CN112135427B - Circuit board for power battery - Google Patents
Circuit board for power battery Download PDFInfo
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- CN112135427B CN112135427B CN202011076084.9A CN202011076084A CN112135427B CN 112135427 B CN112135427 B CN 112135427B CN 202011076084 A CN202011076084 A CN 202011076084A CN 112135427 B CN112135427 B CN 112135427B
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- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/02—Polyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2465/00—Characterised by the use of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2471/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
- C08J2471/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08J2471/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08J2471/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The invention discloses a circuit board for a power battery, which comprises a copper substrate, a first prepreg, a first copper foil layer and a first solder mask which are sequentially covered above the copper substrate from bottom to top, and a second prepreg, a second copper foil layer and a second solder mask which are sequentially arranged below the copper substrate from top to bottom; the first prepreg and the second prepreg are prepared by the following method, and the method comprises the following steps: (1) sequentially adding the component A, the component B, the component C, the component D, the component E, the component F, the component G, the component H, the component I, the component J and the component K into a container filled with an organic solvent, stirring for dissolving and dispersing to prepare resin composition glue; the prepreg is prepared by applying the formula and the method, and the circuit board prepared by using the prepreg has excellent heat resistance, lower dielectric constant and dielectric loss factor, better flame retardance and bending strength, lower water absorption and no poor glue shortage.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a circuit board for a power battery.
Background
Along with the continuous development of the circuit board industry, circuit boards with various purposes appear, in addition to the traditional pursuit of precision and fineness, in recent years, due to the concern of international and domestic environmental protection problems, the rapid development of the new energy electric automobile and motor car industry is pulled, and correspondingly, the demand for the circuit board protected by a large-current high-voltage battery is rapidly increased.
Because the power battery circuit board needs to bear heavy current and high voltage, the common circuit board can not meet the requirement, a red copper plate with the thickness of 1.0-1.2mm needs to be embedded in the circuit board, and the inner copper plate needs to be provided with holes or grooves to achieve the purpose of isolation.
Disclosure of Invention
In view of the above, the present invention is directed to the defects in the prior art, and a main object of the present invention is to provide a circuit board for a power battery, which can effectively solve the problems that the existing circuit board has low performance and cannot meet the requirements of the power battery.
In order to achieve the purpose, the invention adopts the following technical scheme:
a circuit board for a power battery comprises a copper substrate, a first prepreg, a first copper foil layer and a first solder mask which are sequentially covered above the copper substrate from bottom to top, and a second prepreg, a second copper foil layer and a second solder mask which are sequentially arranged below the copper substrate from top to bottom; the first prepreg and the second prepreg are prepared by the following method, and the method comprises the following steps:
(1) sequentially adding the component A, the component B, the component C, the component D, the component E, the component F, the component G, the component H, the component I, the component J and the component K into a container filled with an organic solvent, stirring, dissolving and dispersing to prepare resin composition glue; the weight portions of the components are as follows: and (2) component A: 55-60 parts, component B: 32-40 parts of component C: 35-45 parts of component D: 15-18 parts, component E: 35-40 parts, component F: 20-35 parts, component G: 80-100 parts of a component H: 3-5 parts; a component I: 20-30 parts of component J: 20-15 parts of a component K: 150-200 parts of (A) a solvent, wherein,
the structural formula of the component A is as follows:
wherein R is an alkyl structure containing 2 carbon atoms, R1 is a phenyl mechanism containing 6-8 carbon atoms, and n is 2 or 3;
the structural formula of the component B is as follows:
the structural formula of the component C is as follows:
in the formula II, n is an integer of 5-8;
the structural formula of the component D is as follows:
in the formula III, m is an integer of 2-3;
the structural formula of the component E is as follows:
in the formula II, n is an integer of 2-5;
the component F is modified polyphenyl ether resin, the terminal active group of the modified polyphenyl ether resin is allyl, vinyl or styryl, and the weight-average molecular weight is 2000-4000; the component G is a curing agent; the component H is an accelerator; the component I is an organic flame retardant; the component J is a cross-linking agent; the component K is a filler;
(2) soaking glass fiber cloth in the resin composition glue, and then drying in an oven to prepare a semi-cured bonding sheet;
(3) the adhesive sheet was stacked in a predetermined number to form a prepreg.
Preferably, the organic solvent is one or a mixture of acetone, butanone, cyclohexanone, dimethylformamide, propylene glycol methyl ether and propylene glycol methyl ether acetate.
Preferably, the component G is one or more of phenolic curing agent, amine curing agent, acid or anhydride curing agent and cyanate.
Preferably, the component H is one or a mixture of more than two of 2-methylimidazole, 2-ethyl-4-methylimidazole and 2-methyl-4-phenylimidazole.
Preferably, the component I is at least one of decabromodiphenylethane, decabromodiphenyl ether, brominated polystyrene, ethylenebistetrabromophthalimide and melamine cyanurate.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and specifically, the technical scheme shows that:
the prepreg is prepared by applying the formula and the method, and the circuit board prepared by using the prepreg has excellent heat resistance, lower dielectric constant and dielectric loss factor, better flame retardance and bending strength, lower water absorption rate, no poor glue shortage, no copper sheet wrinkle or layering, effectively improved product service performance and capability of meeting the requirements of power batteries.
To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments:
drawings
FIG. 1 is a cross-sectional view of a preferred embodiment of the present invention.
The attached drawings indicate the following:
11. copper substrate 12, first prepreg
13. First copper foil layer 14, first solder resist layer
15. Second prepreg 16, second copper foil layer
17. Second solder resist layer
Detailed Description
Referring to fig. 1, a specific structure of a preferred embodiment of the invention is shown, which includes a copper substrate 11, a first prepreg 12, a first copper foil layer 13 and a first solder resist layer 14 sequentially covering the copper substrate 11 from bottom to top, and a second prepreg 15, a second copper foil layer 16 and a second solder resist layer 17 sequentially covering the copper substrate 11 from top to bottom.
The copper substrate 11 is made of brass and has a thickness of 2-3 mm.
The first prepreg 12 and the second prepreg 15 are prepared by the following method, which comprises the following steps:
(1) sequentially adding the component A, the component B, the component C, the component D, the component E, the component F, the component G, the component H, the component I, the component J and the component K into a container filled with an organic solvent, stirring, dissolving and dispersing to prepare resin composition glue; the weight portions of the components are as follows: and (2) component A: 55-60 parts, component B: 32-40 parts of component C: 35-45 parts of component D: 15-18 parts, component E: 35-40 parts, component F: 20-35 parts, component G: 80-100 parts of a component H: 3-5 parts; a component I: 20-30 parts of component J: 20-15 parts of a component K: 150-200 parts of (A) a solvent, wherein,
the structural formula of the component A is as follows:
wherein R is an alkyl structure containing 2 carbon atoms, R1 is a phenyl mechanism containing 6-8 carbon atoms, and n is 2 or 3;
the structural formula of the component B is as follows:
the structural formula of the component C is as follows:
in the formula II, n is an integer of 5-8;
the structural formula of the component D is as follows:
in the formula III, m is an integer of 2-3;
the structural formula of the component E is as follows:
in the formula II, n is an integer of 2-5;
the component F is modified polyphenyl ether resin, the terminal active group of the modified polyphenyl ether resin is allyl, vinyl or styryl, and the weight-average molecular weight is 2000-4000; the component G is a curing agent; the component H is an accelerator; the component I is an organic flame retardant; the component J is a cross-linking agent; the component K is a filler. The organic solvent is one or a mixture of acetone, butanone, cyclohexanone, dimethylformamide, propylene glycol methyl ether and propylene glycol methyl ether acetate. The component G is one or more of a phenol curing agent, an amine curing agent, an acid or anhydride curing agent and cyanate ester, the component H is one or a mixture of more than two of 2-methylimidazole, 2-ethyl-4-methylimidazole and 2-methyl-4-phenylimidazole, the component I is at least one of decabromodiphenylethane, decabromodiphenyl ether, brominated polystyrene, ethylenebistetrabromophthalimide and melamine cyanurate, the component J is at least one of styrene, divinylbenzene, methyl methacrylate and butadiene, and the component K is formed by mixing barium sulfate, magnesium hydroxide, boron nitride, silicon micro powder and montmorillonite according to the mass ratio of 1:2:1:3: 2. The organic solvent is one or a mixture of acetone, butanone, cyclohexanone, dimethylformamide, propylene glycol monomethyl ether and propylene glycol monomethyl ether acetate.
(2) And (3) soaking the glass fiber cloth in the resin composition glue, and then drying in an oven to prepare the semi-cured bonding sheet.
(3) The adhesive sheets are stacked in a predetermined number to form a prepreg.
The invention is described in further detail below in several examples, as shown in table 1 below:
table 1: formulation of each example
Circuit boards were made using the resin compositions prepared according to the formulations of examples 1-6, and the performance test data for the circuit boards are shown in table 2 below:
table 2: each example tests Performance
The test method comprises the following steps:
1. glass transition temperature, Tg, using Dynamic Mechanical Analysis (DMA).
2. The thermal decomposition temperature (Td) was measured by the method defined in IPC-TM-650, 2.4.26.
3. The dielectric constant was measured at 1GHz according to IPC-TM-650 using the plate method 2.5.5.9.
4. Dielectric loss tangent the dielectric loss tangent at 1GHz was measured by the plate method according to 2.5.5.9 in IPC-TM-650.
5. The flame retardancy was measured according to UL 94.
6. Peel Strength the peel strength of the metal cap was tested according to the experimental conditions of "thermal stress" in the method specified by IPC-TM-650, 2.4.8.
7. The thermal stratification time T-288 was measured according to the method defined in IPC-TM-650, 2.4.24.1.
8. Water absorption was measured by the method defined in IPC-TM-650, 2.6.2.1.
As can be seen from Table 2 above, the circuit board prepared by using the resin composition obtained in the example of the present invention has excellent heat resistance, lower dielectric constant and dielectric loss tangent, better flame retardancy and bending strength, and lower water absorption.
The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be taken in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.
Claims (5)
1. A circuit board for a power battery comprises a copper substrate, a first prepreg, a first copper foil layer and a first solder mask which are sequentially covered above the copper substrate from bottom to top, and a second prepreg, a second copper foil layer and a second solder mask which are sequentially arranged below the copper substrate from top to bottom; the method is characterized in that: the first prepreg and the second prepreg are prepared by the following method, and the method comprises the following steps:
(1) sequentially adding the component A, the component B, the component C, the component D, the component E, the component F, the component G, the component H, the component I, the component J and the component K into a container filled with an organic solvent, stirring, dissolving and dispersing to prepare resin composition glue; the weight portions of the components are as follows: and (2) component A: 55-60 parts, component B: 32-40 parts, component C: 35-45 parts of component D: 15-18 parts, component E: 35-40 parts, component F: 20-35 parts, component G: 80-100 parts of a component H: 3-5 parts; a component I: 20-30 parts of component J: 20-15 parts of a component K: 150-200 parts of (A) a solvent, wherein,
the structural formula of the component A is as follows:
wherein R is an alkyl structure containing 2 carbon atoms, R1 is a phenyl mechanism containing 6-8 carbon atoms, and n is 2 or 3;
the structural formula of the component B is as follows:
the structural formula of the component C is as follows:
in the formula II, n is an integer of 5-8;
the structural formula of the component D is as follows:
in the formula III, m is an integer of 2-3;
the structural formula of the component E is as follows:
in the formula II, n is an integer of 2-5;
the component F is modified polyphenyl ether resin, the terminal active group of the modified polyphenyl ether resin is allyl, vinyl or styryl, and the weight-average molecular weight is 2000-4000; the component G is a curing agent; the component H is an accelerator; the component I is an organic flame retardant; the component J is a cross-linking agent; the component K is a filler;
(2) soaking glass fiber cloth in the resin composition glue, and then drying in an oven to prepare a semi-cured bonding sheet;
(3) the adhesive sheets are stacked in a predetermined number to form a prepreg.
2. A circuit board for a power cell according to claim 1, wherein: the organic solvent is one or a mixture of acetone, butanone, cyclohexanone, dimethylformamide, propylene glycol methyl ether and propylene glycol methyl ether acetate.
3. A circuit board for a power cell according to claim 1, wherein: the component G is one or more of phenolic curing agent, amine curing agent, acid or anhydride curing agent and cyanate.
4. A circuit board for a power cell according to claim 1, wherein: the component H is one or a mixture of more than two of 2-methylimidazole, 2-ethyl-4-methylimidazole and 2-methyl-4-phenylimidazole.
5. A circuit board for a power cell according to claim 1, wherein: the component I is at least one of decabromodiphenylethane, decabromodiphenyl ether, brominated polystyrene, ethylene bistetrabromophthalimide and melamine cyanurate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011076084.9A CN112135427B (en) | 2020-10-10 | 2020-10-10 | Circuit board for power battery |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011076084.9A CN112135427B (en) | 2020-10-10 | 2020-10-10 | Circuit board for power battery |
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| CN112135427B true CN112135427B (en) | 2022-08-12 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102093672A (en) * | 2009-12-09 | 2011-06-15 | 广州美嘉伟华电子材料有限公司 | Halogen-phosphorus-free flame retardant epoxy resin composition and application thereof in bonding sheet and copper-clad plate |
| CN102093666B (en) * | 2010-12-23 | 2012-09-26 | 广东生益科技股份有限公司 | Halogen-free resin composite and preparation method of halogen-free copper clad laminate using same |
| CN102504532B (en) * | 2011-10-18 | 2013-09-18 | 广东生益科技股份有限公司 | Halogen-free low dielectric resin composition and prepreg and copper clad laminate made of same |
| US9005761B2 (en) * | 2011-12-22 | 2015-04-14 | Elite Material Co., Ltd. | Halogen-free resin composition and its application for copper clad laminate and printed circuit board |
| CN106832764A (en) * | 2015-12-04 | 2017-06-13 | 广东生益科技股份有限公司 | A kind of halogen-free epoxy resin composition and the prepreg containing it, laminate and printed circuit board |
| CN110317445A (en) * | 2019-07-22 | 2019-10-11 | 南亚新材料科技股份有限公司 | A kind of high frequency resin composition and its application |
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