CN112066275A - LED light source module and lighting device - Google Patents

LED light source module and lighting device Download PDF

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Publication number
CN112066275A
CN112066275A CN201910494766.2A CN201910494766A CN112066275A CN 112066275 A CN112066275 A CN 112066275A CN 201910494766 A CN201910494766 A CN 201910494766A CN 112066275 A CN112066275 A CN 112066275A
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CN
China
Prior art keywords
chip
polarity
conductive layer
led chip
led
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Application number
CN201910494766.2A
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Chinese (zh)
Inventor
李树琪
王保兴
郭豪杰
陈宝瑨
蔡勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Tianju Optoelectronics Technology Co ltd
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Ningbo Tianju Optoelectronics Technology Co ltd
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Application filed by Ningbo Tianju Optoelectronics Technology Co ltd filed Critical Ningbo Tianju Optoelectronics Technology Co ltd
Priority to CN201910494766.2A priority Critical patent/CN112066275A/en
Publication of CN112066275A publication Critical patent/CN112066275A/en
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
    • F21V13/02—Combinations of only two kinds of elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
    • F21V9/32—Elements containing photoluminescent material distinct from or spaced from the light source characterised by the arrangement of the photoluminescent material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)

Abstract

The invention provides an LED light source module and a lighting device, wherein the LED light source module comprises: a substrate including a base portion and a chip mounting portion extending from one end of the base portion; the LED chip comprises a first LED chip attached to a first mounting surface of a chip mounting part and a second LED chip attached to a second mounting surface of the chip mounting part, wherein the first LED chip and the second LED chip correspond to the chip mounting part in size; the fluorescent layer wraps the first LED chip and the second LED chip, the fluorescent layer is arranged around the chip mounting portion in the extending direction of the chip mounting portion, the reflecting unit is provided with a reflecting cavity matched with the fluorescent layer, and the reflecting unit is provided with a light outlet at one side far away from the base portion and used for converging light transmitted by the fluorescent layer to the light outlet for emitting. Through the arrangement, the LED light source module can obtain the light field with a small beam angle without additionally arranging a secondary lens, has a simple structure and is convenient to produce and apply.

Description

LED light source module and lighting device
Technical Field
The invention belongs to the technical field of manufacturing of light-emitting semiconductors, and particularly relates to an LED light source module and a lighting device with the same.
Background
As a new illumination light source, LED has a development trend of a new generation of light source due to its advantages of long life, high luminous efficiency, multiple light colors, and one-time light distribution directional irradiation function, and can operate under a safe voltage. But in some luminaire applications, for example: flashlights, automobile headlamps, mine lamps, projection lamps, stage lamps, and the like often require LED light sources with small light emitting areas and small beam angles to facilitate optical light distribution design of the lamps.
In the prior art, a light field of a conventional LED light source of this kind is lambertian, and a plurality of LED chips arranged in a surrounding manner are disposed on one side of a substrate, so that light rays illuminate a range of 120 degrees along a light-emitting surface defined by the substrate, and a secondary lens needs to be further added to obtain a light field with a small beam angle, which is complicated in structure.
Disclosure of Invention
In view of the above, the present invention provides an LED light source module and an illumination device for obtaining a light field with a small beam angle.
In order to achieve the above object, an embodiment of the present invention provides the following technical solutions:
an LED light source module, comprising:
a substrate including a base portion and a chip mounting portion extending from one end of the base portion, the chip mounting portion having a first mounting surface and a second mounting surface that are opposite to each other;
the LED chip comprises a first LED chip attached to a first mounting surface of the chip mounting part and a second LED chip attached to a second mounting surface of the chip mounting part, wherein the first LED chip and the second LED chip correspond to the chip mounting part in size;
a fluorescent layer that covers the first LED chip and the second LED chip, the fluorescent layer being disposed around the chip mounting portion in a direction in which the chip mounting portion extends,
the reflecting unit is provided with a reflecting cavity which is matched with and used for accommodating the fluorescent layer, a light outlet is formed in one side, far away from the base, of the reflecting unit, and the reflecting unit is used for converging at least part of light transmitted by the fluorescent layer to the light outlet for emitting.
In one embodiment, any cross section of the fluorescent layer perpendicular to the extending direction of the chip mounting part is circular, square or polygonal; and/or in the extending direction of the chip mounting part, the cross-sectional area of the fluorescent layer, which is vertical to the extending direction of the chip mounting part, has the tendency of monotonously increasing and then monotonously decreasing.
In one embodiment, the fluorescent layer covers an end side of the chip mounting portion away from the base portion; and/or the fluorescent layer is reflection-symmetrical with respect to the chip mounting portion; and/or the curvatures at any point on the fluorescent layer are the same.
In one embodiment, the reflection unit is fixed to the substrate at an end away from the light exit.
In one embodiment, the size of the base portion is larger than the size of the chip mounting portion.
In one embodiment, at least a portion of the base portion is gradually widened in a direction away from the chip mounting portion.
In one embodiment, the base includes first and second mounting surfaces facing away from each other; wherein,
a first conductive layer is arranged on the first mounting surface of the base, the first conductive layer comprises a first polarity path and a second polarity path, and the first LED chip is connected to the first polarity path and the second polarity path of the first conductive layer through leads respectively; and/or the presence of a gas in the gas,
and a second conductive layer is arranged on the second mounting surface of the base, the second conductive layer comprises a first polarity path and a second polarity path, and the second LED chip is connected to the first polarity path and the second polarity path of the second conductive layer through leads respectively.
In one embodiment, the first LED chip includes a first polarity wire and a second polarity wire, one end of the first polarity wire of the first LED chip is connected to a first chip pad for external lead, one end of the second polarity wire of the first LED chip is connected to a second chip pad for external lead, the width of the first polarity wire of the first LED chip in the extending direction away from the first chip pad is gradually reduced, and the width of the second polarity wire of the first chip in the extending direction away from the second chip pad is gradually reduced; and/or the presence of a gas in the gas,
the second LED chip comprises a first polarity wiring and a second polarity wiring, one end of the first polarity wiring of the second LED chip is connected with a third chip bonding pad used for an external lead, one end of the second polarity wiring of the second LED chip is connected with a fourth chip bonding pad used for the external lead, the first polarity wiring of the second LED chip is far away from the width of the third chip bonding pad in the extending direction, and the second polarity wiring of the second chip is far away from the width of the fourth chip bonding pad in the extending direction.
In one embodiment, the base includes first and second mounting surfaces facing away from each other; wherein,
a first conductive layer is arranged on the first mounting surface of the base, the first conductive layer includes a second polarity path, the first LED chip includes a first polarity wiring and a second polarity wiring on two opposite back surfaces thereof, the second polarity wiring of the first LED chip is connected to the second polarity path of the first conductive layer by a wire, the LED light source module further includes a first back conductive layer covering the first surface of the chip mounting portion and the first surface of the base, the first back conductive layer includes a first polarity path, the first back conductive layer is located below the first conductive layer in a direction perpendicular to the substrate, the first polarity wiring of the first LED chip is connected to the first polarity path of the first back conductive layer; and/or the presence of a gas in the gas,
the second mounting surface of the base portion is provided with a second conductive layer, the second conductive layer includes a second polarity path, the second LED chip includes a first polarity wiring and a second polarity wiring on two opposite surfaces thereof, the second polarity wiring of the second LED chip is connected to the second polarity path of the second conductive layer by a wire, the LED light source module further includes a second back conductive layer covering the second surface of the chip mounting portion and the second surface of the base portion, the second back conductive layer includes a first polarity path, the second back conductive layer is located below the second conductive layer in a direction perpendicular to the substrate, and the first polarity wiring of the second LED chip is connected to the first polarity path of the second back conductive layer.
In one embodiment, the first back conductive layer has exposed first external connection pads on a side facing away from the first mounting surface of the base, and the second polarity path of the first conductive layer has exposed second external connection pads on a side facing away from the first mounting surface of the base; and/or
The second back conductive layer has an exposed third external connection pad on a side facing away from the second mounting surface of the base, and the second polarity via of the second conductive layer has an exposed fourth external connection pad on a side facing away from the second mounting surface of the base.
In one embodiment, the second polarity path of the first conductive layer has an exposed second external pad on the side facing away from the first mounting surface of the base, the first conductive layer also has an exposed first external pad on the side facing away from the first mounting surface of the base, and the first polarity path of the first back conductive layer and the first external pad are electrically interconnected through a through hole; and/or the presence of a gas in the gas,
the second polarity path of the second conductive layer is provided with an exposed fourth external bonding pad on the side back to the second base mounting surface, the second conductive layer is also provided with an exposed third external bonding pad on the side back to the second base mounting surface, and the first polarity path of the second back conductive layer is electrically interconnected with the third external bonding pad through a through hole.
In one embodiment, the substrate includes a heat conduction portion connected to an end of the base portion away from the chip mounting portion, the LED light source module further includes a heat dissipation unit, the heat conduction portion is inserted into an assembly groove of the heat dissipation unit, and the heat conduction portion is in heat conduction connection with an inner wall of the assembly groove.
In one embodiment, the heat dissipating unit further includes a mounting hole recessed from a surface thereof and penetrating through the mounting groove in a thickness direction, and the mounting hole is used for a fixing member to pass through to hold the heat conducting portion.
In one embodiment, the heat dissipation unit further includes a holder disposed in the mounting groove, the holder is configured to generate a second directional force that causes the heat conduction portion to abut against the inner wall of the mounting groove under the driving of a first directional force, and the first directional force and the second directional force act in different directions.
In one embodiment, the first LED chip and the second LED chip respectively include a plurality of unit cells capable of emitting light independently, and the plurality of unit cells are connected in series and/or in parallel.
In one embodiment, the beam angle of the reflection unit is less than or equal to 90 °, and preferably, the beam angle of the reflection unit is less than or equal to 60 °.
An embodiment of the present application further provides a lighting device, including the LED light source module described above.
The invention has the following beneficial effects: the LED chip is respectively attached to the two sides of the chip mounting part, the fluorescent layer surrounding the chip mounting part is coated, and the reflecting unit is provided with the reflecting cavity for accommodating the fluorescent layer.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an LED light source module according to an embodiment of the present invention, without a heat dissipation unit;
FIG. 2 is a side view of an LED light source module without a heat dissipation unit according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an embodiment of an LED light source module according to the present invention, the LED light source module being equipped with a heat dissipation unit;
fig. 4 is a schematic structural diagram of an embodiment of an LED light source module according to the present invention, the LED light source module being equipped with a heat dissipation unit;
FIG. 5 is a schematic wiring diagram of a first LED chip according to an embodiment of the present invention;
fig. 6 is a schematic structural view of an LED light source module according to a second embodiment of the present invention without a heat dissipation unit;
FIG. 7 is a side view of an LED light source module without a heat dissipation unit according to a second embodiment of the present invention;
fig. 8 is a schematic structural view of an LED light source module according to a third embodiment of the present invention without a heat dissipation unit;
fig. 9 is a side view of the LED light source module according to the third embodiment of the present invention without a heat dissipation unit.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 and 2, a first embodiment of an LED light source module 100 according to the present application is described. In the present embodiment, the LED light source module 100 includes a substrate 10, a first LED chip 21, a second LED chip 22, a fluorescent layer 30, and a reflection unit 60.
The substrate 10 is preferably made of a material with good thermal conductivity, such as copper, aluminum nitride, silicon carbide, or the like, or the substrate 10 may be made of a laminated combination of the above materials to meet the requirements of practical application regarding processing strength and thermal conductivity.
The substrate 10 includes a base portion 11 and a chip mounting portion 12 extending from one end of the base portion 11, the chip mounting portion 12 has a first mounting surface and a second mounting surface opposite to each other, and a first LED chip 21 and a second LED chip 22 are respectively attached to the first mounting surface and the second mounting surface of the base portion 11. The first LED chip 21 and the second LED chip 22 correspond to the size of the chip mounting portion 12, where "size correspondence" means: the first LED chip 21 and the second LED chip 22 are substantially the same in size as the corresponding mounting surfaces on the chip mounting portion 12, and in actual production processing, for example, in a direction perpendicular to the extending direction of the chip mounting portion 12, the width of the chip mounting portion 12 is equal to or slightly larger than the width of the first LED chip 21 and the second LED chip 22, and in the extending direction of the chip mounting portion 12, the length of the chip mounting portion 12 is slightly larger than the length of the first LED chip 21 and the second LED chip 22, so as to balance feasibility of mounting processes while achieving a compact light source structure and a high light source density.
In one embodiment, the first LED chip 21 and the second LED chip 22 each include a plurality of unit cells capable of independently emitting light, and the plurality of unit cells are connected in series and/or in parallel. The structure can reduce the distance between the basic luminous units on one hand, and can also obtain a larger luminous surface in a chip with the same size on the other hand, thereby effectively improving the power density of the chip. In the present embodiment, the first mounting surface and the second mounting surface of the chip mounting portion 12 are provided with only a single one of the first LED chip 21 and the second LED chip 22, respectively.
The phosphor layer 30 encapsulates the first LED chip 21 and the second LED chip 22, wherein the phosphor layer 30 is usually a curable transparent material mixed with phosphor, for example, silica gel mixed with phosphor in one embodiment. The fluorescent layer 30 is disposed around the chip mounting portion 12 in a direction in which the chip mounting portion 12 extends, so that the fluorescent layer 30 can radiate light emitted via the first and second LED chips 21 and 22 to the periphery.
In one embodiment, the fluorescent layer 30 further covers an end side of the chip mounting portion 12 away from the base portion 11, wherein any cross section of the fluorescent layer 30 perpendicular to the extending direction of the chip mounting portion 12 is a circular shape, and a cross-sectional area of the fluorescent layer 30 perpendicular to the extending direction of the chip mounting portion 12 in the extending direction of the chip mounting portion 12 has a tendency of monotonically increasing and then monotonically decreasing. Therefore, the light emitted by the first LED chip 21 and the second LED chip 22 can be diffused by the fluorescent layer 30 at an angle of 4 pi solid angle to the periphery without any obvious dark area, and the process difficulty of coating and curing the fluorescent layer 30 around is low, which is also convenient for the application of production and processing. Of course, any cross section of the fluorescent layer perpendicular to the extending direction of the chip mounting portion can be square, polygonal and other suitable shapes so as to meet different production applications.
In one embodiment, the phosphor layer 30 is reflectively symmetric about the chip mounting portion 12, and the curvatures at any point on the phosphor layer 30 are equal. That is, the fluorescent layer 30 is substantially spherical as a whole, and the fluorescent layer 30 is configured to uniformly receive the light emitted from the first LED chip 21 and the light emitted from the second LED, so as to further ensure the uniformity of the light field of the LED light source module 100.
The reflection unit 60 has a reflection cavity 61 for accommodating the fluorescent layer 30, and the reflection unit 60 has a light outlet (not labeled) at a side away from the base 11, and the reflection unit 60 is configured to converge at least a part of the light transmitted through the fluorescent layer 30 to the light outlet for emitting. The reflective cavity 61 of the reflective unit 60 is generally cup-shaped, and the distance between the light source center formed by the first and second LED chips 21 and 22 and the center of the light exit of the reflective cavity 61, the opening diameter of the light exit, and the reflective curve of the reflective cavity 61 are adjusted, so as to realize the precise control of the light exit angle of the LED light source module 100, and ensure the controllability and the precise directivity of the light exit angle.
In one embodiment, the beam angle of the reflection unit is less than or equal to 90 °, and preferably, the beam angle of the reflection unit is less than or equal to 60 °.
In one embodiment, the reflection unit 60 is fixed to the substrate 10 at an end away from the light outlet, for example, by welding, adhesive, threaded fastener, etc., which will not be described herein.
The size of the base 11 is larger than that of the chip mounting portion 12, so that the base 11 can efficiently conduct heat generated by the first LED chip 21 and the second LED chip 22 on the chip mounting portion 12, reduce the temperature of the LED chip portion in the LED light source module 100 by natural heat dissipation or external heat dissipation units, and prolong the service life of the LED light source module 100.
In one embodiment, the chip mounting portion 12 and the base portion 11 may be considered as regions processed from the substrate 10 in one piece to serve different functions, and at least a portion of the base portion 11 is gradually widened in a direction away from the chip mounting portion 12, where the base portion 11 may be in a tendency of widening as a whole, or the base portion 11 may be in a tendency of widening at a portion connected to the chip mounting portion 12 and may be kept constant after widening to a set width.
Referring to fig. 3 and 4, the substrate 10 further includes a heat conduction portion 13 attached to an end of the base portion 11 remote from the chip mounting portion 12, and the heat conduction portion 13 may be a portion where one end of the substrate 10 is uncovered in configuration. The LED light source module 100 includes a heat dissipating unit 80, and the heat conducting portion 13 is inserted into the mounting groove of the heat dissipating unit 80 and is connected to the inner wall of the mounting groove in a heat conducting manner. Exemplarily, the heat conducting portion 13 may achieve a better attaching heat conducting effect through a heat conducting medium such as heat conducting silicone grease and the like and the inner wall of the assembling groove.
The heat conduction portion 13 may be fixedly connected to the heat dissipation unit 80 in various ways, exemplarily:
referring to fig. 3, in an embodiment, the heat dissipating unit 80 includes a mounting hole (not labeled) recessed from a surface thereof and penetrating through the mounting groove in a thickness direction, the mounting hole being for a fixing member P to pass through to hold the heat conducting portion 13. Alternatively, the fixing members P (e.g., screws) may be fixedly coupled to the heat dissipating unit 80 by passing through corresponding mounting holes of the heat conducting portion 13; alternatively (not shown), the fixing member P may be abutted against the heat conducting portion 13 through the mounting hole, and clamp the heat conducting portion 13 together with the inner wall of the mounting groove.
Referring to fig. 4, in an embodiment, the heat dissipating unit 80 further includes a holding member 81 disposed in the mounting groove, the holding member 81 is configured to generate a second directional force that makes the heat conducting portion 13 abut against the inner wall of the mounting groove under the driving of a first directional force, and the first directional force and the second directional force act in different directions. Specifically, the holding member 81 may be an oblique sliding block, which is matched with an oblique surface formed in the assembling groove, when the oblique sliding block is subjected to a first direction force from the top, under the guidance of the oblique surface, the oblique sliding block 81 integrally generates a tendency of moving towards a side wall direction of the assembling groove, and accordingly generates a second direction force acting on the heat conducting portion 13 to abut against the side inner wall of the assembling groove, and the oblique sliding block 81 and the side inner wall of the assembling groove clamp the heat conducting portion 13 together.
The inclined surface to be engaged with the bevel slider 81 may be defined integrally as one side wall of the fitting groove, or alternatively, as an inclined surface of another bevel slider 82 disposed in the fitting groove. The first direction force applied to the top end of the bevel slider 81 can be realized, for example, by a pressing piece M and a fixing piece P cooperating with the pressing piece M: one end of the pressing sheet M abuts against the top end of the oblique sliding block 81, and the other end of the pressing sheet M is fixed with the heat dissipation unit 80 through the fixing piece P, when the pressing sheet M is locked by the fixing piece P, the first direction force of the oblique sliding block 81 applied to one end of the pressing sheet M abutting against the top end of the oblique sliding block 81 is enough to generate the second direction force for locking the heat conduction portion 13.
In the present embodiment, the base 11 includes a first mounting surface and a second mounting surface that are opposite to each other, the first mounting surface of the base 11 is laid with a first conductive layer (not labeled) that includes a first polarity path 41 and a second polarity path (not labeled), and the first LED chip 21 is connected to the first polarity path 41 and the second polarity path of the first conductive layer by wires, respectively; the second mounting surface of the base 11 is laid with a second conductive layer (not denoted) including a first polarity via 51 and a second polarity via (not denoted), and the second LED chip 22 is connected to the first polarity via 51 and the second polarity via of the second conductive layer by wires, respectively.
With reference to fig. 5, the first LED chip 21 suitably includes a first polarity wiring 211 and a second polarity wiring 212 distributed in an inserting finger shape, one end of the first polarity wiring 211 of the first LED chip 21 is connected to a first chip pad 213 for external connection, one end of the second polarity wiring 212 of the first LED chip 21 is connected to a second chip pad 214 for external connection, a width of the first polarity wiring 211 of the first LED chip 21 in an extending direction away from the first chip pad 213 is gradually reduced, and a width of the second polarity wiring 212 of the first LED chip 21 in an extending direction away from the second chip pad 214 is gradually reduced. Similarly, the second LED chip 22 also includes a first polarity wiring and a second polarity wiring in a finger-inserted distribution, one end of the first polarity wiring of the second LED chip 22 is connected to a third chip pad for external connection, one end of the second polarity wiring of the second LED chip 22 is connected to a fourth chip pad for external connection, the width of the first polarity wiring of the second LED chip 22 in the extending direction away from the third chip pad is gradually reduced, and the width of the second polarity wiring of the second LED chip in the extending direction away from the fourth chip pad is gradually reduced. By such an arrangement, the first LED chip 21 and the second LED chip 22 can have a larger light emitting area, and the light emitting efficiency of the chips is improved.
The first polarity path 41 of the first conductive layer includes a first lead pad 411 and a first external pad 412 at two ends thereof, the second polarity path of the first conductive layer includes a second lead pad 421 and a second external pad 422 at two ends thereof, the area of the first lead pad 411 is smaller than that of the first external pad 412, the area of the second lead pad 421 is smaller than that of the second external pad 422, the first lead pad 411 is electrically connected to the first chip pad 213 on the first LED chip 21 by a lead, and the second lead pad 421 is electrically connected to the second chip pad 214 on the first LED chip 21 by a lead. Similarly, the first polarity path 51 of the second conductive layer also includes a third lead pad 511 and a third external pad 512 respectively located at two ends thereof, and the area of the third lead pad 511 is smaller than that of the third external pad 512, the third lead pad 511 is electrically connected to the corresponding chip pad on the second LED chip 22 through a lead, the second polarity path of the second conductive layer is not shown in the figure, and the connection configuration of the second polarity path with respect to the pad and the second LED chip 22 is similar to the first polarity path of the second conductive layer, which is not repeated herein.
In one embodiment, the first and second chip pads 213, 214 on the first LED chip 21 are disposed on a side of the first LED chip 21 adjacent to the base 11, and the third and fourth chip pads on the second LED chip 22 are disposed on a side of the second LED chip 22 adjacent to the base 11, so as to facilitate the wiring connection and packaging.
In an embodiment of practical processing application, the insulating layer 91 may be disposed on each of two sides of the base 11 of the substrate 10, the conductive layers are disposed on the insulating layer 91 and then covered by the insulating layer 92, and portions of the conductive layers exposed on the insulating layer 92 serve as the lead pads and the external pads. The first LED chip 21 and the second LED chip 22 have the length of 0.2-15 mm and the width of 0.2-10 mm; and/or the thickness of the light-transmitting substrate 10 is 0.2 mm-10 mm; and/or the power of the first LED chip 21 and the second LED chip 22 can be set to be 0.5-50W, and the chip voltage can be set to be 3-220V, so as to meet the requirements of different application scenes.
Referring to fig. 6 and 7, a second embodiment of the LED light source module 200 of the present application will be described. Unlike the first embodiment, in the present embodiment, the first LED chip 21a and the second LED chip 22a are vertical-structure LEDs, and correspondingly, the first LED chip 21a includes first polarity wirings (not shown) and second polarity wirings (not shown) on both back surfaces thereof, the second polarity wirings of the first LED chip are connected to the second polarity paths of the first conductive layer by wires, the LED light source module 200 further includes a first back conductive layer 43a covering the first surface of the chip mounting portion 12a and the first surface of the base portion 11a, the first back conductive layer 43a includes first polarity paths (not shown), the first back conductive layer 43a is located below the first conductive layer in a direction perpendicular to the substrate 10a, the first polarity wirings of the first LED chip 21a are connected to the first polarity paths of the first back conductive layer 43 a; similarly, the second LED chip 22a includes first polarity wirings (not shown) and second polarity wirings (not shown) on both back surfaces thereof, the second polarity wirings of the second LED chip are connected to second polarity paths of the second conductive layer by wires, the LED light source module 200 further includes a second back conductive layer 53a that covers the second surface of the chip mounting portion 12a and the second surface of the base portion 11a, the second back conductive layer 53a includes first polarity paths (not shown), the second back conductive layer 53a is located below the second conductive layer in a direction perpendicular to the substrate 10a, and the first polarity wirings of the second LED chip 21a are connected to the first polarity paths of the second back conductive layer 53 a.
Specifically, the second polarity via of the first conductive layer has the exposed second external connection pad 422a on the side facing away from the first mounting surface of the base 11a, the first conductive layer also has the exposed first external connection pad 412a on the side facing away from the first mounting surface of the base 11a, and the first polarity via of the first back conductive layer 43a and the first external connection pad 412a are electrically interconnected through the through hole 44 a; the second polarity path of the second conductive layer has an exposed fourth external connection pad (not shown) on the side facing away from the second mounting surface of the base 11a, the second conductive layer also has an exposed third external connection pad 512a on the side facing away from the second mounting surface of the base 11a, and the first polarity path of the second back conductive layer 53a and the third external connection pad 512a are electrically interconnected through the through hole 54 a. The vias 44a and 54a may be filled with a conductive metal, and the first conductive layer and the first back conductive layer 43a, and the second conductive layer and the second back conductive layer 53a may be electrically isolated by an insulating layer 91 a. Therefore, the external bonding pads on the same side are positioned on the same plane, and further processes such as routing and the like are facilitated.
Referring to fig. 8 and 9, a third embodiment of the LED light source module 300 of the present application will be described. Unlike the second embodiment, in the present embodiment, the first back conductive layer 43b has the first external connection pad 431b exposed on the side facing away from the first mounting surface of the base portion 11b, and the second polarity via 42b of the first conductive layer has the second external connection pad 421b exposed on the side facing away from the first mounting surface of the base portion 11 b; the second backside conductive layer 53b has exposed third external connection pads 531b on a side facing away from the second mounting surface of the base 11b, and the second polarity via 52b of the second conductive layer has exposed fourth external connection pads 521b on a side facing away from the second mounting surface of the base. Therefore, through holes for communication do not need to be arranged as in the second embodiment, and the process difficulty is reduced.
An embodiment of the present application also provides a lighting device, which includes an LED light source module, and the LED light source module herein can be fully cited in the above-mentioned embodiments/examples. Further, since the other parts of the lighting device are not improved, further description of the structure of the other parts of the lighting device is omitted here.
According to the technical scheme, the invention has the following advantages:
according to the invention, the chip mounting part on the substrate is set to be corresponding to the size of the LED chip, the two sides of the chip mounting part are respectively attached to the LED chip, the fluorescent layer surrounding the chip mounting part is coated, and the reflecting unit is provided with the reflecting cavity for accommodating the fluorescent layer, so that the light transmitted by the fluorescent layer can be converged to the light outlet on the reflecting unit to be emitted, a secondary lens is not required to be additionally arranged, the light field with a small beam angle can be obtained, the structure is simple, and the production and application are convenient.
It is to be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (10)

1. An LED light source module, comprising:
a substrate including a base portion and a chip mounting portion extending from one end of the base portion, the chip mounting portion having a first mounting surface and a second mounting surface that are opposite to each other;
the LED chip comprises a first LED chip attached to a first mounting surface of the chip mounting part and a second LED chip attached to a second mounting surface of the chip mounting part, wherein the first LED chip and the second LED chip correspond to the chip mounting part in size;
a fluorescent layer that covers the first and second LED chips, the fluorescent layer being disposed around the chip mounting portion in a direction in which the chip mounting portion extends;
the reflecting unit is provided with a reflecting cavity which is matched with and used for accommodating the fluorescent layer, a light outlet is formed in one side, far away from the base, of the reflecting unit, and the reflecting unit is used for converging at least part of light transmitted by the fluorescent layer to the light outlet for emitting.
2. The LED light source module as claimed in claim 1, wherein any cross section of the fluorescent layer perpendicular to the extending direction of the chip mounting portion is circular, square or polygonal; and/or the cross-sectional area of the fluorescent layer, which is perpendicular to the extending direction of the chip mounting part, in the extending direction of the chip mounting part has a tendency of monotonously increasing and then monotonously decreasing; and/or the fluorescent layer covers the end side of the chip mounting part far away from the base part; and/or the fluorescent layer is reflection-symmetrical with respect to the chip mounting portion; and/or the curvatures at any point on the fluorescent layer are the same; and/or the reflecting unit is fixed with the substrate at one end far away from the light outlet; and/or the size of the base is larger than that of the chip mounting part; and/or at least part of the base part is gradually widened in the direction away from the chip mounting part; and/or the first LED chip and the second LED chip respectively comprise a plurality of unit cells capable of independently emitting light, and the plurality of unit cells are mutually connected in series and/or in parallel; and/or the beam angle of the reflection unit is less than or equal to 90 degrees, preferably, the beam angle of the reflection unit is less than or equal to 60 degrees.
3. The LED light source module as claimed in claim 1 or 2, wherein the base comprises a first mounting surface and a second mounting surface opposite to each other; wherein,
a first conductive layer is arranged on the first mounting surface of the base, the first conductive layer comprises a first polarity path and a second polarity path, and the first LED chip is connected to the first polarity path and the second polarity path of the first conductive layer through leads respectively; and/or the presence of a gas in the gas,
and a second conductive layer is arranged on the second mounting surface of the base, the second conductive layer comprises a first polarity path and a second polarity path, and the second LED chip is connected to the first polarity path and the second polarity path of the second conductive layer through leads respectively.
4. The LED light source module according to claim 3, wherein the first LED chip comprises a first polarity wire and a second polarity wire, one end of the first polarity wire of the first LED chip is connected with a first chip pad for external lead, one end of the second polarity wire of the first LED chip is connected with a second chip pad for external lead, the width of the first polarity wire of the first LED chip in the extending direction away from the first chip pad is gradually reduced, and the width of the second polarity wire of the first chip in the extending direction away from the second chip pad is gradually reduced; and/or the presence of a gas in the gas,
the second LED chip comprises a first polarity wiring and a second polarity wiring, one end of the first polarity wiring of the second LED chip is connected with a third chip bonding pad used for an external lead, one end of the second polarity wiring of the second LED chip is connected with a fourth chip bonding pad used for the external lead, the first polarity wiring of the second LED chip is far away from the width of the third chip bonding pad in the extending direction, and the second polarity wiring of the second chip is far away from the width of the fourth chip bonding pad in the extending direction.
5. The LED light source module as claimed in claim 1 or 2, wherein the base comprises a first mounting surface and a second mounting surface opposite to each other; wherein,
a first conductive layer is arranged on the first mounting surface of the base, the first conductive layer includes a second polarity path, the first LED chip includes a first polarity wiring and a second polarity wiring on two opposite back surfaces thereof, the second polarity wiring of the first LED chip is connected to the second polarity path of the first conductive layer by a wire, the LED light source module further includes a first back conductive layer covering the first surface of the chip mounting portion and the first surface of the base, the first back conductive layer includes a first polarity path, the first back conductive layer is located below the first conductive layer in a direction perpendicular to the substrate, the first polarity wiring of the first LED chip is connected to the first polarity path of the first back conductive layer; and/or the presence of a gas in the gas,
the second mounting surface of the base portion is provided with a second conductive layer, the second conductive layer includes a second polarity path, the second LED chip includes a first polarity wiring and a second polarity wiring on two opposite surfaces thereof, the second polarity wiring of the second LED chip is connected to the second polarity path of the second conductive layer by a wire, the LED light source module further includes a second back conductive layer covering the second surface of the chip mounting portion and the second surface of the base portion, the second back conductive layer includes a first polarity path, the second back conductive layer is located below the second conductive layer in a direction perpendicular to the substrate, and the first polarity wiring of the second LED chip is connected to the first polarity path of the second back conductive layer.
6. The LED light source module of claim 5, wherein the first back conductive layer has exposed first external connection pads on a side facing away from the first mounting surface of the base, and the second polarity via of the first conductive layer has exposed second external connection pads on a side facing away from the first mounting surface of the base; and/or
The second back conductive layer has an exposed third external connection pad on a side facing away from the second mounting surface of the base, and the second polarity via of the second conductive layer has an exposed fourth external connection pad on a side facing away from the second mounting surface of the base.
7. The LED light source module as claimed in claim 5, wherein the second polarity path of the first conductive layer has a second exposed external pad on a side facing away from the first mounting surface of the base, the first conductive layer further has a first exposed external pad on a side facing away from the first mounting surface of the base, and the first polarity path of the first back conductive layer and the first external pad are electrically interconnected through a through hole; and/or the presence of a gas in the gas,
the second polarity path of the second conductive layer is provided with an exposed fourth external bonding pad on the side back to the second base mounting surface, the second conductive layer is also provided with an exposed third external bonding pad on the side back to the second base mounting surface, and the first polarity path of the second back conductive layer is electrically interconnected with the third external bonding pad through a through hole.
8. The LED light source module of claim 1, wherein the substrate includes a heat conducting portion connected to an end of the base portion away from the chip mounting portion, the LED light source module further includes a heat dissipating unit, the heat conducting portion is inserted into a mounting groove of the heat dissipating unit, and the heat conducting portion is thermally connected to an inner wall of the mounting groove.
9. The LED light source module as claimed in claim 8, wherein the heat sink further comprises a mounting hole recessed from a surface thereof and penetrating the mounting groove in a thickness direction, the mounting hole being for a fixing member to pass through to hold the heat conducting portion; or,
the heat dissipation unit further comprises a fixing piece arranged in the assembling groove, the fixing piece is arranged to generate a second direction force which enables the heat conduction part to abut against the inner wall of the assembling groove under the driving of a first direction force, and the action directions of the first direction force and the second direction force are different.
10. An illumination device is characterized by comprising the LED light source module.
CN201910494766.2A 2019-06-10 2019-06-10 LED light source module and lighting device Pending CN112066275A (en)

Priority Applications (1)

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Application Number Priority Date Filing Date Title
CN201910494766.2A CN112066275A (en) 2019-06-10 2019-06-10 LED light source module and lighting device

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US20030063476A1 (en) * 2001-09-28 2003-04-03 English George J. Replaceable LED lamp capsule
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CN206310267U (en) * 2017-01-04 2017-07-07 林明珠 A kind of LED multi-chips phase transformation encapsulates bulkhead lamp
CN207584500U (en) * 2017-11-22 2018-07-06 东莞市百倬电子科技有限公司 A kind of LED bay light
CN208503968U (en) * 2018-05-15 2019-02-15 海宁市鑫诚电子有限公司 A kind of LED luminescence component that power drives are integrated with LED light source
CN209856797U (en) * 2019-06-10 2019-12-27 宁波天炬光电科技有限公司 LED light source module and lighting device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030063476A1 (en) * 2001-09-28 2003-04-03 English George J. Replaceable LED lamp capsule
CN103292173A (en) * 2013-04-28 2013-09-11 杭州杭科光电股份有限公司 4 Pi luminous LED light source module
CN206310267U (en) * 2017-01-04 2017-07-07 林明珠 A kind of LED multi-chips phase transformation encapsulates bulkhead lamp
CN207584500U (en) * 2017-11-22 2018-07-06 东莞市百倬电子科技有限公司 A kind of LED bay light
CN208503968U (en) * 2018-05-15 2019-02-15 海宁市鑫诚电子有限公司 A kind of LED luminescence component that power drives are integrated with LED light source
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