CN112164880B - Guided missile ceramic antenna house connection structure - Google Patents
Guided missile ceramic antenna house connection structure Download PDFInfo
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- CN112164880B CN112164880B CN202010911912.XA CN202010911912A CN112164880B CN 112164880 B CN112164880 B CN 112164880B CN 202010911912 A CN202010911912 A CN 202010911912A CN 112164880 B CN112164880 B CN 112164880B
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- pin
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- ceramic radome
- missile
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/27—Adaptation for use in or on movable bodies
- H01Q1/28—Adaptation for use in or on aircraft, missiles, satellites, or balloons
- H01Q1/281—Nose antennas
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- Engineering & Computer Science (AREA)
- Astronomy & Astrophysics (AREA)
- Aviation & Aerospace Engineering (AREA)
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Abstract
The invention discloses a missile ceramic radome connecting structure which comprises a ceramic radome and a connecting ring, wherein a plurality of non-through pin holes are formed in the inner wall of the ceramic radome; the connecting ring is fixedly connected with the ceramic radome through connecting glue and is fixedly connected with the ceramic radome through a pin; glue solution is poured into the non-through pin holes, glue overflow holes are formed in the pins along the axial direction, and a buffer glue layer is formed between the non-through pin holes and the pins after the glue solution is solidified. According to the missile ceramic radome connection structure provided by the invention, the mode of combining glue and pin connection is adopted, so that the connection strength of the ceramic radome and the connection ring is enhanced, and the buffer glue layer is formed between the non-through pin hole and the pin to ensure that the ceramic radome is not easy to crack.
Description
Technical Field
The invention relates to the technical field of missile radomes, in particular to a missile ceramic radome connecting structure.
Background
The radome of the missile is positioned at the forefront part of the missile and is required to bear external load in the flying process and thermal stress generated by pneumatic heating. Generally, when high temperature resistant ceramic material was chooseed for use to guided missile antenna house material, because ceramic material is fragile, should not punch or fluting, ceramic antenna house generally is connected through the go-between that the mode of gluing set up rather than the root to realize through the go-between and be connected between the body of bullet, the go-between passes power more evenly through the mode of connecting gluey cementing with ceramic antenna house, and simple structure.
However, the bonding method cannot eliminate the thermal stress generated by pneumatic heating, when the temperature of the connecting glue rises, the bonding performance is reduced, even the connection fails in severe cases, and the bonding quality between the ceramic radome and the connecting ring cannot be checked, so that a great safety risk exists.
Disclosure of Invention
The invention provides a missile ceramic radome connecting structure, which aims to solve the problems of uncontrollable bonding quality and unreliable bonding performance existing in a bonding connection mode of a ceramic radome and a connecting ring in the prior art.
The first aspect of the invention provides a missile ceramic radome connecting structure which comprises a ceramic radome and a connecting ring, wherein a plurality of non-through pin holes are formed in the inner wall of the ceramic radome, and a plurality of through pin holes are formed in the connecting ring; the connecting ring is fixedly connected with the ceramic radome through connecting glue and is fixedly connected with the ceramic radome through a pin; glue solution is poured into the non-through pin holes, glue overflow holes are formed in the pins along the axial direction, and a buffer glue layer is formed between the wall of each non-through pin hole and each pin after the glue solution is solidified.
In some embodiments, the pin is a stepped pin, wherein the larger diameter end of the stepped pin is in threaded connection with the through pin hole, and the smaller diameter end of the stepped pin is embedded in the non-through pin hole.
In some embodiments, the buffer glue layer is integrally connected with the connecting glue after being cured.
In some embodiments, the glue solution in the glue overflow hole is integrally connected with the buffer glue layer after being cured.
In some embodiments, the buffer adhesive layer is an organic adhesive with the adhesive property of more than 4Mpa in shear strength within the temperature range of-35 ℃ to 200 ℃.
In some embodiments, the non-through pin hole and the through pin hole are located in the bonding region and correspond in location.
In some embodiments, the material linear expansion coefficients of the ceramic radome and the connection ring are close.
In some embodiments, the glue overflow hole is a through hole.
In some embodiments, the glue overflow hole is provided with an internal thread at one end of the connecting ring, and the internal thread is used for taking out the pin.
In a second aspect, the invention provides a method for installing a connecting structure of a missile ceramic radome, which comprises the steps of adhering and fixing a ceramic radome and a connecting ring, injecting glue solution into a non-through pin hole, then penetrating a pin through the through pin hole and embedding the pin into the non-through pin hole of the ceramic radome, discharging redundant glue solution through a glue overflow hole, and solidifying the residual glue solution to form a buffer glue layer.
The technical scheme provided by the invention has the following beneficial effects:
the invention provides a missile ceramic radome connecting structure, which adopts a mode of combining glue and pin connection, thereby enhancing the connection strength of a ceramic radome and a connecting ring; because a buffer glue layer is formed between the hole wall of the non-through pin and the pin after the glue solution is solidified, the problem of brittle fracture of the ceramic radome is avoided; the glue overflow hole is arranged along the axial direction of the pin, so that the problem that glue solution expands after being excessively cured is avoided.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a ceramic radome connection structure provided in an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a ceramic radome provided in an embodiment of the present invention;
fig. 3 is a schematic partial structural diagram of a ceramic radome connection structure according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a pin according to an embodiment of the present invention;
the antenna comprises a ceramic antenna housing 1, a non-through pin hole 11, a buffer glue layer 12, a connecting ring 2, a through pin hole 21, a pin 3, a glue overflow hole 31 and a connecting glue 4.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly and encompass, for example, both fixed and removable coupling as well as integral coupling; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
It is to be noted that, in the present invention, relational terms such as "first" and "second", and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The invention provides a missile ceramic radome connecting structure which is used for improving the connection reliability of a ceramic radome and a connecting ring and solving the problems of uncontrollable bonding quality and unreliable bonding performance existing in a bonding connection mode of the ceramic radome and the connecting ring.
Fig. 1 to 4 are schematic diagrams of a ceramic radome connection structure according to an embodiment of the present invention, and the missile ceramic radome connection structure according to the present invention includes a ceramic radome 1 and a connection ring 2, wherein the inner wall of the ceramic radome 1 is provided with a plurality of non-through pin holes 11, and the connection ring 2 is provided with a plurality of through pin holes 21; the connecting ring 2 is fixedly connected with the ceramic radome 1 through a connecting glue 4 and is fixedly connected with the ceramic radome 1 through a pin 3; glue solution is poured into the non-through pin hole 11, the pin 3 is provided with a glue overflow hole 31 along the axial direction, and a buffer glue layer 12 is formed between the inner wall of the non-through pin hole 11 and the pin 3 after the glue solution is solidified. The arrangement of the pin 3 avoids the problem that the ceramic radome 1 falls off from the connecting ring 2 after the bonding failure; the arrangement of the buffer glue layer 12 prevents the inner wall of the non-through pin hole 11 from directly contacting with the pin 3, so that the ceramic radome 1 is prevented from being cracked due to excessive stress; after the glue solution fills the gaps among the inner wall of the non-through pin hole 11, the pin 3 and the connecting glue 4, the excessive glue solution enters the glue overflow hole 31 and is cured in the glue overflow hole 31 to be integrally connected with the buffer glue layer 12, and the buffer glue layer 12 is integrally connected with the connecting glue 4.
Preferably, the non-through pin holes 11 and the through pin holes 21 are uniformly distributed in the circumferential direction to reduce the concentrated stress of the ceramic radome 1.
Preferably, the pin 3 is a stepped pin, one end of the stepped pin with a large diameter is screwed into the through pin hole 21, and the other end of the stepped pin with a small diameter is inserted into the non-through pin hole 11, so that the end of the stepped pin with a small diameter can pass through the through pin hole 21 quickly, and the installation speed of the pin 3 is increased.
Preferably, the buffer glue layer 12 is integrally connected with the connection glue 4 after being cured, so that the connection strength between the ceramic radome 1 and the connection ring 2 is increased.
Preferably, the glue solution in the glue overflow hole 31 is integrally connected with the buffer glue layer 12 after being cured, so that the connection strength between the pin 3 and the ceramic radome 1 is increased.
Preferably, the buffer glue layer 12 and the connecting glue 4 both adopt organic glue with the bonding performance of more than 4Mpa of shearing strength within the temperature range of minus 35 ℃ to 200 ℃, and have certain viscosity and elasticity.
Preferably, the plurality of non-through pin holes 11 and the plurality of through pin holes 21 are located in the bonding region and correspond in position, and after the holes are aligned, the pins 3 are simultaneously embedded into the non-through pin holes 11 and the through pin holes 21, so that the ceramic radome 1 and the connection ring 2 are fixed.
Further, the coefficient of linear expansion of the materials of the ceramic radome 1 and the connecting ring 2 is close, and the ceramic radome 1 is prevented from being broken due to the expansion of the connecting ring 2.
Furthermore, the glue overflow hole 31 can be a through hole or a non-through hole, a slight excess of glue solution is poured into the non-through pin hole 11, after the pin 3 is inserted, the glue solution fills the gap between the non-through pin hole 11 and the pin 3, and excess glue solution enters the glue overflow hole 31, when the glue solution is excessive, the glue overflow hole 31 is preferably a through hole, and the excess glue solution can be discharged through the through glue overflow hole 31.
Further, one end of the glue overflow hole 31, which is located at the connection ring 2, is provided with an internal thread, and the internal thread is used for taking out the pin 3.
The installation method of the missile ceramic radome connection structure comprises the following steps: after the ceramic radome 1 and the connection ring 2 are bonded and fixed, the pin 3 penetrates through the through pin hole 21 and is embedded into the non-through pin hole 11 of the ceramic radome 1, glue solution is injected into the non-through pin hole 11, redundant glue solution is discharged through the glue overflow hole 31, and the residual glue solution is cured to form the buffer glue layer 12.
The ceramic radome 1 and the connecting ring 2 are connected in a mode of bonding by the connecting glue 4 and combining the pins 3. The connecting ring 2 is made of a material with a linear expansion coefficient close to that of the ceramic radome 1, the ceramic radome 1 is bonded with the connecting ring 2 by the connecting glue 4 in a large area, meanwhile, the inner wall of the radome body 1 of the ceramic radome in a bonding area is uniformly provided with non-through pin holes 11, and the corresponding positions of the connecting ring 2 are provided with through pin holes 21. After the ceramic radome 1 is bonded with the connecting ring 2, the pin 3 is embedded into the non-through pin hole 11 in the ceramic radome 1, and the effect of enhancing the connection strength of the ceramic radome 1 and the connecting ring 2 is achieved. The pin 3 is a step pin, the diameter of one end embedded in the ceramic antenna housing 1 is smaller than the diameter of the non-through pin hole 11 on the ceramic antenna housing 1 cover body, and the ceramic antenna housing 1 is prevented from being subjected to concentrated stress. Meanwhile, when the pin 3 is installed, the adhesive liquid is injected into the non-through pin hole 11, so that the non-through pin hole 11 is filled with the adhesive liquid, and redundant adhesive liquid is discharged through the adhesive overflow hole 31 of the pin 3. The glue solution fills the non-through pin hole 11, and forms a buffer glue layer 12 after curing, so as to play a buffer role between the ceramic antenna housing 1 and the pin 3. The glue overflow hole 31 is internally threaded and the pin 3 can be removed by screwing a screw into the glue overflow hole 31, if necessary.
The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. The missile ceramic radome connection structure is characterized by comprising a ceramic radome (1) and a connection ring (2), wherein a plurality of non-through pin holes (11) are formed in the inner wall of the ceramic radome (1), and a plurality of through pin holes (21) are formed in the connection ring (2); the connecting ring (2) is fixedly connected with the ceramic antenna housing (1) through a connecting glue (4) and is fixedly connected with the ceramic antenna housing (1) through a pin (3); glue solution is poured into the non-through pin holes (11), glue overflow holes (31) are formed in the pins (3) along the axial direction, and a buffer glue layer (12) is formed between the inner walls of the non-through pin holes (11) and the pins (3) after the glue solution is solidified;
the pin (3) is a step pin, one end with the large diameter of the step pin is in threaded connection with the through pin hole (21), one end with the small diameter is embedded into the non-through pin hole (11), and the diameter of one end, embedded into the non-through pin hole (11), of the pin (3) is smaller than that of the non-through pin hole (11).
2. The missile ceramic radome connection structure of claim 1, wherein: the buffer glue layer (12) is integrally connected with the connecting glue (4) after being cured.
3. The missile ceramic radome connection structure of claim 1, wherein: the glue solution in the glue overflow hole (31) is solidified and then is integrally connected with the buffer glue layer (12).
4. The missile ceramic radome connection structure of claim 1, wherein: the buffer glue layer (12) is made of organic glue with the adhesive property of more than 4Mpa within the temperature range of minus 35 ℃ to 200 ℃.
5. The missile ceramic radome connection structure of claim 1, wherein: the non-through pin hole (11) and the through pin hole (21) are located in the bonding area and correspond in position.
6. The missile ceramic radome connection structure of claim 1, wherein: the linear expansion coefficients of the materials of the ceramic radome (1) and the connecting ring (2) are close to each other, so that the ceramic radome (1) is prevented from cracking due to the expansion of the connecting ring (2).
7. The missile ceramic radome connection structure of claim 1, wherein: the glue overflow hole (31) is a through hole.
8. The missile ceramic radome connection structure of claim 7, wherein: and an internal thread is arranged at one end of the glue overflow hole (31) positioned on the connecting ring (2), and the internal thread is used for taking out the pin (3).
9. The installation method of the missile ceramic radome connection structure as claimed in any one of claims 1 to 8, wherein: after the ceramic antenna housing (1) and the connecting ring (2) are fixedly bonded, glue solution is injected into the non-through pin hole (11), then the pin (3) penetrates through the through pin hole (21) and is embedded into the non-through pin hole (11) of the ceramic antenna housing (1), redundant glue solution is discharged through the glue overflow hole (31), and the residual glue solution is cured to form the buffer glue layer (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010911912.XA CN112164880B (en) | 2020-09-02 | 2020-09-02 | Guided missile ceramic antenna house connection structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010911912.XA CN112164880B (en) | 2020-09-02 | 2020-09-02 | Guided missile ceramic antenna house connection structure |
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| CN112164880A CN112164880A (en) | 2021-01-01 |
| CN112164880B true CN112164880B (en) | 2022-09-02 |
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| CN105415710A (en) * | 2015-11-03 | 2016-03-23 | 上海无线电设备研究所 | Antenna housing structure and forming method and die thereof |
| CN206834331U (en) * | 2016-12-15 | 2018-01-02 | 中国航空工业集团公司济南特种结构研究所 | A kind of external becket root attachment structure of refractory ceramics structure radome |
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| JP6278924B2 (en) * | 2015-04-08 | 2018-02-14 | 三菱電機株式会社 | Method for manufacturing flying radome |
| CN206723237U (en) * | 2017-05-23 | 2017-12-08 | 广东通宇通讯股份有限公司 | A kind of waterproof antenna with screw nail sealing structure |
| CN207052759U (en) * | 2017-07-14 | 2018-02-27 | 中国航空工业集团公司济南特种结构研究所 | A kind of antenna house built-in metal ring root attachment structure |
| CN109269780A (en) * | 2017-07-18 | 2019-01-25 | 中国航空工业集团公司济南特种结构研究所 | A method of test missile-borne radome glue-line temperature |
| CN109494473A (en) * | 2018-07-13 | 2019-03-19 | 中国航空工业集团公司济南特种结构研究所 | A kind of connection structure of newer versions of these missiles antenna house |
| CN109638445B (en) * | 2018-10-26 | 2021-11-02 | 上海无线电设备研究所 | Preparation method of high-temperature-resistant foam A interlayer composite material radome |
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| CN105415710A (en) * | 2015-11-03 | 2016-03-23 | 上海无线电设备研究所 | Antenna housing structure and forming method and die thereof |
| CN206834331U (en) * | 2016-12-15 | 2018-01-02 | 中国航空工业集团公司济南特种结构研究所 | A kind of external becket root attachment structure of refractory ceramics structure radome |
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