CN112092086B - Dustless drilling equipment is used in printed circuit board processing - Google Patents
Dustless drilling equipment is used in printed circuit board processing Download PDFInfo
- Publication number
- CN112092086B CN112092086B CN202010938271.7A CN202010938271A CN112092086B CN 112092086 B CN112092086 B CN 112092086B CN 202010938271 A CN202010938271 A CN 202010938271A CN 112092086 B CN112092086 B CN 112092086B
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- printed circuit
- assembly
- circuit board
- pipe
- suction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
- B26D7/1845—Means for removing cut-out material or waste by non mechanical means
- B26D7/1863—Means for removing cut-out material or waste by non mechanical means by suction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
- B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
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- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Drilling And Boring (AREA)
Abstract
The invention provides dustless drilling equipment for processing a printed circuit board, which relates to the field of drilling of the printed circuit board and comprises a supporting seat and a three-axis moving assembly, wherein the three-axis moving assembly is fixed at the top end of the supporting seat; bottom cleaning device is including inhaling row's subassembly and supporting cleaning assembly, vertically is provided with in the spacing frame of panel and inhales the row's subassembly, inhales the below that the row's subassembly is in printed circuit board, inhales the front and back both ends of row's subassembly and is connected with the lateral shifting subassembly, lateral shifting subassembly swing joint is in the spacing frame department of panel, gives printed circuit board support dynamics to prevent that the rig from hitting in the brill many times, concentrate on panel department repeatedly because of pressure, the printed circuit board deformation problem that causes.
Description
Technical Field
The invention relates to the field of printed circuit board drilling, in particular to a dust-free drilling device for processing a printed circuit board.
Background
The printed circuit board drilling machine is a machine applied to a drilling process in the PCB processing process, namely, before the printed circuit board is provided with components, a small hole needs to be drilled on the board to enable pins of the components to be inserted, or circuits on different layers are conducted up and down, so that the purpose of fixing devices in the pin inserting hole positions of electronic components is achieved.
The existing drilling machine discharges powder on the upper surface of a printed circuit board only by being located on a drill bit and sucking and discharging components in the drilling operation of the printed circuit board, and more powder is still remained on the lower surface of the printed circuit board at the edge of a drilled hole in the sucking and discharging process, so that the powder is remained, the overall attractiveness of the board can be influenced, the subsequent cleaning process needs to be added on the other hand, and the problem of production cost rise is caused.
Disclosure of Invention
The invention aims to provide dust-free drilling equipment for processing a printed circuit board, which aims to solve the technical problem.
In order to solve the technical problems, the invention adopts the following technical scheme: the utility model provides a printed circuit board processing is with dustless drilling equipment, includes supporting seat and triaxial removal subassembly, its characterized in that: a three-axis moving assembly is fixed at the top end of the supporting seat, a drilling machine is fixed at the front end of the three-axis moving assembly, a bottom layer cleaning device is arranged below the drilling machine, the left end and the right end of the bottom layer cleaning device are fixed at the supporting frame, and a fixing groove position for a printed circuit board is arranged at the port of the top end of the bottom layer cleaning device;
the bottom layer cleaning device comprises a suction assembly and a supporting cleaning assembly, the suction assembly is longitudinally arranged in the plate limiting frame and is positioned below the printed circuit board, the front end and the rear end of the suction assembly are connected with transverse moving assemblies, and the transverse moving assemblies are movably connected to the plate limiting frame; the top end of the suction and discharge assembly is movably embedded with a supporting and cleaning assembly at the left and right positions, and the surface of the supporting and cleaning assembly is in a state of being attached to the end surface of the bottom end of the printed circuit board.
Preferably, the suction and exhaust assembly comprises a U-shaped baffle plate and an airflow adjusting assembly, the U-shaped baffle plate is arranged in the inner concave pipe, and the front end and the rear end of the U-shaped baffle plate are fixed on the front inner wall and the rear inner wall of the inner concave pipe; and the air flow adjusting assemblies are arranged at the concave positions of the inner concave pipes in a penetrating way.
Preferably, the supporting and cleaning component comprises a contact rod and rod grooves, the rod grooves are formed in the left side and the right side of the concave position of the suction and discharge component, the contact rod is arranged in the rod grooves in a rolling mode, and the surface of the contact rod is connected with cleaning fluff.
Preferably, one end of the exhaust pipe penetrates through the center of the rear end of the suction and exhaust assembly, and one end of the air inlet pipe penetrates through the center of the front end of the suction and exhaust assembly; the U-shaped baffle plate divides the inner concave pipe into two regions, and the area is gushed for the air current below the U-shaped baffle plate in being located the inner concave pipe, and the area is discharged for the air current above the U-shaped baffle plate being located the inner concave pipe, and the honeycomb duct has been run through on the surface of U-shaped baffle plate, and the one end and the intake-tube connection of honeycomb duct, the other end of honeycomb duct run through to the air current gush in the area.
Preferably, the airflow adjusting assembly comprises a rotary rod, air holes and a dust pipe, the dust pipe is arranged at the concave part of the inner concave pipe in a penetrating way, and the air holes are arranged on the surface of the dust pipe above the concave part of the suction assembly in a penetrating way; the rotating rod is screwed in the dust pipe.
Preferably, the left side and the right side of the contact rod are provided with extension edges at the positions of the rod grooves, and the extension edges are in a clearance state with the printed circuit board when the contact rod contacts the printed circuit board.
Preferably, the left end and the right end of the U-shaped baffle plate are arranged at the inverted V-shaped cutting edges, and the surface of the contact rod and the left top edge and the right top edge of the U-shaped baffle plate are arranged at an upper gap and a lower gap.
Preferably, the diameter of the air hole is gradually reduced to a closed state when the rotary rod rotates downwards relative to the dust pipe.
The invention has the beneficial effects that:
1. the invention provides a supporting force for the printed circuit board based on the rolling support of the supporting and cleaning component to prevent the deformation of the printed circuit board caused by repeated concentration of pressure on the board during multiple drilling of the drilling machine.
2. According to the invention, the surface of the printed circuit board after drilling is cleaned in a rolling manner based on the rolling contact between the contact rod and the printed circuit board, and after the cleaning, the air flow jacking pressure formed in the air flow inflow area through the air inlet pipe is used for flushing the dust remained on the surface of the contact rod after the cleaning, so that the air flow with the dust is discharged from the exhaust pipe under the condition that the exhaust pipe forms negative pressure in the pipe from the concave pipe.
3. According to the invention, the airflow adjusting component is used for absorbing the dust accumulated above the inner concave pipe, so that the airflow with the dust is discharged from the exhaust pipe on the premise that the exhaust pipe forms negative pressure in the pipe from the inner concave pipe, and the problem of dust accumulation caused by the fact that the falling dust is accumulated in the concave part of the inner concave pipe is avoided.
Drawings
FIG. 1 is a schematic front view of a dust-free drilling apparatus for processing printed circuit boards according to the present invention;
FIG. 2 is a schematic view of the overall structure of the bottom layer cleaning apparatus of the present invention;
FIG. 3 is a cross-sectional view of the cleaning assembly of the present invention;
FIG. 4 is a schematic rear sectional view of the suction assembly of the present invention;
FIG. 5 is a schematic front sectional view of the suction assembly of the present invention;
FIG. 6 is a schematic side sectional view of a suction cup assembly according to the present invention;
FIG. 7 is a schematic front view of the airflow adjustment assembly of the present invention;
reference numerals: 1. a supporting seat; 2. a three-axis moving assembly; 3. a drilling machine; 4. a bottom layer cleaning device; 41. a plate limiting frame; 42. a suction assembly; 43. supporting a cleaning assembly; 44. a lateral movement assembly; 45. an exhaust pipe; 46. an air inlet pipe; 421. a U-shaped baffle plate; 422. a gas flow regulating assembly; 423. an inwardly concave tube; 424. a flow guide pipe; 431. a contact lever; 432. a rod groove; 4221. rotating the rod; 4222. air holes; 4223. a dust pipe.
Detailed Description
In order to make the technical means, the original characteristics, the achieved purposes and the effects of the invention easily understood, the invention is further described below with reference to the specific embodiments and the attached drawings, but the following embodiments are only the preferred embodiments of the invention, and not all embodiments. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative efforts belong to the protection scope of the present invention.
Specific embodiments of the present invention are described below with reference to the accompanying drawings.
Example 1
As shown in fig. 1-2, a dust-free drilling device for processing a printed circuit board comprises a supporting seat 1 and a three-axis moving assembly 2, wherein the three-axis moving assembly 2 is fixed at the top end of the supporting seat 1, a drilling machine 3 is fixed at the front end of the three-axis moving assembly 2, a bottom layer cleaning device 4 is arranged below the drilling machine 3, the left end and the right end of the bottom layer cleaning device 4 are fixed at a supporting frame, and a fixed slot position for the printed circuit board is arranged at the port of the top end of the bottom layer cleaning device 4;
the bottom layer cleaning device 4 comprises a suction assembly 42 and a supporting cleaning assembly 43, the suction assembly 42 is longitudinally arranged in the plate limiting frame 41, the suction assembly 42 is positioned below the printed circuit board, the front end and the rear end of the suction assembly 42 are connected with transverse moving assemblies 44, and the transverse moving assemblies 44 are movably connected to the plate limiting frame 41; the top end of the suction and exhaust assembly 42 is movably embedded with a supporting and cleaning assembly 43 at the left and right positions, and the surface of the supporting and cleaning assembly 43 is in a state of being attached to the bottom end surface of the printed circuit board.
In this embodiment, the supporting and cleaning assembly 43 is in rolling contact with the printed circuit board, and the rolling contact gives a supporting force to the board to prevent the deformation of the printed circuit board caused by repeated concentration of pressure on a certain position of the board during multiple drilling operations of the drilling machine 3, and the rolling contact peels off the adhered dust remaining on the lower surface of the printed circuit board, and most of the peeled dust is concentrated on the concave part of the suction and exhaust assembly 42, so that a negative pressure is formed at the exhaust pipe 45 from the suction and exhaust assembly 42 to exhaust the dust, and a small part of the peeled dust is adhered to the supporting and cleaning assembly 43, and at this time, an air flow can be introduced into the suction and exhaust assembly 42 through the air inlet pipe 46, so that the supporting and cleaning assembly 43 is cleaned at the air flow passage provided in the suction and exhaust assembly 42, and the air flow with the dust is exhausted from the exhaust pipe 45 after cleaning, so as to achieve the purpose of efficiently cleaning the bottom layer of the printed circuit board.
Example 2
As shown in fig. 4-7, in a dust-free drilling device for processing a printed circuit board, a suction assembly 42 includes a U-shaped baffle 421 and an airflow adjusting assembly 422, the U-shaped baffle 421 is disposed in an inner concave pipe 423, and front and rear ends of the U-shaped baffle 421 are fixed to front and rear inner walls of the inner concave pipe 423; an air flow adjusting assembly 422 is arranged at the concave position of the inner concave pipe 423 in a penetrating manner, the air flow adjusting assembly 422 comprises a rotary rod 4221, an air hole 4222 and a dust pipe 4223, the dust pipe 4223 is arranged at the concave position of the inner concave pipe 423 in a penetrating manner, the air hole 4222 is arranged on the surface of the dust pipe 4223 above the concave position of the suction and exhaust assembly 42 in a penetrating manner, and the rotary rod 4221 is connected in the dust pipe 4223 in a rotating manner; one end of an exhaust pipe 45 penetrates through the center of the rear end of the suction and exhaust assembly 42, and one end of an air inlet pipe 46 penetrates through the center of the front end of the suction and exhaust assembly 42; the U-shaped baffle 421 divides the concave pipe 423 into two areas, the air flow inflow area is located in the concave pipe 423 below the U-shaped baffle 421, the air flow discharge area is located in the concave pipe 423 above the U-shaped baffle 421, the flow guide pipe 424 penetrates through the surface of the U-shaped baffle 421, one end of the flow guide pipe 424 is connected with the air inlet pipe 46, and the other end of the flow guide pipe 424 penetrates into the air flow inflow area.
In this embodiment, the air inlet pipe 46 guides the air flow into the air flow inflow area, so that after the contact rod 431 is cleaned by the U-shaped baffle 421 in a surface rolling manner, the air flow with the dust after cleaning is guided into the air flow discharge area through the gap between the U-shaped baffle 421 and the contact rod 431, and when the contact rod 431 is cleaned, negative pressure is formed in the air flow discharge area through the exhaust pipe 45, so that the air flow adjusting assembly 422 penetrates through the concave part of the concave pipe 423, the falling dust above the concave part is sucked, and under the action of the negative pressure in the concave pipe 423, the dust is discharged from the exhaust pipe 45.
In this embodiment, the size of the aperture of the air hole 4222 can be adjusted, that is, during the rotation of the rotary rod 4221 downward relative to the dust pipe 4223, the air hole 4222 is gradually covered by the rotary rod 4221 until the air hole 4222 is in a closed state, in the process of adjusting the air hole 4222 by the rotary rod 4221, when the pipe pressure of the concave pipe 423 is fixed, the smaller the aperture of the air hole 4222 is, the larger the suction force is, and conversely, the larger the aperture of the air hole 4222 is, the matched state is that the suction force is in a descending state.
Example 3
As shown in fig. 3-5, a dust-free drilling device for processing a printed circuit board, wherein a supporting cleaning assembly 43 comprises a contact rod 431 and a rod groove 432, the left side and the right side of a concave part of a suction assembly 42 are provided with the rod groove 432, the contact rod 431 is arranged in the rod groove 432 in a rolling manner, the surface of the contact rod 431 is connected with cleaning fluff, the left side and the right side of the contact rod 431 are provided with extension edges at the position of the rod groove 432, the extension edges are in a clearance state with the printed circuit board when the contact rod 431 contacts the printed circuit board, the left end and the right end of a U-shaped baffle 421 are arranged at inverted V-shaped cutting edges, and the surface of the contact rod 431 and the left top edge and the right top edge of the U-shaped baffle 421 are arranged at an up-down clearance.
In this embodiment, the contact rod 431 is rolled to contact the pcb to provide a supporting force to the pcb, so as to prevent the deformation of the pcb caused by the pressure repeatedly concentrated on the pcb by the drilling machine 3, and the contact rod 431 is rolled to clean the dust remained on the lower surface of the pcb, and the dust on the surface of the contact rod 431 is scraped by the contact rod 431 contacting the contact rod 431 through the left and right top edges of the U-shaped partition 421 after cleaning, and the scraped dust is guided into the air flow discharging area to be discharged through the gap formed from the U-shaped partition 421 to the contact rod 431 by the jacking air flow introduced into the air flow injecting area after scraping, which can prevent the contact rod 431 from remaining on the surface of the contact rod 431 due to the dust after rolling cleaning the pcb, therefore, when the subsequent rolling support and rolling cleaning are carried out, the dust is adhered to the surface of the board again, and the problem of the dust adhesion of the surface of the printed circuit board after cleaning is caused.
The working principle is as follows: after the invention is installed, when the invention is needed, the three-axis moving assembly 2 performs the drilling operation on the printed circuit board which is arranged at the bottom layer cleaning device 4 by controlling the drilling position of the drilling machine 3, the upper layer dust suction assembly which is arranged beside the drilling machine 3 during the drilling operation performs the suction and exhaust treatment on the drilling dust remained on the upper surface of the printed circuit board, the bottom layer cleaning device 4 performs the cleaning operation on the lower surface of the printed circuit board after supporting, the bottom layer cleaning device 4 comprises six structures of a board limiting frame 41, a suction and exhaust assembly 42, a supporting and cleaning assembly 43, a transverse moving assembly 44, an exhaust pipe 45 and an air inlet pipe 46 during the setting, and the six structures are used in combination, the supporting and cleaning assembly 43 is in rolling contact with the printed circuit board to give the supporting force to the board so as to prevent the drilling machine 3 from repeatedly concentrating on a certain place of the board due to pressure during multiple drilling, the problem of deformation of the printed circuit board is caused, adhesion dust remained on the lower surface of the printed circuit board is stripped in rolling contact, most of the stripped dust is concentrated at the concave position of the suction and discharge assembly 42, negative pressure is formed at the suction and discharge assembly 42 of the exhaust pipe 45 to discharge the dust, a small part of the stripped dust is adhered to the supporting and cleaning assembly 43, the air flow can be guided into the suction and discharge assembly 42 through the air inlet pipe 46, the supporting and cleaning assembly 43 is cleaned at the air flow channel arranged in the suction and discharge assembly 42, and the air flow with the dust is discharged from the exhaust pipe 45 after being cleaned, so that the purpose of efficiently cleaning the bottom layer of the printed circuit board is achieved.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (5)
1. The utility model provides a printed circuit board processing is with dustless drilling equipment, includes supporting seat (1) and triaxial removal subassembly (2), its characterized in that: a three-axis moving assembly (2) is fixed at the top end of the supporting seat (1), a drilling machine (3) is fixed at the front end of the three-axis moving assembly (2), a bottom layer cleaning device (4) is arranged below the drilling machine (3), the left end and the right end of the bottom layer cleaning device (4) are fixed at the supporting frame, and a fixing groove position for a printed circuit board is arranged at the port of the top end of the bottom layer cleaning device (4);
the bottom layer cleaning device (4) comprises a suction and discharge assembly (42) and a supporting and cleaning assembly (43), the suction and discharge assembly (42) is longitudinally arranged in the plate limiting frame (41), the suction and discharge assembly (42) is positioned below the printed circuit board, the front end and the rear end of the suction and discharge assembly (42) are connected with transverse moving assemblies (44), and the transverse moving assemblies (44) are movably connected to the plate limiting frame (41); the top end of the suction and discharge assembly (42) is movably embedded with a supporting and cleaning assembly (43) at the left and right positions, and the surface of the supporting and cleaning assembly (43) is in a state of being attached to the bottom end surface of the printed circuit board;
the suction and exhaust assembly (42) comprises a U-shaped baffle plate (421) and an airflow adjusting assembly (422), the U-shaped baffle plate (421) is arranged in the inner concave pipe (423), and the front end and the rear end of the U-shaped baffle plate (421) are fixed on the front inner wall and the rear inner wall of the inner concave pipe (423); the air flow adjusting components (422) are arranged at the concave positions of the inner concave pipes (423) in a penetrating way;
one end of an exhaust pipe (45) penetrates through the center of the rear end of the suction and exhaust assembly (42), and one end of an air inlet pipe (46) penetrates through the center of the front end of the suction and exhaust assembly (42); the U-shaped baffle plate (421) divides the concave pipe (423) into two areas, an airflow inflow area is positioned in the concave pipe (423) below the U-shaped baffle plate (421), an airflow discharge area is positioned in the concave pipe (423) above the U-shaped baffle plate (421), a flow guide pipe (424) penetrates through the surface of the U-shaped baffle plate (421), one end of the flow guide pipe (424) is connected with the air inlet pipe (46), and the other end of the flow guide pipe (424) penetrates into the airflow inflow area;
the supporting and cleaning assembly (43) comprises a contact rod (431) and rod grooves (432), the left side and the right side of the concave position of the suction and discharge assembly (42) are provided with the rod grooves (432), the contact rod (431) is arranged in the rod grooves (432) in a rolling mode, and the surface of the contact rod (431) is connected with cleaning fluff.
2. The dust-free drilling equipment for processing the printed circuit board as claimed in claim 1, wherein: the air flow adjusting assembly (422) comprises a rotary rod (4221), air holes (4222) and a dust pipe (4223), the dust pipe (4223) penetrates through the concave position of the inner concave pipe (423), and the air holes (4222) penetrate through the surface of the dust pipe (4223) above the concave position of the suction and exhaust assembly (42); a rotating rod (4221) is screwed in the dust pipe (4223).
3. The dust-free drilling equipment for processing the printed circuit board as claimed in claim 1, wherein: the left side and the right side of the contact rod (431) are provided with extended edges at the position of the rod groove (432), and the extended edges are in a clearance state with the printed circuit board when the contact rod (431) contacts the printed circuit board.
4. The dust-free drilling equipment for processing the printed circuit board as claimed in claim 1, wherein: the left end and the right end of the U-shaped baffle plate (421) are arranged at the inverted V-shaped cutting edges, and the surface of the contact rod (431) and the left top edge and the right top edge of the U-shaped baffle plate (421) are arranged at an upper gap and a lower gap.
5. A dust-free drilling apparatus for processing a printed circuit board according to claim 2, wherein: when the rotary rod (4221) rotates downwards relative to the dust pipe (4223), the pore diameter of the air hole (4222) gradually decreases to a closed state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010938271.7A CN112092086B (en) | 2020-09-09 | 2020-09-09 | Dustless drilling equipment is used in printed circuit board processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010938271.7A CN112092086B (en) | 2020-09-09 | 2020-09-09 | Dustless drilling equipment is used in printed circuit board processing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112092086A CN112092086A (en) | 2020-12-18 |
| CN112092086B true CN112092086B (en) | 2021-11-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010938271.7A Active CN112092086B (en) | 2020-09-09 | 2020-09-09 | Dustless drilling equipment is used in printed circuit board processing |
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| CN (1) | CN112092086B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114340181B (en) * | 2022-03-04 | 2022-05-27 | 深圳市盛鸿辉科技有限公司 | A perforation equipment for circuit board processing |
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| CN110167265A (en) * | 2018-03-30 | 2019-08-23 | 苏州吉耐特信息科技有限公司 | A kind of punch device of printed circuit board |
| CN111556657A (en) * | 2020-05-11 | 2020-08-18 | 安琰 | Circuit board and processing device and processing method thereof |
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2020
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101468561B1 (en) * | 2013-06-10 | 2014-12-03 | 주식회사 아이엠피이씨 | Substrate cutting apparatus locally collecting dust |
| CN107172813A (en) * | 2017-05-05 | 2017-09-15 | 重庆新派新智能科技有限公司 | Perforating device for circuit board |
| CN107350518A (en) * | 2017-08-24 | 2017-11-17 | 成都预细科技有限公司 | A kind of wiring board positions drilling equipment |
| CN108177191A (en) * | 2017-12-27 | 2018-06-19 | 刘嘉豪 | Circuit board processing punching platform |
| CN110167265A (en) * | 2018-03-30 | 2019-08-23 | 苏州吉耐特信息科技有限公司 | A kind of punch device of printed circuit board |
| CN208930912U (en) * | 2018-09-25 | 2019-06-04 | 东莞市国盈电子有限公司 | A kind of pcb plate printing machine of band cleaning tin bits device |
| CN111556657A (en) * | 2020-05-11 | 2020-08-18 | 安琰 | Circuit board and processing device and processing method thereof |
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| Publication number | Publication date |
|---|---|
| CN112092086A (en) | 2020-12-18 |
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