CN112174499B - Forming method of curved surface cover plate - Google Patents
Forming method of curved surface cover plate Download PDFInfo
- Publication number
- CN112174499B CN112174499B CN202011064821.3A CN202011064821A CN112174499B CN 112174499 B CN112174499 B CN 112174499B CN 202011064821 A CN202011064821 A CN 202011064821A CN 112174499 B CN112174499 B CN 112174499B
- Authority
- CN
- China
- Prior art keywords
- curved surface
- mother board
- preset temperature
- temperature condition
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000000465 moulding Methods 0.000 claims abstract description 57
- 239000011796 hollow space material Substances 0.000 claims abstract description 52
- 230000009471 action Effects 0.000 claims abstract description 26
- 238000010438 heat treatment Methods 0.000 claims description 49
- 238000005086 pumping Methods 0.000 claims description 12
- 238000005452 bending Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 description 18
- 230000008569 process Effects 0.000 description 12
- 238000007373 indentation Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000005299 abrasion Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 238000005498 polishing Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 238000013003 hot bending Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/02—Re-forming glass sheets
- C03B23/023—Re-forming glass sheets by bending
- C03B23/035—Re-forming glass sheets by bending using a gas cushion or by changing gas pressure, e.g. by applying vacuum or blowing for supporting the glass while bending
- C03B23/0352—Re-forming glass sheets by bending using a gas cushion or by changing gas pressure, e.g. by applying vacuum or blowing for supporting the glass while bending by suction or blowing out for providing the deformation force to bend the glass sheet
- C03B23/0357—Re-forming glass sheets by bending using a gas cushion or by changing gas pressure, e.g. by applying vacuum or blowing for supporting the glass while bending by suction or blowing out for providing the deformation force to bend the glass sheet by suction without blowing, e.g. with vacuum or by venturi effect
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The application discloses a forming method and a forming device of a curved cover plate. The embodiment of the application provides a forming method of a curved cover plate, which comprises the following steps: providing a mold, wherein the mold comprises a molding surface matched with a curved surface cover plate to be molded, a flat plate-shaped master plate is placed on one side of the molding surface of the mold, and a hollow space is formed between the molding surface and the master plate; and under the preset temperature condition, vacuumizing the hollow space, so that the mother board is bent and attached along the molding surface under the action of negative pressure to form a curved cover plate.
Description
Technical Field
The application relates to the field of processing of cover plates, in particular to a forming method of a curved cover plate.
Background
With the development of technology and the improvement of living standard of people, intelligent terminals represented by mobile phones and tablet computers have become indispensable consumer electronic products. Meanwhile, the requirements of people on the electronic products are also higher and higher, and taking a mobile phone as an example, the cover plate of the mobile phone is gradually developed from a traditional flat cover plate to a current curved cover plate.
The traditional curved surface cover plate is processed in a hot bending forming mode, namely, the temperature of the flat-plate-shaped mother plate reaches the softening point through heating, and then the mother plate is pressed down, so that the mother plate is formed in a hot bending mode in a die. Because of the existence of pressure, the surface of the molded curved cover plate is provided with poor appearance such as stamping, indentation, orange grain and the like, and the depth is deeper, which is not beneficial to polishing and removing in the subsequent process. From the perspective of improving the yield and reducing the cost, the curved surface cover plate production process needs to be updated.
Disclosure of Invention
The application provides a forming method of a curved cover plate, which can reduce appearance defects on the surface of the curved cover plate and improve appearance yield of the curved cover plate.
In a first aspect, the present application provides a method for forming a curved cover plate, which includes: providing a mold, wherein the mold comprises a molding surface matched with a curved surface cover plate to be molded, a flat plate-shaped master plate is placed on one side of the molding surface of the mold, and a hollow space is formed between the molding surface and the master plate; and under the preset temperature condition, vacuumizing the hollow space, so that the mother board is bent and attached along the molding surface under the action of negative pressure to form a curved cover plate.
According to an aspect of the molding method of the embodiment of the present application, the mold in the step of providing a mold includes a female mold having a supporting surface and a concave curved surface concavely formed by the supporting surface, the concave curved surface is the molding surface, the mother board is placed on the supporting surface to be supported, and the hollow space is formed between the mother board and the concave curved surface.
According to one aspect of the molding method of the embodiment of the present application, the step of performing the vacuum pumping treatment on the hollow space under the preset temperature condition includes: heating the mother board to a first preset temperature condition through the female die, and keeping for a period of time; and vacuumizing the hollow space so that the mother board is bent and attached along the concave curved surface under the action of negative pressure. Optionally, the first preset temperature condition is 700 ℃ to 750 ℃. Optionally, the step of heating the mother board to the first preset temperature condition through the die and maintaining for a period of time is performed for 70s-120s, and the step of vacuumizing the hollow space to enable the mother board to be bent and attached along the concave curved surface under the action of negative pressure is performed for 70s-120s.
According to an aspect of the molding method of the embodiment of the present application, the step of vacuumizing the hollow space to bend and attach the mother board along the concave curved surface under the action of negative pressure is performed under a second preset temperature condition, where the second preset temperature condition is smaller than the first preset temperature condition.
According to an aspect of the molding method of the embodiment of the present application, the step of performing the vacuumizing treatment on the hollow space under the preset temperature condition further includes: and maintaining the mother board attached to the concave curved surface for a period of time under a third preset temperature condition. The third preset temperature condition is lower than the second preset temperature condition. Optionally, the step of maintaining the mother board attached to the concave curved surface for a period of time under a third preset temperature condition is performed for 70s-120s.
According to an aspect of the molding method of the embodiment of the present application, in the step of providing a mold, the mold further includes a male mold, and the male mold includes an upper convex curved surface matched with the curved cover plate to be molded, and the upper convex curved surface is located on a side of the mother board, which is far away from the lower concave curved surface. The step of heating the mother board to a first preset temperature condition through the female die and maintaining for a period of time comprises the following steps: and heating the mother board to a first preset temperature condition through the female die and the male die, and keeping for a period of time. The manufacturing method further comprises the following steps of: and driving the male die and the female die to move relatively so as to enable the upward convex curved surface to keep contact with the surface, facing away from the downward concave curved surface, of the mother board. Optionally, the pressure applied by the convex curved surface to the mother board is less than 0.1Mpa.
According to an aspect of the molding method of the embodiment of the present application, the mother sheet in the step of placing the flat-plate-shaped mother sheet to one side of the molding surface of the mold is a glass sheet.
According to the method for forming the curved cover plate, disclosed by the embodiment of the application, the hollow space formed between the forming surface of the die and the mother board is vacuumized, so that the mother board is bent and attached along the forming surface under the action of negative pressure, and the curved cover plate is formed. According to the forming method of the curved surface cover plate, the master plate is driven to deform under the action of negative pressure, and the master plate is directly extruded from the upper side without a die, so that poor appearance such as stamping, indentation and orange peel formed on the surface of the curved surface cover plate is reduced, and the appearance yield of the curved surface cover plate is improved. On the other hand, the die does not need to directly extrude the mother board, so the application can reduce the abrasion of the die in the forming process of the curved cover plate, prolong the service life of the die and reduce the production cost.
In a second aspect, the present application further provides a forming device for a curved cover plate, which includes: the die comprises a molding surface matched with the curved cover plate to be molded, and is used for placing a flat motherboard on one side of the molding surface; the temperature control mechanism is used for enabling the mother board placed on the die to reach a preset temperature condition; and the vacuumizing mechanism is used for vacuumizing the hollow space between the molding surface and the mother board so that the mother board is bent and attached along the molding surface under the action of negative pressure to form a curved cover plate.
According to one aspect of the forming device of the embodiment of the application, the die comprises a female die and a male die which are connected in a sliding manner, the female die is provided with a supporting surface and a concave curved surface formed by recessing the supporting surface, the concave curved surface is the forming surface, and the male die comprises an upper convex curved surface matched with a curved cover plate to be formed. The mother board is used for being placed on the supporting surface and located between the concave curved surface and the convex curved surface, and the hollow space can be formed between the mother board and the concave curved surface. The temperature control mechanism comprises a first heating plate, a second heating plate and a power assembly, wherein the power assembly is connected with at least one of the female die and the male die and used for driving the first heating plate and the second heating plate to move relatively. The female die is used for being placed on the first heating plate and being capable of being heated by the first heating plate, the male die is located on one side, far away from the first heating plate, of the female die, and the second heating plate is located on one side, far away from the female die, of the male die and is used for heating the male die. The vacuumizing mechanism is connected to the first heating plate and used for vacuumizing the hollow space.
According to an aspect of the molding apparatus of the embodiment of the present application, the first heating plate has a through hole, the vacuuming means is connected to the first heating plate and communicates with the through hole, and the female die covers the through hole. The surface of the female die facing the first heating plate is provided with a groove communicated with the through hole, and the female die is made of a breathable material. Optionally, the female die is made of graphite. Optionally, along the axial direction of the through hole, the orthographic projection of the through hole is located within the orthographic projection of the groove, and the distance between the bottom wall of the groove and the concave curved surface is 0.3mm-0.7mm.
According to the forming device of the curved surface cover plate, disclosed by the embodiment of the application, the mother board is driven to deform under the action of negative pressure, and the mother board is directly extruded from the upper part without a die, so that poor appearance such as stamping, indentation and orange peel formed on the surface of the curved surface cover plate is reduced, and the appearance yield of the curved surface cover plate is improved. On the other hand, the die does not need to directly extrude the mother board, so the application can reduce the abrasion of the die in the forming process of the curved cover plate, prolong the service life of the die and reduce the production cost.
Drawings
Features, advantages, and technical effects of exemplary embodiments of the present application will be described below with reference to the accompanying drawings.
Fig. 1 shows a flowchart of a method for forming a curved cover plate according to an embodiment of the present application.
Fig. 2 illustrates a flow chart of step S120 of the molding method of fig. 1 in some embodiments.
Fig. 3 illustrates a schematic view of a female die and a master sheet placed on the female die, provided according to some embodiments of the application.
Fig. 4 is a schematic view showing a curved cover plate formed after the mother board of fig. 3 is bent.
Fig. 5 is a schematic view of a mold and a mother board placed on the mold according to other embodiments of the present application.
Fig. 6 shows a schematic view of a curved cover plate formed after the mother board of fig. 5 is bent.
Fig. 7 is a schematic diagram of a forming device for a curved cover plate according to an embodiment of the application.
Fig. 8 shows a schematic view of a female die provided according to an embodiment of the application.
In the drawings, the drawings are not necessarily to scale.
Marking:
1. a mother board;
2. a mold; 21. a female die; 211. a support surface; 212. concave curved surfaces; 213 upper surface; 214. a positioning groove; 215. a groove; 216. a bottom surface; 22. a male die; 221. an upwardly convex curved surface; 222. lower surface of
3. A curved cover plate;
4. Rack
5. A temperature control mechanism; 51. a first heating plate; 511. a through hole; 52. a second heating plate; 53. a power assembly;
6. A vacuum pumping mechanism; 61. a vacuum pump; 62. a pipeline;
S, hollow space.
Detailed Description
Features and exemplary embodiments of various aspects of the present application will be described in detail below, and in order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be described in further detail below with reference to the accompanying drawings and the detailed embodiments. It should be understood that the specific embodiments described herein are merely configured to illustrate the application and are not configured to limit the application. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the application by showing examples of the application.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
It will be understood that when a layer, an area, or a structure is described as being "on" or "over" another layer, another area, it can be referred to as being directly on the other layer, another area, or another layer or area can be included between the layer and the other layer, another area. And if the component is turned over, that layer, one region, will be "under" or "beneath" the other layer, another region.
The embodiment of the application provides a forming method of a curved cover plate. Fig. 1 shows a flowchart of a method for forming a curved cover plate according to an embodiment of the present application, and referring to fig. 1, the method for forming a curved cover plate according to an embodiment of the present application includes:
Step S110: a mold 2 is provided, the mold 2 includes a molding surface matched with a curved cover plate 3 to be molded, and a flat-plate-shaped mother board 1 is placed to one side of the molding surface of the mold 2, and a hollow space S is formed between the molding surface and the mother board 1.
The molding surface of the mold 2 is arranged according to the shape of the curved cover plate 3 which is produced as required, and is used for guiding the deformation of the mother board 1. The mother sheet 1 covers the hollow space S from one side of the molding surface, and the surface of the mother sheet 1 facing the molding surface and the molding surface enclose the hollow space S. Alternatively, the hollow space S is a closed space.
Step S120: and under the preset temperature condition, vacuumizing the hollow space S to enable the mother board 1 to be bent and attached along the molding surface under the action of negative pressure and form the curved cover plate 3.
The mother sheet 1 is heated to a preset temperature, which can be fluctuated within a certain temperature range. Under the preset temperature condition, the mother board 1 is softened and easy to deform. At this time, the vacuum-pumping process is performed on the hollow space S, the mother board 1 moves toward the molding surface under the action of the negative pressure and deforms, and when the mother board 1 contacts with the molding surface, the molding surface guides the mother board 1 to bend at a set position, and when the mother board 1 is completely attached to the molding surface, the mother board 1 deforms to a set shape to form the curved cover plate 3.
During the vacuum-pumping process of the hollow space S, the mother sheet 1 gradually approaches the molding surface, and the hollow space S gradually decreases. When the mother sheet 1 is completely attached to the molding surface, the hollow space S is substantially disappeared (minute gaps that may exist are ignored).
According to the method for forming the curved cover plate, disclosed by the embodiment of the application, the hollow space S formed between the forming surface of the die 2 and the mother board 1 is vacuumized, so that the mother board 1 is bent and attached along the forming surface under the action of negative pressure, and the curved cover plate 3 is formed. According to the forming method of the curved surface cover plate, disclosed by the embodiment of the application, the mother plate 1 is driven to deform under the action of negative pressure, and the mother plate 1 is directly extruded from the upper side without a die, so that appearance defects such as stamping, indentation, orange marks and the like formed on the surface of the curved surface cover plate 3 are reduced, and the appearance yield of the curved surface cover plate 3 is improved. On the other hand, the die does not need to directly extrude the mother board 1, so the application can reduce the abrasion of the curved cover plate 3 to the die in the forming process, prolong the service life of the die and reduce the production cost.
In some specific embodiments, referring to fig. 3 and 4, in the step of providing the mold 2, the mold 2 includes a female mold 21, the female mold 21 has a supporting surface 211 and a concave curved surface 212 concavely formed by the supporting surface 211, the concave curved surface 212 is a molding surface, the mother board 1 is placed on the supporting surface 211 to be supported, and a hollow space S is formed between the mother board 1 and the concave curved surface 212.
The concave curved surface 212 encloses a cavity with an opening facing the mother sheet 1, and the mother sheet 1 placed on the supporting surface 211 covers the opening of the cavity. Before the hollow space S is vacuumized, the hollow space S is consistent with the concave cavity; when the hollow space S is vacuumized, the mother board 1 gradually enters the concave cavity, the hollow space S gradually decreases, and at the moment, the hollow space S is smaller than the concave cavity.
Optionally, the concave curved surface 212 includes a planar region at the bottom and a cambered surface region connected to the edge of the planar region, and an end of the cambered surface region away from the planar region is connected to the supporting surface 211. The cambered surface region can guide the edge of the mother board 1 to deform so as to bend the edge of the mother board 1 into a cambered surface shape.
Optionally, the upper end of the female die 21 has an upper surface 213 and a positioning groove 214 concavely formed from the upper surface 213, and the shape of the positioning groove 214 matches the shape of the flat-plate-shaped mother board 1. The supporting surface 211 is a bottom surface of the positioning groove 214. In step S110, the flat-plate-shaped mother board 1 may be placed into the positioning groove 214 and supported by the support surface 211. The positioning groove 214 may play a role of positioning to guide the mother board 1 to be placed on the die 21. Meanwhile, when the vacuum pumping treatment is performed on the hollow space S, the positioning groove 214 can also play a limiting role, so that the mother board 1 is prevented from shaking, and the hollow space S is prevented from being communicated with the space on the upper side of the mother board 1.
Referring to fig. 4, after the curved cover plate 3 is bent and formed, the outer surface of the curved cover plate 3 is attached to the concave curved surface 212; since the outer surface of the curved cover plate 3 is an exposed convex surface, even if the outer surface of the curved cover plate 3 is indented by pressing the concave curved surface 212, it can be removed by a polishing process or the like.
In some specific embodiments, referring to fig. 2, the step of evacuating the hollow space S under the preset temperature condition includes:
Step S121: heating the mother board 1 to a first preset temperature condition through the female die 21 and keeping for a period of time;
Step S122: the hollow space S is evacuated to allow the mother board 1 to be bent and attached along the concave curved surface 212 under the action of negative pressure.
After step S121, the mother board 1 is softened and easily bent at a high temperature, and at this time, the negative pressure required for bending deformation of the mother board 1 can be reduced by performing step S122.
Optionally, the first preset temperature condition is 700 ℃ to 750 ℃. The mother board 1 can be fully softened in a high-temperature environment of 700-750 ℃. In some examples, step S121 lasts for 70S-120S, optionally, the mother board 1 is heated to the first preset temperature condition for 40S-90S, and maintained at the first preset temperature condition for 20S-80S.
Optionally, the time of step S122 is 70S-120S, so that the mother board 1 can be sufficiently deformed under the action of the negative pressure.
In some specific embodiments, step S122 is performed under a second preset temperature condition, which is less than the first preset temperature condition. Optionally, the second preset temperature condition is 680-720 ℃, which is slightly lower than the first preset temperature condition, so that the defect can be reduced in the bending deformation process of the mother board 1.
In some specific embodiments, step S120 further comprises:
in step S123, the mother board 1 attached to the concave curved surface 212 is maintained at the third preset temperature for a period of time. Wherein the third preset temperature condition is lower than the second preset temperature condition. Optionally, the third preset temperature condition is 650 ℃ -680 ℃.
After step S122, step S123 is performed, and vacuum pumping is continued, so that the mother board 1 is continuously attached to the concave curved surface 212, and meanwhile, the temperature of the mother board 1 is reduced, so that the mother board 1 is solidified to form the curved cover plate 3, and the curved cover plate 3 is prevented from deforming under the action of self restoring force.
Optionally, the time of step S123 is 70S-120S. This can sufficiently cure the shape of the curved cover plate 3.
Alternatively, the duration of step S121, step S122, and step S123 is the same. The three steps S121, S122 and S123 may be performed at three stations, respectively, and the same duration may enable continuous production of the curved cover plate 3.
In some specific embodiments, referring to fig. 5 and 6, the die 2 provided in step S110 further includes a male die 22, and the male die 22 includes an upper convex curved surface 221 matching with the curved cover plate 3 to be formed, and the upper convex curved surface 221 is located on a side of the mother board 1 away from the lower concave curved surface 212.
Alternatively, the punch 22 has a lower surface 222 and a convex portion protruding from the lower surface 222, the upper convex curved surface 221 being at least a portion of the surface of the convex portion. Prior to step S120, the mother sheet 1 is placed on the support surface 211 to be supported, and the upwardly convex curved surface 221 is in contact with the surface of the mother sheet 1 remote from the downwardly concave curved surface 212.
Step S121 includes: the mother sheet 1 is heated to a first preset temperature condition by the female die 21 and the male die 22 and held for a period of time. And meanwhile, the female die 21 and the male die 22 heat the mother board 1, so that the heating efficiency can be effectively improved. In some examples, heating means may be integrated in the female die 21 and the male die 22, enabling the female die 21 and the male die 22 to actively generate heat; in other examples, the female die 21 and the male die 22 may also be heated by other heating means, the female die 21 and the male die 22 functioning to conduct heat to the master 1.
Simultaneously with step S120, the manufacturing method further includes step S130: the male die 22 and the female die 21 are driven in relative motion so that the upper convex curved surface 221 is held in contact with the surface of the mother sheet 1 facing away from the lower concave curved surface 212.
In step S120, the mother board 1 is deformed toward the concave curved surface 212, and at this time, step S130 is performed, the convex curved surface 221 is kept in contact with the mother board 1, and the male die 22 can continuously heat the mother board 1 to keep the mother board 1 at a preset temperature. On the other hand, the upwardly convex curved surface 221 of the punch 22 can also guide the deformation of the mother sheet 1.
Optionally, the upper convex curved surface 221 also includes a planar area and a cambered surface area connected to an edge of the planar area, and the planar area of the upper convex curved surface 221 contacts the mother board 1 to heat the mother board 1 when the step S121 is performed; in the step S122, the male die 22 moves toward the female die 21, and the curved surface area of the upwardly convex curved surface 221 can guide the edge deformation of the mother sheet 1.
In the target state, the convex curved surface 221 is in contact with the mother board 1 and the pressure of the convex curved surface 221 and the mother board 1 is 0, so that the convex curved surface 221 does not form poor appearance such as stamping, indentation, orange peel and the like on the surface of the mother board 1. Of course, for process reasons, in order to ensure that the upwardly convex curved surface 221 can remain in contact with the mother board 1, the upwardly convex curved surface 221 may exert a certain pressure on the mother board 1; however, the pressure applied to the mother sheet 1 by the upper convex curved surface 221 is not for pressing the mother sheet 1, so that even if the upper convex curved surface 221 applies pressure to the mother sheet 1, the pressure is relatively small; at this time, even if the inner surface of the curved cover plate 3 contacting the upwardly convex curved surface 221 is formed with poor appearance such as stamping, indentation, orange peel, etc. due to pressure, the depth of the poor appearance is small, and the poor appearance can be disposed of with a small removal amount by the polishing process, thereby reducing the polishing time and improving the polishing yield. On the other hand, since the pressure applied to the mother board 1 by the upwardly convex curved surface 221 is small, the abrasion to the male die 22 can be reduced, the service life of the die 2 can be prolonged, and the production cost can be reduced.
Optionally, the pressure applied by the convex curved surface 221 to the mother board 1 is less than 0.1Mpa, so as to reduce the appearance defects such as stamping, indentation, orange peel and the like formed on the inner surface of the curved cover board 3, and improve the polishing yield; meanwhile, the abrasion to the male die 22 is reduced, the service life of the die 2 is prolonged, and the production cost is reduced.
In some specific embodiments, sheet 1 is a glass sheet. Alternatively, the curved cover plate 3 serves as a curved outer screen of the handset.
The embodiment of the application also provides a forming device of the curved cover plate. Referring to fig. 7, the molding apparatus of the embodiment of the present application includes a mold 2, a temperature control mechanism 5, and a vacuum evacuation mechanism 6. The mold 2 includes a molding surface matching with the curved cover plate 3 to be molded, and the mold 2 is used for placing a flat plate-shaped mother board 1 on one side of the molding surface. The temperature control mechanism 5 is used for enabling the mother board 1 placed on the die 2 to reach a preset temperature condition. The vacuumizing mechanism 6 is used for vacuumizing the hollow space S between the molding surface and the mother board 1, so that the mother board 1 is bent and attached along the molding surface under the action of negative pressure to form the curved cover plate 3.
When it is necessary to produce the curved cover plate 3, the flat-plate-shaped mother sheet 1 is placed on one side of the molding surface of the mold 2, with a hollow space S between the molding surface and the mother sheet 1. Then, the temperature control mechanism 5 heats the die 2 to make the mother board 1 on the die 2 reach the preset temperature condition. Under the preset temperature condition, the mother board 1 is softened and easy to deform. Then, the vacuum-pumping mechanism 6 performs vacuum-pumping treatment on the hollow space S, the mother board 1 moves toward the molding surface under the action of negative pressure and deforms, when the mother board 1 contacts with the molding surface, the molding surface guides the mother board 1 to bend at a set position, and when the mother board 1 is completely attached to the molding surface, the mother board 1 deforms to a set shape to form the curved cover plate 3.
According to the forming device for the curved cover plate, disclosed by the embodiment of the application, the mother plate 1 is driven to deform through the negative pressure effect, and the mother plate 1 is directly extruded from the upper side without a die, so that appearance defects such as stamping, indentation, orange marks and the like formed on the surface of the curved cover plate 3 are reduced, and the appearance yield of the curved cover plate 3 is improved. On the other hand, the die 2 does not need to directly extrude the mother board 1, so the application can reduce the abrasion of the curved cover plate 3 to the die in the forming process, prolong the service life of the die and reduce the production cost.
In some specific embodiments, the mold 2 includes a female mold 21 and a male mold 22 that are slidingly connected, the female mold 21 having a support surface 211 and a concave curved surface 212 formed by recessing the support surface 211, the concave curved surface 212 being a forming surface, and the male mold 22 including an upper convex curved surface 221 that mates with the curved cover plate 3 to be formed.
Alternatively, referring to fig. 8, the upper end of the female die 21 has an upper surface 213 and a positioning groove 214 concavely formed from the upper surface 213, and the shape of the positioning groove 214 matches the shape of the flat-plate-shaped mother board 1. The supporting surface 211 is a bottom surface of the positioning groove 214. The flat-plate-shaped mother sheet 1 may be placed into the positioning groove 214 and supported by the support surface 211. The positioning groove 214 may play a role of positioning to guide the mother board 1 to be placed on the die 21. Meanwhile, when the vacuum pumping treatment is performed on the hollow space S, the positioning groove 214 can also play a limiting role, so that the mother board 1 is prevented from shaking, and the hollow space S is prevented from being communicated with the space on the upper side of the mother board 1.
The punch 22 has a lower surface 222 and a convex portion protruding from the lower surface 222, and the upper convex curved surface 221 is at least a part of the surface of the convex portion.
Alternatively, the die 21 has guide posts extending from the upper surface 213 toward the punch 22, the punch 22 being provided with guide holes in sliding engagement with the guide posts up and down. Alternatively, the die 21 is provided with guide holes and the punch 22 is provided with guide posts.
When the curved cover plate 3 is required to be produced, the mother board 1 is placed on the supporting surface 211 and positioned between the concave curved surface 212 and the convex curved surface 221, and at this time, a hollow space S can be formed between the mother board 1 and the concave curved surface 212.
The temperature control mechanism 5 comprises a first heating plate 51, a second heating plate 52 and a power assembly 53, wherein the power assembly 53 is connected to at least one of the female die 21 and the male die 22 and is used for driving the first heating plate 51 and the second heating plate 52 to move relatively. The first heating plate 51 and the second heating plate 52 are integrated inside with a heat generating member.
Optionally, a power assembly 53 is connected to the second heating plate 52 and is used to drive the second heating plate 52 closer to or farther from the first heating plate 51. The power assembly 53 may be a cylinder.
The female die 21 is intended to be placed on the first heating plate 51 and to be heated by the first heating plate 51, the male die 22 being located on the side of the female die 21 remote from the first heating plate 51, and the second heating plate 52 being located on the side of the male die 22 remote from the female die 21 and intended to heat the male die 22. The evacuation mechanism 6 is connected to the first heating plate 51 and is used for evacuating the hollow space S.
The operation of the curved cover plate forming apparatus of the present application in some embodiments will be briefly described with reference to fig. 7 and 8:
Firstly), placing the mother board 1 on the supporting surface 211 of the female die 21, and abutting the upper convex curved surface 221 of the male die 22 against the mother board 1 from the upper side;
Secondly), placing the die 2 provided with the mother board 1 on the first heating plate 51, wherein the female die 21 is in contact with the first heating plate 51; then, the power assembly 53 drives the second heating plate 52 downward and into contact with the punch 22;
Third), the first heating plate 51 and the second heating plate 52 heat the mother board 1 through the female die 21 and the male die 22, respectively, so that the mother board 1 reaches a preset temperature condition and is maintained for a period of time;
Fourth), the vacuumizing mechanism 6 is started and vacuumizes the hollow space S, the mother board 1 moves towards the concave curved surface 212 under the action of negative pressure and deforms, and meanwhile, the power component 53 drives the male die 22 to move downwards through the second heating plate 52 so that the convex curved surface 221 of the male die 22 is kept in contact with the mother board 1;
Fifth), after the mother board 1 is completely attached to the concave curved surface 212, the power unit 53 stops driving the punch 22 to move downward, while the evacuation mechanism 6 continues to maintain the evacuation. After a period of time, the curved cover plate 3 is molded.
In some specific embodiments, the first heating plate 51 has a through hole 511, the evacuating mechanism 6 is connected to the first heating plate 51 and communicates with the through hole 511, and the die 21 covers the through hole 511. Alternatively, the vacuum-pumping mechanism 6 includes a vacuum pump 61 and a pipe 62 connected to the vacuum pump 61, the pipe 62 being connectable from the lower side to the through hole 511, and the die 21 covering the through hole 511 from the upper side.
The surface of the female die 21 facing the first heating plate 51 is provided with a groove 215 communicating with the through hole 511, and the female die 21 is made of a gas permeable material. The die 21 is thin at the portion where the recess 215 is provided (i.e., the portion of the bottom wall of the die 21 located between the recess 215 and the concave curved surface 212), while the die 21 is made of a gas-permeable material, so that the vacuum pump 61 can draw out the gas in the die 21 through the bottom wall of the die 21 when the through hole 511 is evacuated. In the embodiment of the present application, there is no need to provide a through hole in the concave curved surface 212, so that the formation of an indentation in the curved cover plate 3 can be avoided. Alternatively, the die 21 is made of graphite.
Optionally, along the axial direction of the through hole 511, the orthographic projection of the through hole 511 is located within the orthographic projection of the groove 215. The "orthographic projection of the through hole 511" refers to an area surrounded by an orthographic projection of the peripheral wall surrounding the through hole 511 along the axial direction, and the "within the orthographic projection of the groove 215" refers to an area surrounded by an orthographic projection of the peripheral wall surrounding the groove 215 along the axial direction. At this time, the size of the through hole 511 is large, and the efficiency of vacuum pumping can be improved.
In one example, the bottom surface 216 of the recess 215 is spaced from the concave curved surface 212 by a distance of 0.3mm to 0.7mm, in other words, the thickness of the portion of the bottom wall of the die 21 between the recess 215 and the concave curved surface 212 is 0.3mm to 0.7mm. If the distance is less than 0.3mm, the thickness of the portion of the bottom wall of the die 21 between the groove 215 and the concave curved surface 212 is too small, and there is a risk of breakage when pressed by the mother sheet 1. If the distance is greater than 0.7mm, the thickness of the portion of the bottom wall of the female die 21 between the recess 215 and the concave curved surface 212 is excessively large, resulting in an excessively low efficiency of evacuation, insufficient negative pressure in the hollow space S, and affecting the formation of the curved cover plate 3. Optionally, the bottom surface 216 of the groove 215 is spaced from the concave curved surface 212 by 0.5mm.
These embodiments are not exhaustive of all details, nor are they intended to limit the application to the precise embodiments disclosed, in accordance with the application. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the application and the practical application, to thereby enable others skilled in the art to best utilize the application and various modifications as are suited to the particular use contemplated. The application is limited only by the claims and the full scope and equivalents thereof.
Claims (4)
1. The forming method of the curved cover plate is characterized by comprising the following steps of:
Providing a mold, wherein the mold comprises a molding surface matched with a curved surface cover plate to be molded, a flat plate-shaped master plate is placed on one side of the molding surface of the mold, and a hollow space is formed between the molding surface and the master plate;
Under the preset temperature condition, vacuumizing the hollow space to enable the mother board to be bent and attached along the molding surface under the action of negative pressure and form a curved surface cover plate;
The step of providing a die comprises a female die, wherein the female die is provided with a concave curved surface, the concave curved surface is the molding surface, and the hollow space is formed between the female plate and the concave curved surface;
the step of providing the die comprises a male die, wherein the male die comprises an upper convex curved surface matched with a curved cover plate to be formed, and the upper convex curved surface is positioned on one side of the mother board far away from the lower concave curved surface;
The step of vacuumizing the hollow space under the preset temperature condition comprises the following steps:
Heating the mother board to a first preset temperature condition through the female die and the male die, and keeping for a period of time, wherein the first preset temperature condition is 700-750 ℃;
vacuumizing the hollow space to enable the mother board to be bent and attached along the concave curved surface under the action of negative pressure;
Driving the male die and the female die to move relatively so as to keep the upward convex curved surface in contact with the surface, facing away from the downward concave curved surface, of the mother board;
The pressure exerted by the upward convex curved surface on the mother board is less than 0.1Mpa;
The hollow space is vacuumized, so that the step of bending and attaching the mother board along the concave curved surface under the action of negative pressure is performed under a second preset temperature condition, and the second preset temperature condition is smaller than the first preset temperature condition;
the step of performing vacuum pumping treatment on the hollow space under the preset temperature condition further comprises the following steps:
Maintaining the mother board attached to the concave curved surface for a period of time under a third preset temperature condition;
The third preset temperature condition is lower than the second preset temperature condition, and the third preset temperature condition is 650-680 ℃;
the mother board in the step of placing the flat-plate-shaped mother board on one side of the molding surface of the mold is a glass plate.
2. The molding method as claimed in claim 1, wherein,
The female die is provided with a supporting surface, the concave curved surface is formed by recessing the supporting surface, and the mother board is placed on the supporting surface for supporting.
3. The molding method according to claim 1, wherein the step of heating the master sheet to a first predetermined temperature condition by the die and maintaining the master sheet for a period of time is performed for 70s to 120s, and the step of evacuating the hollow space to allow the master sheet to be bent and attached along the concave curved surface under the action of negative pressure is performed for 70s to 120s.
4. The molding method according to claim 1, wherein the step of maintaining the master sheet attached to the concave curved surface at a third preset temperature for a period of time is 70s to 120s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011064821.3A CN112174499B (en) | 2020-09-30 | 2020-09-30 | Forming method of curved surface cover plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011064821.3A CN112174499B (en) | 2020-09-30 | 2020-09-30 | Forming method of curved surface cover plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112174499A CN112174499A (en) | 2021-01-05 |
| CN112174499B true CN112174499B (en) | 2024-05-24 |
Family
ID=73948149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011064821.3A Active CN112174499B (en) | 2020-09-30 | 2020-09-30 | Forming method of curved surface cover plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112174499B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114248422B (en) * | 2021-12-03 | 2023-04-21 | 中国电子科技集团公司第二十九研究所 | Bending and shaping tool and method for RT/Duriod board |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB786416A (en) * | 1955-10-05 | 1957-11-20 | Hydro Chemie Ag | Improvements in and relating to vacuum deep-drawing of thermoplastic sheet material |
| KR20160118746A (en) * | 2015-04-03 | 2016-10-12 | (주)대호테크 | The mold device for glass molding which doesn't make any adsorption molding marks during vacuum molding |
| TW201806890A (en) * | 2016-08-26 | 2018-03-01 | 關鍵應用科技股份有限公司 | Manufacturing method of 3D glass |
| CN107879605A (en) * | 2017-12-06 | 2018-04-06 | 李宝轮 | A kind of permeability type bend glass mould and curve glass forming apparatus |
| CN207391252U (en) * | 2016-10-31 | 2018-05-22 | 正达国际光电股份有限公司 | Forming die |
| CN207685130U (en) * | 2017-12-06 | 2018-08-03 | 李宝轮 | A kind of curve glass forming apparatus |
| CN110255870A (en) * | 2019-06-27 | 2019-09-20 | Oppo广东移动通信有限公司 | The hot bending shape method of hot bending equipment and shell |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018020958A (en) * | 2016-07-22 | 2018-02-08 | 旭硝子株式会社 | Molding tool, molding equipment, and production method of bent glass |
-
2020
- 2020-09-30 CN CN202011064821.3A patent/CN112174499B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB786416A (en) * | 1955-10-05 | 1957-11-20 | Hydro Chemie Ag | Improvements in and relating to vacuum deep-drawing of thermoplastic sheet material |
| KR20160118746A (en) * | 2015-04-03 | 2016-10-12 | (주)대호테크 | The mold device for glass molding which doesn't make any adsorption molding marks during vacuum molding |
| TW201806890A (en) * | 2016-08-26 | 2018-03-01 | 關鍵應用科技股份有限公司 | Manufacturing method of 3D glass |
| CN207391252U (en) * | 2016-10-31 | 2018-05-22 | 正达国际光电股份有限公司 | Forming die |
| CN107879605A (en) * | 2017-12-06 | 2018-04-06 | 李宝轮 | A kind of permeability type bend glass mould and curve glass forming apparatus |
| CN207685130U (en) * | 2017-12-06 | 2018-08-03 | 李宝轮 | A kind of curve glass forming apparatus |
| CN110255870A (en) * | 2019-06-27 | 2019-09-20 | Oppo广东移动通信有限公司 | The hot bending shape method of hot bending equipment and shell |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112174499A (en) | 2021-01-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102117337B1 (en) | Apparatus for forming a glass | |
| CN112174499B (en) | Forming method of curved surface cover plate | |
| US20190152829A1 (en) | Thermoforming method and thermoforming device for glass product | |
| JP2009539626A5 (en) | ||
| KR101697467B1 (en) | Method for manufacturing mold for thermoformed glass | |
| SG126739A1 (en) | Method and apparatus for manufacturing glass substrate for storage medium, glass substrate for storage medium, and storage medium | |
| JP2007230241A (en) | Press-forming method | |
| JP5046075B2 (en) | Glass article molding method and molding apparatus | |
| JPH01242428A (en) | Method for molding glass product | |
| CN208232309U (en) | A kind of jig for the glass evacuated fitting of 3D | |
| TWI641565B (en) | Molded three-dimensional glass mold and mold forming method | |
| CN207330729U (en) | Model solid glass mold | |
| TW201408604A (en) | Mould and apparatus of glass molding and method using same | |
| CN215750705U (en) | Film pressing forming device and film pasting system | |
| KR102005919B1 (en) | Forming Zig for Curved Glass and Manufacturing Equipment Including Thereof | |
| CN111844715A (en) | Vehicle-mounted glass laminating equipment under vacuum state | |
| KR101164866B1 (en) | Molding apparatus, thermal transfer press apparatus, and method of manufacturing thermal transfer molding article | |
| CN111825314A (en) | Glass bending method and mold | |
| CN101839438B (en) | Lampshade and making method thereof | |
| CN106648243A (en) | Preparation method of integrally molded curved touch screen | |
| CN219217832U (en) | Mould | |
| CN105985008A (en) | Vacuum-assisted glass forming method and using method thereof | |
| CN212581753U (en) | Negative pressure forming equipment | |
| CN112079555A (en) | 3D glass forming die and 3D glass forming system | |
| CN211707884U (en) | Stamping die for thick plates |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant |