CN112176377A - Electroplating process of lead frame - Google Patents
Electroplating process of lead frame Download PDFInfo
- Publication number
- CN112176377A CN112176377A CN202011094392.4A CN202011094392A CN112176377A CN 112176377 A CN112176377 A CN 112176377A CN 202011094392 A CN202011094392 A CN 202011094392A CN 112176377 A CN112176377 A CN 112176377A
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- Prior art keywords
- lead frame
- cleaning
- silver
- solution
- washing
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- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000009713 electroplating Methods 0.000 title claims abstract description 13
- 238000004140 cleaning Methods 0.000 claims abstract description 50
- 238000007747 plating Methods 0.000 claims abstract description 46
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 41
- 229910052709 silver Inorganic materials 0.000 claims abstract description 41
- 239000004332 silver Substances 0.000 claims abstract description 41
- 238000005406 washing Methods 0.000 claims abstract description 41
- 238000001035 drying Methods 0.000 claims abstract description 37
- 229910052802 copper Inorganic materials 0.000 claims abstract description 26
- 239000010949 copper Substances 0.000 claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 25
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000002253 acid Substances 0.000 claims abstract description 11
- 238000011084 recovery Methods 0.000 claims abstract description 8
- 238000005238 degreasing Methods 0.000 claims abstract description 6
- 238000006386 neutralization reaction Methods 0.000 claims abstract description 6
- 239000000243 solution Substances 0.000 claims description 55
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 39
- 239000008367 deionised water Substances 0.000 claims description 30
- 229910021641 deionized water Inorganic materials 0.000 claims description 30
- 238000004070 electrodeposition Methods 0.000 claims description 25
- 239000008151 electrolyte solution Substances 0.000 claims description 11
- 238000005868 electrolysis reaction Methods 0.000 claims description 10
- 230000002378 acidificating effect Effects 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 7
- 239000008399 tap water Substances 0.000 claims description 7
- 235000020679 tap water Nutrition 0.000 claims description 7
- 238000004064 recycling Methods 0.000 claims description 5
- 238000002791 soaking Methods 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 abstract description 7
- 238000004381 surface treatment Methods 0.000 abstract description 3
- 238000002845 discoloration Methods 0.000 abstract 1
- 238000007664 blowing Methods 0.000 description 6
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention belongs to the technical field of surface treatment of lead frames, and particularly relates to an electroplating process of a lead frame. A series of processes such as feeding → electrolytic degreasing → cleaning → acid cleaning → neutralization → cleaning → copper preplating → cleaning → copper plating → cleaning → preplating → washing → preplating silver → cleaning → local silver plating → silver recovery → silver stripping → cyaniding cleaning → anti-copper discoloration → cleaning → drying → blanking are adopted to realize the electroplating process of the lead frame, so that a uniform plating layer can be obtained during copper plating and silver plating in the later stage, and the lead frame subjected to silver recovery and silver stripping treatment is placed in a potassium cyanide solution to improve the welding wettability of a silver plating film and improve the welding quality of a chip.
Description
Technical Field
The invention belongs to the technical field of surface treatment of lead frames, and particularly relates to an electroplating process of a lead frame.
Background
In recent years, the electronic information industry has been rapidly developed, and the contribution of integrated circuit technology has been great. An integrated circuit device requires an integrated circuit chip, and also requires a plurality of materials such as lead frames, gold wires, plastic packages, etc., which are processed through a plurality of processes. In the production process of the integrated circuit element, the integrated circuit lead frame plays an important role in bearing the integrated circuit chip, provides a base, a welding lead and a guide pin for the integrated circuit chip, and needs to be subjected to surface treatment, namely electroplating, in order to achieve the weldability among the frame, the chip and gold wires and the electrical parameter performance of the integrated circuit element. Control of the electroplating process is therefore important.
However, the welding wettability of the plating layer obtained by the existing process is poor, and the welding wettability directly influences the welding quality; we propose a process for electroplating lead frames for this purpose.
Disclosure of Invention
The invention aims to provide an electroplating process of a lead frame, which mainly aims at the current situation of the prior art and solves the problems in the prior art.
In order to achieve the purpose, the invention specifically adopts the following technical scheme:
an electroplating process of a lead frame comprises the following steps:
feeding → degreasing by electrolysis → washing → acid washing → neutralization → washing → preplating → washing → coppering → washing → preplating → washing → partially plating silver → silver recycling → de-silvering → cyaniding washing → preventing discolouration of copper → washing → drying → feeding
S1, putting a lead frame into an electrolytic solution for electrolysis for 30-120 s, circularly stirring by using ultrasonic waves in the electrolytic process, and then cleaning by using tap water and drying;
s2, putting the lead frame processed in the step S1 into H2 S04Soaking the solution at room temperature for 10-20 s, then cleaning with tap water, cleaning with deionized water, and drying;
s3, putting the lead frame processed in the step S2 into a KCN solution to neutralize acidic substances;
s4, putting the lead frame processed in the step S3 into an alkaline copper plating solution for electrodeposition for 20-25S, and then cleaning with deionized water and drying;
s5, putting the lead frame processed in the step S4 into an acid copper plating solution for electrodeposition for 20-25S, and then cleaning the lead frame with deionized water and drying the lead frame;
s6, immersing the lead frame processed in the step S5 into a silver pre-plating solution for electrodeposition for 3-5S, and then cleaning the lead frame with deionized water and drying the lead frame;
s7, immersing the functional area of the lead frame processed in the step S6 into local silver plating solution for electrodeposition for 3-5S, cleaning with deionized water, and drying;
s8, placing the lead frame processed in the step S7 into a potassium cyanide solution after silver recovery and silver stripping;
s9, immersing the lead frame processed in the step S8 in a Cuprotec solution, performing electrodeposition for 20-25S, cleaning with deionized water, and drying;
further, the temperature of the electrolytic solution in the step S1 is kept at 35-50 ℃, and the current density is 2-10A/dm2。
Further, H in the step S22 S04The concentration of (A) is 10-15%.
Further, the mass concentration of KCN in the step S3 is 15-30 g/L.
Further, the mass concentration of the potassium cyanide solution in step S8 is 1%.
Further, the concentration of the Cuprotecec solution in the step S9 is 15-30 mL/L, the pH value is 12.5-14, the temperature is 35-50 ℃, and the processing time is 190-220S.
Further, the copper plating layer has a purity of greater than 99% and a thickness of greater than 3.5 um.
Compared with the prior art, the invention has the beneficial effects that:
1. in the invention, the KCN solution is adopted to neutralize the acidic substances in the electrolytic solution, so that the acidic substances are prevented from being brought into the subsequent copper plating process, and the surface of the metal is activated at the same time, thereby being beneficial to obtaining a uniform plating layer during the subsequent copper plating and silver plating.
2. The lead frame after silver recovery and silver stripping treatment is placed in potassium cyanide solution to improve the welding wettability of the silver-plated film.
Detailed Description
In order to achieve the purpose, the invention specifically adopts the following technical scheme:
example 1
An electroplating process of a lead frame comprises the following steps:
feeding → degreasing by electrolysis → washing → acid washing → neutralization → washing → preplating → washing → coppering → washing → preplating → washing → partially plating silver → silver recycling → de-silvering → cyaniding washing → preventing discolouration of copper → washing → drying → feeding
S1, putting the lead frame into an electrolytic solution for electrolysis for 30s, circularly stirring the lead frame by ultrasonic waves in the electrolytic process, cleaning the lead frame by tap water, and drying the lead frame by blowing, wherein the temperature of the electrolytic solution is kept at 35 ℃ in the electrolytic process, and the current density is 2A/dm2。
S2, putting the lead frame processed in the step S1 into H2 S04Soaking the solution at room temperature for 10-20 s, H2S04The mass concentration of the water is 10-15%, then the water is used for cleaning, and the water is used for cleaning and then is dried by blowing after being cleaned by deionized water;
s3, the lead frame processed in the step S2 is placed into a KCN solution to neutralize acidic substances, and the mass concentration of KCN is 15-30 g/L.
S4, putting the lead frame processed in the step S3 into an alkaline copper plating solution for electrodeposition for 20-25S, and then cleaning with deionized water and drying;
s5, putting the lead frame processed in the step S4 into an acid copper plating solution for electrodeposition for 20-25S, and then cleaning the lead frame with deionized water and drying the lead frame;
s6, immersing the lead frame processed in the step S5 into a silver pre-plating solution for electrodeposition for 3-5S, and then cleaning the lead frame with deionized water and drying the lead frame;
s7, immersing the functional area of the lead frame processed in the step S6 into local silver plating solution for electrodeposition for 3-5S, cleaning with deionized water, and drying;
s8, placing the lead frame processed in the step S7 into a potassium cyanide solution after silver recovery and silver stripping;
s9, immersing the lead frame processed in the step S8 in a Cuprotec solution, performing electrodeposition for 20-25S, cleaning with deionized water, and drying;
in step S8, the potassium cyanide solution has a mass concentration of 1%, and if immersion cleaning does not improve the wettability of the silver-plated film, the workpiece is cleaned by applying current to the workpiece as a cathode, and if the cyanide solution is contaminated, the workpiece is applied current to the workpiece as an anode.
The concentration of the Cuprotecec solution in the step S9 is 15-30 mL/L, the pH value is 12.5-14, the temperature is 35-50 ℃, and the processing time is 190-220S.
The purity of the copper plating layer is more than 99%, and the thickness is more than 3.5 um.
Example 2
Feeding → degreasing by electrolysis → washing → acid washing → neutralization → washing → preplating → washing → coppering → washing → preplating → washing → partially plating silver → silver recycling → de-silvering → cyaniding washing → preventing discolouration of copper → washing → drying → feeding
S1, putting the lead frame into an electrolytic solution for electrolysis for 60s, circularly stirring the lead frame by ultrasonic waves in the electrolytic process, cleaning the lead frame by tap water, and drying the lead frame by blowing, wherein the temperature of the electrolytic solution is kept at 45 ℃ in the electrolytic process, and the current density is 6A/dm2。
S2, putting the lead frame processed in the step S1 into H2 S04Soaking the solution at room temperature for 10-20 s, H2S04The mass concentration of the water is 10-15%, then the water is used for cleaning, and the water is used for cleaning and then is dried by blowing after being cleaned by deionized water;
s3, the lead frame processed in the step S2 is placed into a KCN solution to neutralize acidic substances, and the mass concentration of KCN is 15-30 g/L.
S4, putting the lead frame processed in the step S3 into an alkaline copper plating solution for electrodeposition for 20-25S, and then cleaning with deionized water and drying;
s5, putting the lead frame processed in the step S4 into an acid copper plating solution for electrodeposition for 20-25S, and then cleaning the lead frame with deionized water and drying the lead frame;
s6, immersing the lead frame processed in the step S5 into a silver pre-plating solution for electrodeposition for 3-5S, and then cleaning the lead frame with deionized water and drying the lead frame;
s7, immersing the functional area of the lead frame processed in the step S6 into local silver plating solution for electrodeposition for 3-5S, cleaning with deionized water, and drying;
s8, placing the lead frame processed in the step S7 into a potassium cyanide solution after silver recovery and silver stripping;
s9, immersing the lead frame processed in the step S8 in a Cuprotec solution, performing electrodeposition for 20-25S, cleaning with deionized water, and drying;
in step S8, the potassium cyanide solution has a mass concentration of 1%, and if immersion cleaning does not improve the wettability of the silver-plated film, the workpiece is cleaned by applying current to the workpiece as a cathode, and if the cyanide solution is contaminated, the workpiece is applied current to the workpiece as an anode.
The concentration of the Cuprotecec solution in the step S9 is 15-30 mL/L, the pH value is 12.5-14, the temperature is 35-50 ℃, and the processing time is 190-220S.
The purity of the copper plating layer is more than 99%, and the thickness is more than 3.5 um.
Example 3
Feeding → degreasing by electrolysis → washing → acid washing → neutralization → washing → preplating → washing → coppering → washing → preplating → washing → partially plating silver → silver recycling → de-silvering → cyaniding washing → preventing discolouration of copper → washing → drying → feeding
S1, putting the lead frame into an electrolytic solution for electrolysis for 120s, circularly stirring the lead frame by using ultrasonic waves in the electrolytic process, cleaning the lead frame by using tap water, and drying the lead frame by blowing, wherein the temperature of the electrolytic solution is kept at 50 ℃ in the electrolytic process, and the current density is 10A/dm2。
S2, lead frame processed in step S1Put into H2 S04Soaking the solution at room temperature for 10-20 s, H2S04The mass concentration of the water is 10-15%, then the water is used for cleaning, and the water is used for cleaning and then is dried by blowing after being cleaned by deionized water;
s3, the lead frame processed in the step S2 is placed into a KCN solution to neutralize acidic substances, and the mass concentration of KCN is 15-30 g/L.
S4, putting the lead frame processed in the step S3 into an alkaline copper plating solution for electrodeposition for 20-25S, and then cleaning with deionized water and drying;
s5, putting the lead frame processed in the step S4 into an acid copper plating solution for electrodeposition for 20-25S, and then cleaning the lead frame with deionized water and drying the lead frame;
s6, immersing the lead frame processed in the step S5 into a silver pre-plating solution for electrodeposition for 3-5S, and then cleaning the lead frame with deionized water and drying the lead frame;
s7, immersing the functional area of the lead frame processed in the step S6 into local silver plating solution for electrodeposition for 3-5S, cleaning with deionized water, and drying;
s8, placing the lead frame processed in the step S7 into a potassium cyanide solution after silver recovery and silver stripping;
s9, immersing the lead frame processed in the step S8 in a Cuprotec solution, performing electrodeposition for 20-25S, cleaning with deionized water, and drying;
in step S8, the potassium cyanide solution has a mass concentration of 1%, and if immersion cleaning does not improve the wettability of the silver-plated film, the workpiece is cleaned by applying current to the workpiece as a cathode, and if the cyanide solution is contaminated, the workpiece is applied current to the workpiece as an anode.
The concentration of the Cuprotecec solution in the step S9 is 15-30 mL/L, the pH value is 12.5-14, the temperature is 35-50 ℃, and the processing time is 190-220S.
The purity of the copper plating layer is more than 99%, and the thickness is more than 3.5 um.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (7)
1. An electroplating process of a lead frame comprises the following steps:
feeding → degreasing by electrolysis → washing → acid washing → neutralization → washing → preplating → washing → coppering → washing → preplating → washing → partially plating silver → silver recycling → de-silvering → cyaniding washing → preventing discolouration of copper → washing → drying → feeding
S1, putting a lead frame into an electrolytic solution for electrolysis for 30-120 s, circularly stirring by using ultrasonic waves in the electrolytic process, and then cleaning by using tap water and drying;
s2, putting the lead frame processed in the step S1 into H2 S04Soaking the solution at room temperature for 10-20 s, then cleaning with tap water, cleaning with deionized water, and drying;
s3, putting the lead frame processed in the step S2 into a KCN solution to neutralize acidic substances;
s4, putting the lead frame processed in the step S3 into an alkaline copper plating solution for electrodeposition for 20-25S, and then cleaning with deionized water and drying;
s5, putting the lead frame processed in the step S4 into an acid copper plating solution for electrodeposition for 20-25S, and then cleaning the lead frame with deionized water and drying the lead frame;
s6, immersing the lead frame processed in the step S5 into a silver pre-plating solution for electrodeposition for 3-5S, and then cleaning the lead frame with deionized water and drying the lead frame;
s7, immersing the functional area of the lead frame processed in the step S6 into local silver plating solution for electrodeposition for 3-5S, cleaning with deionized water, and drying;
s8, placing the lead frame processed in the step S7 into a potassium cyanide solution after silver recovery and silver stripping;
s9, the lead frame processed in the step S8 is immersed in Cuprotec solution, and is subjected to electrodeposition for 20-25S, then is cleaned by deionized water and is dried.
2. A method as claimed in claim 1The electroplating process of the lead frame is characterized in that: the temperature of the electrolytic solution in the step S1 is kept at 35-50 ℃, and the current density is 2-10A/dm2。
3. The plating process for lead frames according to claim 1, wherein: h in the step S22 S04The mass concentration of (A) is 10-15%.
4. The plating process for lead frames according to claim 1, wherein: the mass concentration of KCN in the step S3 is 15-30 g/L.
5. The plating process for lead frames according to claim 1, wherein: the mass concentration of the potassium cyanide solution in the step S8 is 1%.
6. The plating process for lead frames according to claim 1, wherein: the concentration of the Cuprotecec solution in the step S9 is 15-30 mL/L, the pH value is 12.5-14, the temperature is 35-50 ℃, and the processing time is 190-220S.
7. The plating process for lead frames according to claim 1, wherein: the purity of the copper plating layer is more than 99%, and the thickness is more than 3.5 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011094392.4A CN112176377A (en) | 2020-10-14 | 2020-10-14 | Electroplating process of lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011094392.4A CN112176377A (en) | 2020-10-14 | 2020-10-14 | Electroplating process of lead frame |
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| Publication Number | Publication Date |
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| CN112176377A true CN112176377A (en) | 2021-01-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011094392.4A Pending CN112176377A (en) | 2020-10-14 | 2020-10-14 | Electroplating process of lead frame |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113584537A (en) * | 2021-08-03 | 2021-11-02 | 东强（连州）铜箔有限公司 | Ultra-thin copper foil with resin layer and extremely low roughness and manufacturing method thereof |
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|---|---|---|---|---|
| CN101867009A (en) * | 2010-05-07 | 2010-10-20 | 厦门永红科技有限公司 | LED lead frame and electroplating method and electroplating equipment thereof |
| CN105386100A (en) * | 2014-09-05 | 2016-03-09 | 泰州华龙电子有限公司 | Method for electroplating copper and sliver on iron-nickel alloy frame |
| CN108642538A (en) * | 2018-05-24 | 2018-10-12 | 中山品高电子材料有限公司 | The electroplating technology of high-power LED bracket |
-
2020
- 2020-10-14 CN CN202011094392.4A patent/CN112176377A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101867009A (en) * | 2010-05-07 | 2010-10-20 | 厦门永红科技有限公司 | LED lead frame and electroplating method and electroplating equipment thereof |
| CN105386100A (en) * | 2014-09-05 | 2016-03-09 | 泰州华龙电子有限公司 | Method for electroplating copper and sliver on iron-nickel alloy frame |
| CN108642538A (en) * | 2018-05-24 | 2018-10-12 | 中山品高电子材料有限公司 | The electroplating technology of high-power LED bracket |
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|---|
| 管华良: "引线框架电镀银工艺经验谈", 《电镀与涂饰》 * |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113584537A (en) * | 2021-08-03 | 2021-11-02 | 东强（连州）铜箔有限公司 | Ultra-thin copper foil with resin layer and extremely low roughness and manufacturing method thereof |
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Application publication date: 20210105 |