CN112073599A - Camera module, circuit board assembly and manufacturing method thereof, and electronic equipment - Google Patents

Abstract

The present invention provides a camera module, a circuit board assembly, a manufacturing method thereof, and an electronic device, wherein the circuit board assembly includes a substrate, a photosensitive element, and at least one molding base. The photosensitive element is electrically connected to the substrate, wherein the photosensitive element is integrally fixed to the substrate by the molding base, and the molding base includes an inner wall of the base, an outer wall of the base and further has A molding upper end surface and a molding lower end surface, wherein the inner wall of the base forms a light window of the molding base, wherein the inner wall of the base further has an inner slope and an inner arc surface, the inner wall The arc surface extends from the inner side surface, and the inner arc surface faces the molding base.

Description

Camera module, circuit board assembly and manufacturing method thereof, and electronic equipment

technical field

The invention relates to the field of optical imaging, and in particular, to a camera module, a circuit board assembly, a manufacturing method thereof, and an electronic device.

Background technique

At present, electronic devices are increasingly developing in the direction of intelligence and thinning, which puts forward more stringent requirements for the volume and imaging quality of the camera module, which is one of the standard configurations of electronic products. The hardware basis of a high-pixel, high-quality camera module is that the photosensitive element has a larger photosensitive area and a larger number of passive components with a larger size. Due to the pursuit of higher pixels and higher quality by intelligent electronic devices, As a result, the volume of the camera module is getting larger and larger, which also makes the development trend of the camera module less and less in line with the development trend of thin and light electronic devices.

Therefore, in order to reduce the size of the camera module, the camera module in the prior art uses a molding technology to package the photosensitive element in the camera module, so as to reduce the size of the camera module in the horizontal direction. Specifically, the electronic components of the camera module are mounted on the circuit board through a surface attachment process, and then the molding material is integrally combined with the circuit board by a molding process to form a base-type circuit board. The molding process of the prior art is to place the semi-finished circuit board in a molding mold, and after the molding material is filled, a molding base is formed to be cured on the circuit board, and then the mold is pulled out to obtain the base. pedestal circuit board.

However, in order to facilitate drafting and ensure the yield after drafting, the draft angle of the molded circuit board of the camera module in the prior art is less than 90°, which also makes the molded circuit of the camera module less than 90°. The structure of the molded base of the board is a structure of small upper and lower. This results in a very small width of the upper surface of the molding base, leaving very limited space for subsequent machining operations. For example, the glue space reserved for the motor or lens holder to be pasted on the upper surface of the molding is very small, and it is not easy to control the amount of glue. Usually, the amount of glue is insufficient, which causes the motor or the lens holder to be attached to the molding base. Adhesion to the surface is not enough. Therefore, in order to ensure a sufficient amount of glue, the molding process in the prior art can only increase the width of the upper surface of the molding base, so that the size of the lower surface of the molding base also increases, thereby increasing the The overall size of the molding base is increased, and the size of the camera module is also increased invisibly.

In addition, this molding process in the prior art will inevitably lead to the structural characteristics of the molding base being narrow at the top and wider at the bottom because the draft angle is less than 90°, and the size of the upper opening of the molding base is larger than that of the molding base. The size of the opening in the lower part of the seat, where the photosensitive element is mounted on the circuit board under the molded base. Therefore, it is unavoidable that stray light easily enters the photosensitive element, which requires an additional structure for preventing stray light, and on the other hand increases the process of molding structure and assembling.

In addition, with the emergence of a full screen, the terminal device (mobile phone) needs a higher screen ratio, so the camera module, especially the front camera module, needs to be installed closer to the top of the terminal. The structure of the molding base of the module with a small upper part and a large lower part makes it difficult to achieve a very narrow edge of the circuit board. In other words, because the draft angle of the molding base of the camera module in the prior art is less than 90°, the molding base has a structure that is small at the top and large at the bottom. If the circuit board is designed to be extremely narrow on one side It will inevitably cause one side of the upper surface of the molding base to be narrower, which may cause the upper surface of the molding base to be unable to reliably attach the light-transmitting component, resulting in unstable imaging of the camera module. even scrapped altogether.

SUMMARY OF THE INVENTION

One of the main advantages of the present invention is to provide a camera module, a circuit board assembly, a method for manufacturing the same, and an electronic device, wherein on the premise of ensuring the imaging quality, the camera module can be reduced in size to facilitate the camera module It meets the requirements of miniaturization and thinning of the electronic device.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method for manufacturing the same, and an electronic device, wherein the width of the camera module can be effectively reduced under the condition of ensuring imaging quality, thereby reducing the size of the camera module. The small camera module occupies the internal space of the electronic device, which is beneficial to the design, processing and development of the electronic device.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a manufacturing method thereof, and an electronic device, wherein the width dimension of the circuit board assembly of the camera module can be effectively reduced, so as to maintain the camera module. When the structure of the module is stable, it is beneficial to reduce the width of the camera module.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method for manufacturing the same, and an electronic device, wherein the mold base can be enlarged when the area of the lower end surface of the mold base remains unchanged. The size of the upper end face of the plastic base provides a larger space for the AA process or the HA process, so as to improve the assembly yield of the electronic product.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a manufacturing method thereof, and an electronic device, wherein the draft angle of at least one side of the molding base of the circuit board assembly is greater than 90°, and in the same mold Under the condition that the area of the lower end of the plastic base remains unchanged, it is beneficial to increase the area of the upper end surface of the mold base, thereby facilitating the subsequent processing of the camera module.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method for manufacturing the same, and an electronic device, wherein the molding base of the circuit board assembly is extruded through a mold during the molding process. film, and the molding space of the molding base is squeezed by the shaping film, so that the draft angle of the molding base is greater than 90°.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a manufacturing method thereof, and an electronic device, wherein the draft angle of at least one side of the molding base of the circuit board assembly is greater than 90°, and the camera mold When the overall size of the group is reduced, the width of the glue on the upper end face of the molding base can be increased, thereby increasing the force of the lens holder or the IR attachment, and helping to improve the manufacturing yield of the camera module.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method for manufacturing the same, and an electronic device, wherein the molding base of the circuit board assembly is integrally formed with a molding base of the circuit board assembly through a molding process. The circuit board, wherein the draft angle during the molding process of the molding base is greater than 90°, so that the size of the upper end face of the molding base is larger than the size of the lower end face.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a manufacturing method thereof, and an electronic device, wherein the inner draft angle of at least one side of the molding base of the circuit board assembly is greater than 90° The inner surface of the molding base is inclined outward from top to bottom, thereby reducing the reflection of external stray light on the inner surface of the molding base, and improving the imaging performance of the camera module.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method for manufacturing the same, and an electronic device, wherein the mold presses the molding film so that the upper end molded on the inner surface of the molding base is inclined The lower end of the inner surface of the molding base is an arc surface, which is beneficial to reduce the reflection of external stray light on the inner surface of the molding base and improve the imaging performance of the camera module.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a manufacturing method thereof, and an electronic device, wherein the curved surface of the inner surface of the molding base is a rough surface, which is beneficial to reduce the mold The inner surface of the plastic base has the effect of reflecting stray light, thereby helping to reduce the reflection of stray light by the inner surface of the molding base to the photosensitive element, and improving the imaging performance of the camera module.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a manufacturing method thereof, and an electronic device, wherein the outer draft angle of at least one side of the molding base of the circuit board assembly is greater than 90° , so that at least one outer side surface of the molding base is inclined inward from top to bottom, so as to reduce the size of the lower end of the base of the molding base, which is conducive to reducing the size of the circuit board assembly. the substrate, thereby reducing the overall size of the camera module.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method for manufacturing the same, and an electronic device, wherein the internal draft angle of at least one side of the molding base of the circuit board assembly is greater than 90° and When the external draft angle is greater than 90°, the molding base gradually narrows from top to bottom, so as to facilitate the formation of a narrow edge on the substrate of the circuit board assembly.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a manufacturing method thereof, and an electronic device, wherein at least one side of the substrate of the circuit board assembly is a narrow side, and corresponds to the narrow side. The inner draft angle of the molding base is greater than 90° and the outer draft angle is greater than 90°, so as to increase the area size of the upper surface of the base of the molding base corresponding to the narrow side, there are This facilitates the installation of the circuit board assembly and the light-transmitting assembly.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method for manufacturing the same, and an electronic device, wherein at least one side of the circuit board of the circuit board assembly is a narrow side, wherein the camera module has a narrow edge. The extremely narrow side is installed close to the top of the electronic device, thereby helping to increase the screen-to-body ratio of the electronic device.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method for manufacturing the same, and an electronic device, wherein during the molding process of the molding base, the mold for processing the molding base is extruded by extrusion. Pressing a plastic film to deform, so that the draft angle of at least one side of the molding base is greater than 90° during the mold drafting process.

Another advantage of the present invention is to provide a camera module, a circuit board assembly, a method for manufacturing the same, and an electronic device, wherein the mold is deformed by pressing the plastic film, and the formed film is formed by the pressing and deformation of the plastic film. The draft angle of the mold base, when the mold is pulled out, the shaping film returns to the original state, so that the mold and the shaping film are demolded from the mold base.

Other advantages and features of the invention will be fully realized from the following detailed description and may be realized by means of the instrumentalities and combinations particularly pointed out in the appended claims.

According to one aspect of the present invention, a circuit board assembly of the present invention capable of achieving the foregoing objects and other objects and advantages includes:

a substrate; and

at least one molded base, wherein the molded base includes a base inner wall, a base outer wall and further has a molded upper end surface and a molded lower end surface, wherein the base inner wall forms the molded A light window of a base, wherein the inner wall of the base further has an inner side surface and an inner arc surface, the inner arc surface extends from the inner side surface, and the inner arc surface faces the molding base.

According to an embodiment of the present invention, the molding base is integrally formed on the substrate by a molding process, wherein the molding base is produced by the following steps:

placing the substrate and the photosensitive element in a processing space of a mold, wherein the mold includes an upper mold, a lower mold and a shaping film;

Clamping the upper mold and the lower mold to form a molding space between the plastic film and the substrate, wherein a spacer of the upper mold squeezes the plastic film to generate an inner extension, extruding the forming space outward from the isolation block by the inward extension;

adding a molding material into the molding space, and curing and forming in the molding space, wherein the inner wall of the base of the molding base is formed on the outer side of the inner extension; and

demolding to mold the mold base on the substrate.

According to an embodiment of the present invention, the included angle between the inner side surface of the inner wall of the base and the substrate is less than or equal to 90°, so that the internal draft angle of the mold base for demolding is greater than or equal to 90° .

According to an embodiment of the present invention, the roughness of the inner arc surface is greater than the roughness of the inner side surface. .

According to an embodiment of the present invention, the outer wall of the base of the molding base has an outer side surface and an outer arc surface, wherein the outer side surface extends downward and obliquely inward from the upper end of the molding to the The outer arc surface extends upwardly and obliquely inward from the lower molding end of the molding base to the outer side surface.

According to an embodiment of the present invention, the molding base is integrally formed on the substrate by a molding process, wherein the molding base is produced by the following steps:

placing the substrate and the photosensitive element in a processing space of a mold, wherein the mold includes an upper mold, a lower mold and a shaping film;

Clamp the upper mold and the lower mold to form a molding space between the plastic film and the substrate, wherein a pressing block of the upper mold presses the plastic film to generate an epitaxial portion, pressing the forming space inward from the pressing block by the extension part;

adding a molding material to the molding space, and curing and forming in the molding space, wherein the outer wall of the base of the molding base is formed on the inner side of the extension; and

demolding to mold the mold base on the substrate.

According to an embodiment of the present invention, the included angle between the outer side surface of the outer wall of the base and the base plate is less than or equal to 90°, so that the outer draft angle of the mold base for demolding is greater than or equal to 90°.

According to an embodiment of the present invention, the circuit board assembly further includes a photosensitive element, wherein the photosensitive element is electrically connected to the substrate, and the photosensitive element is integrally fixed to the substrate by the molding base.

According to an embodiment of the present invention, the circuit board assembly further includes a photosensitive element, the photosensitive element is electrically connected to the substrate, wherein the molding base is integrally disposed outside the photosensitive element.

According to an embodiment of the present invention, the photosensitive element includes a photosensitive portion and at least one non-photosensitive portion, wherein the non-photosensitive portion is located outside the photosensitive portion, wherein the non-photosensitive portion is electrically connected to the substrate , wherein the molding base covers the top of the non-photosensitive part of the photosensitive element, and the photosensitive element is fixed on the substrate by the molding base.

According to an embodiment of the present invention, the substrate further has a substrate upper surface and a substrate lower surface corresponding to the substrate upper surface, wherein the photosensitive element is attached to the substrate upper surface, wherein the mold The plastic base is integrally formed on the upper surface of the substrate.

According to an embodiment of the present invention, the circuit board assembly further includes a set of leads, wherein the leads are electrically connected to the non-photosensitive portion of the photosensitive element to the substrate, and the leads are embedded by the molding base above the substrate.

According to an embodiment of the present invention, the circuit board assembly further includes at least one electronic device, wherein the electronic device is disposed in the edge region of the substrate, wherein the molding base embeds the electronic device on the substrate.

According to an embodiment of the present invention, the substrate is further provided with a bonding region and an edge region, wherein the photosensitive element is attached to the bonding region, and the edge region is located at the periphery of the bonding region, The photosensitive element is attached to the substrate in a manner close to one side of the substrate, so that the edge region of the substrate forms at least one narrow side and at least one load side, wherein the width of the narrow side is less than The width of the load side.

According to an embodiment of the present invention, the circuit board assembly further includes at least one electronic device, wherein the electronic device is disposed on the load side of the substrate, wherein the molding base embeds the electronic device on the substrate.

According to another aspect of the present invention, the present invention further provides a camera module, comprising:

A circuit board assembly as described above;

a lens, wherein the lens is held over the photosensitive element along a photosensitive path of the photosensitive element; and

At least one filter element, wherein the filter element is held between the lens and the photosensitive element.

According to an embodiment of the present invention, the camera module further includes a driving device, wherein the driving device is disposed above the molding base, and the lens is mounted on the driving device, by means of the The driving device drives the movement of the lens.

According to an embodiment of the present invention, the filter element is disposed above the molding base of the circuit board assembly, and the filter element is supported by the molding base.

According to an embodiment of the present invention, the camera module further includes a lens holder, wherein the lens holder is arranged between the driving device and the molding base, wherein the filter element is arranged on the The lens holder supports the filter element by the lens holder.

According to another aspect of the present invention, the present invention further provides an electronic device, comprising:

an electronic device body; and

The above camera module, wherein the camera module is mounted on the upper end of the electronic device body.

According to another aspect of the present invention, the present invention further provides a manufacturing method of a circuit board assembly, wherein the manufacturing method comprises the following steps:

(a) placing a substrate and at least one photosensitive element in a processing space of a mold, wherein the mold includes an upper mold, a lower mold, and a shaping film, wherein the processing space is formed in the upper mold and all the following molds;

(b) clamping the upper mold and the lower mold, forming a molding space between the molding film and the base plate, and pressing the molding film to deform, and pressing the molding film through the molding film pressing the forming space;

(c) adding a molding material into the molding space, and curing the molding material in the molding space;

as well as

(d) demolding the upper mold and the lower mold to mold a molding base on the substrate.

According to an embodiment of the present invention, in the step (a) of the above method, the photosensitive element is attached to the upper surface of the substrate, and a set of leads are arranged, and the photosensitive elements are electrically connected through the leads. components on the substrate.

According to an embodiment of the present invention, before the step (b) of the above method, it further includes the step of: extracting the air between the shaping film and the upper mold by means of air suction, so as to attach the molding A film is formed on the lower surface of the upper mold.

According to an embodiment of the present invention, in the step (b) of the above manufacturing method, a spacer of the upper mold presses the shaping film on the photosensitive element, wherein the shaping film is squeezed Press to form an inner extension portion, wherein the inner extension portion presses the forming space outward from the isolation block, so that the inner draft angle of the molding base is greater than or equal to 90°.

According to an embodiment of the present invention, in the step (c) of the above-mentioned manufacturing method, the molding material is molded on the outer side of the inner extension portion, and is cured and molded into a base of the molding base inner wall.

According to an embodiment of the present invention, in the step (c) of the above-mentioned manufacturing method, a molding material fills the molding space, wherein the inner wall of the base of the molding base is formed on the extension portion On the outer side of the base, the inner side surface and the inner arc surface of the inner wall of the base are formed by the inner extension portion.

According to an embodiment of the present invention, in the step (b) of the above manufacturing method, a pressing block of the upper mold presses the shaping film on the substrate, wherein the shaping film is squeezed Press to form an extension portion, wherein the extension portion presses the forming space inward from the isolation block, so that the outer draft angle of the molding base is greater than or equal to 90°.

According to an embodiment of the present invention, in the step (c) of the above-mentioned manufacturing method, the molding material is molded on the inner side of the extension portion, and is cured and molded into a base outer wall of the molding base .

According to an embodiment of the present invention, in the step (c) of the above-mentioned manufacturing method, a molding material fills the molding space, wherein the outer wall of the base of the molding base is formed on the outer wall of the extension part. On the inner side, the outer side surface and the outer arc surface of the outer wall of the base are formed by the extension portion.

According to an embodiment of the present invention, the step (d) of the above method further comprises: pulling the upper mold of the mold to relieve the pressure of the upper mold on the shaping film, wherein the shaping The membrane is elastically restored to its original state.

Further objects and advantages of the present invention will be fully realized by an understanding of the ensuing description and drawings.

These and other objects, features and advantages of the present invention are fully embodied by the following detailed description, drawings and claims.

Description of drawings

FIG. 1 is a schematic perspective view of an electronic device according to a first preferred embodiment of the present invention.

2 is an overall schematic diagram of a camera module of the electronic device according to the above preferred embodiment of the present invention.

3 is an exploded schematic view of the camera module according to the above preferred embodiment of the present invention.

4 is a three-dimensional cross-sectional view of the camera module according to the above-mentioned preferred embodiment of the present invention.

5A is a schematic perspective view of a circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

5B is a perspective cross-sectional view of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

5C is a schematic perspective view of a circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

5D is a perspective cross-sectional view of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

6A is a schematic perspective view of another circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

6B is a perspective cross-sectional view of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

6C is a schematic perspective view of another circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

6D is a perspective cross-sectional view of the circuit board assembly of the camera module according to the above-mentioned preferred embodiment of the present invention.

7A is a perspective cross-sectional view of another circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

7B is a schematic diagram of an alternative embodiment of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

7C is a schematic diagram of another alternative embodiment of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

7D is a schematic diagram of another alternative embodiment of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

7E is a schematic diagram of another alternative embodiment of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

8 is an overall schematic diagram of another camera module of the electronic device according to the above preferred embodiment of the present invention.

9 is an exploded schematic view of a camera module of the camera module according to the above preferred embodiment of the present invention.

10 is a perspective cross-sectional view of the camera module of the camera module according to the above preferred embodiment of the present invention.

11A to 11G are schematic diagrams illustrating steps of a manufacturing process of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

12A to 12F are schematic diagrams illustrating steps of another manufacturing process of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

13A is a schematic diagram of a modified embodiment of another circuit board assembly of the camera module according to the above-mentioned preferred embodiment of the present invention.

13B is a schematic diagram of molding of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

14 is a cross-sectional view of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

15 is a schematic diagram of a modified embodiment of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

16 is a schematic diagram of another modified embodiment of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

17 is a schematic diagram of another modified embodiment of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

18 is a perspective cross-sectional view of a camera module according to a second preferred embodiment of the present invention.

19A is a schematic diagram of a manufacturing process of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

19B is a schematic view of the manufacturing of the circuit board assembly of the camera module according to the above preferred embodiment of the present invention.

Detailed ways

The following description serves to disclose the invention to enable those skilled in the art to practice the invention. The preferred embodiments described below are given by way of example only, and other obvious modifications will occur to those skilled in the art. The basic principles of the invention defined in the following description may be applied to other embodiments, variations, improvements, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It should be understood by those skilled in the art that in the disclosure of the present invention, the terms "portrait", "horizontal", "upper", "lower", "front", "rear", "left", "right", " The orientation or positional relationship indicated by vertical, horizontal, top, bottom, inner, outer, etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and to simplify the description, rather than to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and thus the above terms should not be construed as limiting the invention.

It should be understood that the term "a" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be one. The number may be plural, and the term "one" should not be understood as a limitation on the number.

Referring to FIG. 1 of the accompanying drawings of the present invention, an electronic device according to a first preferred embodiment of the present invention is explained in the following description. The electronic device includes at least one camera module 100 and an electronic device body 200 on which the at least one camera module 100 is mounted, wherein the electronic device body 200 controls the camera module 100 to capture images. Exemplarily, the camera module 100 may be installed on the electronic device body 200 in a manner facing the front of the electronic device body 200 , and the camera module 100 assists the electronic device body 200 to assist in photographing the electronic device body 200 . Image information in front of electronic devices. In short, the camera module 100 is used as a front camera device of the electronic device. It can be understood that, in this preferred embodiment of the present invention, the manner in which the camera module 100 is mounted on the electronic device body 200 is merely illustrative and not limiting. Therefore, the at least one camera module 100 can also be installed on the electronic device body 200 in a manner facing the back of the electronic device body 200 , that is, the camera module 200 is used as a rear camera of the electronic device. a device to capture image information behind the electronic device.

By way of example, the electronic device may be implemented as a smartphone. In the drawings of the description of the present invention, the camera device in the electronic device is shown in the form of a single camera, and in other embodiments, the camera module can also be implemented as an array camera module, such as a dual camera module. camera module, triple-camera module or other multi-camera module. In addition, the type of the electronic device is only used as an example. The drawings in the description of the present invention take a mobile phone device as an example, but it is not limited to a smart phone device. The electronic device can also be implemented as other electronic devices with a photographing function. Devices, such as tablet computers, smart home electronics, and other types of electronic devices.

Referring to FIGS. 2 to 7B of the accompanying drawings of the present invention, the camera module 100 of the electronic device according to the above preferred embodiment of the present invention is explained in the following description. The camera module 100 includes at least one circuit board assembly 10 and at least one lens 20, wherein the lens 20 is kept above the circuit board assembly 10 along the light-sensing path of the camera module 100, and light passes through the camera module 100. The lens 20 is received to the circuit board assembly 10 for the circuit board assembly 10 to receive the light and convert the light signal of the light into an electrical signal. The circuit board assembly 10 includes a substrate 11, a molding base 12, and a photosensitive element 130, wherein the photosensitive element 130 is disposed on the substrate 11, and the molding base 12 is integrally formed. is formed on the substrate 11 , wherein the photosensitive element 130 is fixed on the substrate 11 by the molding base 12 .

The photosensitive element 130 is electrically connected to the substrate 11 of the circuit board assembly 10 , and the electrical signal generated by the photosensitive element 130 is transmitted to the electronic device body 200 through the substrate 11 . Correspondingly, when the camera module 100 is mounted on the electronic device body 200 , the circuit board assembly 10 of the camera module 100 is communicatively connected to the electronic device body 200 .

In the present invention, the circuit board assembly 10 is formed by integrally molding the molding base 12 on the substrate 11 based on the molding process. The camera module 100 further includes at least one filter element 40, wherein the filter element 40 is disposed between the photosensitive element 130 and the lens 20, wherein the filter element 40 filters the filter element 40 from the lens. The stray light transmitted to the photosensitive element 130 helps to improve the imaging quality of the camera module 100 .

As shown in FIGS. 2 to 4 , the lens 20 is an optical system element of the camera module 100 , wherein the lens 20 includes at least one optical lens 21 and at least one lens barrel 22 , wherein the optical lens 21 is based on The optical axis of the camera module is set on the lens barrel 22 . Preferably, in this preferred embodiment of the present invention, the number of the optical lenses 21 of the lens 20 is multiple, wherein the optical lenses 21 are arranged on the lens barrel 22 based on the optical axis direction . The lens barrel 22 holds the optical lens 21 of the lens 20 above the photosensitive path of the photosensitive element 130 .

In the first preferred embodiment of the present invention, the filter element 40 of the camera module 100 is disposed on the molding base 12 of the circuit board assembly 10, and the molding base The holder 12 holds the filter element 40 . Preferably, in the first preferred embodiment of the present invention, the filter element 40 is attached to the top of the molding base 12 in an adhesive manner. It is worth mentioning that the manner in which the filter element 40 is mounted in the present invention is merely illustrative, rather than limiting. Therefore, the filter element 40 can also be installed on the mold base 12 by other installation methods, such as installing the filter element 40 on the mold base 12 through a mounting bracket, and by the installation The support holds the position of the filter element 40 fixedly; or the filter element 40 is arranged on a support, and the support is arranged above the photosensitive element 130 .

As shown in FIG. 2 to FIG. 4 , the camera module 100 further includes a driving device 50 , wherein the at least one lens 20 is disposed on the driving device 50 , and the driving device 50 maintains all The lens 20 is above the photosensitive element 130 . The driving device 50 is disposed on the molding base 12 of the circuit board assembly 10 , wherein the driving device 50 is supported by the molding base 12 to drive the lens 20 to move. The driving device 50 can be attached to the top of the molding base 12 by means of gluing. The lens barrel 22 of the lens 20 is drivably disposed on the driving device 50, wherein the driving device 50 drives the lens barrel 22 to move.

Those skilled in the art can understand that the driving device 50 of the camera module 100 may be, but not limited to, a motor, such as a voice coil motor, wherein the driving device 50 drives the lens 20 along the direction of the photosensitive element 130 The top of the photosensitive path moves.

It is worth mentioning that, in the first preferred embodiment of the present invention, the driving device 50 and the filter element 40 are attached or adhered to the molding base 12 in an adhesive manner. surface. Therefore, the upper surface of the molding base 12 of the circuit board assembly 10 needs to reserve a large enough attachment surface for the driving device 50 and the filter element 40 to be attached.

As shown in FIG. 2 to FIG. 4 , the molding base 12 is integrally formed on the substrate 11 by a molding process, wherein the molding material forming the molding base 12 is wrapped around the substrate 11 . . It can be understood that, since the molding material is integrally formed on the surface of the substrate 11, the size of the surface area of the substrate 11 should be at least greater than or equal to the size of the bottom of the molding base 12, So that the base plate 11 is sufficient to support the molding of the molding material. Those skilled in the art can understand that when the size of the lower part of the molding base 12 is reduced, the size of the base plate 11 corresponding to the lower part of the molding base 12 can be reduced, so as to be sufficient to support the mold In the case of the plastic base 12, the overall size of the circuit board assembly 10 can be reduced.

It is worth mentioning that, in the preferred embodiment of the present invention, the photosensitive element 130 is fixedly disposed on the substrate 11 by the molding base 12 through a molding process.

The molding base 12 includes a base upper end 121 and a base lower end 122, wherein the base upper end 121 integrally extends upward from the base lower end 122, and the base lower end The portion 122 is integrally attached to the upper surface of the substrate 11 . Preferably, the molding base 12 has a structure that is larger in size at the top and smaller at the bottom, wherein the size of the upper end portion 121 of the base of the molding base 12 is larger than the size of the lower end portion 122 of the base. In short, the molding base 12 has a structure that is large on the top and small on the bottom, wherein the size of the lower part of the molding base 12 is small, so as to reduce the overall width of the circuit board assembly 10 . Preferably, the size of the base upper end portion 121 of the molding base 12 is larger than the size of the base lower end portion 122, so that the base upper end portion 121 of the molding base 12 has sufficient There is a space for the driving device 50 and the filter element 40 to be attached to the upper end 121 of the base. In other words, the structure size of the upper end portion 121 of the base is larger than that of the lower end portion 122 of the base, when the size of the lower end portion 122 of the base is reduced in order to reduce the size of the substrate 11 of the circuit board assembly 10 In the case of the width dimension, the base upper end 121 of the molding base 12 also has enough space for subsequent processing processes, such as the AA process and the HA process.

The molding base 12 further has a molding upper end surface 123 and a molding lower end surface 124, wherein the molding upper end surface 123 is located on the upper surface of the molding base 12, that is, the upper end of the base The upper surface of 121; wherein the molding lower end surface 124 is formed on the lower surface of the molding base 12, that is, the lower surface of the lower end portion 122 of the base. It can be understood that the molding lower end surface 124 is integrally formed on the upper surface of the base 11 from the molding material through the molding process, or the molding lower end surface 124 faces each other through the molding process. It is integrally attached to the upper surface of the base 11 .

It is worth mentioning that the molding upper end surface 123 is a smooth surface formed on the upper surface of the molding base 12, so that the molding upper end surface 123 can be coated with an adhesive layer and provided to the supported object evenly. support force.

Preferably, the size and area of the molding upper end surface 123 are larger than the size and area size of the molding lower end surface 124, so that the molding upper end surface 123 of the molding base 12 can be provided on the molding base 12. The filter element 40 and the driving device 50 have enough space to meet the processing requirements of the molding base 12 . It can be understood that, under the condition that the size of the molding upper end surface 123 of the molding base 12 meets the requirements of subsequent processing (such as the AA process or the HA process), the mold of the molding base 12 The size of the molded lower end surface 124 is smaller than the size of the molded lower end surface 123, so as to reduce the width dimension of the substrate 11 of the circuit board assembly 10, thereby reducing the overall size of the circuit board assembly 10. size. In other words, when the size of the molding upper end surface 123 of the molding base 12 remains unchanged, by reducing the size of the base lower end 122 of the molding base 12 The size of the molded lower end surface 124 is reduced, thereby facilitating the reduction of the width of the substrate 11 of the circuit board assembly 10 .

Those skilled in the art can understand that the size of the substrate 11 of the circuit board assembly 10 is the main factor restricting the overall width of the camera module 100 . Therefore, when the width dimension of the substrate 11 of the circuit board assembly 10 is reduced, it is beneficial to reduce the overall size of the camera module 100. When the size of the camera module 100 is reduced and the camera module 100 is installed on the electronic device body 200 , the ratio of the camera module 100 to the electronic device body 200 can be reduced, which is beneficial to improve the The screen ratio of the electronic device.

When the size and area of the molding lower end surface 124 of the molding base 12 remain unchanged, the base upper end 121 of the molding base 12 can be enlarged, and the molding The size of the area of the upper end surface 123 is increased, thereby increasing the size of the contact surface between the driving device 50 and the filter element 40 and the circuit board assembly 10 , which is easy to install on the surface of the molding base 12 . Mold the upper end face with 123 glue, and increase the width of the glue. Those skilled in the art can understand that, when the camera module 100 is assembled, the space reserved for the AA process and the HA process is very small. The size of the end face 123 can increase the processing space reserved for the AA process or the HA process, thereby helping to improve the yield of the AA process.

The molded base 12 of the circuit board assembly 10 further includes a base inner wall 125 and a base outer wall 126, wherein the base inner wall 125 is formed on the inner inner wall of the molded base 12, wherein The base outer wall 126 is formed on the outer outer wall of the molded base 12 . It can be understood that the base inner wall 125 and the base outer wall 126 of the molding base 12 are formed on the inner side and the outer side of the molding base 12 after being drafted through a molding process. Preferably, in the first preferred embodiment of the present invention, the base inner wall 125 of the molding base 12 is formed on an inclined surface of the molding base 12 inclined outward from top to bottom. In other words, the inner surface of the molding base 12 is inclined downward toward the substrate 11 of the circuit board assembly 10 , wherein the vertical projection of the inner wall 125 of the base is determined by the molding upper end surface The projection of 124 in the vertical direction is covered, that is, along the direction of the photosensitive path of the camera module 100 , the projection of the inner wall 125 of the base is covered by the projection of the upper molding end surface 124 .

Preferably, the base inner wall 125 and the base outer wall 126 of the molding base 12 are planes formed on the inner and outer sides of the molding base 12, or curved surfaces with a certain curvature shape, or is an irregularly shaped arc. Therefore, in the present invention, the shape, curvature and smoothness of the base inner wall 125 and the base outer wall 126 are not limited herein.

Those skilled in the art can understand that when stray light from outside is transmitted to the circuit board assembly 10 through the lens 20 of the camera module 100 , the molding base 12 of the circuit board assembly 10 can By reducing stray light from entering the photosensitive element 130 through reflection, the influence of stray light on the imaging of the camera module 100 can be effectively reduced, and the imaging performance of the camera module 100 can be improved. The base inner wall 125 of the molding base 12 faces the substrate 11 of the circuit board assembly 10 , so as to prevent stray light from being irradiated on the base inner wall 125 and then reflected to the photosensitive element 130 . In short, the molding base 12 has the base inner wall 12 sloping inwardly and facing downward, reducing reflections through the base inner wall 12 of the molding base 12 to the photosensitive element 130 stray light, thereby improving the imaging quality of the camera module 100 .

Preferably, in this preferred embodiment of the present invention, the base inner wall 125 of the molding base 12 is a rough surface formed on the inner side of the molding base, wherein the molding base 12 has a rough surface. The roughness of the inner wall 125 of the base is greater than the roughness of the upper surface of the molding base 12 . In other words, the base inner wall 125 of the molding base 12 is a non-smooth surface to reduce the reflection effect of the base inner wall 125 on light, which is beneficial to reduce the stray light reflected by the base inner wall 125 .

Each of the base inner walls 125 of the molding base 12 has an inner arc surface 1252 formed by an inner side surface 1251 and the inner side surface 1251 integrally extending downward, wherein the inner side surface 1251 is formed from the molding The inner side of the molded upper end surface 123 of the base 12 extends downward and obliquely outward to the inner arc surface 1252 . The inner arc surface 1252 extends upwardly and obliquely outward from the lower molding end surface 124 of the molding base 12 to the inner side surface 1251 . It is worth mentioning that the inner side surface 1251 of the base inner wall 125 of the molding base 12 may also be a vertical surface perpendicular to the molding upper end surface 123 , that is, the inner side surface 1251 is perpendicular to The molded upper end face 123 . Preferably, the inner side surface 1251 of the base inner wall 125 is an inclined plane of the base inner wall 125 . The opening of the inner arc surface 1252 faces the inner side of the molding base 12 . The inner arc surface 1252 of the base inner wall 125 is a rough surface formed on the lower end of the base inner wall 125 , wherein the inner arc surface 1252 of the base inner wall 125 is formed on the molding base 12 the inside of the lower part. It can be understood that the inner arc surface 1252 in the form of a rough surface can reduce the reflection effect on light, so that the inner arc surface 1252 can reduce the stray light reflected to the photosensitive element 130, which is beneficial to improve the camera module. 100 imaging performance.

Preferably, in the first preferred embodiment of the present invention, the base outer wall 126 of the molding base 12 is formed on the inclined surface of the base 12 inclined inward from top to bottom, wherein the base The vertical projection of the outer wall 126 of the base is covered by the projection of the upper molding end surface 124 in the vertical direction, that is, along the direction of the photosensitive path of the camera module 100, the projection of the outer wall 126 of the base is covered by the Covered by the molded upper end face 124 . In short, the molding base 12 is a structure with a large upper and a small lower, wherein the outer wall 126 of the base of the molding base 12 is inclined downward toward the substrate of the circuit board assembly 10 11. The base upper end portion 121 of the molding base 12 extends inwardly from top to bottom to the base lower end portion 122 of the molding base 12 . The size of the lower end portion 122 of the seat is smaller than the size of the upper end portion 121 of the base. The size of the base lower end portion 122 of the molding base 12 is reduced in order to reduce the width dimension of the substrate 11 of the circuit board assembly 10 .

Each of the base outer walls 126 of the molding base 12 has an outer side surface 1261 and an outer arc surface 1262 , wherein the outer side surface 1261 extends from the upper molding end surface 123 of the molding base 12 . The outer edge extends downwardly and obliquely inwardly to the outer arcuate surface 1262 . The outer arc surface 1262 extends upwardly and obliquely inward from the lower molding end surface 124 of the molding base 12 to the outer side surface 1261 . It is worth mentioning that, the outer side surface 1261 of the base outer wall 126 of the molding base 12 may also be a vertical surface perpendicular to the molding upper end surface 123 , that is, the outer side surface 1261 is perpendicular to The molded upper end face 123 . Preferably, the outer side surface 1261 of the base outer wall 126 is an inclined plane of the base outer wall 126 . The opening of the outer arc surface 1262 faces the outer side of the molding base 12 or faces the base plate 11 . The outer arc surface 1262 of the base outer wall 126 is formed on the outer side of the lower portion of the molding base 12 , wherein the outer arc surface 1262 of the base outer wall 126 is recessed from the outside to the inside to reduce Dimensions of the base lower end 122 of the molded base 12 .

In the first preferred embodiment of the present invention, the driving device 50 of the camera module 100 is disposed on the molding base 12 of the circuit board assembly 10 by means of gluing. The camera module 100 further includes a base adhesive layer 60 , wherein the base adhesive layer 60 is formed on the base upper end surface 123 of the molding base 12 in a manner of drawing glue. It can be understood that, the base adhesive layer 60 can also be implemented as a glue painting process formed on the bottom of the driving device 50 .

As shown in FIGS. 2 to 5A , the molding base 12 is further provided with a glue painting area 127 , wherein the glue painting area 127 is located on the upper end surface 123 of the base of the molding base 12 . The glue is applied to the glue area 127 , and the base glue layer 60 is formed over the glue area 127 . It can be understood that the formation of the base adhesive layer 60 may be not limited to solid colloidal materials and fluid colloidal materials. When the lower end portion 122 of the molding base 12 is reduced, or when the size of the lower end portion 122 of the molding base 12 is kept unchanged, the base of the molding base 12 The upper end portion 121 can be enlarged to increase the size of the upper end surface 123 of the base of the molding base 12 , so as to increase the width of the glue drawing area 127 , so as to increase the size of the camera module 100 . The width of the base adhesive layer 60 . Those skilled in the art can understand that, by increasing the width of the drawing glue area 127 of the molding base 12 to increase the width of the base glue layer 60 of the camera module 100, the molding is facilitated. The base 12 is attached to the driving device 50, and the attachment reliability is improved.

As shown in FIG. 2 to FIG. 4 , the circuit board assembly 10 of the camera module 100 further includes a set of lead wires 13 , wherein the lead wires 13 are connected to the photosensitive element 130 and the substrate 11 . The substrate 11 of the circuit board assembly 10 communicates with the photosensitive element 130 through the leads 13 , so that the photosensitive element 130 transmits electrical signals to the substrate 11 of the circuit board assembly 10 through the leads 13 .

Preferably, in the first preferred embodiment of the present invention, the lead 13 and the photosensitive element 130 of the circuit board assembly 10 of the camera module 100 are embedded in the molding base 12 , In order to reduce the size of the width dimension of the camera module 100 . In other embodiments, the molding base 12 is integrally molded on the substrate 11 in a manner of wrapping around the outside of the photosensitive element 130 and the lead 13 .

Those skilled in the art can understand that the leads 13 of the circuit board assembly 10 are embedded in the molding base 12 , and the molding base 12 further fixes the photosensitive element 130 on the substrate 11. The lead 13 and part of the photosensitive element 130 are embedded in the molding base 12 to reduce the size of the substrate 11 of the circuit board assembly 10 and improve the utilization rate of the photosensitive element 130 .

Further, the circuit board assembly 10 further has a light window 14 , wherein the light window 14 is formed on the inner side of the molding base 12 by a molding process. The lens 20 transmits light to the photosensitive element 130 through the light window 14 . It is understood that the light window 14 is defined by the base inner wall 125 of the molded base 12 . Preferably, the size of the opening of the light window 14 should be adapted to the photosensitive element 130 , so that the light entering the module can be received by the photosensitive element 130 . Photosensitive element 130 According to the first preferred embodiment of the present invention, the size of the upper opening of the light window 14 is smaller than or equal to the size of the lower opening of the light window 14, wherein the upper opening of the light window 14 limits all The light transmittance of the camera module 100 is described. The upper opening of the light window 14 can limit the entry of part of the stray light from the outside, while the inner wall 125 of the base faces the substrate 11 of the circuit board assembly 10 , and the light entering will not pass through the inner wall of the base 125 reflection, so as to avoid the generation of stray light, thus improving the imaging quality of the camera module 100 .

As shown in FIGS. 2 to 4 , the photosensitive element 130 further includes a photosensitive portion 31 and a non-photosensitive portion 32 , wherein the non-photosensitive portion 32 integrally extends outward from the photosensitive portion 31 . The photosensitive portion 31 receives the light transmitted by the lens 20 and converts the light signal into a corresponding electrical signal. The lead 13 is connected to the non-photosensitive portion 32 of the photosensitive element 130 and the substrate 11 of the circuit board assembly 10 , so that the photosensitive element 130 transmits the photoelectrically converted signal through the lead 13 to the substrate 11 . the substrate 11 . Preferably, in the first preferred embodiment of the present invention, the light window 14 corresponds to the photosensitive portion 31 of the photosensitive element 130 . Correspondingly, the non-photosensitive portion 31 of the photosensitive element 130 is embedded in the molding base of the circuit board assembly 10 . The molding base 12 fixes the photosensitive element 130 on the upper surface of the substrate 11 .

The lower surface of the photosensitive element 130 is attached above the substrate 11 , wherein the upper surface of the photosensitive element 130 has a photosensitive area 33 and a non-photosensitive area 34 , wherein the non-photosensitive area 33 is located in the photosensitive area 33 . The non-photosensitive region 34 is located on the upper end surface of the non-photosensitive portion 32 and the edge portion of the upper end surface of the photosensitive portion 31 . Specifically, the size of the photosensitive area 33 of the photosensitive unit 30 corresponds to the size of the upper opening (aperture) of the light window 14 , and the molding base 12 covers a portion of the upper surface of the photosensitive element Corresponding to the non-photosensitive area 34 of the photosensitive element 130 . The photosensitive area 33 of the photosensitive element 130 is based on the light window 14 and receives the light transmitted by the lens 20 .

As shown in FIG. 2 to FIG. 4 , the circuit board assembly 10 further includes at least one electronic device 15 , wherein the electronic device 15 is disposed on the surface of the substrate 11 . Preferably, the at least one electronic device 15 is attached to the edge of the substrate 11 , and the electronic device 15 is embedded on the upper surface of the substrate 11 by the molding base 12 . The electronic device 15 of the circuit board assembly 10 is covered by the molding base 12, and the electronic device 15 is isolated by the molding base 12, so as to protect the electronic device of the circuit board assembly The device 15 is protected from oxidation due to prolonged contact with the environment.

The substrate 11 has a substrate upper surface 111 and a substrate lower surface 112 corresponding to the substrate upper surface 111 , wherein the photosensitive element 130 and the electronic device 15 are attached to the substrate upper surface 111 . The molding base 12 is integrally formed on the upper surface 111 of the substrate 11 , wherein the width of the upper surface 111 of the substrate 11 is greater than or equal to the width of the molding base 12 . When the width dimension of the molding base 12 can be reduced, the size of the substrate 11 corresponding to the lower end of the molding base 12 can be correspondingly reduced, thereby reducing the width of the circuit board assembly 10 The size is beneficial to reduce the overall size of the camera module 100 .

The substrate 11 is further provided with a bonding area 113 and an edge area 114 , wherein the photosensitive element 130 is attached to the bonding area 113 of the substrate 11 , and the edge area 114 is located in the bonding area 113 around. The molding base 12 is integrally formed on the edge region 114 of the substrate 11 . Preferably, the lower end portion 122 of the molding base 12 covers or is embedded in the edge region 114 of the substrate 11 . Optionally, the size of the edge region 114 of the substrate 11 is greater than or equal to the size of the base lower end 122 of the molding base 12 . Therefore, the size of the substrate 11 of the circuit board assembly 10 can be reduced by reducing the size of the lower end portion 122 of the molding base 12 , thereby reducing the size of the camera module 100 overall size.

Referring to FIGS. 5A to 7B of the accompanying drawings of the present invention, several alternative implementations of the circuit board assembly 10 according to the above-mentioned preferred embodiment of the present invention are shown. The substrate 11 of the circuit board assembly 10 is communicated with the photosensitive element 20 through the leads 13 , wherein the electronic device 15 is disposed on the upper surface of the substrate 11 . After the electronic device 15 and the circuit board assembly 10 are placed on the substrate 11 , the substrate 11 is placed in a mold 300 for molding, and the mold 300 is integrated by molding. The molding base is formed on the upper surface of the substrate 11 . It is worth mentioning that during the molding process of the circuit board assembly 10, the draft angle of the draft process for forming the molding base 12 is greater than or equal to 90° (including 90°), so that the After the molding base 12 is formed on the substrate 11 , the size of the base upper end 121 of the molding base 12 is larger than the size of the base lower end 122 .

As shown in FIG. 7C , two different embodiments of the inner surface 1251 and the inner arc surface 1252 of the inner wall 125 of the base of the molding base 12 are shown, wherein the inner arc surface 1252 A groove is formed by concave from the inside to the outside, wherein the inner side surface 1251 is located above the groove. In another embodiment, the inner side surface 1251 of the base inner wall 125 of the molding base 12 smoothly extends downward to the inner arc surface 1252 , wherein the inner side surface 1251 and the inner The connecting portion of the arc surface 1252 has a smooth chamfer.

In particular, the molding base 12 formed by impacting the molding material on the substrate 11 and/or the photosensitive element 130, the inner wall 125 of the base forms an inner side surface, an inner arc surface and an inclined surface. The inner surface is located above the inner arc surface, and the inclined surface is an inclined surface formed by the molding material impacting above the substrate 11 or the photosensitive element 130 .

It is worth mentioning that the draft angle of the draft process for forming the molding base 12 includes at least one inner draft angle and at least one outer draft angle, wherein the base of the molding base 12 is The inclination angle and shape of the inner wall 125 depend on the size of the inner draft angle, wherein the inclination angle and shape of the base outer wall 126 of the mold base 12 depend on the outer draft angle. In this preferred embodiment of the present invention, at least one draft angle in the molding process of the molding base 12 is greater than or equal to 90°.

As shown in FIG. 5A to FIG. 5D , the internal draft angle of at least one side of the molding base 12 is greater than or equal to 90° (including 90°), so that at least one side of the molding base 12 after molding is at least 90° or more. The inner wall 125 of the base on one side extends obliquely outward from top to bottom. The angle between the outer edge of the molding base 12 and the base plate 11 is less than or equal to 90° (including 90°), so that the base outer wall 126 of the molding base 12 is formed from the top The lower ground slopes inland. Preferably, the inner draft angle of each side of the molding base 12 is greater than or equal to 90° (including 90°), so that the base inner wall 125 of the molding base 12 is inclined inwardly, In order to avoid stray light being reflected by the inner wall 125 of the base and entering the photosensitive element 130 .

The included angle between the base inner wall 125 of the molding base 12 and the vertical direction of the molding base 12 is θ ₁ , wherein the included angle θ ₁ is greater than zero. It can be understood that the inner wall of the base of the molding base 12 is inclined upwardly extending from the inward of the molding base 12 , when the lower molding end surface 124 of the molding base 12 Under the condition that the size _of the area of The area of the upper end surface 123 of the base base 12 is molded, so as to facilitate the subsequent AA process or HA process.

The included angle between the inner wall 125 of the molding base 12 and the plane where the substrate 11 is located is α1, where α1 is less than or equal to 90°, and the sum of α1 and the included angle _θ1 is 90°. Preferably, the included angle between the inner wall 125 of the base and the plane where the substrate 11 is located is an acute angle with α1 less than 90°. It can be understood that the inner draft angle of the molding base 12 is 90°+θ ₁ .

It is worth mentioning that the base inner wall 125 of the molding base 12 may be a flat surface or a curved surface formed on the inner side of the molding base 12 . As shown in FIG. 5C and FIG. 5D , the inner wall 125 of the base is a curved surface formed on the inner side of the molding base 12 , wherein the inner wall 125 of the base has a certain arc along the photosensitive path of the camera module 100 . In the vertical direction of the camera module 100 , the projection of the inner wall 125 of the base is covered by the upper end surface 123 of the base of the molding base 12 .

Referring to FIGS. 6A to 6D of the accompanying drawings of the present invention, another optional embodiment of the molding base 12 of the camera module 100 according to the above preferred embodiment of the present invention is described in the following. clarified in. The molding base 12 of the camera module 100 is integrally formed on the substrate 11 of the circuit board assembly 10 through a molding process. At least one side of the molding base 12 is externally drawn. The angle is greater than or equal to 90° (including 90°), so that the base outer wall 126 of at least one side of the molded base 12 is inclined inward from top to bottom. The angle between the inner side of the molding base 12 and the base plate 11 is less than or equal to 90° (including 90°), so that the base outer wall 126 of the molding base 12 is formed from top to bottom The lower ground slopes inward. Preferably, the inner draft angle of each side of the molding base 12 is greater than 90° (including 90°), so that the base outer wall 126 of the molding base 12 goes from top to bottom. inclination. The included angle between the base outer wall 126 of the molding base 12 and the vertical direction of the molding base 12 is θ ₂ , wherein the included angle θ ₂ is greater than zero.

The included angle between the base outer wall 126 of the molding base 12 and the plane where the substrate 11 is located is α2, where α2 is less than or equal to 90°, and the sum of _α2 and the included angle θ2 is 90°. Preferably, the included angle between the outer wall 126 of the base and the plane where the substrate 11 is located is an acute angle with α2 less than 90°. It can be understood that the inner draft angle of the molding base 12 is 90°+θ ₂ .

It is worth mentioning that the base outer wall 126 of the molding base 12 may be a plane or a curved surface formed on the outside of the molding base 12 . As shown in FIG. 6C and FIG. 6D , the base outer wall 126 is a curved surface formed on the outside of the molding base 12 , wherein the base outer wall 126 has a certain arc along the photosensitive path of the camera module 100 . In the vertical direction of the camera module 100 , the projection of the outer wall 126 of the base is covered by the upper end surface 123 of the base of the molding base 12 .

Correspondingly, when the size of the base upper end 121 of the molding base 12 is kept unchanged, and is sufficient to support and assemble the driving device 50 and the green light element 40, the molding base The lower end portion 122 of the base 12 extends obliquely inward from the upper end portion 121 of the base, so that the bottom end of the molding base 12 becomes smaller, thereby helping to reduce the size of the circuit board assembly 10. The size of the substrate 11 is beneficial to reduce the overall size of the camera module.

Referring to FIGS. 7A to 7E of the accompanying drawings of the present invention, other optional embodiments of the molding base 12 of the camera module 100 according to the above preferred embodiments of the present invention are described below clarified in. The molding base 12 of the camera module 100 is integrally formed on the substrate 11 of the circuit board assembly 10 through a molding process. At least one side of the molding base 12 is externally drawn. The angle is greater than or equal to 90° (including 90°), so that the base outer wall 126 of at least one side of the molded base 12 is inclined inward from top to bottom. The inner side of the molding base 12 is formed with a draft angle greater than or equal to 90° (including 90°), so that the base outer wall 126 of the molded base 12 is inclined outward from top to bottom. . Preferably, the inner draft angle of each side of the molding base 12 is greater than 90° and the outer draft angle is greater than 90°, so that the molding base 12 after molding is large at the top and small at the bottom structure, wherein the size of the upper end portion 121 of the molding base 12 is larger than the size of the lower end portion 122 . The included angle between the base inner wall 125 of the molding base 12 and the vertical direction of the molding base 12 is θ ₁ , wherein the included angle θ ₁ is greater than zero. The included angle between the base outer wall 126 of the molding base 12 and the vertical direction of the molding base 12 is θ ₂ , wherein the included angle θ ₂ is greater than zero.

The included angle between the inner wall 125 of the molding base 12 and the plane where the substrate 11 is located is α1, where α1 is less than or equal to 90°, and the sum of α1 and the included angle _θ1 is 90°. Preferably, the included angle between the inner wall 125 of the base and the plane where the substrate 11 is located is an acute angle with α1 less than 90°. It can be understood that the inner draft angle of the molding base 12 is 90°+θ ₁ . The included angle between the base outer wall 126 of the molding base 12 and the plane where the substrate 11 is located is α2, where α2 is less than or equal to 90°, and the sum of _α2 and the included angle θ2 is 90°. Preferably, the included angle between the outer wall 126 of the base and the plane where the substrate 11 is located is an acute angle with α2 less than 90°. It can be understood that the inner draft angle of the molding base 12 is 90°+θ ₂ .

It is worth mentioning that the base inner wall 125 of the molding base 12 may be a flat surface or a curved surface formed on the inner side of the molding base 12 . As shown in FIG. 7C and FIG. 7D , the base inner wall 125 is a curved surface formed on the inner side of the molding base 12 , wherein the base inner wall 125 and the base outer wall 126 have a certain arc, along the The direction of the photosensitive path of the camera module 100 , that is, in the vertical direction of the camera module 100 , the projections of the inner wall 125 of the base and the outer wall 126 of the base are projected by the base of the molding base 12 . The upper end surface 123 of the seat is covered.

It can be understood that, when the inner draft angle of the molding base 12 is greater than 90°, the inner wall of the base of the molding base 12 can reduce the stray light from the outside entering the photosensitive element 130, and the When the outer draft angle of the molding base 12 is greater than 90°, the size of the base lower end 122 of the molding base 12 can be reduced, so as to reduce the size of the base 11, which is beneficial to all The overall size of the camera module 100 is described. While the lower end surface 124 of the molding base 12 is reduced, the upper end surface 123 of the base of the molding base 12 can be enlarged, so that all the The base upper end 121 of the molding base 12 is enlarged on the premise that the base lower end 122 is reduced. In short, when the inner draft angle and the outer draft angle of the molding base 12 are both greater than 90°, the size of the base lower end surface 124 of the molding base 12 decreases, In order to reduce the size of the molding base 12, and the size of the base upper end surface 123 of the molding base 12 becomes larger, so that the molding base 12 can provide a larger size for subsequent processing. processing space.

Referring to FIGS. 8 to 10 of the accompanying drawings of the present invention, another alternative implementation of a camera module according to the first preferred embodiment of the present invention is explained in the following description. The camera module 100 further includes a mirror holder 70 , wherein the mirror holder 70 is disposed between the molding base 12 and the driving device 50 , and the driving device is fixed by the mirror holder 70 . 50 to the molded base 12 of the circuit board assembly 10 .

Further, in this embodiment, the filter element 40 of the camera module 100 is also disposed on the lens holder 70 , wherein the lens holder 70 supports the filter element 40 to hold the filter element 40 . The element 40 is above the photosensitive element 130 .

It can be understood that the lens holder 70 can be implemented as a support base, wherein the lens holder 70 further includes a lens holder body 71 and a lens holder adhesive layer 72, wherein the lens holder adhesive layer 72 is provided Above or below the lens holder 70 , the driving device 50 is fixed to the lens holder body 71 through the lens holder adhesive layer 72 , or the lens holder body 71 is fixed to the lens holder body 71 through the lens holder adhesive layer 72 . The molded base 12 . The driving device 50 is supported by the lens holder body 71 to drive the lens 20 to move.

Referring to FIGS. 11A to 11G in the accompanying drawings of the present invention, the flow of the manufacturing method of the circuit board assembly 10 of the camera module 100 according to the above preferred embodiment of the present invention is shown. As shown in FIG. 11A , first, at least one of the substrates 11 of the circuit board assembly 10 is provided or prepared. According to the above preferred embodiment of the present invention, the photosensitive element 130 is attached to the upper end of the substrate 11 . In short, the substrate 11 of the circuit board assembly 10 is provided as a semi-finished product, wherein the lead 13 is connected to the photosensitive element 130 and the substrate 11 .

As shown in FIG. 11B , the substrate 11 of the circuit board assembly 10 is placed in the mold 300 , and the substrate 11 is fixed by the mold 300 . It is worth mentioning that the mold 300 includes an upper mold 310 , a lower mold 320 , and is further provided with at least one processing space 330 , wherein the processing space 330 is located between the upper mold 310 and the lower mold 320 . The substrate 11 is placed in the processing space 330. During mold clamping, the processing space 330 between the upper mold 310 and the lower mold 320 is squeezed to become smaller until the upper mold 310 is attached to the mold. fit on the upper surface of the substrate 11 .

Further, the mold 300 further includes a shaping film 340, wherein the shaping film 340 is disposed under the upper mold 310 of the mold 300, when the upper mold 310 and the lower mold 320 When the mold is closed, the shaping film 340 is attached to the upper mold 310 . After the mold is closed, the upper mold 310 of the mold 300 presses the shaping film 340 on the upper surface of the substrate 11 , so that part of the shaping film 340 is closely attached to the substrate 11 . After the mold 300 is closed, a molding space 350 is further formed between the molding film 340 and the substrate 11 , wherein the molding material of the molding base 12 is placed into the molding space 350 In the process, the molding base 12 is formed by curing.

It is worth mentioning that the shaping film 340 of the mold 300 has elasticity, and after the upper mold 310 and the lower mold 320 are closed, the upper mold 310 squeezes the shaping film 340, The plastic film 340 is squeezed to produce elastic deformation. It can be understood that the shape contour of the shaping film 340 determines the spatial shape characteristics of the molding space 350 , and the molding base 12 is obtained after the molding material is molded in the molding space 350 .

It is worth mentioning that when the shaping film 340 is adsorbed under the upper mold 310 of the mold 300 , the upper mold 310 cures the molding base 12 through the shaping film 340 . in the forming space 350 . When the molding material is cured in the molding space 350 , the molding material is cured based on the lower surface of the molding film 340 to form the molding base 12 . It can be understood that the molding upper end surface 123 of the molding base 12 is formed at the upper end of the molding space 350 , wherein the molding upper end surface 123 is facing the molding surface at the upper end of the molding space 350 . form the lower surface of the membrane 340 . It is worth mentioning that the surface of the molding film 340 is smooth, and the molding upper end surface 123 of the molding base 12 formed by the molding film 340 is a smooth plane.

When the upper mold 310 of the mold 300 presses the shaping film 340 and deforms, the shaping film 340 is pressed outward by the upper mold 310 to produce plastic elastic deformation, wherein the shaping film 340 The surface of the part protruding and extending outward is rough, and the surface of the molding base 12 formed by the protruding part of the shaping film 340 is a rough surface.

The upper mold 310 of the mold 300 further includes at least one isolation block 311 and at least one pressing block 312, wherein the isolation block 311 and the pressing block 312 are pressed against the photosensitive element 130 and the substrate 11 to form the channel of the molding space 350 . The spacer block 311 has a groove, wherein two ends of the spacer block 311 press the plastic film 340 , and an isolation space 360 is formed between the spacer block 311 and the photosensitive element 130 . The spacer block 311 is located on the inner side of the pressing block 312 , wherein the spacer block 311 is in close contact with the upper surface of the photosensitive element 130 , so as to prevent the molding material from entering the molding space 350 into the Isolate Space 360. In short, after the upper mold 310 and the lower mold 320 are clamped, the isolation block 311 is closely adhered to the top of the photosensitive element 130 to form the light passage of the photosensitive element 130 . The isolation block 311 presses the shaping film 340 to make the shaping film 340 closely adhere to the upper surface of the photosensitive element 130 to isolate the shaping space 350 from the light passage. After the upper mold 310 and the lower mold 320 are closed, the pressing block 312 and the spacer block 311 press the shaping film 340 over the substrate 11 and the photosensitive element 130 , So that the molding space 350 is formed between the molding film 340 and the substrate 11 .

Correspondingly, in the above steps, the shaping film 340 is attached to the lower surface of the upper mold 310, and the gas between the shaping film 340 and the upper mold 310 is extracted by means of air extraction, In order to make the shaping film 340 close to the upper mold 310 , air between the shaping film 340 and the upper mold 310 is avoided, which would affect the flatness of the shaping film 340 .

As shown in FIG. 11C and FIG. 11D , the mold 300 is closed, wherein the upper mold 310 presses the shaping film 340 , so that the shaping film 340 is elastically deformed, wherein the shaping film 340 is The forming space 350 is compressed by elastic deformation. The spacer block 311 of the upper mold 310 presses the shaping film 340 , so that the shaping film 340 is pressed by the spacer block 311 to generate elastic deformation extending outward from the spacer block 311 . It can be understood that the lower end of the spacer block 311 presses the plastic film 340 , wherein the elastic deformation of the plastic film 340 near the bottom end of the spacer block 311 is greater than that of the top end of the spacer block 311 . The elastic deformation produced by the plastic film 340 is described. In other words, the spacer block 311 presses the shaping film 340 on the photosensitive element 130 , so that the shaping film 340 attached to the outside of the spacer block 311 produces elastic deformation that gradually decreases from bottom to top , so that the shaping film 340 presses the shaping space 350 outward from the outer wall of the isolation block 311 . In short, the shaping film 340 is pressed by the spacer block 311 , so that the thickness of the lower end of the shaping film 340 attached to the outside of the spacer block 311 is greater than the thickness of the upper end of the shaping film 340 .

The spacer block 311 of the upper mold 310 presses the shaping film 340 , wherein the shaping film 340 is extruded by the spacer block 311 to form an inner extension 341 , wherein the inner extension 341 is Extrusion is formed on the outer side of the isolation block 311 , wherein the inwardly extending portion 341 extrudes the molding space 350 outward from the outer side of the isolation block 311 . It can be understood that the inwardly extending portion 341 forms the inner side surface 1251 and the inner arc surface 1252 of the molding base 12 . It can be understood that, due to the inner extension 341 formed by extrusion of the shaping film 340 , the outer surface of the lower part of the inner extension 341 is rough, and the inner extension 341 is used to roughen the inner extension 341 . The arc surface 1252 can reduce the surface smoothness of the inner arc surface 1252 .

The pressing block 312 of the upper mold 310 presses the shaping film 340 , so that the shaping film 340 is pressed by the isolation block 311 to generate elasticity extending inward from the pressing block 312 deformation. It can be understood that the lower end of the pressing block 312 presses the plastic film 340 , wherein the elastic deformation of the plastic film 340 near the bottom end of the pressing block 312 is greater than that of the pressing block 312 The elastic deformation produced by the plastic film 340 at the top. In other words, the pressing block 312 presses the shaping film 340 on the substrate 11 , so that the shaping film 340 attached to the inner side of the pressing block 312 produces a gradually decreasing elasticity from bottom to top Deformed, so that the shaping film 340 presses the shaping space 350 outward from the inner wall of the pressing block 312 .

The pressing block 312 of the upper mold 310 presses the plastic film 340 to form an extension portion 342 , wherein the extension portion 342 is formed under the upper mold 310 , and the extension portion 342 is formed On the inner side of the pressing block 312 , the extension portion 342 presses the forming space 350 inward from the inner side of the pressing block 312 . It can be understood that the extension portion 342 forms the outer side surface 1261 and the outer arc surface 1262 of the molding base 12 .

The spacer block 311 of the upper mold 310 squeezes the shaping film 340 , wherein the shaping film 340 is extruded by the spacer block 311 to form an inner extension 341 , and the inner extension 341 is divided into An upper inner extension portion and a lower inner extension portion, the upper inner extension portion correspondingly forms the inner side surface 1251 , and the lower inner extension portion correspondingly forms the inner arc surface 1252 . It is worth mentioning that when the upper mold 210 and the lower mold 320 are closed, the shaping film 340 on the isolation block 311 is pressed, so that the shaping film 340 protrudes outward to form As for the lower inner extension portion, since the lower inner extension portion squeezes the shaping film 340 so that the shaping films 340 are stacked, the shape of the lower inner extension portion is not easily controlled, so the corresponding formed The shape of the inner arc surface 1252 is also not fixed. Secondly, the lower inner extension portion is formed because the plastic film 340 has elasticity, so it will be formed by extrusion, the surface of the lower inner extension portion will be relatively rough, and the upper inner extension portion is formed by the lower inner extension portion. The extension is formed so that the upper inner extension is subjected to a certain force, so that the upper inner extension may form an inclined surface; however, the upper inner extension remains taut during the molding process. Therefore, the surface of the upper inward extension portion is relatively smooth, so the surface of the inner side surface 1251 is smoother than the inner arc surface 1252 after molding.

It is worth mentioning that the isolation block 311 and the pressing block 312 of the upper mold 310 press the plastic film 340 to produce deformation, wherein the elastic deformation of the plastic film 340 determines the size of the elastic deformation. The draft angle of the molding base 12 is described. Therefore, the shape and shape of the inner extension 341 and the outer extension 342 can be controlled by the thickness of the shaping film 340, the elastic coefficient, and the pressure of the upper mold 311 and the shaping film 340 after clamping. size, thereby determining the draft angle of the molding base 12 .

When the thickness of the shaping film 340 of the present invention is H, the thickness of the inner extension 341 and the outer extension 342 produced by the upper die 310 extruding the shaping film 340 is 1.2H-1.5H . In other words, the transverse vertical distance between the inner arc surface 341 of the molding base 12 and the light window opening of the molding base 12 is 0.2H˜0.5H. Exemplarily, when the thickness of the shaping film 340 is 100 μm, the distance between the base upper end surface 123 and the base lower end surface 124 of the molded base 12 is based on the optical axis direction. The vertical distance is 20μm ~ 50μm.

As shown in FIGS. 11D and 11E , a molding material is added to the molding space, so that the molding material is molded in the molding space 350 based on the outer wall of the molding film 340 . Since the shaping film 340 is pressed by the spacer block 311 of the upper mold 310 and closely adhered to the upper surface of the photosensitive element 130 , when the molding material is formed in the molding space 350 , the The shaping film 340 is pressed by the spacer block 311 to prevent the molding material from entering the photosensitive channel of the photosensitive element 130 from the molding space 350 .

As shown in FIGS. 11F and 11G , the molding material is cured and formed in the molding space 350 to obtain the molding base 12 . When the mold base 12 is demolded from the mold 300, the upper mold 310 and/or the lower mold 320 of the mold 300 are pulled so that the upper mold 310 and the lower mold 320 are pulled. phase separation. During the separation process of the upper mold 310 from the lower mold 320, the pressure between the upper mold 310 and the shaping film 340 is eliminated, and the shaping film 340 returns to the original state under the action of elasticity, so that the The shaping film 340 and the upper mold 310 are separated from the molding base 12 .

Referring to FIGS. 12A to 12F of the accompanying drawings of the present invention, another manufacturing process of the molded base 12 of the circuit board assembly 10 according to the above-mentioned preferred embodiment of the present invention will be described in the following description. is elucidated. As shown in FIG. 12A , first, in a substrate imposition composed of a plurality of substrates 11 , the photosensitive element 130 is connected to the substrate 11 through the leads 13 , and the electronic device 15 of the circuit board assembly 10 is arranged on the substrate 11 . The substrate 11 is composed of a plurality of semi-finished circuit boards to form a circuit board imposition.

As shown in FIG. 12B, the substrate imposition is placed in a mold 300, wherein the mold includes an upper mold 310 and a lower mold 320, wherein a processing space 330 is formed between the upper mold 310 and the lower mold 320 , wherein the substrate imposition is placed in the processing space 330 . The mold 300 further includes a shaping film 340 , wherein the shaping film 340 has elasticity and toughness, and the shaping film 340 is attached to the upper mold 310 of the mold 300 . The air between the upper mold 310 and the shaping film 340 is extracted by means of air extraction, so that the shaping film 340 is closely attached to the upper mold 310 . The upper mold 310 further includes a plurality of spacer blocks 311 and a plurality of pressing blocks 312 , wherein each of the spacer blocks 311 corresponds to the upper surface of the photosensitive element 130 , wherein each of the pressing blocks 312 is in close contact with each other correspondingly. on the substrate 11 . During the molding process, the adjacent spacer blocks 311 and the pressing blocks 312 are spaced to form at least one molding space 350, wherein the molding material is solidified and formed in the molding space 350, thereby forming two adjacent the molded base 12 of the circuit board assembly 20 . The spacer block 311 is further provided with a groove, wherein two ends of the spacer block 311 press the plastic film 340 , so that an isolation space 360 is formed between the spacer block 311 and the photosensitive element 130 , wherein The isolation space 360 corresponds to the photosensitive channel of the photosensitive element 130 . The isolation block 311 corresponds to the top of the photosensitive element 130 , and the molding film 340 is pressed by the pressing block 312 to prevent the molding material in the molding space 350 from entering the isolation space 360.

As shown in FIG. 12C , when the substrate imposition is placed in the processing space 330 , the upper mold 310 and the lower mold 320 of the mold 300 are closed, and the upper mold 310 is in close contact with the Above the substrate 11 and the photosensitive element 130 . Each of the upper molds 310 presses the photosensitive element 130 and the substrate 11 through the shaping film 340 , wherein the shaping film 340 is pressed by the upper mold 310 to produce elastic deformation. The spacer block 311 of the upper mold 310 presses the shaping film 340 , so that the shaping film 340 is pressed by the spacer block 311 to generate elastic deformation extending outward from the spacer block 311 . It can be understood that the lower end of the spacer block 311 presses the plastic film 340 , wherein the elastic deformation of the plastic film 340 near the bottom end of the spacer block 311 is greater than that of the top end of the spacer block 311 . The elastic deformation produced by the plastic film 340 is described. In other words, the spacer block 311 presses the shaping film 340 against the photosensitive element 130 , so that the shaping film 340 attached to the outside of the spacer block 311 produces elastic deformation that gradually decreases from bottom to top , so that the shaping film 340 presses the shaping space 350 outward from the outer wall of the isolation block 311 . In short, the shaping film 340 is pressed by the spacer block 311 , so that the thickness of the lower end of the shaping film 340 attached to the outside of the spacer block 311 is greater than the thickness of the upper end of the shaping film 340 .

As shown in FIGS. 12D to 12E , a molding material is injected into the molding space 350 , wherein the molding material is cured in the molding space 350 to form the molding base 12 . After the molding base 12 is cured, the circuit board assembly 10 is taken out from the mold 300 by demolding. It is worth mentioning that, during the demolding process, the upper mold 311 is decompressed from the shaping film 340, so that the shaping membrane 340 returns to the original state under the action of elasticity after decompression, so that the The upper mold 311 and the shaping film 340 are separated from the molding base 12 after molding.

As shown in FIG. 12F , after demolding, a circuit board assembly that is interconnected by circuit board assemblies is obtained, and the circuit board assembly imposition is cut by cutting to obtain each of the circuit board assemblies 10 . It is worth mentioning that, after demolding, the molding bases 12 of the adjacent circuit board assemblies 10 are connected to each other. It can be understood that the molding base 12 is cut in an inclined manner from top to bottom, so that the size of the upper end portion 121 of the molding base 12 is larger than that of the lower end portion of the base 122 size.

Referring to FIGS. 13A to 14 of the accompanying drawings of the present specification, modified embodiments according to the above-described preferred embodiments of the present invention are explained in the following description. The photosensitive element 130 and the electronic device 15 are attached to the substrate 11 of the circuit board assembly 10 , wherein the photosensitive element 130 is attached to the substrate in a manner close to one side of the substrate 11 . 11, so that the edge region 114 of the substrate 11 has at least one narrow side 115 and at least one load side 116, wherein the width of the narrow side 115 is smaller than the width of the load side 116.

As shown in FIGS. 13A and 13B , the electronic device 15 is disposed in the edge region 114 close to the load side 116 , wherein the edge of the photosensitive element 130 is close to the narrow side 115 of the substrate 11 , In order to reduce the length of the substrate 11 of the circuit board assembly 10 in at least one direction. The substrate 11 attached with the photosensitive element 130 is placed on the mold 300 , wherein the isolation block 311 and the pressing block 312 of the upper mold 310 are pressed against the photosensitive element 130 and the pressing block 312 respectively. The substrate 11 is described. After the mold 300 is closed, the width of the channel of the molding space 350 corresponding to the narrow side 115 is smaller than the width of the channel of the molding space 350 corresponding to the load side 116 , so that the molding is formed. The bottom surface of at least one side of the resulting molded base 12 is narrow.

As shown in FIG. 14 , during the molding process, the draft angle of the molding base 12 corresponding to the narrow side 115 of the substrate 11 is greater than 90°, so that the molding is formed on the narrow side. The width of the base lower end portion 122 of the molding base 12 above 115 is smaller than the width of the base upper end portion 121 . In short, the molding base 12 formed above the narrow side 115 of the substrate 11 by molding is a structure with a large top and a small bottom. Preferably, both the inner draft angle and the outer draft angle of the molding base 12 corresponding to the upper side of the narrow side 115 are greater than 90°, so that the corresponding upper side of the narrow side 115 of the substrate 11 is larger than 90°. The size of the base upper end surface 123 of the molding base 12 is sufficient to support and be attached by the driving device 50 .

Those skilled in the art can understand that the camera module 100 is mounted on the electronic device body 200 of the electronic device, and the side of the narrow side 115 of the circuit board assembly 10 faces the electronic device The top of the device body 200 , so that the lens 20 of the camera module 100 is upwardly close to the top of the electronic device body 200 .

It can be understood that the draft angle of the molding base 12 is greater than 90°, so as to reduce the size of the base lower end 122 of the molding base 12 and the base plate 11 , thereby reducing the size of the base 11 . The width dimension of the circuit board assembly 10 is indicated. Based on the size reduction of the circuit board assembly 10, the overall lateral size of the camera module 100 can be reduced to reduce the ratio of the camera module 100 to the electronic device body 200, thereby increasing the size of the electronic device The screen ratio of the device body 200 .

Referring to FIG. 15 of the accompanying drawings of the present specification, a modified embodiment of the circuit board assembly 10 of the camera module 100 according to the above preferred embodiment of the present invention is explained in the following description. The circuit board assembly 10 includes at least one substrate 11 , at least one molding base 12 , at least one set of leads 13 , and at least one electronic device 15 , wherein the leads 13 communicate with the photosensitive element 130 and the substrate 11 , The electronic device 15 is attached above the substrate 11 .

It is worth mentioning that the structures and functions of the substrate 11 , the leads 13 , and the electronic device 15 are the same as those of the first preferred embodiment, and the difference is that the molding base 12 is embedded In the edge region 114 of the substrate 11 , the photosensitive element 130 and the leads 13 are located inside the molding base 12 . The lower end portion 122 of the molding base 12 covers the edge area 114 of the substrate 11 , and the lead 13 connects the photosensitive element 130 to the bonding area 113 of the substrate 11 . . In other words, the lower end portion 122 of the molding base 12 is located outside the photosensitive element 130 .

Similar to the above-mentioned first preferred embodiment, the draft angle of the molding base 12 is greater than 90°, so that the structural dimension of the base upper end 121 of the molding base 12 is larger than the The structural dimension of the lower end portion 122 of the base. The inner draft angle or the outer draft angle of at least one side of the molding base 12 is greater than 90°. Preferably, the inner draft angle and the outer draft angle of the molding base 12 are both greater than 90°, so as to reduce the size of the base lower end 122 of the molding base 12, so that the The size of the substrate 11 is reduced. The inner draft angle and the outer draft angle of the molding base 12 are both greater than 90°, and the size of the base upper end 121 of the molding base 12 is increased, so that the molding base The area of the upper end surface 123 of the base of 12 is increased, which is convenient for attaching the driving device 50 or the mirror base 70 .

Referring to FIG. 16 of the accompanying drawings of the present invention, another modified embodiment of the circuit board assembly 10 of the camera module 100 according to the above preferred embodiment of the present invention will be explained in the following description. The photosensitive element 130 is attached under the substrate 11 of the circuit board assembly 10 , wherein the substrate 11 is further provided with a through hole 117 , wherein the photosensitive element 130 is attached to the substrate 117 based on the through hole 117 . below the substrate 11 . The molding base 12 of the circuit board assembly 10 is integrally formed above the substrate 11 , wherein the draft angle of at least one side of the molding base 12 is greater than 90°, so that the molding base 12 has a draft angle greater than 90°. The size of the structure size of the upper end portion 121 of the base of 12 is larger than the size of the structure size of the lower end portion 122 of the base.

Different from the above-mentioned first preferred embodiment, in the molding process, the substrate 11 is placed in the mold 300 , wherein the upper mold 310 of the mold 300 presses the shaping film 340 on the mold 300 . the substrate 11 , so that the shaping film 340 is in close contact with the substrate 11 .

Referring to FIG. 17 of the accompanying drawings of the present invention, another modified embodiment of the circuit board assembly 10 of the camera module 100 according to the above preferred embodiment of the present invention will be explained in the following description. The camera module 100 is a dual-camera, triple-camera, or multi-camera camera module, wherein the circuit board assembly 10 of the camera module 100 includes at least one substrate 11 , at least two molding bases 12 , at least one A set of leads 13 and a plurality of electronic devices 15, wherein the molding base 12 is integrally formed above the substrate 11 in a molding manner. The photosensitive element 130 is disposed above the substrate 11 , and the molding base 12 is embedded above a part of the non-photosensitive area of the photosensitive element 130 and above the edge region 114 of the substrate 11 .

The draft angle of at least one side of at least one of the molding bases 12 of the circuit board assembly 10 is greater than 90°, so that the structural size of the lower end portion 122 of the molding base 12 is smaller than that of the molding base 12 . The structural dimensions of the upper end portion 121 of the base. Preferably, the inner draft angle and the outer draft angle of the molding base 12 are both greater than 90°, and the molding base 12 of the circuit board assembly 10 is formed into a structure with a large top and a small bottom, so that the The width dimension of the molding base 12 of the circuit board assembly 10 is reduced, thereby reducing the size of the substrate 11 of the circuit board assembly 10 . After the molding base 12 of the circuit board assembly 10 is formed, the upper part is large and the lower part is small, and the size of the upper end 121 of the base 12 of the molding base 12 is increased, so as to be a follow-up AA process. Or HA process provides enough processing space.

Referring to FIGS. 18 to 19B of the accompanying drawings of the present invention, another alternative embodiment of a camera module 100a according to the second preferred embodiment of the present invention is explained in the following description. The camera module 100a can be, but is not limited to, a single projection module in the preferred embodiment of the present invention. Therefore, the camera module 100a can also be implemented as an array module composed of other camera units, such as TOF camera module.

The camera module 100a includes a circuit board assembly 10a, at least one optical element 20a, and a projection unit 30a, wherein the projection unit 30a is disposed on the circuit board assembly 10a, and the projection unit 30a is connected to the The circuit board assembly 10a, wherein the circuit board assembly 10a provides the power required by the projection unit 30a. The optical element 20a is held above the projection unit 30a by the circuit board assembly 10a to project the light generated by the projection element 30a outwardly.

It is worth mentioning that the projection unit 30a of the camera module 100a is implemented as a light source, which may be, but is not limited to, an LED light source, wherein the light generated by the projection unit 30a diffuses outward through the optical element 20a and emission.

As shown in FIG. 18, the circuit board assembly 10a includes a substrate 11a and a molding base 12a, wherein the molding base 12a wraps the substrate 11a, and the projection unit 30a is disposed on the circuit board The base plate 11a of the assembly 10a provides power to the projection unit 30a through the base plate 11a. The substrate 11a further includes a substrate main body 111a and at least one conductive member 112a disposed on the substrate main body 111a, wherein the conductive member 112a is electrically connected to the projection unit 30a. The circuit board assembly 10a further includes at least one lead 13a, wherein the lead 13a electrically connects the conductive member 112a to the projection unit 30a.

The molding base 12a is integrally formed on the substrate 11a of the circuit board assembly 10a by a molding process, wherein the molding base 12a includes a base upper end 121a and a base lower end 122a , and a base bottom 123a, wherein the base upper end 121a and the base lower end 122a integrally extend upward from the base bottom 123a. It is worth mentioning that, in this preferred embodiment of the present invention, different from the above-mentioned preferred embodiments, the molding base 12a is integrally wrapped with the substrate 11a through a molding process, so as to reduce the the thickness of the circuit board assembly 10a. Preferably, the base bottom plate 123a wraps the base plate 11a, and the thickness of the base bottom plate 123a is the same as the thickness of the base plate 11a.

The mold base 12a further has a support portion 124a, wherein the support portion 124a is formed on the base upper end portion 121a of the mold base 12a, and the support portion 124a supports the optical element 20a. Preferably, in this preferred embodiment of the present invention, the support portion 124a is a groove formed in the base upper end portion 121a of the molding base 12a, wherein the optical element 20a is disposed on the base Support portion 124a.

The molding base 12a is further provided with a base inner wall 125a and a base outer wall 126a, wherein the base inner wall 125a is formed on the inner side of the molding base 12a, and the base outer wall 126a is formed on the The outside of the base 12a is molded. Preferably, the base inner wall 125a extends inwardly and upwardly from the base lower end 122a of the molding base 12a to the base upper end 121a. More preferably, the base outer wall 126a extends outwardly and upwardly from the base lower end 122a of the molded base 12a to the base upper end 121a. In other words, the size of the base lower end portion 122a of the molding base 12a is smaller than the size of the base upper end portion 121a.

As shown in FIG. 18 , the base inner wall 125a has an inner side surface 1251a and an inner arc surface 1252a, wherein the inner side surface 1251a extends from the inner side of the molding upper end surface 123a of the molding base 12a It extends downwardly and obliquely outwards to the inner arc surface 1252a. The inner arc surface 1252a extends upwardly and obliquely outward from the molding lower end surface 124a of the molding base 12a to the inner side surface 1251a. Each of the base outer walls 126a of the molding base 12a has an outer side surface 1261a and an outer arc surface 1262a, wherein the outer side surface 1261a extends from the upper molding end surface 123a of the molding base 12a. The outer edge extends downwardly and obliquely inwardly to the outer arcuate surface 1262a. The outer arc surface 1262a extends upwardly and obliquely inward from the lower molding end surface 124a of the molding base 12a to the outer side surface 1261a.

As shown in FIGS. 19A to 19B , a method of manufacturing the molding base 12 a is shown, wherein the molding base 12 a is integrally formed with the substrate 11 a through a molding process. The draft angle of at least one side of the molding base 12a is greater than 90°, so that the molding base 12 can form a structural feature of the upper size, so that when the optical element 20a is placed on the supporting portion 124a, The contact surface between the support portion 124a and the optical element 20a is large enough to ensure the installation reliability of the molding base 12a and the optical element 20a.

As shown in FIG. 19A , a substrate is first processed to form an imposition, wherein the substrate may be but not limited to a metal substrate, such as a copper substrate. The imposition is processed by etching to form the conductive member on the substrate 11a. As shown in FIG. 19B, the imposition is placed in a mold 300a, wherein the mold 300a includes an upper mold 310a, a lower mold 320a, and a shaping film 340a, wherein the shaping film 340a is attached to the A processing space 330a is formed between the upper mold 310a, the upper mold 310a and the lower mold 320a. The upper module 310 includes a spacer block 311a and a pressing block 312a, wherein the spacer block 311a presses the shaping film 340a on the substrate 11a, so that the shaping film 340a is closely attached to the substrate 11a. substrate 11a. The pressing block 312a presses the shaping film 340a on the lower mold 320a, so that the shaping film 340 is closely attached to the lower mold 320a. After the upper mold 310a and the lower mold 320a are closed, the upper mold 310a squeezes the shaping film onto the lower mold 320a, wherein the shaping film 340a and the lower mold 320a are between A molding space 350a corresponding to the molding base 12a is formed. A molding material is injected into the molding space 350, and is cured and molded in the molding space 350a to form the molding base 12a.

The molding material is then cured in the mold 300a to form the molding base 12a on the substrate 11a. After the molding base 12a is cured and formed, it is demolded to obtain the circuit board assembly 10a. It is worth mentioning that, the projection unit 30a may be disposed on the upper surface of the substrate 11a after the molding is completed, or disposed on the substrate 11a before the molding process. In other words, the installation sequence of the projection units 30a is not limited herein.

Similar to the above-mentioned first preferred embodiment, the draft angle of at least one side of the molding base 12a is greater than 90°, so that the size of the base lower end 122a of the molding base 12a is It is smaller than the size of the upper end portion 121a of the base. Preferably, the inner molding film angle and the outer draft angle of the molding base 12a are both greater than 90°, so as to reduce the size of the base lower end 122a of the molding base 12a, so that the The overall size of the mold base 12a becomes small. It can be understood that, the overall size of the molding base 12a is reduced, so that the lateral size of the camera module 100a can be reduced. In the case where the size of the base lower end portion 122a of the molding base 12a is reduced, the size of the base upper end portion 121a of the molding base 12a is increased to increase the size of the base The size of the support portion 124a of the upper end portion 121a increases the contact area between the support portion 124a and the optical element 30a.

It can be understood that, during the molding process of the molding base 12a, the upper mold 310a of the mold 300a presses the molding film 340a on the substrate 11a, so that the molding The membrane 340a is squeezed and elastically deformed. It can be understood that when the inner side of the upper mold 310a presses the shaping film 340a, and the elastic deformation is generated from the inside to the outside, the internal draft angle of the mold base 12a is greater than 90°, so as to form the plastic film 340a. The base inner wall 125a of the molded base 12a. When the outer side of the upper mold 310a presses the shaping film 340a, and elastic deformation occurs from the inside to the inside, the outer draft angle of the molding base 12a is greater than 90°, so as to form the molding The base outer wall 126a of the base 12a.

It should be understood by those skilled in the art that the embodiments of the present invention shown in the above description and the accompanying drawings are only examples and do not limit the present invention. The objects of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been shown and described in the embodiments, and the embodiments of the present invention may be modified or modified in any way without departing from the principles.

Claims (30)

1. A circuit board assembly, characterized in that, comprising: a substrate; and at least one molded base, wherein the molded base includes a base inner wall, a base outer wall and further has a molded upper end surface and a molded lower end surface, wherein the base inner wall forms the molded A light window of a base, wherein the inner wall of the base further has an inner side surface and an inner arc surface, the inner arc surface extends from the inner side surface, and the inner arc surface faces the molding base. 2. The circuit board assembly of claim 1, wherein the molded base is integrally formed with the substrate by a molding process, wherein the molded base is made by: placing the substrate and the photosensitive element in a processing space of a mold, wherein the mold includes an upper mold, a lower mold and a shaping film; Clamping the upper mold and the lower mold to form a molding space between the plastic film and the substrate, wherein a spacer of the upper mold squeezes the plastic film to generate an inner extension, extruding the forming space outward from the isolation block by the inward extension; adding a molding material into the molding space, and curing and forming in the molding space, wherein the inner wall of the base of the molding base is formed on the outer side of the inner extension; and demolding to mold the mold base on the substrate. 3 . The circuit board assembly according to claim 2 , wherein the included angle between the inner side surface of the inner wall of the base and the base plate is less than or equal to 90°, so as to release the inner draft of the molding base from the mold. 4 . The angle is greater than or equal to 90°. 4. The circuit board assembly of claim 1, wherein the roughness of the inner arc surface is greater than the roughness of the inner side surface. 5. The circuit board assembly of claim 1, wherein the base outer wall of the molded base has an outer side and an outer arc surface, wherein the outer side faces downward and slopes from the molded upper end It extends inward to the outer arc surface, and the outer arc surface extends from the molding lower end surface of the molding base to the outer side surface. 6. The circuit board assembly of claim 5, wherein the molded base is integrally formed with the substrate by a molding process, wherein the molded base is made by: placing the substrate and the photosensitive element in a processing space of a mold, wherein the mold includes an upper mold, a lower mold and a shaping film; Clamp the upper mold and the lower mold to form a molding space between the plastic film and the substrate, wherein a pressing block of the upper mold presses the plastic film to generate an epitaxial portion, pressing the forming space inward from the pressing block by the extension part; adding a molding material to the molding space, and curing and forming in the molding space, wherein the outer wall of the base of the molding base is formed on the inner side of the extension; and demolding to mold the mold base on the substrate. 7 . The circuit board assembly according to claim 6 , wherein the included angle between the outer side surface of the outer wall of the base and the base plate is less than or equal to 90°, so as to release the outer draft of the molding base from the mold. 8 . The angle is greater than or equal to 90°. 8. The circuit board assembly of any one of claims 1 to 7, wherein the circuit board assembly further comprises a photosensitive element, wherein the photosensitive element is electrically connected to the substrate, the photosensitive element being molded by the molding The base is integrally fixed to the base plate. 9. The circuit board assembly of any one of claims 1 to 7, wherein the circuit board assembly further comprises a photosensitive element electrically connected to the substrate, wherein the molded base is integrally arranged on the outside of the photosensitive element. 10. The circuit board assembly of claim 8, wherein the photosensitive element comprises a photosensitive portion and at least one non-photosensitive portion, wherein the non-photosensitive portion is located outside the photosensitive portion, wherein the non-photosensitive portion is It is electrically connected to the substrate, wherein the molding base covers the top of the non-photosensitive part of the photosensitive element, and the photosensitive element is fixed on the substrate by the molding base. 11. The circuit board assembly of claim 10, wherein the substrate further has a substrate upper surface and a substrate lower surface corresponding to the substrate upper surface, wherein the photosensitive element is attached to the substrate surface, wherein the molding base is integrally formed on the upper surface of the substrate. 12. The circuit board assembly of claim 11, wherein the circuit board assembly further comprises a set of leads, wherein the leads electrically connect the non-photosensitive portion of the photosensitive element to the substrate, the leads are connected by the A molding base is embedded above the substrate. 13. The circuit board assembly of claim 11, wherein the circuit board assembly further comprises at least one electronic device, wherein the electronic device is disposed in the edge region of the substrate, wherein the molded base The electronic device is embedded in the substrate. 14. The circuit board assembly according to claim 10, wherein the substrate is further provided with a bonding region and an edge region, wherein the photosensitive element is attached to the bonding region, and the edge region is located in the bonding region The periphery of the bonding area, wherein the photosensitive element is bonded to the substrate in a manner close to one side of the substrate, so that the edge area of the substrate forms at least one narrow side and at least one loading side, wherein the The width of the narrow side is smaller than the width of the load side. 15. The circuit board assembly of claim 14, wherein the circuit board assembly further comprises at least one electronic device, wherein the electronic device is disposed on the load side of the substrate, wherein the molded base The electronic device is embedded in the substrate. 16. A camera module, characterized in that, comprising: The circuit board assembly of any one of claims 1 to 15; a lens, wherein the lens is held over the photosensitive element along a photosensitive path of the photosensitive element; and At least one filter element, wherein the filter element is held between the lens and the photosensitive element. 17. The camera module according to claim 16, wherein the camera module further comprises a driving device, wherein the driving device is disposed above the molding base, and the lens is mounted on the A driving device, the lens is driven to move by the driving device. 18. The camera module of claim 17, wherein the filter element is disposed above the molding base of the circuit board assembly, and the filter base is supported by the molding base element. 19. The camera module of claim 18, wherein the camera module further comprises a lens mount, wherein the lens mount is disposed between the driving device and the molding base, wherein the The filter element is disposed on the lens holder, and the filter element is supported by the lens holder. 20. An electronic device, characterized in that, comprising: an electronic device body; and The camera module according to at least one of claims 16 to 19, wherein the camera module is mounted on the upper end of the electronic device body. 21. A manufacturing method of a circuit board assembly, wherein the manufacturing method comprises the following steps: (a) placing a substrate and at least one photosensitive element in a processing space of a mold, wherein the mold includes an upper mold, a lower mold, and a shaping film, wherein the processing space is formed in the upper mold and all the following molds; (b) clamping the upper mold and the lower mold, forming a molding space between the molding film and the base plate, and pressing the molding film to deform, and pressing the molding film through the molding film pressing the forming space; (c) adding molding material to the molding space, and curing the molding material to the molding space; and (d) demolding the upper mold and the lower mold to mold a molding base on the substrate. 22. The manufacturing method according to claim 21, wherein in the step (a) of the method, the photosensitive element is attached to the upper surface of the substrate, and a set of lead wires are provided, by the The lead wire is electrically connected to the photosensitive element and the substrate. 23. The manufacturing method according to claim 21, further comprising a step before the step (b) of the method: extracting the air between the shaping film and the upper mold by means of air suction , to attach the shaping film to the lower surface of the upper mold. 24. The manufacturing method according to claim 21, wherein in the step (b) of the manufacturing method, a spacer of the upper mold presses the shaping film against the photosensitive element, wherein The shaping film is extruded to form an inner extension, wherein the inner extension extrudes the molding space outward from the spacer block, so that the inner draft angle of the molding base is greater than or equal to 90°. 25. The manufacturing method according to claim 24, wherein in the step (c) of the manufacturing method, the molding material is molded on the outer side of the inwardly extending portion, and is cured and molded into the mold A base inner wall of the plastic base. 26. The manufacturing method according to claim 25, wherein in the step (c) of the manufacturing method, a molding material fills the molding space, wherein the base inner wall of the molding base is The inner surface and the inner arc surface of the inner wall of the base are formed by the inner extension part. 27. The manufacturing method according to claim 21, wherein in the step (b) of the manufacturing method, a pressing block of the upper mold presses the shaping film on the substrate, wherein The shaping film is extruded to form an extension portion, wherein the extension portion extrudes the molding space inward from the isolation block, so that the outer draft angle of the molding base is greater than or equal to 90° . 28. The manufacturing method according to claim 27, wherein in the step (c) of the manufacturing method, the molding material is molded on the inner side of the extension portion, and is cured and molded into the molding A base outer wall of the base. 29. The manufacturing method according to claim 28, wherein in the step (c) of the manufacturing method, a molding material fills the molding space, wherein the base outer wall of the molding base is It is formed on the inner side of the extension part, and the outer side surface and the outer arc surface of the outer wall of the base are formed by the extension part. 30. The manufacturing method according to claim 21, wherein step (d) of the method further comprises: pulling the upper mold of the mold to relieve the pressure of the upper mold on the shaping film, Wherein the shaping film is restored to the original state under the action of elasticity.

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