CN112105170A - Method for gluing small circuit hard board and small circuit hard board - Google Patents
Method for gluing small circuit hard board and small circuit hard board Download PDFInfo
- Publication number
- CN112105170A CN112105170A CN202011039565.2A CN202011039565A CN112105170A CN 112105170 A CN112105170 A CN 112105170A CN 202011039565 A CN202011039565 A CN 202011039565A CN 112105170 A CN112105170 A CN 112105170A
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- Prior art keywords
- board
- small
- circuit hard
- small circuit
- boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention discloses a method for gluing a small circuit hard board, which comprises the following steps: the method comprises the following steps: punching the adhesive film into a plurality of single adhesive films, wherein the size of each single adhesive film is the same as that of the single-board small circuit hard board, and the number of the single adhesive films is the same as that of the single-board small circuit hard boards; step two: cutting the joint of two adjacent single-board small circuit hard boards in the whole small circuit hard board by adopting a V-CUT process, wherein the single-board small circuit hard boards in the whole small circuit hard board are still connected with each other, and the third step is that: tearing the lower release paper of all the single adhesive films, and then respectively adhering the single adhesive films with the lower release paper torn to the corresponding single-board small circuit hard boards one by one; the invention has the characteristic of being convenient for efficiently gluing large-batch small-sized circuit hard boards.
Description
Technical Field
The invention relates to the technical field of circuit board rubberizing, in particular to a method for rubberizing a small circuit hard board.
Background
With the wide popularization and rapid development of electronic equipment, a circuit board is required to be adopted for mounting and fixing electronic components in the electronic equipment, an adhesive film is usually adhered to the surface of the circuit board in order to facilitate the rapid fixing of the circuit board, when the electronic equipment is required to be used, the circuit board can be fixed at a specified position by tearing off release paper on the surface of the adhesive film, and the operation is very convenient; the existing small-sized circuit hard board mainly adopts a veneer to carry out manual rubberizing, and has the defects of difficulty in rubberizing operation of large-batch small-sized circuit hard boards and low efficiency.
In view of the above, the present inventors have made extensive studies and intensive studies to solve the above problems, and as a result, the present invention has been developed and designed.
Disclosure of Invention
The invention aims to provide a method for gluing a small circuit hard board, which is convenient for efficiently gluing large-batch small circuit hard boards.
Another object of the present invention is to provide a small-sized circuit hard board.
In order to achieve the purpose, the solution of the invention is as follows:
a method for gluing a small circuit hard board comprises the following steps:
the method comprises the following steps: punching the adhesive film into a plurality of single adhesive films, wherein the size of each single adhesive film is the same as that of the single-board small circuit hard board, and the number of the single adhesive films is the same as that of the single-board small circuit hard boards;
step two: cutting the joint of two adjacent single-board small circuit hard boards in the whole small circuit hard board by adopting a V-CUT process, wherein the single-board small circuit hard boards in the whole small circuit hard board are still connected;
step three: and tearing the lower release paper of all the single adhesive films, and then respectively adhering the single adhesive films with the lower release paper torn to the corresponding single-board small-sized circuit hard boards one by one.
The method for gluing the small circuit hard board further comprises the following four steps: and adhering a carrier film on the release paper of all the single adhesive films.
And step two, cutting the upper surface and the lower surface of the joint of two adjacent single-board small circuit hard boards in the whole small circuit hard board by adopting a V-CUT process.
The notch formed on the upper surface of the joint of the two adjacent single-board small circuit hard boards by adopting the V-CUT process is opposite to the notch formed on the lower surface of the joint of the two adjacent single-board small circuit hard boards by adopting the V-CUT process.
The method for gluing the small circuit hard board further comprises the following five steps: the whole small-sized circuit hard board is inserted into the jig with the strip-shaped hole, so that the joint of two adjacent single-board small-sized circuit hard boards to be broken is opposite to the position in the strip-shaped hole, the whole small-sized circuit hard board is bent, and the joint of two adjacent single-board small-sized circuit hard boards to be broken is disconnected.
In the first step, at least three positioning holes are required to be arranged on the adhesive film; in the second step, at least three positioning holes are required to be arranged on the whole small circuit hard board; in the third step, the positioning holes of the adhesive film and the positioning holes of the whole small-sized circuit hard board are aligned one by one.
The carrier film is a PET film.
A small circuit hard board is manufactured by applying the adhesive tape pasting method of the small circuit hard board.
After the technical scheme is adopted, the adhesive film is punched into a plurality of single adhesive films, the V-CUT process is combined to CUT the joints of two adjacent single-board small circuit hard boards in the whole small circuit hard board, the single adhesive films are adhered to the corresponding single-board small circuit hard boards respectively, the integral adhesive pasting of the whole small circuit hard board with a plurality of single-board small circuit hard boards is completed, when the single-board small circuit hard board needs to be used, the joints of the single-board small circuit hard board and the adjacent single-board small circuit hard board are bent and broken, and the adhesive pasting machine is convenient to use, so that the adhesive pasting machine has the characteristics of convenience in large-batch adhesive pasting operation of the small circuit hard boards and high efficiency.
Drawings
Fig. 1 is a schematic structural diagram of a small-sized circuit hard board according to the present invention.
Fig. 2 is a schematic structural view of a jig with a strip-shaped hole according to the present invention.
[ notation ] to show
Whole small-sized circuit hard board 1
11 single-board small-sized circuit hardboard 12 of notch
Carrier film 3
Jig 4
And a strip-shaped hole 41.
Detailed Description
To achieve the above objects and advantages, the present invention provides a novel and improved technical means and structure, which will be described in detail in connection with the preferred embodiments of the present invention.
The invention discloses a method for gluing a small circuit hard board, which comprises the following steps:
the method comprises the following steps: arranging at least three positioning holes on an adhesive film, and punching the adhesive film into a plurality of single adhesive films 2, wherein the size of each single adhesive film 2 is the same as that of the single small-sized circuit hard board 12, and the number of the single adhesive films 2 is the same as that of the single small-sized circuit hard boards 12;
step two: cutting the joint of two adjacent single-board small circuit hard boards 12 in the whole small circuit hard board 1 by adopting a V-CUT process, keeping connection among the single-board small circuit hard boards 12 in the whole small circuit hard board 1, and arranging at least three positioning holes on the whole small circuit hard board 1;
step three: aligning the positioning holes of the adhesive films with the positioning holes of the whole small-sized circuit hard board 1 one by one, tearing off the lower release paper of all the single adhesive films 2, and then respectively adhering the single adhesive films 2 with the lower release paper torn off to the corresponding single-board small-sized circuit hard boards 12 one by one; namely, the lower surfaces of the glue layers 21 of the single glue films 2 are respectively adhered to the corresponding single-board small-sized circuit hard boards 12.
Further, the method for gluing the small circuit hard board further comprises the following four steps: a layer of carrier film 3 is adhered to the upper release paper 22 of all the single adhesive films 2, so that the upper release paper 22 of the single adhesive films 2 is torn together by pulling the carrier film 3, the adhesive layer 21 of the single adhesive film 2 is exposed, and the upper surface of the adhesive layer 21 is adhered and fixed at a position to be fixed, wherein the carrier film 3 may be a PET film, but not limited thereto, and films made of other materials may also be used.
The number of the positioning holes of the adhesive film and the number of the positioning holes of the whole small circuit hard board 1 can be four, the positioning holes of the adhesive film are respectively arranged at four corner positions of the adhesive film, and the positioning holes of the whole small circuit hard board 1 are respectively arranged at four corner positions of the whole small circuit hard board 1.
In addition, in the second step, the V-CUT process can be adopted to CUT the upper surface and the lower surface of the joint of the two adjacent single-board small circuit hard boards 12 in the whole small circuit hard board 1, so that when the single-board small circuit hard boards 12 need to be used, the joint of the two adjacent single-board small circuit hard boards 12 can be bent and broken regularly.
Then, the notch 11 formed on the upper surface of the joint of the two adjacent single-board small-sized circuit hard boards 12 by the V-CUT process can be opposite to the notch 11 formed on the lower surface of the joint of the two adjacent single-board small-sized circuit hard boards 12 by the V-CUT process, that is, the notch 11 formed on the upper surface of the joint of the two adjacent single-board small-sized circuit hard boards 12 has a distance from the notch 11 formed on the lower surface of the joint of the two adjacent single-board small-sized circuit hard boards 12, so that the single-board small-sized circuit hard boards 12 in the whole small-sized circuit hard board 1 are still connected; further, when the single-board small-sized circuit hard board 12 needs to be used, the joint of two adjacent single-board small-sized circuit hard boards 12 can be bent and broken regularly.
Further, the method for gluing the small circuit hard board further comprises the following five steps: inserting the whole small circuit hard board 1 into a jig 4 (shown in fig. 2) with a strip-shaped hole 41, positioning the joint of two adjacent single-board small circuit hard boards 12 to be broken at the position of the strip-shaped hole 41, bending the whole small circuit hard board 1, and disconnecting the joint of two adjacent single-board small circuit hard boards 12 to be broken; therefore, the connection of two adjacent single-board small circuit hard boards 12 to be broken can be conveniently and quickly disconnected.
As shown in FIG. 1, the invention also discloses a small circuit hard board manufactured by applying the adhesive tape pasting method for the small circuit hard board.
The small-sized circuit hard board of the present invention may comprise: the integrated small-sized circuit hard board comprises a whole small-sized circuit hard board 1 with a plurality of single-board small-sized circuit hard boards 11, a plurality of single-board adhesive films 2 and a layer of carrier film 3, wherein a notch 11 is formed on the upper surface and the lower surface of the joint of every two adjacent single-board small-sized circuit hard boards 11 respectively, each single-board adhesive film 2 comprises an adhesive layer 21 and upper release paper 22, each notch 11 is arranged between every two adjacent single-board adhesive films 3, each carrier film 3 is adhered to each single-board adhesive film 2, and each single-board adhesive film 2 is adhered to the corresponding single-board small-sized circuit hard board 11; wherein the adhesive layer 21 may be a pressure sensitive adhesive and the incision 11 is V-shaped.
In summary, the adhesive film is punched into a plurality of single adhesive films 2, the V-CUT process is combined to CUT the joints of two adjacent single-board small-sized circuit hard boards 12 in the whole small-sized circuit hard board 1, and the single adhesive films 2 are adhered to the corresponding single-board small-sized circuit hard boards 12 respectively, so as to complete the integral adhesive bonding of the whole small-sized circuit hard board 1 with a plurality of single-board small-sized circuit hard boards 12.
While the invention has been described with reference to the foregoing embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention. Therefore, the scope of the present invention should not be limited to the embodiments disclosed, but includes various alternatives and modifications without departing from the present invention, which are encompassed by the claims.
Claims (8)
1. A method for gluing a small circuit hard board is characterized by comprising the following steps:
the method comprises the following steps: punching the adhesive film into a plurality of single adhesive films, wherein the size of each single adhesive film is the same as that of the single-board small circuit hard board, and the number of the single adhesive films is the same as that of the single-board small circuit hard boards;
step two: cutting the joint of two adjacent single-board small circuit hard boards in the whole small circuit hard board by adopting a V-CUT process, wherein the single-board small circuit hard boards in the whole small circuit hard board are still connected;
step three: and tearing the lower release paper of all the single adhesive films, and then respectively adhering the single adhesive films with the lower release paper torn to the corresponding single-board small-sized circuit hard boards one by one.
2. A method for applying adhesive to a small circuit board as defined in claim 1, wherein: the method also comprises the following four steps: and adhering a carrier film on the release paper of all the single adhesive films.
3. A method for gluing a small circuit board as defined in claim 1 or 2, wherein: and step two, cutting the upper surface and the lower surface of the joint of two adjacent single-board small circuit hard boards in the whole small circuit hard board by adopting a V-CUT process.
4. A method for applying adhesive to a small circuit board as defined in claim 3, wherein: the notch formed on the upper surface of the joint of the two adjacent single-board small circuit hard boards by adopting the V-CUT process is opposite to the notch formed on the lower surface of the joint of the two adjacent single-board small circuit hard boards by adopting the V-CUT process.
5. A method for gluing a small circuit board as defined in claim 1 or 2, wherein: further comprises the following steps: the whole small-sized circuit hard board is inserted into the jig with the strip-shaped hole, so that the joint of two adjacent single-board small-sized circuit hard boards to be broken is opposite to the position in the strip-shaped hole, the whole small-sized circuit hard board is bent, and the joint of two adjacent single-board small-sized circuit hard boards to be broken is disconnected.
6. A method for applying adhesive to a small circuit board as defined in claim 1, wherein: in the first step, at least three positioning holes are required to be arranged on the adhesive film; in the second step, at least three positioning holes are required to be arranged on the whole small circuit hard board; in the third step, the positioning holes of the adhesive film and the positioning holes of the whole small-sized circuit hard board are aligned one by one.
7. A method for applying adhesive to a small circuit board as defined in claim 2, wherein: the carrier film is a PET film.
8. A miniature circuit hard board characterized by: the small-sized circuit hardboard rubberizing method according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011039565.2A CN112105170B (en) | 2020-09-28 | 2020-09-28 | Method for gluing small circuit hard board and small circuit hard board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011039565.2A CN112105170B (en) | 2020-09-28 | 2020-09-28 | Method for gluing small circuit hard board and small circuit hard board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112105170A true CN112105170A (en) | 2020-12-18 |
| CN112105170B CN112105170B (en) | 2021-11-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011039565.2A Active CN112105170B (en) | 2020-09-28 | 2020-09-28 | Method for gluing small circuit hard board and small circuit hard board |
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| CN (1) | CN112105170B (en) |
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| JP2012222218A (en) * | 2011-04-12 | 2012-11-12 | Seiko Epson Corp | Circuit board, and composite board comprising a plurality of circuit boards and frame boards |
| CN103732008A (en) * | 2012-10-15 | 2014-04-16 | 富葵精密组件(深圳)有限公司 | Piece connection circuit board and manufacturing method thereof |
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| CN104214563A (en) * | 2014-04-26 | 2014-12-17 | 王定锋 | Light-emitting diode (LED) identification module manufactured by sticking glue plate on whole board connecting piece of circuit board, and slitting method thereof |
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| CN107027242A (en) * | 2017-05-26 | 2017-08-08 | 中国电子科技集团公司第二十九研究所 | A kind of printed circuit board contour processing method |
| CN108601221A (en) * | 2018-04-17 | 2018-09-28 | 深圳市宝明科技股份有限公司 | A kind of method of rubberizing on pcb board |
| CN208191007U (en) * | 2018-04-26 | 2018-12-04 | 深圳市同创鑫电子有限公司 | A kind of flexible circuit board |
| CN109068491A (en) * | 2018-09-30 | 2018-12-21 | 东莞联桥电子有限公司 | A kind of aluminium base board machining process |
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2020
- 2020-09-28 CN CN202011039565.2A patent/CN112105170B/en active Active
Patent Citations (14)
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| CN2777903Y (en) * | 2004-12-29 | 2006-05-03 | 安捷利（番禺）电子实业有限公司 | Flexible printed circuitboard capable of keeping microconnection after die cutting |
| JP2012222218A (en) * | 2011-04-12 | 2012-11-12 | Seiko Epson Corp | Circuit board, and composite board comprising a plurality of circuit boards and frame boards |
| CN202050588U (en) * | 2011-04-21 | 2011-11-23 | 淳华科技(昆山)有限公司 | Flexible printed circuit board back adhesive tape and adhesive tape sticking jig |
| CN103732008A (en) * | 2012-10-15 | 2014-04-16 | 富葵精密组件(深圳)有限公司 | Piece connection circuit board and manufacturing method thereof |
| CN103923574A (en) * | 2014-03-27 | 2014-07-16 | 厦门爱谱生电子科技有限公司 | Double-sided adhesive tape, manufacturing method thereof and method of adhering double-sided adhesive tape to FPC (Flexible Printed Circuit) product |
| CN104214563A (en) * | 2014-04-26 | 2014-12-17 | 王定锋 | Light-emitting diode (LED) identification module manufactured by sticking glue plate on whole board connecting piece of circuit board, and slitting method thereof |
| CN103994356A (en) * | 2014-04-26 | 2014-08-20 | 王定锋 | Slitting method for LED lamp band with combined jointed boards and integrated adhesive glue board and LED lamp band |
| CN204313087U (en) * | 2014-04-26 | 2015-05-06 | 王定锋 | The LED of jigsaw whole plate rubberizing plate together cuts the LED obtained |
| CN105898988A (en) * | 2016-06-01 | 2016-08-24 | 深圳市汇晨电子股份有限公司 | Backlight FPC (Flexible Printed Circuit board) full page adhesive film and overall rubberizing process thereof |
| CN205793649U (en) * | 2016-06-01 | 2016-12-07 | 深圳市汇晨电子股份有限公司 | Backlight FPC justifying glued membrane |
| CN107027242A (en) * | 2017-05-26 | 2017-08-08 | 中国电子科技集团公司第二十九研究所 | A kind of printed circuit board contour processing method |
| CN108601221A (en) * | 2018-04-17 | 2018-09-28 | 深圳市宝明科技股份有限公司 | A kind of method of rubberizing on pcb board |
| CN208191007U (en) * | 2018-04-26 | 2018-12-04 | 深圳市同创鑫电子有限公司 | A kind of flexible circuit board |
| CN109068491A (en) * | 2018-09-30 | 2018-12-21 | 东莞联桥电子有限公司 | A kind of aluminium base board machining process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112105170B (en) | 2021-11-23 |
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