JPH07180085A - Non-cyanide silver plating method and non-cyanide solution used therefor - Google Patents
Non-cyanide silver plating method and non-cyanide solution used thereforInfo
- Publication number
- JPH07180085A JPH07180085A JP34566693A JP34566693A JPH07180085A JP H07180085 A JPH07180085 A JP H07180085A JP 34566693 A JP34566693 A JP 34566693A JP 34566693 A JP34566693 A JP 34566693A JP H07180085 A JPH07180085 A JP H07180085A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- silver
- copper
- strike plating
- strike
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 119
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 49
- 239000004332 silver Substances 0.000 title claims abstract description 49
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims abstract description 41
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 title abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052802 copper Inorganic materials 0.000 claims abstract description 23
- 239000010949 copper Substances 0.000 claims abstract description 23
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 18
- CIUJKJGFMKSNOT-UHFFFAOYSA-N imidazolidine-2,4-dione;silver Chemical compound [Ag].O=C1CNC(=O)N1 CIUJKJGFMKSNOT-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 9
- NHQSYENHCTXNIG-UHFFFAOYSA-N [Cu+3].[O-]P([O-])[O-] Chemical compound [Cu+3].[O-]P([O-])[O-] NHQSYENHCTXNIG-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910000365 copper sulfate Inorganic materials 0.000 claims abstract description 5
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims abstract description 5
- 239000010931 gold Substances 0.000 claims abstract description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052737 gold Inorganic materials 0.000 claims abstract description 4
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 claims description 6
- 150000001412 amines Chemical class 0.000 claims description 4
- JCDVTZPJEWWGHU-UHFFFAOYSA-N gold sulfurous acid Chemical compound [Au].S(O)(O)=O JCDVTZPJEWWGHU-UHFFFAOYSA-N 0.000 claims description 2
- SRCZENKQCOSNAI-UHFFFAOYSA-H gold(3+);trisulfite Chemical compound [Au+3].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O.[O-]S([O-])=O SRCZENKQCOSNAI-UHFFFAOYSA-H 0.000 claims description 2
- 238000004065 wastewater treatment Methods 0.000 abstract description 3
- 241001502050 Acis Species 0.000 abstract 1
- 150000002825 nitriles Chemical class 0.000 abstract 1
- 239000000126 substance Substances 0.000 description 18
- 238000006467 substitution reaction Methods 0.000 description 8
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000002265 prevention Effects 0.000 description 4
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 4
- YIROYDNZEPTFOL-UHFFFAOYSA-N 5,5-Dimethylhydantoin Chemical compound CC1(C)NC(=O)NC1=O YIROYDNZEPTFOL-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 229910001961 silver nitrate Inorganic materials 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 238000001994 activation Methods 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- IRXRGVFLQOSHOH-UHFFFAOYSA-L dipotassium;oxalate Chemical compound [K+].[K+].[O-]C(=O)C([O-])=O IRXRGVFLQOSHOH-UHFFFAOYSA-L 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002574 poison Substances 0.000 description 2
- 231100000614 poison Toxicity 0.000 description 2
- 150000003138 primary alcohols Chemical class 0.000 description 2
- -1 silver ions Chemical class 0.000 description 2
- 235000010265 sodium sulphite Nutrition 0.000 description 2
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- YHVBWJNSIYPDAU-UHFFFAOYSA-J S(=O)([O-])[O-].[Au+4].S(=O)([O-])[O-] Chemical compound S(=O)([O-])[O-].[Au+4].S(=O)([O-])[O-] YHVBWJNSIYPDAU-UHFFFAOYSA-J 0.000 description 1
- VEMHQNXVHVAHDN-UHFFFAOYSA-J [Cu+2].[Cu+2].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O Chemical compound [Cu+2].[Cu+2].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O VEMHQNXVHVAHDN-UHFFFAOYSA-J 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 229940091173 hydantoin Drugs 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- ZWZLRIBPAZENFK-UHFFFAOYSA-J sodium;gold(3+);disulfite Chemical compound [Na+].[Au+3].[O-]S([O-])=O.[O-]S([O-])=O ZWZLRIBPAZENFK-UHFFFAOYSA-J 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は非シアン銀めっき方法及
びそれに用いられる非シアン溶液に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-cyan silver plating method and a non-cyan solution used therein.
【０００２】[0002]
【従来の技術】銀めっきは、装身具や洋食器などに広く
利用されているが、電気抵抗が小さく、熱伝導率が高い
など工業材料としてすぐれた性質を持つので、電子部品
や軸受などへの利用が開発され、工業用めっきの用途が
拡大しつつある。2. Description of the Related Art Silver plating is widely used for jewelry and western tableware, but because it has excellent properties as an industrial material such as low electric resistance and high thermal conductivity, it can be applied to electronic parts and bearings. Applications have been developed and the uses of industrial plating are expanding.
【０００３】例えば、電子部品としてのＩＣリードフレ
ームの場合、ダイボンディング性、ワイヤーボンディン
グ性を確保するため銀めっきが不可欠であり、その標準
的な工程は、（Ａ）電解脱脂工程→（Ｂ）酸活性工程→
（Ｃ）銅ストラクめっき工程→（Ｄ）置換防止工程→
（Ｅ）銀めっき工程→（Ｆ）剥離工程、である。銀めっ
き（Ｅ）の前に、銀ストライクめっき工程（ｅ）が行わ
れる場合がある。For example, in the case of an IC lead frame as an electronic component, silver plating is indispensable in order to secure die bondability and wire bondability, and the standard process is (A) electrolytic degreasing process → (B) Acid activation process →
(C) Copper stroke plating process → (D) Substitution prevention process →
(E) Silver plating step → (F) Peeling step. The silver strike plating step (e) may be performed before the silver plating (E).
【０００４】[0004]
【発明が解決しようとする課題】このような工程でめっ
きされたＩＣリードフレームは、その品質面では問題な
いが、そのめっき処理を行う過程において問題がある。
すなわち、上記の標準的工程のうち、（Ｃ）の銅ストラ
クめっき工程、（Ｅ）の銀めっき工程、（Ｆ）の剥離工
程では、有害なシアン系薬品が使用されるため、下記の
如き取扱い上の問題が生じる。The IC lead frame plated by such a process has no problem in terms of its quality, but has a problem in the process of performing the plating process.
That is, among the standard processes described above, harmful cyan chemicals are used in the (C) copper struc- ture plating process, (E) silver plating process, and (F) peeling process. The above problem arises.
【０００５】イ）有害物質であるシアン系薬品を分解さ
せる排水処理施設が必要となる。 ロ）シアン系薬品を毒物として厳重に管理する設備が必
要となる。 ハ）作業現場における十分な安全対策が必要となる。B) A wastewater treatment facility for decomposing a cyanide chemical which is a harmful substance is required. B) Facilities that strictly control cyanide chemicals as poisons are required. C) Sufficient safety measures at the work site are required.
【０００６】そこで、従来より、シアン系薬品を全く用
いない非シアン銀めっき方法の開発が望まれていた。Therefore, it has been conventionally desired to develop a non-cyan silver plating method which does not use cyan chemicals at all.
【０００７】この発明はこのような従来の技術に着目し
てなされたものであり、シアン系薬品を全く使用しない
非シアン銀めっき方法及びそれに用いられる非シアン溶
液を提供するものである。The present invention has been made by paying attention to such a conventional technique, and provides a non-cyan silver plating method which does not use a cyan chemical at all and a non-cyan solution used therefor.
【０００８】[0008]
【課題を解決するための手段】この発明の発明者はシア
ン系薬品を全く使用しない非シアン銀めっき方法及びそ
れに用いられる非シアン溶液の研究を鋭意行った結果、
シアン系薬品に代わる薬品を開発し、それを用いること
によりシアンを全く使用しない非シアン銀めっき方法を
発明するに至ったものである。すなわち、従来銅ストラ
イクめっき工程や銀めっき工程などにシアン系の薬品が
使われていたのは、銅イオンや銀イオンとシアンとが高
い錯安定性を示すからである。このような高い錯安定性
を有するが故に、素材との密着性、析出結晶の均一性、
めっき液の安定性などの優位性が得られていたものであ
る。そこで、本発明は、このようなシアン化合物に代わ
って、銅イオンや銀イオンと高い錯安定性をもつ薬品を
使用することにより、シアン系薬品を全く含まない非シ
アン銀めっき方法を開発したものである。The inventor of the present invention has earnestly studied the non-cyan silver plating method using no cyan chemicals and the non-cyan solution used therefor.
By developing a chemical alternative to the cyan chemical and using it, the inventors have invented a non-cyan silver plating method that does not use cyan at all. That is, the cyan chemicals have been conventionally used in the copper strike plating process and the silver plating process because copper ions and silver ions show high complex stability with cyan. Due to its high complex stability, the adhesion to the material, the uniformity of the precipitated crystals,
The advantages such as the stability of the plating solution were obtained. Therefore, the present invention has developed a non-cyan silver plating method containing no cyan chemicals by using chemicals having high complex stability with copper ions and silver ions instead of such cyan compounds. Is.
【０００９】具体的には、この発明に係る非シアン銀め
っき方法は、銅ストライクめっき工程、銀めっき工程、
剥離工程を含む銀めっき方法において、前記銅ストライ
クめっき工程に、ピロリン酸銅ストライクめっき液、亜
リン酸銅ストライクめっき液、硫酸銅ストライクめっき
液の中の少なくとも１つのストライクめっき液を用い、
前記銀めっき工程にヒダントイン銀めっき液を用い、前
記剥離工程に非シアンの剥離液を用いたものである。Specifically, the non-cyan silver plating method according to the present invention comprises a copper strike plating step, a silver plating step,
In a silver plating method including a peeling step, in the copper strike plating step, at least one strike plating solution in a copper pyrophosphate strike plating solution, a copper phosphite strike plating solution, and a copper sulfate copper strike plating solution is used,
The silver plating step uses a hydantoin silver plating solution, and the peeling step uses a non-cyan peeling solution.
【００１０】また、銅ストライクめっき工程の代わり
に、ヒダントイン銀ストライクめっき液を用いた銀スト
ライクめっき工程、アミンパラジウムストライクめっき
液を用いたパラジウムストライクめっき工程、亜硫酸金
ストライクめっき液を用いた金ストライクめっき工程
の、少なくとも１つを行っても良い。Further, instead of the copper strike plating step, a silver strike plating step using a hydantoin silver strike plating solution, a palladium strike plating step using an amine palladium strike plating solution, and a gold strike plating using a sulfurous acid gold strike plating solution At least one of the steps may be performed.
【００１１】各工程に使用される非シアン溶液は以下の
ような組成のものが好適である。 ピロリン酸銅ストライクめっき液： ピロリン酸銅 １０〜１１０ｇ／ｌ ピロリン酸カリウム １００〜５００ｇ／ｌ シュウ酸カリウム １００ｇ／ｌ以下 ｐＨ ８．０〜１０．０ 温度 ２０〜６０℃ 電流密度 ０．２〜１０．０Ａ／ｄｍ2 The non-cyan solution used in each step preferably has the following composition. Copper pyrophosphate strike plating solution: copper pyrophosphate 10 to 110 g / l potassium pyrophosphate 100 to 500 g / l potassium oxalate 100 g / l or less pH 8.0 to 10.0 Temperature 20 to 60 ° C. Current density 0.2 to 10 0.0 A / dm 2
【００１２】 亜リン酸銅ストライクめっき液： 亜リン酸銅 １０〜１１０ｇ／ｌ 亜リン酸 ５〜１１０ｇ／ｌ ｐＨ ７．０〜１０．０ 温度 ２０〜７０℃ 電流密度 ０．２〜１０．０Ａ／ｄｍ2 Copper phosphite strike plating solution: copper phosphite 10-110 g / l phosphorous acid 5-110 g / l pH 7.0-10.0 Temperature 20-70 ° C. Current density 0.2-10.0 A / Dm 2
【００１３】 硫酸銅ストライクめっき液： 硫酸銅 １５〜１２０ｇ／ｌ 硫酸 ５〜１２０ｇ／ｌ 塩素イオン １００ｍｇ／ｌ以下 ｐＨ １．０以下 温度 ２０〜４０℃ 電流密度 ０．２〜１０．０Ａ／ｄｍ2 Copper sulfate strike plating solution: copper sulfate 15 to 120 g / l sulfuric acid 5 to 120 g / l chloride ion 100 mg / l or less pH 1.0 or less temperature 20 to 40 ° C. current density 0.2 to 10.0 A / dm 2
【００１４】 ヒダントイン銀めっき液： 硝酸銀 ３〜１６０ｇ／ｌ ジメチルヒダントイン １０〜５００ｇ／ｌ ｐＨ ３．０〜１０．０ 温度 ２０〜８０℃ 電流密度 ０．５〜１００Ａ／ｄｍ2 Hydantoin silver plating solution: silver nitrate 3 to 160 g / l dimethylhydantoin 10 to 500 g / l pH 3.0 to 10.0 Temperature 20 to 80 ° C. Current density 0.5 to 100 A / dm 2
【００１５】 剥離液（銅剥離）： 直鎖型一級アルコール ５０〜３００ｍｌ／ｌ リン酸 ４００〜８００ｍｌ／ｌ 温度 ２０〜４０℃ 電流密度 ０．５〜３０．０Ａ／ｄｍ2 Stripping solution (copper stripping): linear primary alcohol 50 to 300 ml / l phosphoric acid 400 to 800 ml / l temperature 20 to 40 ° C. current density 0.5 to 30.0 A / dm 2.
【００１６】 ヒダントイン銀ストライクめっき液： 硝酸銀 １〜１０ｇ／ｌ ジメチルヒダントイン ３〜１００ｇ／ｌ ｐＨ ３．０〜１０．０ 温度 ２０〜８０℃ 電流密度 ０．２〜１０．０Ａ／ｄｍ2 Hydantoin silver strike plating solution: silver nitrate 1 to 10 g / l dimethylhydantoin 3 to 100 g / l pH 3.0 to 10.0 Temperature 20 to 80 ° C. Current density 0.2 to 10.0 A / dm 2
【００１７】 アミンパラジウムストライクめっき液： 亜硫酸ナトリウム １０〜２００ｇ／ｌ アンモニア水 １０〜５０ｇ／ｌ パラドスアミンクロライド ０．１〜１０ｇ／ｌ （Ｐｄメタルとして） ｐＨ ８．０〜１０．０ 温度 ２０〜５０℃ 電流密度 ０．２〜１０．０Ａ／ｄｍ2 Amine-palladium strike plating solution: sodium sulfite 10-200 g / l ammonia water 10-50 g / l paradosamine chloride 0.1-10 g / l (as Pd metal) pH 8.0-10.0 Temperature 20- 50 ° C. current density 0.2-10.0 A / dm 2
【００１８】 亜硫酸金ストライクめっき液： 亜硫酸ナトリウム １０〜１００ｇ／ｌ 亜硫酸金ナトリウム ０．１〜１０ｇ／ｌ （Ａｕメタルとして） ｐＨ ８．０〜１０．０ 温度 ２０〜５０℃ 電流密度 ０．２〜１０．０Ａ／ｄｍ2 Gold sulfite strike plating solution: sodium sulfite 10-100 g / l sodium gold sulfite 0.1-10 g / l (as Au metal) pH 8.0-10.0 Temperature 20-50 ° C. Current density 0.2- 10.0 A / dm 2
【００１９】置換防止剤としては、銅に対する銀の置換
反応を抑制する機能を有するものであれば何でも良く、
具体的にはＮ及びＳ系有機化合物などが好適である。Any anti-substitution agent may be used as long as it has a function of suppressing the substitution reaction of silver with copper.
Specifically, N- and S-based organic compounds are suitable.
【００２０】[0020]
【実施例】以下、この発明の好適な一実施例を説明す
る。この実施例では、４２アロイを素材としたＩＣリー
ドフレームのめっき部位に銀メッキ処理試験を行ってみ
た。具体的には、電解脱脂工程→酸活性工程→銅ストラ
イクめっき工程→置換防止工程→銀メッキ工程→剥離工
程→洗浄工程→乾燥工程の順で処理を施した。各工程の
詳細は以下の通りであり、この実施例の工程では、シア
ン系薬品が全く使用されていない。A preferred embodiment of the present invention will be described below. In this example, a silver plating treatment test was performed on a plated portion of an IC lead frame made of 42 alloy. Specifically, treatments were performed in the order of electrolytic degreasing step → acid activation step → copper strike plating step → displacement prevention step → silver plating step → peeling step → washing step → drying step. Details of each step are as follows, and no cyanide chemical is used in the steps of this example.
【００２１】銅ストライクめっき工程：以下の組成のピ
ロリン酸銅ストライクめっき液を使用して行った。 ピロリン酸銅 １６ｇ／ｌ ピロリン酸カリウム １２０ｇ／ｌ シュウ酸カリウム １０ｇ／ｌ以下 ｐＨ ８．５ 温度 ２５℃ 電流密度 １．０Ａ／ｄｍ2 Copper strike plating step: The copper strike plating solution having the following composition was used. Copper pyrophosphate 16 g / l Potassium pyrophosphate 120 g / l Potassium oxalate 10 g / l or less pH 8.5 Temperature 25 ° C. Current density 1.0 A / dm 2
【００２２】置換防止工程：使用した置換防止剤は、日
本エレクトロプレイティング・エンジニヤース社製のイ
ートレックス（Ｗ−ＡＩＳ）で、その施し方としては、
銅ストライクめっき後のＩＣリードフレームに、４０倍
に希釈した前記置換防止剤を室温で１０秒間浸漬処理す
る方法を採用した。 Substitution prevention step: The substitution prevention agent used was Eatrex (W-AIS) manufactured by Nippon Electroplating Engineering Co., Ltd.
A method of dipping the anti-substitution agent diluted 40 times in the IC lead frame after copper strike plating at room temperature for 10 seconds was adopted.
【００２３】銀めっき工程：以下の組成のヒダントイン
銀めっき液を使用して行った。 硝酸銀 ９５ｇ／ｌ ジメチルヒダントイン ２５０ｇ／ｌ ｐＨ ９．０ 温度 ７０℃ 電流密度 ５０Ａ／ｄｍ2 Silver plating step : A silver plating solution of hydantoin having the following composition was used. Silver nitrate 95 g / l Dimethylhydantoin 250 g / l pH 9.0 Temperature 70 ° C. Current density 50 A / dm 2
【００２４】剥離工程：以下の組成の剥離液を使用して
行った。 直鎖型一級アルコール １５０ｍｌ／ｌ リン酸 ６００ｍｌ／ｌ 温度 ２５℃ 電流密度 １０Ａ／ｄｍ2 Stripping step: The stripping solution having the following composition was used. Linear primary alcohol 150 ml / l Phosphoric acid 600 ml / l Temperature 25 ° C. Current density 10 A / dm 2
【００２５】以上の各工程を経て、洗浄・乾燥を行った
ＩＣリードフレームの表面には、厚さ５μｍの銀めっき
層が形成されていた。そして、この得られたＩＣリード
フレームに対して、３５０℃、５分間の耐熱テストを大
気雰囲気中で行ったが、銀めっき層に変色がなく、下地
メッキである銅ストラクめっき層との密着性も良好であ
った。このように、この発明によれば、シアン系の薬品
を全く使用しないめっき工程でありながら、従来と変わ
らない優れた銀めっき層が得られる。A silver plating layer having a thickness of 5 μm was formed on the surface of the IC lead frame which was washed and dried through the above steps. The obtained IC lead frame was subjected to a heat resistance test at 350 ° C. for 5 minutes in an air atmosphere. The silver plating layer was not discolored, and the adhesion with the copper strike plating layer, which is the base plating, was good. Was also good. Thus, according to the present invention, it is possible to obtain an excellent silver plating layer that is the same as the conventional one, even though the plating process does not use cyan chemicals at all.
【００２６】尚、この実施例では、銀めっき工程の前に
銅ストライクめっき工程と置換防止工程を行う例を示し
たが、この銅ストライクめっき工程と置換防止工程に代
えて、ヒダントイン銀ストライクめっき液を用いた銀ス
トライクめっき工程、アミンパラジウムストライクめっ
き液を用いたパラジウムストライクめっき工程、亜硫酸
金ストライクめっき液を用いた金ストライクめっき工程
の、少なくとも１つを行っても良い。In this embodiment, the copper strike plating step and the substitution preventing step are performed before the silver plating step. However, instead of the copper strike plating step and the substitution preventing step, a hydantoin silver strike plating solution is used. At least one of a silver strike plating process using the above, a palladium strike plating process using an amine palladium strike plating solution, and a gold strike plating process using a gold sulfite sulfite plating solution may be performed.
【００２７】また、この非シアン銀めっき方法の効果と
して、ＩＣリードフレームに貼られる変形防止用のテー
プの接着性を低下させない点も挙げられる。すなわち、
ＩＣリードフレームには変形防止用として、テープを貼
る方法があるが、今まではこのテープの接着力がシアン
系薬品との接触により低下する不具合があった。しかし
ながら、この発明のめっき方法ではシアンを全く使用し
ないので、そのような不具合が生じることもない。Further, as an effect of this non-cyan silver plating method, there is also a point that the adhesiveness of the deformation preventing tape stuck to the IC lead frame is not deteriorated. That is,
Although there is a method of attaching a tape to the IC lead frame to prevent deformation, there has been a problem that the adhesive strength of this tape is lowered by contact with a cyan chemical until now. However, since the plating method of the present invention does not use cyan at all, such a problem does not occur.
【００２８】[0028]
【発明の効果】この発明に係る非シアン銀めっき方法は
以上説明してきた如き内容のものなので、シアン系の薬
品を全く使用しないめっき工程でありながら、従来と変
わらない銀めっき処理が行える。従って、有害物質であ
るシアン系薬品を分解させる排水処理施設や、シアン系
を毒物として厳重に管理する設備が不要となり、作業現
場における安全性も確保される。EFFECTS OF THE INVENTION The non-cyan silver plating method according to the present invention has the contents as described above, so that it is possible to perform the silver plating treatment which is the same as the conventional one, even though the plating process does not use cyan chemicals at all. Therefore, there is no need for a wastewater treatment facility that decomposes cyanide chemicals, which are harmful substances, or a facility that strictly manages cyanide as a poison, and safety at the work site is ensured.
【００２９】また、この発明に係る非シアン溶液によ
り、前記の非シアン銀めっき方法を確実に実施できるよ
うになるため、この非シアン溶液は非常に商品価値の高
いものである。Further, the non-cyan solution according to the present invention makes it possible to reliably carry out the above-mentioned non-cyan silver plating method, so that this non-cyan solution has a very high commercial value.
Claims (6)
程、剥離工程を含む銀めっき方法において、 前記銅ストライクめっき工程に、ピロリン酸銅ストライ
クめっき液、亜リン酸銅ストライクめっき液、硫酸銅ス
トライクめっき液の中の少なくとも１つのストライクめ
っき液を用い、 前記銀めっき工程にヒダントイン銀めっき液を用い、 前記剥離工程に非シアンの剥離液を用いたことを特徴と
する非シアン銀めっき方法。1. A silver plating method including a copper strike plating step, a silver plating step, and a peeling step, wherein the copper strike plating step includes a copper pyrophosphate strike plating solution, a copper phosphite strike plating solution, and a copper sulfate strike plating solution. A non-cyan silver plating method, characterized in that at least one strike plating solution in the above is used, a hydantoin silver plating solution is used in the silver plating step, and a non-cyan peeling solution is used in the peeling step.
用いられるピロリン酸銅ストライクめっき液、亜リン酸
銅ストライクめっき液、硫酸銅ストライクめっき液の中
から選ばれた少なくとも１つのものである非シアン溶
液。2. At least one selected from the copper pyrophosphate strike plating solution, the copper phosphite strike plating solution, and the copper sulfate strike plating solution used in the non-cyan silver plating method according to claim 1. Non-cyan solution.
用いられるヒダントイン銀めっき液である非シアン溶
液。3. A non-cyan solution which is a hydantoin silver plating solution used in the non-cyan silver plating method according to claim 1.
用いられる剥離液である非シアン溶液。4. A non-cyan solution which is a stripping solution used in the non-cyan silver plating method according to claim 1.
ントイン銀ストライクめっき液を用いた銀ストライクめ
っき工程、アミンパラジウムストライクめっき液を用い
たパラジウムストライクめっき工程、亜硫酸金ストライ
クめっき液を用いた金ストライクめっき工程の、少なく
とも１つを行う請求項１記載の非シアン銀めっき方法。5. A silver strike plating step using a hydantoin silver strike plating solution, a palladium strike plating step using an amine palladium strike plating solution, and a gold strike plating using a sulfurous acid gold strike plating solution instead of the copper strike plating step. The non-cyan silver plating method according to claim 1, wherein at least one of the steps is performed.
用いられるヒダントイン銀ストライクめっき液、アミン
パラジウムストライクめっき液、亜硫酸金ストライクめ
っき液の中から選ばれた少なくとも１つのものである非
シアン溶液。6. A non-cyan solution which is at least one selected from a hydantoin silver strike plating solution, an amine palladium strike plating solution, and a gold sulfite strike plating solution used in the non-cyan silver plating method according to claim 5. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34566693A JP3299370B2 (en) | 1993-12-22 | 1993-12-22 | Non-cyanide silver plating method and non-cyanide solution used therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34566693A JP3299370B2 (en) | 1993-12-22 | 1993-12-22 | Non-cyanide silver plating method and non-cyanide solution used therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07180085A true JPH07180085A (en) | 1995-07-18 |
| JP3299370B2 JP3299370B2 (en) | 2002-07-08 |
Family
ID=18378147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34566693A Expired - Fee Related JP3299370B2 (en) | 1993-12-22 | 1993-12-22 | Non-cyanide silver plating method and non-cyanide solution used therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3299370B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007327127A (en) * | 2006-06-09 | 2007-12-20 | Daiwa Fine Chemicals Co Ltd (Laboratory) | Silver plating method |
| JP2010287741A (en) * | 2009-06-11 | 2010-12-24 | Nagasaki Univ | Lead frame and method of manufacturing the same, and semiconductor device |
| US20110005935A1 (en) * | 2008-02-28 | 2011-01-13 | Hyun-Yeong Jung | Plating method for a radio frequency device and a radio frequency device produced by the method |
| US10889907B2 (en) | 2014-02-21 | 2021-01-12 | Rohm And Haas Electronic Materials Llc | Cyanide-free acidic matte silver electroplating compositions and methods |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103981548A (en) * | 2014-05-20 | 2014-08-13 | 西安西光表面精饰有限公司 | Silver plating process |
| CN103981549A (en) * | 2014-05-20 | 2014-08-13 | 西安西光表面精饰有限公司 | Silver-plating solution |
-
1993
- 1993-12-22 JP JP34566693A patent/JP3299370B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007327127A (en) * | 2006-06-09 | 2007-12-20 | Daiwa Fine Chemicals Co Ltd (Laboratory) | Silver plating method |
| US20110005935A1 (en) * | 2008-02-28 | 2011-01-13 | Hyun-Yeong Jung | Plating method for a radio frequency device and a radio frequency device produced by the method |
| US8859049B2 (en) * | 2008-02-28 | 2014-10-14 | Ace Technologies Corp. | Plating method for a radio frequency device and a radio frequency device produced by the method |
| JP2010287741A (en) * | 2009-06-11 | 2010-12-24 | Nagasaki Univ | Lead frame and method of manufacturing the same, and semiconductor device |
| US10889907B2 (en) | 2014-02-21 | 2021-01-12 | Rohm And Haas Electronic Materials Llc | Cyanide-free acidic matte silver electroplating compositions and methods |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3299370B2 (en) | 2002-07-08 |
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