CN112133677B - Semiconductor triode with waterproof voltage stabilization seal - Google Patents
Semiconductor triode with waterproof voltage stabilization seal Download PDFInfo
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- CN112133677B CN112133677B CN202011123804.2A CN202011123804A CN112133677B CN 112133677 B CN112133677 B CN 112133677B CN 202011123804 A CN202011123804 A CN 202011123804A CN 112133677 B CN112133677 B CN 112133677B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 26
- 230000006641 stabilisation Effects 0.000 title claims description 7
- 238000011105 stabilization Methods 0.000 title claims description 7
- 230000017525 heat dissipation Effects 0.000 claims abstract description 67
- 238000007789 sealing Methods 0.000 claims abstract description 45
- 239000000919 ceramic Substances 0.000 claims abstract description 27
- 230000000694 effects Effects 0.000 claims abstract description 18
- 230000000149 penetrating effect Effects 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 41
- 229910052802 copper Inorganic materials 0.000 claims description 41
- 239000010949 copper Substances 0.000 claims description 41
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 101150006573 PAN1 gene Proteins 0.000 description 7
- 238000001816 cooling Methods 0.000 description 7
- 230000000670 limiting effect Effects 0.000 description 6
- 238000012423 maintenance Methods 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- FGRBYDKOBBBPOI-UHFFFAOYSA-N 10,10-dioxo-2-[4-(N-phenylanilino)phenyl]thioxanthen-9-one Chemical compound O=C1c2ccccc2S(=O)(=O)c2ccc(cc12)-c1ccc(cc1)N(c1ccccc1)c1ccccc1 FGRBYDKOBBBPOI-UHFFFAOYSA-N 0.000 description 1
- 206010033799 Paralysis Diseases 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to the technical field of triodes, in particular to a waterproof voltage-stabilizing sealed semiconductor triode which comprises a bottom shell and an upper cover, wherein a ceramic U-shaped plate is arranged on the upper surface of the bottom shell, a radiating fin is arranged on the lower surface of the ceramic U-shaped plate, the left end of the radiating fin penetrates through the left side of the bottom shell, a wafer is arranged on the inner side of the ceramic U-shaped plate, the right side of the wafer is connected with three pins, pin sealing devices are movably arranged on the outer sides of the three pins in a penetrating mode, first mounting grooves are formed in the upper cover and the right side of the bottom shell, a sealing sleeve locking device is arranged in each first mounting groove, clamping devices are arranged in the middle portions of the front side and the rear side of the upper cover, and a radiating device is arranged on the upper surface of the ceramic U-shaped plate. The invention can be conveniently disassembled and assembled by mutual matching of the structures, has stronger heat dissipation effect and good sealing effect, can ensure that the triode is not easily damaged in a humid working environment, and has a protection effect on a circuit.
Description
Technical Field
The invention relates to the technical field of triodes, in particular to a semiconductor triode with waterproof voltage-stabilizing seal.
Background
The triode is one of basic semiconductor components, has the current amplification function and is a core element of an electronic circuit, two PN junctions which are very close to each other are manufactured on a semiconductor substrate, the whole semiconductor is divided into three parts by the two PN junctions, the middle part is a base region, the two side parts are an emission region and a current collection region, and the arrangement mode is PNP and NPN.
The triode generally need combine the fin to install when the encapsulation, because of its inside produce more heat and be difficult to the effluvium easily carrying out the during operation, the triode leads to the inside burning out of triode easily for long-time work, when causing economic loss, the burden that the staff maintained has been increased, it is comparatively inconvenient to dismantle the installation after the encapsulation of current triode, often can not change wafer and pin, and most triode can not dampproofing and waterproofing, work leads to the triode to destroy under humid environment easily and makes whole circuit paralysed. Therefore, a semiconductor triode with waterproof voltage stabilization sealing is provided.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides a semiconductor triode with waterproof voltage-stabilizing sealing, which has reasonable design and ingenious structure, can be conveniently detached and installed through mutual matching of the structures, has better heat dissipation effect and good sealing effect, can ensure that the triode is not easily damaged in a humid working environment, has a protection effect on a circuit, has good market competitiveness, and is worthy of recommendation.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a design has waterproof steady voltage sealed semiconductor triode, includes drain pan and upper cover, surface mounting has ceramic U template on the drain pan, surface mounting has the fin under the ceramic U template, the fin left end runs through the drain pan left side, first louvre has been seted up on the fin surface, the fin is the integral type design with first louvre, the wafer is installed to ceramic U template inboard, the wafer right side is connected with three pin, and is three pin outside activity is run through and is installed pin sealing device, first mounting groove has all been seted up on upper cover and drain pan right side, the inside second mounting groove that has all been seted up of upper cover and drain pan, the third mounting groove has all been seted up to upper cover and drain pan one side, first mounting groove internally mounted has seal cover locking device, the inside seal cover that has of third mounting groove demolishs the device, chucking device is all installed at both sides middle part around the upper cover, ceramic U template upper surface mounting has heat abstractor.
Preferably, pin sealing device runs through the seal cover of installing in the three pin outside including the activity, first sealed pad is installed in the seal cover left side, first sealed pad is made for rubber, seal cover left side mid-mounting has two picture pegs, first dog is installed to picture peg one side, the picture peg is the integral type design with first dog.
Preferably, the fixed plate is installed on the left side of the bottom shell, a second sealing gasket is installed on the upper surface of the fixed plate, and the second sealing gasket is made of rubber.
Preferably, third sealing gaskets are installed on the front side and the rear side of the upper surface of the bottom shell and are made of rubber.
Preferably, seal cover locking device is including installing the dead lever in first mounting groove inside, dead lever left end movable mounting has L type rotor arm, first spring is installed to L type rotor arm one side, the one end that L type rotor arm was kept away from to first spring is installed on first mounting groove side surface, locking device is still including installing the movable rod in the inside of second mounting groove, upper portion the movable rod activity runs through inside upper cover to first mounting groove, the lower part the movable rod activity runs through inside drain pan to first mounting groove, the movable rod is located the inside one end of first mounting groove and installs the touch multitouch, the movable rod is located the inside one end of second mounting groove and installs first baffle, first baffle is the integral type design with the movable rod, first baffle is close to one side of touch multitouch and installs the second spring, the second spring is kept away from first baffle one end and is installed in the inside one side of second mounting groove.
Preferably, the cross section of the shaft of the contact block is triangular, and the contact block and the movable rod are designed in an integrated manner.
Preferably, the seal sleeve removing device comprises a second baffle movably mounted inside a third mounting groove, a moving rod is mounted on one side of the second baffle, the moving rod movably penetrates through the upper cover and the second mounting groove, the moving rod movably penetrates through the bottom shell and the moving rod, a third spring is mounted on one side of the second baffle, one end of the third spring, far away from the second baffle, is mounted inside the third mounting groove, and the seal sleeve removing device further comprises a rotating plate movably mounted inside the second mounting groove.
Preferably, the chucking device is including installing the fixed block of both sides around the upper cover, the equal movable mounting in fixed block left and right sides has the dwang, the magnet piece is installed to dwang one side, the fixture block is the integral type design with the dwang, fixture block cross-section is triangle-shaped, the chucking device is still including installing the second dog at both sides middle part around the drain pan, the second dog is made for the steel.
Preferably, the heat dissipation device comprises a plurality of heat dissipation copper columns installed on the upper surface of the ceramic U-shaped plate, the heat dissipation copper columns penetrate through the upper cover, the heat dissipation device further comprises four support columns installed on the upper surface of the upper cover, a heat dissipation copper plate is installed at the upper ends of the support columns, one ends of the heat dissipation copper columns, far away from the ceramic U-shaped plate, are connected to the lower surface of the heat dissipation copper plate, copper pipes are installed outside the heat dissipation copper columns in a penetrating mode, a plurality of heat dissipation fins are installed outside the copper pipes in a penetrating mode, first connection cooling fins are installed on the left side and the right side of each heat dissipation fin, the heat dissipation fins and the first connection cooling fins are designed in an integrated mode, a plurality of second heat dissipation holes are formed in the surface of each first connection cooling fin, the second heat dissipation holes and the first connection cooling fins are designed in an integrated mode, two second connection cooling fins are installed on the left side and the right side of the bottom shell, a plurality of third integrated modes are formed in the surface of the second connection cooling fins, and the second connection cooling fins and the third heat dissipation holes are designed in an integrated mode.
The invention provides a semiconductor triode with waterproof voltage-stabilizing seal, which has the beneficial effects that: the ceramic U-shaped plate has an insulating effect, prevents the direct contact between the radiating copper column and the wafer to cause short circuit and other circuit problems, protects the wafer, ensures that part of heat generated during the operation of the wafer is directly led out through the radiating fin to be radiated, the other part of heat is conducted to the radiating copper plate through the radiating copper column to be radiated, and the heat conducted by the radiating copper column is conducted to the radiating fins through the copper tube, and then is radiated out from the surfaces of the radiating fins, the first connecting radiating fin and the second connecting radiating fin, further increases the radiating area by increasing the radiating area, and further increases the radiating area by arranging the second radiating hole on the surface of the first connecting radiating fin and arranging the third radiating hole on the surface of the second connecting radiating fin to radiate out the heat generated during the operation of the wafer, effectively prevents the wafer from being damaged due to overhigh internal temperature, protects the triode and prolongs the service life of the triode, when the triode needs to be disassembled, firstly, the whole sealing sleeve needs to be disassembled, a fine tool such as a needle is inserted into the third mounting groove, and the second baffle is pressed to drive the motion rod to move, so that the motion rod extrudes one side of the surface of the rotating plate to drive the rotating plate to abut against the first baffle, the first baffle is driven to move, the movable rod and the abutting block can be driven to move together with the first baffle while the second spring is stretched, and at the moment, the L-shaped rotating arm loses the limiting effect of the contact block, can be directly pull out the seal cover to the outside, loosen the second baffle afterwards, at the second spring, first spring, under the effect of third spring, the third mounting groove, the second mounting groove, first mounting groove internal arrangement resets, need inwards hold between the fingers dwang upper end afterwards, it rotates to the outside to drive the dwang lower extreme, the limiting displacement of fixture block is lost to the second baffle this moment, can upwards take out the upper cover is whole, the dismantlement work of triode has been accomplished, when needs are installed, directly press the upper cover downwards, drive the dwang through the fixed block and push down, rotate to the outside when fixture block contact second dog, the fixture block passes through behind the second dog, the second baffle attracts the magnet piece, it resets to drive the dwang, the installation work of upper cover has been accomplished, directly inside inserting the left picture peg of seal cover into first mounting groove afterwards, when first dog contact L type rotor arm, drive L type rotor arm wholly rotates, when first dog passes through L type rotor arm, first dog gets into L type rotor arm left side, L type rotor arm resets and with first spring effect this moment, the contact block L type rotor arm and the maintenance seal up the inside picture tube and has been carried out the maintenance of triode simultaneously, the maintenance baffle, the sealed simultaneously, the sealed the fixing of L type is convenient for the triode, the maintenance is convenient for the baffle.
Drawings
Fig. 1 is a schematic structural diagram of a front view of a semiconductor triode with waterproof voltage stabilization sealing according to the present invention;
fig. 2 is a schematic cross-sectional structural view of a semiconductor triode with waterproof voltage-stabilizing seal according to the present invention;
fig. 3 is a schematic top view of a semiconductor transistor with waterproof voltage stabilizing seal according to the present invention;
fig. 4 is a schematic structural diagram of a seal cartridge of a semiconductor triode with a waterproof voltage-stabilizing seal according to the present invention;
fig. 5 is a schematic structural diagram of a three-dimensional view of a semiconductor triode heat dissipation fin with waterproof voltage stabilization seal according to the present invention;
fig. 6 is a schematic structural diagram of a semiconductor transistor a with waterproof voltage-stabilizing seal according to the present invention;
fig. 7 is a schematic structural diagram of a semiconductor triode B with waterproof voltage-stabilizing seal according to the present invention;
fig. 8 is a schematic structural diagram of a semiconductor transistor C with waterproof voltage-stabilizing seal according to the present invention;
fig. 9 is a schematic structural diagram of a semiconductor transistor D with a waterproof voltage-stabilizing seal according to the present invention;
fig. 10 is a schematic structural diagram of a semiconductor transistor E with a waterproof voltage-stabilizing seal according to the present invention;
in the figure: the structure comprises a bottom shell 1, a ceramic U-shaped plate 2, a heat radiating fin 3, a first heat radiating hole 4, a wafer 5, pins 6, a seal sleeve 7, a first sealing gasket 8, an inserting plate 9, a first baffle 10, a first mounting groove 11, a second mounting groove 12, a fixed rod 13, an L-shaped rotating arm 14, a first spring 15, a movable rod 16, an abutting block 17, a first baffle 18, a second spring 19, a rotating plate 20, a moving rod 21, a second baffle 22, a third spring 23, a third mounting groove 24, an upper cover 25, a fixed block 26, a rotating rod 27, a magnet block 28, a clamping block 29, a second baffle 30, a fixed plate 31, a second sealing gasket 32, a third sealing gasket 33, a supporting column 34, a heat radiating copper plate 35, a heat radiating copper column 36, a copper pipe 37, a heat radiating fin 38, a first connecting heat radiating fin 39, a second connecting heat radiating fin 40, a second connecting heat radiating fin 41 and a third heat radiating hole 42.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-8, a semiconductor triode with waterproof steady voltage is sealed, including drain pan 1 and upper cover 25, fixed plate 31 is installed in drain pan 1 left side, surface mounting has the sealed pad 32 of second on fixed plate 31, the sealed pad 32 of second is made for rubber, the sealed pad 33 of third is all installed to the back both sides around the upper surface of drain pan 1, the sealed pad 33 of third is made for rubber, guarantee that drain pan 1 and upper cover 25 junction left side and both sides are all sealed around, guarantee the leakproofness of triode, improve the triode practicality, reach waterproof sealing's effect.
Surface mounting has ceramic U template 2 on drain pan 1, surface mounting has fin 3 under ceramic U template 2, 3 left ends of fin run through drain pan 1 left side, first louvre 4 has been seted up on the surface of fin 3, fin 3 is the integral type design with first louvre 4, 2 inboard installing wafer 5 of ceramic U template, wafer 5 right side is connected with three pin 6, the activity of 6 outside of three pin is run through and is installed pin sealing device, pin sealing device runs through the seal cover 7 of installing in the 6 outside of three pin including the activity, seal cover 7 left side is installed first sealed pad 8, first sealed pad 8 is made for rubber, seal cover 7 left side mid-mounting has two picture peg 9, picture peg 9 one side is installed first dog 10, picture peg 9 is the integral type design with first dog 10, can fix seal cover 7 in the triode left side through the seal effect of first sealed pad 8, it is whole sealed to seal whole pin 6 region, guarantee the leakproofness of triode, can make the triode work under humid environment.
The upper cover 25 and the right side of the bottom shell 1 are both provided with a first mounting groove 11, the upper cover 25 and the bottom shell 1 are both provided with a second mounting groove 12, one side of the upper cover 25 and one side of the bottom shell 1 are both provided with a third mounting groove 24, a seal sleeve locking device is arranged in the first mounting groove 11 and comprises a fixed rod 13 arranged in the first mounting groove 11, the left end of the fixed rod 13 is movably provided with an L-shaped rotating arm 14, one side of the L-shaped rotating arm 14 is provided with a first spring 15, one end of the first spring 15 far away from the L-shaped rotating arm 14 is arranged on the surface of one side of the first mounting groove 11, the locking device also comprises a movable rod 16 arranged in the second mounting groove 12, the upper movable rod 16 movably penetrates through the upper cover 25 to the inside of the first mounting groove 11, the lower movable rod 16 movably penetrates through the bottom shell 1 to the inside of the first mounting groove 11, one end of the movable rod 16 positioned in the first mounting groove 11 is provided with a touch block 17, the cross section of the shaft of the abutting block 17 is triangular, the abutting block 17 and the movable rod 16 are designed in an integrated manner, one end of the movable rod 16, which is positioned inside the second mounting groove 12, is provided with a first baffle plate 18, the first baffle plate 18 and the movable rod 16 are designed in an integrated manner, one side of the first baffle plate 18, which is close to the abutting block 17, is provided with a second spring 19, one end of the second spring 19, which is far away from the first baffle plate 18, is mounted on one side inside the second mounting groove 12, the inserting plate 9 on the left side of the sealing sleeve 7 is inserted into the first mounting groove 11, when the first baffle plate 10 contacts the L-shaped rotating arm 14, the L-shaped rotating arm 14 is driven to integrally rotate, when the first baffle plate 10 passes through the L-shaped rotating arm 14, the first baffle plate 10 enters the left side of the L-shaped rotating arm 14, at the moment, the L-shaped rotating arm 14 resets under the action of the first spring 15 and blocks the first baffle plate 10, at the moment, the abutting block 17 blocks the L-shaped rotating arm 14, the fixing of the first stop block 10 by the L-shaped rotating arm 14 is completed, the inserting plate 9 and the sealing sleeve 7 are simultaneously fixed, the mounting work of the sealing sleeve 7 can be completed, the operation is convenient, and the working efficiency is high.
A seal cartridge removing device is arranged in a third mounting groove 24, the seal cartridge removing device comprises a second baffle 22 movably mounted in the third mounting groove 24, a moving rod 21 is mounted on one side of the second baffle 22, the upper moving rod 21 movably penetrates through the upper cover 25 to the interior of the second mounting groove 12, the lower moving rod 21 movably penetrates through the bottom shell 1 to the interior of the moving rod 21, a third spring 23 is mounted on one side of the second baffle 22, one end of the third spring 23, which is far away from the second baffle 22, is mounted in the third mounting groove 24, the seal cartridge removing device further comprises a rotating plate 20 movably mounted in the second mounting groove 12, a small tool such as a needle is inserted into the third mounting groove 24, the second baffle 22 is pressed to drive the moving rod 21 to move, the moving rod 21 presses one side of the surface of the rotating plate 20 to drive the rotating plate 20 to abut against the first baffle 18, the first baffle 18 moves while the second spring 19 is stretched, the moving rod 16 and the abutting block 17 can be driven to move together with the first baffle 18, at this time, the L-type rotating arm 14 loses the limiting effect of abutting against the abutting block 17, the seal cartridge 7 can be directly pulled out outwards, the seal cartridge can be provided with the third mounting groove 24, and the sealing operation of the seal cartridge can be prevented from being convenient for preventing the triode from being loosened by touching, and preventing the sealing operation, and the triode from being loosened by mistake.
Clamping device is all installed at both sides middle part around upper cover 25, clamping device is including installing the fixed block 26 in both sides around upper cover 25, the equal movable mounting in the fixed block 26 left and right sides has dwang 27, dwang 27 one side is installed magnet piece 28, dwang 27 one side is installed fixture block 29, fixture block 29 is the integral type design with dwang 27, fixture block 29 cross-section is triangle-shaped, clamping device is still including installing the second dog 30 at both sides middle part around drain pan 1, second dog 30 is made for the steel, press upper cover 25 down, drive dwang 27 through fixed block 26 and push down, fixture block 29 outside when contacting second dog 30, fixture block 29 passes through behind second dog 30, second dog 30 attracts magnet piece 28, it resets to drive dwang 27, the installation of upper cover 25 has been accomplished, direct pressing can be in order to accomplish the installation, during the dismantlement, inwards hold between fingers the upper end of dwang 27, it rotates to drive the lower extreme to the outside to drive dwang 27, second dog 30 loses the limiting displacement of fixture block 29 this moment, can upwards take off upper cover 25 wholly, the practicality is higher, convenient operation.
The upper surface of the ceramic U-shaped plate 2 is provided with a heat dissipation device, the heat dissipation device comprises a plurality of heat dissipation copper columns 36 arranged on the upper surface of the ceramic U-shaped plate 2, the heat dissipation copper columns 36 penetrate through the upper cover 25, the heat dissipation device also comprises four support columns 34 arranged on the upper surface of the upper cover 25, heat dissipation copper plates 35 are arranged at the upper ends of the four support columns 34, one ends of the heat dissipation copper columns 36 far away from the ceramic U-shaped plate 2 are connected to the lower surface of the heat dissipation copper plates 35, copper pipes 37 are arranged on the outer sides of the heat dissipation copper columns 36 in a penetrating manner, a plurality of heat dissipation fins 38 are arranged on the outer sides of the copper pipes 37 in a penetrating manner, first connecting heat dissipation fins 39 are arranged on the left sides and the right sides of the heat dissipation fins 38, the heat dissipation fins 38 and the first connecting heat dissipation fins 39 are designed in an integrated manner, a plurality of second heat dissipation holes 40 are formed in the surface of the first connecting heat dissipation fins 39, two second connecting heat dissipation fins 41 are arranged on the left side and the right side of the bottom shell 1, the second connecting radiating fin 41 and the bottom shell 1 are designed in an integrated manner, the surface of the second connecting radiating fin 41 is provided with a plurality of third radiating holes 42, the second connecting radiating fin 41 and the third radiating holes 42 are designed in an integrated manner, the heat is conducted to the radiating copper plate 35 through the radiating copper pillar 36 and is radiated, the heat conducted by the radiating copper pillar 36 is conducted to the radiating fins 38 through the copper pipe 37, and then is radiated from the radiating fins 38, the first connecting radiating fin 39 and the surface of the second connecting radiating fin 41, the radiating area is increased, the second radiating holes 40 are arranged on the surface of the first connecting radiating fin 39, the third radiating holes 42 are arranged on the surface of the second connecting radiating fin 41, the radiating area is further increased, the heat generated during the work of the wafer 5 is radiated, the radiating efficiency of the triode is improved, the damage of the triode due to overhigh temperature is prevented, and the triode is protected, the service life of the triode is prolonged.
The working principle is as follows: when the invention works, the ceramic U-shaped plate 2 plays an insulating role, prevents the circuit problems such as short circuit and the like caused by the direct contact of the heat dissipation copper column 36 and the chip 5, protects the chip 5, one part of the heat generated when the chip 5 works is directly led out through the heat dissipation sheet 3 for heat dissipation, the other part of the heat is conducted to the heat dissipation copper plate 35 through the heat dissipation copper column 36 for heat dissipation, and the heat conducted by the heat dissipation copper column 36 is conducted to the heat dissipation fins 38 through the copper pipes 37, and then is dissipated out through the surfaces of the heat dissipation fins 38, the first connection heat dissipation sheet 39 and the second connection heat dissipation sheet 41, through increasing the heat dissipation area, and through arranging the second heat dissipation holes 40 on the surface of the first connection heat dissipation sheet 39 and arranging the third heat dissipation holes 42 on the surface of the second connection heat dissipation sheet 41, the heat dissipation area is further increased, and the heat generated when the chip 5 works is dissipated, the second sealing gasket 32 arranged on the upper surface of the fixing plate 31 can seal the joint of the upper cover 25 and the left side of the bottom shell 1, the third sealing gasket 33 can seal the front side and the rear side, the first sealing gasket 8 arranged on the left side of the sealing sleeve 7 can completely seal the pin 6 of the triode, so that the triode has the waterproof and moistureproof capabilities, when the triode needs to be disassembled, firstly, the whole sealing sleeve 7 needs to be disassembled, fine tools such as a needle and the like are inserted into the third mounting groove 24, and the second baffle plate 22 is pressed to drive the moving rod 21 to move, so that the moving rod 21 presses one side of the surface of the rotating plate 20 to drive the rotating plate 20 to abut against the first baffle plate 18, so that the first baffle plate 18 moves, the moving rod 16 and the abutting block 17 can be driven to move together with the first baffle plate 18 while the second spring 19 is stretched, at the moment, the L-shaped rotating arm 14 loses the limiting effect of the abutting block 17, and the sealing sleeve 7 can be directly pulled out towards the outside, then the second baffle 22 is loosened, the devices in the third installation groove 24, the second installation groove 12 and the first installation groove 11 are reset under the action of the second spring 19, the first spring 15 and the third spring 23, then the upper end of the rotating rod 27 needs to be pinched inwards to drive the lower end of the rotating rod 27 to rotate outwards, at this time, the second baffle 30 loses the limiting function of the fixture block 29, the upper cover 25 can be integrally and upwards taken away, the dismounting work of the triode is completed, when the installation is needed, the upper cover 25 is directly pressed downwards, the rotating rod 27 is driven to press downwards through the fixing block 26, the fixture block 29 rotates outwards when contacting the second baffle 30, after the fixture block 29 passes through the second baffle 30, the second baffle 30 attracts the magnet block 28 to drive the rotating rod 27 to reset, after the installation work of the upper cover 25 is completed, the inserting plate 9 on the left side of the sealing sleeve 7 is directly inserted into the first installation groove 11, when the first stop block 10 contacts the L-shaped rotating arm 14, the L-shaped rotating arm 14 is driven to integrally rotate, when the first stop block 10 passes through the L-shaped rotating arm 14, the first stop block 10 enters the left side of the L-shaped rotating arm 14, the L-shaped rotating arm 14 resets under the action of the first spring 15 and blocks the first stop block 10, and at the moment, the contact block 17 clamps the L-shaped rotating arm 14, so that the L-shaped rotating arm 14 completes the fixation of the first stop block 10, and simultaneously fixes the inserting plate 9 and the sealing sleeve 7 to complete the sealing work.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered as the technical solutions and the inventive concepts of the present invention within the technical scope of the present invention.
Claims (9)
1. The utility model provides a semiconductor triode with waterproof steady voltage is sealed, includes drain pan (1) and upper cover (25), its characterized in that, surface mounting has ceramic U template (2) on drain pan (1), surface mounting has fin (3) under ceramic U template (2), fin (3) left end runs through drain pan (1) left side, first louvre (4) have been seted up on fin (3) surface, fin (3) are the integral type design with first louvre (4), wafer (5) are installed to ceramic U template (2) inboard, wafer (5) right side is connected with three pin (6), and is three pin (6) outside activity runs through installs pin sealing device, first mounting groove (11) have all been seted up on upper cover (25) and drain pan (1) right side, second mounting groove (12) have all been seted up to upper cover (25) and drain pan (1) inside, third mounting groove (24) have all been seted up on upper cover (25) and drain pan (1) one side, ceramic seal cover (25) surface mounting device (25) both sides are all installed to last ceramic seal cover surface mounting device (25), last ceramic seal cover surface mounting device (2) middle part is installed.
2. The semiconductor triode with waterproof voltage stabilization sealing according to claim 1, characterized in that the pin sealing device comprises a sealing sleeve (7) movably installed outside three pins (6) in a penetrating manner, a first sealing gasket (8) is installed on the left side of the sealing sleeve (7), the first sealing gasket (8) is made of rubber, two inserting plates (9) are installed in the middle of the left side of the sealing sleeve (7), a first stop block (10) is installed on one side of each inserting plate (9), and the inserting plates (9) and the first stop blocks (10) are designed in an integrated manner.
3. The triode according to claim 1, wherein a fixing plate (31) is installed at the left side of the bottom shell (1), a second sealing gasket (32) is installed on the upper surface of the fixing plate (31), and the second sealing gasket (32) is made of rubber.
4. The triode according to claim 1, wherein the third gaskets (33) are mounted on the front and rear sides of the upper surface of the bottom shell (1), and the third gaskets (33) are made of rubber.
5. The semiconductor triode with waterproof voltage stabilization seal according to claim 1, the sealing sleeve locking device comprises a fixed rod (13) arranged in a first mounting groove (11), the left end of the fixed rod (13) is movably provided with an L-shaped rotating arm (14), a first spring (15) is arranged on one side of the L-shaped rotating arm (14), one end of the first spring (15) far away from the L-shaped rotating arm (14) is arranged on one side surface of the first mounting groove (11), the locking device also comprises a movable rod (16) arranged in the second mounting groove (12), the upper part of the movable rod (16) movably penetrates through the upper cover (25) to the inside of the first mounting groove (11), the lower part of the movable rod (16) movably penetrates through the bottom shell (1) to the inside of the first mounting groove (11), one end of the movable rod (16) positioned in the first mounting groove (11) is provided with a contact block (17), a first baffle (18) is arranged at one end of the movable rod (16) positioned in the second mounting groove (12), the first baffle (18) and the movable rod (16) are designed into a whole, a second spring (19) is arranged on one side of the first baffle (18) close to the contact block (17), one end of the second spring (19) far away from the first baffle (18) is arranged on one side of the inner part of the second mounting groove (12).
6. The triode according to claim 5, wherein the contact block (17) has a triangular axial cross section, and the contact block (17) is integrally formed with the movable rod (16).
7. The triode with waterproof voltage-stabilizing sealing function according to claim 1, wherein the seal sleeve removing device comprises a second baffle plate (22) movably mounted inside a third mounting groove (24), a moving rod (21) is mounted on one side of the second baffle plate (22), the moving rod (21) at the upper part movably penetrates through an upper cover (25) to the inside of the second mounting groove (12), the moving rod (21) at the lower part movably penetrates through a bottom shell (1) to the inside of the moving rod (21), a third spring (23) is mounted on one side of the second baffle plate (22), one end, far away from the second baffle plate (22), of the third spring (23) is mounted inside the third mounting groove (24), and the seal sleeve removing device further comprises a rotating plate (20) movably mounted inside the second mounting groove (12).
8. The semiconductor triode with waterproof voltage-stabilizing seal according to claim 1, wherein the clamping device comprises fixing blocks (26) mounted on the front and rear sides of the upper cover (25), rotating rods (27) are movably mounted on the left and right sides of the fixing blocks (26), a magnet block (28) is mounted on one side of each rotating rod (27), a clamping block (29) is mounted on one side of each rotating rod (27), the clamping block (29) and the rotating rods (27) are designed in an integrated manner, the axial section of each clamping block (29) is triangular, the clamping device further comprises second stopping blocks (30) mounted in the middle of the front and rear sides of the bottom shell (1), and the second stopping blocks (30) are made of steel.
9. The triode according to claim 1, wherein the heat dissipation device comprises a plurality of copper pillars (36) mounted on the upper surface of the U-shaped ceramic plate (2), the copper pillars (36) penetrate through the upper cover (25), the heat dissipation device further comprises four supporting pillars (34) mounted on the upper surface of the upper cover (25), a copper heat dissipation plate (35) is mounted at the upper ends of the four supporting pillars (34), one end of the copper pillars (36) far away from the U-shaped ceramic plate (2) is connected to the lower surface of the copper heat dissipation plate (35), a copper pipe (37) is mounted outside the copper pillars (36), a plurality of heat dissipation fins (38) are mounted outside the copper pipe (37) in a penetrating manner, a first connection heat dissipation hole (39) is mounted on the left side and the right side of each heat dissipation fin (38), the heat dissipation fins (38) are designed to be integrated with the first connection heat dissipation hole (39), a plurality of second heat dissipation holes (40) are formed on the surface of the first connection heat dissipation fin (39), a plurality of second connection heat dissipation holes (40) are designed to be integrated with the first connection heat dissipation fin (39), a second connection heat dissipation hole (41) is formed on the left side and the bottom shell (1), a second connection heat dissipation hole (41) is designed to be connected with a plurality of each second connection heat dissipation fin (41), the second connecting radiating fins (41) and the third radiating holes (42) are designed in an integrated mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011123804.2A CN112133677B (en) | 2020-10-20 | 2020-10-20 | Semiconductor triode with waterproof voltage stabilization seal |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011123804.2A CN112133677B (en) | 2020-10-20 | 2020-10-20 | Semiconductor triode with waterproof voltage stabilization seal |
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| CN112133677B true CN112133677B (en) | 2023-01-17 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06268122A (en) * | 1993-03-12 | 1994-09-22 | Hitachi Ltd | Semiconductor device |
| US5703397A (en) * | 1991-11-28 | 1997-12-30 | Tokyo Shibaura Electric Co | Semiconductor package having an aluminum nitride substrate |
| CN204792799U (en) * | 2015-07-16 | 2015-11-18 | 四川蓝彩电子科技有限公司 | Triode with heat dissipation function |
| CN210443548U (en) * | 2019-11-18 | 2020-05-01 | 桐庐瑶琳电子科技有限公司 | Triode convenient to equipment |
| CN211295077U (en) * | 2020-03-26 | 2020-08-18 | 深圳市长泰峰元器件有限公司 | Waterproof voltage-stabilizing triode |
-
2020
- 2020-10-20 CN CN202011123804.2A patent/CN112133677B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5703397A (en) * | 1991-11-28 | 1997-12-30 | Tokyo Shibaura Electric Co | Semiconductor package having an aluminum nitride substrate |
| JPH06268122A (en) * | 1993-03-12 | 1994-09-22 | Hitachi Ltd | Semiconductor device |
| CN204792799U (en) * | 2015-07-16 | 2015-11-18 | 四川蓝彩电子科技有限公司 | Triode with heat dissipation function |
| CN210443548U (en) * | 2019-11-18 | 2020-05-01 | 桐庐瑶琳电子科技有限公司 | Triode convenient to equipment |
| CN211295077U (en) * | 2020-03-26 | 2020-08-18 | 深圳市长泰峰元器件有限公司 | Waterproof voltage-stabilizing triode |
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| CN112133677A (en) | 2020-12-25 |
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Effective date of registration: 20221229 Address after: 518000 floors 1-5, building A2, new era Gongrong Industrial Park, No. 2, Shilong community, Shiyan street, Bao'an District, Shenzhen, Guangdong Province Applicant after: SHENZHEN CHANGHAO MICROELECTRONICS Co.,Ltd. Address before: No.9, Xiaoliu group, Qianwu village, sanheji Town, Dingyuan County, Chuzhou City, Anhui Province Applicant before: Wang Encai |
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