CN112086036A - Display panel, manufacturing method thereof and display device - Google Patents
Display panel, manufacturing method thereof and display device Download PDFInfo
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- CN112086036A CN112086036A CN202011015737.2A CN202011015737A CN112086036A CN 112086036 A CN112086036 A CN 112086036A CN 202011015737 A CN202011015737 A CN 202011015737A CN 112086036 A CN112086036 A CN 112086036A
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- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
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Abstract
The application relates to a display panel, a manufacturing method thereof and a display device, wherein the display panel comprises: a substrate structure including a first substrate that transmits light of a first wavelength range and shields light of a second wavelength range; a thin film transistor and a plurality of signal lines on the first substrate, the signal lines being electrically connected to the thin film transistor; the short circuit bar is used for providing a test signal for at least part of the binding wires during testing; at least part is located the electrically conductive line on the substrate structure side, and the one end of electrically conductive line is connected with corresponding signal line electricity, and the other end is with to correspond to bind the line electricity and be connected to, when carrying out first substrate back short circuit stick laser cutting, can make first substrate opaque under laser irradiation to shield the laser beam, and then avoid taking place the laser beam and pass first substrate and injure thin-film transistor and its connecting circuit's problem.
Description
[ technical field ] A method for producing a semiconductor device
The application relates to the technical field of display, in particular to a display panel, a manufacturing method thereof and a display device.
[ background of the invention ]
At present, a Mini/Micro LED (Mini/Micro light emitting diode) cannot be prepared in a large area, and large-size display is realized by adopting a splicing mode. Because the width of the splicing seam is a key factor influencing the display effect, manufacturers of large panels devote themselves to developing seamless splicing technology, and the most ideal mode for realizing seamless splicing is to adopt a back binding mode. Specifically, the back binding refers to binding the chip on film and the circuit board on the back of the display area, and the outer pin binding area is also located on the back of the display area.
However, a great difficulty of the back-side bonding process is that when the back-side shorting bar (shorting bar) is laser-cut, laser energy is large, and the laser easily penetrates through the transparent glass substrate to damage the thin film transistor and the connecting circuit thereof at the corresponding position of the front side, thereby affecting the display effect and yield.
[ summary of the invention ]
The present disclosure provides a display panel, a manufacturing method thereof, and a display device, so as to avoid the problem that a laser beam damages a front thin film transistor and a connection circuit thereof when performing laser cutting of a back shorting bar, thereby ensuring a display effect and a yield of the display panel.
In order to solve the above problem, an embodiment of the present application provides a display panel, including: a substrate structure comprising a first substrate that is transparent under illumination with light of a first wavelength range and opaque under illumination with light of a second wavelength range to transmit light of the first wavelength range and shield light of the second wavelength range; a thin film transistor and a plurality of signal lines on the first substrate, the signal lines being electrically connected to the thin film transistor; the short-circuit bars are positioned on the surface of the substrate structure, which is far away from the signal lines, and the binding wires are electrically connected with at least part of the binding wires and used for providing test signals for at least part of the binding wires when the display panel is tested; and at least part of the conductive wires are positioned on the side surface of the substrate structure, one end of each conductive wire is electrically connected with the corresponding signal wire, and the other end of each conductive wire is electrically connected with the corresponding binding wire.
The short-circuit bars are arranged along the direction perpendicular to the binding wires, notches are arranged at the corresponding positions of any two adjacent binding wires, and the notches are formed by light cutting in a second wavelength range.
The manufacturing material of the first substrate comprises a photochromic material, and the light in the second wavelength range is light for exciting the photochromic material to change from transparent to opaque.
Wherein the photochromic material is a metal halide.
The substrate structure further comprises a second substrate, and the second substrate is fixedly arranged on the surface of the first substrate, which is far away from the signal line.
Wherein the second substrate is transparent under light irradiation of a first wavelength range and opaque under light irradiation of a second wavelength range to shield light of the first wavelength range.
The display panel also comprises a chip on film and a circuit board which are positioned on the surface of the substrate structure deviating from the signal line, the chip on film is electrically connected with the binding wires, and the circuit board is electrically connected with the chip on film.
In order to solve the above problem, an embodiment of the present application further provides a method for manufacturing a display panel, where the method includes: providing a substrate structure comprising a first substrate that is transparent under illumination with light in a first wavelength range and opaque under illumination with light in a second wavelength range to transmit light in the first wavelength range and shield light in the second wavelength range; forming a thin film transistor and a plurality of signal lines on the substrate structure, the signal lines being electrically connected to the thin film transistor; forming at least one short circuit bar and a plurality of binding wires on the surface of the substrate structure, which is far away from the signal wires, wherein each short circuit bar is electrically connected with at least part of the binding wires and is used for providing test signals for at least part of the binding wires when the display panel is tested; and forming a conductive wire at least partially positioned on the side surface of the substrate structure, wherein one end of the conductive wire is electrically connected with the corresponding signal wire, and the other end of the conductive wire is electrically connected with the corresponding binding wire.
Wherein, the short-circuit stick is along the direction setting of the line of binding of perpendicular to, after forming electrically conductive line of walking, still includes: and cutting the short-circuit bar by using light in a second wavelength range to form a cut at the corresponding position of any two adjacent binding wires.
In order to solve the above problem, an embodiment of the present application further provides a display device including the display panel of any one of the above.
The beneficial effect of this application is: being different from the prior art, the display panel that this application provided, through making first substrate be transparent under the light irradiation of first wavelength range in the substrate structure, it is opaque under the light irradiation of second wavelength range to see through the light of first wavelength range, and shield the light of second wavelength range, thereby, when carrying out first substrate back short-circuit bar laser cutting, can make first substrate opaque under laser irradiation, with the shielding laser beam, and then avoid taking place the laser beam and pass first substrate and hit the problem of hurting thin-film transistor and its connecting circuit, in order to ensure display panel's display effect and yield.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic top view of a display panel according to an embodiment of the present disclosure;
FIG. 2 is a schematic cross-sectional view of the display panel of FIG. 1 taken along line C-C';
fig. 3 is a schematic bottom view of a display panel according to an embodiment of the present disclosure;
fig. 4 is a schematic bottom view of a display panel according to an embodiment of the present disclosure;
FIG. 5 is another cross-sectional structural view of the display panel of FIG. 1 taken along line C-C';
fig. 6 is a schematic bottom view of a display panel according to an embodiment of the present disclosure;
fig. 7 is a schematic flowchart of a method for manufacturing a display panel according to an embodiment of the present disclosure;
fig. 8 is a schematic structural diagram of a display device according to an embodiment of the present application.
[ detailed description ] embodiments
The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive step are within the scope of the present application.
Referring to fig. 1 to 3, fig. 1 is a schematic top view structure diagram of a display panel provided in an embodiment of the present application, fig. 2 is a schematic cross-sectional structure diagram of the display panel in fig. 1 taken along line C-C', and fig. 3 is a schematic bottom view structure diagram of the display panel provided in the embodiment of the present application. As shown in fig. 1 to 3, the display panel 10 includes a substrate structure 11, a thin film transistor 12, a plurality of signal lines 13, at least one shorting bar 14, a plurality of bonding wires 15, and a conductive wire 16. The substrate structure 11 includes a first substrate 111, and the first substrate 111 is transparent under the irradiation of light in a first wavelength range and opaque under the irradiation of light in a second wavelength range to transmit the light in the first wavelength range and shield the light in the second wavelength range. The thin film transistor 12 and the plurality of signal lines 13 are provided over the first substrate 111, and the signal lines 13 are electrically connected to the thin film transistor 12 to supply signals to the thin film transistor 12. The at least one shorting bar 14 and the plurality of bonding wires 15 are located on the surface 11A of the substrate structure 11 away from the signal lines 13, and each shorting bar 14 is electrically connected to at least some of the bonding wires 15, and is configured to provide a test signal to the at least some of the bonding wires 15 when the display panel 10 is tested. The conductive trace 16 is at least partially located on the side surface 11B of the substrate structure 11, one end 16A of the conductive trace 16 is electrically connected to the corresponding signal line 13, and the other end 16B is electrically connected to the corresponding bonding trace 15.
The material for manufacturing the first substrate 111 may include a photochromic material, and the photochromic material may be an inorganic photochromic material such as a metal halide (e.g., silver halide, zinc halide, copper halide, magnesium halide, or the like), a transition metal oxide, a rare earth complex, or the like, or an organic photochromic material such as spiropyran, spirophenoxazine, oxazine dye, dehydropyridine, or the like. For example, the first substrate 111 may be made of a material obtained by doping the photochromic material in a base material (e.g., glass or organic resin).
In this embodiment, the light in the second wavelength range is light that excites the photochromic material to change from transparent to opaque, that is, the photochromic material undergoes a color change reaction under the irradiation of the light in the second wavelength range, so that the color deepens, and the transmittance of the first substrate 111 to the light in the second wavelength range is reduced, for example, reduced to less than 10%, so as to realize the effect of shielding the light in the second wavelength range by the first substrate 111. Further, when the photochromic material is irradiated with light of the first wavelength range instead of light of the second wavelength range, the color of the photochromic material changes from dark color to colorless, which increases the transmittance of the first substrate 111 to light of the first wavelength range, for example, to more than 90%, thereby realizing the function of the first substrate 111 transmitting light of the first wavelength range. In an example where the first substrate 111 is a silver halide photochromic glass, the light in the first wavelength range may be visible light (having a wavelength of 400 to 700 nm), the light in the second wavelength range may be ultraviolet light (having a wavelength of less than 400 nm), and the transmittance of the first substrate 111 may be changed from 100% to 0% under the irradiation of the light in the second wavelength range.
The thin film transistor 12 may include a gate, and a source and a drain disposed on two sides of the gate, and the relative positions of the source and the drain are not limited. The plurality of signal lines 13 may include data lines and scan lines, wherein the signal lines receive signals for driving the display panel 10 to display a picture. In one embodiment, the scan lines of the signal lines 13 may receive scan signals from a scan signal driving chip (not shown), or the data lines of the signal lines 13 may receive data signals from a data signal driving chip (not shown).
Specifically, the number of the conductive traces 16 may be multiple, and may be the same as the number of the signal lines 13 and the number of the binding traces 15, that is, each conductive trace 16 corresponds to one signal line 13 and one binding trace 15, so that one end of each conductive trace 16 is connected to the corresponding signal line 13, and the other end of each conductive trace 16 is connected to the corresponding binding trace 15, so as to achieve the electrical connection between the shorting bar 14 and the signal line 13. Further, when the display panel 10 is tested, the shorting bar 14 may receive a test signal and transmit the received test signal to at least some of the signal lines 13 to detect whether the signal lines 13 are broken or otherwise defective.
In one embodiment, the display panel 10 may further include a plurality of pixels (not shown), each of which may include at least three sub-pixels of different colors, for example, a first color sub-pixel, a second color sub-pixel, and a third color sub-pixel, and the thin film transistor 12 is electrically connected to the corresponding sub-pixel for lighting the sub-pixel when receiving a driving signal or a test signal. Further, the at least one shorting bar 14 may include a first shorting bar, a second shorting bar, and a third shorting bar, and all of the bonding wires 15 connected to the first color sub-pixel are connected to the first shorting bar, all of the bonding wires 15 connected to the second color sub-pixel are connected to the second shorting bar, and all of the bonding wires 15 connected to the third color sub-pixel are connected to the third shorting bar. In this way, when the display panel 10 is tested, different test signals can be provided through the first shorting bar, the second shorting bar and the third shorting bar, so that the display panel displays pictures with different colors, and defects of the scan lines and/or the data lines connected to the sub-pixels with different colors can be detected respectively.
Furthermore, since the shorting bar 14 is no longer functional in the actual operation of the display panel 10 after the test of the display panel 10 is performed, and the plurality of bonding wires 15 (signal lines 13) are still shorted together by the shorting bar 14, in order to provide data signals and/or scan signals to the thin film transistors 12 through the signal lines 13 electrically connected to the bonding wires 15, the shorting bar 14 needs to be cut off to separate the plurality of bonding wires 15 that are shorted together.
Specifically, as shown in fig. 3, the shorting bar 14 may be disposed in a direction perpendicular to the bonding traces 15, and after the shorting bar 14 is cut off, as shown in fig. 4, a cut 141 may be disposed at a corresponding position of any two adjacent bonding traces 15, and the cut 141 may transversely cut the shorting bar 14 to separate the plurality of short-circuited bonding traces 15. In addition, in this embodiment, the notch 141 may be formed by photo-cutting in the second wavelength range, and in a specific implementation, as shown in fig. 2, the laser L in the second wavelength range is used to irradiate a corresponding position of any two adjacent bonding wires 15, so as to remove the short bar 14 located at the corresponding position of any two adjacent bonding wires 15, so as to form the notch 141. In this way, by the effect of the first substrate 111 shielding or absorbing light in the second wavelength range, when the short bar 14 is laser-cut using the laser light L in the second wavelength range, the thin film transistor 12 and the signal line 13 located at the corresponding positions on the front surface of the first substrate 111 can be prevented from being damaged by the laser light L passing through the first substrate 111.
In one embodiment, as shown in fig. 5, the substrate structure 11 may further include a second substrate 112, and the second substrate 112 is fixed on a surface 111A of the first substrate 111 facing away from the signal line 13. Specifically, the substrate structure 11 may further include an adhesive layer 113, where the adhesive layer 113 is located between the first substrate 111 and the second substrate 112, and is used to adhesively fix the first substrate 111 and the second substrate 112 together. The material of the adhesive layer 113 may be a heat-sensitive or pressure-sensitive adhesive material, and has hydrophobicity. When heated or pressurized, the adhesive layer 113 is cured with an increased adhesive ability to adhesively fix the first substrate 111 and the second substrate 112 together, resulting in the above-described substrate structure 11. In some embodiments, the adhesive layer 113 may be disposed in an edge region of the display panel 10 to avoid an influence of the adhesive layer 113 on the transmittance of the substrate structure 11.
Further, in order to more effectively block the laser light L from passing through the substrate structure 11 when the shorting bar 14 is cut by the laser light L, the second substrate 112 may be transparent under light irradiation of the first wavelength range and opaque under light irradiation of the second wavelength range, and may shield the light of the first wavelength range. Specifically, the material of the second substrate 112 may be the same as or different from that of the first substrate 111. For example, the second substrate 112 may be made of a base material (e.g., glass or an organic resin) doped with a photochromic material, and the photochromic material may be an inorganic photochromic material such as a metal halide (e.g., silver halide, zinc halide, copper halide, magnesium halide, or the like), a transition metal oxide, or a rare earth complex, or an organic photochromic material such as spiropyran, spirophenoxazine, oxazine dye, or dehydropyridine.
It should be noted that, in some alternative embodiments, the second substrate 112 may also be fixed on a surface of the first substrate 111 away from the shorting bar 14, and the thin film transistor 12 and the plurality of signal lines 13 are disposed on the second substrate 112, it is understood that the second substrate 112, the thin film transistor 12 disposed thereon, and the plurality of signal lines 13 together form an array substrate of the display panel 10.
In an embodiment, as shown in fig. 6, the display panel 10 may further include a flip-chip film 17 and a circuit board 18 located on a surface 11A of the substrate structure 11 away from the signal lines 13, the flip-chip film 17 is electrically connected to the bonding wires 15, the circuit board 18 is electrically connected to the flip-chip film 17, and the circuit board 18 is configured to provide the signal lines 13 with a voltage and a control signal required by the display panel 10 for displaying images through the flip-chip film 17.
In the above embodiments, the material of the signal line 13, the conductive trace 16, the bonding trace 15 and the shorting bar 14 may be aluminum, copper, silver or other materials with low resistivity.
Different from the prior art, the display panel in this embodiment includes a substrate structure, a thin film transistor, a plurality of signal lines, at least one shorting bar, a plurality of bonding wires, and conductive wires, wherein the substrate structure includes a first substrate, the first substrate is transparent under light irradiation of a first wavelength range and opaque under light irradiation of a second wavelength range to transmit light of the first wavelength range and shield light of the second wavelength range, the thin film transistor and the plurality of signal lines are located on the first substrate, the signal lines are electrically connected to the thin film transistor, the at least one shorting bar and the plurality of bonding wires are located on a surface of the substrate structure away from the signal lines, each shorting bar is electrically connected to at least some of the bonding wires and is configured to provide a test signal to at least some of the bonding wires when the display panel is tested, and the conductive wires are located at least partially on a side of the substrate structure, one end of the conductive wire is electrically connected with the corresponding signal wire, and the other end of the conductive wire is electrically connected with the corresponding binding wire, so that when the first substrate back short-circuit bar is subjected to laser cutting, the first substrate can be opaque under laser irradiation to shield a laser beam, and then the problem that the thin film transistor and a connecting circuit thereof are damaged by the laser beam passing through the first substrate is avoided, and the display effect and the yield of the display panel are ensured.
Referring to fig. 7, fig. 7 is a schematic flow chart illustrating a manufacturing method of a display panel according to an embodiment of the present disclosure. The specific flow of the manufacturing method of the display panel can be as follows:
s61: a substrate structure is provided, the substrate structure including a first substrate that is transparent under illumination with light in a first wavelength range and opaque under illumination with light in a second wavelength range to transmit light in the first wavelength range and shield light in the second wavelength range.
The first substrate may be made of a photochromic material, and the photochromic material may be an inorganic photochromic material such as a metal halide (e.g., silver halide, zinc halide, copper halide, magnesium halide, or the like), a transition metal oxide, a rare earth complex, or the like, or an organic photochromic material such as spiropyran, spirophenoxazine, oxazine dye, or dehydropyridine, or the like. For example, the first substrate may be made of a material obtained by doping the photochromic material in a base material (e.g., glass or organic resin).
In this embodiment, the light in the second wavelength range is light that excites the photochromic material to change from transparent to opaque, that is, the photochromic material undergoes a color change reaction under the irradiation of the light in the second wavelength range, and the color deepens, so that the transmittance of the first substrate to the light in the second wavelength range is reduced, for example, reduced to less than 10%, so as to realize the effect of shielding the light in the second wavelength range by the first substrate. Further, when the photochromic material is irradiated with light of the first wavelength range instead of light of the second wavelength range, the color of the photochromic material changes from dark color to colorless, which increases the transmittance of the first substrate to light of the first wavelength range, for example, to more than 90%, thereby realizing the function of the first substrate transmitting light of the first wavelength range. In the case where the first substrate is silver halide photochromic glass, the light in the first wavelength range may be visible light (having a wavelength of 400 to 700 nm), the light in the second wavelength range may be ultraviolet light (having a wavelength of less than 400 nm), and the transmittance of the first substrate may be changed from 100% to 0% when the first substrate is irradiated with the light in the second wavelength range.
In one embodiment, the substrate structure may further include a second substrate fixed on a surface of the first substrate facing away from the signal line. Specifically, the substrate structure may further include an adhesive layer, which is located between the first substrate and the second substrate and is used to adhesively fix the first substrate and the second substrate together. The material of the bonding layer can be a heat-sensitive or pressure-sensitive adhesive material and has hydrophobicity. When heated or pressurized, the adhesive layer is cured with an accompanying increase in adhesive ability to adhesively secure the first and second substrates together to provide the above-described substrate structure. In some embodiments, the adhesive layer may be disposed in an edge region of the substrate structure to avoid an influence of the adhesive layer on the light transmittance of the substrate structure.
Further, in order to more effectively block the laser light from passing through the substrate structure when the shorting bar is cut by the laser light, the second substrate may be transparent under the irradiation of the light of the first wavelength range, opaque under the irradiation of the light of the second wavelength range, and shield the light of the first wavelength range. Specifically, the material of the second substrate may be the same as or different from that of the first substrate. For example, the second substrate may be made of a base material (e.g., glass or an organic resin) doped with a photochromic material, and the photochromic material may be an inorganic photochromic material such as a metal halide (e.g., silver halide, zinc halide, copper halide, magnesium halide, or the like), a transition metal oxide, or a rare earth complex, or an organic photochromic material such as spiropyran, spirophenoxazine, oxazine dye, or dehydropyridine.
It should be noted that, in some alternative embodiments, the second substrate may be further fixed on a surface of the first substrate away from the shorting bar, and the thin film transistor and the plurality of signal lines are disposed on the second substrate, and it is understood that the second substrate, the thin film transistor and the plurality of signal lines disposed thereon together form an array substrate of the display panel.
S62: a thin film transistor and a plurality of signal lines are formed on the substrate structure, the signal lines being electrically connected to the thin film transistor.
The thin film transistor may include a gate, and a source and a drain disposed at two sides of the gate, and the relative positions of the source and the drain are not limited. The plurality of signal lines may include data lines and scan lines, wherein the signal lines receive signals for supplying signals to the thin film transistors to drive the display panel to display images. In one embodiment, the scan lines of the signal lines may receive scan signals from a scan signal driving chip, or the data lines of the signal lines may receive data signals from a data signal driving chip.
S63: and forming at least one short circuit bar and a plurality of binding wires on the surface of the substrate structure deviating from the signal wires, wherein each short circuit bar is electrically connected with at least part of the binding wires and is used for providing test signals for at least part of the binding wires when the display panel is tested.
Specifically, when the display panel is subsequently tested, the shorting bar may receive a test signal and transmit the received test signal to a corresponding signal line through the at least partially bound trace, so as to detect whether the signal line has an open circuit or other defects.
S64: and forming a conductive wire at least partially positioned on the side surface of the substrate structure, wherein one end of the conductive wire is electrically connected with the corresponding signal wire, and the other end of the conductive wire is electrically connected with the corresponding binding wire.
Specifically, the number of the conductive traces can be multiple, and can be the same as the number of the signal lines and the binding traces, that is, each conductive trace corresponds to one signal line and one binding trace, so that one end of each conductive trace is connected with the corresponding signal line, and the other end of each conductive trace is connected with the corresponding binding trace, thereby achieving the electrical connection between the shorting bar and the signal line. Further, when the display panel is tested, the shorting bar may receive a test signal and transmit the received test signal to at least some of the signal lines to detect whether the signal lines are open or defective.
In one embodiment, since the shorting bar is no longer effective in the actual operation of the display panel after the test and the plurality of bonding wires (signal lines) are still shorted together by the shorting bar, in order to subsequently provide the data signals and/or the scan signals to the tfts through the signal lines electrically connected to the bonding wires, a cutting process is required to be performed on the shorting bar to separate the plurality of bonding wires shorted together. Specifically, after S64, the method may further include:
s65: and cutting the short-circuit bar by using light in a second wavelength range to form a cut at the corresponding position of any two adjacent binding wires.
Specifically, the short-circuit bars may be disposed in a direction perpendicular to the binding wires, and the cuts cut the short-circuit bars transversely to separate the short-circuited binding wires. In addition, in this embodiment, the laser in the second wavelength range may be used to irradiate corresponding positions of any two adjacent bonding wires, so as to remove the short bar located at the corresponding position of any two adjacent bonding wires to form the cut. Therefore, the effect of shielding or absorbing light in the second wavelength range by the first substrate can be utilized, and when laser in the second wavelength range is adopted to carry out laser cutting on the short-circuit rod, the thin film transistor and the signal wire which are positioned on the corresponding position of the front surface of the first substrate can be prevented from being damaged by the laser penetrating through the first substrate.
In a specific embodiment, after the step S63, the method further includes:
s66: and forming a chip on film and a circuit board on the surface of the substrate structure deviating from the signal line, wherein the chip on film is electrically connected with the binding wires, and the circuit board is electrically connected with the chip on film.
The circuit board is used for providing voltage and control signals required by the display panel for picture display to the signal wires through the chip on film.
In the above embodiments, the signal lines, the conductive traces, the bonding traces, and the shorting bars may be made of a material with low resistivity, such as aluminum, copper, or silver.
Different from the prior art, the method for manufacturing a display panel in this embodiment includes providing a substrate structure, where the substrate structure includes a first substrate, the first substrate is transparent under light irradiation in a first wavelength range and opaque under light irradiation in a second wavelength range to transmit light in the first wavelength range and shield light in the second wavelength range, and a thin film transistor and a plurality of signal lines are formed on the substrate structure, the signal lines are electrically connected to the thin film transistor, then at least one shorting bar and a plurality of bonding wires are formed on a surface of the substrate structure away from the signal lines, each shorting bar is electrically connected to at least part of the bonding wires and is configured to provide a test signal to at least part of the bonding wires when the display panel is tested, and then at least part of conductive wires located on a side surface of the substrate structure are formed, and one end of each conductive wire is electrically connected to a corresponding signal line, the other end of the first substrate is electrically connected with the corresponding binding wires, so that when the first substrate back short-circuit bar is subjected to laser cutting, the first substrate can be made opaque under laser irradiation to shield a laser beam, the problem that the laser beam penetrates through the first substrate to damage the thin film transistor and the connecting circuit thereof is avoided, and the display effect and the yield of the display panel are ensured.
Referring to fig. 8, fig. 8 is a schematic structural diagram of a display device according to an embodiment of the present disclosure. The display device 70 includes the display panel 71 of any of the above embodiments.
Specifically, the display panel 71 includes a substrate structure, a thin film transistor, a plurality of signal lines, at least one shorting bar, a plurality of bonding lines, and conductive lines, wherein the substrate structure includes a first substrate, the first substrate is transparent under light irradiation of a first wavelength range and opaque under light irradiation of a second wavelength range to transmit light of the first wavelength range and shield light of the second wavelength range, the thin film transistor and the plurality of signal lines are located on the first substrate, the signal lines are electrically connected to the thin film transistor for providing signals to the thin film transistor, the at least one shorting bar and the plurality of bonding lines are located on a surface of the substrate structure away from the signal lines, each shorting bar is electrically connected to at least some of the bonding lines for providing test signals to at least some of the bonding lines when the display panel is tested, and the conductive lines are at least partially located on a side surface of the substrate structure, one end of the conductive wire is electrically connected with the corresponding signal wire, and the other end of the conductive wire is electrically connected with the corresponding binding wire.
Different from the prior art, the display device in this embodiment includes a display panel, the display panel includes a substrate structure, a thin film transistor, a plurality of signal lines, at least one short bar, a plurality of bonding wires, and conductive wires, wherein the substrate structure includes a first substrate, the first substrate is transparent under light irradiation in a first wavelength range and opaque under light irradiation in a second wavelength range to transmit light in the first wavelength range and shield light in the second wavelength range, the thin film transistor and the plurality of signal lines are located on the first substrate, the signal lines are electrically connected to the thin film transistor, the at least one short bar and the plurality of bonding wires are located on a surface of the substrate structure away from the signal lines, each short bar is electrically connected to at least a portion of the bonding wires and is used for providing a test signal to at least a portion of the bonding wires during testing of the display panel, the conductive wires are located at least a portion of the side surfaces of the substrate structure, one end of the conductive wire is electrically connected with the corresponding signal wire, and the other end of the conductive wire is electrically connected with the corresponding binding wire, so that when the first substrate back short-circuit bar is subjected to laser cutting, the first substrate can be made opaque under laser irradiation to shield a laser beam, and the problem that the thin film transistor and a connecting circuit thereof are damaged by the laser beam passing through the first substrate is avoided, and the display effect and the yield of the display panel are ensured.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A display panel, comprising:
a substrate structure comprising a first substrate that is transparent under illumination with light of a first wavelength range and opaque under illumination with light of a second wavelength range to transmit light of the first wavelength range and shield light of the second wavelength range;
a thin film transistor and a plurality of signal lines on the first substrate, the signal lines being electrically connected to the thin film transistor;
the short circuit bars are electrically connected with at least part of the binding wires and used for providing test signals for at least part of the binding wires when the display panel is tested; and the number of the first and second groups,
and at least part of the conductive wires are positioned on the side surface of the substrate structure, one end of each conductive wire is electrically connected with the corresponding signal wire, and the other end of each conductive wire is electrically connected with the corresponding binding wire.
2. The display panel according to claim 1, wherein the shorting bar is disposed along a direction perpendicular to the bonding wires, and a notch is disposed at a corresponding position of any two adjacent bonding wires, and the notch is formed by photo-cutting in the second wavelength range.
3. The display panel according to claim 1, wherein the first substrate is made of a material including a photochromic material, and the light in the second wavelength range is light for exciting the photochromic material to change from transparent to opaque.
4. The display panel of claim 3 wherein the photochromic material is a metal halide.
5. The display panel according to claim 1, wherein the substrate structure further comprises a second substrate fixed on a surface of the first substrate facing away from the signal lines.
6. The display panel according to claim 5, wherein the second substrate is transparent under light irradiation of the first wavelength range and opaque under light irradiation of the second wavelength range to transmit light of the first wavelength range and shield light of the second wavelength range.
7. The display panel of claim 1, further comprising a flip-chip film and a circuit board on a surface of the substrate structure facing away from the signal lines, wherein the flip-chip film is electrically connected to the bonding wires, and the circuit board is electrically connected to the flip-chip film.
8. A method for manufacturing a display panel is characterized by comprising the following steps:
providing a substrate structure comprising a first substrate that is transparent under illumination with light of a first wavelength range and opaque under illumination with light of a second wavelength range to transmit light of the first wavelength range and to shield light of the second wavelength range;
forming a thin film transistor and a plurality of signal lines on the substrate structure, the signal lines being electrically connected to the thin film transistor;
forming at least one short circuit bar and a plurality of binding wires on the surface of the substrate structure deviating from the signal lines, wherein each short circuit bar is electrically connected with at least part of the binding wires and is used for providing test signals for at least part of the binding wires when the display panel is tested; and the number of the first and second groups,
and forming a conductive wire at least partially positioned on the side surface of the substrate structure, wherein one end of the conductive wire is electrically connected with the corresponding signal wire, and the other end of the conductive wire is electrically connected with the corresponding binding wire.
9. The method for manufacturing a display panel according to claim 8, wherein the shorting bar is disposed along a direction perpendicular to the bonding trace, and after the forming of the conductive trace, the method further comprises:
and cutting the short-circuit bar by using the light in the second wavelength range to form a cut at the corresponding position of any two adjacent binding wires.
10. A display device comprising the display panel according to any one of claims 1 to 7.
Priority Applications (2)
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| CN202011015737.2A CN112086036B (en) | 2020-09-24 | 2020-09-24 | Display panel, manufacturing method thereof and display device |
| PCT/CN2020/126369 WO2022062081A1 (en) | 2020-09-24 | 2020-11-04 | Display panel and manufacturing method therefor, and display apparatus |
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| CN202011015737.2A CN112086036B (en) | 2020-09-24 | 2020-09-24 | Display panel, manufacturing method thereof and display device |
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| CN112086036B CN112086036B (en) | 2021-08-24 |
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| CN113721397A (en) * | 2021-08-20 | 2021-11-30 | Tcl华星光电技术有限公司 | Binding structure, display device, detection method and detection device |
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| CN114578594A (en) * | 2022-03-03 | 2022-06-03 | Tcl华星光电技术有限公司 | Array substrate, display module thereof and manufacturing method |
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Also Published As
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| WO2022062081A1 (en) | 2022-03-31 |
| CN112086036B (en) | 2021-08-24 |
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