CN112073599A

CN112073599A - Camera module, circuit board assembly and manufacturing method thereof and electronic equipment

Info

Publication number: CN112073599A
Application number: CN201910498834.2A
Authority: CN
Inventors: 梅其敏; 黄桢; 栾仲禹; 席逢生; 梅哲文
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2019-06-11
Filing date: 2019-06-11
Publication date: 2020-12-11

Abstract

The invention provides a camera module, a circuit board assembly, a manufacturing method thereof and electronic equipment, wherein the circuit board assembly comprises a substrate, a photosensitive element and at least one molding base. The photosensitive element is electrically connected to the substrate, wherein the photosensitive element is integrally fixed to the substrate by the molding base, the molding base comprises a base inner wall, a base outer wall and further comprises a molding upper end surface and a molding lower end surface, wherein the base inner wall forms an optical window of the molding base, the base inner wall further comprises an inner inclined surface and an inner arc surface, the inner arc surface extends to the inner side surface, and the inner arc surface faces to the molding base.

Description

Camera module, circuit board assembly and manufacturing method thereof and electronic equipment

Technical Field

The invention relates to the field of optical imaging, in particular to a camera module, a circuit board assembly, a manufacturing method of the circuit board assembly and electronic equipment.

Background

At present, electronic devices are developing towards intellectualization and lightness and thinness, which puts more severe requirements on the volume and the imaging quality of a camera module, which is one of standard configurations of electronic products. The hardware basis of the high-pixel and high-quality camera module is that the photosensitive element has a larger photosensitive area and a larger number of passive components with larger sizes, and the size of the camera module is larger and larger due to the pursuit of the intelligent electronic equipment to higher pixels and higher quality, so that the development trend of the camera module is less and less consistent with the development trend of lightness and thinness of the electronic equipment.

Therefore, in order to reduce the size of the camera module, the camera module in the prior art uses a molding technique to encapsulate the photosensitive element in the camera module, so as to reduce the size of the camera module in the horizontal direction. Specifically, the electronic components of the camera module are attached to a circuit board through a surface attachment process, and then a molding material is integrally bonded to the circuit board through a molding process to form a base type circuit board. The prior art molding process is to place the semi-finished circuit board in a mold, form a mold base solidified on the circuit board after the molding material is filled, and then draw the mold to obtain the base type circuit board.

However, in order to facilitate the mold drawing and ensure the yield after the mold drawing, the mold drawing angle of the molded circuit board of the camera module in the prior art is smaller than 90 °, which also makes the structure of the molded base of the molded circuit board of the camera module a structure with a small top and a large bottom. This results in a very small width of the upper surface of the mold base, which places a very limited amount of space for subsequent processing operations. For example, the space reserved for the motor or mirror base to adhere to the upper surface of the mold is very small, and the amount of glue is not easy to control, and is usually insufficient, resulting in insufficient adhesion between the motor or mirror base and the upper surface of the mold base. Therefore, in order to ensure that the amount of glue is sufficient, the molding process in the prior art can only increase the width of the upper surface of the mold base, and thus the size of the lower surface of the mold base is increased, so that the size of the whole mold base is increased, and the size of the camera module is increased virtually.

In addition, this molding process of the prior art inevitably results in a structural characteristic of a mold base having a narrow top and a wide bottom due to a draft angle of less than 90 °, and an upper opening size of the mold base is larger than an opening size of a lower portion of the mold base under which a photosensitive element is mounted to the circuit board. Therefore, it is inevitable that stray light easily enters the photosensitive element, and thus an external stray light prevention structure is required, thereby increasing the number of molding structures and assembling processes on the other hand.

In addition, along with the appearance of comprehensive screen, terminal equipment (cell-phone) need higher screen to account for than, so need to make a video recording the module, especially leading the module of making a video recording is more close to the top at the mounted position at terminal, and the big end down's of mould base of the present module of making a video recording structure leads to the circuit board to be difficult to accomplish extremely narrow limit. In other words, the mold base of the camera module in the prior art has a structure with a small top and a large bottom due to the fact that the mold drawing angle is smaller than 90 °, and if one side of the circuit board is designed to be a very narrow side, one side of the upper surface of the mold base is inevitably narrower, which may cause the upper surface of the mold base to be unable to reliably attach the light-transmitting component, and cause unstable imaging of the camera module or even integral scrapping of the camera module.

Disclosure of Invention

One of the main advantages of the present invention is to provide a camera module, a circuit board assembly, a method for manufacturing the same, and an electronic device, wherein the camera module can be downsized on the premise of ensuring image quality, so that the camera module can meet the requirements of miniaturization and lightness of the electronic device.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method for manufacturing the same, and an electronic device, wherein the width of the camera module can be effectively reduced while ensuring the imaging quality, so as to reduce the occupation of the camera module in the internal space of the electronic device, thereby facilitating the design, processing, and development of the electronic device.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method of manufacturing the same, and an electronic apparatus, wherein the width of the circuit board assembly of the camera module can be effectively reduced, thereby facilitating the reduction of the width of the camera module while maintaining the stability of the structure of the camera module.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method for manufacturing the same, and an electronic device, wherein the area of the upper end surface of the mold base can be increased while the area of the lower end surface of the mold base is not changed, so as to provide a larger space for the AA process or the HA process, thereby improving the assembly yield of the electronic product.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method for manufacturing the same, and an electronic device, wherein a draft angle of at least one side of a mold base of the circuit board assembly is greater than 90 °, which is beneficial to increasing an area of an upper end surface of the mold base under the condition that an area of a lower end of the same mold base is not changed, thereby facilitating subsequent processing of the camera module.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method for manufacturing the same, and an electronic device, wherein a molding base of the circuit board assembly is extruded with a molding film through a mold during a molding process, and a molding space of the molding base is extruded by the molding film, so that a draft angle of the molding base is greater than 90 °.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method for manufacturing the same, and an electronic device, wherein a mold drawing angle of at least one side of a mold base of the circuit board assembly is greater than 90 °, and the camera module can increase a glue drawing width of an upper end surface of the mold base under the condition of reducing an overall size, so as to increase an acting force of a lens holder or IR attachment, which is beneficial to improving a manufacturing yield of the camera module.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method for manufacturing the same, and an electronic device, wherein a mold base of the circuit board assembly is integrally formed on a circuit board of the circuit board assembly through a molding process, wherein a draft angle during molding of the mold base is greater than 90 °, so that a size of an upper end surface of the mold base is greater than a size of a lower end surface of the mold base.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method for manufacturing the same, and an electronic device, wherein an inner draft angle of at least one side of the mold base of the circuit board assembly is greater than 90 °, wherein an inner surface of the mold base is inclined outward from top to bottom, so as to reduce external stray light reflected on the inner surface of the mold base, and improve an imaging performance of the camera module.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method for manufacturing the same, and an electronic device, wherein the mold extrudes the shaping film, such that an upper end of the shaping film formed on the inner side surface of the molding base is an inclined surface, and a lower end of the inner side surface of the molding base is an arc surface, which is beneficial for reducing external stray light reflected on the inner side surface of the molding base, and improving an imaging performance of the camera module.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method for manufacturing the same, and an electronic device, wherein the arc-shaped surface of the inner side surface of the mold base is rough, which is beneficial to reducing the reflection of the inner side surface of the mold base to stray light, thereby being beneficial to reducing the reflection of the stray light from the inner side surface of the mold base to a photosensitive element, and improving the imaging performance of the camera module.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method for manufacturing the same, and an electronic device, wherein an outer draft angle of at least one side of the mold base of the circuit board assembly is greater than 90 °, so that at least one outer side of the mold base is inclined inward from top to bottom, thereby reducing a size of the lower end of the mold base, facilitating to reduce the substrate of the circuit board assembly, and reducing an overall size of the camera module.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method for manufacturing the same, and an electronic device, wherein an inner draft angle of at least one side of the mold base of the circuit board assembly is greater than 90 °, an outer draft angle of the mold base is greater than 90 °, and the mold base is tapered from top to bottom to facilitate forming a narrow edge on the substrate of the circuit board assembly.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method for manufacturing the same, and an electronic device, wherein at least one side of the substrate of the circuit board assembly is a narrow side, and an inner draft angle of the mold base corresponding to the narrow side is greater than 90 ° and an outer draft angle of the mold base corresponding to the narrow side is greater than 90 °, so as to increase an area of the upper surface of the mold base corresponding to the narrow side, thereby facilitating the installation of the circuit board assembly and the transparent assembly.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method of manufacturing the same, and an electronic device, wherein at least one side of the circuit board assembly is a narrow side, and wherein the very narrow side of the camera module is mounted close to the top end of the electronic device, thereby improving the screen occupation ratio of the electronic device.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method of manufacturing the same, and an electronic device, in which a mold for processing a mold base is deformed by extruding a plastic film during the molding of the mold base, so that a draft angle of at least one side of the mold base during the mold draft is greater than 90 °.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method of manufacturing the same, and an electronic device, wherein the mold presses the shaping film to deform, a draft angle of the mold base is formed by the pressing deformation of the shaping film, and the shaping film returns to an initial state when the mold is drawn, so that the mold and the shaping film are released from the mold base.

Additional advantages and features of the invention will be set forth in the detailed description which follows and in part will be apparent from the description, or may be learned by practice of the invention as set forth hereinafter.

In accordance with one aspect of the present invention, the foregoing and other objects and advantages are achieved in a circuit board assembly comprising:

a substrate; and

at least one molded base, wherein said molded base comprises a base inner wall, a base outer wall and further having a molded upper end surface and a molded lower end surface, wherein said base inner wall forms an optical window of said molded base, wherein said base inner wall further has an inner side surface and an intrados surface, said intrados surface extending across said inner side surface, said intrados surface facing said molded base.

According to an embodiment of the present invention, the mold base is integrally formed on the substrate by a molding process, wherein the mold base is prepared by the following steps:

placing the substrate and the photosensitive element in a processing space of a mold, wherein the mold comprises an upper mold, a lower mold and a shaping film;

closing the upper die and the lower die to form a molding space between the plastic film and the substrate, wherein a spacer of the upper die extrudes the plastic film to form an inward extending portion, and the molding space is extruded outwards from the spacer by the inward extending portion;

adding a molding material into the molding space, and curing and molding in the molding space, wherein the inner wall of the base of the molding base is molded on the outer side of the inward extending part; and

demolding to mold the molding base on the substrate.

According to an embodiment of the present invention, an included angle between the inner side surface of the inner wall of the base and the substrate is less than or equal to 90 °, so that an inner draft angle of demolding the molding base is greater than or equal to 90 °.

According to an embodiment of the invention, the roughness of the intrados surface is greater than the roughness of the inner flank surface. .

According to an embodiment of the present invention, the base outer wall of the mold base has an outer side surface extending downwardly and obliquely inwardly from the mold upper end surface to the outer arcuate surface, and an outer arcuate surface extending upwardly and obliquely inwardly from the mold lower end surface of the mold base to the outer side surface.

closing the upper die and the lower die to form a molding space between the plastic film and the substrate, wherein a pressing block of the upper die presses the plastic film to generate an extension part, and the molding space is pressed inwards from the pressing block by the extension part;

adding a molding material into the molding space, and curing and molding in the molding space, wherein the base outer wall of the molding base is molded on the inner side of the extension part; and

demolding to mold the molding base on the substrate.

According to an embodiment of the present invention, an included angle between the outer side surface of the outer wall of the base and the substrate is less than or equal to 90 °, so that an external draft angle of the mold base for demolding is greater than or equal to 90 °.

According to an embodiment of the present invention, the circuit board assembly further includes a photosensitive element, wherein the photosensitive element is electrically connected to the substrate, and the photosensitive element is integrally fixed to the substrate by the mold base.

According to an embodiment of the present invention, the circuit board assembly further includes a photosensitive element electrically connected to the substrate, wherein the molding base is integrally disposed at an outer side of the photosensitive element.

According to an embodiment of the present invention, the photosensitive element includes a photosensitive portion and at least one non-photosensitive portion, wherein the non-photosensitive portion is located outside the photosensitive portion, wherein the non-photosensitive portion is electrically connected to the substrate, wherein the molding base covers above the non-photosensitive portion of the photosensitive element, and the photosensitive element is fixed to the substrate by the molding base.

According to an embodiment of the present invention, the substrate further has a substrate upper surface and a substrate lower surface corresponding to the substrate upper surface, wherein the photosensitive element is attached to the substrate upper surface, and wherein the molding base is integrally formed on the substrate upper surface.

According to an embodiment of the present invention, the circuit board assembly further includes a set of leads, wherein the leads electrically connect the non-photosensitive portion of the photosensitive element to the substrate, and the leads are embedded above the substrate by the molding base.

According to an embodiment of the present invention, the circuit board assembly further includes at least one electronic device, wherein the electronic device is disposed at the edge region of the substrate, and wherein the molding base embeds the electronic device on the substrate.

According to an embodiment of the present invention, the substrate is further provided with a bonding region and an edge region, wherein the photosensitive element is attached to the bonding region, the edge region is located at a periphery of the bonding region, wherein the photosensitive element is bonded to the substrate close to one side of the substrate, so that the edge region of the substrate forms at least one narrow edge and at least one load edge, wherein a width of the narrow edge is smaller than a width of the load edge.

According to an embodiment of the present invention, the circuit board assembly further comprises at least one electronic device, wherein the electronic device is disposed on the load side of the substrate, and wherein the molded base embeds the electronic device on the substrate.

According to another aspect of the present invention, the present invention further provides a camera module, including:

a circuit board assembly as described above;

a lens, wherein the lens is held above the photosensitive element along a photosensitive path of the photosensitive element; and

at least one filter element, wherein the filter element is held between the lens and the photosensitive element.

According to an embodiment of the present invention, the camera module further includes a driving device, wherein the driving device is disposed above the molding base, and the lens is mounted on the driving device, and the driving device drives the lens to move.

According to an embodiment of the present invention, the filter element is disposed above the mold base of the circuit board assembly, and the filter element is supported by the mold base.

According to an embodiment of the present invention, the image capturing module further includes a lens holder, wherein the lens holder is disposed between the driving device and the molding base, and the filter element is disposed on the lens holder and supported by the lens holder.

According to another aspect of the present invention, the present invention further provides an electronic device comprising:

an electronic device body; and

the camera module is mounted on the upper end of the electronic device body.

According to another aspect of the present invention, the present invention further provides a method of manufacturing a circuit board assembly, wherein the method of manufacturing includes the steps of:

(a) placing a substrate and at least one photosensitive element in a processing space of a mold, wherein the mold comprises an upper mold, a lower mold and a shaping film, and wherein the processing space is formed between the upper mold and the lower mold;

(b) closing the upper mold and the lower mold to form a molding space between the shaping film and the substrate, and extruding the shaping film to deform, the molding space being extruded by the shaping film;

(c) adding a molding material to the molding space, and curing the molding material in the molding space;

and

(d) and demolding the upper mold and the lower mold to mold a molding base on the substrate.

According to an embodiment of the present invention, in the step (a) of the method, the photosensitive element is attached to the upper surface of the substrate, and a set of leads is disposed, by which the photosensitive element is electrically connected to the substrate.

According to an embodiment of the present invention, before the step (b) of the method, the method further comprises the steps of: and extracting air between the shaping film and the upper die in an air extraction mode so as to attach the shaping film to the lower surface of the upper die.

According to an embodiment of the present invention, in the step (b) of the manufacturing method, a spacer of the upper mold presses the shaping film against the photosensitive element, wherein the shaping film is pressed to form an inward extending portion, wherein the inward extending portion presses the shaping space outward from the spacer, so that an inward draft angle of the molding base is equal to or greater than 90 °.

According to an embodiment of the present invention, in the step (c) of the manufacturing method, the molding material is formed outside the inward extending portion and cured to form a base inner wall of the molding base.

According to an embodiment of the present invention, in the step (c) of the above manufacturing method, a molding material fills the molding space, wherein the base inner wall of the mold base is molded outside the inward extending portion, and the inner side surface and the inward curved surface of the base inner wall are formed by the inward extending portion.

According to an embodiment of the present invention, in the step (b) of the manufacturing method, a pressing block of the upper mold presses the shaping film against the substrate, wherein the shaping film is pressed to form an extending portion, wherein the extending portion presses the shaping space inward from the isolation block, so that an outward draft angle of the molding base is greater than or equal to 90 °.

According to an embodiment of the present invention, in the step (c) of the manufacturing method, the molding material is formed inside the extension portion and cured to form a base outer wall of the molding base.

According to an embodiment of the present invention, in the step (c) of the above manufacturing method, a molding material fills the molding space, wherein the base outer wall of the molding base is molded inside the extension portion, and the outer side surface and the outer arc surface of the base outer wall are formed by the extension portion.

According to an embodiment of the present invention, step (d) of the method further comprises: and drawing the upper die of the die to relieve the pressure of the upper die on the shaping film, wherein the shaping film is restored to the initial state under the action of elasticity.

Further objects and advantages of the invention will be fully apparent from the ensuing description and drawings.

These and other objects, features and advantages of the present invention will become more fully apparent from the following detailed description, the accompanying drawings and the claims.

Drawings

Fig. 1 is a perspective view of an electronic device according to a first preferred embodiment of the invention.

Fig. 2 is an overall schematic view of a camera module of the electronic device according to the above preferred embodiment of the invention.

Fig. 3 is an exploded view of the camera module according to the above preferred embodiment of the invention.

Fig. 4 is a perspective sectional view of the camera module according to the above preferred embodiment of the invention.

Fig. 5A is a schematic perspective view of a circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 5B is a perspective cross-sectional view of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 5C is a schematic perspective view of a circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 5D is a perspective cross-sectional view of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 6A is a schematic perspective view of another circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 6B is a perspective cross-sectional view of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 6C is a perspective view of another circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 6D is a perspective cross-sectional view of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 7A is a perspective cross-sectional view of another circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 7B is a schematic diagram of an alternative implementation of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 7C is a schematic diagram of another alternative implementation of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 7D is a schematic diagram of another alternative implementation of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 7E is a schematic diagram of another alternative implementation of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 8 is an overall schematic view of another camera module of the electronic device according to the above preferred embodiment of the invention.

Fig. 9 is an exploded view of a camera module of the camera module according to the above preferred embodiment of the invention.

Fig. 10 is a perspective sectional view of the camera module according to the above preferred embodiment of the present invention.

Fig. 11A to 11G are schematic diagrams illustrating steps of a manufacturing process of a circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 12A to 12F are schematic diagrams illustrating steps of another manufacturing process of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 13A is a schematic diagram of another modified embodiment of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 13B is a schematic diagram of the molding of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 14 is a cross-sectional view of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

Fig. 15 is a schematic diagram of a modified implementation of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 16 is a schematic diagram of another variant of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 17 is a schematic diagram of another variant of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 18 is a perspective sectional view of a camera module according to a second preferred embodiment of the invention.

Fig. 19A is a schematic manufacturing flow chart of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 19B is a schematic diagram illustrating a circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be in a particular orientation, constructed and operated in a particular orientation, and thus the above terms are not to be construed as limiting the present invention.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

An electronic device according to a first preferred embodiment of the invention is illustrated in the following description with reference to figure 1 of the accompanying drawings. The electronic device comprises at least one camera module 100 and an electronic device body 200 carrying the camera module 100, wherein the electronic device body 200 controls the camera module 100 to shoot images. For example, the camera module 100 may be mounted on the electronic device body 200 in a manner of facing the front of the electronic device body 200, and the camera module 100 assists the electronic device body 200 in capturing image information in front of the electronic device. In short, the camera module 100 is used as a front camera of the electronic device. It is understood that, in the preferred embodiment of the present invention, the manner in which the camera module 100 is mounted to the electronic device body 200 is merely exemplary and not limiting. Therefore, the at least one camera module 100 can be further mounted on the electronic device body 200 in a manner of facing the back of the electronic device body 200, that is, the camera module 200 serves as a rear camera of the electronic device to capture image information behind the electronic device.

By way of example, the electronic device may be embodied as a smartphone. In the drawings of the present specification, the camera in the electronic device is shown as a single camera, but in other embodiments, the camera module may be implemented as an array camera module, such as a dual camera module, a triple camera module, or other multi-camera modules. In addition, the type of the electronic device is only taken as an example, and the drawings in the specification of the present invention take a mobile phone device as an example, but not limited to a smart phone device, and the electronic device may also be implemented as other electronic devices with a shooting function, such as a tablet computer, a smart home electronic device, and other kinds of electronic devices.

Referring to fig. 2 to 7B of the drawings of the present specification, the camera module 100 of the electronic device according to the above preferred embodiment of the present invention is illustrated in the following description. The camera module 100 includes at least one circuit board assembly 10 and at least one lens 20, wherein the lens 20 is held above the circuit board assembly 10 along a photosensitive path of the camera module 100, and light is received by the lens 20 to the circuit board assembly 10, so that the circuit board assembly 10 receives the light and converts an optical signal of the light into an electrical signal. The circuit board assembly 10 includes a substrate 11, a molding base 12, and a photosensitive element 130, wherein the photosensitive element 130 is disposed on the substrate 11, the molding base 12 is integrally formed on the substrate 11, and the photosensitive element 130 is fixed on the substrate 11 by the molding base 12.

The photosensitive element 130 is electrically connected to the substrate 11 of the circuit board assembly 10, and the substrate 11 transmits the electrical signal generated by the photosensitive element 130 to the electronic device body 200. Accordingly, when the camera module 100 is mounted to the electronic apparatus body 200, the circuit board assembly 10 of the camera module 100 is communicatively connected to the electronic apparatus body 200.

In the present invention, the circuit board assembly 10 is formed by integrally molding the mold base 12 on the substrate 11 by a molding process. The image capturing module 100 further includes at least one filter element 40, wherein the filter element 40 is disposed between the photosensitive element 130 and the lens 20, and the filter element 40 filters stray light transmitted from the lens 20 to the photosensitive element 130, which is helpful for improving the imaging quality of the image capturing module 100.

As shown in fig. 2 to 4, the lens 20 is an optical system element of the camera module 100, wherein the lens 20 includes at least one optical lens 21 and at least one lens barrel 22, and the optical lens 21 is disposed on the lens barrel 22 based on an optical axis of the camera module. Preferably, in the preferred embodiment of the present invention, the number of the optical lenses 21 of the lens barrel 20 is a plurality of pieces, wherein the optical lenses 21 are disposed on the lens barrel 22 based on the optical axis direction. The lens barrel 22 holds the optical lens 21 of the lens 20 above the photosensitive path of the photosensitive element 130.

In the first preferred embodiment of the present invention, the filter element 40 of the camera module 100 is disposed on the mold base 12 of the circuit board assembly 10, and the filter element 40 is held by the mold base 12. Preferably, in the first preferred embodiment of the present invention, the filter element 40 is attached to the upper side of the mold base 12 in an attaching manner. It is noted that the manner in which the filter element 40 is mounted in the present invention is provided herein by way of example only, and not by way of limitation. Therefore, the filter element 40 can be disposed on the mold base 12 by other mounting methods, such as mounting the filter element 40 on the mold base 12 by a mounting bracket, and fixedly holding the position of the filter element 40 by the mounting bracket; or the filter element 40 is disposed on a support, which is disposed above the photosensitive element 130.

As shown in fig. 2 to 4, the camera module 100 further includes a driving device 50, wherein the at least one lens 20 is disposed on the driving device 50, and the driving device 50 holds the lens 20 above the photosensitive element 130 based on the photosensitive path. The driving device 50 is disposed on the mold base 12 of the circuit board assembly 10, wherein the driving device 50 is supported by the mold base 12 to drive the lens 20 to move. The driving device 50 may be attached to the top of the mold base 12 by gluing. The lens barrel 22 of the lens 20 is drivably disposed on the driving device 50, wherein the driving device 50 drives the lens barrel 22 to move.

It will be understood by those skilled in the art that the driving device 50 of the camera module 100 can be, but is not limited to, a motor, such as a voice coil motor, wherein the driving device 50 drives the lens 20 to move along the upper portion of the photosensitive path of the photosensitive element 130.

It should be noted that, in the first preferred embodiment of the present invention, the driving device 50 and the filter element 40 are attached or glued to the upper surface of the mold base 12. Therefore, the upper surface of the mold base 12 of the circuit board assembly 10 needs to reserve a sufficiently large attachment surface for the driving device 50 and the filter element 40 to be attached.

As shown in fig. 2 to 4, the molding base 12 is integrally formed on the substrate 11 by a molding process, wherein a molding material forming the molding base 12 wraps around the substrate 11. It is understood that, since the molding material is integrally formed on the surface of the substrate 11, the surface area of the substrate 11 has a size at least greater than or equal to the size of the bottom of the molding base 12, so that the substrate 11 can sufficiently support the molding material. As will be appreciated by those skilled in the art, as the lower portion of the mold base 12 is reduced in size, the substrate 11 corresponding to the lower portion of the mold base 12 may be reduced in size, thereby reducing the overall size of the circuit board assembly 10 while sufficiently carrying the mold base 12.

It should be noted that, in the preferred embodiment of the present invention, the molding base 12 fixedly mounts the photosensitive element 130 on the substrate 11 through a molding process.

The mold base 12 includes a base upper end portion 121 and a base lower end portion 122, wherein the base upper end portion 121 integrally extends upward from the base lower end portion 122, and the base lower end portion 122 integrally adheres to the upper surface of the base plate 11. Preferably, the mold base 12 has a structure with a large top and a small bottom, wherein the size of the base upper end 121 of the mold base 12 is larger than that of the base lower end 122. In short, the mold base 12 has a structure with a large top and a small bottom, wherein the lower portion of the mold base 12 has a small size so as to reduce the overall width dimension of the circuit board assembly 10. Preferably, the size of the base upper end portion 121 of the mold base 12 is larger than the size of the base lower end portion 122, so that the base upper end portion 121 of the mold base 12 has enough space for the driving device 50 and the filter element 40 to adhere to the base upper end portion 121. In other words, the structural size of the base upper end 121 is larger than that of the base lower end 122, and when the size of the base lower end 122 is reduced to reduce the width of the substrate 11 of the circuit board assembly 10, the base upper end 121 of the mold base 12 HAs enough space for subsequent processing processes, such as AA process and HA process.

The mold base 12 further has a mold top surface 123 and a mold bottom surface 124, wherein the mold top surface 123 is located on the top surface of the mold base 12, i.e., the top surface of the base top end 121; wherein the molded lower end surface 124 is formed on the lower surface of the molded base 12, i.e., the lower surface of the base lower end portion 122. It is understood that the molded lower end surface 124 is integrally formed on the upper surface of the base 11 by the molding material through the molding process, or the molded lower end surface 124 is integrally attached to the upper surface of the base 11 in a face-to-face manner through the molding process.

It is worth mentioning that the molding upper end surface 123 is a smooth surface formed on the upper surface of the molding base 12, so as to coat the molding upper end surface 123 with a glue layer and provide a uniform supporting force to the supported object.

Preferably, the size and area of the molded upper end surface 123 are larger than the size and area of the molded lower end surface 124, so that the molded upper end surface 123 of the mold base 12 can provide enough space for the filter element 40 and the driving device 50 to meet the processing requirements of the mold base 12. It is understood that, in the case that the molded upper end surface 123 of the molded base 12 HAs a size that meets the requirements of subsequent processing (such as AA process or HA process), the molded lower end surface 124 of the molded base 12 HAs a size that is smaller than the size of the molded lower end surface 123, so as to reduce the width dimension of the substrate 11 of the circuit board assembly 10, thereby reducing the size of the overall dimension of the circuit board assembly 10. In other words, while the size of the mold upper end surface 123 of the mold base 12 remains unchanged, the size of the mold lower end surface 124 is reduced by reducing the size of the base lower end portion 122 of the mold base 12, thereby facilitating a reduction in the width dimension of the substrate 11 of the circuit board assembly 10.

As will be appreciated by those skilled in the art, the size of the substrate 11 of the circuit board assembly 10 is a major factor that limits the overall width dimension of the camera module 100. Therefore, when the width dimension of the substrate 11 of the circuit board assembly 10 is reduced, it is advantageous to reduce the overall size of the camera module 100. When the size of the camera module 100 is reduced and the camera module 100 is installed in the electronic device body 200, the ratio of the camera module 100 to the electronic device body 200 can be reduced, which is beneficial to improving the screen occupation ratio of the electronic device.

When the size and area of the molded lower end surface 124 of the mold base 12 are kept unchanged, the base upper end 121 of the mold base 12 can be enlarged, and the area of the molded upper end surface 123 can be enlarged, so that the size of the contact surface between the driving device 50 and the filter element 40 and the circuit board assembly 10 is increased, the glue can be easily painted on the molded upper end surface 123 of the mold base 12, and the glue width can be increased. As will be understood by those skilled in the art, when the camera module 100 is assembled, the space reserved for the AA process and the HA process is very small, and the size of the molded upper end surface 123 of the mold base 12 can be increased to increase the processing space reserved for the AA process or the HA process, thereby improving the yield of the AA process.

The mold base 12 of the circuit board assembly 10 further includes a base inner wall 125 and a base outer wall 126, wherein the base inner wall 125 is formed on an inner side inner wall of the mold base 12, and wherein the base outer wall 126 is formed on an outer side outer wall of the mold base 12. It is understood that the base inner wall 125 and the base outer wall 126 of the molded base 12 are formed inside and outside the molded base 12 by being drawn out through a molding process. Preferably, in the first preferred embodiment of the present invention, the base inner wall 125 of the molding base 12 is a slope inclined outward from top to bottom of the molding base 12. In other words, the inner side surface of the mold base 12 is inclined downward toward the substrate 11 of the circuit board assembly 10, wherein the projection of the base inner wall 125 in the vertical direction is covered by the projection of the mold upper end surface 124 in the vertical direction, i.e., in the light-sensing path direction of the camera module 100, the projection of the base inner wall 125 is covered by the projection of the mold upper end surface 124.

Preferably, the base inner wall 125 and the base outer wall 126 of the mold base 12 are formed on the inner side and the outer side of the mold base 12, or are formed as a curved surface having a certain curvature shape, or are formed as an irregular curved surface. Therefore, in the present invention, the shape, curvature and smoothness of the base inner wall 125 and the base outer wall 126 are not limited thereto.

As will be understood by those skilled in the art, when external stray light is transmitted to the circuit board assembly 10 through the lens 20 of the camera module 100, the mold base 12 of the circuit board assembly 10 can reduce the stray light from entering the photosensitive element 130 in a reflective manner, so that the influence of the stray light on the imaging of the camera module 100 can be effectively reduced, and the imaging performance of the camera module 100 can be improved. The inner wall 125 of the base of the molding base 12 faces the substrate 11 of the circuit board assembly 10, so as to prevent stray light from irradiating the inner wall 125 of the base and being reflected to the photosensitive element 130. In short, the mold base 12 has the base inner wall 12 facing inward and inclined downward, so that stray light reflected to the photosensitive element 130 by the base inner wall 12 of the mold base 12 is reduced, thereby improving the imaging quality of the camera module 100.

Preferably, in this preferred embodiment of the present invention, the base interior wall 125 of the mold base 12 is a roughened surface formed on the inside of the mold base, wherein the roughness of the base interior wall 125 of the mold base 12 is greater than the roughness of the upper surface of the mold base 12. In other words, the base inner wall 125 of the molded base 12 is a non-smooth surface to reduce the reflection of light by the base inner wall 125, which is beneficial to reduce the stray light reflected by the base inner wall 125.

Each base inner wall 125 of the mold base 12 has an inner side surface 1251 and an inner arc surface 1252 formed by extending the inner side surface 1251 integrally downward, wherein the inner side surface 1251 extends downward and obliquely outward from an inner side edge of the mold upper end surface 123 of the mold base 12 to the inner arc surface 1252. The intrados 1252 extends upwardly and obliquely outwardly from the molded lower end surface 124 of the mold base 12 to the inner side surface 1251. It should be noted that the inner side surface 1251 of the base inner wall 125 of the mold base 12 may also be a vertical surface perpendicular to the mold upper end surface 123, that is, the inner side surface 1251 is perpendicular to the mold upper end surface 123. Preferably, the inner side surface 1251 of the base inner wall 125 is an inclined plane of the base inner wall 125. The intrados 1252 opens toward the inside of the mold base 12. The inner arc surface 1252 of the base inner wall 125 is a rough surface formed at the lower end of the base inner wall 125, wherein the inner arc surface 1252 of the base inner wall 125 is formed inside the lower portion of the mold base 12. It can be understood that the inner arc surface 1252 in the form of a rough surface can reduce the reflection of light, so that the inner arc surface 1252 can reduce the stray light reflected to the light-sensing element 130, which is beneficial to improving the imaging performance of the camera module 100.

Preferably, in the first preferred embodiment of the present invention, the base outer wall 126 of the mold base 12 is a slope formed on the base 12 and inclined inward from top to bottom, wherein a projection of the base outer wall 126 in a vertical direction is covered by a projection of the mold upper end surface 124 in the vertical direction, that is, in a direction of a photosensitive path of the camera module 100, a projection of the base outer wall 126 is covered by the mold upper end surface 124. In short, the mold base 12 is a structure with a large top and a small bottom, wherein the base outer wall 126 of the mold base 12 is inclined downward toward the substrate 11 of the circuit board assembly 10. The base upper end 121 of the mold base 12 extends inward from top to bottom to the base lower end 122 of the mold base 12, and the size of the base lower end 122 of the mold base 12 is smaller than the size of the base upper end 121. The base lower end 122 of the mold base 12 is reduced in size to reduce the width dimension of the base plate 11 of the circuit board assembly 10.

Each base outer wall 126 of the mold base 12 has an outer side surface 1261 and an outer arcuate surface 1262, wherein the outer side surface 1261 extends downwardly and obliquely inwardly from an outer edge of the mold upper end surface 123 of the mold base 12 to the outer arcuate surface 1262. The outer arcuate surface 1262 extends upwardly and obliquely inwardly from the mold lower end surface 124 of the mold base 12 to the outer side surface 1261. It should be noted that the outer side surface 1261 of the base outer wall 126 of the mold base 12 may also be a vertical surface perpendicular to the mold upper end surface 123, that is, the outer side surface 1261 is perpendicular to the mold upper end surface 123. Preferably, the outer side surface 1261 of the base outer wall 126 is an inclined plane of the base outer wall 126. The outer curved surface 1262 opens toward the outside of the mold base 12 or toward the substrate 11. The outer arcuate surface 1262 of the base outer wall 126 is formed outwardly of a lower portion of the mold base 12, wherein the outer arcuate surface 1262 of the base outer wall 126 is outwardly and inwardly concave to reduce the size of the base lower end 122 of the mold base 12.

In the first preferred embodiment of the present invention, the driving device 50 of the camera module 100 is disposed on the molding base 12 of the circuit board assembly 10 by gluing. The camera module 100 further includes a base adhesive layer 60, wherein the base adhesive layer 60 is formed on the base upper end surface 123 of the mold base 12 in a glue painting manner. It is understood that the base glue layer 60 can also be implemented to be formed at the bottom of the driving device 50 in a painting process.

As shown in fig. 2 to fig. 5A, the molding base 12 is further provided with a painting area 127, wherein the painting area 127 is located on the base upper end surface 123 of the molding base 12. The glue is painted to the painting area 127, and the base glue layer 60 is formed over the painting area 127. It is understood that the base glue layer 60 may be formed of a solid glue material, a fluid glue material, or the like. In the case that the base lower end portion 122 of the mold base 12 is reduced, or the size of the base lower end portion 122 is kept unchanged, the base upper end portion 121 of the mold base 12 may be enlarged to increase the size of the base upper end surface 123 of the mold base 12, so as to increase the width of the painting area 127, so as to increase the width of the base glue layer 60 of the camera module 100. As will be understood by those skilled in the art, increasing the width of the base glue layer 60 of the camera module 100 by increasing the width of the glue area 127 of the mold base 12 facilitates the attachment of the mold base 12 to the driving device 50 and improves the reliability of the attachment.

As shown in fig. 2 to 4, the circuit board assembly 10 of the camera module 100 further includes a set of leads 13, wherein the leads 13 connect the photosensitive element 130 to the substrate 11. The substrate 11 of the circuit board assembly 10 is communicated with the photosensitive element 130 through the lead 13, so that the photosensitive element 130 transmits an electrical signal to the substrate 11 of the circuit board assembly 10 through the lead 13.

Preferably, in the first preferred embodiment of the present invention, the leads 13 of the circuit board assembly 10 and the photosensitive element 130 of the camera module 100 are embedded in the mold base 12 to reduce the size of the width dimension of the camera module 100. In other embodiments, the mold base 12 is integrally formed on the substrate 11 so as to surround the photosensitive element 130 and the leads 13.

It will be understood by those skilled in the art that the leads 13 of the circuit board assembly 10 are embedded in the mold base 12, and the mold base 12 further fixes the photosensitive element 130 to the substrate 11. The leads 13 and a portion of the photosensitive element 130 are embedded by the mold base 12, so as to reduce the size of the substrate 11 of the circuit board assembly 10 and improve the utilization rate of the photosensitive element 130.

Further, the circuit board assembly 10 further has an optical window 14, wherein the optical window 14 is formed on the inner side of the mold base 12 by a molding process. The lens 20 transmits light to the photosensitive element 130 through the optical window 14. It will be appreciated that the light window 14 is defined by the base interior wall 125 of the molded base 12. Preferably, the size of the opening of the light window 14 should be adapted to the light-sensing element 130, so that the light entering the module can be received by the light-sensing element 130. The size of the upper opening of the optical window 14 is smaller than or equal to the size of the lower opening of the optical window 14, wherein the upper opening of the optical window 14 limits the amount of light transmission of the camera module 100. The upper opening of the optical window 14 can limit the entrance of a part of external stray light, and at the same time, the base inner wall 125 faces the substrate 11 of the circuit board assembly 10, and light entering cannot be reflected by the base inner wall 125, so that the generation of stray light is avoided, and the imaging quality of the camera module 100 is improved.

As shown in fig. 2 to 4, the photosensitive element 130 further includes a photosensitive portion 31 and a non-photosensitive portion 32, wherein the non-photosensitive portion 32 integrally extends outward from the photosensitive portion 31. The light sensing portion 31 receives the light transmitted by the lens 20 and converts the light signal into a corresponding electrical signal. The lead 13 is connected to the non-photosensitive portion 32 of the photosensitive element 130 and the substrate 11 of the circuit board assembly 10, so that the photosensitive element 130 transmits the photoelectrically converted signal to the substrate 11 through the lead 13. Preferably, in the first preferred embodiment of the present invention, the light window 14 corresponds to the light sensing portion 31 of the light sensing element 130. Accordingly, the non-light-sensing portion 31 of the light-sensing element 130 is embedded in the molding base of the circuit board assembly 10. The molding base 12 fixes the photosensitive element 130 on the upper surface of the substrate 11.

The lower surface of the photosensitive element 130 is attached above the substrate 11, wherein the upper surface of the photosensitive element 130 has a photosensitive area 33 and a non-photosensitive area 34, the non-photosensitive area 33 is located on the upper end surface of the photosensitive portion 31, and the non-photosensitive area 34 is located on the upper end surface of the non-photosensitive portion 32 and the edge portion of the upper end surface of the photosensitive portion 31. Specifically, the size of the photosensitive region 33 of the photosensitive unit 30 corresponds to the size of the upper opening (aperture) of the optical window 14, and the portion of the mold base 12 covering the upper surface of the photosensitive element corresponds to the non-photosensitive region 34 of the photosensitive element 130. The light sensing area 33 of the light sensing element 130 receives the light transmitted by the lens 20 based on the light window 14.

As shown in fig. 2 to 4, the circuit board assembly 10 further includes at least one electronic device 15, wherein the electronic device 15 is disposed on the surface of the substrate 11. Preferably, the at least one electronic device 15 is attached to the edge of the substrate 11, and the electronic device 15 is embedded on the upper surface of the substrate 11 by the molding base 12. The electronic components 15 of the circuit board assembly 10 are covered by the mold base 12, and the electronic components 15 are isolated by the mold base 12, so that the electronic components 15 of the circuit board assembly are protected from oxidation due to long-term environmental contact.

The substrate 11 has a substrate upper surface 111 and a substrate lower surface 112 corresponding to the substrate upper surface 111, wherein the photosensitive element 130 and the electronic device 15 are attached to the substrate upper surface 111. The mold base 12 is integrally formed on the upper surface 111 of the substrate 11, wherein a width dimension of the substrate upper surface 111 of the substrate 11 is greater than or equal to a width dimension of the mold base 12. When the width dimension of the mold base 12 can be reduced, the dimension of the substrate 11 corresponding to the lower end of the mold base 12 can be correspondingly reduced, thereby reducing the width dimension of the circuit board assembly 10, which is beneficial for reducing the overall dimension of the camera module 100.

The substrate 11 is further provided with a bonding region 113 and an edge region 114, wherein the photosensitive element 130 is attached to the bonding region 113 of the substrate 11, and the edge region 114 is located at the periphery of the bonding region 113. The mold base 12 is integrally formed on the edge region 114 of the substrate 11. Preferably, the base lower end 122 of the mold base 12 covers or is embedded in the edge region 114 of the substrate 11. Optionally, the size of the edge region 114 of the substrate 11 is greater than or equal to the size of the base lower end 122 of the mold base 12. Therefore, the size of the substrate 11 of the circuit board assembly 10 can be reduced by reducing the size of the base lower end portion 122 of the mold base 12, thereby reducing the overall size of the camera module 100.

Referring to fig. 5A-7B of the drawings accompanying this specification, there are shown several alternative embodiments of the circuit board assembly 10 of the above-described preferred embodiment of the present invention. The substrate 11 of the circuit board assembly 10 is connected to the photosensitive element 20 through the leads 13, wherein the electronic device 15 is disposed on the upper surface of the substrate 11. After the electronic device 15 and the circuit board assembly 10 are disposed on the substrate 11, the substrate 11 is placed in a mold 300 for molding, and the mold 300 integrally molds the molding base on the upper surface of the substrate 11. It should be noted that, during the molding process of the circuit board assembly 10, the mold drawing angle of the mold drawing process for forming the mold base 12 is greater than or equal to 90 ° (including 90 °), so that after the mold base 12 is formed on the substrate 11, the size of the base upper end 121 of the mold base 12 is greater than the size of the base lower end 122.

As shown in fig. 7C, two different embodiments of the inner side surface 1251 and the inner arc surface 1252 of the base inner wall 125 of the mold base 12 are shown, wherein the inner arc surface 1252 is recessed from the inside to the outside to form a groove, wherein the inner side surface 1251 is located above the groove. In another embodiment, the inner side surface 1251 of the base inner wall 125 of the mold base 12 extends downward smoothly to the inner arc surface 1252, wherein a connecting portion of the inner side surface 1251 and the inner arc surface 1252 has a smooth chamfer.

In particular, the molding material impacts the molding base 12 formed above the substrate 11 and/or the photosensitive element 130, and the base inner wall 125 thereof forms an inner side surface, an inner arc surface, and a slope. The inner side surface is located above the inner arc surface, and the inclined surface is an inclined surface formed by the molding material impacting above the substrate 11 or the photosensitive element 130.

It is worth mentioning that the draft angle of the draft process for forming the molding base 12 includes at least an inner draft angle and at least an outer draft angle, wherein the inclination angle and the shape of the base inner wall 125 of the molding base 12 depend on the size of the inner draft angle, and wherein the inclination angle and the shape of the base outer wall 126 of the molding base 12 depend on the outer draft angle. In the preferred embodiment of the present invention, at least one draft angle in the molding process of the mold base 12 is greater than or equal to 90 °.

As shown in fig. 5A to 5D, the inner draft angle of at least one side of the mold base 12 is greater than or equal to 90 ° (including 90 °), so that the base inner wall 125 of at least one side of the molded base 12 after molding extends obliquely outward from top to bottom. The outer side of the mold base 12 is formed at an angle of 90 ° or less (including 90 °) to the base plate 11 so that the base outer wall 126 of the mold base 12 after formation is inclined inward from top to bottom. Preferably, the inner draft angle of each side of the mold base 12 is equal to or greater than 90 ° (including 90 °), so that the base inner wall 125 of the mold base 12 is inwardly inclined to prevent stray light from being reflected by the base inner wall 125 into the photosensitive element 130.

The included angle between the inner wall 125 of the base of the molding base 12 and the vertical direction of the molding base 12 is θ₁Wherein the angle θ₁Greater than 0. It is understood that the inner base wall of the molding base 12 extends from the molding base 12 in an inward direction and obliquely upward, and the included angle between the inner base wall 125 and the vertical direction of the molding base 12 is adjusted to be θ by adjusting the inner draft angle while the area of the molding lower end surface 124 of the molding base 12 is kept constant₁To increase the area of the base upper end surface 123 of the molded base 12 to facilitate a subsequent AA process or HA process.

The included angle between the base inner wall 125 of the molding base 12 and the plane of the substrate 11 is α 1, where α 1 is less than or equal to 90 °, and α 1 and the included angle θ₁The sum of (a) and (b) is 90 °. Preferably, the included angle between the inner wall 125 of the base and the plane of the substrate 11 is an acute angle α 1 smaller than 90 °. It will be appreciated that the molded base 12 has an inside draft angle of 90 + θ₁。

It is worth mentioning that the base inner wall 125 of the molding base 12 may be a plane or a curved surface formed inside the molding base 12. As shown in fig. 5C and 5D, the base inner wall 125 is a curved surface formed inside the mold base 12, wherein the base inner wall 125 has a certain curvature, and a projection of the base inner wall 125 is covered by the base upper end surface 123 of the mold base 12 along a photosensitive path direction of the camera module 100, that is, in a vertical direction of the camera module 100.

Referring to fig. 6A to 6D of the drawings accompanying this specification, another alternative embodiment of the mold base 12 of the camera module 100 according to the above preferred embodiment of the present invention is illustrated in the following description. The mold base 12 of the camera module 100 is integrally formed on the substrate 11 of the circuit board assembly 10 by a molding process, and an outward draft angle of at least one side of the mold base 12 is greater than or equal to 90 ° (including 90 °), so that the base outer wall 126 of at least one side of the molded mold base 12 is inclined inward from top to bottom. The inner side edge of the mold base 12 is formed at an angle of 90 ° or less (including 90 °) to the base plate 11 so that the base outer wall 126 of the mold base 12 after formation is inclined inward from top to bottom. Preferably, the in-draft angle of each side of the molded base 12 is greater than 90 ° (including 90 °), so that the base outer wall 126 of the molded base 12 slopes inwardly from top to bottom. The included angle between the outer base wall 126 of the molding base 12 and the vertical direction of the molding base 12 is θ₂Wherein the angle θ₂Greater than 0.

The included angle between the base outer wall 126 of the molding base 12 and the plane of the substrate 11 is α 2, where α 2 is less than or equal to 90 °, and α 2 and the included angle θ₂The sum of (a) and (b) is 90 °. Preferably, the included angle between the outer wall 126 of the base and the plane of the substrate 11 is an acute angle α 2 smaller than 90 °. It will be appreciated that the molded base 12 has an inside draft angle of 90 + θ₂。

It is worth mentioning that the base outer wall 126 of the mold base 12 may be a plane or a curved surface formed outside the mold base 12. As shown in fig. 6C and 6D, the base outer wall 126 is a curved surface formed on the outer side of the mold base 12, wherein the base outer wall 126 has a certain curvature, and a projection of the base outer wall 126 is covered by the base upper end surface 123 of the mold base 12 along a photosensitive path direction of the camera module 100, that is, in a vertical direction of the camera module 100.

Accordingly, when the size of the base upper end 121 of the mold base 12 is kept constant and sufficient to support and assemble the driving device 50 and the green light element 40, the base lower end 122 of the mold base 12 extends obliquely inward from the base upper end 121, so that the bottom end of the mold base 12 becomes smaller, thereby facilitating reduction in size of the substrate 11 of the circuit board assembly 10 and, consequently, reduction in overall size of the camera module.

Referring to fig. 7A-7E of the drawings accompanying this specification, further alternative embodiments of the molded base 12 of the camera module 100 according to the above preferred embodiment of the invention are set forth in the following description. The mold base 12 of the camera module 100 is integrally formed on the substrate 11 of the circuit board assembly 10 by a molding process, and an outward draft angle of at least one side of the mold base 12 is greater than or equal to 90 ° (including 90 °), so that the base outer wall 126 of at least one side of the molded mold base 12 is inclined inward from top to bottom. The varied draft angle of the inside of the mold base 12 is greater than or equal to 90 ° (including 90 °), so that the base outer wall 126 of the molded base 12 after molding is inclined outward from top to bottom. Preferably, the inner draft angle of each side of the mold base 12 is greater than 90 ° and the outer draft angle is greater than 90 °, so that the molded mold base 12 after being formed is a structure with a large top and a small bottom, wherein the size of the upper end 121 of the mold base 12 is larger than that of the lower end 122. The included angle between the inner wall 125 of the base of the molding base 12 and the vertical direction of the molding base 12 is θ₁Wherein the angle θ₁Greater than 0. The included angle between the outer base wall 126 of the molding base 12 and the vertical direction of the molding base 12 is θ₂Wherein the angle θ₂Greater than 0.

The included angle between the base inner wall 125 of the molding base 12 and the plane of the substrate 11 is α 1, where α 1 is less than or equal to 90 °, and α 1 and the included angle θ₁The sum of (a) and (b) is 90 °. Preferably, the included angle between the inner wall 125 of the base and the plane of the substrate 11 is an acute angle α 1 smaller than 90 °. Can understand thatThat is, the inner draft angle of the mold base 12 is 90 ° + θ₁. The included angle between the base outer wall 126 of the molding base 12 and the plane of the substrate 11 is α 2, where α 2 is less than or equal to 90 °, and α 2 and the included angle θ₂The sum of (a) and (b) is 90 °. Preferably, the included angle between the outer wall 126 of the base and the plane of the substrate 11 is an acute angle α 2 smaller than 90 °. It will be appreciated that the molded base 12 has an inside draft angle of 90 + θ₂。

It is worth mentioning that the base inner wall 125 of the molding base 12 may be a plane or a curved surface formed inside the molding base 12. As shown in fig. 7C and 7D, the base inner wall 125 is a curved surface formed inside the mold base 12, wherein the base inner wall 125 and the base outer wall 126 have a certain curvature, and a projection of the base inner wall 125 and the base outer wall 126 is covered by the base upper end surface 123 of the mold base 12 along a photosensitive path direction of the camera module 100, that is, in a vertical direction of the camera module 100.

It can be understood that when the inner draft angle of the mold base 12 is greater than 90 °, the inner wall of the mold base 12 can reduce the entrance of the external stray light into the photosensitive element 130, and when the outer draft angle of the mold base 12 is greater than 90 °, the size of the base lower end 122 of the mold base 12 can be reduced to reduce the size of the base 11, which is beneficial to the overall size of the camera module 100. The base lower end surface 124 of the mold base 12 is reduced while the base upper end surface 123 of the mold base 12 is increased, so that the base upper end 121 of the mold base 12 is increased on the premise that the base lower end 122 of the mold base 12 is reduced. In short, when both the inner and outer draft angles of the mold base 12 are greater than 90 °, the base lower end surface 124 of the mold base 12 is reduced in size so that the mold base 12 is reduced in size, and the base upper end surface 123 of the mold base 12 is enlarged in size so that the mold base 12 provides a larger processing space for subsequent processing.

Referring to fig. 8 to 10 of the drawings accompanying the present specification, another alternative embodiment of a camera module according to the above first preferred embodiment of the present invention is illustrated in the following description. The camera module 100 further includes a lens holder 70, wherein the lens holder 70 is disposed between the mold base 12 and the driving device 50, and the driving device 50 is fixed to the mold base 12 of the circuit board assembly 10 by the lens holder 70.

Further, in this embodiment, the filter element 40 of the camera module 100 is also disposed on the mirror base 70, wherein the mirror base 70 supports the filter element 40 to keep the filter element 40 above the photosensitive element 130.

It is understood that the lens holder 70 can be implemented as a supporting base, wherein the lens holder 70 further comprises a lens holder body 71 and a lens holder adhesive layer 72, wherein the lens holder adhesive layer 72 is disposed above or below the lens holder 70, and the driving device 50 is fixed to the lens holder body 71 through the lens holder adhesive layer 72, or the lens holder body 71 is fixed to the molding base 12 through the lens holder adhesive layer 72. The driving device 50 is supported by the lens holder main body 71 to drive the lens 20 to move.

Referring to fig. 11A to 11G of the drawings in the present specification, a flow of a method for manufacturing the circuit board assembly 10 of the camera module 100 according to the above preferred embodiment of the present invention is shown. As shown in fig. 11A, at least one substrate 11 of the circuit board assembly 10 is provided or prepared. According to the above preferred embodiment of the present invention, the upper end of the substrate 11 is attached to the photosensitive element 130. In short, the substrate 11 of the semi-finished circuit board assembly 10 is provided, wherein the leads 13 communicate with the photosensitive elements 130 on the substrate 11.

As shown in fig. 11B, the substrate 11 of the circuit board assembly 10 is placed on the mold 300, and the substrate 11 is fixed by the mold 300. It should be noted that the mold 300 includes an upper mold 310, a lower mold 320, and at least one processing space 330, wherein the processing space 330 is located between the upper mold 310 and the lower mold 320. The substrate 11 is placed in the processing space 330, and when the mold is closed, the processing space 330 between the upper mold 310 and the lower mold 320 is compressed and reduced until the upper mold 310 is attached to the upper surface of the substrate 11.

Further, the mold 300 further includes a shaping film 340, wherein the shaping film 340 is disposed below the upper mold 310 of the mold 300, and when the upper mold 310 and the lower mold 320 are closed, the shaping film 340 fits to the upper mold 310. After the dies are closed, the upper die 310 of the die 300 presses the shaping film 340 against the upper surface of the substrate 11, so that a portion of the shaping film 340 is tightly adhered to the substrate 11. After the mold 300 is closed, a forming space 350 is further formed between the shaping film 340 and the substrate 11, wherein the molding material of the mold base 12 is inserted into the forming space 350 to be cured to form the mold base 12.

It should be noted that the shaping film 340 of the mold 300 has elasticity, and when the upper mold 310 and the lower mold 320 are closed, the upper mold 310 presses the shaping film 340, wherein the shaping film 340 is pressed to generate elastic deformation. It will be appreciated that the shape profile of the shaping film 340 determines the spatial shape characteristics of the shaping space 350, resulting in the molded base 12 when the molding material is shaped in the shaping space 350.

It should be noted that when the shaping film 340 is adsorbed under the upper mold 310 of the mold 300, the upper mold 310 cures the molding base 12 in the molding space 350 through the shaping film 340. When the molding material is cured and formed in the forming space 350, the molding material is cured to form the molding base 12 based on the lower surface of the shaping film 340. It is understood that the molding upper end surface 123 of the molding base 12 is formed at the upper end of the molding space 350, wherein the molding upper end surface 123 is opposite to the lower surface of the shaping film 340 at the upper end of the molding space 350. It is worth mentioning that the surface of the shaping film 340 is smooth, and the molding upper end surface 123 of the molding base 12 formed by the shaping film 340 is a smooth plane.

When the upper mold 310 of the mold 300 presses the shaping film 340 to deform, the shaping film 340 is pressed outwards by the upper mold 310 to generate plastic elastic deformation, wherein the part of the shaping film 340 protruding outwards is rough in surface, and the surface of the molding base 12 formed by the protruding part of the shaping film 340 is rough in surface.

The upper mold 310 of the mold 300 further includes at least one spacer block 311 and at least one pressing block 312, wherein the spacer block 311 and the pressing block 312 are pressed above the photosensitive element 130 and the substrate 11 to form a channel of the molding space 350. The isolation block 311 has a groove, wherein the two ends of the isolation block 311 press the shaping film 340, and an isolation space 360 is formed between the isolation block 311 and the photosensitive element 130. The isolation block 311 is located inside the pressing block 312, wherein the isolation block 311 correspondingly fits the upper surface of the photosensitive element 130 to prevent the molding material from entering the isolation space 360 from the molding space 350. In short, when the upper mold 310 and the lower mold 320 are closed, the spacer 311 is closely attached above the photosensitive element 130 to form the light path of the photosensitive element 130. The isolation block 311 presses the shaping film 340, so that the shaping film 340 is tightly fit to the upper surface of the photosensitive element 130 to isolate the shaping space 350 from the light path. When the upper mold 310 and the lower mold 320 are closed, the pressing block 312 and the separating block 311 press the shaping film 340 above the substrate 11 and the photosensitive element 130, so that the shaping space 350 is formed between the shaping film 340 and the substrate 11.

Accordingly, in the above steps, the shaping film 340 is attached to the lower surface of the upper mold 310, and the air between the shaping film 340 and the upper mold 310 is extracted by air-extracting, so that the shaping film 340 is tightly attached to the upper mold 310, and the influence of air between the shaping film 340 and the upper mold 310 on the flatness of the shaping film 340 is avoided.

As shown in fig. 11C and 11D, the mold 300 is closed, wherein the upper mold 310 presses the shaping film 340, so that the shaping film 340 is elastically deformed, wherein the shaping film 340 presses the molding space 350 in an elastically deformed manner. The isolation block 311 of the upper mold 310 presses the plastic film 340, so that the plastic film 340 is pressed by the isolation block 311 to generate elastic deformation extending outward from the isolation block 311. It is understood that the lower end of the spacer block 311 presses the shaping film 340, wherein the elastic deformation of the shaping film 340 near the bottom end of the spacer block 311 is larger than the elastic deformation of the shaping film 340 near the top end of the spacer block 311. In other words, the isolation block 311 presses the shaping film 340 against the photosensitive element 130, so that the shaping film 340 attached to the outer side of the isolation block 311 is elastically deformed gradually from bottom to top, so that the shaping film 340 presses the molding space 350 from the outer wall of the isolation block 311 outwards. In short, the shaping film 340 is pressed by the spacer 311, so that the thickness of the lower end of the shaping film 340 attached to the outside of the spacer 311 is greater than the thickness of the upper end of the shaping film 340.

The isolation block 311 of the upper mold 310 presses the plastic film 340, wherein the plastic film 340 is pressed by the isolation block 311 to form an inward extending portion 341, wherein the inward extending portion 341 is formed by pressing on the outer side of the isolation block 311, and wherein the inward extending portion 341 presses the forming space 350 from the outer side of the isolation block 311. It will be appreciated that the inward extending portion 341 forms the inner side surface 1251 and the inward curved surface 1252 of the mold base 12. It can be understood that, since the inward extending portion 341 is formed by the molding film 340 being pressed, the outer surface of the lower portion of the inward extending portion 341 is rough, and the inner arc surface 1252 is roughened by the inward extending portion 341 so that the surface smoothness of the inner arc surface 1252 is reduced.

The pressing block 312 of the upper mold 310 presses the shaping film 340, so that the shaping film 340 is pressed by the spacer block 311 to generate an elastic deformation extending inward from the pressing block 312. It is understood that the lower end of the lamination block 312 presses the shaping film 340, wherein the elastic deformation of the shaping film 340 near the bottom end of the lamination block 312 is larger than the elastic deformation of the shaping film 340 near the top end of the lamination block 312. In other words, the pressing block 312 presses the plastic film 340 against the substrate 11, so that the plastic film 340 attached to the inner side of the pressing block 312 is elastically deformed gradually from bottom to top, so that the plastic film 340 presses the molding space 350 from the inner wall of the pressing block 312 to the outside.

The lamination block 312 of the upper mold 310 presses the shaping film 340 to form an extension portion 342, wherein the extension portion 342 is formed under the upper mold 310, the extension portion 342 is formed inside the lamination block 312, and the extension portion 342 presses the molding space 350 inward from the inside of the lamination block 312. It is understood that the outer extensions 342 form the outer side surfaces 1261 and the outer arcuate surfaces 1262 of the mold base 12.

The isolating block 311 of the upper mold 310 extrudes the shaping film 340, wherein the shaping film 340 is extruded by the isolating block 311 to form an inward extending portion 341, the inward extending portion 341 is divided into an upper inward extending portion and a lower inward extending portion, the upper inward extending portion correspondingly forms the inner side surface 1251, and the lower inward extending portion correspondingly forms the inner arc surface 1252. It should be noted that, when the upper mold 210 and the lower mold 320 are closed, the shaping film 340 on the isolation block 311 is squeezed, so that the shaping film 340 protrudes outward to form the lower inward extending portion, and since the lower inward extending portion is used for squeezing the shaping film 340, so that the shaping film 340 is stacked, the shape of the lower inward extending portion is not easily controlled, and thus the shape of the correspondingly formed inner arc surface 1252 is not fixed. Secondly, the lower inward extending part is formed by extruding the shaping film 340 due to elasticity, the surface of the lower inward extending part is rough, and the upper inward extending part is formed by the lower inward extending part, so that the upper inward extending part is subjected to certain force, and the upper inward extending part can form an inclined surface; however, the upper inwardly extending portion is still kept in a taut state during the molding process, so that the surface of the upper inwardly extending portion is smooth, and the surface of the inner side surface 1251 is smoother than the inwardly curved surface 1252 after the molding.

It should be noted that the isolating block 311 and the pressing block 312 of the upper mold 310 press the plastic film 340 to generate deformation, wherein the magnitude of the elastic deformation generated by the plastic film 340 determines the draft angle of the molding base 12. Therefore, the shape and size of the inner extension 341 and the outer extension 342 can be controlled by the thickness and the elastic modulus of the shaping film 340, and the pressure of the upper mold 311 and the shaping film 340 after the mold is closed, thereby determining the draft angle of the mold base 12.

When the thickness of the plastic film 340 is H, the thickness of the inner extension portion 341 and the thickness of the outer extension portion 342 generated by the upper die 310 extruding the plastic film 340 are 1.2H to 1.5H. In other words, the transverse vertical distance between the inner arc surface 341 of the mold base 12 and the light window opening of the mold base 12 is 0.2H to 0.5H. Illustratively, when the thickness of the shaping film 340 is 100 μm, the perpendicular distance between the base upper end surface 123 and the base lower end surface 124 of the molded base 12 after molding is 20 μm to 50 μm based on the optical axis direction.

As shown in fig. 11D and 11E, a molding material is added to the molding space such that the molding material is molded in the molding space 350 based on the outer wall of the shaping film 340. Since the shaping film 340 is pressed by the spacer 311 of the upper mold 310 and closely attached to the upper surface of the photosensitive element 130, when the molding material is formed in the forming space 350, the shaping film 340 is pressed by the spacer 311 to prevent the molding material from entering the photosensitive channel of the photosensitive element 130 from the forming space 350.

As shown in fig. 11F and 11G, the molding material is cured and formed in the forming space 350, and the molding base 12 is obtained. When the mold base 12 is released from the mold 300, the upper mold 310 and/or the lower mold 320 of the mold 300 are pulled to separate the upper mold 310 and the lower mold 320. In the process of separating the upper mold 310 from the lower mold 320, the pressure between the upper mold 310 and the shaping film 340 is released, and the shaping film 340 is returned to the original state by the elastic action, so that the shaping film 340 and the upper mold 310 are separated from the molding base 12.

Referring to fig. 12A to 12F of the drawings of the present specification, another manufacturing process of the mold base 12 of the circuit board assembly 10 according to the above preferred embodiment of the present invention is explained in the following description. As shown in fig. 12A, in a substrate imposition composed of a plurality of substrates 11, the photosensitive element 130 is connected to the substrates 11 through leads 13, and the electronic device 15 of the circuit board assembly 10 is disposed on the substrates 11, so as to compose a circuit board imposition from a plurality of semi-finished circuit boards.

As shown in fig. 12B, the substrate imposition is placed on a mold 300, wherein the mold comprises an upper mold 310 and a lower mold 320, wherein a processing space 330 is formed between the upper mold 310 and the lower mold 320, wherein the substrate imposition is placed in the processing space 330. The mold 300 further comprises a shaping film 340, wherein the shaping film 340 has elasticity and toughness, and the shaping film 340 is attached to the upper mold 310 of the mold 300. Air between the upper mold 310 and the shaping film 340 is extracted by air suction, so that the shaping film 340 is tightly attached to the upper mold 310. The upper mold 310 further includes a plurality of spacers 311 and a plurality of pressing blocks 312, wherein each spacer 311 corresponds to an upper surface of the photosensitive element 130, and each pressing block 312 correspondingly adheres to the substrate 11. During the molding process, at least one molding space 350 is formed between the adjacent spacer blocks 311 and the pressing blocks 312, wherein the molding material is cured in the molding space 350, so as to form the molding bases 12 of the two adjacent circuit board assemblies 20. The isolation block 311 is further provided with a groove, wherein two ends of the isolation block 311 press the shaping film 340, so that an isolation space 360 is formed between the isolation block 311 and the photosensitive element 130, wherein the isolation space 360 corresponds to the photosensitive channel of the photosensitive element 130. The isolation block 311 corresponds to the upper portion of the photosensitive element 130, and the molding film 340 is pressed by the pressing block 312 to prevent the molding material in the molding space 350 from entering the isolation space 360.

As shown in fig. 12C, when the substrate imposition is placed in the processing space 330, the upper mold 310 and the lower mold 320 of the mold 300 are closed, and the upper mold 310 is closely adhered above the substrate 11 and the photosensitive element 130. Each of the upper molds 310 presses the photosensitive element 130 and the substrate 11 through the shaping film 340, wherein the shaping film 340 is elastically deformed by the upper mold 310. The isolation block 311 of the upper mold 310 presses the plastic film 340, so that the plastic film 340 is pressed by the isolation block 311 to generate elastic deformation extending outward from the isolation block 311. It is understood that the lower end of the spacer block 311 presses the shaping film 340, wherein the elastic deformation of the shaping film 340 near the bottom end of the spacer block 311 is larger than the elastic deformation of the shaping film 340 near the top end of the spacer block 311. In other words, the isolation block 311 presses the shaping film 340 against the photosensitive element 130, so that the shaping film 340 attached to the outer side of the isolation block 311 is elastically deformed gradually from bottom to top, so that the shaping film 340 presses the molding space 350 from the outer wall of the isolation block 311 outwards. In short, the shaping film 340 is pressed by the spacer 311, so that the thickness of the lower end of the shaping film 340 attached to the outside of the spacer 311 is greater than the thickness of the upper end of the shaping film 340.

As shown in fig. 12D to 12E, a molding material is injected into the molding space 350, wherein the molding material is then solidified in the molding space 350 to form the molding base 12. After the mold base 12 is cured, the circuit board assembly 10 is removed from the mold 300 by demolding. It should be noted that, during the demolding process, the upper mold 311 is separated from the shaping film 340, so that the shaping film 340 is restored to the initial state under the elastic action after being separated from the mold base 12, so that the upper mold 311 and the shaping film 340 are separated from the molded base 12.

As shown in fig. 12F, a circuit board assembly layout formed by connecting circuit board assemblies after demolding is cut by cutting, so as to obtain each circuit board assembly 10. It is worth mentioning that after the mold release, the mold bases 12 of the adjacent circuit board assemblies 10 are connected with each other. It is understood that the mold base 12 is cut in a manner inclined inward from top to bottom such that the base upper end 121 of the mold base 12 is larger in size than the base lower end 122.

A variant embodiment according to the above preferred embodiment of the present invention is illustrated in the following description with reference to figures 13A to 14 of the accompanying drawings. The photosensitive element 130 and the electronic device 15 are attached to the substrate 11 of the circuit board assembly 10, wherein the photosensitive element 130 is attached to the substrate 11 close to one side of the substrate 11, so that the edge region 114 of the substrate 11 has at least one narrow side 115 and at least one load side 116, wherein the width of the narrow side 115 is smaller than the width of the load side 116.

As shown in fig. 13A and 13B, the electronic device 15 is disposed in the edge region 114 close to the load side 116, wherein the edge of the photosensitive element 130 is close to the narrow side 115 of the substrate 11, so as to reduce the length of the substrate 11 of the circuit board assembly 10 in at least one direction. The substrate 11 to which the photosensitive element 130 is attached is placed in the mold 300, wherein the spacer block 311 and the pressing block 312 of the upper mold 310 are respectively pressed against the photosensitive element 130 and the substrate 11. After the mold 300 is closed, the width of the channel of the forming space 350 corresponding to the narrow side 115 is smaller than the width of the channel of the forming space 350 corresponding to the load side 116, so that the bottom surface of at least one side of the molded base 12 obtained after molding is narrow.

As shown in fig. 14, in the molding process, the draft angle of the mold base 12 corresponding to the narrow side 115 of the substrate 11 is greater than 90 °, so that the width of the base lower end 122 of the mold base 12 molded over the narrow side 115 is smaller than the width of the base upper end 121. In short, the mold base 12 formed above the narrow side 115 of the substrate 11 by molding has a structure large in top and small in bottom. Preferably, the draft angle of the inner side and the draft angle of the outer side of the molding base 12 corresponding to above the narrow side 115 are both greater than 90 °, so that the base upper end face 123 of the molding base 12 corresponding to above the narrow side 115 of the substrate 11 is of sufficient size to support and be attached by the driving device 50.

As will be understood by those skilled in the art, the camera module 100 is mounted on the electronic device body 200 of the electronic device, and one side of the narrow side 115 of the circuit board assembly 10 faces the top end of the electronic device body 200, so that the lens 20 of the camera module 100 is close to the top end of the electronic device body 200 upwards.

It will be appreciated that the draft angle of the mold base 12 is greater than 90 ° to reduce the size of the base lower end 122 of the mold base 12 and the substrate 11, thereby reducing the width dimension of the circuit board assembly 10. Based on the downsizing of the circuit board assembly 10, the overall lateral dimension of the camera module 100 can be reduced to reduce the ratio of the camera module 100 to the electronic device body 200, thereby increasing the screen occupation ratio of the electronic device body 200.

Referring to fig. 15 of the drawings accompanying the present specification, a modified embodiment of the circuit board assembly 10 of the camera module 100 according to the above preferred embodiment of the present invention is illustrated in the following description. The circuit board assembly 10 includes at least one substrate 11, at least one molding base 12, at least one set of leads 13, and at least one electronic device 15, wherein the leads 13 communicate with the photosensitive element 130 on the substrate 11, and the electronic device 15 is attached above the substrate 11.

It should be noted that the structure of the substrate 11, the leads 13, and the electronic device 15 is the same as that of the first preferred embodiment, except that the molding base 12 is embedded in the edge region 114 of the substrate 11, and the photosensitive element 130 and the leads 13 are located inside the molding base 12. The lower base end 122 of the molding base 12 covers the edge region 114 of the substrate 11, and the lead 13 connects the photosensitive element 130 to the bonding region 113 of the substrate 11. In other words, the base lower end 122 of the mold base 12 is located outside the photosensitive element 130.

As in the first preferred embodiment, the draft angle of the molded base 12 is greater than 90 °, so that the structural dimensions of the base upper end 121 of the molded base 12 are greater than the structural dimensions of the base lower end 122. The internal or external draft angle of at least one side of the mold base 12 is greater than 90 °. Preferably, the inside draft angle and the outside draft angle of the mold base 12 are both greater than 90 ° to reduce the size of the base lower end 122 of the mold base 12, thereby enabling the size of the base plate 11 to be reduced. The inner draft angle and the outer draft angle of the mold base 12 are both greater than 90 °, and the size of the base upper end 121 of the mold base 12 is increased, so that the area of the base upper end surface 123 of the mold base 12 is increased, and the attachment of the driving device 50 or the lens holder 70 is facilitated.

Referring to fig. 16 of the drawings accompanying the present specification, another variant of the circuit board assembly 10 of the camera module 100 according to the above preferred embodiment of the present invention is illustrated in the following description. The photosensitive element 130 is attached below the substrate 11 of the circuit board assembly 10, wherein the substrate 11 is further provided with a through hole 117, and the photosensitive element 130 is attached below the substrate 11 based on the through hole 117. The mold base 12 of the circuit board assembly 10 is integrally formed above the substrate 11, wherein at least one side of the mold base 12 has a draft angle greater than 90 °, such that the structural dimension of the base upper end 121 of the mold base 12 is greater than the structural dimension of the base lower end 122.

Unlike the first preferred embodiment, the substrate 11 is placed in the mold 300 during the molding process, wherein the upper mold 310 of the mold 300 presses the shaping film 340 against the substrate 11, so that the shaping film 340 is tightly adhered to the substrate 11.

Referring to fig. 17 of the drawings accompanying the present specification, another variant of the circuit board assembly 10 of the camera module 100 according to the above preferred embodiment of the present invention is illustrated in the following description. The camera module 100 is a dual-camera, triple-camera, or multi-camera module, wherein the circuit board assembly 10 of the camera module 100 includes at least one substrate 11, at least two mold bases 12, at least one set of leads 13, and a plurality of electronic devices 15, wherein the mold bases 12 are integrally formed on the substrate 11 by molding. The photosensitive element 130 is disposed above the substrate 11, and the molding base 12 is embedded above a portion of the non-photosensitive region of the photosensitive element 130 and above the edge region 114 of the substrate 11.

The draft angle of at least one side of the mold base 12 of the circuit board assembly 10 is greater than 90 ° such that the structural dimension of the base lower end 122 of the mold base 12 is smaller than the structural dimension of the base upper end 121. Preferably, the inner draft angle and the outer draft angle of the mold base 12 are both greater than 90 °, and the mold base 12 of the circuit board assembly 10 is formed in a structure with a large top and a small bottom, so that the width of the mold base 12 of the circuit board assembly 10 is reduced, thereby reducing the size of the substrate 11 of the circuit board assembly 10. The molding base 12 of the circuit board assembly 10 is formed in a structure with a large top and a small bottom, which increases the size of the base upper end 121 of the molding base 12, thereby providing a sufficient processing space for the subsequent AA process or HA process.

Referring to fig. 18 to 19B of the drawings in the specification, another alternative embodiment of a camera module 100a according to the second preferred embodiment of the present invention is illustrated in the following description. The camera module 100a in the preferred embodiment of the present invention may be, but is not limited to, a single projection module, and therefore, the camera module 100a may also be implemented as an array module with other camera units, such as a TOF camera module.

The camera module 100a includes a circuit board assembly 10a, at least one optical element 20a, and a projection unit 30a, wherein the projection unit 30a is disposed on the circuit board assembly 10a, the projection unit 30a is connected to the circuit board assembly 10a, and the circuit board assembly 10a provides the electric power required by the projection unit 30 a. The optical element 20a is held above the projection unit 30a by the circuit board assembly 10a to outwardly project light generated by the projection unit 30 a.

It should be noted that the projection unit 30a of the camera module 100a is implemented as a light source, which may be, but not limited to, an LED light source, wherein the light generated by the projection unit 30a is diffused and emitted out through the optical element 20 a.

As shown in fig. 18, the circuit board assembly 10a includes a substrate 11a and a mold base 12a, wherein the mold base 12a wraps the substrate 11a, the projection unit 30a is disposed on the substrate 11a of the circuit board assembly 10a, and the substrate 11a provides power for the projection unit 30 a. The substrate 11a further includes a substrate main body 111a and at least one conductive member 112a disposed on the substrate main body 111a, wherein the conductive member 112a is electrically connected to the projection unit 30 a. The circuit board assembly 10a further includes at least one lead 13a, wherein the lead 13a electrically connects the conductive member 112a to the projection unit 30 a.

The mold base 12a is integrally formed on the substrate 11a of the circuit board assembly 10a by a molding process, wherein the mold base 12a includes a base upper end 121a, a base lower end 122a, and a base bottom 123a, and the base upper end 121a and the base lower end 122a integrally extend upward from the base bottom 123 a. It should be noted that, in the preferred embodiment of the present invention, unlike the above preferred embodiment, the molding base 12a is integrally wrapped on the substrate 11a by a molding process, so as to reduce the thickness of the circuit board assembly 10 a. Preferably, the base bottom plate 123a wraps the substrate 11a, and the thickness of the base bottom plate 123a is the same as that of the substrate 11 a.

The mold base 12a further has a support portion 124a, wherein the support portion 124a is formed at the base upper end portion 121a of the mold base 12a, and the support portion 124a supports the optical element 20 a. Preferably, in this preferred embodiment of the present invention, the supporting portion 124a is a groove formed at the base upper end portion 121a of the mold base 12a, wherein the optical element 20a is provided to the supporting portion 124 a.

The mold base 12a is further provided with a base inner wall 125a and a base outer wall 126a, wherein the base inner wall 125a is formed on the inner side of the mold base 12a, and the base outer wall 126a is formed on the outer side of the mold base 12 a. Preferably, the base inner wall 125a extends inwardly and upwardly from the base lower end 122a of the molded base 12a to the base upper end 121 a. More preferably, the base outer wall 126a extends outwardly and upwardly from the base lower end 122a of the molded base 12a to the base upper end 121 a. In other words, the base lower end 122a of the mold base 12a has a smaller size than the base upper end 121 a.

As shown in fig. 18, the base inner wall 125a has an inner side surface 1251a and an inner arc surface 1252a, wherein the inner side surface 1251a extends downwardly and obliquely outwardly from the inner side edge of the molded upper end surface 123a of the mold base 12a to the inner arc surface 1252 a. The intrados surface 1252a extends upward and obliquely outward from the mold lower end surface 124a of the mold base 12a to the inner side surface 1251 a. Each base outer wall 126a of the mold base 12a has an outer side surface 1261a and an outer curved surface 1262a, wherein the outer side surface 1261a extends downwardly and obliquely inwardly from an outer edge of the mold upper end surface 123a of the mold base 12a to the outer curved surface 1262 a. The outer arcuate surface 1262a extends upwardly and obliquely inwardly from the mold lower end surface 124a of the mold base 12a to the outer side surface 1261 a.

As shown in fig. 19A to 19B, a method of manufacturing the mold base 12a is shown, in which the mold base 12a is integrally formed with the substrate 11a by a molding process. The draft angle of at least one side of the mold base 12a is larger than 90 °, so that the mold base 12 forms a structural feature with an upper size, so that when the optical element 20a is placed on the supporting portion 124a, the contact surface of the supporting portion 124a and the optical element 20a is large enough to ensure the installation reliability of the mold base 12a and the optical element 20 a.

As shown in FIG. 19A, a substrate, such as but not limited to a metal substrate, e.g., a copper substrate, is first processed to form a layout. The imposition is processed in an etching manner to form the conductive member on the substrate 11 a. As shown in fig. 19B, the imposition plate is placed in a mold 300a, wherein the mold 300a comprises an upper mold 310a, a lower mold 320a, and a shaping film 340a, wherein the shaping film 340a is attached to the upper mold 310a, and a processing space 330a is formed between the upper mold 310a and the lower mold 320 a. The upper module 310 includes an isolation block 311a and a pressing block 312a, wherein the isolation block 311a presses the shaping film 340a against the substrate 11a, so that the shaping film 340a is tightly adhered to the substrate 11 a. The pressing block 312a presses the shaping film 340a against the lower mold 320a, so that the shaping film 340 is tightly adhered to the lower mold 320 a. When the upper mold 310a and the lower mold 320a are closed, the upper mold 310a presses the shaping film against the lower mold 320a, wherein a molding space 350a corresponding to the molding base 12a is formed between the shaping film 340a and the lower mold 320 a. A molding material is injected into the molding space 350, and is cured and molded in the molding space 350a to form the molding base 12 a.

The molding material is then cured in the mold 300a to form the molding base 12a on the substrate 11 a. After the mold base 12a is cured, the mold is removed to obtain the circuit board assembly 10 a. It should be noted that the projection unit 30a may be disposed on the upper surface of the substrate 11a after the molding process is completed, or disposed on the substrate 11a before the molding process. In other words, the mounting order of the projection units 30a is not limited herein.

As in the first preferred embodiment, the draft angle of at least one side of the mold base 12a is greater than 90 °, so that the size of the base lower end 122a of the mold base 12a is smaller than the size of the base upper end 121 a. Preferably, both the inner shaping film angle and the outer draft angle of the mold base 12a are larger than 90 ° to reduce the size of the base lower end 122a of the mold base 12a, thereby making the entire size of the mold base 12a smaller. It will be appreciated that the overall size of the molded base 12a is reduced, which results in a reduced lateral size of the camera module 100 a. In the case where the size of the base lower end portion 122a of the mold base 12a is reduced, the size of the base upper end portion 121a of the mold base 12a is increased to increase the size of the supporting portion 124a of the base upper end portion 121a, thereby increasing the contact area of the supporting portion 124a with the optical element 30 a.

It is understood that, during the molding process of the mold base 12a, the upper mold 310a of the mold 300a presses the shaping film 340a against the substrate 11a, so that the shaping film 340a is pressed to generate elastic deformation. It is understood that when the inner side of the upper mold 310a presses the shaping film 340a to generate elastic deformation from the inside to the outside, the inner draft angle of the mold base 12a is greater than 90 ° to form the base inner wall 125a of the mold base 12 a. When the outer side of the upper die 310a presses the shaping film 340a to be elastically deformed from the inside, the draft angle of the mold base 12a is larger than 90 ° to form the base outer wall 126a of the mold base 12 a.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims

1. A circuit board assembly, comprising:

a substrate; and

2. The circuit board assembly of claim 1, wherein the mold base is integrally formed to the substrate by way of a molding process, wherein the mold base is made by:

demolding to mold the molding base on the substrate.

3. The circuit board assembly of claim 2, wherein the inner side of the base inner wall is at an angle of 90 ° or less to the substrate such that an inner draft angle of the molded base de-molded is 90 ° or greater.

4. The circuit board assembly of claim 1, wherein the intrados surface has a roughness that is greater than a roughness of the medial side.

5. The circuit board assembly of claim 1, wherein the base outer wall of the mold base has an outer side surface extending downwardly and obliquely inwardly from the mold upper end surface to the outer arcuate surface, and an outer arcuate surface extending from the mold lower end surface of the mold base to the outer side surface.

6. The circuit board assembly of claim 5, wherein the mold base is integrally formed to the substrate by way of a molding process, wherein the mold base is made by:

demolding to mold the molding base on the substrate.

7. The circuit board assembly of claim 6, wherein the outer side of the base outer wall is at an angle of 90 ° or less to the substrate such that the molded base is demolded at an angle of 90 ° or more.

8. The circuit board assembly according to any one of claims 1 to 7, wherein the circuit board assembly further comprises a photosensitive element, wherein the photosensitive element is electrically connected to the base plate, and the photosensitive element is integrally fixed to the base plate by the mold base.

9. The circuit board assembly according to any one of claims 1 to 7, wherein the circuit board assembly further comprises a photosensitive element electrically connected to the base plate, wherein the mold base is integrally provided on an outer side of the photosensitive element.

10. The circuit board assembly of claim 8, wherein the photosensitive element comprises a photosensitive portion and at least one non-photosensitive portion, wherein the non-photosensitive portion is located outside the photosensitive portion, wherein the non-photosensitive portion is electrically connected to the substrate, wherein the molding base covers over the non-photosensitive portion of the photosensitive element, and the photosensitive element is fixed to the substrate by the molding base.

11. The circuit board assembly of claim 10, wherein the substrate further has a substrate upper surface and a substrate lower surface corresponding to the substrate upper surface, wherein the photosensitive element is attached to the substrate upper surface, wherein the molding base is integrally formed on the substrate upper surface.

12. The circuit board assembly of claim 11, wherein the circuit board assembly further comprises a set of leads, wherein the leads electrically connect the non-light-sensitive portions of the light-sensitive elements to the substrate, the leads being embedded by the mold base above the substrate.

13. The circuit board assembly of claim 11, wherein the circuit board assembly further comprises at least one electronic device, wherein the electronic device is disposed at the edge region of the substrate, wherein the molded base embeds the electronic device in the substrate.

14. The circuit board assembly of claim 10, wherein the substrate further has a bonding region and an edge region, wherein the photosensitive element is attached to the bonding region, the edge region is located at the periphery of the bonding region, wherein the photosensitive element is bonded to the substrate close to one side of the substrate, such that the edge region of the substrate forms at least one narrow edge and at least one load edge, wherein the width of the narrow edge is smaller than the width of the load edge.

15. The circuit board assembly of claim 14, wherein the circuit board assembly further comprises at least one electronic device, wherein the electronic device is disposed on the load side of the substrate, wherein the mold base embeds the electronic device on the substrate.

16. A camera module, comprising:

a circuit board assembly according to any one of claims 1 to 15;

17. The camera module according to claim 16, wherein the camera module further comprises a driving device, wherein the driving device is disposed above the mold base, and the lens is mounted to the driving device, and movement of the lens is driven by the driving device.

18. The camera module of claim 17, wherein the filter element is disposed above the mold base of the circuit board assembly, the filter element being supported by the mold base.

19. The camera module of claim 18, wherein the camera module further comprises a lens mount, wherein the lens mount is disposed between the driving device and the mold base, wherein the filter element is disposed on the lens mount, the filter element being supported by the lens mount.

20. An electronic device, comprising:

an electronic device body; and

the camera module according to at least one of claims 16 to 19, wherein the camera module is mounted on an upper end of the electronic device body.

21. A method of manufacturing a circuit board assembly, wherein the method comprises the steps of:

(c) adding a molding material to the molding space, and curing the molding material in the molding space; and

22. The method of claim 21, wherein in step (a) of the method, the photosensitive element is attached to the upper surface of the substrate, and a set of leads is provided by which the photosensitive element is electrically connected to the substrate.

23. The manufacturing method according to claim 21, further comprising, before the step (b) of the above method, a step of: and extracting air between the shaping film and the upper die in an air extraction mode so as to attach the shaping film to the lower surface of the upper die.

24. The manufacturing method according to claim 21, wherein in the step (b) of the manufacturing method, a spacer of the upper mold presses the shaping film against the photosensitive element, wherein the shaping film is pressed to form an inward extending portion, wherein the inward extending portion presses the shaping space outward from the spacer, so that an inward draft angle of the molding base is 90 ° or more.

25. The manufacturing method according to claim 24, wherein in the step (c) of the manufacturing method, the molding material is molded on an outer side of the inwardly extending portion and cured to be a base inner wall of the mold base.

26. The manufacturing method according to claim 25, wherein in the step (c) of the above manufacturing method, a molding material fills the molding space in which the base inner wall of the mold base is molded outside the inward extending portion by which the inner side face and an inward curved face of the base inner wall are formed.

27. The method of claim 21, wherein in step (b) of the method, a pressing block of the upper mold presses the shaping film against the substrate, wherein the shaping film is pressed to form an extension portion, wherein the extension portion presses the shaping space inward from the spacer block, so that an outward draft angle of the mold base is equal to or greater than 90 °.

28. The manufacturing method according to claim 27, wherein in the step (c) of the manufacturing method, the molding material is molded inside the extension portion and cured to be a base outer wall of the molding base.

29. The manufacturing method according to claim 28, wherein in the step (c) of the above manufacturing method, a molding material fills the molding space, wherein the base outer wall of the mold base is molded inside the extension portion, the outer side face and an outer arc face of the base outer wall being formed by the extension portion.

30. The method of manufacturing of claim 21, wherein step (d) of the method further comprises: and drawing the upper die of the die to relieve the pressure of the upper die on the shaping film, wherein the shaping film is restored to the initial state under the action of elasticity.