CN109266275A - Microspeaker vibrating diaphragm ball high temperature resistant type bonds glue film and top dome module - Google Patents
Microspeaker vibrating diaphragm ball high temperature resistant type bonds glue film and top dome module Download PDFInfo
- Publication number
- CN109266275A CN109266275A CN201811061504.9A CN201811061504A CN109266275A CN 109266275 A CN109266275 A CN 109266275A CN 201811061504 A CN201811061504 A CN 201811061504A CN 109266275 A CN109266275 A CN 109266275A
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- China
- Prior art keywords
- glue film
- top dome
- bonding glue
- vibrating diaphragm
- epoxy resin
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/12—Non-planar diaphragms or cones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
Abstract
The present invention relates to a kind of Microspeaker vibrating diaphragm top dome bonding glue films, in parts by weight, the bonding glue film includes the following raw material component: thermosetting epoxy resin 30~40%, thermoplastic elastomer resin 1~40%, curing agent relative to thermosetting epoxy resin 2~30%, coupling agent 0.5~10%, curing accelerator be that curing agent adds the 0.1~10% of quality, 1~50% part relative to resin total amount of filler.There is good caking property between bonding glue film of the invention and metal foil layer and substrate, top dome module process made of the present invention is simple, cost is relatively low, adhesive tape sections heat resisting temperature may be up to 300 DEG C or more, for the heat resisting temperature of top dome module up to 260 DEG C or more, the performance of top dome module of the invention is much better than conventional heat curing type composite balls backform block.
Description
Technical field
The invention belongs to speaker technology fields, and in particular to a kind of Microspeaker vibrating diaphragm ball high temperature resistant type bonding glue film
And top dome module.
Background technique
At present during loudspeaker transmits message, in order to reduce the noise of loudspeaker output, the complete of message is realized
It presents, guarantees the message effect that listener eventually receives, vibrating diaphragm top dome module, biggest advantage can be set in loudspeaker
It is that medium-high frequency response is excellent and directive property is wider, sound is enable effectively to transmit.With the need of portable electronic device in the market
Increase is asked, the requirement to quality is also continuously improved, this just needs loudspeaker towards small-sized, slim, high tone quality, powerful direction
Development.
Vibrating diaphragm top dome module is the core component of the acoustical devices such as loudspeaker, and the excellent resistance to mechanical fatigue needed resists
Aging and waterproofness.In view of these requirements, the material that vibrating diaphragm top dome module uses includes metal, ceramics, PI, synthesis fibre
Dimension, natural fiber, antimicrobial fiber, foam polymer precursor etc., people by the Material cladding with different characteristics at multilayered structure,
For manufacturing the vibrating diaphragm top dome of various functional balances, thus the shortcomings that making up homogenous material.
The composite construction that heading module mainly uses at present is followed successively by metal foil, foamed board and metal foil from top to bottom, is
There is enough adhesive strengths between guarantee each layer, need to use adhesive that metal foil is adhered on foamed board, it is common viscous
Mixture is mainly pressure sensitive, heat molten type, cross-linking type.As CN107880828A discloses a kind of Microspeaker vibrating diaphragm top dome with viscous
Gum deposit film and top dome module, but its caking property is only 465~488gf/cm, heat resistance is only 190~208 DEG C.
Summary of the invention
Technical problem to be solved by the invention is to provide a kind of good Microspeaker vibrating diaphragm ball high temperature resistant types of caking property
Bond glue film and top dome module.
In order to solve the above technical problems, the present invention adopts the following technical scheme that:
It is an object of the present invention to provide a kind of Microspeaker vibrating diaphragm top dome bonding glue films, according to mass percent
Meter, the bonding glue film includes the following raw material component: thermosetting epoxy resin 30~40%, thermoplastic elastomer resin 1~
40%, curing agent 0.6~12%, coupling agent 0.5~10%, curing accelerator 0.0006~1.2%, filler 0.3~40%.
Preferably, the thermosetting epoxy resin be BPA type epoxy resin, BPF type epoxy resin, BPE type epoxy resin,
BPS type epoxy resin, benzene oxygen modified epoxy, phenol aldehyde modified epoxy resin, alicyclic type epoxy resin, silicon-modified epoxy
One of resin is a variety of.Preferably, the thermosetting epoxy resin is to contain hydroxyl (OH) and aromatic rings in molecular structure
Or the resin of cycloaliphatic ring functional group.Wherein, hydroxyl (OH) increases the cohesive force and heat resistance of resin system for being crosslinked;Fragrance
Ring or aliphatic ring structure are both the heat resistance for increasing resin, and aromatic ring structure such as contains benzenoid form, naphthalene nucleus type, anthracene type, (folder) oxa-
Anthracene type, fluorenes ring type, biphenyl type etc.;Aliphatic ring structure such as cyclopropane, cyclobutane, penta ring of ring, hexamethylene etc..
From the viewpoint of the physical property of mobility and film for controlling resin, high temperature resistant Gumming glue film preferably comprises thermoplastic
Constituent of the property elastomer resin ingredient as high temperature resistant Gumming glue film.It can be used third as thermoplastic elastomer resin ingredient
Olefin(e) acid ester elastomer, polyamide, polyimide resin, polyester resin, polyurethane elastomer, polyvinyl butyral, fourth
Cyanogen rubber, butadiene-styrene rubber, butadiene rubber, neoprene, buttress rubber, silicon rubber, polyurethane rubber, fluorubber butyl rubber,
Polyester modification rubber, ethylene propylene diene rubber etc., from heat reactive resin Combination and with by the close contact of cohesive body
From the viewpoint of preferred acrylate elastomer, the composition amounts of thermoplastic elastomer resin ingredient is preferably 1~40 mass %, more
Further preferably 5~30%.Lower than lower limit additive amount, at low temperature, glue film is more crisp;Higher than upper limit additive amount, influence whether
The high temperature resistance of Gumming glue film entirety and bonding force with affixed object.Thermoplastic elastomer resin is generated to due to environmental change
The good tracing ability changed by the physics of cohesive body, can sufficiently inhibit by the bad connection between cohesive body.
Preferably, the thermoplastic elastomer resin is the thermoplastic elastomer (TPE) tree containing aromatic rings or cycloaliphatic ring in structure
Rouge, the purpose is to increase the heat resistance of resin.
Preferably, the curing agent be containing acid anhydride type curing agent, amine curing agent, imidazole curing agent, ureas curing agent,
One of hydrazides curing agent, cation curing agent are a variety of.
It is further preferred that the curing agent is selected from one of following type or a variety of:
Sanyo's chemical conversion: F7120, F7080, F7150;
Three new chemical industry Co., Ltd.: SI60L, SI80L, SI100L, SI145, SI150, SI160, SI180;
Hensel aradur2844, aradur3082 advanced in years, aradur3086, aradur3088, aradur9690,
aradur9506,aradur9664-1,aradur9717-1,aradur5200,aradur9577;
Mitsubishi Chemical YH306, YH307,170,171N, DICY;
The G8009L of Japanese first industrial pharmaceutical;
PN23, MY-24 of Japanese aginomoto, PN-H, PN-31, PN-40, PN50, AH-203, AH-154, AH-162,
VDH-J;
Aiz Chem.Fluid 111、URAcc 57;
EH15LS, EH3293S of Japanese rising sun electrification, EH4360S, EH4356S, EH5011S, EH3636AS, EH3842,
EH4357S, EH5031S etc..
Preferably, the curing accelerator be one of imidazoles, Lewis Acids and Bases, lewis acid, metal carboxylate or
It is a variety of.
It is further preferred that the curing accelerator is selected from one of following type or a variety of:
2MZA-PW, 2E4MZ-A, 2MAOK-PW, 2PHZ-PW, 2P4MHZ-PW of four countries' chemical conversion;
FXR-1020, FXR-1030, FXR-1081, FXR-1090FA, FXE-1000, FXB-1050 of Japanese T&K;
HX-3722, HX3741, HX3742, HX3748, HX-3941HP of Asahi Chemical Industry;
Three new chemical industry Co., Ltd.: SI60L, SI80L, SI100L, SI145, SI150, SI160, SI180;
Hensel aradur2844, aradur3082 advanced in years, aradur3086, aradur3088, aradur9690,
aradur9506、aradur9664-1、aradur9717-1、aradur5200、aradur9577。
Preferably, the coupling agent be one of titanate coupling agent, aluminate coupling agent, organo silane coupling agent or
It is a variety of.
It is further preferred that the titanate coupling agent such as isopropyl three (dioctylphyrophosphoric acid acyloxy) titanate esters, different
Propyl three (dioctyl phosphoric acid acyloxy) titanate esters, two oleic acid acyloxy of isopropyl (dioctyl phosphoric acid acyloxy) titanate esters, list
Alkoxy unsaturated fatty acid titanate esters, Di(dioctylpyrophosphato) ethylene titanate and triethanolamine chelate,
Di(dioctylpyrophosphato) ethylene titanate etc..
It is further preferred that the aluminate coupling agent is different if any aluminium titanium compound, two (ethyl acetoacetate base) aluminic acids
Propyl ester, two (acetylacetone,2,4-pentanedione) aluminic acid diisopropyl esters, isopropyl stearic acid oxygen base aluminum acid ester, isopropyl distearyl oxygroup aluminic acid
Ester etc..
It is further preferred that the organo silane coupling agent such as amino silane, epoxy silane, methacryloxy silicon
Alkane, vinyl silanes, alkyl silane, sulfuric silane, phenoxy group silane, isocyanatosilanes, silicon fluoride etc..
Preferably, the filler is inorganic microsphere, in inorfil, organic phosphonium flame retardant, organic nitrogen-containing fire retardant
It is one or more.
It is further preferred that the inorganic microsphere can be aluminium hydroxide, aluminium oxide, iron oxide, diamond dust, calcium carbonate,
Hollow glass bead, ceramic hollow microballon etc..
It is further preferred that the inorfil can be carbon fiber, metallic fiber, glass fibre etc..
Preferably, the filler is laminal filter, the laminal filter be mica powder, talcum powder, montmorillonite, in graphene
It is one or more.
The addition of filler can reduce exothermic peak in the curing process, reduce shrinking percentage and thermal stress, improve adhesive strength,
Increase thermal stability and hardness reduces cost simultaneously.
It is a further object to provide a kind of composite membrane, the composite membrane includes the bonding glue film, sets
Set in the one side of the bonding glue film coated face release film, the described bonding glue film is set another side on it is compound
Face release film.Release film is arranged in the two sides of composite membrane, consequently facilitating the transport of composite membrane and selling.
Preferably, the coated face release film is release PET or release paper.
Preferably, the coated face release film with a thickness of 5~300um.
Preferably, the composite surface release film is release PET or release paper.
Preferably, the composite surface release film with a thickness of 5~300um.
Third object of the present invention is to provide a kind of Microspeaker vibrating diaphragm top dome modules, and the top dome module includes base
Plate, positioned at the substrate one side the first metal foil layer, positioned at the substrate another side the second metal foil layer, setting exist
First between first metal foil layer and the substrate bonds glue film, second metal foil layer and institute is arranged in
The second bonding glue film between the substrate stated, the first bonding glue film and the second bonding glue film independently are and are selected from
The bonding glue film.
The top dome module presses solidification realization by hot-rolling and is adhesively fixed.
Preferably, the substrate is high molecular foam material, and foaming aperture is 0.005~0.100mm, the substrate
With a thickness of 0.01~0.5mm.
It is further preferred that the high molecular foam material is one of PET, PU, PC, PMI foamed material.
Preferably, first metal foil layer and second metal foil layer are independently selected from aluminium alloy, titanium alloy, copper foil
One of, the thickness of first metal foil layer and second metal foil layer independently is 0.001~0.100mm.
Preferably, the thickness of the first bonding glue film and the described second bonding glue film independently be 0.001~
0.100mm。
Due to the implementation of above technical scheme, the invention has the following advantages over the prior art:
There is good caking property, top dome made of the present invention between bonding glue film of the invention and metal foil layer and substrate
Module process is simple, and cost is relatively low, and the glass transition temperatures of adhesive tape sections is high, top dome module it is heat-resist, it is of the invention
The performance of top dome module is much better than conventional heat curing type composite balls backform block.
Figure of description
Attached drawing 1 is the structural schematic diagram of composite membrane;
Attached drawing 2 is the structural schematic diagram of top dome module.
Specific embodiment
The present invention will be further described in detail combined with specific embodiments below, but the present invention is not limited to following implementations
Example.Implementation condition used in the examples can do further adjustment according to specifically used different requirements, the implementation being not specified
Condition is the normal condition in the industry.It is obtained by those of ordinary skill in the art without making creative efforts
All other embodiment, shall fall within the protection scope of the present invention.
Embodiment 1
A kind of composite membrane, including bonding glue film 1, the coated face release film 11 being arranged in the one side of bonding glue film 1, setting
Composite surface release film 13 on the another side of bonding glue film 1.
Embodiment 2
According to mass percent meter, the material component for bonding glue film 1 is as follows: thermosetting epoxy resin 30%, thermoplastic elastomehc
Property body resin 19%, curing agent 5%, coupling agent 5%, curing accelerator 1%, filler 40%.
Thermosetting epoxy resin is the epoxy resin of 1000 trade mark of XD purchased from Mitsubishi Chemical Ind;Thermoplastic elastomer (TPE)
Resin is the acrylate elastomer of the Vamac G trade mark purchased from E.I.Du Pont Company;Curing agent is PN50;Coupling agent is amino silicone
Alkane;Curing accelerator is imidazoles;Filler is aluminium hydroxide.
Embodiment 3
It is substantially the same manner as Example 2, the difference is that: thermosetting epoxy resin 40%, thermoplastic elastomer resin
10%, curing agent 5%, coupling agent 4%, curing accelerator 1%, filler 40%.
Embodiment 4
It is substantially the same manner as Example 2, the difference is that: thermosetting epoxy resin 40%, thermoplastic elastomer resin
30%, curing agent 12%, coupling agent 7.5%, curing accelerator 0.5%, filler 10%.
Embodiment 5
It is substantially the same manner as Example 2, the difference is that: thermosetting epoxy resin is the XD purchased from Mitsubishi Chemical Ind
The epoxy resin of 1000 trades mark;Thermoplastic elastomer resin is the nitrile rubber of the XER91 purchased from JSR company;Curing agent is
G8009L;Coupling agent is isopropyl stearic acid oxygen base aluminum acid ester;Curing accelerator is HX-3722;Filler is carbon fiber.
Embodiment 6
It is substantially the same manner as Example 2, the difference is that: thermosetting epoxy resin is purchased from Mitsubishi Chemical Ind
The epoxy resin of the XD1000 trade mark;Thermoplastic elastomer resin is the ethylene propylene diene rubber purchased from Carlyle company;Curing agent is
F7120;Coupling agent is two oleic acid acyloxy of isopropyl (dioctyl phosphoric acid acyloxy) titanate esters;Curing accelerator is 2MZA-PW;
Filler is mica powder.
Comparative example 1
It is substantially the same manner as Example 2, the difference is that: thermosetting epoxy resin 20%, thermoplastic elastomer resin
50%, curing agent 10%, coupling agent 5%, curing accelerator 1%, filler 14%.
Comparative example 2
It is substantially the same manner as Example 2, the difference is that: thermosetting epoxy resin 50%, thermoplastic elastomer resin
4%, curing agent 15%, coupling agent 5%, curing accelerator 2%, filler 24%.
Embodiment 7
A kind of Microspeaker vibrating diaphragm top dome module, including substrate 3, positioned at substrate 3 one side the first metal foil layer 2,
Positioned at the another side of substrate 3 the second metal foil layer 4, be arranged between the first metal foil layer 2 and substrate 3 first bonding glue film
1-1, second be arranged between the second metal foil layer 4 and substrate 3 bond glue film 1-2, the first bonding glue film 1-1 and the second bonding
Glue film 1-2, which is that embodiment 2 is obtained, bonds glue film, bond glue film with a thickness of 0.001mm.
Substrate 3 be PET foamed material, foaming aperture 0.005mm, substrate 3 with a thickness of 0.01mm.
First metal foil layer 2 and the second metal foil layer 4 are aluminium alloy, the thickness of the first metal foil layer 2 and the second metal foil layer 4
Degree is 0.001mm.
Embodiment 8
It is substantially the same manner as Example 7, the difference is that: the first bonding glue film 1-1 and the second bonding glue film 1-2 is reality
Apply the bonding glue film obtained of example 3.
Embodiment 9
It is substantially the same manner as Example 7, the difference is that: the first bonding glue film 1-1 and the second bonding glue film 1-2 is reality
Apply the bonding glue film obtained of example 4.
Embodiment 10
It is substantially the same manner as Example 7, the difference is that: the first bonding glue film 1-1 and the second bonding glue film 1-2 is reality
Apply the bonding glue film obtained of example 5.
Embodiment 11
It is substantially the same manner as Example 7, the difference is that: the first bonding glue film 1-1 and the second bonding glue film 1-2 is reality
Apply the bonding glue film obtained of example 6.
Embodiment 12
It is substantially the same manner as Example 7, the difference is that: bond glue film with a thickness of 0.040mm.Substrate 3 is PMI foaming
Material, foaming aperture 0.040mm, substrate 3 with a thickness of 0.3mm.First metal foil layer 2 and the second metal foil layer 4 are copper
Foil, the first metal foil layer 2 and the second metal foil layer 4 with a thickness of 0.050mm.
Comparative example 3
It is substantially the same manner as Example 7, the difference is that: the first bonding glue film 1-1 and the second bonding glue film 1-2 is pair
Ratio 2 is obtained to bond glue film.
Performance test experiment
1, bond the appearance of glue film: visual adhesive glue film outward appearance, whether there is or not starved, pin hole, foreign matter, caliper uniformities etc.
Judgment criteria:
Zero: uniform (within tolerance 1um) without starved, pin hole, foreign matter, thickness
△: without starved, pin hole, foreign matter, thickness floats larger (within thickness deviation 2um)
×: there are starved, pin hole, foreign matter, thickness deviation >=2um
2, the glass transition temperature of glue film is bonded
Test method: sampling pure 10~15mg of glue film, be put in standard crucible, carries out at the uniform velocity ascending, descending using 10K/min
Temperature, between -40 DEG C of temperature range~300 DEG C, the intermediate value for changing step in second of heating curve is separation transition temperature
(referring in detail to ASTM E794-2001)
3, the appearance of vibrating diaphragm top dome module:
Zero: no bulge, without layering, without corrugation
×: bulge, layering, corrugation
4, the caking property test of vibrating diaphragm top dome module
By vibrating diaphragm top dome sample, the batten of 15cm*15cm is cut into, room temperature carries out 180 ° of peel tests, records peeling force
Test value, the higher the better for followability.
5, the heat resistance of vibrating diaphragm top dome module
With roll squeezer by adhesive glue film transfer to metal foil surface (80 DEG C of heat roller temperature, pressure 0.4MPa), heat is reused
Roller will carry out compound (150 DEG C of combined temp) into vibrating diaphragm top dome with glue metal foil and PMI foamed board, solidify 3h, sample at 160 DEG C
Product size 5cm × 20cm toasts 3min using baking oven at 260 DEG C, observes cosmetic variation.
Zero: appearance is without layering, no bulge, no corrugation
△: appearance has slight corrugation, no bulge, no layering
×: appearance corrugation, bulge, layering
6, DH168 test method
Vibrating diaphragm top dome sample (5cm*20cm size) is placed on 85 DEG C, in 85% climatic chamber of relative humidity, record
Cosmetic variation after initial appearance and constant temperature and humidity 168h,
Determinating reference:
After zero: DH168, appearance is without layering, no bulge, no corrugation
After △: DH168, appearance has slight corrugation, no bulge, no layering
×: after DH168, appearance corrugation, bulge, layering
The experimental result of embodiment 2 to 6, comparative example 1 and comparative example 2 is shown in Table 1, embodiment 7 to 14, comparative example 3 and comparison
The experimental result of example 4 is shown in Table 2.
Table 1
Table 2
Experiment conclusion
Compared with comparative example, vibrating diaphragm top dome module produced by the present invention has good adhesion and high-temperature stability, furthermore
The shape feature of current material can also be kept in appearance.
The present invention is described in detail above, its object is to allow the personage for being familiar with this field technology that can understand this
The content of invention is simultaneously implemented, and it is not intended to limit the scope of the present invention, all Spirit Essence institutes according to the present invention
The equivalent change or modification of work, should be covered by the scope of protection of the present invention.
Claims (9)
1. a kind of Microspeaker vibrating diaphragm top dome bonding glue film, it is characterised in that: according to mass percent meter, the adhesive glue
Film includes the following raw material component: thermosetting epoxy resin 30~40%, thermoplastic elastomer resin 1~40%, curing agent 0.6~
12%, coupling agent 0.5~10%, curing accelerator 0.0006~1.2%, filler 0.3~40%;
The thermosetting epoxy resin is BPA type epoxy resin, BPF type epoxy resin, BPE type epoxy resin, BPS type asphalt mixtures modified by epoxy resin
Rouge, benzene oxygen modified epoxy, phenol aldehyde modified epoxy resin, alicyclic type epoxy resin, one in modifying epoxy resin by organosilicon
Kind is a variety of;
The thermoplastic elastomer resin is acrylate elastomer, polyamide, polyimide resin, polyester resin, gathers
Urethane elastomer, polyvinyl butyral, nitrile rubber, butadiene-styrene rubber, butadiene rubber, neoprene, buttress rubber, silicon rubber
One of glue, polyurethane rubber, fluorubber butyl rubber, polyester modification rubber, ethylene propylene diene rubber are a variety of;
The curing agent is containing acid anhydride type curing agent, amine curing agent, imidazole curing agent, ureas curing agent, hydrazides solidification
One of agent, cation curing agent are a variety of;
The curing accelerator is one of imidazoles, Lewis Acids and Bases, lewis acid, metal carboxylate or a variety of.
2. Microspeaker vibrating diaphragm top dome according to claim 1 bonding glue film, it is characterised in that: the coupling agent is
One of titanate coupling agent, aluminate coupling agent, organo silane coupling agent are a variety of.
3. Microspeaker vibrating diaphragm top dome according to claim 1 bonding glue film, it is characterised in that: the filler is nothing
One of machine microballoon, inorfil, organic phosphonium flame retardant, organic nitrogen-containing fire retardant are a variety of, and the inorganic microsphere is
One of aluminium hydroxide, aluminium oxide, iron oxide, diamond dust, calcium carbonate, hollow glass bead, ceramic hollow microballon are a variety of;
The inorfil is one of carbon fiber, metallic fiber, glass fibre or a variety of.
4. Microspeaker vibrating diaphragm top dome according to claim 1 bonding glue film, it is characterised in that: the filler is piece
Shape filler, the laminal filter are one of mica powder, talcum powder, montmorillonite, graphene or a variety of.
5. a kind of composite membrane, it is characterised in that: the composite membrane includes adhesive glue described in any one of Claims 1-4
Film, is arranged on the another side of the bonding glue film coated face release film being arranged in the one side of the bonding glue film
Composite surface release film.
6. a kind of Microspeaker vibrating diaphragm top dome module, it is characterised in that: the top dome module includes substrate, is located at the substrate
One side the first metal foil layer, positioned at the substrate another side the second metal foil layer, first metal is set
First between layers of foil and the substrate bonds glue film, is arranged between second metal foil layer and the substrate
Second bonding glue film, the first bonding glue film and the second bonding glue film independently are in Claims 1-4
Described in any item bonding glue films.
7. Microspeaker vibrating diaphragm top dome module according to claim 6, it is characterised in that: the substrate is macromolecule hair
Foam material, foaming aperture be 0.005~0.100mm, the substrate with a thickness of 0.01~0.5mm.
8. Microspeaker vibrating diaphragm top dome module according to claim 6, it is characterised in that: first metal foil layer and
Second metal foil layer is independently selected from one of aluminium alloy, titanium alloy, copper foil, first metal foil layer and described
The thickness of two metal foil layers independently is 0.001~0.100mm.
9. Microspeaker vibrating diaphragm top dome module according to claim 6, it is characterised in that: it is described first bonding glue film and
The thickness of the second bonding glue film independently is 0.001~0.100mm.
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CN201811061504.9A CN109266275A (en) | 2018-09-12 | 2018-09-12 | Microspeaker vibrating diaphragm ball high temperature resistant type bonds glue film and top dome module |
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CN201811061504.9A CN109266275A (en) | 2018-09-12 | 2018-09-12 | Microspeaker vibrating diaphragm ball high temperature resistant type bonds glue film and top dome module |
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Cited By (14)
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CN109880550A (en) * | 2019-03-01 | 2019-06-14 | 苏州鼎汉材料科技有限公司 | A kind of hot setting adhesive, preparation method and the adhesive tape comprising the adhesive |
CN110708639A (en) * | 2019-10-31 | 2020-01-17 | 歌尔股份有限公司 | Vibrating diaphragm for miniature sound generating device and miniature sound generating device |
CN110708636A (en) * | 2019-10-31 | 2020-01-17 | 歌尔股份有限公司 | Sound generating device's vibrating diaphragm and sound generating device |
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CN110784817A (en) * | 2019-10-16 | 2020-02-11 | 深圳创维-Rgb电子有限公司 | Preparation method of loudspeaker diaphragm, loudspeaker diaphragm and loudspeaker monomer |
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CN111263274B (en) * | 2020-03-31 | 2021-11-30 | 歌尔股份有限公司 | Vibrating diaphragm, sound production device and electronic device |
CN114105667A (en) * | 2020-08-28 | 2022-03-01 | 常州驰科光电科技有限公司 | Novel ball top material and preparation method thereof |
CN112063337A (en) * | 2020-09-24 | 2020-12-11 | 苏州中来光伏新材股份有限公司 | Photovoltaic adhesive film resisting mechanical impact and preparation method thereof |
CN112680154A (en) * | 2020-12-21 | 2021-04-20 | 河南天濮环保科技有限公司 | High initial adhesion epoxy adhesive film and preparation method thereof |
CN113969110A (en) * | 2021-11-11 | 2022-01-25 | 美特科技(苏州)有限公司 | Elastomer adhesive, loudspeaker device adopting elastomer adhesive and preparation method of loudspeaker device |
CN114363775A (en) * | 2022-01-11 | 2022-04-15 | 苏州赛伍应用技术股份有限公司 | Vibrating diaphragm material and preparation process thereof |
CN114507495A (en) * | 2022-03-09 | 2022-05-17 | 上海回天新材料有限公司 | Low-modulus high-Tg epoxy resin adhesive and preparation method thereof |
CN114561179A (en) * | 2022-03-09 | 2022-05-31 | 上海回天新材料有限公司 | High-temperature-resistant heat-conducting oil epoxy resin sealant and preparation method thereof |
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