CN215453457U

CN215453457U - HDI circuit board micropore copper plating device

Info

Publication number: CN215453457U
Application number: CN202122263624.0U
Authority: CN
Inventors: 何海华; 汤永火; 彭登洋
Original assignee: Suichuan Shande Electronic Technology Co ltd
Current assignee: Suichuan Shande Electronic Technology Co ltd
Priority date: 2021-09-17
Filing date: 2021-09-17
Publication date: 2022-01-07
Anticipated expiration: 2031-09-17

Abstract

The utility model discloses a HDI circuit board micropore copper plating device which comprises a machine body and supporting legs, wherein a plurality of groups of fixing rods are symmetrically arranged on the surfaces of two sides in the machine body, and a fixing groove is formed in the surface of one side of the top of each fixing rod. According to the utility model, the gas outlet holes, the gas guide grooves, the placing box and the fixing columns are adopted, in use, holes are mostly formed in the surface of the circuit board, so that the circuit board is fixed through the fixing columns and can move randomly in subsequent operation, damage caused by friction is avoided, then the circuit board is placed into the plating solution, and gas is continuously discharged through the gas outlet holes by the fan, so that the gas drives the plating solution to flow, the contact area of the plating solution and the circuit board is increased, the copper plating effect is improved, the gas is discharged through the gas guide grooves in an accelerated manner when being discharged, the flowing strength of the surrounding plating solution is increased, the placing box is driven to shake left and right, the contact between the plating solution and the circuit board is further improved, and the copper plating effect is good, and the damage to the circuit board is small.

Description

HDI circuit board micropore copper plating device

Technical Field

The utility model relates to the technical field of HDI circuit board copper plating, in particular to a micro-hole copper plating device for an HDI circuit board.

Background

The HDI circuit board is English abbreviation of High Density interconnect, and High Density interconnection manufacturing is a field with the fastest development in the printed circuit board industry.

In the in-service use process, the present HDI circuit board micropore copper plating device carries out the centre gripping with the circuit board most and then carries out the copper facing operation again, cause the damage to the circuit board at the in-process of centre gripping easily, influence holistic result of use, and can't carry out the copper facing operation owing to receiving to shelter from at the position of centre gripping, can cause the influence to holistic copper facing effect, and the dust of circuit board surface adhesion can drop in the copper facing operation and mix in the middle of the plating bath, can cause the influence to follow-up operation, certain limitation has.

An effective solution to the problems in the related art has not been proposed yet.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

Aiming at the defects of the prior art, the utility model provides the HDI circuit board micropore copper plating device which has the advantages of good copper plating effect, impurity collection and small circuit board damage, and further solves the problems in the background technology.

(II) technical scheme

In order to realize the advantages of good copper plating effect, impurity collection and small damage of the circuit board, the utility model adopts the following specific technical scheme:

the utility model provides a HDI circuit board micropore coppering device, includes fuselage body and supporting leg, a plurality of dead levers of group are installed to the inside both sides surface position symmetry of fuselage body, dead lever top one side surface position is equipped with the fixed slot, the inside intermediate position joint of fixed slot has the fixed block, fixed block top surface position fixed mounting has the connecting plate, connecting plate bottom surface position is connected with through the pivot and places the case, it evenly installs a plurality of group's baffles to place incasement portion bottom surface position, baffle fixed mounting of position between two liang places the board, place board top surface position and evenly install a plurality of fixed columns of group, it has the collection string bag to place board bottom surface position butt, it offers a plurality of groups and supplies the orifice that plating bath flows and use to collect string bag surface position.

Further, the fixed mounting of inside bottom surface position of fuselage body has the outlet duct, outlet duct one end runs through fuselage body one side and fan sealing connection, a plurality of groups of ventholes are evenly installed to outlet duct one end surface position.

Furthermore, air guide grooves are symmetrically arranged on two sides of the surface of one end inside the machine body.

Furthermore, the supporting legs are symmetrically arranged on the two side surfaces of the bottom of the machine body.

Further, a plurality of groups of collecting plates are uniformly arranged on the surface of one end inside the machine body, and dense mesh cloth is symmetrically arranged on the surface of one side of each collecting plate.

Furthermore, a plurality of groups of channels for the flowing of plating solution are uniformly arranged on the surface of the placing box.

Furthermore, a plurality of groups of grooves for moving the gas and the plating solution are uniformly formed on the surface of one side of the gas guide groove.

Furthermore, a channel for connecting the fan and the air outlet pipe is formed in the middle of the surface of the bottom of the machine body.

(III) advantageous effects

Compared with the prior art, the utility model provides a HDI circuit board micropore copper plating device, which has the following beneficial effects:

(1) according to the utility model, the air outlet holes, the air guide grooves, the placing box and the fixing columns are adopted, in the actual use process, holes are mostly formed in the surface of the circuit board, so that the circuit board can be clamped and fixed through the fixing columns, the circuit board is prevented from moving randomly in subsequent operation, damage caused by friction is avoided, then the circuit board can be placed in the plating solution, gas is continuously discharged through the air outlet holes through the operation of the fan, the gas can drive the plating solution to flow, the contact area of the plating solution and the circuit board is increased, the copper plating effect is improved, the gas can be discharged at an accelerated speed through the air guide grooves when being discharged, the flowing strength of the surrounding plating solution is increased, the placing box is driven to shake left and right, the contact of the plating solution and the circuit board is further improved, and the copper plating effect is good, and the damage to the circuit board is small.

(2) According to the utility model, the collecting net bag and the compact net cloth are adopted, in the actual use process, due to the flowing of the plating solution, the plating solution can drive the impurities on the surface of the circuit board to flow, when the plating solution flows through the collecting net bag, the impurities can be filtered through the leak holes on the surface of the collecting net bag, the impurities are prevented from continuously moving, the circuit board is protected, and the impurities can be filtered and adsorbed through the compact net cloth during flowing, so that the impurity removing effect in the plating solution is further improved, and the advantage of impurity collecting is achieved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a HDI circuit board micropore copper plating device provided by the utility model;

FIG. 2 is a schematic view showing the structure of a collecting net according to the present invention;

FIG. 3 is a schematic view showing the connection of the standing board and the fixing post according to the present invention;

fig. 4 is a schematic view of the structure of the placing box of the present invention.

In the figure:

1. a body; 2. fixing the rod; 3. fixing grooves; 4. a fixed block; 5. a gas guide groove; 6. a connecting plate; 7. placing a box; 8. collecting the net bag; 9. placing the plate; 10. a partition plate; 11. fixing a column; 12. a leak hole; 13. compacting the mesh cloth; 14. a collection plate; 15. an air outlet; 16. an air outlet pipe; 17. supporting legs; 18. a fan.

Detailed Description

For further explanation of the various embodiments, the drawings which form a part of the disclosure and which are incorporated in and constitute a part of this specification, illustrate embodiments and, together with the description, serve to explain the principles of operation of the embodiments, and to enable others of ordinary skill in the art to understand the various embodiments and advantages of the utility model, and, by reference to these figures, reference is made to the accompanying drawings, which are not to scale and wherein like reference numerals generally refer to like elements.

According to the embodiment of the utility model, the HDI circuit board micropore copper plating device is provided.

Referring to the drawings and the detailed description, the utility model is further explained, as shown in fig. 1-4, the HDI circuit board micropore copper plating device according to the embodiment of the utility model comprises a machine body 1 and supporting legs 17, wherein a plurality of groups of fixing rods 2 are symmetrically arranged on the surface positions of two sides inside the machine body 1, a fixing groove 3 is arranged on one side surface position of the top of each fixing rod 2, a fixing block 4 is clamped in the middle position inside each fixing groove 3, a connecting plate 6 is fixedly arranged on the surface position of the top of each fixing block 4, the surface position of the bottom of each connecting plate 6 is connected with a placing box 7 through a rotating shaft, a plurality of groups of partition plates 10 are uniformly arranged on the surface position of the bottom inside the placing box 7, a placing plate 9 is fixedly arranged between every two partition plates 10, a plurality of groups of fixing columns 11 are uniformly arranged on the surface position of the top of the placing plate 9, and a collecting net bag 8 is abutted on the surface position of the bottom of the placing plate 9, the surface of the collecting net bag 8 is provided with a plurality of groups of leak holes 12 for the flowing of the plating solution.

In one embodiment, an air outlet pipe 16 is fixedly installed on the surface of the bottom end inside the machine body 1, one end of the air outlet pipe 16 penetrates through one side of the machine body 1 and is hermetically connected with a fan 18, a plurality of groups of air outlet holes 15 are evenly installed on the surface of one end of the air outlet pipe 16, and air can be continuously blown into the device through the fan 18, so that plating solution can flow, and copper plating operation of a circuit board is facilitated.

In one embodiment, the gas guide grooves 5 are symmetrically arranged on two sides of the surface of one end inside the machine body 1, and the gas guide grooves 5 can facilitate the moving use of gas and plating solution, so that the plating solution can better perform omnibearing copper plating operation on a circuit board, and the overall copper plating effect is improved.

In one embodiment, the supporting legs 17 are symmetrically arranged on the two side surfaces of the bottom of the machine body 1, and the device can be fixed through the supporting legs 17, so that the stability of the device is enhanced.

In one embodiment, a plurality of groups of collecting plates 14 are uniformly arranged on the surface of one end inside the machine body 1, a densified mesh 13 is symmetrically arranged on the surface of one side of each collecting plate 14, and the densified mesh 13 can adsorb impurities floating in the plating solution, so that the interference of the impurities on the circuit board is reduced, and the copper plating effect of the circuit board is improved.

In one embodiment, a plurality of groups of channels for flowing of the plating solution are uniformly formed on the surface of the placing box 7, and the plating solution can enter the placing box 7 conveniently due to the arrangement of the channels, so that the copper plating operation can be better performed on the circuit board.

In one embodiment, a plurality of groups of grooves for moving the gas and the plating solution are uniformly formed on the surface of one side of the gas guide groove 5, and the grooves facilitate the moving of the gas and the plating solution, so that the plating solution can better perform all-around copper plating operation on the circuit board, and the overall copper plating effect is improved.

In one embodiment, a channel for connecting the blower 18 and the air outlet pipe 16 is formed in the middle of the bottom surface of the body 1, and the formation of the channel facilitates the connection of the blower 18 and the air outlet pipe 16.

The working principle is as follows: in the practical use process, because holes are mostly arranged on the surface of the circuit board, the circuit board can be clamped and fixed through the fixing columns 11, the circuit board is prevented from moving randomly in the subsequent operation, the damage caused by friction is avoided, then the circuit board can be placed into the plating solution, the gas is continuously discharged through the air outlet holes 15 through the operation of the fan 18, the gas can drive the plating solution to flow, the contact area of the plating solution and the circuit board is increased, the copper plating effect is improved, the gas can be discharged at an accelerated speed through the air guide groove 5 when being discharged, the flowing strength of the surrounding plating solution is increased, the placing box 7 is driven to shake left and right, the contact between the plating solution and the circuit board is further improved, the copper plating effect is good, the damage of the circuit board is small, and the impurities on the surface of the circuit board can be driven to flow due to the flowing of the plating solution, when collecting string bag 8 when flowing through, can filter impurity through the small opening 12 on collecting string bag 8 surface, prevent that impurity from continuing to remove, play the guard action to the circuit board to also can filter impurity through fine and close screen cloth 13 when flowing and adsorb, further improve the effect of cleaing away of impurity in to the plating bath, have the advantage that impurity was collected, the device is whole to have the copper facing effectual, impurity is collected, the circuit board harm is little advantage.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "disposed," "connected," "secured," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims

1. The HDI circuit board micropore copper plating device comprises a machine body (1) and supporting legs (17), and is characterized in that a plurality of groups of fixing rods (2) are symmetrically installed on two side surface positions inside the machine body (1), a fixing groove (3) is formed in one side surface position on the top of each fixing rod (2), a fixing block (4) is clamped at an intermediate position inside each fixing groove (3), a connecting plate (6) is fixedly installed on the top surface position of each fixing block (4), a placing box (7) is connected to the bottom surface position of each connecting plate (6) through a rotating shaft, a plurality of groups of partition plates (10) are uniformly installed on the bottom surface position inside each placing box (7), a placing plate (9) is fixedly installed between every two partition plates (10), and a plurality of groups of fixing columns (11) are uniformly installed on the top surface position of the placing plate (9), the bottom surface of the placing plate (9) is connected with a collecting net bag (8) in an abutting mode, and a plurality of groups of leakage holes (12) for flowing of plating solution are formed in the surface of the collecting net bag (8).

2. An HDI circuit board micropore copper plating device according to claim 1, characterized in that, the surface position of the bottom end inside the fuselage body (1) is fixedly provided with an air outlet pipe (16), one end of the air outlet pipe (16) penetrates one side of the fuselage body (1) to be connected with a fan (18) in a sealing way, and a plurality of groups of air outlet holes (15) are uniformly arranged on the surface position of one end of the air outlet pipe (16).

3. An HDI circuit board micropore copper plating device according to claim 1, characterized in that air guide grooves (5) are symmetrically arranged on two sides of one end surface in the machine body (1).

4. An HDI circuit board micropore copper plating device according to claim 1, characterized in that, the fuselage body (1) bottom both sides surface position symmetry install supporting leg (17).

5. An HDI circuit board micropore copper plating device according to claim 1, characterized in that, a plurality of groups of collecting plates (14) are evenly installed on one end surface position inside the machine body (1), and a dense mesh (13) is symmetrically installed on one side surface position of the collecting plates (14).

6. An HDI circuit board micropore copper plating device according to claim 1, characterized in that, a plurality of groups of channels for plating solution to flow are evenly opened on the surface position of the placing box (7).

7. A HDI circuit board micropore copper plating device according to claim 3, characterized in that, a plurality of groups of grooves for gas and plating solution to move are evenly arranged on one side surface position of the gas guide groove (5).

8. An HDI circuit board micropore copper plating device as claimed in claim 1 wherein, the middle position of the bottom surface of the machine body (1) is provided with a channel for connecting the fan (18) and the air outlet pipe (16).