CN1121305A - 用作联接器的印刷电路板 - Google Patents

用作联接器的印刷电路板 Download PDF

Info

Publication number
CN1121305A
CN1121305A CN95109864A CN95109864A CN1121305A CN 1121305 A CN1121305 A CN 1121305A CN 95109864 A CN95109864 A CN 95109864A CN 95109864 A CN95109864 A CN 95109864A CN 1121305 A CN1121305 A CN 1121305A
Authority
CN
China
Prior art keywords
circuit board
track
pcb
printed circuit
contact surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN95109864A
Other languages
English (en)
Other versions
CN1060308C (zh
Inventor
W·克恩德尔梅尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adc Co ltd
ADC GmbH
Original Assignee
Krone GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Krone GmbH filed Critical Krone GmbH
Publication of CN1121305A publication Critical patent/CN1121305A/zh
Application granted granted Critical
Publication of CN1060308C publication Critical patent/CN1060308C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461Means for preventing cross-talk
    • H01R13/6467Means for preventing cross-talk by cross-over of signal conductors
    • H01R13/6469Means for preventing cross-talk by cross-over of signal conductors on substrates
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04QSELECTING
    • H04Q1/00Details of selecting apparatus or arrangements
    • H04Q1/02Constructional details
    • H04Q1/14Distribution frames
    • H04Q1/142Terminal blocks for distribution frames
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/72Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461Means for preventing cross-talk
    • H01R13/6464Means for preventing cross-talk by adding capacitive elements
    • H01R13/6466Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00Connectors or connections adapted for particular applications
    • H01R2201/16Connectors or connections adapted for particular applications for telephony
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/24Connections using contact members penetrating or cutting insulation or cable strands
    • H01R4/2416Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type
    • H01R4/242Connections using contact members penetrating or cutting insulation or cable strands the contact members having insulation-cutting edges, e.g. of tuning fork type the contact members being plates having a single slot
    • H01R4/2425Flat plates, e.g. multi-layered flat plates
    • H01R4/2429Flat plates, e.g. multi-layered flat plates mounted in an insulating base
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/117Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09145Edge details
    • H05K2201/09172Notches between edge pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09245Crossing layout
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672Superposed layout, i.e. in different planes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10189Non-printed connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Stabilization Of Oscillater, Synchronisation, Frequency Synthesizers (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Exchange Systems With Centralized Control (AREA)
  • Paper (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

一种在对称通信和数据系统工程配电系统中用作联接器的印刷电路板,该电路板的正面有一对基本上平行的电路板印刷线基本上与印刷电路板背面一对基本上平行的电路板印刷线一致,其中背面上所述一对印刷线的其中之一借助于两个金属化通孔跨越该对印刷线的另一印刷线,该金属化通孔在正面上通过一互连电路板印刷线在电气上互连。

Description

用作联接器的印刷电路板
本发明涉及在通信和数据系统工程的配电系统中用作联接器的印刷电路板。
配电系统中工作频率高达100兆赫时,系统所有元器件的配置就要特别小心,尤其是接插部位联接器的配置,更是如此。对元器件的传输性能主要有三个要求,即插入损失、端接头回路损失和串扰性能三方面的要求。除电缆引起的衰减外,其中串扰性能尤其是确定最佳传输特性的因素。因此,除原来的串扰消除设计外。通常还需要对个别元器件采取另外的补偿措施。美国标准ANSI/EIA/TLA-568(商用建筑电信配线标准)和有关的配件技术公报T.IA/EIATSB40规定了商用配电系统元器件应满足的一些要求。该标准特别重要的部分是第五部分,该部分要求在100兆赫工作频率下各成对电路板之间的接插件串扰衰减(NEXT)至少为-40分贝。接触间隙均匀的一般接插件几乎再也不能满足这个要求,并且需要有复杂的电路板几何形状或平衡电路。
美国专利5,295,869的说明书公开了一种将各金属化通孔紧挨毗连配置从而在附加的一个板上产生对串扰起容性平衡作用的联接器。该专利文件还详细列举了其它周知的消除串扰的可行措施,即,采用多个分立平衡电容器,将有关的印刷电路板表面设计成容性表面,借助于有关印刷电路板上的并行导电作用进行感应耦合,以及增加平衡导体部分。
联接器上述周知的平衡处理方法有这样的缺点:各分立平衡电容之间的协调作用差,或缺乏额外的平衡导体部分,再加上要求增设额外的工序,而提高了生产成本。
德国专利4325952.9的说明书公开了配电系统构成电路板或端子板形式的一种接触板,这种接触板能使串扰衰减到-60分贝以上,采取的具体措施是,缩小绞线对各导线之间的接触间隙,并保持不同双股线之间的接触间隙不变。这里存在这样的缺点:这种特殊结构的接触板作为断路板时,若采用一般的联接器,对置着的双线之间的串扰衰减上升到-40分贝,从而需要在联接器上进一步采取补偿措施。
按照本发明,本发明提供的在对称通信和数据系统工程配电系统中用作联接器的印刷电路板,其正面有一对基本上平行的电路板印刷线,配置得基本上与印刷电路板背面的一对基本上平行电路板印刷线一致,且背面上所述一对印刷线的其中之一借助于两个金属化通孔在该对的另一个印刷线上方交叉而过,两个金属化通孔则在正面上通过一个互连电路板印刷线在电气上互连起来。
在本发明的一些实施例中,联接器与接触板之间的部分的磁自平衡,和联接器内的极小串扰部分的磁自平衡一样,是根据电路板印刷线的形状进行的,磁自平衡作用是通过基本上平行于且紧挨接触板的接触弹簧走线且与接触表面连接的电路板印刷线部分产生的,联接器中的串扰则主要通过印刷电路板正反面上基本上一致的电路板印刷线设计,使其衰减到最小程度。
从本说明书所附的权利要求的附属权项中可以搞清楚本发明其它有益的一些研究成果。特别是缩短平行电路板印刷线的设计,使电阻阻抗值可以调节到100欧左右,有效地防止了反射作用。电路板印刷线连接起来,改善了电阻阻抗值。此外这一切还可以抗衡印刷电路板前后之间的串扰,主要抵消了接触表面的影响。为利用磁自平衡来平衡检测不出的接触板串扰,最好将容性表面设计得比有关的接触表面大些。
下面参照附图仅以举例的方式更详细地说明本发明的内容。附图中:
图1示出了印刷电路板处于插接状态的绞线对联接器块的侧视图;
图2示出了印刷电路板处于接插状态的联接器块的剖视图;
图3是印刷电路板正面的平面图;
图4是印刷电路板背面的平面图。
通信和数据系统工程中用的配电系统,其联接器块1的外壳通常由合成材料制成,上面有端子接点3、4的接合凹口,如图1中所示。各对端子接点供连接绞线对2用。结构对称的联接器块1中的一对端子接点3、4对应于联接器块对面上相关的一对。接联器块1的一侧是接例如电话交换局来的双线2的电缆侧,另一侧的搭接处则接呼叫方。将有关接点之间的信号旁路或进行测量和测试时,可以将联接器插入中间的孔口14。这种联接器有一个印刷电路板7,电路板上焊接有互连电缆的绞线对8。从图2中可以看到,两对置着的端子接点3的接点弹簧9凸入中间孔口14中。在本实施例中,接点弹簧9形成断路接点,即接插件没有插在相对的两接点3之间,对置着的端子接点3在电气上是互连的。接插件的印刷电路板7插入断路接点中时,就使电路断开。于是焊接到印刷电路板7接线电缆的绞线对8就进入分流状态。
印刷电路板7插入中间孔中14的下部分设计成一个槽口41,如图3和图4中所示。在各分路上,接点表面21、22、23、24配置在印刷电路板7的正面20和背面40。这些接点表面上连接有有关电路板通常平行于电路板7的纵边走线的印刷线25、26、27、28。印刷电路板印刷线25、26、27、28走过印刷电路板7大约1/3的长度后偏向印刷电路板7的外缘走线,这时正面20的电路板印刷线25、26与背面的电路板印刷线27、28基本一致。在此偏离段之后,正面20的电路板印刷线25、26与背面40的电路板印刷线27、28再次彼此平行走线。但彼此间的间距较小。电路板印刷线26附近有一个容性表面32,与电路板印刷线26相连接。同样,容性表面33安置在印刷电路板7背面40上的电路板印刷线附近,基本上与容性表面32一致。
两金属化通孔29、30在正面20上通过电路板印刷线31在电气上互连,印刷电路板7背面40上的电路板印刷线28则借助于两金属化通孔29、30跨越电路板印刷线27与容性表面33连接。这之后,电路板印刷线27、28再次继续彼此平行走线,最后连接到相关的焊盘37、39上。印刷电路板7背面40上的焊盘38下方配置有另一个容性表面,与电路板印刷线27相连接。容性表面24配置在印刷电路板的正面20上,基本上与背面40上的容性表面35一致,且与电路板印刷线25相连接。
电路板印刷线25、26走过印刷电路板7约2/3的长度之后,偏向印刷电路板7的另一纵边42,再次彼此平行走线,最后与有关的焊盘36、38相连接。有关的绞线对8焊接到焊盘36、38或37、39,分接提取的信号可在绞线对8上传送。接点表面21、22、23、24与端子接点3、4在中间孔口14中的接点弹簧9电接触。
电路板印刷线在接点表面21上方平行配置,与联接器块1的接点弹簧9起部分磁自平衡的作用。电路板印刷线平行但紧靠在一起的连接方式最大限度地减小了对毗邻联接器的串扰,且使阻抗达到防止反射的程度。电路板印刷线25、26之间或27、28之间在较紧密部位的间距最好设计得使由此形成的双线,其阻抗接近100欧。由于电路板印刷线与容性表面在结构上基本上一致,因而在正面20与背面40之间在电磁方面紧密耦合。电路板印刷线28在走过大致半个印刷电路板7的长度之后,在电路板背面40电路板印刷线紧挨处的跨越,几乎完全抵消了正面20与背面40之间的串扰。各电容器32、33或34、35设计成平板式也起了抵消正面20与背面40之间串扰的作用,主要抵消了接点表面21、22或23、24的影响。容性表面32、33和34、35最好比接触表面21、22、23、24稍微大些,为的是使待抵消的磁自平衡不致检测出接触板1的串扰。
按上述比例将平衡划分成感性部分(半个板长之后紧挨和交叉的平行电路板印刷线)和容性部分(容性表面32、33和34、35),最终使阻抗匹配良好,从而减小反射,就和纯感性或纯容性平衡的情况一样。

Claims (9)

1.一种在对称通信和数据系统工程配电系统中用作联接器的印刷电路板,该电路板的正面有一对基本上平行的电路板印刷线,配置得基本上与印刷电路板背面的一对基本上平行的电路板印刷线一致,其中,背面上的所述一对印刷线的其中之一借助于两个金属化通孔跨越过另一个印刷线,所述金属化通孔通过互连电路板印刷线在正面上电互连。
2.如权利要求1所述的印刷电路板,其特征在于,在电路板的一端配备电路板印刷线的接触表面,并被一个槽所分隔,电路板印刷线即沿该槽紧密配置。
3.如权利要求1或2所述的印刷电路板,其特征在于,电路板印刷线从接触表面开始、走过大约1/3印刷电路板的长度之后改变方向,以更紧密毗连的方式继续彼此平行地走线。
4.如1至3任一权利要求所述的印刷电路板,其特征在于,相应的各容性表面与电路板印刷线相连接。
5.如权利要求4所述的印刷电路板,其特征在于,容性表面设计得略大于有关的接触表面。
6.如权利要求4或5所述的印刷电路板,其特征在于,各成对的电路板印刷线相应的第一印刷线配置在印刷电路板大致中间的位置,各成对电路板印刷线相应的第二印刷线则毗邻设在电路板接触表面另一端的焊盘配置。
7.如权利要求6所述的印刷电路板,其特征在于,各电路板印刷线,从接触表面开始,走了大约1/3印刷电路板长度之后偏向纵边,再次平行于该纵边走线,从而使正面的电路板印刷线在走了印刷电路板约2/3的长度之后,以第一偏转角偏转,然后垂直朝纵边走线,再次垂直偏向焊盘,与有关的焊盘相连接,而所述电路板印刷线,在走了印刷电路板约1/2的长度之后,以第一偏转角偏转,再借助于金属化通孔在该角度的走线行程中跨越另一电路板印刷线,以便继续与该另一电路板印刷线平行于纵边走线,最后与有关的焊盘连接。
8.一种基本上如前面参照各附图加以说明的电路板。
9.本说明书所公开或提到或说明的和/或在此专利申请中个别或共同要求予以专利保护的步骤、特点、组成、组合,以及任两个或两个以上所述步骤或特点的所有组合。
CN95109864A 1994-08-09 1995-08-09 用作联接器的印刷电路板 Expired - Fee Related CN1060308C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEG9412794.8 1994-08-09
DE9412794U DE9412794U1 (de) 1994-08-09 1994-08-09 Leiterplatte für Steckverbinder

Publications (2)

Publication Number Publication Date
CN1121305A true CN1121305A (zh) 1996-04-24
CN1060308C CN1060308C (zh) 2001-01-03

Family

ID=6912154

Family Applications (1)

Application Number Title Priority Date Filing Date
CN95109864A Expired - Fee Related CN1060308C (zh) 1994-08-09 1995-08-09 用作联接器的印刷电路板

Country Status (15)

Country Link
US (1) US5663870A (zh)
EP (1) EP0697804B1 (zh)
JP (1) JP2705917B2 (zh)
CN (1) CN1060308C (zh)
AT (1) ATE189761T1 (zh)
BR (1) BR9503581A (zh)
DE (2) DE9412794U1 (zh)
DK (1) DK0697804T3 (zh)
ES (1) ES2144542T3 (zh)
GR (1) GR3033351T3 (zh)
HK (1) HK1004742A1 (zh)
IN (1) IN183462B (zh)
PT (1) PT697804E (zh)
RU (1) RU2150799C1 (zh)
ZA (1) ZA956630B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101529670B (zh) * 2006-04-11 2011-08-10 Adc有限公司 具有串话补偿和用于减少回流损失的装置的电信插座

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3698896B2 (ja) * 1998-07-29 2005-09-21 株式会社日立製作所 給電系インピーダンス低減方法および回路基板ならびに電子機器
US6392148B1 (en) * 1999-05-10 2002-05-21 Furukawa Electric Co., Ltd. Wire harness joint
JP3456442B2 (ja) * 1999-04-21 2003-10-14 日本電気株式会社 プリント配線基板
US6089923A (en) 1999-08-20 2000-07-18 Adc Telecommunications, Inc. Jack including crosstalk compensation for printed circuit board
KR100709164B1 (ko) * 2000-08-14 2007-04-18 정보통신연구진흥원 누화 소거를 위한 프린트 기판
US6710255B2 (en) * 2001-03-30 2004-03-23 Intel Corporation Printed circuit board having buried intersignal capacitance and method of making
US6744329B2 (en) * 2001-12-14 2004-06-01 Yazaki North America, Inc. Cross talk compensation circuit
US7153168B2 (en) * 2004-04-06 2006-12-26 Panduit Corp. Electrical connector with improved crosstalk compensation
US7179115B2 (en) * 2004-04-26 2007-02-20 Commscope Solutions Properties, Llc Alien next compensation for adjacently placed connectors
EP1744404B2 (de) * 2005-07-14 2013-09-11 Reichle & De-Massari AG Anschlussvorrichtung und Anschlusssystem für isolierte elektrische Leiter
US8011972B2 (en) * 2006-02-13 2011-09-06 Panduit Corp. Connector with crosstalk compensation
US7488206B2 (en) * 2006-02-14 2009-02-10 Panduit Corp. Method and apparatus for patch panel patch cord documentation and revision
US7180011B1 (en) * 2006-03-17 2007-02-20 Lsi Logic Corporation Device for minimizing differential pair length mismatch and impedance discontinuities in an integrated circuit package design
WO2007137605A1 (en) * 2006-05-30 2007-12-06 Agilent Technologies, Inc. Fin-socket bridging electronic tapping interface
US7874878B2 (en) 2007-03-20 2011-01-25 Panduit Corp. Plug/jack system having PCB with lattice network
EP2705575B1 (en) * 2011-05-03 2017-04-12 CardioInsight Technologies, Inc. High-voltage resistance for a connector attached to a circuit board
US9130326B2 (en) * 2011-12-14 2015-09-08 Dula-Werke Dustmann & Co. Gmbh Device for supplying electrical energy to a load, and system therefor
US9590339B2 (en) * 2013-05-09 2017-03-07 Commscope, Inc. Of North Carolina High data rate connectors and cable assemblies that are suitable for harsh environments and related methods and systems
WO2020180933A1 (en) * 2019-03-05 2020-09-10 Ppc Broadband, Inc. Reversible jumper device for selecting an electrical path
US10673165B1 (en) * 2019-07-05 2020-06-02 Wbstudio Technology Media Co., Ltd. Power connector for building blocks

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1481700A (en) * 1974-06-06 1977-08-03 Quantel Ltd Interconnection of circuit boards
DE3326800A1 (de) * 1983-07-26 1985-02-14 ANT Nachrichtentechnik GmbH, 7150 Backnang Leiterplatte
DE3539040A1 (de) * 1985-11-04 1987-05-07 Telefonbau & Normalzeit Gmbh Leiterbahnanordnung und schaltungsanordnung fuer mit integrierten schaltkreisen bestueckte leiterplatten
US4831497A (en) * 1986-09-11 1989-05-16 General Electric Company Reduction of cross talk in interconnecting conductors
US5079069A (en) * 1989-08-23 1992-01-07 Zycon Corporation Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture
DE4015238A1 (de) * 1990-05-10 1991-11-14 Krone Ag Anschlussleiste fuer die fernmeldetechnik
DE9012222U1 (zh) * 1990-08-22 1992-01-02 Krone Ag, 1000 Berlin, De
CA2072380C (en) * 1992-06-25 2000-08-01 Michel Bohbot Circuit assemblies of printed circuit boards and telecommunications connectors
US5414393A (en) * 1992-08-20 1995-05-09 Hubbell Incorporated Telecommunication connector with feedback
US5432484A (en) * 1992-08-20 1995-07-11 Hubbell Incorporated Connector for communication systems with cancelled crosstalk
GB2270422B (en) * 1992-09-04 1996-04-17 Pressac Ltd Method and apparatus for cross talk cancellation
US5295869A (en) 1992-12-18 1994-03-22 The Siemon Company Electrically balanced connector assembly
US5269708A (en) * 1993-03-03 1993-12-14 Adc Telecommunications, Inc. Patch panel for high speed twisted pair
DE4325952C2 (de) * 1993-07-27 1997-02-13 Krone Ag Anschlußleiste für hohe Übertragungsraten in der Telekommunikations- und Datentechnik
US5431584A (en) * 1994-01-21 1995-07-11 The Whitaker Corporation Electrical connector with reduced crosstalk

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101529670B (zh) * 2006-04-11 2011-08-10 Adc有限公司 具有串话补偿和用于减少回流损失的装置的电信插座

Also Published As

Publication number Publication date
ES2144542T3 (es) 2000-06-16
IN183462B (zh) 2000-01-15
PT697804E (pt) 2000-06-30
EP0697804B1 (de) 2000-02-09
ATE189761T1 (de) 2000-02-15
JP2705917B2 (ja) 1998-01-28
HK1004742A1 (en) 1998-12-04
DK0697804T3 (da) 2000-06-13
GR3033351T3 (en) 2000-09-29
CN1060308C (zh) 2001-01-03
DE9412794U1 (de) 1995-09-07
BR9503581A (pt) 1996-04-09
DE59507771D1 (de) 2000-03-16
RU2150799C1 (ru) 2000-06-10
US5663870A (en) 1997-09-02
ZA956630B (en) 1997-02-10
JPH0888057A (ja) 1996-04-02
EP0697804A1 (de) 1996-02-21

Similar Documents

Publication Publication Date Title
CN1060308C (zh) 用作联接器的印刷电路板
CA2245377C (en) Electrical connector having time-delayed signal compensation
EP0649194B1 (en) Electrical connector having reduced cross-talk
TW466806B (en) Jack including crosstalk compensation for printed circuit board
US7140924B2 (en) Compensation system and method for negative capacitive coupling in IDC
US8915756B2 (en) Communication connector having a printed circuit board with thin conductive layers
US7038554B2 (en) Crosstalk compensation with balancing capacitance system and method
US5915989A (en) Connector with counter-balanced crosswalk compensation scheme
US7711093B2 (en) Telecommunications test plugs having tuned near end crosstalk
RU2322741C2 (ru) Устройство для компенсации перекрестной помехи в телекоммуникационном соединителе
US6065994A (en) Low-crosstalk electrical connector grouping like conductors together
CN101142756B (zh) 带有对差模到差模和差模到共模串扰补偿的通信插座的接线板和通信插座
WO2013122832A1 (en) Small form-factor modular plugs with low-profile surface mounted printed circuit board plug blades
EP3175515B1 (en) Communications connectors including low impedance transmission line segments that improve return loss
US20170040762A1 (en) Small form-factor modular plugs with low-profile surface mounted printed circuit board plug blades
EP0709930A2 (en) Capacitive trace coupling for reduction of crosstalk
AU676752B2 (en) Printed circuit board for connectors
JP2004146078A (ja) 高速コネクタ

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: ADC LIMITED LIABILITY COMPANY

Free format text: FORMER OWNER: ADC CO., LTD.

Effective date: 20060113

C41 Transfer of patent application or patent right or utility model
C56 Change in the name or address of the patentee

Owner name: ADC CO., LTD.

Free format text: FORMER NAME OR ADDRESS: KRONE GMBH

CP03 Change of name, title or address

Address after: Berlin

Patentee after: ADC Co.,Ltd.

Address before: Berlin, Federal Republic of Germany

Patentee before: Krone GmbH

TR01 Transfer of patent right

Effective date of registration: 20060113

Address after: Berlin

Patentee after: ADC GmbH

Address before: Berlin

Patentee before: ADC Co.,Ltd.

C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20010103

Termination date: 20100809