CN112097840B - Temperature-pressure differential pressure sensor based on high static pressure structure - Google Patents
Temperature-pressure differential pressure sensor based on high static pressure structure Download PDFInfo
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- CN112097840B CN112097840B CN202011293090.XA CN202011293090A CN112097840B CN 112097840 B CN112097840 B CN 112097840B CN 202011293090 A CN202011293090 A CN 202011293090A CN 112097840 B CN112097840 B CN 112097840B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0092—Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D21/00—Measuring or testing not otherwise provided for
- G01D21/02—Measuring two or more variables by means not covered by a single other subclass
Abstract
The invention provides a temperature-pressure differential pressure sensor based on a high static pressure structure, and belongs to the technical field of machinery. The temperature-pressure differential pressure sensor includes: the temperature sensing device comprises a base, two pressure sensing assemblies and at least one temperature sensing element. Wherein, the base is provided with into pressure port respectively along its length direction's both sides, and two pressure sensing subassembly symmetries set up the both sides at the base, and every pressure sensing subassembly corresponds a pressure port to detect the pressure signal of base both sides pressure port medium respectively, obtain pressure difference data. At least one temperature sensing element is arranged on at least one side of the base and corresponds to the corresponding pressure inlet to detect the temperature data of the medium at the pressure inlet, so that the medium temperature and the external pressure are converted into analog signals capable of being sensed through the pressure inlet, a differential pressure signal can be detected, the temperature data of different pressure inlets can be obtained, the product can measure the temperature and the pressure simultaneously, low-pressure and high-pressure inlets can be exchanged according to the requirements of customers, the research and development types are reduced, and the time and the cost are saved.
Description
Technical Field
The invention belongs to the technical field of machinery, and particularly relates to a temperature-pressure differential pressure sensor based on a high static pressure structure.
Background
At present, be used for measuring temperature and differential pressure sensor on the market, separate independent encapsulation with temperature sensor and differential pressure core body more and realize, a model number corresponds a section structural design, and is used for low pressure environment more, can't measure the temperature and the pressure differential of medium simultaneously, and this causes very big inconvenience to the use.
Therefore, based on the technical problem, the invention provides a temperature-pressure differential pressure sensor based on a high static pressure structure, so as to measure the pressure difference and simultaneously measure the temperature data of different pressure inlets.
Disclosure of Invention
The invention aims to solve at least one technical problem in the prior art and provides a temperature-pressure differential pressure sensor based on a high static pressure structure.
The invention provides a temperature-pressure differential pressure sensor based on a high static pressure structure, which comprises: the temperature sensing device comprises a base, two pressure sensing assemblies and at least one temperature sensing element; wherein the content of the first and second substances,
the two sides of the base along the length direction are respectively provided with a pressure inlet;
the two pressure sensing assemblies are symmetrically arranged on two sides of the base, and each pressure sensing assembly corresponds to one pressure inlet so as to respectively detect pressure signals of media of the pressure inlets on the two sides of the base and obtain pressure difference data;
at least one temperature sensing element is arranged on at least one side of the base and corresponds to the pressure inlet so as to detect temperature data of the medium at the pressure inlet.
Optionally, the pressure sensing assembly includes a pressure sensing film and a pressure sensing chip; wherein the content of the first and second substances,
the pressure sensing chip is arranged in the base, and the pressure sensing film is arranged between the pressure sensing chip and the pressure inlet; and silicone oil is filled between the pressure sensing film and the pressure sensing chip.
Optionally, the temperature-pressure differential pressure sensor includes a temperature sensing element, the temperature sensing element is disposed on a first side of any one of the pressure sensing chips along the width direction of the base, and the temperature sensing element is located in the silicone oil.
Optionally, the temperature-pressure differential pressure sensor includes two temperature sensing elements, the two temperature sensing elements are symmetrically disposed on two sides of the base, and each temperature sensing element is disposed on a first side of the corresponding pressure sensing chip along the width direction of the base; and the temperature sensing element is positioned in the silicone oil.
Optionally, the temperature sensing element is a PT1000 platinum resistor.
Optionally, a silicone oil filling cavity and a sealing member are arranged on a second side of each pressure sensing chip along the width direction of the base; wherein the content of the first and second substances,
one end of the silicone oil filling cavity is arranged in the base in a penetrating mode and communicated with the silicone oil, the other end of the silicone oil filling cavity extends to the outside of the base, and the sealing element is located at the other end of the silicone oil filling cavity to seal the silicone oil filling cavity.
Optionally, a stress release ring is disposed on each of the first side and the second side of each of the pressure sensing chips in the width direction of the base; wherein the content of the first and second substances,
the stress release rings on the two sides are all clamped in the silicone oil and the base, and the stress release rings on the second side are communicated with the silicone oil filling cavity and the silicone oil so as to release stress generated by expansion of the silicone oil.
Optionally, pins and leads are further disposed on two sides of each pressure sensing chip along the width direction of the base, and the pins penetrate through the base; wherein the content of the first and second substances,
the first end of each pin penetrates through the stress release ring and is positioned in the silicon oil, and is connected with the pressure sensing chip and/or the temperature sensing element through each lead;
the second end of each pin extends to the outside of the base.
Optionally, a plurality of insulating sleeves are arranged in the base, and each pin is arranged in the insulating sleeve in a penetrating manner.
Optionally, the temperature-pressure differential pressure sensor further includes a plurality of connecting members, and each connecting member connects the base and the corresponding pressure sensing diaphragm.
The invention provides a temperature-pressure differential pressure sensor based on a high static pressure structure, which comprises: the temperature sensing device comprises a base, two pressure sensing assemblies and at least one temperature sensing element. Wherein, the base is provided with into pressure port respectively along its length direction's both sides, and two pressure sensing subassembly symmetries set up the both sides at the base, and every pressure sensing subassembly corresponds a pressure port to detect the pressure signal of base both sides pressure port medium respectively, obtain pressure difference data. At least one temperature sensing element is arranged on at least one side of the base and corresponds to the corresponding pressure inlet to detect the temperature data of the medium at the pressure inlet, so that the medium temperature and the external pressure are converted into analog signals capable of being sensed through the pressure inlet, and not only can the differential pressure signals be detected, but also the temperature data of different pressure inlets can be obtained. Therefore, the product of the invention can measure the temperature and the pressure, and can exchange the low-pressure inlet and the high-pressure inlet according to the requirements of customers, thereby reducing the research and development types and saving the time and the cost.
Drawings
FIG. 1 is a schematic structural diagram of a differential pressure-temperature sensor based on a high static pressure structure according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a differential pressure-temperature sensor based on a high static pressure structure according to another embodiment of the present invention.
Detailed Description
In order to make the technical solutions of the present invention better understood, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without any inventive step, are within the scope of protection of the invention.
In some descriptions of the present invention, unless expressly stated or limited otherwise, the terms "mounted," "connected," or "fixed" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect through an intermediate medium, whether internal to two elements or an interactive relationship between two elements. Also, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", and the like indicate an orientation or positional relationship based on that shown in the drawings, and are used only to indicate a relative positional relationship, which may also be changed accordingly when the absolute position of the object being described is changed.
As shown in fig. 1 and 2, the present invention provides a differential temperature-pressure sensor 100 based on a high static pressure structure, including: a base 110, two pressure sensing assemblies 120, and at least one temperature sensing element 130. The base 110 is provided with pressure inlets 111/112 along its two sides in the length direction, that is, a pressure inlet 111 located on the left side of the base and a pressure inlet 112 located on the right side of the base. The two pressure sensing assemblies 120 are symmetrically arranged on two sides of the base 110, and each pressure sensing assembly 120 corresponds to one pressure inlet 111/112 so as to respectively detect pressure signals of media at the pressure inlets on the two sides of the base and obtain pressure difference data. At least one temperature sensing element 130 is disposed on at least one side of the base 110 corresponding to a respective pressure inlet 111/112 for sensing temperature data of the pressure inlet media.
The design of this embodiment has the pressure inlet with the base symmetry, in order to realize measuring the temperature data of different pressure inlets, and be provided with two pressure sensing subassembly in the bilateral symmetry of base, and all set up temperature-sensing element in either side of base or both sides in order to realize changing medium temperature and applied pressure into the analog signal that can be perceived through pressure inlet, both detectable differential pressure signal can obtain the temperature data of different pressure inlets again, in order to realize that the product of this embodiment can measure temperature and pressure, can also exchange low pressure and high pressure inlet according to customer's requirement.
Specifically, as shown in fig. 1 and fig. 2, the pressure sensing assemblies 120 on both sides each include a pressure sensing diaphragm 121 and a pressure sensing chip 122; among them, the pressure-sensitive chip 122 is disposed in the base 110, and the pressure-sensitive film 121 is disposed between the pressure-sensitive chip 122 and the pressure inlet 111/112, for example, the pressure-sensitive film 121 on the left side of the base 110 is disposed between the pressure-sensitive chip 122 on the corresponding side and the pressure inlet 111, and the pressure-sensitive film 121 on the right side of the base 110 is disposed between the pressure-sensitive chip 122 on the corresponding side and the pressure inlet 112. Silicone oil is filled between the pressure-sensitive film 121 and the pressure-sensitive chip 122 on both sides.
It should be noted that the pressure sensing diaphragm of the present embodiment may be a stainless steel diaphragm, and the base may also be a stainless steel base, so as to form a sealed stainless steel cavity.
It should be understood that for better sealing, a connection member may be disposed between the stainless steel diaphragm and the base, and for example, as shown in fig. 1 and 2, in some embodiments, the differential temperature-pressure sensor 100 further includes a plurality of connection members 140, and each connection member 140 connects the base 110 and the corresponding pressure sensing diaphragm 121, respectively, and functions as an isolation medium to protect the internal pressure sensing diaphragm.
It should be noted that, the connecting member is not specifically limited in this embodiment, for example, a welding ring may be adopted, and based on that the base and the pressure sensing diaphragm are both made of stainless steel, the stainless steel diaphragm is located between the welding ring and the base, and the welding ring, the base and the pressure sensing diaphragm are fixed by metal welding to isolate the medium and form a sealed cavity.
The pressure sensing subassembly of this embodiment is at the during operation, advances to press mouthful to exert pressure and passes through on stainless steel diaphragm, the silicone oil of inside seal transmit the pressure sensing chip, this pressure sensing chip direct contact measured medium not, and foreign matter is direct action not on the pressure sensing chip promptly, can form the pressure measurement difference. It is made by using the piezoresistive effect of the chip Wheatstone bridge, i.e. the principle that the resistivity of the material changes along with the change of the applied pressure.
It should be further noted that, in this embodiment, the number and the position of the temperature sensing elements are not specifically limited, and one temperature sensing element may be provided, and the temperature sensing element may be provided on any side of the base, that is, on either the left side or the right side, so as to detect temperature data of the pressure inlet medium on any side. Of course, two temperature sensing elements can be arranged and symmetrically arranged on two sides of the base respectively so as to detect the temperature data of the medium entering the pressure inlet on two sides simultaneously.
Specifically, as shown in fig. 1, in some embodiments, the differential temperature-pressure sensor 100 includes a temperature-sensing element 130, the temperature-sensing element 130 is disposed on the left side of the base 110, that is, corresponding to the pressure-sensing component on the left side, and is located on the first side of the pressure-sensing chip 122 along the width direction of the base 110, and the temperature-sensing element 130 is located in the silicone oil, so as to transmit the temperature of the media at the left pressure inlet 111 to the temperature-sensing element through the pressure-sensing film 121 and the silicone oil sealed inside, so as to implement the detection of the temperature data of the media at the left pressure inlet.
It should be understood that in other embodiments, when the differential temperature-pressure sensor includes a temperature-sensing element, the temperature-sensing element may also be disposed on the right side of the base, that is, corresponding to the pressure-sensing assembly on the right side, and also on the first side of the pressure-sensing chip in the width direction of the base, and the temperature-sensing element is located in the silicone oil, so as to transmit the temperature of the right pressure inlet medium to the temperature-sensing element through the pressure-sensing film and the silicone oil sealed inside, so as to realize the detection of the temperature data of the right pressure inlet medium.
It should also be understood that in other embodiments, when the differential pressure temperature-pressure sensor includes two temperature sensing elements, the two temperature sensing elements are symmetrically disposed on two sides of the base, as shown in fig. 2, the two temperature sensing elements 130 correspond to the left and right pressure sensing assemblies 120, respectively, and each temperature sensing element 130 is also disposed on a first side of the corresponding pressure sensing chip 122 along the width direction of the base 110; and each temperature sensing element 130 is located in the silicone oil, so that the temperature of the media entering the pressure inlet at the two sides is transmitted to the temperature sensing element through the pressure sensing film and the silicone oil sealed inside, and the temperature data of the media entering the pressure inlet at the two sides can be detected simultaneously.
It should be noted that, the temperature sensing element in the above embodiments is not specifically limited, for example, a PT1000 platinum resistor may be adopted, and the platinum resistor does not directly contact the measured medium, that is, the foreign matter does not directly act on the PT1000 platinum resistor, and the specific operation principle is as follows: when the PT1000 is at 0 deg.C, its resistance value is 1000 ohm, and its resistance value is linearly changed with temp. so as to implement detection of temp. data.
Further, as shown in fig. 1 and fig. 2, each of the pressure sensing chips 122 of the present embodiment is provided with a silicone oil filling cavity 151 and a sealing member 152 along a second side of the base 110 in the width direction; wherein, one end of the silicone oil filling cavity 151 is disposed through the base 110 and communicated with the silicone oil, the other end of the silicone oil filling cavity 151 extends to the outside of the base 110, and the sealing member 152 is located at the other end of the silicone oil filling cavity 151 to seal the silicone oil filling cavity. That is to say, the silicone oil filling cavity of this embodiment has one end located outside the base, and one end communicates the silicone oil between pressure sensing chip and the pressure sensing diaphragm to inject the silicone oil into the base through the port of silicone oil filling cavity towards the outside of the base, and seal the silicone oil inside the base, in order to transmit the pressure signal and the temperature signal of the pressure inlet medium.
The silicone oil adopted by the embodiment has the advantages of low expansion coefficient, small temperature drift of the sensor, stable temperature characteristic and the like, and can effectively improve the efficiency of signal transmission.
It should be noted that the present embodiment is not limited to a sealing member, for example, a steel ball may be used to seal the silicone oil filling cavity, and of course, other sealing members may be selected by those skilled in the art.
Further, for improving differential pressure sensor's sensitivity, the thickness of present simple increase pressure sensing face or increase line quantity all can influence the silicon oil volume balance in the differential pressure sensor, and the unbalance of oil mass can lead to differential pressure sensor at different environment operating temperature, and the inflation takes place for silicon oil, and is different to the dynamics of beating of pressure sensing chip, can cause the deviation of differential pressure sensor precision like this, and based on this problem, this embodiment has still set up stress release ring to prescribe a limit to the silicon oil volume.
Specifically, as shown in fig. 1 and 2, in some embodiments, each of the pressure-sensing chips 122 is provided with a stress relief ring 160 on a first side and a second side in a width direction of the base 110; the stress release rings 160 on both sides are clamped in the silicone oil and the base 110, and the stress release ring 160 on the second side is communicated with the silicone oil filling cavity and the silicone oil to release the stress generated by the expansion of the silicone oil. It is understood that, because the volume of the silicone oil is increased, a large stress is generated, and sensitive components such as the pressure sensing chip are damaged to a certain extent, the stress release rings are respectively arranged on two sides of the pressure sensing chip in the embodiment, so as to limit the volume of the silicone oil between the pressure sensing chip and the pressure sensing diaphragm to the minimum volume, as long as pressure and temperature signals can be transmitted, and a large stress is prevented from being generated.
It should be noted that the stress relief ring is not particularly limited in this embodiment, and for example, a ceramic ring having a hollow structure may be used to inject silicone oil from the silicone oil filling cavity to between the pressure sensing chip and the pressure sensing diaphragm.
Optionally, as shown in fig. 1 and fig. 2, two sides of each pressure-sensing chip 122 along the width direction of the base 110 are further provided with pins 171 and leads 172, and each pin 171 penetrates through the base 110; wherein a first end of each lead 171 passes through the stress relief ring 160 and is located in the silicone oil, and is connected to the pressure sensing chip 122 and/or the temperature sensing element 130 through each lead 172, and a second end of each lead 171 extends to the outside of the base 110 to connect to an external electrical connector. That is, in the embodiment, since the stress release ring is a hollow structure, the pins can penetrate through the stress release ring and be inserted into the silicone oil, so that the first ends of the pins are located in the silicone oil and are connected with the pressure sensing chip through the leads, or are connected with the pressure sensing chip and the temperature sensing element through the leads at the same time.
Further, in other embodiments, as shown in fig. 1 and 2, a plurality of insulating sleeves 180 are disposed inside the base 110, and each of the pins 171 is disposed through the insulating sleeves 180.
It should be noted that, in this embodiment, the insulating sleeve is not specifically limited, and an electronic insulating glass may be adopted, that is, each pin is fixed on the base by sintering the electronic insulating glass.
It should be further noted that the lead is not limited in this embodiment, for example, a gold wire is used, i.e., a PT1000 platinum resistor is connected to the lead through the gold wire to output a temperature signal, and a pressure sensing chip is connected to the lead through the gold wire to output a pressure signal.
It should be understood that, because the base is symmetrically provided with the two pressure sensing assemblies, the two silicone oil filling cavities, the two steel ball sealing elements and the pins, the pins and the steel balls correspond to each other in the width direction of the base and are in an evenly distributed structure.
Based on above-mentioned structure, this embodiment encapsulates PT1000 platinum resistance and pressure sensing chip and porcelain ring at the left end of base, and another pressure sensing chip and porcelain ring encapsulation are at the right-hand member of base, pour into silicone oil into in the base, wholly adopt full stainless steel welded structure, realize the temperature of rated operating pressure 60MPa pipeline and high-pressure and low differential pressure's measurement. Because of the unique symmetrical design of the base, the PT1000 platinum resistor can be packaged at the right end of the base so as to measure the temperature data of different pressure inlets. Of course, the PT1000 PT resistor may be packaged on the right side, or the PT1000 PT resistors may be packaged on both ends, which is not particularly limited.
Compared with the prior art, the temperature-pressure differential pressure sensor based on the high static pressure structure has the following beneficial effects: the invention encapsulates the PT1000 platinum resistor and the pressure sensing chip in the stainless steel cavity, converts the medium temperature and the applied pressure into analog signals which can be sensed through the pressure port, simultaneously, external substances do not directly act on the PT1000 platinum resistor and the pressure sensing chip, and the invention adopts the encapsulation of the full stainless steel structure to realize the measurement of the temperature of the pipeline with the rated working pressure of 60MPa and the difference value of high pressure and low pressure. Secondly, due to the unique symmetrical design of the base, the PT1000 platinum resistor can be packaged at the right end or two ends of the base to realize the measurement of temperature data of different pressure inlets, the product can simultaneously measure temperature and pressure, low-pressure and high-pressure inlets can be exchanged according to the requirements of customers, the research and development types are reduced, and the time and the cost are saved.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (9)
1. A high hydrostatic pressure based differential temperature-pressure sensor, comprising: the temperature sensing device comprises a base, two pressure sensing assemblies and at least one temperature sensing element; wherein the content of the first and second substances,
the two sides of the base along the length direction are respectively provided with a pressure inlet;
the two pressure sensing assemblies are symmetrically arranged on two sides of the base, and each pressure sensing assembly corresponds to one pressure inlet so as to respectively detect pressure signals of media of the pressure inlets on the two sides of the base and obtain pressure difference data; wherein, the pressure sensing assembly comprises a pressure sensing film and a pressure sensing chip; wherein the content of the first and second substances,
the pressure sensing chip is arranged in the base, and the pressure sensing film is arranged between the pressure sensing chip and the pressure inlet; silicon oil is filled between the pressure sensing film and the pressure sensing chips, stress release rings are arranged on the first side and the second side of each pressure sensing chip along the width direction of the base, and the stress release rings on the two sides are clamped between the silicon oil and the base;
at least one temperature sensing element is arranged on at least one side of the base, and the temperature sensing element is positioned in the silicon oil and corresponds to the pressure inlet so as to detect the temperature data of the medium at the pressure inlet.
2. The differential temperature-pressure sensor based on the high static pressure structure, as claimed in claim 1, wherein the differential temperature-pressure sensor comprises a temperature sensing element, the temperature sensing element is disposed on a first side of any one of the pressure sensing chips along the width direction of the base.
3. The differential temperature-pressure sensor based on the high static pressure structure is characterized in that the differential temperature-pressure sensor comprises two temperature sensing elements, the two temperature sensing elements are symmetrically arranged on two sides of the base, and each temperature sensing element is arranged on a first side of the corresponding pressure sensing chip in the width direction of the base; and the temperature sensing element is positioned in the silicone oil.
4. The high hydrostatic pressure based temperature-pressure differential pressure sensor according to claim 2 or 3, wherein the temperature sensing element is a PT1000 platinum resistor.
5. The high static pressure structure-based differential temperature-pressure sensor according to claim 4, wherein each of the pressure sensing chips is provided with a silicone oil filling cavity and a sealing member along a second side of the base in the width direction; wherein the content of the first and second substances,
one end of the silicone oil filling cavity is arranged in the base in a penetrating mode and communicated with the silicone oil, the other end of the silicone oil filling cavity extends to the outside of the base, and the sealing element is located at the other end of the silicone oil filling cavity to seal the silicone oil filling cavity.
6. The high static pressure structure based differential temperature-pressure sensor according to claim 5, wherein the stress relief ring on the second side of the pressure sensing chip is communicated with the silicone oil filling cavity and the silicone oil to relieve the stress generated by the expansion of the silicone oil.
7. The high static pressure structure-based differential temperature-pressure sensor according to claim 6, wherein each pressure sensing chip is further provided with pins and leads along both sides of the base in the width direction, and each pin is arranged in the base in a penetrating manner; wherein the content of the first and second substances,
the first end of each pin penetrates through the stress release ring and is positioned in the silicon oil, and is connected with the pressure sensing chip and/or the temperature sensing element through each lead;
the second end of each pin extends to the outside of the base.
8. The high static pressure configuration based differential temperature-pressure sensor of claim 7 wherein a plurality of insulative sleeves are provided within said base, each of said pins being disposed through said insulative sleeves.
9. The high static pressure structure based temperature-pressure differential pressure sensor according to any one of claims 5 to 8, further comprising a plurality of connecting members, each connecting the base and the corresponding pressure sensing diaphragm.
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| CN205664864U (en) * | 2016-05-25 | 2016-10-26 | 南京高华科技股份有限公司 | Band number word temperature compensating's voltage output oil charge core pressure sensor |
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