CN105034249B - A kind of method for packing with brill acoustic wave transducer - Google Patents
A kind of method for packing with brill acoustic wave transducer Download PDFInfo
- Publication number
- CN105034249B CN105034249B CN201510399228.7A CN201510399228A CN105034249B CN 105034249 B CN105034249 B CN 105034249B CN 201510399228 A CN201510399228 A CN 201510399228A CN 105034249 B CN105034249 B CN 105034249B
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- China
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- encapsulating material
- shell
- packing
- acoustic wave
- piezoceramics crystal
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Measuring Fluid Pressure (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
A kind of method for packing with brill acoustic wave transducer, it is described to comprise the following steps with brill acoustic wave transducer including rubber layer, shell and the piezoceramics crystal and electric connector being encapsulated in the shell, the method for packing：1) electrode of the piezoceramics crystal is connected with electric connector by lead, be placed in mould；2) encapsulating material is prepared, the encapsulating material is identical with the thermal coefficient of expansion of the piezoceramics crystal；3) encapsulating material is heated to being filled in the mould after fusing point, forms the shell after encapsulating material cooling and solidifying, the encapsulating material is packaged as a whole with the piezoceramics crystal and electric connector；4) by external application rubber layer on the shell.The method for packing ensures the piezoceramics crystal that will not be damaged in it in encapsulation process, the external application Rubber shockproof on the shell for boring acoustic wave transducer, and is advantageous to transducer installation.
Description
Technical field
The present invention relates to a kind of with the method for packing for boring acoustic wave transducer.
Background technology
It is the most important element of acoustic logging while drilling instrument with brill acoustic wave transducer, when instrument works, as built in instrument
Transmitting transducer produces sound wave, is then received by the receive transducer in same instrument, passes through the various mode waves that receive
The acoustic information such as velocity of wave and decay evaluates borehole wall medium character.Because with the hydrophthalmia for having mud among instrument is bored, sound wave changes
Energy device is arranged on drill collar outer wall, is sealed it is difficult to be immersed in as cable acoustic logging instrument in oil, so, with brill acoustic wave transducer one
As using individually encapsulation, it is of the prior art with bore acoustic wave transducer appearance sealed by High temperature epoxy resinses, high temperature wire draws
Go out, transducing should be caused under high-temperature and high-pressure conditions with being that epoxy resin sealant easily retains bubble the shortcomings that boring acoustic wave transducer
Device insulation is reduced or destroyed, and is also exactly that the polytetrafluoroethylene (PTFE) crust of high temperature wire and epoxy resin can not bond very well, high temperature
Mud may enter inside transducer along wire sheath under high pressure, destroy the insulation of transducer.
The content of the invention
It is an object of the present invention to provide a kind of with the method for packing for boring acoustic wave transducer, the encapsulation in the method for packing
Material is packaged by the way of injection, ensures the piezoceramics crystal that will not be damaged in it in encapsulation process.
The technical solution adopted in the present invention is, a kind of with the method for packing for boring acoustic wave transducer, described to be changed with brill sound wave
Energy device includes rubber layer, shell and the piezoceramics crystal and electric connector being encapsulated in the shell, the method for packing
Comprise the following steps：1) electrode of the piezoceramics crystal is connected with electric connector by lead, be placed in mould；2)
Encapsulating material is prepared, the thermal coefficient of expansion error of the encapsulating material and the piezoceramics crystal is no more than 1 × 10-6/℃；3)
The encapsulating material is heated to being filled in the mould after fusing point, formed after encapsulating material cooling and solidifying described outer
Shell, and the encapsulating material is packaged as a whole with the piezoceramics crystal and connector；4) by external application rubber on the shell
Glue-line.
It is preferred that the electric connector is pressure-bearing thrusting needle, the Plug pin patch bay of the pressure-bearing thrusting needle is in the step 3) by institute
Encapsulating material is stated to be molded.
It is preferred that the electric connector is pressure-bearing thrusting needle, the Plug pin patch bay of the pressure-bearing thrusting needle is metal material, the pressure-bearing
The Plug pin patch bay of contact pin is integral with encapsulating material injection in the step 3).
It is preferred that the encapsulating material includes the high temperature polymeric materialses of 50-100 parts by weight and the glass of 0-50 parts by weight
Glass fiber.
It is preferred that the high temperature polymeric materialses include polyether-ether-ketone, polytetrafluoroethylene (PTFE) or polyimides.
It is preferred that the lead is connected with the electrode of the piezoceramics crystal using silver soldering.
It is preferred that the piezoceramics crystal is cylindrical, its piezoelectric ceramic body head and the tail phase by multiple sections in arcuation
Company forms, and the inner surface of the piezoelectric ceramic body and outer surface are respectively provided with slot electrode, and the slot electrode is arranged in the piezoelectricity
The both ends of ceramic body, metal electrode is embedded with the slot electrode.
The beneficial effects of the invention are as follows：
1st, encapsulating material of the invention is packaged in the form of injection, and pressure is uniform in encapsulation process, will not be to it
Interior piezoceramics crystal causes to damage.
If the 2, difference of thermal expansion coefficients is larger, transducer enclosure can be caused to ftracture under hot conditions, therefore be sealed in the present invention
Glass fibre is added in package material, for reinforcement and the thermal coefficient of expansion of adjustment encapsulating material, makes itself and piezoceramics crystal
Thermal coefficient of expansion is consistent, and (piezoceramics crystal thermal coefficient of expansion is generally 4.8 × 10-6/℃)。
3rd, in encapsulating material of the present invention main material using high temperature polymeric materialses be because its by additive adjustment, leather
Change temperature and can reach 170 DEG C, higher than transducer technology index；Its condensing temperature is at 360 DEG C or so, in the composite relatively
It is low, avoided piezoceramics crystal depolarization in injection molding process, because piezoceramics crystal is using being preceding in hot conditions
Lower polarization, same can also take off polarization under the high temperature conditions, so piezoceramics crystal is not easy to be placed in for a long time more than its residence
In temperature environment, the crystal Curie temperature that uses of the present invention is up to 380 DEG C.
4th, being used with brill acoustic wave transducer, the shell of transducer and the Plug pin patch bay of pressure-bearing thrusting needle in the present invention in the present invention
Encapsulating material be molded, make integral with the Plug pin patch bay injection for the shell and pressure-bearing thrusting needle for boring acoustic wave transducer, effectively keep away
Exempt from mud to penetrate into inside transducer along transducer lead, increase sealing effectiveness between the two.
5th, metal electrode is arranged on the both ends of piezoelectric ceramic body in the present invention, can avoid the piezoelectric ceramic body in polarization process
It is breakdown.
6th, the electrode of lead and piezoceramics crystal is connected using silver soldering, scolding tin in injection molding process can be avoided to melt
Cause to connect unreliable (silver point is 960 DEG C).
7th, rubber is suppressed in the outer surface of the encapsulating material of injection molding, strengthened with the shockproof properties for boring acoustic wave transducer,
Be advantageous to the installation of transducer.
Brief description of the drawings
Fig. 1 is the present invention with the sectional view for boring acoustic wave transducer；
Fig. 2 is the present invention with the structural representation for boring acoustic wave transducer；
Fig. 3 is the present invention with the side view for boring piezoelectric ceramic body in acoustic wave transducer；
Fig. 4 is the present invention with the top view for boring piezoelectric ceramic body in acoustic wave transducer.
Embodiment
For the object, technical solutions and advantages of the present invention are more clearly understood, below in conjunction with accompanying drawing to the present invention
Embodiment be described in detail.It should be noted that in the case where not conflicting, in the embodiment and embodiment in the application
Feature can mutually be combined.
As depicted in figs. 1 and 2, it is a kind of with boring acoustic wave transducer, including shell 1 and covering rubber layer 5, Yi Jifeng thereon
Piezoceramics crystal 2 and electric connector 4 in the shell 1, it should include with the method for packing for boring acoustic wave transducer as follows
Step：1) electrode of the piezoceramics crystal 2 is connected with electric connector 4 by lead 3, be placed in mould；2) prepare
Encapsulating material, the encapsulating material are identical with the thermal coefficient of expansion of the piezoceramics crystal；3) encapsulating material is heated
It is filled in after to fusing point in the mould, forms the shell 1 after encapsulating material cooling and solidifying, make the encapsulating material
It is packaged as a whole with the piezoceramics crystal 2 and electric connector 4；4) by external application rubber layer 5 on the shell, enhancing it is described with
The shockproof properties of acoustic wave transducer are bored, and are advantageous to transducer installation.
A preferred embodiment of the invention is that electric connector 4 is pressure-bearing thrusting needle, and pressure-bearing thrusting needle includes contact pin and Plug pin patch bay,
The material of the Plug pin patch bay is above-mentioned encapsulating material, and in the method for packing for boring acoustic wave transducer, first contact pin and piezoelectricity are made pottery
Porcelain crystal 2 is connected by lead 3, is placed in mould；Encapsulating material injection is added again, makes the Plug pin patch bay of pressure-bearing thrusting needle and with brill sound
The shell of wave transducer is molded integral in the step 3) of above-mentioned method for packing by the encapsulating material.
Another preferred embodiment of the present invention is that electric connector 4 is pressure-bearing thrusting needle, and pressure-bearing thrusting needle includes contact pin and contact pin
Seat, the material of the Plug pin patch bay is metal material, in the method for packing for boring acoustic wave transducer, by pressure-bearing thrusting needle and piezoelectric ceramics
Crystal 2 is connected by lead 3, is placed in mould；Encapsulating material injection is added again, makes the Plug pin patch bay of pressure-bearing thrusting needle in above-mentioned encapsulation
It is bonded to one in the step 3) of method with encapsulating material.
As shown in Figure 3 and Figure 4, the piezoceramics crystal in the present invention is cylindrical, its pressure by multiple sections in arcuation
Ceramics body 6, which joins end to end, to be formed, and the section of piezoelectric ceramic body 6 is quadrant, and piezoceramics crystal is by four piezoelectricity
Ceramic body 6 is spliced, and the inner surface of each piezoelectric ceramic body 6 and outer surface are respectively provided with a slot electrode, and the slot electrode
Be arranged in the both sides of the piezoelectric ceramic body 5, be embedded with metal electrode 7 in the slot electrode, metal electrode 7 by lead 3 with
Electric connector 4 connects.
Encapsulating material in the present invention includes the high temperature polymeric materialses of 50-100 parts by weight and the glass of 0-50 parts by weight
Glass fiber, wherein, high temperature polymeric materialses include but is not limited to polyether-ether-ketone, polytetrafluoroethylene (PTFE) or polyimides；It is prepared
Method comprises the following steps：
1) coupling agent NDZ-102 is added in absolute ethyl alcohol, solution for standby is made；
2) glass fibre is placed in high mixer, dried 8 hours after being well mixed with above-mentioned solution；
3) high temperature polymeric materialses are dried 8 hours in the case where temperature is 120 DEG C；By the fire resistant polymer after drying
The height in high mixer is mixed with above-mentioned mixed glass fibre for material, and the mixture of generation is the encapsulating material.
In the encapsulation process of the present invention, ensure transducer leaving no air bubbles inside, and piezoceramics crystal and encapsulating material
Thermal coefficient of expansion error be no more than 1 × 10-6/ DEG C, by the test in 150 DEG C of high temperature and pressure test well, 140MPa, transducer
It is undeformed, without fragmentation, electric property with it is completely the same before experiment, reached designing technique index.
Although disclosed herein embodiment as above, described content only to facilitate understand the present invention and adopt
Embodiment, it is not limited to the present invention.Any those skilled in the art to which this invention pertains, this is not being departed from
On the premise of the disclosed spirit and scope of invention, any modification and change can be made in the implementing form and in details,
But the scope of patent protection of the present invention, still should be subject to the scope of the claims as defined in the appended claims.
Claims (4)
- It is 1. a kind of with the method for packing for boring acoustic wave transducer, it is characterised in that described to include rubber layer, outer with boring acoustic wave transducer Shell and the piezoceramics crystal and electric connector being encapsulated in the shell, the electric connector include contact pin and Plug pin patch bay, The method for packing comprises the following steps：1) electrode of the piezoceramics crystal is connected with contact pin by lead, be placed in mould；2) encapsulating material is prepared, the encapsulating material includes the high temperature polymeric materialses and 0-50 parts by weight of 50-100 parts by weight Glass fibre；The thermal coefficient of expansion error of the encapsulating material and the piezoceramics crystal is no more than 1 × 10-6/℃；3) encapsulating material is heated to being filled in the mould after fusing point, formed after encapsulating material cooling and solidifying The shell and Plug pin patch bay, make shell and the Plug pin patch bay injection integral；4) by external application rubber layer on the shell.
- 2. method for packing as claimed in claim 1, it is characterised in that the high temperature polymeric materialses include polyether-ether-ketone, Polytetrafluoroethylene (PTFE) or polyimides.
- 3. method for packing as claimed in claim 1, it is characterised in that the electrode of the lead and the piezoceramics crystal is adopted Connected with silver soldering.
- 4. method for packing as claimed in claim 1, it is characterised in that the piezoceramics crystal is cylindrical, and it is by multiple Section joins end to end in the piezoelectric ceramic body of arcuation and formed, and the inner surface of the piezoelectric ceramic body and outer surface are respectively provided with electrode Groove, and the slot electrode is arranged in the both ends of the piezoelectric ceramic body, and metal electrode is embedded with the slot electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510399228.7A CN105034249B (en) | 2015-07-08 | 2015-07-08 | A kind of method for packing with brill acoustic wave transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510399228.7A CN105034249B (en) | 2015-07-08 | 2015-07-08 | A kind of method for packing with brill acoustic wave transducer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105034249A CN105034249A (en) | 2015-11-11 |
| CN105034249B true CN105034249B (en) | 2017-12-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510399228.7A Active CN105034249B (en) | 2015-07-08 | 2015-07-08 | A kind of method for packing with brill acoustic wave transducer |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106522925B (en) * | 2016-11-21 | 2018-04-13 | 中国科学院地质与地球物理研究所 | It is a kind of to receive transducer package with brill orientation acoustic signals |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86206715U (en) * | 1986-09-05 | 1987-06-03 | 李少夫 | Ultrasonic atomized energy converter with packaged vibrator and flexible components |
| CN2359726Y (en) * | 1998-04-28 | 2000-01-19 | 阮建民 | Non-induction type low-voltage steady D. C. power supply module |
| CN202550090U (en) * | 2012-02-29 | 2012-11-21 | 西安空间无线电技术研究所 | High voltage adaptor for traveling wave tube amplifier |
| CN202693079U (en) * | 2012-06-21 | 2013-01-23 | 广州市番禺奥迪威电子有限公司 | Ultrasonic sensor for liquid level measurement |
| CN103115967A (en) * | 2013-01-21 | 2013-05-22 | 济南大学 | Acoustic emission sensor as well as preparation method and application thereof |
| CN103726835A (en) * | 2013-08-14 | 2014-04-16 | 中国石油大学(华东) | While-drilling reflecting sound wave measuring sound system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2166466Y (en) * | 1993-06-23 | 1994-05-25 | 董志伟 | Full-closed ultrasound wave energy transducer |
-
2015
- 2015-07-08 CN CN201510399228.7A patent/CN105034249B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86206715U (en) * | 1986-09-05 | 1987-06-03 | 李少夫 | Ultrasonic atomized energy converter with packaged vibrator and flexible components |
| CN2359726Y (en) * | 1998-04-28 | 2000-01-19 | 阮建民 | Non-induction type low-voltage steady D. C. power supply module |
| CN202550090U (en) * | 2012-02-29 | 2012-11-21 | 西安空间无线电技术研究所 | High voltage adaptor for traveling wave tube amplifier |
| CN202693079U (en) * | 2012-06-21 | 2013-01-23 | 广州市番禺奥迪威电子有限公司 | Ultrasonic sensor for liquid level measurement |
| CN103115967A (en) * | 2013-01-21 | 2013-05-22 | 济南大学 | Acoustic emission sensor as well as preparation method and application thereof |
| CN103726835A (en) * | 2013-08-14 | 2014-04-16 | 中国石油大学(华东) | While-drilling reflecting sound wave measuring sound system |
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| CN105034249A (en) | 2015-11-11 |
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Address after: 100010 Chaoyangmen North Street, Dongcheng District, Dongcheng District, Beijing Co-patentee after: China Oilfield Services Limited Patentee after: China Offshore Oil Group Co., Ltd. Address before: 100010 Chaoyangmen North Street, Dongcheng District, Dongcheng District, Beijing Co-patentee before: China Oilfield Services Limited Patentee before: China National Offshore Oil Corporation |