CN112086784A - 用于传输超高频信号的同轴线缆阳连接器 - Google Patents

用于传输超高频信号的同轴线缆阳连接器 Download PDF

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CN112086784A
CN112086784A CN202010536709.9A CN202010536709A CN112086784A CN 112086784 A CN112086784 A CN 112086784A CN 202010536709 A CN202010536709 A CN 202010536709A CN 112086784 A CN112086784 A CN 112086784A
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coaxial cable
inner conductor
shield
connector
exposed inner
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CN112086784B (zh
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金炳南
姜敬逸
韩相佑
疆智训
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Xinsiyou Co ltd
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    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
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    • H01R12/75—Coupling devices for rigid printing circuits or like structures connecting to cables except for flat or ribbon cables
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Abstract

本发明公开了用于传输超高频信号的同轴线缆阳连接器，该同轴线缆阳连接器使用在用于传输超高频信号的同轴线缆连接器中，并被接纳在安装在印刷电路板(PCB)上的连接器插接件中，以将多根同轴线缆连接至PCB。同轴线缆阳连接器包括：单根或多根同轴线缆，其各自包括内导体、外导体、电介质和护套，其中，外导体、电介质和护套被部分地剥开以使内导体在预定长度上暴露，并且暴露的内导体的端子与形成在PCB上的信号线端子焊盘电连接；以及屏蔽壳，其接纳单根或多根同轴线缆的暴露的内导体，固定并保护暴露的内导体的端部，并阻挡从内导体产生的电磁波。

Description

用于传输超高频信号的同轴线缆阳连接器
相关申请的交叉引用
本申请要求韩国专利申请No.10-2019-0145208的权益，其全部公开内容通过引用并入本文。
技术领域
本发明涉及连接器，并且更特别地涉及用于传输超高频信号的同轴线缆阳连接器，该同轴线缆阳连接器是PCB复式连接器的阳连接器，该阳连接器适于分别将作为信号线的同轴线缆内导体直接连接至印刷电路板上的电路信号线焊盘。
背景技术
图1是典型的PCB单连接器或复式连接器的截面图。在PCB单连接器或复式连接器中，包括阳连接器壳体112的阳连接器插入至并连接至安装在PCB上的阴连接器(或插接件)150，该阳连接器壳体对用于传输电信号的电信号线114的端子进行覆盖，电信号线比如为线缆或线。此处，阴连接器150的阴连接器壳体152设置有接纳在阳连接器中的端子(或引脚)的接纳构件154。然而，这种典型的PCB单连接器或复式连接器具有以下问题：很可能通过接纳构件154发生泄漏电流和噪声，从而导致信号损失，并且连接器的小型化受到限制。
发明内容
已经构思了本发明的实施方式以解决典型的单连接器或复式连接器的问题，并且本发明的一方面是提供一种用于传输超高频信号的同轴线缆阳连接器，其中，同轴线缆阳连接器是PCB复式连接器的阳连接器，PCB复式连接器包括阴连接器，该阴连接器仅包括安装在PCB上的壳体插接件，并且接纳阳连接器壳体，而没有用于在阳连接器中接纳同轴线缆端子的单独端子接纳构件，从而阳连接器中的同轴线缆端子可以分别与PCB上的电路信号线端子焊盘直接接触，该阳连接器适于允许同轴线缆内导体、即单根或多根超高频信号线分别与PCB上的端子焊盘直接接触，从而最大程度地减少信号损失并且通过连接器的高度上的显著减小来实现小型化。
根据本发明的一方面，提供了一种用于传输超高频信号的同轴线缆阳连接器，该同轴线缆阳连接器被接纳在安装于印刷电路板(PCB)上的连接器插接件中，以将单根或多根同轴线缆连接至PCB，同轴线缆阳连接器包括：单根或多根同轴线缆，所述单根或多根同轴线缆各自包括内导体、外导体、电介质和护套，其中，外导体，电介质和护套被部分地剥开以使内导体在预定长度上暴露，并且暴露的内导体的端子与形成在PCB上的信号线端子焊盘电连接；以及屏蔽壳，该屏蔽壳接纳单根或多根同轴线缆的暴露的内导体，固定并保护暴露的内导体的端部，并且阻挡从内导体产生的电磁波，其中，同轴线缆的内导体的端子形成在屏蔽壳的底表面上，以分别与形成在PCB上的信号线端子焊盘直接接触。屏蔽壳可以连接至同轴线缆的外导体，并且可以包括内导体接纳部分，该内导体接纳部分接纳相应的同轴线缆的暴露的内导体而联接至暴露的内导体，并且联接至内导体接纳部分的内导体在同轴线缆阳连接器坐置于PCB上时被电屏蔽。
同轴线缆阳连接器还可以包括：适配器，适配器各自在其一个端部处连接至同轴线缆的暴露的内导体中的对应的暴露的内导体，并且适配器各自在另一端部处连接至形成在PCB上的电路信号线端子焊盘中的对应的一个电路信号线端子焊盘，以使同轴线缆的内导体的端子与形成在PCB上的电路信号线端子焊盘之间易于接触，并且同轴线缆的内导体的端子经由适配器分别连接至形成在PCB上的电路信号线端子焊盘。屏蔽壳可以包括接纳适配器的适配器接纳部分，该适配器一对一地连接至同轴线缆的暴露的内导体，适配器接纳部分成形为单独地屏蔽适配器。屏蔽壳可以连接至同轴线缆的外导体；并且连接器插接件可以接纳屏蔽壳并且可以电连接至屏蔽壳和PCB的接地端子以对同轴线缆的暴露的内导体和适配器进行屏蔽。屏蔽壳可以包括：下部屏蔽构件，该下部屏蔽构件形成屏蔽壳的下部部分并且接纳同轴线缆的暴露的内导体，使得暴露的内导体的端部位于下部屏蔽构件上；上部屏蔽构件，该上部屏蔽构件对接纳在下部屏蔽构件中的同轴线缆的暴露的内导体进行覆盖；以及前部屏蔽构件，该前部屏蔽构件形成屏蔽壳的前部分，并且联接与下部屏蔽构件和上部屏蔽构件以对同轴线缆的暴露的内导体进行屏蔽。屏蔽壳可以包括：第一屏蔽构件，该第一屏蔽构件形成屏蔽壳的下部部分并接纳同轴线缆的暴露的内导体，使得暴露的内导体的端部位于第一屏蔽构件上；第二屏蔽构件，该第二屏蔽构件联接至第一屏蔽构件以对同轴线缆的暴露的内导体进行屏蔽。屏蔽壳可以是具有上部部分、下部部分和前部部分的屏蔽构件，该上部部分、下部部分和前部部分彼此一体地形成，该屏蔽构件具有底表面，同轴线缆的暴露的内导体的端部位于底表面上，并且该屏蔽构件适于对同轴线缆的暴露的内导体进行屏蔽。
根据本发明，与同轴线缆复式连接器的阳连接器对应的根据本发明的用于传输超高频信号的同轴线缆阳连接器被插入并紧固至连接器插接件，而无需用以接纳同轴线缆内导体端子的接纳构件，使得同轴线缆阳连接器中的信号线端子可以分别与PCB上的信号线端子焊盘直接接触，或者设置有适配器以使同轴线缆阳连接器中的信号线端子与PCB上的相应的信号线端子焊盘之间易于接触，从而减少泄漏电流，并且因此减少信号损失，同时通过减小连接器的紧固高度来使连接器最小化。
另外，根据本发明，作为连接至阳连接器的同轴线缆的屏蔽层的外导体连接至屏蔽壳，该屏蔽壳阻挡从作为同轴线缆的信号线的内导体产生的电磁波，并且安装在PCB上并连接至PCB的接地端子的连接器插接件通过接纳屏蔽壳与同轴线缆阳连接器的屏蔽盒接触并电连接，从而减少同轴线缆阳连接器中的信号线端子中的信号损耗，同轴线缆阳连接器中的信号线端子分别直接接触PCB上的电路信号端子焊盘。
附图说明
图1是典型的PCB复式连接器的侧视截面图；
图2是应用了本发明的用于传输超高频信号的同轴线缆连接器的示例的视图，其中，根据本发明的用于传输超高频信号的同轴线缆阳连接器未紧固至安装在PCB上的连接器插接件；
图3是应用了本发明的用于传输超高频信号的同轴线缆连接器的视图，其中，根据本发明的用于传输超高频信号的同轴线缆阳连接器紧固至安装在PCB上的连接器插接件；
图4是根据本发明的同轴线缆阳连接器和连接器插接件的仰视立体图；
图5是应用了本发明的用于传输超高频信号的同轴线缆连接器的连接器插接件的示例的立体分解图；
图6是连接至根据本发明的用于传输超高频信号的同轴线缆阳连接器的多根同轴线缆的示例的视图；
图7是构成根据本发明的用于传输超高频信号的同轴线缆阳连接器的示例性部件的视图；
图8是图2中所示的根据本发明的用于传输超高频信号的同轴线缆阳连接器沿着线VII-VII截取的截面图；
图9是图2所示的根据本发明的用于传输超高频信号的同轴线缆阳连接器的沿着线VIII-VIII截取的截面图；
图10是示出根据本发明的第一实施方式的同轴线缆阳连接器的组装过程的视图，其中，阳连接器的屏蔽壳由三个部件组成；
图11是示出了根据本发明的第二实施方式的同轴线缆阳连接器的组装过程的视图，其中，阳连接器的屏蔽壳由两个部件构成；以及
图12是示出根据本发明的第三实施方式的同轴线缆阳连接器的组装过程的视图，其中，阳连接器的屏蔽壳由一个部件构成。
具体实施方式
在下文中，将参照附图描述本发明的实施方式。将理解的是，说明书中描述的实施方式和附图不是穷举的，而仅仅是说明性的，并且在提交本申请时存在本发明的各种变型和等同实施方式。
应用了本发明的用于传输超高频信号的同轴线缆连接器是印刷电路板(PCB)连接器，该印刷电路板连接器将印刷电路板(PCB)连接至复式同轴线缆内导体，其中，复式同轴线缆内导体将电信号传输通过复式同轴线缆内导体，并且复式同轴线缆连接器包括阳连接器和连接器插接件。
图2是应用了本发明的用于传输超高频信号的同轴线缆连接器的示例的视图，该同轴线缆连接器具有根据本发明的用于传输超高频信号的同轴线缆阳连接器20，该同轴线缆阳连接器20未紧固至安装PCB 215上的连接器插接件225。图3是应用了本发明的用于传输超高频信号的同轴线缆连接器的视图，该同轴线缆连接器具有根据本发明的用于传输超高频信号的同轴线缆阳连接器20，该同轴线缆阳连接器20紧固至安装在PCB 215上的连接器插接件225。参照图2和图3，连接至同轴线缆240的同轴线缆复式连接器的壳体270、280、290插入并紧固至安装在PCB 125上的连接器插接件225。此处，通过使形成在根据本发明的同轴线缆阳连接器的底表面上的同轴线缆内导体端子分别与形成在PCB 215上的电路信号线端子焊盘接触，来建立PCB 215上的电路信号线端子焊盘与同轴线缆240的内导体之间的连接。
图4是根据本发明的用于传输超高频信号的同轴线缆阳连接器20和连接器插接件225的仰视立体图。图5是应用本发明的用于传输超高频信号的同轴线缆连接器的立体分解图，其示出了连接器插接件225和PCB 215。参照图4和图5，电缆信号线端子255形成在阳连接器20的底表面上。连接器插接件225可以包括紧固部分222，该紧固部分222被紧固至同轴线缆阳连接器20。连接器插接件225可以通过以下技术安装在PCB 215上：表面安装技术(SMT)、通孔安装技术或表面安装技术与通孔安装技术的组合，该通孔安装技术比如为单列直插式封装(SIP)技术、双列直插式封装(DIP)技术和四列直插式封装QIP技术。替代性地，连接器插接件225可以与PCB一体地形成，而不是与PCB分开地形成。
当用于传输超高频信号的同轴线缆阳连接器20的壳体270、280、290插入并紧固至安装在PCB 125上的连接器插接件225时，电缆信号线端子255分别与形成在PCB 215上的电路信号线端子焊盘214直接接触，而无需使用接纳同轴线缆信号线端子255的独立接纳构件。根据本发明，由于安装在PCB 125上的连接器插接件225未设置有用于接纳电缆信号线端子255的接纳构件，如图4中所示，连接器插接件的结构可以被简化，并且可以使得将连接器插接件紧固至用于传输超高频信号的、对应于阳连接器的同轴线缆阳连接器20所处的高度最小，从而允许连接器插接件实现小型化。应用了本发明的用于传输超高频信号的同轴线缆连接器可以将用于传输诸如RF信号和电源信号之类的电信号的信号线连接至PCB或电源，并且可以被应用于需要使相关连接器小型化的各种电子设备，比如平板电脑、笔记本电脑、5G智能手机和家用电器(例如电视、冰箱、洗衣机等)。
根据本发明的用于传输超高频信号的同轴线缆阳连接器被接纳在安装在PCB上的连接器插接件中，以将多根同轴线缆连接至PCB上的电路信号线端子焊盘，并且同轴线缆阳连接器包括多根同轴线缆240和屏蔽壳270、280、290。图6是连接至根据本发明的用于传输超高频信号的同轴线缆阳连接器20的同轴线缆30的示例的视图。多根同轴线缆中的每一根同轴线缆包括内导体210、外导体230、电介质220和护套240，其中，护套、外导体和电介质被剥开不同的长度，以使内导体暴露出预定的长度，并且已暴露的内导体210的端子与形成在PCB 215上的信号线端子焊盘214直接接触。即，如图4和图5中所示的，与形成在PCB 215上的各个信号线端子焊盘314直接接触的同轴线缆内导体端子255形成在下部屏蔽构件270的底表面上。
参照图6，同轴线缆30中的每根同轴线缆包括用作信号线的内导体210、外导体230、电介质220以及保护外导体230的护套(或外壳)，其中，外导体230由铝、铜等形成并阻挡由内导体210产生的电磁波，电介质220使内导体210相对于外导体230绝缘和隔离。内导体可以传输各种电信号，比如DC信号、微波信号和毫米波信号，特别是大约50GHz或更高的超高频信号。连接器插接件安装在PCB上，并且接纳屏蔽壳，该屏蔽壳是同轴线缆复式连接器的外壳，该屏蔽壳将紧固至用于传输超高频信号的同轴线缆阳连接器。
图7是构成根据本发明的用于传输超高频信号的同轴线缆阳连接器20的示例性部件的视图。根据本发明的用于传输超高频信号的同轴线缆阳连接器20包括同轴线缆30和屏蔽壳270、280、290，并且还可以包括适配器单元40。护套240、外导体230和同轴线缆30的电介质220被部分地剥开。同轴线缆30中的每个同轴线缆的外导体130可以连接至屏蔽壳270、280、290。屏蔽壳270、280、290接纳、保护并固定同轴线缆30，并阻止从同轴线缆的内导体210产生的电磁波。屏蔽壳270、280、290可以通过将下部屏蔽构件270、上部屏蔽构件280和前部屏蔽构件290彼此联接而形成。然而，将理解的是，本发明不限于此，并且屏蔽壳可以由两个部件组成，比如图11中所示的第一屏蔽构件310和第二屏蔽构件320，或者可以由一个屏蔽构件410构成，如图12中所示，该屏蔽构件410的上部部分、下部部分和前部部分彼此一体地形成。
适配器单元40包括多个适配器。适配器中的每个适配器42被成形为易于由屏蔽壳270、280、290、310、320、410屏蔽，并且允许同轴线缆30的内导体210与形成在PCB 215上的电路信号线端子焊盘214之间容易连接，并且每个适配器包括导体部分250和电介质部分260。导体部分250的一端部与PCB 215上的信号线端子焊盘214接触并连接，并且导体部分250的另一端部接纳并连接至信号线210，即同轴线缆30的内导体。当内导体、即电缆的信号线插入并连接至适配器42时，导体部分250的一端部与PCB215上的信号线端子焊盘214接触并连接，其中，导体部分250的一端部对应于图4的电缆信号线端子255。电介质部分260用于将接纳在屏蔽壳270、280、290、310、320、410中的导体部分250与屏蔽壳分离。
屏蔽壳270、280、290、310、320、410包括形成在其中的内导体接纳部分272或适配器接纳部分272，该内导体接纳部分272或适配器接纳部分272具有筒形部分，该筒形部分适于分别接纳适配器42，适配器42一对一地连接至单根或多根同轴线缆的内导体210。在省略适配器时，内导体接纳部分272设置成接纳暴露的内导体。内导体接纳部分272被成形为形成屏蔽壁，该屏蔽壁适于将接纳在内导体接纳部分中的已暴露的内导体彼此分离，并且在将下部屏蔽构件270联接至上部屏蔽构件280和前部屏蔽构件290时对暴露的内导体进行屏蔽。在提供适配器时，适配器接纳部分272设置成接纳连接至内导体的适配器42。适配器接纳部分272定形为形成屏蔽壁，该屏蔽壁适于将接纳在适配器接纳部分中的适配器彼此分离，并且在将下部屏蔽构件270联接至上部屏蔽构件280和前部屏蔽构件290时对适配器进行屏蔽。
图8是图2中所示的根据本发明的用于传输超高频信号的同轴线缆阳连接器20沿着线VII-VII截取的截面图，并且图9是图2所示的根据本发明的用于传输超高频信号的同轴线缆阳连接器20的沿着线VIII-VIII截取的截面图。参照图8和图9所示，在同轴线缆210、220、230、240和适配器250、260被屏蔽壳270、280、290接纳、保护和屏蔽的情况下，同轴线缆阳连接器20插入并紧固至安装在PCB 215上的连接器插接件225中。特别地，图9示出了屏蔽壁275，该屏蔽壁275通过将下部屏蔽构件270、上部屏蔽构件280和前部屏蔽构件290彼此联接而形成，其中，在对适配器进行屏蔽的同时，屏蔽壁将适配器彼此分开。
图10是示出对根据本发明的第一实施方式的同轴线缆阳连接器进行组装的过程的视图，其中，阳连接器的屏蔽壳由三个部件组成。参照图10，未剥开的同轴线缆60被剥开，然后将经剥开的同轴线缆30连接至适配器单元40，然后连接至适配器单元40的同轴线缆50坐置在下部屏蔽构件270上，该下部屏蔽构件270联接至上部屏蔽构件280和前部屏蔽构件290。
下部屏蔽构件270形成屏蔽壳的下部部分并且接纳同轴线缆的暴露的内导体，使得暴露的内导体的端部255位于下部屏蔽构件上。上部屏蔽构件280对接纳在下部屏蔽构件270中的同轴线缆的暴露的内导体进行覆盖。前部屏蔽构件290对应于屏蔽壳的前部分，并且联接至下部屏蔽构件270和上部屏蔽构件280以对同轴线缆的暴露的内导体进行屏蔽。
图11是示出对根据本发明的第二实施方式的同轴线缆阳连接器进行组装的过程的视图，其中，阳连接器的屏蔽壳由两个部件组成。参照图11，未剥开的同轴线缆60被剥开，然后经剥开的同轴线缆30连接至适配器单元40，然后连接至适配器单元40的同轴线缆50坐置在第一屏蔽构件310上，该第一屏蔽构件310又联接至第二屏蔽构件255。第一屏蔽构件310形成屏蔽壳的下部部分，并且接纳同轴线缆的暴露的内导体，使得暴露的内导体的端部255位于第一屏蔽构件上。
图12是示出对根据本发明的第三实施方式的同轴线缆阳连接器进行组装的过程的视图，其中，阳连接器的屏蔽壳由一个部件组成。参照图12，未剥开的同轴线缆60被剥开，然后经剥开的同轴线缆30连接至适配器单元40，然后连接至适配器单元40的同轴线缆50坐置在屏蔽构件410上，屏蔽构件410具有彼此一体形成的上部部分、下部部分以及前部部分。屏蔽构件410对同轴线缆的暴露的内导体进行屏蔽，并且具有底表面，同轴线缆的暴露的内导体的端部或者连接至内导体的适配器的端子255位于该底表面上。
根据本发明的用于传输超高频信号的同轴线缆阳连接器可以提供抵抗由同轴线缆的用作信号线的暴露的内导体所产生的电磁波的最大的屏蔽。具体地，连接至根据本发明的同轴线缆阳连接器的多根同轴线缆的暴露的内导体彼此分开，并且分别被屏蔽壳内侧的内导体接纳部分或适配器接纳部分的屏蔽壁来屏蔽，并且根据本发明的同轴线缆阳连接器20的屏蔽壳270、280、290、310、320、410连接至同轴线缆30的外导体230。由导体形成的连接器插接件215连接至PCB 215的接地端子。当同轴线缆阳连接器20插入并紧固至安装在PCB 215上的连接器插接件225时，连接至同轴线缆30的外导体230的同轴线缆阳连接器20的屏蔽壳270、280、290、310、320、410与连接至PCB 215的接地端子的连接器插接件225接触并连接，由此提供抵抗从同轴线缆阳连接器中的信号线端子产生的电磁波的最大程度的屏蔽，该同轴线缆阳连接器中的信号线端子分别直接接触PCB 215上的电路信号线端子焊盘214。
尽管本文已经参照附图描述了一些实施方式，但是本领域技术人员应该理解的是，这些实施方式仅是为了说明而给出的，并且本发明不限于此，在不脱离本发明的精神和范围的情况下，本领域技术人员可以做出各种改型、变型和变更。因此，本发明的范围应仅由所附权利要求及其等同方案限制。
<附图标记列表>
110：阳连接器 112：阳连接器壳体
114：电信号线 150：阴连接器
152：阴连接器壳体 154：端子(引脚)接纳构件
20：同轴线缆阳连接器 210：内导体(信号线)
214：PCB端子焊盘 215：印刷电路板(PCB)
220：电介质 222：紧固部分
225：连接器插接件 230：外导体(屏蔽层)
240：护套(外壳) 250：适配器导体部分
260：适配器电介质部分 270：下部屏蔽构件
272：适配器接纳部分 280：上部屏蔽构件
290：前部屏蔽构件
30：同轴线缆 40：适配器单元
42：适配器 410：屏蔽构件
50：连接至适配器的同轴线缆
60：未剥开的同轴线缆

Claims (8)

1.一种用于传输超高频信号的同轴线缆阳连接器，所述同轴线缆阳连接器被接纳在安装于印刷电路板(PCB)上的连接器插接件中，以将单根或多根同轴线缆连接至所述印刷电路板，所述同轴线缆阳连接器包括：
单根或多根同轴线缆，所述单根或多根同轴线缆各自包括内导体、外导体、电介质和护套，其中，所述外导体、所述电介质和所述护套被部分地剥开以使所述内导体在预定长度上暴露，并且暴露的内导体的端子与形成在所述印刷电路板上的信号线端子焊盘电连接；以及
屏蔽壳，所述屏蔽壳接纳所述单根或多根同轴线缆的所述暴露的内导体、固定并保护所述暴露的内导体的端部、并且阻挡从所述内导体产生的电磁波，
其中，所述同轴线缆的所述内导体的端子形成在所述屏蔽壳的底部表面上，以分别与形成在所述印刷电路板上的所述信号线端子焊盘直接接触。
2.根据权利要求1所述的同轴线缆阳连接器，其中，所述屏蔽壳连接至所述同轴线缆的所述外导体，并且包括内导体接纳部分，所述内导体接纳部分接纳相应的同轴线缆的暴露的内导体而联接至所述暴露的内导体；并且当所述同轴线缆阳连接器坐置在所述印刷电路板上时，联接至所述内导体接纳部分的所述内导体被电屏蔽。
3.根据权利要求1所述的同轴线缆阳连接器，还包括：
适配器，所述适配器各自在所述适配器的一个端部处连接至所述同轴线缆的所述暴露的内导体中的对应的一个暴露的内导体，而在所述适配器的另一端部处连接至形成在所述印刷电路板上的所述信号线端子焊盘中的对应的一个信号线端子焊盘，以允许所述同轴线缆的所述内导体的端子与形成在所述印刷电路板上的所述电路信号线端子焊盘之间的容易的接触，并且所述同轴线缆的所述内导体的端子分别经由所述适配器连接至形成在所述印刷电路板上的所述电路信号线端子焊盘。
4.根据权利要求3所述的同轴线缆阳连接器，其中，所述屏蔽壳包括接纳所述适配器的适配器接纳部分，所述适配器一对一地连接至所述同轴线缆的所述暴露的内导体，所述适配器接纳部分定形为单独地屏蔽所述适配器。
5.根据权利要求3所述的同轴线缆阳连接器，其中：
所述屏蔽壳连接至所述同轴线缆的所述外导体；并且
所述连接器插接件接纳所述屏蔽壳，并且电连接至所述屏蔽壳和所述印刷电路板的接地端子，以对所述同轴线缆的所述暴露的内导体和所述适配器进行电屏蔽。
6.根据权利要求1所述的同轴线缆阳连接器，其中，所述屏蔽壳包括：
下部屏蔽构件，所述下部屏蔽构件形成所述屏蔽壳的下部部分并且接纳所述同轴线缆的所述暴露的内导体，使得所述暴露的内导体的所述端部位于所述下部屏蔽构件上；
上部屏蔽构件，所述上部屏蔽构件对接纳在所述下部屏蔽构件中的所述同轴线缆的所述暴露的内导体进行覆盖；以及
前部屏蔽构件，所述前部屏蔽构件形成所述屏蔽壳的前部部分，并且联接至所述下部屏蔽构件和所述上部屏蔽构件以对所述同轴线缆的所述暴露的内导体进行屏蔽。
7.根据权利要求1所述的同轴线缆阳连接器，其中，所述屏蔽壳包括：
第一屏蔽构件，所述第一屏蔽构件形成所述屏蔽壳的下部部分并且接纳所述同轴线缆的所述暴露的内导体，使得所述暴露的内导体的所述端部位于所述第一屏蔽构件上；以及
第二屏蔽构件，所述第二屏蔽构件联接至所述第一屏蔽构件以对所述同轴线缆的所述暴露的内导体进行屏蔽。
8.根据权利要求1所述的同轴线缆阳连接器，其中，所述屏蔽壳是具有上部部分、下部部分以及前部部分的屏蔽构件，所述上部部分、所述下部部分以及所述前部部分彼此一体地形成，所述屏蔽构件具有底部表面，所述同轴线缆的所述暴露的内导体的端部位于所述底部表面上，并且所述屏蔽构件适于对所述同轴线缆的所述暴露的内导体进行屏蔽。
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