CN112063337B - Photovoltaic adhesive film resisting mechanical impact and preparation method thereof - Google Patents

Photovoltaic adhesive film resisting mechanical impact and preparation method thereof Download PDF

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Publication number
CN112063337B
CN112063337B CN202011015244.9A CN202011015244A CN112063337B CN 112063337 B CN112063337 B CN 112063337B CN 202011015244 A CN202011015244 A CN 202011015244A CN 112063337 B CN112063337 B CN 112063337B
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adhesive film
resin system
photovoltaic
hot
acid
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CN112063337A (en
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林建伟
张付特
曾金栋
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JOLYWOOD (SUZHOU) SUNWATT CO Ltd
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JOLYWOOD (SUZHOU) SUNWATT CO Ltd
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/204—Applications use in electrical or conductive gadgets use in solar cells
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention relates to a photovoltaic adhesive film resisting mechanical impact and a preparation method thereof. The photovoltaic adhesive film resisting mechanical impact is made of 0.1-45% of elastomer resin system, 20-95% of hot-melt thermosetting resin system and 0.1-5% of glass fiber as basic materials; the elastomer resin system is prepared from 95-99% of elastomer resin, 0.05-5% of antioxidant, 0.25-5% of free radical crosslinking agent and 0.1-4% of silane coupling agent. The photovoltaic adhesive film adopts the hot-melt thermosetting resin and the curing system thereof to provide mechanical shock resistance for the photovoltaic adhesive film; glass fiber is adopted to provide mechanical impact resistance for the photovoltaic adhesive film; the elastomer is adopted to provide toughness for the adhesive film, and the adhesive film is prevented from being cracked in the processes of processing, preparation, transportation, storage and use. In addition, the photovoltaic adhesive film can provide mechanical strength for the assembly after hot pressing, effectively resist mechanical impact and simultaneously prevent the photovoltaic adhesive film from cracking in the processes of production, storage, transportation, use and the like.

Description

Photovoltaic adhesive film resisting mechanical impact and preparation method thereof
Technical Field
The invention relates to the technical field of solar cells, in particular to a photovoltaic adhesive film resisting mechanical impact and a preparation method thereof.
Background
The photovoltaic packaging adhesive film is an important material in the solar photovoltaic technology industry, plays an important role in bonding a battery piece, photovoltaic glass and a back plate, and simultaneously has multiple functions of mechanical buffering and protection of a photovoltaic module, PID resistance of the module and ultraviolet resistance protection of the back plate. Because the photovoltaic module is gradually developed towards thinning, thinning and flexibility at present, the photovoltaic glass is gradually thinned and even needs to be replaced, and therefore the packaging adhesive film and the back plate need to be enhanced in mechanical property to have the function of resisting mechanical impact of the module.
The traditional photovoltaic adhesive film is made of EVA (ethylene-vinyl acetate) or POE (ethylene-octene) polymer as a basic material, is an elastomer adhesive film, is very soft and cannot play a role in resisting mechanical impact.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a photovoltaic adhesive film resisting mechanical impact and a preparation method thereof.
The invention provides a photovoltaic adhesive film resisting mechanical impact, which is made of 0.1-45% of elastomer resin system, 20-95% of hot-melt thermosetting resin system and 0.1-5% of glass fiber as basic materials;
the elastomer resin system is prepared from 95-99% of elastomer resin, 0.05-5% of antioxidant, 0.25-5% of free radical crosslinking agent and 0.1-4% of silane coupling agent.
The invention provides a photovoltaic adhesive film resisting mechanical impact, which also comprises the following auxiliary technical scheme:
wherein the softening points of the elastomer resin system and the hot-melt thermosetting resin system are 50-130 ℃;
the thickness of the photovoltaic adhesive film resisting mechanical impact is 300-1000 mu m.
Wherein the hot melt thermoset resin system comprises:
70 to 98 percent of hot-melt epoxy resin and 2 to 30 percent of organic dicarboxylic acid; or the like, or a combination thereof,
70-95% of hot-melt unsaturated polyester resin and 5-30% of cross-linking agent; or the like, or a combination thereof,
70-95% of hydroxyl-terminated hot-melt polyester resin and 5-30% of isocyanate curing agent; or,
70-95% of carboxyl-terminated hot-melt polyester resin, 0-30% of epoxy curing agent and 0-30% of isocyanate curing agent; or,
70-99% of hot-melt epoxy modified acrylic resin and 1-30% of organic dicarboxylic acid; or,
80-95% of hot-melt acrylic resin, 0-20% of epoxy curing agent and 0-20% of isocyanate curing agent.
Wherein the elastomer resin comprises one or the combination of any more of EVA, POE, hydrogenated styrene-butadiene block copolymer, polybutadiene rubber, polyvinyl acetate or polyvinyl butyral.
Wherein the antioxidant comprises a main antioxidant and an auxiliary antioxidant; wherein,
the main antioxidant group comprises octadecyl beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate;
the auxiliary antioxidant comprises one or two of tris (4-nonylphenol) phosphite or tris (2, 4-di-tert-butylphenyl) phosphite.
Wherein the cross-linking agent comprises a cross-linking curing agent and an auxiliary cross-linking agent; wherein,
the crosslinking curing agent comprises one or a mixture of two of organic peroxide or azo compound;
the organic peroxide comprises one or the combination of any more of cumyl peroxide, di-tert-butyl peroxide, dicumyl hydroperoxide, 2, 5-dimethyl-2, 5-di-tert-butyl peroxy hexane, 4-di (tert-amyl peroxy) n-butyl valerate, tert-butyl peroxy-2-ethylhexyl carbonate or ethyl 3, 3-di (tert-butyl peroxy) butyrate;
the auxiliary crosslinking agent comprises one or a combination of any of triallyl isocyanurate, triallyl cyanurate, trimethylolpropane trimethacrylate or diethylene glycol dimethacrylate.
Wherein, the silane coupling agent is one or the combination of any more of vinyltriethoxysilane, vinyltrimethoxysilane, vinyltri-tert-butyl peroxide silane, vinyltriacetoxysilane or vinyltri (beta-methoxyethoxy) silane.
Wherein, the organic dicarboxylic acid comprises one or the combination of any of maleic anhydride, maleic acid, fumaric acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid or sebacic acid.
Wherein the isocyanate curing agent is an organic compound containing a plurality of isocyanate groups, and comprises isophorone diisocyanate and a trimer thereof or hexamethylene diisocyanate and a trimer thereof.
Wherein the epoxy curing agent is an organic compound containing a plurality of epoxy groups, including 2,2' - [ [2, 2-bis [ (oxetanylmethoxy) methyl ] -1, 3-propylene ] bis (oxymethylene) ] bis-oxirane, 1, 4-butanediol glycidyl ether, diethylene glycol diglycidyl ether, glycerol triglycidyl ether, or neopentyl glycol diglycidyl ether.
The invention also provides a preparation method of the photovoltaic adhesive film resisting mechanical impact, which comprises the following steps:
fully mixing 0.1-45% of elastomer resin system and 20-95% of hot-melt thermosetting resin system, then carrying out banburying and plasticizing, producing by an extrusion casting process, and carrying out embossing and shaping treatment to form the photovoltaic adhesive film resisting mechanical impact; wherein,
the elastomer resin system is prepared from 95-99% of elastomer resin, 0.05-5% of antioxidant, 0.25-5% of free radical crosslinking agent and 0.1-4% of silane coupling agent.
The photovoltaic adhesive film adopts the hot-melt thermosetting resin and the curing system thereof to provide mechanical impact resistance for the photovoltaic adhesive film; glass fiber is adopted to provide mechanical impact resistance for the photovoltaic adhesive film; the elastomer is adopted to provide toughness for the adhesive film, and the adhesive film is prevented from being cracked in the processes of processing, preparation, transportation, storage and use. In addition, the photovoltaic adhesive film can provide mechanical strength for the assembly after hot pressing, effectively resist mechanical impact and simultaneously prevent the photovoltaic adhesive film from cracking in the processes of production, storage, transportation, use and the like.
Detailed Description
The present invention will be described in detail with reference to examples.
The specific embodiments are merely illustrative and not restrictive, and those skilled in the art who review this disclosure may make modifications to the embodiments without any inventive contribution, as desired, while remaining within the scope of the appended claims.
The invention provides a photovoltaic adhesive film with resistance to mechanical impact, which is made of 0.1-45% of elastomer resin system, 20-95% of hot-melt thermosetting resin system and 0.1-5% of glass fiber as basic materials;
the elastomer resin system is prepared from 95-99% of elastomer resin, 0.05-5% of antioxidant, 0.25-5% of free radical crosslinking agent and 0.1-4% of silane coupling agent.
The softening points of the elastomer resin system and the hot-melt thermosetting resin system are 50-130 ℃; the thickness of the photovoltaic adhesive film resisting mechanical impact is 300-1000 mu m.
The photovoltaic adhesive film adopts the hot-melt thermosetting resin and the curing system thereof to provide mechanical impact resistance for the photovoltaic adhesive film; the glass fiber is adopted to provide mechanical impact resistance for the photovoltaic adhesive film; the elastomer is adopted to provide toughness for the adhesive film, and the adhesive film is prevented from being cracked in the processes of processing, preparation, transportation, storage and use. In addition, the photovoltaic adhesive film can provide mechanical strength for the assembly after hot pressing, effectively resist mechanical impact and prevent the photovoltaic adhesive film from being cracked in the processes of production, storage, transportation, use and the like.
Wherein the hot melt thermoset resin system comprises: 70 to 98 percent of hot-melt epoxy resin and 2 to 30 percent of organic dicarboxylic acid; or 70 to 95 percent of hot-melt unsaturated polyester resin and 5 to 30 percent of cross-linking agent; or 70-95% of end hydroxyl hot-melt polyester resin and 5-30% of isocyanate curing agent; or 70-95% of carboxyl-terminated hot-melt polyester resin, 0-30% of epoxy curing agent and 0-30% of isocyanate curing agent; or 70 to 99 percent of hot-melt epoxy modified acrylic resin and 1 to 30 percent of organic dicarboxylic acid; or 80 to 95 percent of hot-melt acrylic resin, 0 to 20 percent of epoxy curing agent and 0 to 20 percent of isocyanate curing agent.
Preferably, the elastomer resin comprises one or a combination of any of EVA, POE, hydrogenated styrene-butadiene block copolymer, polybutadiene rubber, polyvinyl acetate, or polyvinyl butyral.
Preferably, the antioxidant comprises a primary antioxidant and a secondary antioxidant; more preferably, the primary antioxidant group comprises octadecyl beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate; the auxiliary antioxidant comprises one or two of tris (4-nonylphenol) phosphite or tris (2, 4-di-tert-butylphenyl) phosphite.
Preferably, the crosslinking agent comprises a crosslinking curing agent and a co-crosslinking agent; more preferably, the crosslinking curing agent comprises one or a mixture of two of an organic peroxide or an azo compound; the organic peroxide comprises one or the combination of any more of cumyl peroxide, di-tert-butyl peroxide, dicumyl hydroperoxide, 2, 5-dimethyl-2, 5-di-tert-butyl peroxy hexane, 4-di (tert-amyl peroxy) n-butyl valerate, tert-butyl peroxy-2-ethylhexyl carbonate or ethyl 3, 3-di (tert-butyl peroxy) butyrate; the auxiliary crosslinking agent comprises one or a combination of any of triallyl isocyanurate, triallyl cyanurate, trimethylolpropane trimethacrylate or diethylene glycol dimethacrylate.
Preferably, the silane coupling agent is one or a combination of any of vinyltriethoxysilane, vinyltrimethoxysilane, vinyltri-tert-butyl-peroxide silane, vinyltriacetoxysilane or vinyltris (beta-methoxyethoxy) silane.
Preferably, the organic dicarboxylic acid comprises one or a combination of any of maleic anhydride, maleic acid, fumaric acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid or sebacic acid.
Preferably, the isocyanate curing agent is an organic compound containing a plurality of isocyanate groups; more preferably, the isocyanate curing agent includes isophorone diisocyanate and its trimer or hexamethylene diisocyanate and its trimer.
Preferably, the epoxy curing agent is an organic compound containing a plurality of epoxy groups, including 2,2' - [ [2, 2-bis [ (oxetanylmethoxy) methyl ] -1, 3-propylene ] bis (oxymethylene) ] bis-oxirane, 1, 4-butanediol glycidyl ether, diethylene glycol diglycidyl ether, glycerol triglycidyl ether or neopentyl glycol diglycidyl ether.
The invention also provides a preparation method of the photovoltaic adhesive film resisting mechanical impact, which comprises the following steps:
fully mixing 0.1-45% of elastomer resin system and 20-95% of hot-melt thermosetting resin system, then carrying out banburying and plasticizing, producing by an extrusion casting process, and carrying out embossing and shaping treatment to form the photovoltaic adhesive film resisting mechanical impact; wherein,
the elastomer resin system is prepared from 95-99% of elastomer resin, 0.05-5% of antioxidant, 0.25-5% of free radical crosslinking agent and 0.1-4% of silane coupling agent.
The inventive photovoltaic adhesive film resistant to mechanical shock will be described in detail below with specific examples.
In the embodiment described below, it is preferred that,
elastomeric resin system: ethylene-octene copolymer (POE) in which the octene content is 30%.
Antioxidant: the main anti-oxygen group is beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionic acid octadecyl ester; the auxiliary antioxidant is a compound of tris (4-nonylphenol) phosphite and tris (2, 4-di-tert-butylphenyl) phosphite.
The crosslinking agent is a compound of tert-butyl peroxy-2-ethylhexyl carbonate and ethyl 3, 3-di (tert-butylperoxy) butyrate; the auxiliary crosslinking agent is a compound of triallyl isocyanurate, triallyl cyanurate and trimethylolpropane trimethacrylate.
Silane coupling agent: vinyltris (. Beta. -methoxyethoxy) silane.
Hot melt thermosetting resin system: hot melt epoxy modified acrylic resin, azelaic acid.
Glass fiber: the length is 3mm.
Example 1
The formula of the elastomer resin system is as follows: antioxidant: a crosslinking agent: silane coupling agent = 100; the formula of the hot-melt thermosetting resin system is as follows: azelaic acid =100:2; elastomeric resin system: hot melt thermosetting resin system: glass fiber =1:2:0.02. the materials are fully and uniformly mixed according to the proportion, the mixture is added into an internal mixer for internal mixing, the plasticizing temperature is 60-90 ℃, the mixture is transferred to an extruder for melt extrusion after being completely plasticized, the temperature and humidity of each area of the extruder and a die head are 80-90 ℃, the mixture is extruded through a co-extrusion die head, the mixture is cooled by a casting roller and shaped after an embossing process, and finally, the thickness is measured, the edge is cut, the rolled adhesive film is observed for toughness, and the rolled adhesive film is packaged and stored in a warehouse. The assembly was laminated for 20min at 160 ℃ and then subjected to an impact resistance test, and the film was laminated alone to test light transmittance.
Example 2
The formula of the elastomer resin system is as follows: antioxidant: a crosslinking agent: silane coupling agent = 100; the formula of the hot-melt thermosetting resin system is as follows: azelaic acid =100:2; elastomer resin system: hot melt thermoset resin system: glass fiber =1:4:0.02. the materials are fully and uniformly mixed according to the proportion, the mixture is added into an internal mixer for internal mixing, the plasticizing temperature is 60-90 ℃, the mixture is transferred to an extruder for melt extrusion after being completely plasticized, the temperature and humidity of each area of the extruder and a die head are 80-90 ℃, the mixture is extruded through a co-extrusion die head, the mixture is cooled by a casting roller and shaped after an embossing process, and finally, the thickness is measured, the edge is cut, the rolled adhesive film is observed for toughness, and the rolled adhesive film is packaged and stored in a warehouse. The assembly was laminated for 20min at 160 ℃ and then subjected to an impact resistance test, and the film was laminated alone to test light transmittance.
Example 3
The formula of the elastomer resin system is as follows: antioxidant: a crosslinking agent: silane coupling agent = 100; the formula of the hot-melt thermosetting resin system is as follows: azelaic acid =100:2; elastomer resin system: hot melt thermosetting resin system: glass fiber =1:6:0.02. the materials are fully and uniformly mixed according to the proportion, the mixture is added into an internal mixer for internal mixing, the plasticizing temperature is 60-90 ℃, the mixture is transferred to an extruder for melt extrusion after being completely plasticized, the temperature and humidity of each area of the extruder and a die head are 80-90 ℃, the mixture is extruded through a co-extrusion die head, the mixture is cooled by a casting roller and shaped after an embossing process, and finally, the thickness is measured, the edge is cut, the rolled adhesive film is observed for toughness, and the rolled adhesive film is packaged and stored in a warehouse. The assembly was laminated for 20min at 160 ℃ and then subjected to an impact resistance test, and the film was laminated alone to test light transmittance.
Example 4
The formula of the elastomer resin system is as follows: antioxidant: a crosslinking agent: silane coupling agent = 100; the formula of the hot-melt thermosetting resin system is as follows: azelaic acid =100:2; elastomer resin system: hot melt thermosetting resin system: glass fiber =1:8:0.02. the materials are fully and uniformly mixed according to the proportion, the mixture is added into an internal mixer for internal mixing, the plasticizing temperature is 60-90 ℃, the mixture is transferred to an extruder for melt extrusion after being completely plasticized, the temperature and humidity of each area of the extruder and a die head are 80-90 ℃, the mixture is extruded through a co-extrusion die head, the mixture is cooled by a casting roller and shaped after an embossing process, and finally, the thickness is measured, the edge is cut, the rolled adhesive film is observed for toughness, and the rolled adhesive film is packaged and stored in a warehouse. The assembly was laminated for 20min at 160 ℃ and then subjected to an impact resistance test, and the film was laminated alone to test light transmittance.
Example 5
The formula of the elastomer resin system is as follows: antioxidant: a crosslinking agent: silane coupling agent = 100; the formula of the hot-melt thermosetting resin system is as follows: azelaic acid =100:2; elastomer resin system: hot melt thermosetting resin system: glass fiber =1:12:0.02. the materials are fully and uniformly mixed according to the proportion, added into an internal mixer for internal mixing, the plasticizing temperature is 60-90 ℃, transferred to an extruder for melt extrusion after complete plasticizing, the temperature and humidity of each area of the extruder and a die head are 80-90 ℃, extruded by a co-extrusion die head, cooled by a casting roller, shaped after an embossing process, finally measured in thickness, trimmed, rolled, observed in toughness of a rolled adhesive film, and packaged and stored in a warehouse. The assembly was laminated for 20min at 160 ℃ and then subjected to an impact resistance test, and the film was laminated alone to test light transmittance.
TABLE 1-examples 1-5 Performance test
Item Example 1 Example 2 Example 3 Example 4 Example 5
Glue film rolling Intact Is intact Is intact Crushing Crushing
Impact resistance NO YES YES YES YES
Transmittance (%) 92.3 92.2 92.0 91.9 91.8
Example 6
The formula of the elastomer resin system is as follows: antioxidant: a crosslinking agent: silane coupling agent: 0.5; the formula of the hot-melt thermosetting resin system is as follows: azelaic acid =100:2; elastomer resin system: hot melt thermoset resin system: glass fiber =1:6:0.01. the materials are fully and uniformly mixed in proportion, added into an internal mixer for internal mixing, the plasticizing temperature is 60-90 ℃, transferred to an extruder for melt extrusion after complete plasticizing, the temperature and humidity of each area of the extruder and a die head are 80-90 ℃, extruded through a co-extrusion die head, cooled by a casting roller, shaped after an embossing process, finally subjected to thickness measurement, edge cutting and rolling, the toughness of a rolled adhesive film is observed, and packaged and stored in a warehouse. The assembly was laminated for 20min at 160 ℃ and then subjected to an impact resistance test, and the film was laminated alone to test light transmittance.
Example 7
The formula of the elastomer resin system is as follows: antioxidant: a crosslinking agent: silane coupling agent: 0.5; the formula of the hot-melt thermosetting resin system is as follows: azelaic acid =100:2; elastomeric resin system: hot melt thermosetting resin system: glass fiber =1:6:0.02. the materials are fully and uniformly mixed in proportion, added into an internal mixer for internal mixing, the plasticizing temperature is 60-90 ℃, transferred to an extruder for melt extrusion after complete plasticizing, the temperature and humidity of the extruder and each area of a die head are 80-90 ℃, extruded by a co-extrusion die head, cooled by a casting roller, shaped after an embossing process, finally measured in thickness, trimmed, rolled, observed in toughness of a rolled adhesive film, and packaged and stored in a warehouse. The assembly was laminated for 20min at 160 ℃ and then subjected to an impact resistance test, and the film was laminated alone to test light transmittance.
Example 8
The formula of the elastomer resin system is as follows: antioxidant: a crosslinking agent: silane coupling agent: 0.5; the formula of the hot-melt thermosetting resin system is as follows: azelaic acid =100:2; elastomeric resin system: hot melt thermoset resin system: glass fiber =1:6:0.03. the materials are fully and uniformly mixed in proportion, added into an internal mixer for internal mixing, the plasticizing temperature is 60-90 ℃, transferred to an extruder for melt extrusion after complete plasticizing, the temperature and humidity of each area of the extruder and a die head are 80-90 ℃, extruded through a co-extrusion die head, cooled by a casting roller, shaped after an embossing process, finally subjected to thickness measurement, edge cutting and rolling, the toughness of a rolled adhesive film is observed, and packaged and stored in a warehouse. The assembly was laminated for 20min at 160 ℃ and then subjected to an impact resistance test, and the film was laminated alone to test light transmittance.
Example 9
The formula of the elastomer resin system is as follows: antioxidant: a crosslinking agent: silane coupling agent: 0.5; the formula of the hot-melt thermosetting resin system is as follows: azelaic acid =100:2; elastomeric resin system: hot melt thermosetting resin system: glass fiber =1:6:0.04. the materials are fully and uniformly mixed in proportion, added into an internal mixer for internal mixing, the plasticizing temperature is 60-90 ℃, transferred to an extruder for melt extrusion after complete plasticizing, the temperature and humidity of the extruder and each area of a die head are 80-90 ℃, extruded by a co-extrusion die head, cooled by a casting roller, shaped after an embossing process, finally measured in thickness, trimmed, rolled, observed in toughness of a rolled adhesive film, and packaged and stored in a warehouse. The assembly was laminated for 20min at 160 ℃ and then subjected to an impact resistance test, and the film was laminated alone to test light transmittance.
Example 10
The formula of the elastomer resin system is as follows: antioxidant: a crosslinking agent: silane coupling agent: 0.5; the formula of the hot-melt thermosetting resin system is as follows: azelaic acid =100:2; elastomer resin system: hot melt thermosetting resin system: glass fiber =1:6:0.05. the materials are fully and uniformly mixed in proportion, added into an internal mixer for internal mixing, the plasticizing temperature is 60-90 ℃, transferred to an extruder for melt extrusion after complete plasticizing, the temperature and humidity of each area of the extruder and a die head are 80-90 ℃, extruded through a co-extrusion die head, cooled by a casting roller, shaped after an embossing process, finally subjected to thickness measurement, edge cutting and rolling, the toughness of a rolled adhesive film is observed, and packaged and stored in a warehouse. The assembly was laminated for 20min at 160 ℃ and then subjected to an impact resistance test, and the film was laminated alone to test light transmittance.
TABLE 2-EXAMPLES 6-10 Performance test
Item Example 6 Example 7 Example 8 Example 9 Example 10
Glue film rolling Crushing Intact Intact Intact Intact
Impact resistance NO YES YES YES YES
Light transmittance 92.4 92.0 91.8 91.5 91.3
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims (6)

1. The photovoltaic adhesive film with the mechanical impact resistance is characterized in that the photovoltaic adhesive film with the mechanical impact resistance is made of an elastomer resin system, a hot-melt thermosetting resin system and glass fibers as basic materials;
the elastomer resin system is prepared by 95-99% of elastomer resin, 0.05-5% of antioxidant, 0.25-5% of free radical crosslinking agent and 0.1-4% of silane coupling agent; wherein the elastomer resin is POE;
the hot-melt thermosetting resin system is as follows:
70 to 99 percent of hot-melt epoxy modified acrylic resin and 1 to 30 percent of organic dicarboxylic acid;
the softening points of the elastomer resin system and the hot-melt thermosetting resin system are 50 to 130 ℃; the thickness of the photovoltaic adhesive film resisting the mechanical impact is 300 to 1000 mu m;
the elastomer resin system: hot melt thermoset resin system: the proportion of the glass fiber is 1:4-6:0.02.
2. the chemically resistant photovoltaic adhesive film of claim 1, wherein the antioxidant comprises a primary antioxidant and a secondary antioxidant; wherein,
the main antioxidant group comprises octadecyl beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate;
the auxiliary antioxidant comprises one or a compound of two of tris (4-nonylphenol) phosphite or tris (2, 4-di-tert-butylphenyl) phosphite.
3. The mechanical impact resistant photovoltaic film as set forth in claim 1, wherein said crosslinking agent comprises a crosslinking curing agent and a co-crosslinking agent; wherein,
the crosslinking curing agent comprises one or a mixture of two of organic peroxide or azo compound;
the organic peroxide comprises one or the combination of any more of cumyl peroxide, di-tert-butyl peroxide, diisopropylbenzene hydroperoxide, 2, 5-dimethyl-2, 5-di-tert-butyl peroxy hexane, n-butyl 4, 4-di (tert-amyl peroxy) valerate, tert-butyl peroxy 2-ethyl hexyl carbonate or ethyl 3, 3-di (tert-butyl peroxy) butyrate;
the auxiliary crosslinking agent comprises one or the combination of any more of triallyl isocyanurate, triallyl cyanurate, trimethylolpropane trimethacrylate or diethylene glycol dimethacrylate.
4. The optical shock resistant photovoltaic film as claimed in any one of claims 1-3, wherein the silane coupling agent is one or a combination of any two of vinyltriethoxysilane, vinyltrimethoxysilane, vinyltributylsilane, vinyltriacetoxysilane or vinyltris (β -methoxyethoxy) silane.
5. The resistive optical impact photovoltaic film of claim 1, wherein the organic dicarboxylic acid comprises one or a combination of any of maleic anhydride, maleic acid, fumaric acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, or sebacic acid.
6. The method for preparing a photovoltaic adhesive film resistant to mechanical impact according to claim 1, wherein the method comprises the following steps:
an elastomer resin system: hot melt thermosetting resin system: glass fiber is proportionally 1:4-6:0.02, fully mixing, carrying out banburying and plasticizing, carrying out extrusion casting process production, and carrying out embossing and shaping treatment to form the photovoltaic adhesive film with resistance to mechanical impact.
CN202011015244.9A 2020-09-24 2020-09-24 Photovoltaic adhesive film resisting mechanical impact and preparation method thereof Active CN112063337B (en)

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CN112646339A (en) * 2020-12-17 2021-04-13 苏州中来光伏新材股份有限公司 Packaging adhesive film resisting mechanical impact, preparation process and photovoltaic module
CN112812703A (en) * 2021-01-04 2021-05-18 苏州中来光伏新材股份有限公司 Photovoltaic adhesive film resisting mechanical impact, preparation process and photovoltaic module
CN116285516B (en) * 2023-01-28 2023-12-29 常州威斯敦粘合材料有限责任公司 Paint and coating for photovoltaic toughened glass and preparation method thereof

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