CN112151446B - Wafer cutting and fixing method and device thereof - Google Patents
Wafer cutting and fixing method and device thereof Download PDFInfo
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- CN112151446B CN112151446B CN202011015849.8A CN202011015849A CN112151446B CN 112151446 B CN112151446 B CN 112151446B CN 202011015849 A CN202011015849 A CN 202011015849A CN 112151446 B CN112151446 B CN 112151446B
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- wafer
- dicing
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- cutting
- blade
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Abstract
The wafer cutting fixing device is characterized in that the first water sprayer is arranged to enable the wafer to be subjected to force in the direction of a cutting table surface during cutting, the wafer is pressed, the stability of the wafer during cutting is kept, vibration generated during cutting of the cutting blade is reduced, and the phenomenon of fragmentation is reduced.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer cutting and fixing method and a device thereof.
Background
In semiconductor manufacturing, wafer dicing (wafer saw) is a critical process step for dicing a wafer into a plurality of chips (die) to form different semiconductor packages. In the process of dicing a wafer, a plurality of chips need to be separated under the condition of ensuring that each chip is not damaged, so that the normal function of each chip can be ensured, but with the development of a semiconductor process, a circuit layer in the wafer becomes finer and more complex, so that the dicing quality of dicing the wafer is also more required. However, since many dicing stresses are generated during dicing of the wafer, the diced wafer is susceptible to chipping (dicing) on its front and back surfaces. Therefore, it is necessary to provide a wafer dicing fixing method and apparatus thereof to solve the above-mentioned problems.
Disclosure of Invention
The invention aims to provide a wafer cutting and fixing method and a device thereof.
In order to achieve the above object, a first aspect of the present invention provides a wafer dicing fixing method, comprising the steps of:
providing a wafer to be cut on a cutting table top, wherein the wafer is provided with a first surface facing the cutting table top and a second surface facing away from the first surface;
dicing the wafer from the second surface using a dicing blade, the dicing blade having two sides perpendicular to the second surface; and
and when cutting is performed, the first water sprayer is used for spraying high-pressure water columns on the second surface of the wafer beside the two side surfaces of the cutting blade, so that the wafer is pressed towards the cutting table surface.
Further, before providing the wafer to be cut on the cutting table top, the method further comprises the following steps:
the dicing adhesive film comprises a substrate layer and an adhesive layer arranged on the substrate layer, wherein the substrate layer is arranged on the dicing table top, and the adhesive layer is adhered to the wafer.
Further, the method comprises the following steps:
and the wafer is adsorbed and fixed on the cutting table top by vacuum adsorption from the cutting table top.
Further, the high pressure water column has a pressure of 300 to 500 kilopascals.
Further, the high-pressure water column sprayed by the first water sprayer is inclined at a non-orthogonal angle relative to the second surface.
Further, the first sprinkler includes a plurality of first water jets that emit the high pressure water jets at different angles relative to the second surface.
Further, the method comprises the following steps of:
spraying water curtains on the two side surfaces of the cutting blade by using a second water sprayer so as to reduce the temperature of the two side surfaces of the cutting blade; and
and spraying water to the contact part of the cutting blade and the second surface by using a third water sprayer.
A second aspect of the present invention provides a wafer cutting apparatus, including:
a dicing table for placing a wafer to be diced, and the wafer has a first surface facing the dicing table and a second surface facing away from the first surface;
a dicing blade for dicing the wafer from the second surface, the dicing blade having two sides perpendicular to the second surface; and
the first water sprayer is arranged on the two side surfaces of the cutting blade, and sprays high-pressure water columns on the second surface of the wafer when cutting is performed, so that the wafer is pressed towards the cutting table surface.
Further, the wafer cutting and fixing device further comprises:
the dicing adhesive film comprises a substrate layer and an adhesive layer arranged on the substrate layer, wherein the substrate layer is arranged on the dicing tabletop, and the adhesive layer is adhered to the wafer.
Further, the dicing table top is provided with a plurality of adsorption holes for adsorbing the wafer, so that the wafer is adsorbed and fixed on the dicing table top by vacuum adsorption from the dicing table top.
Further, the high pressure water column has a pressure of 300 to 500 kilopascals.
Further, the high-pressure water column sprayed by the first water sprayer is inclined at a non-orthogonal angle relative to the second surface.
Further, the first sprinkler includes a plurality of first water jets that emit the high pressure water jets at different angles relative to the second surface.
Further, the wafer cutting device further includes:
the second water sprayers are arranged on the two side surfaces of the cutting blade and used for spraying water curtains on the two side surfaces of the cutting blade so as to reduce the temperature of the two side surfaces of the cutting blade; and
the third water sprayer is arranged at one end of the cutting blade and is used for spraying water to the contact part of the cutting blade and the second surface.
Further, the first and second water sprayers respectively comprise a plurality of first water spraying ports and second water spraying ports, and the first water spraying ports are arranged between the second water spraying ports at intervals.
According to the invention, the first water sprayer is arranged to enable the wafer to be subjected to force in the direction of the cutting table surface during cutting, so that the wafer is pressed, and the stability of the wafer during cutting is maintained, thereby reducing vibration generated during cutting by the cutting blade and reducing the phenomenon of fragmentation.
Drawings
The technical solution and other advantageous effects of the present invention will be made apparent by the following detailed description of the specific embodiments of the present invention with reference to the accompanying drawings.
Fig. 1 is a front view of a wafer dicing fixing apparatus according to a first embodiment of the invention.
Fig. 2 is a top view of a wafer dicing fixture according to a first embodiment of the invention.
Fig. 3 is a side view of a wafer dicing fixture according to a first embodiment of the invention.
Fig. 4 is a flowchart of a wafer dicing fixing method according to a second embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and effects of the present invention clearer and more specific, the present invention will be described in further detail below with reference to the accompanying drawings and examples. It should be understood that the particular embodiments described herein are illustrative only and that the word "embodiment" is used in the description of the invention to mean serving as an example, instance, or illustration, and not being intended to limit the invention.
The terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Features defining "first", "second", and "third" may include one or more of such features, either explicitly or implicitly. Referring to fig. 1, a front view of a wafer dicing fixing apparatus according to a first embodiment of the invention is shown.
The wafer cutting fixture includes a cutting table top 10, a cutting blade 11, and a first water sprayer 12. The dicing table 10 is used for placing a wafer 20 to be diced, and the wafer 20 has a first surface facing the dicing table and a second surface facing away from the first surface; the dicing blade 11 is used for dicing the wafer 20 from the second surface, and the dicing blade 11 has two sides perpendicular to the second surface; the first water sprayers 12 are provided on the two side surfaces of the dicing blade 11, and spray high-pressure water jets on the second surface of the wafer 20 while dicing, so that the wafer 20 is pressed toward the dicing table 10.
In this embodiment, the wafer 20 is a wafer subjected to a wafer thinning process (wafer thinning), and thus the thickness of the wafer 20 is about 100 μm. Specifically, the wafer thinning process is used to thin a wafer for facilitating subsequent wafer dicing and packaging, and the purposes thereof include: (1) increasing the flexibility of the chip; (2) allow for higher coefficient of thermal expansion mismatch; (3) reducing the thermal impedance of the chip to speed up the heat dissipation of the chip; (4) Multiple chips are integrated into one package for application to a system in package (System In Package, SIP) of a chip stack of a three-dimensional integrated circuit (3 DIC), such as a 3-dimensional NAND memory.
In this embodiment, the dicing table 10 has a plurality of suction holes 101 capable of sucking the wafer 20, so as to fix the wafer 20 on the dicing table 10 by vacuum suction from the dicing table 10.
In this embodiment, the wafer dicing fixing apparatus further includes a dicing film 30, the dicing film 30 includes a base layer 31 and an adhesive layer 32 disposed on the base layer 31, the base layer 31 is disposed on the dicing table top 10, and the material may be polyvinyl chloride (Polyvinyl Chloride, PVC) and the thickness is about 110 micrometers; the bonding layer 32 is bonded to the wafer 20, and is used for temporarily fixing the wafer 20 during dicing the wafer 20, so as to avoid displacement or breakage, and thus the dicing process can be performed more stably to improve dicing accuracy, and the thickness is about 20-80 μm.
In this embodiment, although the dicing table 10 and the dicing film 30 are used to absorb and adhere the wafer 20, respectively, and the wafer 20 is fixed while being held stationary during dicing, the wafer 20 still generates a chipping phenomenon at the contact point between the dicing blade 11 and the wafer 20 due to the vibration of the dicing blade 11 during dicing. In order to solve the above problems, the present invention proposes a wafer cutting fixture including a first water sprayer 12.
Referring to fig. 2 and 3, fig. 2 is a top view of a wafer dicing fixing apparatus according to a first embodiment of the invention, and fig. 3 is a side view of the wafer dicing fixing apparatus according to the first embodiment of the invention.
Specifically, the first water sprayers 12 may be disposed on the two sides of the dicing blade 11, when the dicing blade 11 is used to dice the wafer 20, the first water sprayers 12 are used to spray high-pressure water to the wafer 20, so that the wafer 20 can be subjected to a force (as shown by an arrow in fig. 1) toward the dicing table 10 during dicing, and the wafer 20 is pressed, so that the stability of the wafer 20 during dicing is maintained, thereby reducing vibration generated during dicing, and reducing a phenomenon of chipping. It should be noted that the angle of the high-pressure water jet sprayed by the first water sprayer 12 pressing the wafer 20 may be perpendicular or non-perpendicular to the wafer 20, which is not limited by the present invention.
Further, the first water sprayers 12 include a plurality of first water sprayers 121, the angles of the high-pressure water columns sprayed by the first water sprayers 121 relative to the second surface are different, that is, the high-pressure water columns can be sprayed to the wafer 20 by using different angles, and when the high-pressure water columns sprayed by the first water sprayers 12 are inclined at non-orthogonal angles relative to the second surface, the waste generated when the wafer 20 is cut can be removed, the cutting blade 11 can be self-sharpened, and the cutting quality can be improved.
Preferably, the high pressure water column has a spray pressure of 300 to 500 kilopascals.
In this embodiment, the wafer cutting device further includes a second water sprayer 13 disposed on the two sides of the cutting blade 11, and the second water sprayer 13 is used to spray a water curtain (as a dashed line in fig. 1) on the two sides of the cutting blade 11 to cool down in order to avoid the influence of high temperature on the function of the wafer 20, because the cutting blade 11 generates heat due to friction of the cutting surface when cutting.
In this embodiment, since the first water sprayers 12 and the second water sprayers 13 are disposed on the two sides of the cutting table 10, in order to avoid the mutual influence between the two, the plurality of first water sprayers 121 of the first water sprayers 12 and the plurality of second water sprayers 131 of the second water sprayers 13 may be disposed at intervals, that is, the high-pressure water jets sprayed by the plurality of first water sprayers 121 are disposed between the water curtains sprayed by the plurality of second water sprayers 131 at intervals, as shown in fig. 2.
In this step, the wafer cutting apparatus further includes a third water sprayer 14 disposed at one end of the cutting blade 11, wherein the temperature of the cutting surface of the cutting blade 11 is increased due to heat generated by friction of the cutting surface when the cutting blade 11 is cutting, and the third water sprayer 14 is used to spray water (as a dotted line in fig. 3) to the cutting surface of the cutting blade 11, that is, to spray water to a portion of the cutting blade 11 contacting the second surface to cool down the wafer 20.
Referring to fig. 4 in combination with fig. 1 to 3, fig. 4 is a flowchart of a wafer dicing and fixing method according to a second embodiment of the present invention, the method includes the following steps:
step S10: a wafer 20 to be cut is provided on the dicing table 10, the wafer 20 having a first surface facing the dicing table 10 and a second surface facing away from the first surface.
In this step, the wafer 20 is a wafer subjected to a wafer thinning process (wafer thinning).
In this step, the wafer 20 is fixed on the dicing table 10 by vacuum suction from the dicing table 10.
In this embodiment, the step of providing the wafer 20 to be diced before dicing the table top 10 further includes the following steps: a dicing film 30 is provided.
The dicing film 30 includes a base layer 31 and an adhesive layer 32 disposed on the base layer 31, wherein the adhesive layer 32 is adhered to the wafer 20, and is used for temporarily fixing the wafer 20 during dicing the wafer 20, so as to avoid displacement or breakage, and to enable the dicing process to be performed more stably, so as to improve dicing accuracy.
Step S20: the wafer 20 is cut from the second surface using a dicing blade 11, and the dicing blade 11 has both sides perpendicular to the second surface.
In this step, the dicing blade 11 performs dicing from the second surface of the wafer 20 in a direction perpendicular to the second surface.
Step S30: at the same time of dicing, a high-pressure water jet is sprayed to the second surface of the wafer 20 by using a first water sprayer 12 beside the two side surfaces of the dicing blade 11, so that the wafer 20 is pressed toward the dicing table 10.
In this step, when the dicing blade 11 is used to dice the wafer 20, the first water sprayer 12 beside the two sides of the dicing blade 11 is used to spray a high-pressure water column on the second surface of the wafer 20, so that the wafer 20 can be subjected to a force (as shown by an arrow in fig. 1) in the direction of the dicing table 10 during dicing, and the wafer 20 is pressed, so that the stability of the wafer 20 during dicing is maintained, thereby reducing vibration generated during dicing and reducing chipping.
Further, the first water sprayers 12 include a plurality of first water sprayers 121, the angles of the high-pressure water columns sprayed by the first water sprayers 121 relative to the second surface are different, that is, the high-pressure water columns can be sprayed to the wafer 20 by using different angles, and when the high-pressure water columns sprayed by the first water sprayers 12 are inclined at non-orthogonal angles relative to the second surface, the waste generated when the wafer 20 is cut can be removed, the cutting blade 11 can be self-sharpened, and the cutting quality can be improved.
Preferably, the high pressure water column has a spray pressure of 300 to 500 kilopascals.
In this step, the following steps are included while the cutting is performed:
spraying water curtains on the two sides of the cutting blade 11 by using a second water sprayer 13 to reduce the temperature of the two sides of the cutting blade 11; and
a third water jet 14 is used to jet water at the location where the cutting blade 11 contacts the second surface.
In this step, since the cutting blade 11 generates heat due to friction of the cutting surface during cutting, the temperature of the both side surfaces of the cutting blade 11 is increased, and in order to avoid the influence of high temperature on the function of the wafer 20, a water curtain (as a broken line in fig. 1) is sprayed to the both side surfaces of the cutting blade 11 by the second water sprayer 13 to cool down.
In this step, since the cutting blade 11 generates heat due to friction of the cutting surface during cutting, the temperature of the cutting surface of the cutting blade 11 is increased, and in order to avoid the influence of the high temperature on the function of the wafer 20, the third water spray 14 is used to spray water (as a broken line in fig. 3) on the cutting surface of the cutting blade 11, that is, to spray water on the portion where the cutting blade 11 contacts the second surface, to cool.
After this step, the method further comprises: and stripping the cutting adhesive film 30.
Further, the dicing film 240 may be an electronic grade film (blue tape), an ultraviolet film (UV tape), a thermal release film, or the like, which can remove the tackiness of the adhesive layer 32 after a special treatment (such as heating, UV irradiation, etc.), so as to facilitate the removal of the chips formed after dicing.
It will be appreciated that the details of the first and second embodiments of the invention may be explained with respect to each other. According to the invention, the first water sprayer 12 is arranged to enable the wafer 20 to receive force in the direction of the cutting table top 10 during cutting, and press the wafer 20, so that the stability of the wafer 20 during cutting is maintained, and therefore vibration generated during cutting of the cutting blade 11 is reduced, and the phenomenon of fragmentation is reduced.
In summary, although the present invention has been described in terms of the preferred embodiments, the preferred embodiments are not limited to the above embodiments, and various modifications and changes can be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention is defined by the appended claims.
Claims (15)
1. The wafer cutting and fixing method is characterized by comprising the following steps of:
providing a wafer to be cut on a cutting table top, wherein the wafer is provided with a first surface facing the cutting table top and a second surface facing away from the first surface;
dicing the wafer from the second surface using a dicing blade, the dicing blade having two sides perpendicular to the second surface; and
and when cutting is performed, a plurality of first water spray ports of a first water sprayer are used for spraying high-pressure water columns on the second surface of the wafer beside the two side surfaces of the cutting blade, and the angles of the high-pressure water columns sprayed by the plurality of first water spray ports relative to the second surface are different, so that the wafer is pressed towards the direction of the cutting table surface.
2. The method of claim 1, further comprising, prior to providing the wafer to be diced at the dicing table, the steps of:
the dicing adhesive film comprises a substrate layer and an adhesive layer arranged on the substrate layer, wherein the substrate layer is arranged on the dicing table top, and the adhesive layer is adhered to the wafer.
3. The method of claim 1, further comprising the step of:
and the wafer is adsorbed and fixed on the cutting table top by vacuum adsorption from the cutting table top.
4. The method according to claim 1, characterized in that: the high pressure water column has a pressure of 300 to 500 kilopascals.
5. The method according to claim 1, characterized in that: the high-pressure water column sprayed by the first water sprayer is inclined at a non-orthogonal angle relative to the second surface.
6. The method according to claim 1, characterized in that: the method comprises the following steps of:
and spraying water curtains on the two side surfaces of the cutting blade by using a second sprayer, wherein the high-pressure water columns sprayed by the first water spraying ports are arranged among the water curtains sprayed by the second water spraying ports of the second sprayer at intervals.
7. The method of claim 1, wherein the cutting is performed simultaneously with the step of:
and spraying water to the contact part of the cutting blade and the second surface by using a third water sprayer.
8. The utility model provides a wafer cutting fixing device which characterized in that includes:
a dicing table for placing a wafer to be diced, and the wafer has a first surface facing the dicing table and a second surface facing away from the first surface;
a dicing blade for dicing the wafer from the second surface, the dicing blade having two sides perpendicular to the second surface; and
the first water sprayer is arranged on the two side surfaces of the cutting blade, and sprays high-pressure water columns on the second surface of the wafer when cutting is performed, so that the wafer is pressed towards the cutting table surface.
9. The wafer dicing fixture of claim 8, further comprising:
the dicing adhesive film comprises a substrate layer and an adhesive layer arranged on the substrate layer, wherein the substrate layer is arranged on the dicing tabletop, and the adhesive layer is adhered to the wafer.
10. The wafer dicing fixture of claim 8, wherein: the cutting table top is provided with a plurality of adsorption holes for adsorbing the wafer, and the wafer is adsorbed and fixed on the cutting table top by vacuum adsorption from the cutting table top.
11. The wafer dicing fixture of claim 8, wherein: the high pressure water column has a pressure of 300 to 500 kilopascals.
12. The wafer dicing fixture of claim 8, wherein: the high-pressure water column sprayed by the first water sprayer is inclined at a non-orthogonal angle relative to the second surface.
13. The wafer dicing fixture of claim 8, wherein: the first sprinkler includes a plurality of first water jets, and the high pressure water jets from the plurality of first water jets are at different angles relative to the second surface.
14. The wafer dicing fixture of claim 8, further comprising:
the second water sprayers are arranged on the two side surfaces of the cutting blade and used for spraying water curtains on the two side surfaces of the cutting blade so as to reduce the temperature of the two side surfaces of the cutting blade; and
the third water sprayer is arranged at one end of the cutting blade and is used for spraying water to the contact part of the cutting blade and the second surface.
15. The wafer dicing fixture of claim 14, wherein: the first water sprayer and the second water sprayer respectively comprise a plurality of first water spraying ports and second water spraying ports, and the first water spraying ports are arranged among the second water spraying ports at intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011015849.8A CN112151446B (en) | 2020-09-24 | 2020-09-24 | Wafer cutting and fixing method and device thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011015849.8A CN112151446B (en) | 2020-09-24 | 2020-09-24 | Wafer cutting and fixing method and device thereof |
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| Publication Number | Publication Date |
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| CN112151446A CN112151446A (en) | 2020-12-29 |
| CN112151446B true CN112151446B (en) | 2023-09-08 |
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| CN202011015849.8A Active CN112151446B (en) | 2020-09-24 | 2020-09-24 | Wafer cutting and fixing method and device thereof |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01188308A (en) * | 1988-01-22 | 1989-07-27 | Nec Corp | Dicing device of semiconductor wafer |
| JPH03181148A (en) * | 1989-12-11 | 1991-08-07 | Tokyo Seimitsu Co Ltd | Dicing method |
| CN1201083A (en) * | 1997-05-29 | 1998-12-09 | 三星电子株式会社 | Chip sawing machine |
| CN1512550A (en) * | 2002-12-30 | 2004-07-14 | 胜开科技股份有限公司 | Method for cutting crystal wafer |
| JP2008192682A (en) * | 2007-02-01 | 2008-08-21 | Nec Electronics Corp | Dicing method and dicing apparatus |
| JP2012064617A (en) * | 2010-09-14 | 2012-03-29 | Disco Abrasive Syst Ltd | Cutting method |
| CN208118157U (en) * | 2018-03-28 | 2018-11-20 | 深圳赛意法微电子有限公司 | Wafer cutting equipment |
-
2020
- 2020-09-24 CN CN202011015849.8A patent/CN112151446B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01188308A (en) * | 1988-01-22 | 1989-07-27 | Nec Corp | Dicing device of semiconductor wafer |
| JPH03181148A (en) * | 1989-12-11 | 1991-08-07 | Tokyo Seimitsu Co Ltd | Dicing method |
| CN1201083A (en) * | 1997-05-29 | 1998-12-09 | 三星电子株式会社 | Chip sawing machine |
| CN1512550A (en) * | 2002-12-30 | 2004-07-14 | 胜开科技股份有限公司 | Method for cutting crystal wafer |
| JP2008192682A (en) * | 2007-02-01 | 2008-08-21 | Nec Electronics Corp | Dicing method and dicing apparatus |
| JP2012064617A (en) * | 2010-09-14 | 2012-03-29 | Disco Abrasive Syst Ltd | Cutting method |
| CN208118157U (en) * | 2018-03-28 | 2018-11-20 | 深圳赛意法微电子有限公司 | Wafer cutting equipment |
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| Publication number | Publication date |
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| CN112151446A (en) | 2020-12-29 |
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