CN112163658A - 一种芯片防转移方法、防转移芯片及射频标签 - Google Patents

一种芯片防转移方法、防转移芯片及射频标签 Download PDF

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CN112163658A
CN112163658A CN202010936041.7A CN202010936041A CN112163658A CN 112163658 A CN112163658 A CN 112163658A CN 202010936041 A CN202010936041 A CN 202010936041A CN 112163658 A CN112163658 A CN 112163658A
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chip
conductive adhesive
tag antenna
composite material
electric connection
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闫运来
马纪丰
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Sichuan Huada Hengxin Technology Co ltd
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Abstract

本发明提供一种芯片防转移方法、防转移芯片及射频标签，该方法包括以下步骤：加工形成芯片的凸点，凸点包括电连接凸点与支撑凸点；其中至少一个电连接凸点采用复合材料加工形成；将加工完成的芯片与标签天线封装在一起，电连接凸点与标签天线导通；在转移芯片期间，分离已封装在一起的芯片与标签天线；将分离得到的芯片浸泡到导电胶专用清洗液，以清洗芯片上附着的导电胶；在利用导电胶专用清洗液清洗芯片上附着的导电胶同时，芯片上的复合材料加工形成的电连接凸点被导电胶专用清洗液溶解。该方法使用复合材料作为电连接凸点的材料，该材料能导电并易溶于导电胶转用清洗液，转移芯片时，复合材料制成的电连接凸点也腐蚀掉，实现芯片防转移。

Description

一种芯片防转移方法、防转移芯片及射频标签
技术领域
本发明涉及电子防伪技术领域，特别涉及一种芯片防转移方法、防转移芯片及射频标签。
背景技术
在无源RFID防伪应用中，防止RFID标签转移并重复使用，是考量系统防伪能力的重要指标。常用防转移方案多是考虑天线防转移，如天线基材采用易碎纸、陶瓷片等易碎材质；当试图转移标签时天线损坏而使标签失效。但这种方法的弊端是芯片是完好的，造假者可以通过专用试剂把芯片完好地从标签上取下来，再倒封装到新的天线上，从而实现芯片重复使用，这种方案只破坏天线无法彻底实现标签防转移。
还有一些芯片防转移方案在芯片内设置专用存储器和比较器，芯片初次上电工作时，测量外接天线的特征参数并记录在专用存储器中，在初始化以后的工作状态下，芯片测量外接天线的特征参数并与专用存储器中的值进行比较，若不一致则将自身标记为已转移状态。这种方案需要为防转移功能设计专门的功能逻辑，增加了芯片设计复杂度和设计成本；此外，还有在芯片上加工测试凸点的防转移方案，当电连接凸点和测试凸点都和天线连接时，标签可以失效，但这也增加了添加测试凸点的工艺过程。
发明内容
有鉴于此，本发明的目的之一在于提供涉及一种芯片防转移方法，可实现芯片的转移盗用。
为实现上述目的，本发明的技术方案为：
一种芯片防转移方法，包括以下步骤：
加工形成芯片的凸点，所述凸点包括电连接凸点与支撑凸点；其中至少一个电连接凸点采用复合材料加工形成；
将加工完成的芯片与标签天线封装在一起，所述电连接凸点与所述标签天线导通；
在转移芯片期间，分离已封装在一起的芯片与所述标签天线，将分离得到的芯片浸泡到导电胶专用清洗液，以清洗所述芯片上附着的导电胶；
在利用导电胶专用清洗液清洗芯片上附着的导电胶同时，芯片上的复合材料加工形成的电连接凸点被导电胶专用清洗液溶解。
进一步地，所述复合材料的组分包括：环氧树脂与金镍颗粒；所述金镍颗粒填充于所述环氧树脂中。
进一步地，复合材料加工形成的电连接凸点能导电并易溶于所述导电胶专用清洗液。
进一步地，除复合材料加工形成的电连接凸点外的其他电连接凸点由金材料或铜材料加工制成。
与此同时，本发明还提供了上述方法在基于RFID标签的身份芯片防转移、商品防伪芯片防转移、票证芯片防转移中的应用。
有鉴于此，本发明的目的之二在于提供涉及一种防转移芯片，该芯片可用于防转移。
为实现上述目的，本发明的技术方案为：
一种防转移芯片，包括：
芯片本体，所述芯片本体与标签天线固定连接的一面设置有支撑作用的支撑凸点和与所述标签天线形成导通的电连接凸点；其中，至少一个电连接凸点采用复合材料加工形成，采用复合材料加工形成的电连接凸点能与标签天线导通。
进一步地，所述复合材料组分包括：环氧树脂与金镍颗粒；所述金镍颗粒填充于所述环氧树脂中。
进一步地，复合材料加工形成的电连接凸点能导电并易溶于所述导电胶专用清洗液。
进一步地，除复合材料加工形成的电连接凸点外的其他电连接凸点由金材料或铜材料制成。
与此同时，发明还提供一种射频标签，包括：上述的防转移芯片；通过导电胶与防转移芯片封装在一起的标签天线。
本发明通过使用在环氧树脂中填充金镍颗粒的复合材料制作芯片上的电连接凸点，这种复合材料制成的电连接凸点能导电并易溶于导电胶转用清洗液，当芯片被从天线上取下用导电胶去除剂去除芯片上的导电胶时，会把复合材料制成的电连接凸点也腐蚀掉，这样芯片将无法再和天线实现电连接，从而实现防转移目的。本技术无需在芯片加工时多加工测试凸点，也无需设计专门的防转移功能逻辑，加工工艺简单，降低了生产成本。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍。显而易见地，下面描述中的附图是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其它的附图。
图1a是本发明实施例提供的一种芯片防转移方法的流程示意图；
图1b是本发明实施例提供的一种芯片防转移方法的工艺流程示意图；
图2a和图2b是本发明实施例提供的防转移芯片及凸点的侧视图和俯视图；
图3a和图3b是本发明实施例提供的射频标签中芯片和标签天线的绑定位置关系的侧视图和俯视图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
所举实施例是为了更好地对本发明进行说明，但并不是本发明的内容仅局限于所举实施例。所以熟悉本领域的技术人员根据上述发明内容对实施方案进行非本质的改进和调整，仍属于本发明的保护范围。
实施例1
参考图1a，为本发明实施例提供的一种芯片防转移方法的流程示意图，具体地，一种芯片防转移方法包括以下步骤：
S100：加工形成芯片的凸点；然后执行步骤S200；
本实施例中，对传统的芯片加工形成做改变，使用一种复合材料作为芯片电连接凸点的制作元件，具体地，采用的复合材料的组分包括：环氧树脂与金镍颗粒；金镍颗粒填充于所述环氧树脂中；
本实施例中，该采用复合材料加工形成的电连接凸点可以只有一个，其余电连接凸点的制作材料为金材料或铜材料；也可以是所有的电连接凸点均是符合材料加工形成；
本实施例中复合材料加工形成的电连接凸点能导电并易溶于导电胶专用清洗液。
S200：将加工完成的芯片与标签天线封装在一起，电连接凸点与标签天线导通；然后执行步骤S300；
本实施例中，将步骤S100中加工得到的芯片通过导电胶和标签天线封装在一起，封装方法可使用倒封装；在一具体实施例中，芯片上的电连接凸点(包括复合材料加工成的电连接凸点与金材料或铜材料加工成的电连接凸点)通过导电胶与标签天线上的感应线圈(或称天线线圈)导通，从而通过将芯片上的电路与天线线圈导通，实现信号传输。
S300：在转移芯片期间，分离已封装在一起的芯片与标签天线，将分离得到的芯片浸泡到导电胶专用清洗液，以清洗芯片上附着的导电胶；然后执行步骤S400；
本实施例中，当想要进行芯片转移盗用时，需要分离已封装在一起的芯片与标签天线，此时分离的芯片上还附着有导电胶，需要放入导电胶专用清洗液中将芯片表面的导电胶去除。
S400：在利用导电胶专用清洗液清洗芯片上附着的导电胶同时，芯片上的复合材料加工形成的电连接凸点被导电胶专用清洗液溶解。
在步骤S300将将芯片表面的导电胶去除时，芯片上使用复合材料加工成的电连接凸点会被导电胶专用清洗液溶解，失去该复合材料加工成的电连接凸点；再将该芯片与其它标签天线封装在一起后，因芯片失去复合材料加工成的电连接凸点，而导致芯片与标签天线不导通，芯片失效。
本发明实施例的方法可以有效防止芯片转移重用，适用于基于RFID标签的身份芯片防转移场景、商品防伪芯片防转移场景、票证芯片防转移场景等芯片防转移场景。
为进一步说明实施1的技术原理和实施过程，以下结合图1b对芯片防转移方法做进一步说明：
图1b中的芯片上的电连接凸点1与电连接凸点2均为复合材料加工成的，然后经过步骤S200，即图1b中步骤a，芯片与标签天线4封装在一起，电连接凸点与标签天线导通；接着，对芯片进行转移，通过步骤300(图1b中步骤b)分离已封装在一起的芯片与标签天线，将分离得到的芯片浸泡到导电胶专用清洗液，最终经过步骤S400(图1b中步骤c)，电连接凸点1与电连接凸点2均被导电胶专用清洗液溶液，只剩下芯片本体3，由于失去了电连接凸点1与电连接凸点2，再将该芯片与其它标签天线封装在一起后，芯片与标签天线也不导通，芯片失效。
实施例2
本发明还提供了一种防转移芯片，图2a和图2b是使用图1b中工艺流程制作的一种防转移芯片的一实施例侧视图和俯视图，芯片本体3的平面呈矩形，其四个角分别设有电连接凸点1和2，支撑凸点5和6，本实施例，电连接凸点1与2均为复合材料加工成的，复合材料的组分包括：环氧树脂与金镍颗粒；金镍颗粒填充于所述环氧树脂中，该复合材料加工形成的电连接凸点能导电并易溶于所述导电胶专用清洗液；当然，以上只是本实施中的一种具体方式，在其他实施例中，可以只有电连接凸点1为复合材料加工成的，电连接凸点2还是为金材料或铜材料，本发明中的防转移芯片只需要至少一个电连接凸点为复合材料加工制成的即可。
本实施例中，复合材料加工成的电连接凸点1和2具备电连接性，从而使芯片可以与标签天线导通，形成回路；其中，支撑凸点5和6不具备电连接性，其在芯片本体3与标签天线封装在一起时支撑芯片本体3。
实施例3
基于实施例2的防转移芯片，本实施例中提供一种射频标签，具体参考图3a与图3b，具体地，该射频标签包括：实施例2中的防转移芯片；通过导电胶与防转移芯片封装在一起的标签天线。
标签天线包括天线基材7(材料一般是PET、铜版纸、易碎纸等)和固定安置在天线基材7上的一组天线线圈8。
带有电连接凸点1和2、支撑凸点5和6的芯片本体3倒封装在标签天线上，电连接凸点1和2通过各向异性导电胶9与天线线圈8连接并导通；电连接凸点1与2均为复合材料加工成的，复合材料的组分包括：环氧树脂与金镍颗粒；金镍颗粒填充于所述环氧树脂中，该复合材料加工形成的电连接凸点能导电并易溶于所述导电胶专用清洗液。
上面结合附图对本发明的实施例进行了描述，但是本发明并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本发明的启示下，在不脱离本发明宗旨和权利要求所保护的范围情况下，还可做出很多形式，这些均属于本发明的保护之内。

Claims (10)

1.一种芯片防转移方法，其特征在于，包括以下步骤：
加工形成芯片的凸点，所述凸点包括电连接凸点与支撑凸点；其中至少一个电连接凸点采用复合材料加工形成；
将加工完成的芯片与标签天线封装在一起，所述电连接凸点与所述标签天线导通；
在转移芯片期间，分离已封装在一起的芯片与所述标签天线；
将分离得到的芯片浸泡到导电胶专用清洗液，以清洗所述芯片上附着的导电胶；
在利用导电胶专用清洗液清洗芯片上附着的导电胶同时，芯片上的复合材料加工形成的电连接凸点被导电胶专用清洗液溶解。
2.根据权利要求1所述的方法，其特征在于，所述复合材料的组分包括：环氧树脂与金镍颗粒；所述金镍颗粒填充于所述环氧树脂中。
3.根据权利要求2所述的方法，其特征在于，复合材料加工形成的电连接凸点能导电并易溶于所述导电胶专用清洗液。
4.根据权利要求3所述的方法，其特征在于，除复合材料加工形成的电连接凸点外的其他电连接凸点由金材料或铜材料加工制成。
5.如权利要求1～4任一项所述方法在基于RFID标签的身份芯片防转移、商品防伪芯片防转移、票证芯片防转移中的应用。
6.一种防转移芯片，其特征在于，包括：
芯片本体，所述芯片本体与标签天线固定连接的一面设置有支撑作用的支撑凸点和与所述标签天线形成导通的电连接凸点；其中，至少一个电连接凸点采用复合材料加工形成，采用复合材料加工形成的电连接凸点能与标签天线导通。
7.根据权利要求6所述的芯片，其特征在于，所述复合材料组分包括：环氧树脂与金镍颗粒；所述金镍颗粒填充于所述环氧树脂中。
8.根据权利要求7所述的芯片，其特征在于，复合材料加工形成的电连接凸点能导电并易溶于所述导电胶专用清洗液。
9.根据权利要求8所述的芯片，其特征在于，除复合材料加工形成的电连接凸点外的其他电连接凸点由金材料或铜材料制成。
10.一种基于权利要求6-9任一项所述的防转移芯片做成射频标签，其特征在于，包括：所述防转移芯片；通过导电胶与所述防转移芯片封装在一起的标签天线。
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Publication number Priority date Publication date Assignee Title
CN106845614A (zh) * 2017-02-16 2017-06-13 上海坤锐电子科技有限公司 一种基于聚合物凸点芯片的物理防拆的rfid电子标签
CN110717571A (zh) * 2019-11-05 2020-01-21 四川华大恒芯科技有限公司 一种防转移芯片及射频标签
CN111144533A (zh) * 2019-12-20 2020-05-12 四川华大恒芯科技有限公司 一种芯片防转移方法、防转移芯片及射频标签

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106845614A (zh) * 2017-02-16 2017-06-13 上海坤锐电子科技有限公司 一种基于聚合物凸点芯片的物理防拆的rfid电子标签
CN110717571A (zh) * 2019-11-05 2020-01-21 四川华大恒芯科技有限公司 一种防转移芯片及射频标签
CN111144533A (zh) * 2019-12-20 2020-05-12 四川华大恒芯科技有限公司 一种芯片防转移方法、防转移芯片及射频标签

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