring the change of the electrode capacitance C' in the flexible sensor, and calculating the dielectric constant of the object to be measured. The flexible sensor has small volume, light weight, flexibility, high efficiency and batch production, and can measure the rigidity and the dielectric constant simultaneously.
Description
Technical Field
The invention relates to the field of sensors, in particular to a flexible sensor, a preparation method thereof and a method for simultaneously measuring rigidity and dielectric constant.
Background
The new sensors became a very active field of engineering research into the 21 st century, which together with computer technology and communication was called the three major legs of information technology. The sensor can sense the specified measured quantity and convert the measured quantity into a usable signal according to a certain rule, and is an essential component for the system to sense the external environment. The rigidity of the object is an important mechanical parameter for representing the elastic deformation resistance of the object, and the larger the rigidity of the object is, the smaller the deformation is when the object is stressed. Dielectric constant, also known as permittivity or relative permittivity, is an important data characterizing the electrical properties of a dielectric or insulating material.
The existing method for measuring the rigidity and the dielectric constant of an object is also complex, and the measuring device also has the problems of large volume and high requirement on the shape of a sample. Moreover, most of the existing sensors are made of hard materials such as metal, cannot be bent greatly and are difficult to be installed on various complex curved surfaces.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a flexible sensor, a preparation method thereof and a method for simultaneously measuring rigidity and dielectric constant. The flexible sensor has small volume, light weight, flexibility, high efficiency and batch production, and can measure the rigidity and the dielectric constant simultaneously.
The invention is realized by the following technical scheme:
a flexible sensor comprises a flexible substrate, a bonding layer and a conductive layer which are arranged from bottom to top in sequence;
the horizontal cross sections of the bonding layer and the conductive layer are the same in shape, and the bonding layer and the conductive layer form two electrodes which are insulated from each other in the same plane;
the thickness of the bonding layer is smaller than that of the conductive layer, and the conductivity of the bonding layer is smaller than that of the conductive layer.
Preferably, the electrodes are interdigitated in shape.
Preferably, a flexible protective layer is fixedly arranged on the conductive layer, and an opening communicated with the conductive layer is formed in the flexible protective layer.
A method for simultaneously measuring rigidity and dielectric constant by a flexible sensor based on the flexible sensor comprises the following steps,
Preferably, in step 2, when the object to be measured is deformed by being pressed, the displacement between the two flexible sensors is calculated by measuring the change of the capacitance C between the two flexible sensors, and further the deformation generated when the object to be measured is pressed is calculated, so that the rigidity of the object to be measured is calculated.
Further, in step 2, the distance between the two flexible sensors after the two flexible sensors are tightly attached to the surface of the object to be measured is d, and the capacitance between the two flexible sensors is C ═ f (d);
by measuring the capacitance C between the two flexible sensors, the deformation delta d of the object to be measured after being stressed is calculated, and further the rigidity of the object to be measured is calculated by a rigidity formula,
the formula for the stiffness is:
in the formula, k is the rigidity of the object to be measured, F is the force acting on the object to be measured, and Δ d is the deformation of the object to be measured caused by the force.
Preferably, in step 2, the capacitance C' of the interdigital electrode of the conductive layer in the flexible sensor is measured, and the dielectric constant of the object to be measured is calculated.
Further, the dielectric constant is calculated by the formula
C’＝g()，
Wherein, the dielectric constant of the object to be measured and C' is the capacitance of the interdigital electrode.
A method for preparing a flexible sensor based on any one of the above flexible sensors comprises the following steps,
and 4, transferring the pattern to the bonding layer and the conductive layer by adopting a stripping process to form two mutually insulated electrodes, and finally forming the flexible sensor.
Preferably, in step 4, a flexible polymer is covered on the conductive layer to form a flexible protection layer, and a part of the flexible polymer is removed by photolithography and etching processes to form an opening communicating with the conductive layer.
Compared with the prior art, the invention has the following beneficial technical effects:
the invention provides a flexible sensor, which is characterized in that a conductive layer is arranged in the flexible sensor, the flexible sensor deforms after being stressed by an object to be measured, the capacitance of the conductive layer is changed, the capacitance change of the conductive layer and the capacitance change between two insulated electrodes are measured, the rigidity and the dielectric constant of the object to be measured can be further calculated, the flexible substrate enables the sensor to be bent, and the weight of the sensor is reduced; and simultaneously, the rigidity and the dielectric constant of the object to be measured are measured, and the structure and the signal processing system of the sensor are simplified. And the bonding force between the flexible substrate and the conducting layer is increased by arranging the bonding layer, so that the conducting layer is prevented from being easily separated from the flexible substrate. The flexible sensor has the advantages of simple structure, few parts and small device volume. The conducting layer can be bent greatly during measurement, and the method is suitable for measured objects with various shapes.
Furthermore, a flexible protective layer is fixedly arranged on the conducting layer, and holes are formed in the flexible protective layer and communicated with the conducting layer. The flexible protective layer can protect the internal structure of the sensor, so that the flexible dielectric constant sensor is more stable and durable.
The method for simultaneously measuring rigidity and dielectric constant by flexible sensor can further obtain rigidity of the object to be measured by measuring capacitance change of the flexible sensors arranged at two sides when the object to be measured is deformed, and can calculate dielectric constant of the object to be measured by measuring capacitance of interdigital electrodes of the sensors. The rigidity and the dielectric constant of the object to be measured are measured simultaneously by the same sensor, the structure of the sensor and a signal processing system can be simplified, the operation is simple, and the measurement result is accurate. The method avoids the complexity of the traditional method for measuring the rigidity and the dielectric constant of the object, and is suitable for the measured objects with various shapes.
According to the preparation method of the flexible sensor, the flexible sensor is prepared by adopting the MEMS technology and the micro-nano manufacturing technology, and compared with a sensor prepared in a machining mode, the preparation method of the flexible sensor is beneficial to large-scale processing. The flexible substrate is made of flexible polymer, so that the sensor can be bent, and the weight of the sensor is reduced; the bonding layer and the conducting layer are prepared by adopting a micro-nano manufacturing technology, so that the conducting layer can be bent greatly and can be suitable for tested objects with various shapes. The preparation method of the flexible sensor has good compatibility and high production efficiency.
Drawings
FIG. 1 is a cross-sectional view of a flexible sensor according to an embodiment of the invention.
Fig. 2 is a schematic diagram of the shape of the electrode of the flexible sensor according to the embodiment of the invention.
Fig. 3 is a schematic view of a flexible sensor according to an embodiment of the present invention.
In the figure: the sensor comprises a flexible substrate 1, a bonding layer 2, a conductive layer 3, a flexible protective layer 4, a flexible sensor 5, an object to be detected 6 and an opening 7.
Detailed Description
The present invention will now be described in further detail with reference to specific examples, which are intended to be illustrative, but not limiting, of the invention.
The invention relates to a flexible sensor capable of simultaneously measuring rigidity and dielectric constant.A flexible sensor 5 comprises a flexible substrate 1, a binding layer 2, a conducting layer 3 and a flexible protective layer 4 which are sequentially arranged from bottom to top; wherein the flexible substrate 1 is made of a flexible polymer; the bonding layer 2 is made of metal; the conductive layer 3 is made of metal; the flexible protective layer 4 is made of a flexible polymer. The horizontal cross sections of the bonding layer 2 and the conductive layer 3 are the same, and the bonding layer 2 and the conductive layer 3 form two electrodes which are insulated from each other in the same plane; the thickness of the bonding layer 2 is smaller than that of the conductive layer 3, and the conductivity of the bonding layer 2 is smaller than that of the conductive layer 3. The flexible protective layer 4 covers the conductive layer 3, and can protect the conductive layer 3. The flexible cover 4 is perforated in some areas 7 to bond the conductive layer 3 to a wire, the other end of which is connected to a test meter for reading data.
The thickness of the flexible substrate 1 is 10-1000 microns, the thickness of the bonding layer 2 is 20-200 nanometers, and the thickness of the conducting layer 3 is 100-1000 nanometers; the thickness of the flexible protective layer 4 is 10-1000 microns.
The flexible substrate 1 is made of any one of polyimide, polydimethylsiloxane, and polyethylene terephthalate; the bonding layer 2 is made of chromium or titanium; the conductive layer 3 is made of one of gold, silver, aluminum, and platinum; the flexible protective layer 4 is made of any one of polyimide, polydimethylsiloxane, and polyethylene terephthalate. Flexible polymers have found widespread use in the electronics industry and in microelectromechanical systems due to their low density and flexibility. The flexible substrate made of flexible polymers such as polyimide has the advantages of low cost, good process performance and good chemical stability.
The bonding layer 2 and the conductive layer 3 form two electrodes which are insulated from each other in the same plane, which is a horizontal plane and parallel to the surface of the flexible substrate 1. The electrode shapes of the bonding layer 2 and the conducting layer 3 are interdigital to improve the sensitivity of the sensor, and the two electrodes are not overlapped and contacted with each other in properties and positions, so that the two electrodes are insulated. The bonding layer 2 is made of metal in order to increase the bonding force between the flexible substrate 1 and the conductive layer 3, and a common material is chromium or titanium. The conductive layer 3 is made of a material having higher conductivity, but the conductive layer 3 is easily separated from the flexible substrate 1, so that the bonding layer 2 is added to be relatively thin, and the bonding layer 2 can increase the bonding force between the conductive layer 3 and the flexible substrate 1. And by optimizing the geometrical parameters of the bonding layer 2 and the conductive layer 3 the sensitivity of the flexible sensor 5 can be further increased.
The flexible sensor 5 has simple structure and few parts, and is realized by a micro-nano manufacturing process, so the device has small volume. The flexible sensor 5 has the advantages of simple structure, small volume, light weight and loose requirements on a test sample, and the flexible protective layer 4 can protect the internal structure of the sensor, so that the flexible sensor 5 is more stable and durable. And when the flexible sensor 5 is used for measuring, the detection sensitivity is high, the measuring speed is high, and the operation is simple.
The invention discloses a method for simultaneously measuring rigidity and dielectric constant by flexible sensors, wherein two flexible sensors 5 are divided into a group and are placed on two sides of the same object 6 to be measured. When the object 6 to be measured is extruded and deformed, the distance between the two flexible sensors 5 in the same group is changed, the capacitance C between the two flexible sensors 5 is changed, and an output signal is generated; when the object 6 to be measured contacts the flexible sensor 5, the capacitance C' of the interdigital electrode of the conductive layer 3 in the flexible sensor 5 changes, and an output signal is generated. By measuring the change of the capacitance C between the two flexible sensors 5 in the same group, the deformation of the object 6 to be measured under pressure can be measured, and the rigidity of the object to be measured can be calculated. By measuring the capacitance C' of the interdigital electrode of the conductive layer 3 in the flexible sensor 5, the dielectric constant of the object to be measured can be calculated.
The rigidity and the dielectric constant of the object 6 to be measured can be measured simultaneously by the same flexible sensor 5, the complexity of the traditional method for measuring the rigidity and the dielectric constant of the object is avoided, the method is suitable for various samples, the structure and the signal processing system of the sensor can be simplified by adopting the method, the measuring operation is simple, and the measuring result is accurate.
The invention also provides a preparation method of the flexible sensor, which comprises the following steps:
and 4, transferring the pattern to the bonding layer 2 and the conductive layer 3 by adopting a stripping process to form two mutually insulated electrodes and finally form the flexible sensor 5.
In step 4, a flexible polymer is covered on the conductive layer 3 to form a flexible protection layer 4, and a part of the flexible polymer is removed by photolithography and etching processes to form an opening 7 communicating with the conductive layer 3.
According to the preparation method, the flexible sensor is prepared by adopting the MEMS technology and the micro-nano manufacturing technology, and compared with a sensor prepared in a machining mode, the preparation method is beneficial to large-scale processing. The flexible substrate is made of flexible polymer, so that the sensor can be bent, and the weight of the sensor is reduced; the bonding layer and the conducting layer are prepared by adopting a micro-nano manufacturing technology, so that the conducting layer can be bent greatly and can be suitable for tested objects with various shapes. The preparation method adopted by the invention has good compatibility and high production efficiency, and is suitable for large-scale processing. Has important significance for the popularization and the application of the sensor.
Example 1
As shown in fig. 1, the present embodiment provides a flexible sensor capable of measuring stiffness and dielectric constant simultaneously, and the flexible sensor sequentially includes: a flexible substrate 1, a bonding layer 2, a conductive layer 3 and a flexible protective layer 4; wherein the flexible substrate 1 is polyimide with the thickness of 100 microns; the bonding layer 2 is 20 nm thick chromium; the conductive layer 3 is gold 200 nm thick;
as shown in fig. 2, the bonding layer 2 and the conductive layer 3 each constitute mutually insulated interdigital electrodes in the same plane.
As shown in fig. 3, when measuring the stiffness, two flexible sensors 5 are respectively attached to two sides of the same object 6 to be measured. When the object 6 to be measured is extruded and deformed, the distance between the two flexible sensors 5 is changed, and the capacitance C between the two flexible sensors 5 is changed accordingly. By measuring the change of the capacitance C between the two flexible sensors 5, the displacement between the two flexible sensors 5 is calculated, and further the deformation generated when the object 6 to be measured is pressed is calculated, so that the rigidity of the object 6 to be measured is calculated. When the dielectric constant is measured, the flexible sensor 5 is in contact with the object 6 to be measured, so that the capacitance C' of the interdigital electrode formed by the bonding layer 2 and the conductive layer 3 is changed. And measuring the capacitance C' change of the interdigital electrode, and further calculating the dielectric constant of the object to be measured 6.
When measuring the rigidity, the two flexible sensors 5 are placed on two parallel surfaces of the same object 6 to be measured, so that the flexible protection layers 4 of the two flexible sensors 5 are tightly attached to the object 6 to be measured. The length of the object 6 to be measured is d, the distance between two flexible sensors 5 tightly attached to the surface of the object 6 to be measured is also d, and the capacitance between the two flexible sensors 5 is C ═ f (d), which is a function of the distance d. By measuring the capacitance C between the two flexible sensors 5, the deformation Δ d of the object 6 to be measured after being stressed can be calculated. Further by definition of stiffness
And calculating the rigidity of the object to be measured 6, wherein k is the rigidity of the object to be measured 6, and F is the force acting on the object to be measured 6.
When measuring the dielectric constant, the flexible protective layer 4 of the flexible sensor 5 is pressed against the object 6 to be measured. The bonding layer 2 and the conductive layer 3 in the same flexible sensor 5 constitute interdigital electrodes. The capacitance C 'of the interdigital electrode corresponds to the dielectric constant of the object to be measured 6 one by one, and the function relationship is C' ═ g (), wherein the function relationship is the dielectric constant of the object to be measured. By measuring the capacitance C' of the interdigital electrodes in the same flexible sensor 5, the dielectric constant of the object 6 to be measured can be calculated.
The preparation method of the flexible sensor capable of simultaneously measuring the rigidity and the dielectric constant comprises the following steps:
step 8, carrying out photoetching and developing to obtain a patterned photoresist;
and 9, taking the photoresist as a protective layer, removing the flexible polymer in the area which is not protected by the photoresist through a corrosion process, and forming an opening 7 communicated with the conductive layer 3 to obtain the flexible sensor 5.
In step 1 of the preparation method, the specific method for cleaning the flexible substrate 1 is as follows: the flexible substrate 1 was ultrasonically cleaned in analytically pure acetone, analytically pure absolute ethanol and deionized water, respectively, for 15 minutes. After the flexible substrate is blow-dried by high-purity nitrogen, the flexible substrate 1 is placed on a hot plate at 70 ℃ for drying.
The specific mode of photoetching in the step 2 is to use a negative photoresist, and the exposure time is 20-25 seconds. The negative glue is adopted to facilitate the stripping process in the step 5.
In the step 4, depositing chromium on the surface of the flexible substrate 1 by adopting an electron beam evaporation method to form a bonding layer 2; depositing gold on the surface of the bonding layer 2 by adopting an electron beam evaporation method to form a conductive layer 3;
in step 5, the stripping process comprises the following specific steps: and soaking the photoresist by using acetone and cleaning the photoresist by using ultrasonic waves to fully dissolve the photoresist.
The specific way of photoetching in the step 8 is to adopt positive photoresist, and the exposure time is 10-15 seconds. The used photoresist is positive photoresist and has stronger corrosion resistance. During corrosion, a tetramethyl ammonium hydroxide solution with the concentration of 5% is adopted.
Claims (10)
1. A flexible sensor is characterized by comprising a flexible substrate (1), a bonding layer (2) and a conducting layer (3) which are arranged from bottom to top in sequence;
the horizontal cross section shapes of the bonding layer (2) and the conducting layer (3) are the same, and the bonding layer (2) and the conducting layer (3) form two electrodes which are insulated from each other in the same plane;
the thickness of the bonding layer (2) is smaller than that of the conductive layer (3), and the conductivity of the bonding layer (2) is smaller than that of the conductive layer (3).
2. A flexible sensor according to claim 1, wherein said electrodes are interdigitated in shape.
3. A flexible sensor according to claim 1, wherein the conductive layer is fixedly provided with a flexible protective layer (4), and the flexible protective layer (4) is provided with an opening (7) communicated with the conductive layer (3).
4. A method for simultaneously measuring rigidity and dielectric constant of a flexible sensor, which is based on the flexible sensor of any one of claims 1 to 3, comprising the steps of,
step 1, two flexible sensors (5) are respectively and tightly attached to two sides of the same object to be detected (6);
step 2, measuring the change of capacitance C between the two flexible sensors (5) when the object (6) to be measured is extruded and deformed, and calculating to obtain the rigidity of the object (6) to be measured; and measuring the change of the electrode capacitance C' in the flexible sensor (5) and calculating the dielectric constant of the object to be measured (6).
5. The method for simultaneously measuring the rigidity and the dielectric constant by the flexible sensor according to claim 4, wherein in the step 2, when the object (6) to be measured is deformed by compression, the displacement between the two flexible sensors (5) is calculated by measuring the change of the capacitance C between the two flexible sensors (5), and further the deformation generated when the object (6) to be measured is pressed is calculated, so that the rigidity of the object (6) to be measured is calculated.
6. The method for simultaneously measuring the rigidity and the dielectric constant by the flexible sensor according to claim 5, wherein in the step 2, the distance between the two flexible sensors (5) which are tightly attached to the surface of the object to be measured (6) is d, and the capacitance between the two flexible sensors (5) is C ═ f (d);
by measuring the capacitance C between the two flexible sensors (5), the deformation delta d of the object (6) to be measured after being stressed is calculated, and further the rigidity of the object (6) to be measured is calculated by a rigidity formula,
the formula for the stiffness is:
in the formula, k is the rigidity of the object (6), F is the force acting on the object (6), and delta d is the deformation of the object (6) under stress.
7. The method for simultaneously measuring the rigidity and the dielectric constant of the flexible sensor as claimed in claim 4, wherein in the step 2, the capacitance C' of the interdigital electrode of the conductive layer (3) in the flexible sensor (5) is measured, and the dielectric constant of the object (6) to be measured is calculated.
8. The method of claim 7, wherein the dielectric constant is calculated by the formula
C’＝g()，
Wherein, the dielectric constant of the object (6) to be measured and C' is the capacitance of the interdigital electrode.
9. A method for manufacturing a flexible sensor, characterized in that the flexible sensor according to any one of claims 1 to 3 comprises the steps of,
step 1, cleaning a flexible substrate (1) made of a flexible polymer;
step 2, carrying out photoetching treatment on the cleaned flexible substrate (1), and transferring a photoetching pattern to the flexible substrate (1);
step 3, respectively forming a bonding layer (2) and a conducting layer (3) on the surface of the flexible substrate (1) by adopting electron beam evaporation deposition of different metals;
and 4, transferring the pattern to the bonding layer (2) and the conductive layer (3) by adopting a stripping process to form two mutually insulated electrodes and finally form the flexible sensor (5).
10. A method for manufacturing a flexible sensor according to claim 9, wherein in step 4, the conductive layer (3) is covered with a flexible polymer to form a flexible protection layer (4), and the flexible polymer is partially removed by photolithography and etching processes to form the opening (7) communicating with the conductive layer (3).
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| CN113175948A (en) * | 2021-03-31 | 2021-07-27 | 西安交通大学 | Flexible integrated sensor and method for simultaneously measuring temperature, pressure and medium |
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