CN112149780A - Chip of electronic tag, electronic tag system and chip identification method - Google Patents
Chip of electronic tag, electronic tag system and chip identification method Download PDFInfo
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- CN112149780A CN112149780A CN202010966945.4A CN202010966945A CN112149780A CN 112149780 A CN112149780 A CN 112149780A CN 202010966945 A CN202010966945 A CN 202010966945A CN 112149780 A CN112149780 A CN 112149780A
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- electronic tag
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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Abstract
The invention discloses a chip of an electronic tag, the electronic tag, an electronic tag system and a chip identification method. The chip includes: a plurality of status bit pads; a conductive structure overlying the plurality of status bit pads; a corrodible insulating layer is arranged between at least one state bit bonding pad and the conductive structure, and the rest state bit bonding pads are in contact with the conductive structure; the detection circuit is electrically connected with the state bit bonding pads and is used for detecting the electrical connection state between the state bit bonding pads and using the electrical connection state as state information; the state information of the chip can be acquired by a reading device. The embodiment of the invention can improve the anti-transfer performance of the electronic tag chip.
Description
Technical Field
The embodiment of the invention relates to an electronic tag technology, in particular to a chip of an electronic tag, the electronic tag, an electronic tag system and a chip identification method.
Background
As a better anti-counterfeiting technology, the RFID (Radio Frequency Identification) anti-counterfeiting technology has been applied in a variety of fields, such as merchandise anti-counterfeiting, ticket anti-counterfeiting, certificate anti-counterfeiting, and luxury goods anti-counterfeiting. The RFID anti-counterfeiting technology is characterized in that a microchip is embedded into a product, an intelligent label is used for identifying various articles, the label is produced according to the RFID wireless radio frequency identification principle, the label and a reader-writer exchange information through wireless radio frequency signals, and compared with the traditional bar code technology, the RFID electronic label has better reliability, can save more time, manpower and material resources, reduces the production cost and improves the working efficiency.
However, the anti-migration performance of the existing electronic tag is poor, for example, the existing various fragile tags, although they are destroyed after being torn, the antenna is only torn, the chip is not destroyed, if the chip is soaked out by using reagent and taken out and bound to a new antenna again, the formed new electronic tag still completely carries the previous information and can be applied to a counterfeit product, that is, the anti-migration performance of the chip in the existing electronic tag is still poor, and the chip of the electronic tag still needs to be improved.
Disclosure of Invention
The invention provides a chip of an electronic tag, the electronic tag, an electronic tag system and a chip identification method, which aim to improve the anti-transfer performance of the electronic tag chip.
In a first aspect, an embodiment of the present invention provides a chip for an electronic tag, where the chip includes: a plurality of status bit pads; a conductive structure overlying the plurality of status bit pads; a corrodible insulating layer is arranged between at least one state bit bonding pad and the conductive structure, and the rest state bit bonding pads are in contact with the conductive structure; the detection circuit is electrically connected with the state bit bonding pads and is used for detecting the electrical connection state between the state bit bonding pads and using the electrical connection state as state information; the state information of the chip can be acquired by a reading device.
Optionally, the corrodible insulating layer covers the corresponding status bit pad.
Optionally, the material of the corrodible insulating layer is photoresist or epoxy resin.
Optionally, the conductive structure is opaque.
Optionally, the plurality of status bit pads are arranged in an array.
Optionally, the plurality of status bit pads are the same in shape and size.
In a second aspect, an embodiment of the present invention further provides an electronic tag, including the chip and the antenna described in the first aspect; the antenna is electrically connected with the chip.
Optionally, the chip further includes a plurality of functional pads, the antenna further includes a plurality of connection pads, and the functional pads are soldered to the connection pads; the connection pads are multiplexed into the conductive structure.
In a third aspect, an embodiment of the present invention further provides an electronic tag system, where the electronic tag system includes the electronic tag and the reading device described in the second aspect; the reading device can read the state information of the electronic tag.
In a fourth aspect, an embodiment of the present invention further provides a method for identifying a chip of an electronic tag, where the chip includes the chip of the first aspect;
the method comprises the following steps:
acquiring the state information of the chip;
comparing the state information with reserved state information, and identifying a chip of the electronic tag if the state information is consistent with the reserved state information; and if the state information is inconsistent with the reserved state information, not identifying the chip of the electronic tag.
According to the technical scheme of the embodiment of the invention, the chip of the adopted electronic tag comprises a plurality of state bit bonding pads; a conductive structure covering the plurality of status bit pads; a corrodible insulating layer is arranged between at least one state bit bonding pad and the conductive structure, and the rest state bit bonding pads are in contact with the conductive structure; the detection circuit is electrically connected with the state bit bonding pads and is used for detecting the electrical connection state between the state bit bonding pads and taking the electrical connection state as state information; the state information of the chip can be acquired by the reading device. When the chip is shifted, because the chip need utilize chemical reagent to steep out, but the corrodible insulating layer is corroded when chemical reagent steeps out, thereby make the connection state between the status bit pad change, if the chip shifts to on the counterfeit product, because the electrical connection relation of every status bit pad all changes this moment, reading equipment knows that this electronic tags's status information does not match with reservation status information in the original server so, thereby judge that this electronic tags's chip is shifted or for the counterfeit product, do not discern it, thereby the effect that the chip prevented shifting has been reached, very big improvement the security of chip.
Drawings
Fig. 1 is a schematic structural diagram of a chip of an electronic tag according to an embodiment of the present invention;
FIG. 2 is a cross-sectional view taken along line A1A2 in FIG. 1;
fig. 3 is a schematic structural diagram of an electronic tag according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another electronic tag according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of an electronic tag system according to an embodiment of the present invention;
fig. 6 is a flowchart of an identification method of an electronic tag chip according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
Fig. 1 is a schematic structural diagram of a chip of an electronic tag according to an embodiment of the present invention, fig. 2 is a cross-sectional view taken along a direction A1a2 in fig. 1, and referring to fig. 1 and fig. 2, a chip 101 includes: a plurality of status bit pads 102; a conductive structure 103, the conductive structure 103 covering the plurality of status bit pads 102; wherein, a corrodible insulating layer 104 is arranged between at least one state bit pad 102 and the conductive structure 103, and the rest state bit pads 102 are contacted with the conductive structure 103; a detection circuit (not shown) electrically connected to the status bit pads 102 for detecting an electrical connection status between the status bit pads 102 as status information; the state information of the chip can be acquired by the reading device.
Specifically, the chip 101 has functions of storing information related to the electronic tag, processing signals received by the electronic tag, processing signals required to be transmitted by the electronic tag, and the like; the chip 101 may include, for example, functional blocks such as a power supply circuit, a clock circuit, a demodulator, a codec, a controller, and a memory. The power supply circuit is used for rectifying radio-frequency signals input by the electronic tag antenna into direct-current energy; the radio frequency front end absorbs current from the electronic tag antenna, and the current is rectified and stabilized to be used as a direct current power supply of the chip 101, so that a voltage stabilizing and biasing circuit is provided for the chip 101. The clock circuit is used for providing a clock signal, and the carrier signal acquired by the antenna of the electronic tag is processed by the clock circuit to be used as the clock signal of a coder-decoder, a memory, a controller and the like of the electronic tag. The memory is used for storing various information of the electronic tag, such as a User Identification (UID) of the electronic tag, and the memory may be a read-only memory, for example.
In this embodiment, the conductive structure 103 enables the status bit pads 102 to form an electrical connection relationship, for example, before the chip 101 is shipped, a plurality of status bit pads 102 are randomly coated, that is, any number of status bit pads are randomly selected, and a corrodible insulating layer is disposed between the selected status bit pads 102 and the conductive structure 103; for example, as shown in fig. 1, there are A, B, C, D, E, F, G, H and I nine status bit pads, and two status bit pads 102(D and E) are randomly selected for coating, so that before shipping, the detection circuit detects the electrical connection status of each status bit pad and other status bit pads, such as a is connected to B, C, F, G, H and I, and is not connected to D, E; d is not connected with A, B, C, E, F, G, H and I, the chip 101 takes the electrical connection relation between each state bit pad and other state bit pads as the reserved state information, and the reserved state information is stored in the server; when the chip 101 is transferred, because the chip 101 needs to be soaked by using a chemical agent, and the corrodible insulating layer 104 is corroded when the chemical agent is soaked out, the connection state between the state bit pads changes, if the chip is transferred to a counterfeit product, because the electrical connection relation of each state bit pad changes at the moment, if A and D are electrically connected, then the reading equipment knows that the state information of the electronic tag is not matched with the reserved state information in the original server, so that the chip of the electronic tag is transferred or is a counterfeit product, and the chip is not identified, thereby achieving the effect of preventing the chip from being transferred, and greatly improving the safety of the chip.
According to the technical scheme of the embodiment, the chip of the adopted electronic tag comprises a plurality of state bit bonding pads; a conductive structure covering the plurality of status bit pads; a corrodible insulating layer is arranged between at least one state bit bonding pad and the conductive structure, and the rest state bit bonding pads are in contact with the conductive structure; the detection circuit is electrically connected with the state bit bonding pads and is used for detecting the electrical connection state between the state bit bonding pads and taking the electrical connection state as state information; the state information of the chip can be acquired by the reading device. When the chip is shifted, because the chip need utilize chemical reagent to steep out, but the corrodible insulating layer is corroded when chemical reagent steeps out, thereby make the connection state between the status bit pad change, if the chip shifts to on the counterfeit product, because the electrical connection relation of every status bit pad all changes this moment, reading equipment knows that this electronic tags's status information does not match with reservation status information in the original server so, thereby judge that this electronic tags's chip is shifted or for the counterfeit product, do not discern it, thereby the effect that the chip prevented shifting has been reached, very big improvement the security of chip.
Optionally, with continued reference to FIG. 2, an etchable insulating layer 104 encapsulates the corresponding status bit pad 102.
Specifically, the status bit pads 102 and the conductive structures 103 can be fixedly connected through the anisotropic conductive adhesive 201, and the corresponding status bit pads 102 and the conductive structures 103 are electrically connected; in order to avoid the situation that the state bit bonding pad corresponding to the corrodible insulating layer is arranged to be laterally and electrically connected with other state bit bonding pads, the corrodible insulating layer 104 can be arranged to cover the corresponding state bit bonding pad 102, so that misjudgment is prevented, and the stability of the chip is improved.
Illustratively, the material of the corrodible insulating layer is photoresist or epoxy.
Specifically, the chip is generally taken out by a solvent capable of dissolving the anisotropic conductive adhesive, such as an acidic organic solvent or an acid solution, in this embodiment, the corrodible insulating layer may be set as a photoresist or an epoxy resin, which can also be dissolved under the action of the acidic organic solvent or the acid solution, so that the electrical connection relationship between the state pads changes after the chip is taken out, and since the corrodible insulating layer is dissolved, a counterfeiter cannot know which state pads are provided with the corrodible insulating layer, thereby greatly improving the anti-migration performance of the chip and improving the safety.
Optionally, as shown in fig. 1, the plurality of status bit pads 102 are arranged in an array, which is advantageous for covering the conductive structure 103 on the plurality of status bit pads 102; on the other hand, any state bit bonding pad has no specificity, and a counterfeiter can not judge which state bit bonding pads are provided with the corrodible insulating layers, so that the anti-transfer performance of the chip is further improved.
Alternatively, as shown in fig. 1, the plurality of status bit pads 102 are all the same in shape and size.
Set up like this, further guarantee that arbitrary state position pad all has no specificity, further make the unable insulating layer that judges which state position pad is provided with corrodible of counterfeiter to further improve the preventing of chip and shift the performance. For example, the status bit pad may have any shape, such as a circle, a rectangle, other polygon, or an irregular shape, which is not specifically limited in this embodiment of the present invention.
Illustratively, the plurality of status bit pads may be located at the center of the chip.
In this embodiment, the overall structure formed by the plurality of status bit pads may be disposed at the center of the chip, generally, the periphery of the chip is provided with the functional pad for binding with the antenna, and the plurality of status bit pads are disposed at the center of the chip, so that the status bit pads are far away from the functional pad, thereby preventing the status bit pads from affecting the functional pad and affecting the normal use of the chip.
Illustratively, the conductive structure 103 may be an opaque conductive structure, such as a metal sheet, to prevent a counterfeiter from detecting which status bit pads are coated by optical means. It should be noted that the embodiment is described by taking the conductive structure 103 as a whole, and in other embodiments, the conductive structure may be multiple pieces as long as it can cover multiple status bit pads. When the number of the conductive structures is multiple, two status bit pads covered by at least one conductive structure need to be arranged to be contacted with the conductive structure.
Fig. 3 is a schematic structural diagram of an electronic tag according to an embodiment of the present invention, and referring to fig. 3, the electronic tag includes a chip and an antenna 301 according to any embodiment of the present invention.
The antenna 301 can transmit the state information inside the chip to the reading device, and can transmit the instruction transmitted by the reading device to the inside of the chip to drive the chip to execute the corresponding function. Since the electronic tag provided by the embodiment of the present invention includes the chip of the electronic tag provided by any embodiment of the present invention, the same advantageous effects are also obtained, and details are not described herein.
Illustratively, the conductive structure 103 and the antenna are fixed to the chip by an anisotropic conductive adhesive layer. As shown in fig. 3, the chip includes a plurality of functional pads 105, the antenna includes a plurality of corresponding connection pads 3011, when the electronic tag is manufactured, after the functional pads and the status pads on the chip are manufactured, the status pads of the film are randomly determined, the film is coated, then an anisotropic conductive adhesive layer is coated on the surface of the chip, and then the conductive structure and the antenna are bound at corresponding positions, that is, the connection pads on the antenna are correspondingly bound with the functional pads on the chip; the conductive structure is correspondingly bound with a state bit bonding pad on the chip; therefore, the difficulty of electronic tag preparation is greatly reduced, the manufacturing process is simplified, and the cost of the electronic tag is favorably reduced.
Optionally, fig. 4 is a schematic structural diagram of another electronic tag according to an embodiment of the present invention, referring to fig. 4, the chip 101 further includes a plurality of functional pads 105, the antenna 301 further includes a plurality of connection pads 3011, and the functional pads 105 are soldered to the connection pads 3011; the connection pads 3011 are multiplexed into the conductive structure 103.
Specifically, in the present embodiment, if the conductive structure 103 includes only one conductive metal block, one of the connection pads 3011 may be reused as a conductive structure; if the conductive structure includes a plurality of conductive metal blocks, a plurality of the connection pads 3011 may be selectively multiplexed into each conductive metal block, or an additional conductive metal block may be provided in addition to the multiplexed connection pads 3011. The connection pad 3011 is reused as a conductive structure, so that the manufacturing process is simplified and the cost is reduced; on the other hand, when the connection relationship between the status bit pads changes, that is, the chip is transferred, the number of the status bit pads electrically connected to the functional pads 105 may change, so that the equivalent impedance of the corresponding functional pads 105 changes, and the signal receiving circuit inside the chip may not normally receive the instruction sent by the reading device or cannot normally send the status information of the chip through the antenna, thereby further improving the anti-transfer performance of the chip.
Fig. 5 is a schematic structural diagram of an electronic tag system according to an embodiment of the present invention, and referring to fig. 5, the electronic tag system includes an electronic tag 401 and a reading device 402 according to any embodiment of the present invention; the reading device 402 is capable of reading status information of the electronic tag 401.
Specifically, the reading device 402 can send an instruction to the electronic tag 401, and the electronic tag 401 sends return information to the reading device 402 according to the received instruction, so that the reading device 402 can acquire whether the electronic tag 401 is counterfeit, that is, whether a chip in the electronic tag 401 is transferred. The reading device 401 may be a device capable of reading electronic tag information, such as a reader/writer or a mobile phone. The electronic tag system provided by the embodiment of the invention comprises the electronic tag provided by any embodiment of the invention, so that the electronic tag system also has the same beneficial effects, and the details are not repeated herein.
Fig. 6 is a flowchart of an identification method for an electronic tag chip according to an embodiment of the present invention, and referring to fig. 6, the identification method for an electronic tag chip according to an embodiment of the present invention may be used to identify an electronic tag chip according to any embodiment of the present invention, where the identification method includes:
step S601, acquiring state information of the chip.
Specifically, the reading device sends an instruction to the electronic tag, the antenna of the electronic tag receives the instruction and sends the instruction to the chip, and after the chip is analyzed, if the instruction is analyzed to obtain the state information of the chip, the chip can send the current state information of the chip to the reading device through the antenna.
Step S602, comparing the state information with the reserved state information, and identifying the chip of the electronic tag if the state information is consistent with the reserved state information; and if the state information is inconsistent with the reserved state information, the chip of the electronic tag is not identified.
Specifically, the state information includes the current connection state of each state bit pad, that is, the connection relationship between each state bit pad and other state bit pads, after the reading device reads the state information of the electronic tag, the reading device compares the reserved state information with the state information of the electronic tag, if the reserved state information is completely consistent with the state information of the electronic tag, it indicates that a chip in the electronic tag is not transferred, and the electronic tag can be identified, that is, it indicates that the electronic tag is a genuine electronic tag; if the reserved state information is inconsistent with the current state information of the electronic tag (for example, a certain data bit is inconsistent), the electronic tag can not be identified, that is, the electronic tag is a pirated electronic tag. It can be understood that the UID is stored in the chip of each electronic tag, and when the reading device reads the state information of the electronic tag, the reading device also reads the UID of the chip, and determines the reserved state information of the chip through the UID of the chip.
It should be noted that the reserved state information may be stored in the server, which is beneficial to reducing the storage space of the reading device; on the other hand, the risk that the reserved state information is acquired by lawbreakers can be reduced, and the safety is further improved.
According to the technical scheme of the embodiment, the identification method of the electronic tag chip comprises the steps of obtaining state information of the chip; comparing the state information with the reserved state information, and identifying a chip of the electronic tag if the state information is consistent with the reserved state information; and if the state information is inconsistent with the reserved state information, the chip of the electronic tag is not identified. Comparing the reserved state information with the state information of the electronic tag, if the reserved state information is completely consistent with the state information of the electronic tag, indicating that the chip in the electronic tag is not transferred, and identifying the electronic tag, namely indicating that the electronic tag is a legal electronic tag; if the reserved state information is inconsistent with the current state information of the electronic tag, the electronic tag can not be identified, namely the electronic tag is a pirated electronic tag. The accuracy of chip identification can be greatly improved.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A chip for an electronic tag, the chip comprising:
a plurality of status bit pads;
a conductive structure overlying the plurality of status bit pads; a corrodible insulating layer is arranged between at least one state bit bonding pad and the conductive structure, and the rest state bit bonding pads are in contact with the conductive structure;
the detection circuit is electrically connected with the state bit bonding pads and is used for detecting the electrical connection state between the state bit bonding pads and using the electrical connection state as state information;
the state information of the chip can be acquired by a reading device.
2. The chip of claim 1, wherein the corrodible insulating layer covers the corresponding status bit pad.
3. The chip of claim 2, wherein the material of the corrodible insulating layer is photoresist or epoxy.
4. The chip of claim 1, wherein the conductive structure is opaque.
5. The chip of claim 1,
the plurality of status bit pads are arranged in an array.
6. The chip of claim 5,
the plurality of status bit pads are identical in shape and size.
7. An electronic tag, comprising the chip and the antenna according to any one of claims 1 to 6;
the antenna is electrically connected with the chip.
8. The electronic tag according to claim 7,
the chip further comprises a plurality of functional bonding pads, the antenna further comprises a plurality of connecting bonding pads, and the functional bonding pads are welded with the connecting bonding pads;
the connection pads are multiplexed into the conductive structure.
9. An electronic label system, characterized in that it comprises an electronic label according to any of claims 7-8 and a reading device;
the reading device can read the state information of the electronic tag.
10. A method for identifying a chip of an electronic tag, wherein the chip comprises the chip of any one of claims 1 to 6;
the method comprises the following steps:
acquiring the state information of the chip;
comparing the state information with reserved state information, and identifying a chip of the electronic tag if the state information is consistent with the reserved state information; and if the state information is inconsistent with the reserved state information, not identifying the chip of the electronic tag.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010966945.4A CN112149780A (en) | 2020-09-15 | 2020-09-15 | Chip of electronic tag, electronic tag system and chip identification method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010966945.4A CN112149780A (en) | 2020-09-15 | 2020-09-15 | Chip of electronic tag, electronic tag system and chip identification method |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108830368A (en) * | 2017-04-24 | 2018-11-16 | 四川谦泰仁投资管理有限公司 | A kind of electronic tag with random variable topology state |
| CN109766983A (en) * | 2019-01-02 | 2019-05-17 | 上海坤锐电子科技有限公司 | The anti-transfer method of radio frequency chip, electronic tag, detection module, chip, article shape and displacement detecting method |
| CN110533144A (en) * | 2019-09-05 | 2019-12-03 | 苏州晟达力芯电子科技有限公司 | Method for the transfer of the chip of RFID electronic label, RFID electronic label and anti-chip |
-
2020
- 2020-09-15 CN CN202010966945.4A patent/CN112149780A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108830368A (en) * | 2017-04-24 | 2018-11-16 | 四川谦泰仁投资管理有限公司 | A kind of electronic tag with random variable topology state |
| CN109766983A (en) * | 2019-01-02 | 2019-05-17 | 上海坤锐电子科技有限公司 | The anti-transfer method of radio frequency chip, electronic tag, detection module, chip, article shape and displacement detecting method |
| CN110533144A (en) * | 2019-09-05 | 2019-12-03 | 苏州晟达力芯电子科技有限公司 | Method for the transfer of the chip of RFID electronic label, RFID electronic label and anti-chip |
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