CN112104324A - Bypass diode for solar junction box - Google Patents
Bypass diode for solar junction box Download PDFInfo
- Publication number
- CN112104324A CN112104324A CN201910526647.0A CN201910526647A CN112104324A CN 112104324 A CN112104324 A CN 112104324A CN 201910526647 A CN201910526647 A CN 201910526647A CN 112104324 A CN112104324 A CN 112104324A
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- fixedly connected
- junction box
- box body
- bypass diode
- copper
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 76
- 229910052802 copper Inorganic materials 0.000 claims abstract description 42
- 239000010949 copper Substances 0.000 claims abstract description 42
- 230000017525 heat dissipation Effects 0.000 claims abstract description 35
- 239000004065 semiconductor Substances 0.000 claims abstract description 28
- 235000014676 Phragmites communis Nutrition 0.000 claims abstract description 14
- 244000273256 Phragmites communis Species 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 239000000428 dust Substances 0.000 claims description 9
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 9
- 239000004033 plastic Substances 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 13
- 238000010248 power generation Methods 0.000 description 8
- 238000009434 installation Methods 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- 230000003139 buffering effect Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/30—Electrical components
- H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/30—Electrical components
- H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
- H02S40/345—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes with cooling means associated with the electrical connection means, e.g. cooling means associated with or applied to the junction box
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention discloses a bypass diode for a solar junction box, which belongs to the field of diodes and comprises a box body, wherein the top of the box body is fixedly connected with a box cover, the bottom of the inner wall of the box body is fixedly connected with a slide rail, the surface of the slide rail is movably connected with six connecting seats, connecting reeds are fixedly connected to the tops of the six connecting seats, connecting pins are fixedly connected to the tops of the connecting reeds, a diode body is fixedly connected between every two adjacent connecting pins, two connecting heads are fixedly connected to one side of the box body, and a lead is fixedly connected to one side of each two connecting heads. According to the invention, the chips are assembled in parallel with the wires, and a semiconductor chip with a larger size can be placed in the same overall dimension, so that the rated power of the product is improved, the area of the copper wires in the product is increased, the heat dissipation area of the chips is enlarged, and the failure rate of the product can be effectively reduced.
Description
Technical Field
The invention relates to the field of diodes, in particular to a bypass diode for a solar junction box.
Background
Photovoltaic power plants are generally constructed with several photovoltaic modules. The photovoltaic component is formed by connecting photovoltaic power generation units in series according to the required voltage, the photovoltaic power generation units are formed by connecting photovoltaic power generation units in series, when the photovoltaic component receives solar energy, in the event that some of the photovoltaic power generation units fail to receive solar energy or are damaged, a high power consumption state ("hot spots") is exhibited, the photovoltaic power generation units are damaged, and a power generation operation failure is caused, therefore, the photovoltaic module needs to adopt a photovoltaic bypass diode circuit to protect the photovoltaic module and maintain the normal operation of the photovoltaic power generation device, the product form of the photovoltaic bypass diode circuit appearing in the current market is a photovoltaic bypass junction box which is composed of a junction box shell, a plurality of lead terminals and a plurality of discrete diodes, and the solar photovoltaic power generation module junction box is an important part for outputting a solar power supply and is a transition device for implementing connection of a solar battery lead and an external lead.
At present, most of chips and wires in the bypass diode are connected in a lead type mode, the chips are packaged through a packaging body, the chips and copper wires are assembled in a side-to-side mode, the diameter size of a cylindrical packaging body limits the packaging of large-size chips, the packaging of the chips with larger power sizes cannot be achieved, meanwhile, the sectional area of the copper wires is too small, the heat dissipation of the chips is not facilitated, and the high-temperature battery core is prone to failure.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems in the prior art, the invention aims to provide a bypass diode for a solar junction box, which has the advantages that a semiconductor chip with a larger size can be placed in the same overall dimension by assembling the chip parallel to a wire, so that the rated power of a product is improved, the area of a copper wire in the product is increased, the heat dissipation area of the chip is enlarged, and the failure rate of the product can be effectively reduced.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
A bypass diode for a solar junction box comprises a box body, wherein the top of the box body is fixedly connected with a box cover, the bottom of the inner wall of the box body is fixedly connected with a slide rail, the surface of the slide rail is movably connected with six connecting seats, the tops of the six connecting seats are fixedly connected with connecting reeds, the tops of the connecting reeds are fixedly connected with connecting feet, a diode body is fixedly connected between every two adjacent connecting feet, one side of the box body is fixedly connected with two connecting heads, one side of each of the two connecting heads is fixedly connected with a lead, the two leads are fixedly connected with the two connecting reeds positioned at the two sides, the bottom of the inner wall of the box body is fixedly connected with a heat dissipation assembly, the diode body is movably connected with the heat dissipation assembly, the other side of the box body is provided with a heat dissipation port, and the, the diode body comprises a semiconductor chip, a first copper conductor section and a second copper conductor section, the semiconductor chip is located between the first copper conductor section and the second copper conductor section, and the surfaces of the semiconductor chip, the first copper conductor section and the second copper conductor section are sealed and molded with an insulating plastic package body.
Preferably, the first copper conductor segment and the second copper conductor segment are both formed by copper conductors and copper sheets, and the two copper sheets are arranged in parallel.
Preferably, the first copper wire segment and the second copper wire segment are provided with lead-tin solder on opposite sides, and the semiconductor chip is welded by the semiconductor chip lead-tin solder semiconductor chip.
Preferably, the insulating plastic package body is an epoxy resin material member.
Preferably, the slot has all been seted up to the top both sides of box body, the equal fixedly connected with inserted bar in bottom both sides of lid, one side threaded connection of inserted bar has the screw, the inserted bar passes through screw and slot fixed connection, and the top fixedly connected with rubber pad of box body.
Preferably, the inner wall top fixedly connected with latch device of connecting seat, the inner wall joint of latch device and slide rail, latch device is including the slider, the mounting groove has all been seted up to the both sides of slider, the first spring of inner wall fixedly connected with of mounting groove, one side fixedly connected with fixture block of first spring, fixture block and slide rail joint, and the shape of fixture block is triangle-shaped.
Preferably, the locating hole that the equidistance distributes is seted up to one side of slide rail, the cavity has been seted up to the inside of connecting seat, one side of connecting seat is pegged graft and is had the locating lever, the locating lever runs through the cavity and pegs graft with the locating hole, the surface of locating lever has cup jointed the fender ring that is located the cavity inside, the surface cover of locating lever is equipped with the second spring that is located fender ring one side.
Preferably, the heat dissipation assembly comprises a fixing frame, wherein metal copper sheets are fixedly connected to the inner side of the fixing frame and are distributed at equal intervals, and one end of the top of each metal copper sheet is arc-shaped.
Preferably, one end of the wire is fixedly connected with a metal connecting sheet, the top of the metal connecting sheet is in threaded connection with a screw, and the metal connecting sheet and the connecting reed are both fixedly connected with the connecting seat through screws.
Preferably, one side of the top of the sliding rail is provided with a dismounting opening.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) the scheme is that the semiconductor chip is assembled in parallel with the first copper conductor section and the second copper conductor section, the semiconductor chip with larger size can be put into the insulating plastic package with the same appearance size, the rated power of a product is improved, the area of the copper conductor inside the product is increased, the heat dissipation area of the chip is enlarged, the failure rate of the product can be effectively reduced, the heat dissipation of the diode body can be accelerated by adjusting the copper conductor packaged in the insulating plastic package into a flat structure from a lead type to increase the heat radiation area, so that the heat dissipation capability of the product is improved, the effective rated power is increased, meanwhile, the diode body is mounted on the heat dissipation assembly, air can enter and exit the box body through the heat dissipation port, the dustproof net plays a role of preventing dust and the like from entering from the heat dissipation port, the service life of the diode in the junction box is longer, and the problem that the diameter size of a cylindrical package body limits, the encapsulation of the chip with larger power size can not be realized, and simultaneously, the copper wire is not favorable for the heat dissipation of the chip because of too small sectional area, and the problem of high-temperature electric core failure is easily caused.
(2) This bypass diode for solar junction box constitutes through changing traditional copper wire into copper wire and copper sheet to through lead-tin solder with semiconductor chip welding between two copper sheets, the great semiconductor chip of size is conveniently installed, and can enlarge the heat radiating area of chip, makes the life of diode body longer.
(3) This bypass diode for solar junction box, when carrying out the fixed of box body and lid, inside pegging graft the slot with the inserted bar, then use the fix with screw can, and under the buffering of rubber pad, make the connection between box body and the lid inseparabler.
(4) This bypass diode for solar junction box, through setting up latch device, when the installation of needs connecting seat, can be directly insert the slide rail inside with the slider, male in-process, the first spring of fixture block extrusion, after the slide rail is inside when the slider is inserted, under the promotion of first spring, the fixture block stretches out from the mounting groove is inside to the card is at the inner wall of slide rail, thereby can make inside the installation slide rail that the connecting seat can be quick, it is very convenient to use.
(5) This bypass diode for solar junction box, through setting up the locating hole that the equidistance distributes, when the diode body of different quantity is installed to needs, the connecting seat of different quantity is installed to the accessible, then the pulling locating lever, make the locating lever break away from the locating hole, adjust the distance between each connecting seat this moment, adjust the back that finishes, loosen the locating lever, the locating lever is pegged graft inside the locating hole that corresponds this moment, can be at the diode body of box body internally mounted not equidimension or quantity, application scope is wider.
(6) This bypass diode for solar junction box through setting up a plurality of metal copper sheets, can accelerate the heat dissipation on diode body surface, and through with metal copper sheet and dust screen contact, can accelerate the heat dissipation of metal copper sheet, accelerates the heat dissipation of diode body.
(7) This bypass diode for solar junction box through setting up the metal connecting piece, can pull down wire or connecting reed from the connecting seat when needing, has made things convenient for follow-up change accessory.
(8) This bypass diode for solar junction box dismantles the mouth through setting up, slides the connecting seat to the position department of dismantling the mouth, can be quick pull down the connecting seat from the slide rail, and it is very convenient to use.
Drawings
FIG. 1 is an exploded view of the present invention;
FIG. 2 is a schematic structural diagram of a diode body according to the present invention;
FIG. 3 is a perspective view of the connecting base of the present invention;
FIG. 4 is a schematic view of a connecting base according to the present invention;
FIG. 5 is an enlarged view taken at A of FIG. 1 in accordance with the present invention;
FIG. 6 is an enlarged view taken at B of FIG. 1 in accordance with the present invention;
fig. 7 is an enlarged view of the invention at C in fig. 1.
The reference numbers in the figures illustrate:
1. a box body; 2. a box cover; 3. a slide rail; 4. a connecting seat; 5. connecting a reed; 6. a connecting pin; 7. a diode body; 71. a semiconductor chip; 72. a first copper wire segment; 73. a second copper wire segment; 74. an insulating plastic package body; 75. lead-tin solder; 8. a heat dissipating component; 81. a fixed mount; 82. a metal copper sheet; 9. a dust screen; 10. a connector; 11. a slot; 12. inserting a rod; 13. a clamping device; 131. a slider; 132. a first spring; 133. a clamping block; 14. positioning holes; 15. positioning a rod; 16. a metal connecting sheet; 17. and (6) disassembling the port.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-7, a bypass diode for a solar junction box comprises a box body 1, a box cover 2 fixedly connected to the top of the box body 1, a slide rail 3 fixedly connected to the bottom of the inner wall of the box body 1, six connecting seats 4 movably connected to the surface of the slide rail 3, connecting springs 5 fixedly connected to the tops of the six connecting seats 4, connecting pins 6 fixedly connected to the tops of the connecting springs 5, a diode body 7 fixedly connected between the two adjacent connecting pins 6, two connecting heads 10 fixedly connected to one side of the box body 1, two wires fixedly connected to the two connecting springs 5 at the two sides, a heat dissipation assembly 8 fixedly connected to the bottom of the inner wall of the box body 1, the diode body 7 movably connected to the heat dissipation assembly 8, and a heat dissipation port arranged at the other side of the box body 1, the inner wall fixedly connected with dust screen 9 of thermovent, radiator unit 8 and dust screen 9 contact, diode body 7 is including semiconductor chip 71, first copper wire section 72 and second copper wire section 73, and semiconductor chip 71 is located between first copper wire section 72 and the second copper wire section 73, and semiconductor chip 71, the surface of first copper wire section 72 and second copper wire section 73 seal and mould insulating plastic-sealed body 74, insulating plastic-sealed body 74 is the epoxy material component.
Further, first copper wire section 72 and second copper wire section 73 constitute by copper wire and copper sheet, two copper sheets are placed in parallel to each other, the opposite side of first copper wire section 72 and second copper wire section 73 all is provided with lead tin solder 75, semiconductor chip 71 all welds through semiconductor chip 71 lead tin solder 75 semiconductor chip 71, constitute through changing traditional copper wire into copper wire and copper sheet, and weld semiconductor chip 71 between two copper sheets through lead tin solder 75, semiconductor chip 71 that the convenient installation size is great, and can enlarge the heat radiating area of chip, make diode body 7's life longer.
Further, slot 11 has all been seted up to the top both sides of box body 1, the equal fixedly connected with inserted bar 12 in the bottom both sides of lid 2, one side threaded connection of inserted bar 12 has the screw, inserted bar 12 passes through screw and slot 11 fixed connection, and the top fixedly connected with rubber pad of box body 1, when carrying out the fixed of box body 1 and lid 2, peg graft inside slot 11 with inserted bar 12, then use the fix with screw can, and under the buffering of rubber pad, make the connection between box body 1 and the lid 2 inseparabler.
Further, inner wall top fixedly connected with latch device 13 of connecting seat 4, latch device 13 and slide rail 3's inner wall joint, latch device 13 is including slider 131, the mounting groove has all been seted up to slider 131's both sides, the first spring 132 of the inner wall fixedly connected with of mounting groove, one side fixedly connected with fixture block 133 of first spring 132, fixture block 133 and slide rail 3 joint, and fixture block 133's shape is triangle-shaped, through setting up latch device 13, when the installation of needs connecting seat 4, can directly insert inside slide rail 3 with slider 131, the male in-process, fixture block 133 extrudes first spring 132, peg graft slide rail 3 inside back when slider 131, under the promotion of first spring 132, fixture block 133 stretches out from the mounting groove is inside, and block at the inner wall of slide rail 3, thereby can make inside installation slide rail 3 that connecting seat 4 can be quick, it is very convenient to use.
Furthermore, one side of the slide rail 3 is provided with positioning holes 14 distributed at equal intervals, the inside of the connecting seat 4 is provided with a cavity, one side of the connecting seat 4 is inserted with a positioning rod 15, the positioning rod 15 penetrates through the cavity and is inserted with the positioning holes 14, the surface of the positioning rod 15 is sleeved with a baffle ring positioned in the cavity, the surface of the positioning rod 15 is sleeved with a second spring positioned at one side of the baffle ring, and through the arrangement of the positioning holes 14 distributed at equal intervals, when different numbers of diode bodies 7 are needed to be installed, by installing different numbers of connecting seats 4, then the positioning rod 15 is pulled to separate the positioning rod 15 from the positioning hole 14, the distance between each connecting seat 4 is adjusted, after the adjustment is finished, the positioning rod 15 is loosened, the positioning rod 15 is inserted into the corresponding positioning hole 14, the diode bodies 7 with different sizes or quantities can be arranged in the box body 1, and the application range is wider.
Further, the heat dissipation assembly 8 comprises a fixing frame 81, the inner side of the fixing frame 81 is fixedly connected with metal copper sheets 82 which are arranged at equal intervals, one end of the top of each metal copper sheet 82 is arc-shaped, heat dissipation of the surface of the diode body 7 can be accelerated by arranging the metal copper sheets 82, and the metal copper sheets 82 are in contact with the dust screen 9, so that heat dissipation of the metal copper sheets 82 can be accelerated, and heat dissipation of the diode body 7 is accelerated.
Further, the one end fixedly connected with metal connecting piece 16 of wire, the top threaded connection of metal connecting piece 16 has the screw, and metal connecting piece 16 and connecting reed 5 all pass through screw and connecting seat 4 fixed connection, through setting up metal connecting piece 16, can pull down wire or connecting reed 5 from connecting seat 4 when needing, have made things convenient for follow-up change accessory.
Furthermore, the top one side of slide rail 3 has been seted up and has been dismantled mouthful 17, dismantles mouthful 17 through setting up, with connecting seat 4 slide to the position department of dismantling mouthful 17, can be quick pull down connecting seat 4 from slide rail 3, it is very convenient to use.
The working principle is as follows: by assembling the semiconductor chip 71 in parallel with the first copper wire section 72 and the second copper wire section 73, a larger semiconductor chip 71 can be placed in the insulating plastic package 74 with the same external dimension, the rated power of the product is improved, the area of the copper wire in the product is increased, the heat dissipation area of the chip is enlarged, the failure rate of the product can be effectively reduced, the heat dissipation of the diode body 7 can be accelerated by adjusting the copper wire packaged in the insulating plastic package 74 from a lead type to a flat type structure to increase the heat dissipation area, thereby improving the heat dissipation capability of the product and increasing the effective rated power, meanwhile, by installing the diode body 7 on the heat dissipation assembly 8, air can enter and exit the box body 1 through the heat dissipation port, the dustproof net 9 plays a role of preventing dust and the like from entering from the heat dissipation port, so that the service life of the diode in the junction box is longer, and the problem that the diameter dimension of the cylindrical package limits the packaging of the large chip, the encapsulation of the chip with larger power size can not be realized, and simultaneously, the copper wire is not favorable for the heat dissipation of the chip because of too small sectional area, and the problem of high-temperature electric core failure is easily caused.
The foregoing is only a preferred embodiment of the present invention; the scope of the invention is not limited thereto. Any person skilled in the art should be able to cover the technical scope of the present invention by equivalent or modified solutions and modifications within the technical scope of the present invention.
Claims (10)
1. The utility model provides a bypass diode for solar junction box, includes box body (1), the top fixedly connected with lid (2) of box body (1), its characterized in that: the LED lamp box is characterized in that a sliding rail (3) is fixedly connected to the bottom of the inner wall of the box body (1), the surface of the sliding rail (3) is movably connected with six connecting seats (4), connecting reeds (5) are fixedly connected to the tops of the six connecting seats (4), connecting feet (6) are fixedly connected to the tops of the connecting reeds (5), a diode body (7) is fixedly connected between every two adjacent connecting feet (6), two connectors (10) are fixedly connected to one side of the box body (1), wires are fixedly connected to one sides of the two connectors (10), the two wires are fixedly connected with the two connecting reeds (5) positioned on two sides, a heat dissipation assembly (8) is fixedly connected to the bottom of the inner wall of the box body (1), and the diode body (7) is movably connected with the heat dissipation assembly (8), the opposite side of box body (1) is provided with the thermovent, the inner wall fixedly connected with dust screen (9) of thermovent, radiator unit (8) and dust screen (9) contact, diode body (7) are including semiconductor chip (71), first copper wire section (72) and second copper wire section (73), semiconductor chip (71) are located between first copper wire section (72) and second copper wire section (73), and the surface of semiconductor chip (71), first copper wire section (72) and second copper wire section (73) is sealed and is moulded insulating plastic envelope body (74).
2. The bypass diode for a solar junction box of claim 1, wherein: the first copper conducting wire section (72) and the second copper conducting wire section (73) are both composed of copper conducting wires and copper sheets, and the two copper sheets are arranged in parallel.
3. The bypass diode for a solar junction box of claim 1, wherein: and lead-tin solder (75) is arranged on the opposite sides of the first copper wire section (72) and the second copper wire section (73), and the semiconductor chip (71) is welded by the lead-tin solder (75) of the semiconductor chip (71).
4. The bypass diode for a solar junction box of claim 1, wherein: the insulation plastic package body (74) is an epoxy resin material component.
5. The bypass diode for a solar junction box of claim 1, wherein: slot (11) have all been seted up to the top both sides of box body (1), the equal fixedly connected with inserted bar (12) in bottom both sides of lid (2), one side threaded connection of inserted bar (12) has the screw, inserted bar (12) are through screw and slot (11) fixed connection, and the top fixedly connected with rubber pad of box body (1).
6. The bypass diode for a solar junction box of claim 1, wherein: inner wall top fixedly connected with latch device (13) of connecting seat (4), the inner wall joint of latch device (13) and slide rail (3), latch device (13) is including slider (131), the mounting groove has all been seted up to the both sides of slider (131), the first spring of inner wall fixedly connected with (132) of mounting groove, one side fixedly connected with fixture block (133) of first spring (132), fixture block (133) and slide rail (3) joint, and the shape of fixture block (133) is triangle-shaped.
7. The bypass diode for a solar junction box of claim 1, wherein: locating hole (14) that the equidistance distributes are seted up to one side of slide rail (3), the cavity has been seted up to the inside of connecting seat (4), peg graft in one side of connecting seat (4) and have locating lever (15), locating lever (15) run through the cavity and peg graft with locating hole (14), the surface of locating lever (15) is cup jointed and is located the inside fender ring of cavity, the surface cover of locating lever (15) is equipped with the second spring that is located fender ring one side.
8. The bypass diode for a solar junction box of claim 1, wherein: the heat dissipation assembly (8) comprises a fixing frame (81), wherein metal copper sheets (82) are fixedly connected to the inner side of the fixing frame (81) at equal intervals, and one end of the top of each metal copper sheet (82) is arranged in an arc shape.
9. The bypass diode for a solar junction box of claim 1, wherein: one end fixedly connected with metal connecting piece (16) of wire, the top threaded connection of metal connecting piece (16) has the screw, metal connecting piece (16) and connection reed (5) all are through screw and connecting seat (4) fixed connection.
10. The bypass diode for a solar junction box of claim 1, wherein: and a dismounting opening (17) is formed in one side of the top of the sliding rail (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910526647.0A CN112104324B (en) | 2019-06-18 | 2019-06-18 | Bypass diode for solar junction box |
Applications Claiming Priority (1)
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115642874A (en) * | 2022-09-09 | 2023-01-24 | 安徽钜芯半导体科技有限公司 | Packaging structure for improving thermal conductivity of photovoltaic module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080232040A1 (en) * | 2007-03-23 | 2008-09-25 | Guoqing Li | Fast terminal box |
| US20090272574A1 (en) * | 2008-05-03 | 2009-11-05 | Michael Richter | Connection box for solar panel |
| CN101944546A (en) * | 2010-09-16 | 2011-01-12 | 常熟市冠日新材料有限公司 | Solar photovoltaic module junction box |
| CN102054888A (en) * | 2010-12-14 | 2011-05-11 | 陈新初 | Photovoltaic assembly junction box |
| CN108551324A (en) * | 2018-06-17 | 2018-09-18 | 李婵珊 | A kind of efficient integrated junction box of photovoltaic |
-
2019
- 2019-06-18 CN CN201910526647.0A patent/CN112104324B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080232040A1 (en) * | 2007-03-23 | 2008-09-25 | Guoqing Li | Fast terminal box |
| US20090272574A1 (en) * | 2008-05-03 | 2009-11-05 | Michael Richter | Connection box for solar panel |
| CN101944546A (en) * | 2010-09-16 | 2011-01-12 | 常熟市冠日新材料有限公司 | Solar photovoltaic module junction box |
| CN102054888A (en) * | 2010-12-14 | 2011-05-11 | 陈新初 | Photovoltaic assembly junction box |
| CN108551324A (en) * | 2018-06-17 | 2018-09-18 | 李婵珊 | A kind of efficient integrated junction box of photovoltaic |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115642874A (en) * | 2022-09-09 | 2023-01-24 | 安徽钜芯半导体科技有限公司 | Packaging structure for improving thermal conductivity of photovoltaic module |
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| CN112104324B (en) | 2024-01-30 |
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