CN112074156B

CN112074156B - Performance test system based on embedded VPX board card

Info

Publication number: CN112074156B
Application number: CN202010919570.6A
Authority: CN
Inventors: 张明玉
Original assignee: Tianjin Linkhope Technology Co ltd
Current assignee: Tianjin Linkhope Technology Co ltd
Priority date: 2020-09-04
Filing date: 2020-09-04
Publication date: 2022-08-09
Anticipated expiration: 2040-09-04
Also published as: CN112074156A

Abstract

The embodiment of the invention discloses a performance testing system based on an embedded VPX board card, wherein four corners of the bottom end of a box body are provided with support legs, the center of the bottom of the box body is provided with an air inlet, the center of the top of the box body is provided with an air outlet, the system also comprises a controller, a battery module, the VPX board card, a pushing mechanism, a heat dissipation mechanism, an adjusting mechanism, a first air pump, a second air pump, an air inlet pipe and a heat dissipation air pipe, a plurality of battery modules and the VPX board card are vertically arranged in the box body, the pushing mechanism is arranged along the arrangement direction of the VPX board card, the pushing mechanism is in transmission connection with the heat dissipation mechanism and the adjusting mechanism, one end of the air inlet pipe is communicated with the air inlet, the other end of the air inlet pipe is communicated with the heat dissipation mechanism, and a first air pump is arranged on the air inlet pipe, one end of the heat dissipation air pipe is communicated with the heat dissipation mechanism, the other end of the heat dissipation air pipe is communicated with the air outlet, a second air pump is arranged on the heat dissipation air pipe, and the controller is electrically connected with the first air pump and the second air pump. The VPX board cooling device is ingenious in structural design, convenient and efficient to use, good in cooling effect and capable of greatly improving the performance test accuracy of the VPX board.

Description

Performance test system based on embedded VPX board card

Technical Field

The embodiment of the invention relates to the technical field of computers, in particular to a performance test system based on an embedded VPX board card.

Background

VPX is a new generation of high speed serial bus standard developed by the VME International Trade Association (VME International Trade Association) organization in 2007 on the basis of its VME bus. The basic specifications, mechanical structure, and details of the bus signals of the VPX bus are defined in the ANSI/VITA46 series of specifications. VPX is a new generation of bus standard based on high speed serial buses, which was originally designed to inherit and continue the VME bus in order to protect the applications of the VME bus.

With the continuous development of products such as a VPX reinforced mainboard and the like, in order to meet market needs, a performance test needs to be performed on a VPX board card before application. In the prior art, the VPX board cards are arranged and placed in a test box to be tested one by one, but the accuracy of the performance test of the VPX board cards is seriously influenced due to the fact that the VPX board cards are arranged closely and a heat dissipation space is small. If only set up simple radiator fan structure on the test box, be difficult to reach comparatively ideal radiating effect, especially when testing single VPX integrated circuit board, because self generate heat and adjacent VPX integrated circuit board generate heat the influence, be difficult to accurately reflect the performance of VPX that awaits measuring.

Therefore, how to provide a performance test system based on an embedded VPX board card to improve the heat dissipation performance of the VPX board card to be tested, so that the performance of the VPX board card is more accurate is a technical problem to be solved urgently by those skilled in the art.

Disclosure of Invention

Therefore, the embodiment of the invention provides a performance test system based on an embedded VPX board card, so as to solve the related technical problems in the prior art.

In order to achieve the above object, the embodiments of the present invention provide the following technical solutions:

a performance testing system based on an embedded VPX board comprises a box body, support legs, an air inlet and an air outlet, wherein the support legs are arranged at four corners of the bottom of the box body, the air inlet is arranged at the center of the bottom of the box body, the air outlet is arranged at the center of the top of the box body, the performance testing system further comprises a controller, a battery module, the VPX board, a pushing mechanism, a heat dissipation mechanism, an adjusting mechanism, a first air pump, a second air pump, an air inlet pipe and a heat dissipation air pipe which are arranged in the box body, the battery module and the VPX board are vertically arranged in the box body, the pushing mechanism is arranged along the arrangement direction of the VPX board, the pushing mechanism is in transmission connection with the heat dissipation mechanism and the adjusting mechanism, the heat dissipation mechanism is obliquely arranged, one end of the air inlet pipe is communicated with the air inlet, the other end of the air inlet pipe is communicated with the heat dissipation mechanism, the first air pump is arranged on the air inlet pipe, one end of the heat dissipation air pipe is communicated with the heat dissipation mechanism, the other end of the heat dissipation air pipe is communicated with the air outlet, a second air pump is arranged on the heat dissipation air pipe, and the controller is electrically connected with the first air pump and the second air pump.

Further, heat dissipation mechanism includes semiconductor refrigeration piece, front cover, back cover, picture peg, inner chamber, blowhole, hinge, torsional spring and conducting hole, the front end and the rear end of semiconductor refrigeration piece are cold junction and hot junction respectively, semiconductor refrigeration piece front end and rear end are equipped with front cover and back cover respectively, just front cover both sides are the opening, semiconductor refrigeration piece bilateral symmetry is equipped with two picture pegs, the picture peg pass through the hinge with the semiconductor refrigeration piece is articulated, be equipped with the torsional spring on the hinge, set up the hole of blowing of slant and the straight conducting hole on the picture peg inside wall, the picture peg is equipped with the cavity inner chamber, the inner chamber with blowhole and conducting hole are linked together, just the conducting hole with front cover opening is corresponding, the controller electricity is connected the semiconductor refrigeration piece.

Further, the lower part of the inserting plate is a fillet, when the inserting plate is in an initial state, an included angle of 120 degrees is formed between the inserting plate and the semiconductor refrigerating sheet, when the inserting plate is in an adjusting state, the inserting plate is perpendicular to the semiconductor refrigerating sheet, and the opening of the front sealing cover is communicated with the conducting hole.

Further, the air inlet pipe is communicated with the front sealing cover, and the heat dissipation air pipe is communicated with the rear sealing cover.

Further, pushing mechanism includes guide bar, guide ring, driving motor, lead screw and screw nut, guide bar and lead screw parallel arrangement, the cover is equipped with the guide ring on the guide bar, the guide ring with the back covers the lower extreme and connects, the lead screw tip is equipped with driving motor, the cover is equipped with screw nut on the lead screw, screw nut with the back covers and connects, the driving motor electricity is connected the controller.

Further, still include the spring, spring one end is connected lead screw nut, the spring other end is connected the back covers.

Further, adjustment mechanism includes connecting rod, slide, electro-magnet, main metal piece and vice metal piece, the slide parallel is located the guide bar top, just be equipped with the electro-magnet in the slide, the electro-magnet passes through the connecting rod transmission and connects lead screw nut, preceding sealed cover upper portion be equipped with electro-magnet complex main metal piece, the inboard upper portion of picture peg be equipped with electro-magnet complex vice metal piece.

The collecting cover is arranged in front of the VPX board card and communicated with one end of the collecting pipe, and the other end of the collecting pipe is communicated with the rear sealing cover.

Further, still include filter screen and fan, all be equipped with the filter screen on air intake and the air exit, just be equipped with the fan on the filter screen on the air exit, fan electric connection director.

Further, still include the sealing washer, be equipped with the sealing washer on the semiconductor refrigeration piece opening.

The embodiment of the invention has the following advantages:

this application is through setting up pushing mechanism, heat dissipation mechanism and adjustment mechanism, can be when carrying out the capability test to single VPX integrated circuit board, promote assigned position through pushing mechanism with heat dissipation mechanism, and under adjustment mechanism's regulation effect, make heat dissipation mechanism insert the VPX integrated circuit board both sides that await measuring, and blow in the gap of VPX integrated circuit board both sides with the low temperature air, and blow the direction towards VPX integrated circuit board both sides face, thereby can improve the cooling ability of the VPX integrated circuit board that awaits measuring, simultaneously with the hot-air discharge in the gap between VPX integrated circuit board both sides and the adjacent VPX integrated circuit board, make the VPX integrated circuit board test more accurate. The VPX board cooling device is ingenious in structural design, convenient and efficient to use, good in cooling effect and capable of greatly improving the performance test accuracy of the VPX board.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.

The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions that the present invention can be implemented, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the effects and the achievable by the present invention, should still fall within the range that the technical contents disclosed in the present invention can cover.

Fig. 1 is a schematic view of a main view structure of a performance testing system based on an embedded VPX board card according to an embodiment of the present invention;

fig. 2 is a bottom view of a performance testing system based on an embedded VPX board card according to an embodiment of the present invention;

fig. 3 is a schematic view of an installation structure of a pushing mechanism and a heat dissipation mechanism according to an embodiment of the present invention;

FIG. 4 is an enlarged view of a portion of FIG. 3A according to an embodiment of the present invention;

FIG. 5 is an enlarged view of a portion of FIG. 3 at B in accordance with an embodiment of the present invention;

fig. 6 is a schematic front view of a heat dissipation mechanism according to an embodiment of the present invention;

FIG. 7 is a schematic sectional view of an embodiment of the present invention taken along line A-A;

FIG. 8 is a schematic view of an air flow direction structure provided by an embodiment of the present invention;

in the figure:

1, a box body; 2, a support leg; 3, air inlet; 4, an air outlet; 5 a battery module; 6, a VPX board card; 7 a pushing mechanism; 701 a guide rod; 702 a guide ring; 703 driving a motor; 704 lead screw; 705 a lead screw nut; 8, a heat dissipation mechanism; 801 semiconductor refrigerating sheet; an 802 front enclosure; 803 a rear enclosure; 804 inserting plates; 805 an inner cavity; 806 air blowing holes; 807 a hinge; 808 via holes; 9 an adjusting mechanism; 901 a connecting rod; 902 a slideway; 903 an electromagnet; 904 a primary metal block; 905 secondary metal blocks; 10 a first air pump; 11 a second air pump; 12, an air inlet pipe; 13 heat dissipation air pipes; 14 springs; 15 a collection hood; 16 collecting pipes; 17, a filter screen; 18 a fan; 19 sealing ring.

Detailed Description

The present invention is described in terms of particular embodiments, other advantages and features of the invention will become apparent to those skilled in the art from the following disclosure, and it is to be understood that the described embodiments are merely exemplary of the invention and that it is not intended to limit the invention to the particular embodiments disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In order to solve the related technical problems in the prior art, the embodiment of the application provides a performance test system based on an embedded VPX board card 6, and aims to cool and dissipate the VPX board card 6 to be tested and improve the test accuracy of the VPX board card 6. As shown in fig. 1-8, the air-conditioning cabinet specifically comprises a cabinet 1, support legs 2, an air inlet 3 and an air outlet 4, wherein the support legs 2 are arranged at four corners of the bottom end of the cabinet 1, so that air can enter the cabinet 1 from the air inlet 3, the air inlet 3 is arranged at the center of the bottom of the cabinet 1, and the air outlet 4 is arranged at the center of the top of the cabinet 1. The air-conditioning box further comprises a controller (not shown in the figure), a battery module 5, a VPX board card 6, a pushing mechanism 7, a heat dissipation mechanism 8, an adjusting mechanism 9, a first air pump 10, a second air pump 11, an air inlet pipe 12 and a heat dissipation air pipe 13 which are arranged in the box body 1. In order to realize testing a plurality of VPX board cards 6, thereby set up a plurality of VPX board cards 6 that await measuring in box 1 simultaneously, it is specific, a plurality of battery module 5 and the vertical range of VPX board card 6 are in box 1, have less gap between the VPX board card 6 and carry out the heat extraction. In order to improve the heat dissipation capacity of the VPX board card 6, a pushing mechanism 7 is arranged along the arrangement direction of the VPX board card 6, the pushing mechanism 7 is arranged at the rear end of the arrangement of the VPX board card 6, a heat dissipation mechanism 8 and an adjusting mechanism 9 are connected to the pushing mechanism 7 in a transmission mode, the heat dissipation mechanism 8 is arranged in an inclined mode, specifically, the lower portion of the heat dissipation mechanism 8 is close to the VPX board card 6, and the upper portion of the heat dissipation mechanism is far away from the VPX board card 6. The pushing mechanism 7 can drive the heat dissipation mechanism 8 to reach the position of the VPX board card 6 to be tested, the heat dissipation mechanism 8 is adjusted through the adjusting mechanism 9, and the heat dissipation mechanism 8 can conveniently blow and dissipate heat of the VPX board card 6 to be tested. One end of the air inlet pipe 12 is communicated with the air inlet 3, the other end of the air inlet pipe 12 is communicated with the heat dissipation mechanism 8, the air inlet pipe 12 is provided with a first air pump 10, and outside cold air is transmitted to the heat dissipation mechanism 8 through the air inlet pipe 12 and the first air pump 10. Simultaneously, 13 one ends of heat dissipation tuber pipe intercommunication heat dissipation mechanism 8, 13 other ends of heat dissipation tuber pipe intercommunication air exit 4, just be equipped with second air pump 11 on the heat dissipation tuber pipe 13, can scatter and disappear heat production on the heat dissipation mechanism 8 through heat dissipation tuber pipe 13 and second air pump 11, the controller electricity is connected first air pump 10 and second air pump 11.

In this embodiment, the heat dissipation mechanism 8 can be driven by the pushing mechanism 7 to move along the setting direction of the VPX board card 6, and can also structurally adjust the heat dissipation of the VPX board card 6 to be measured, specifically, the heat dissipation mechanism 8 includes a semiconductor refrigeration piece 801, a front sealing cover 802, a rear sealing cover 803, a plug board 804, an inner cavity 805, a blowing hole 806, a hinge 807, a torsion spring (not shown in the figure) and a via hole 808. The front end and the rear end of the semiconductor refrigeration piece 801 are respectively a cold end and a hot end, the cold end of the semiconductor refrigeration piece 801 faces one side of the VPX board card 6, the front end and the rear end of the semiconductor refrigeration piece 801 are respectively provided with a front sealing cover 802 and a rear sealing cover 803, the rear sealing cover 803 is a hollow cavity covering the rear end of the semiconductor refrigeration piece 801, the front sealing cover 802 and the rear sealing cover 803 are same in material structure, the two sides of the front sealing cover 802 are provided with openings, and air introduced into the front sealing cover 802 is cooled by the cold end of the semiconductor refrigeration piece 801 and can be discharged outwards from the openings to dissipate heat. The two sides of the semiconductor refrigeration piece 801 are symmetrically provided with two insertion plates 804, the thickness of the insertion plates 804 is small, the insertion plates 804 can be conveniently inserted into a gap between two adjacent VPX board cards 6 for heat dissipation, the insertion plates 804 are hinged with the semiconductor refrigeration piece 801 through hinges 807, torsion springs (not shown in the figure) are arranged on the hinges 807, and when the insertion plates 804 are in an initial state, an included angle of 120 degrees is formed between the insertion plates 804 and the semiconductor refrigeration piece 801, so that when air exhausted from outlets on two sides of the front sealing cover 802 is blown onto the insertion plates 804, the flow direction of cold air is changed, and the cold air is blown away towards the directions of the VPX board cards 6 arranged in rows; simultaneously, set up obliquely blowhole 806 and straight through via hole 808 on the picture peg 804 inside wall, picture peg 804 is equipped with the cavity inner chamber 805, the inner chamber 805 with blowhole 806 and via hole 808 are linked together, just via hole 808 with preceding cover 802 opening is corresponding, consequently, picture peg 804 is when the regulation state, picture peg 804 with semiconductor refrigeration piece 801 is mutually perpendicular, just preceding cover 802 opening and via hole 808 intercommunication, the cold air in the preceding cover 802 enters into the cavity inner chamber 805 of picture peg 804 through 808 via hole, further outwards blows off from blowhole 806, and when the picture peg 804 of both sides inserted 6 both sides of VPX integrated circuit board, obliquely blowhole 806 can be to the cooling of blowing of VPX integrated circuit board 6. The controller is electrically connected with the semiconductor refrigeration chip 801.

In order to facilitate the pushing mechanism 7 to push the heat dissipation mechanism 8 to move, the lower portion of the insertion plate 804 does not touch the rear end of the VPX board card 6, and further, the lower portion of the insertion plate 804 is a rounded corner. Meanwhile, in order to prevent air leakage when the openings at the two sides of the front sealing cover 802 are butted with the inserting plate 804, the sealing ring 19 is arranged on the opening of the semiconductor refrigeration sheet 801.

Based on the above structure, further, the air inlet pipe 12 is communicated with the front sealing cover 802, the heat dissipation air pipe 13 is communicated with the rear sealing cover 803, and heat generated by the hot end of the semiconductor refrigeration piece 801 is taken out through the heat dissipation air pipe 13. Specifically, the collecting device further comprises a collecting cover 15 and a collecting pipe 16, wherein the collecting cover 15 is arranged in front of the VPX board cards 6 arranged in a row, the collecting cover 15 is communicated with one end of the collecting pipe 16, and the other end of the collecting pipe 16 is communicated with the rear sealing cover 803. Therefore, when the heat exchanger is used, after heat exchange is carried out between the cold air blown into the two sides of the VPX board card 6 to be measured through the air blowing holes 806 on the side plates and the VPX board card 6, the cold air enters the rear sealing cover 803 under the suction action of the second air pump 11, the heat dissipation air pipe 13 and the collecting cover 15, so that the rear end of the semiconductor refrigeration piece 801 can be blown, heat is taken away, and stable use of the semiconductor refrigeration piece 801 is guaranteed. In this embodiment, the rear enclosure 803 is configured to enclose heat generated at the rear end of the semiconductor cooling plate 801 therein, so that the heat is not dissipated to the outside and the temperature of the VPX board card 6 is not affected.

In this embodiment, the pushing mechanism 7 mainly has a structure of a lead screw 704, and specifically, the pushing mechanism 7 includes a guide rod 701, a guide ring 702, a driving motor 703, a lead screw 704, and a lead screw nut 705. The guide rod 701 and the lead screw 704 are arranged in parallel, the guide rod 701 is arranged at a position close to the lower end of the VPX board card 6, the lead screw 704 is arranged above the guide rod 701, and the distance between the lead screw 704 and the VPX board card 6 is larger than that between the guide rod 701 and the VPX board card 6, so that the heat dissipation mechanism 8 is in an inclined state in a natural state. Specifically, a guide ring 702 is sleeved on the guide rod 701, the guide ring 702 is connected with the lower end of the rear sealing cover 803, a driving motor 703 is arranged at the end of the lead screw 704, a lead screw nut 705 is sleeved on the lead screw 704, the lead screw nut 705 is connected with the rear sealing cover 803, and the driving motor 703 is electrically connected with the controller. Therefore, under the control of the controller, the driving motor 703 drives the lead screw 704 to rotate, and the lead screw nut 705 drives the heat dissipation mechanism 8 to move along the guide rod 701, and stops when the specified position of the VPX board card 6 is reached.

In order to realize that the heat dissipation mechanism 8 can be adjusted by the adjustment mechanism 9, so that the heat dissipation mechanism 8 is converted into an adjustment state in the initial state, further, a spring 14 is further included, one end of the spring 14 is connected to the lead screw nut 705, and the other end of the spring 14 is connected to the rear enclosure 803. The spring 14 has a certain mechanical strength, and when the screw nut 705 moves, the semiconductor cooling plate 801 can be moved together by the torque transmitted by the spring 14.

In order to realize the adjustment of the state of the heat dissipation mechanism 8, specifically, the adjustment mechanism 9 includes a connecting rod 901, a slide 902, an electromagnet 903, a main metal block 904, and an auxiliary metal block 905. The slide 902 is arranged above the guide rod 701 in parallel, preferably, the slide 902 is fixedly connected with the box body 1, and an electromagnet 903 is arranged in the slide 902 and generates magnetic force when the box body is in a power-on state. The electromagnet 903 is in transmission connection with the lead screw nut 705 through a connecting rod 901, and the lead screw nut 705 transmits torque to the electromagnet 903 through the connecting rod 901 to drive the electromagnet to slide in the slide 902. The upper part of the front sealing cover 802 is provided with a main metal block 904 matched with the electromagnet 903, and the upper part of the inner side of the inserting plate 804 is provided with an auxiliary metal block 905 matched with the electromagnet 903. Specifically, when the cooling device is used, the electromagnet 903 is controlled to be powered on through the controller to generate magnetism, so that attraction is generated between the main metal block 904 and the auxiliary metal block 905, the electromagnet 903 generates magnetic force for the two auxiliary metal blocks 905, the auxiliary metal block 905 drives the plug board 804 to rotate to be vertical to the semiconductor refrigeration piece 801, the main metal block 904 drives the front sealing cover 802 to be close to the rear end of the VPX board card 6 under the attraction effect of the electromagnet 903, the plug board 804 is inserted into gaps on two sides of the VPX board card 6 under the drive of the semiconductor refrigeration piece 801, and meanwhile the front sealing cover 802 is in contact with the rear end of the VPX board card 6 to generate a cooling effect. After the use, the electromagnet 903 loses the electromagnetic effect, and the semiconductor chilling plate 801 is pulled to return to the initial inclined position under the action of the elastic force of the spring 14, and meanwhile, the torsion spring generates restoring force to enable the side plate to return to the initial position.

Further, still include filter screen 17 and fan 18, all be equipped with filter screen 17 on air intake 3 and the air exit 4, just be equipped with fan 18 on the filter screen 17 on the air exit 4, fan 18 electric connection director.

The application process of the embodiment of the invention is as follows:

this application is through setting up pushing mechanism 7, heat dissipation mechanism 8 and adjustment mechanism 9, can be when carrying out the capability test to single VPX integrated circuit board 6, promote assigned position through pushing mechanism 7 with heat dissipation mechanism 8, and under adjustment mechanism 9's regulatory action, make heat dissipation mechanism 8 insert the 6 both sides of VPX integrated circuit board that awaits measuring, and blow in the gap of 6 both sides of VPX integrated circuit board with the low temperature air, and blow the direction towards 6 both sides faces of VPX integrated circuit board, thereby can improve the cooling ability of the VPX integrated circuit board 6 that awaits measuring, simultaneously with the hot-air escape in the gap between 6 both sides of VPX integrated circuit board and the adjacent VPX integrated circuit board 6, make the test of VPX integrated circuit board 6 more accurate. The VPX board cooling device is ingenious in structural design, convenient and efficient to use, good in cooling effect, and capable of greatly improving the performance test accuracy of the VPX board 6.

Although the invention has been described in detail above with reference to a general description and specific examples, it will be apparent to one skilled in the art that modifications or improvements may be made thereto based on the invention. Accordingly, such modifications and improvements are intended to be within the scope of the invention as claimed.

Claims

1. A performance test system based on an embedded VPX board comprises a box body, support legs, an air inlet and an air outlet, wherein the support legs are arranged at four corners of the bottom end of the box body, the air inlet is arranged at the center of the bottom of the box body, the air outlet is arranged at the center of the top of the box body, the performance test system is characterized by further comprising a controller, a battery module, the VPX board, a pushing mechanism, a heat dissipation mechanism, an adjusting mechanism, a first air pump, a second air pump, an air inlet pipe and a heat dissipation air pipe which are arranged in the box body, the battery module and the VPX board are vertically arranged in the box body, the pushing mechanism is arranged along the arrangement direction of the VPX board, the pushing mechanism is connected with the heat dissipation mechanism and the adjusting mechanism in a transmission mode, the heat dissipation mechanism is obliquely arranged, one end of the air inlet pipe is communicated with the air inlet, the other end of the air inlet pipe is communicated with the heat dissipation mechanism, and the first air pump is arranged on the air inlet pipe, one end of the heat dissipation air pipe is communicated with the heat dissipation mechanism, the other end of the heat dissipation air pipe is communicated with the air outlet, a second air pump is arranged on the heat dissipation air pipe, and the controller is electrically connected with the first air pump and the second air pump;

the heat dissipation mechanism comprises a semiconductor refrigeration piece, a front sealing cover, a rear sealing cover, inserting plates, an inner cavity, blowing holes, hinges, torsional springs and conducting holes, wherein the front end and the rear end of the semiconductor refrigeration piece are respectively a cold end and a hot end, the front end and the rear end of the semiconductor refrigeration piece are respectively provided with the front sealing cover and the rear sealing cover, the two sides of the front sealing cover are provided with openings, the two inserting plates are symmetrically arranged on two sides of the semiconductor refrigeration piece, the inserting plates are hinged to the semiconductor refrigeration piece through the hinges, the torsional springs are arranged on the hinges, oblique blowing holes and straight conducting holes are formed in the inner side walls of the inserting plates, the inserting plates are provided with hollow inner cavities, the inner cavities are communicated with the blowing holes and the conducting holes, the conducting holes correspond to the openings of the front sealing cover, and the controller is electrically connected with the semiconductor refrigeration piece;

the lower part of the plug board is a fillet, when the plug board is in an initial state, an included angle of 120 degrees is formed between the plug board and the semiconductor refrigeration piece, when the plug board is in an adjusting state, the plug board is vertical to the semiconductor refrigeration piece, and the opening of the front sealing cover is communicated with the through hole;

the pushing mechanism comprises a guide rod, a guide ring, a driving motor, a lead screw and a lead screw nut, the guide rod and the lead screw are arranged in parallel, the guide rod is sleeved with the guide ring, the guide ring is connected with the lower end of the rear sealing cover, the end part of the lead screw is provided with the driving motor, the lead screw is sleeved with the lead screw nut, the lead screw nut is connected with the rear sealing cover, and the driving motor is electrically connected with the controller;

adjustment mechanism includes connecting rod, slide, electro-magnet, main metal piece and vice metal piece, the slide parallel is located the guide bar top, just be equipped with the electro-magnet in the slide, the electro-magnet passes through the connecting rod transmission and connects screw nut, preceding cover upper portion be equipped with electro-magnet complex main metal piece, the inboard upper portion of picture peg be equipped with electro-magnet complex vice metal piece.

2. The embedded VPX board-based performance testing system of claim 1, wherein the air inlet duct is in communication with a front enclosure and the heat dissipation air duct is in communication with a rear enclosure.

3. The embedded VPX board-based performance testing system of claim 1, further comprising a spring, one end of the spring being connected to the lead screw nut, the other end of the spring being connected to the rear enclosure.

4. The embedded VPX board-based performance testing system of claim 1, further comprising a collection cover and a collection pipe, wherein the collection cover is arranged in front of the VPX boards arranged in a row, the collection cover is communicated with one end of the collection pipe, and the other end of the collection pipe is communicated with the rear sealing cover.

5. The embedded VPX board-based performance testing system of claim 1, further comprising a filter screen and a fan, wherein the filter screen is arranged on the air inlet and the air outlet, the fan is arranged on the filter screen on the air outlet, and the fan is electrically connected with the controller.

6. The embedded VPX board-based performance testing system of claim 1, further comprising a sealing ring, wherein the semiconductor chilling plate opening is provided with the sealing ring.