CN111263274B - Vibrating diaphragm, sound production device and electronic device - Google Patents
Vibrating diaphragm, sound production device and electronic device Download PDFInfo
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- CN111263274B CN111263274B CN202010248898.XA CN202010248898A CN111263274B CN 111263274 B CN111263274 B CN 111263274B CN 202010248898 A CN202010248898 A CN 202010248898A CN 111263274 B CN111263274 B CN 111263274B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
- H04R7/06—Plane diaphragms comprising a plurality of sections or layers
- H04R7/10—Plane diaphragms comprising a plurality of sections or layers comprising superposed layers in contact
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
- H04R2307/025—Diaphragms comprising polymeric materials
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2307/00—Details of diaphragms or cones for electromechanical transducers, their suspension or their manufacture covered by H04R7/00 or H04R31/003, not provided for in any of its subgroups
- H04R2307/027—Diaphragms comprising metallic materials
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- Engineering & Computer Science (AREA)
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
Abstract
The invention discloses a vibrating diaphragm, a sound production device and an electronic device, wherein the vibrating diaphragm comprises a first metal layer, a foaming material layer and a second metal layer, the foaming material layer is arranged on the first metal layer, the second metal layer is arranged on the foaming material layer, the foaming material layer is provided with a material shortage part opposite to the first metal layer, and the second metal layer is connected with the first metal layer after being sunken from the position corresponding to the material shortage part. The vibrating diaphragm is applied to the sound generating device or the electronic device, so that heat in the sound generating device or the electronic device can be dissipated in time, the temperature rise is reduced, and the acoustic performance of the sound generating device and the electronic device is improved.
Description
Technical Field
The invention relates to the technical field of electroacoustic products, in particular to a vibrating diaphragm, a sound production device and an electronic device.
Background
With the development of mobile phone technology, the user experience demand for the mobile phone increases, and most of the mobile phones currently use smart PA (intelligent power amplifier) technology as the mainstream. Smart PA currently has two main modules, temperature protection and amplitude protection, which limit the power of the speaker mainly according to one of temperature or amplitude.
When the Smart PA technology is applied to the loudspeaker, the temperature resistance of each part based on the loudspeaker is limited, and in order to prevent the loudspeaker from being burnt out by high temperature, the temperature protection module can carry out limited protection on the temperature of the loudspeaker. In some current technologies, in order to increase the loudness of a speaker, the power of the speaker is increased, however, the electroacoustic efficiency of the speaker is very low, so that most of the input power becomes heat, and the current speaker has a poor heat dissipation effect, and under the limitation of temperature protection, the sound production capability of the speaker generating high heat is limited, and the maximum loudness cannot be achieved.
Disclosure of Invention
The invention mainly aims to provide a vibrating diaphragm, a sound production device and an electronic device, and aims to solve the technical problems that the existing loudspeaker device or the electronic device with the sound production function is poor in heat dissipation effect, limited in sound production capacity and incapable of meeting the requirement of maximum loudness.
In order to achieve the above object, the present invention provides a diaphragm, including a vibrating plate located at a central position, the diaphragm including:
a first metal layer;
a foam material layer disposed on the first metal layer; and
a second metal layer disposed on the foam layer;
the foaming material layer is provided with a material shortage part opposite to the first metal layer;
and the second metal layer is connected with the first metal layer after being sunken at the position corresponding to the material shortage part.
Optionally, the material shortage portion is a ring-shaped structure arranged around the edge portion of the first metal layer, and the edge portion of the second metal layer extends to the edge portion of the first metal layer along the outer peripheral wall of the foam material layer and is connected with the edge portion of the first metal layer.
Optionally, the distance between the outer peripheral edge of the foaming material layer and the outer peripheral edge of the first metal layer is the width of the material shortage portion, and the width is set to be 0.2-0.5 mm.
Optionally, the material shortage portion is a through hole penetrating through the upper surface and the lower surface of the foaming material layer, and the second metal layer extends onto the first metal layer along the peripheral wall of the through hole and is connected with the first metal layer.
Optionally, the shape of the through hole includes any one of a circle, a square, and a triangle.
Optionally, thermosetting epoxy films are arranged between the first metal layer and the foaming material layer, between the second metal layer and the foaming material layer, and between the first metal layer and the second metal layer, and are bonded by a hot-pressing method.
Optionally, the material of the foaming material layer is polymethacrylimide foam material.
Optionally, the first metal layer is made of any one of aluminum, aluminum alloy, copper and copper alloy;
the second metal layer is made of any one of aluminum, aluminum alloy, copper and copper alloy.
In order to achieve the above object, the present invention further provides a sound generating device, where the sound generating device includes a vibration system, the vibration system includes the above vibrating diaphragm, and the vibrating diaphragm further includes an elastic suspension portion connected to the vibrating plate of the vibrating diaphragm.
In addition, the invention also provides an electronic device which comprises a shell, wherein the sound production device is arranged in the shell.
According to the vibrating diaphragm, the sound generating device and the electronic device in the embodiment of the invention, by improving the structure of the vibrating diaphragm, for example, the foaming material layer is arranged at the material lacking part opposite to the first metal layer, and the position of the second metal layer opposite to the material lacking part is arranged to be concave and then is connected with the first metal layer, so that the heat on the first metal layer is conducted to the second metal layer at the position where the first metal layer is connected with the second metal layer to be conducted to the air through the second metal layer, the heat in the sound generating device or the electronic device is timely dissipated, the temperature rise is reduced, the limitation of the temperature protection on the sound generating capacity can be effectively avoided, and the sound generating device or the electronic device can achieve better loudness.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a first embodiment of a vibrating plate in a diaphragm according to the present invention;
FIG. 2 is a schematic cross-sectional view taken along A-A of FIG. 1;
FIG. 3 is a schematic structural diagram of a second embodiment of a vibrating plate in a diaphragm according to the present invention;
FIG. 4 is a schematic cross-sectional view taken along B-B of FIG. 3;
FIG. 5 is a schematic structural diagram of a third embodiment of a vibrating plate in a diaphragm according to the present invention;
FIG. 6 is a schematic cross-sectional view taken along C-C of FIG. 5;
fig. 7 is a schematic diagram illustrating a comparison of temperature rising speeds of sound generating devices according to various embodiments of the present invention after a diaphragm is used;
fig. 8 is a schematic diagram showing the comparison between the loudness of sound generated by the sound generating device provided by the invention after the diaphragm of the first embodiment is adopted and the conventional sound generating device;
FIG. 9 is a schematic diagram showing the comparison between the loudness variation of sound generated by a sound generating device using a diaphragm according to a second embodiment of the present invention and a conventional sound generating device;
FIG. 10 is a schematic diagram illustrating the total harmonic distortion change of the sound generating device according to the present invention after using the diaphragm of the first embodiment as compared with a conventional sound generating device;
fig. 11 is a schematic diagram illustrating the total harmonic distortion change of the sound generating device provided by the present invention after the diaphragm of the second embodiment is adopted, compared with the conventional sound generating device.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 10 | A |
20 | |
| 30 | |
21 | |
| 40 | |
1 | Vibrating plate |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but on the basis of the realization of the technical solutions by a person skilled in the art, when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent, and the technical solutions are not within the protection scope of the present invention.
The invention provides a vibrating diaphragm which is used for vibrating and sounding of a sounding device and is also used for dissipating heat of a voice coil of the sounding device.
Vibrating diaphragm is as sound generating mechanism's vibration position, vibrates under the effect of voice coil loudspeaker voice coil, the vibrating diaphragm is as vibration position, and its vibration effect is guaranteed to the existing requirement, need have certain intensity again, avoids vibrating the easy deformation of in-process, therefore vibrating diaphragm central point puts and sets up the vibration board, and the vibration board that central point put set up adopts the middle intensity that sets up foaming material layer (for example PMI) reinforcing vibration board, specifically foaming material layer's material is polymethacrylimide foam material, and foaming material layer both sides surface layer sets up the metal level, and middle foaming material layer belongs to the high empty material of aperture, has better thermal-insulated heat preservation effect, and the heat that the voice coil loudspeaker voice coil produced can not in time give off in sound generating mechanism or the outside air of electron device. This embodiment is through the improvement to the vibrating diaphragm structure for the vibrating diaphragm structure satisfies under the advance of intensity requirement, has good radiating effect, in sound generating mechanism or electron device are used, can in time give off the inside heat of sound generating mechanism or electron device to the outside air, improves the temperature rise effect, and then can increase sound generating mechanism or electron device's sound generating capacity, increase loudness, following concrete description is to the concrete improvement of vibrating diaphragm structure in this embodiment:
referring to fig. 1 to 6, the diaphragm in this embodiment includes a diaphragm 1 located at a central position, the diaphragm 1 includes a first metal layer 10, a foam material layer 20, and a second metal layer 30, wherein the foam material layer 20 is disposed on the first metal layer 10, the second metal layer 30 is disposed on the foam material layer 20, the foam material layer 20 is provided with a material shortage portion 21 opposite to the first metal layer 10, a position of the second metal layer 30 corresponding to the material shortage portion 21 is recessed and then connected to the first metal layer 10, based on the first metal layer 10 and the second metal layer 30 having a direct contact position, a sound generating device or an electronic device can conduct heat on the first metal layer 10 to the second metal layer 30 through the contact position of the first metal layer 10 and the second metal layer 30, and the heat is rapidly dissipated through the second metal layer 30.
Specifically, when the vibrating diaphragm is applied to the sound generating device, the second metal layer 30 is located on the vibrating plate and is far away from the position of the voice coil, the first metal layer 10 is connected with the voice coil, and partial heat generated by the voice coil is dissipated into the air through the second metal layer 30 and the position where the first metal layer 10 is connected together, so that the purpose of quickly dissipating heat of the heat inside the sound generating device or the electronic device is achieved, and the temperature of the internal part of the sound generating device or the electronic device is reduced. Therefore, this embodiment is through improving the structure of the vibration board 1 of vibrating diaphragm, set up in the expanded material layer 20 with the relative scarce material portion 21 of first metal level 10, second metal level 30 in lack material portion 21 position recessed back with first metal level 10 is connected, so the position that first metal level 10 and second metal level 30 are connected with the heat conduction on the first metal level 10 extremely on the second metal level 30, then through second metal level 30 conduction to the air in, realize in time distributing away the heat among sound generating mechanism or the electron device, reduce the purpose of temperature rise, can effectively avoid the restriction of temperature protection to sound generating capacity for sound generating mechanism or electron device reach better loudness.
Further, thermosetting epoxy films 40 are arranged between the first metal layer 10 and the foam material layer 20, between the second metal layer 30 and the foam material layer 20, and between the first metal layer 10 and the second metal layer 30, and are bonded by a hot pressing method, wherein the epoxy films 40 have certain heat resistance, and the generated heat does not melt or deteriorate the epoxy films 40 in the working process of the diaphragm, so as to ensure the stability between the first metal layer 10 and the foam material layer 20, between the second metal layer 30 and the foam material layer 20, and between the first metal layer 10 and the second metal layer 30, and the first metal layer 10 and the foam material layer 20, between the second metal layer 30 and the foam material layer 20, and between the first metal layer 10 and the second metal layer 30 can also be connected by epoxy adhesives with high thermal conductivity and high bonding strength.
It is understood that the material lacking portion 21 penetrates through the foam material layer 20, and the second metal layer 30 is connected with the first metal layer 10 along the material lacking portion 21. The material shortage portion 21 is provided in different sizes, the heat dissipation effect between the first metal layer 10 and the second metal layer 30 is different, and the larger the material shortage portion 21 is, the larger the contact area between the first metal layer 10 and the second metal layer 30 is, the better the heat dissipation effect is, but the larger the material shortage portion 21 is, the lower the stability of the diaphragm is, and the diaphragm is easy to deform. Therefore, the size of the starved area 21 needs to be set according to actual conditions.
In one embodiment, as shown in fig. 1 to 4, the material shortage portion 21 is a ring-shaped structure disposed around the edge portion of the first metal layer 10, and the edge portion of the second metal layer 30 extends to the edge portion of the first metal layer 10 along the outer peripheral wall of the foam material layer 20 and is connected with the edge portion of the first metal layer 10.
That is, an outer ring notch is formed in the thickness direction of the foam material layer 20, that is, an outer ring of a side surface of the foam material layer 20 is retracted by a certain distance, so that the material lacking portion 21 is formed between the foam material layer 20 and an edge of the first metal layer 10, an exposed surface of the first metal layer 10 is increased, the edge portion of the first metal layer 10 extends to the edge portion of the first metal layer 10 along the outer peripheral wall of the foam material layer 20 and is attached to the exposed surface of the first metal layer 10 to form a heat conducting surface, the foam material layer 20 is not arranged in the middle of the heat conducting surface, the heat conducting stroke is shortened, and heat on the first metal layer 10 can be directly radiated to the outside through the second metal layer 30, which is more beneficial to improving the heat radiation effect of the diaphragm.
It is understood that the distance between the outer circumference of the foam material layer 20 and the outer circumference of the first metal layer 10 is the width of the material shortage 21, and the width is set between 0.2mm and 0.5 mm.
In an alternative embodiment, the width is 0.2 mm. Referring to fig. 7, fig. 8 and fig. 10, through testing and comparison with a conventional sound generating device, after the diaphragm in this embodiment is applied to the sound generating device or the electronic device, the temperature rise of the sound generating device or the electronic device is reduced by more than 1.5 ℃, and the loudness and performance of the sound generating device or the electronic device are not lost, so the sound generating performance of the sound generating device or the electronic device in this embodiment can be improved.
In a further alternative embodiment, referring to fig. 3 and 4, the width is 0.5 mm. Referring to fig. 7, 9 and 11, after testing and comparing with the conventional sound generating device, the acoustic performance of the sound generating device or the electronic device is not lost and the low frequency distortion is slightly improved after the diaphragm of the present embodiment is applied to the sound generating device or the electronic device. The temperature rise is reduced by more than 5 ℃ compared with the conventional diaphragm design. Compared with the first embodiment, the second metal layer 30 and the first metal layer 10 in the material shortage portion 21 have a large contact area, relatively small thermal resistance, fast heat transfer and obvious temperature rise reduction effect.
In another embodiment, as shown in fig. 5 and 6, the material shortage portion 21 is a through hole penetrating through the upper surface and the lower surface of the foam material layer 20, and the second metal layer 30 extends onto the first metal layer 10 along the peripheral wall of the through hole and is connected with the first metal layer 10.
In this embodiment, the through hole penetrates through the foam material layer 20, the second metal layer 30 extends to the first metal layer 10 along the hole wall of the through hole and is connected with the first metal layer 10, and the first metal layer 10 discharges heat to the air through the second metal layer 30, so as to achieve heat dissipation.
Further, be equipped with a plurality ofly on the foaming material layer 20 the through-hole, and a plurality of through-hole evenly distributed is in on the foaming material layer 20, second metal level 30 is along each the pore wall of through-hole extends to first metal level 10 to dispel the heat, make the heat dissipation even, prevent that the local temperature among sound generating mechanism or the electron device from rising too fast and restrict sound generating mechanism's sound producing effect, further improve sound generating mechanism's performance.
It can be understood that, after the diaphragm in this embodiment is applied to the sound generating device, the temperature rise reduction effect is similar to that in the above embodiment, and the loudness and performance of the sound generating device are not lost.
In a preferred embodiment, there are 4 through holes, and 4 through holes are uniformly distributed on the foam material layer 20.
It is understood that the shape of the through holes may be regular, or irregular, such as circular, square or triangular, and the shape and number of the through holes are not limited herein,
it is understood that, in the above embodiments, the first metal and the second metal may be low-density, high-modulus, and high-thermal conductivity and thermal emissivity metals, for example, the first metal layer 10 may be any one of aluminum, aluminum alloy, copper and copper alloy; the second metal layer 30 is made of any one of aluminum, aluminum alloy, copper and copper alloy. The pure metal material makes the intensity of the vibrating diaphragm reach the requirement of the amplitude of the sound generating device.
In order to achieve the above object, the present invention further provides a sound generating device, which includes a vibration system, wherein the vibration system includes a diaphragm, and the diaphragm includes a vibration plate 1 located at a central position and an elastic suspension portion connected to the vibration plate 1;
wherein, vibration board 1 includes first metal level 10, expanded material layer 20 and second metal level 30, wherein, expanded material layer 20 sets up on the first metal level 10, second metal level 30 sets up on expanded material layer 20, expanded material layer 20 be equipped with relative scarce material portion 21 of first metal level 10, second metal level 30 with the position that lacks material portion 21 corresponds is sunken the back with first metal level 10 links together, based on first metal level 10 with second metal level 30 has direct contact's position, sound generating mechanism or electron device can pass through first metal level 10 with the position that second metal level 30 contacted will heat on the first metal level 10 conducts on the second metal level 30, through second metal level 30 gives out the heat.
Further, the invention also provides an electronic device, which comprises a shell, wherein a sound generating device is arranged in the shell, the sound generating device comprises a vibration system, the vibration system comprises a vibrating diaphragm, and the vibrating diaphragm comprises a vibrating plate 1 positioned at the central position and an elastic suspension part connected with the vibrating plate 1. In this embodiment, what the vibrating diaphragm adopted was above-mentioned each embodiment vibrating diaphragm, based on the vibrating diaphragm has the radiating effect, sets up on electronic device the vibrating diaphragm can be with the electronic device on some heat discharge outside, reduce electronic device's temperature rise, can avoid the restriction of temperature protection to sound generating capacity for electronic device reaches better loudness.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (9)
1. A vibrating diaphragm, including the vibration board that is located central point, its characterized in that: the vibration plate includes:
a first metal layer;
a foam material layer disposed on the first metal layer; and
a second metal layer disposed on the foam layer;
the foaming material layer is provided with a material shortage part opposite to the first metal layer;
the second metal layer is connected with the first metal layer after being concave downwards at the position corresponding to the material shortage part;
the short material part comprises a ring-shaped structure arranged around the edge part of the first metal layer, and the edge part of the second metal layer extends to the edge part of the first metal layer along the peripheral wall of the foaming material layer and is connected with the edge part of the first metal layer.
2. The diaphragm of claim 1, wherein: the distance between the outer peripheral edge of the foaming material layer and the outer peripheral edge of the first metal layer is the width of the material shortage portion, and the width is set to be 0.2-0.5 mm.
3. The diaphragm of claim 1, wherein: the material shortage part comprises a through hole penetrating through the upper surface and the lower surface of the foaming material layer, and the second metal layer extends to the first metal layer along the peripheral wall of the through hole and is connected with the first metal layer.
4. The diaphragm of claim 3, wherein: the shape of the through hole includes any one of a circle, a square and a triangle.
5. The diaphragm of claim 1, wherein: thermosetting epoxy glue films are arranged between the first metal layer and the foaming material layer, between the second metal layer and the foaming material layer and between the first metal layer and the second metal layer, and are bonded by adopting a hot-pressing mode.
6. The diaphragm of claim 1, wherein: the foaming material layer is made of polymethacrylimide foam material.
7. The diaphragm of claim 1, wherein: the first metal layer is made of any one of aluminum, aluminum alloy, copper and copper alloy;
the second metal layer is made of any one of aluminum, aluminum alloy, copper and copper alloy.
8. A sound generating device, characterized by: the sound generating device comprises a vibration system, wherein the vibration system comprises the diaphragm of any one of claims 1 to 7, and the diaphragm further comprises an elastic suspension part connected with the vibration plate of the diaphragm.
9. An electronic device, characterized in that: the electronic device comprises a housing in which the sound generating device of claim 8 is disposed.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010248898.XA CN111263274B (en) | 2020-03-31 | 2020-03-31 | Vibrating diaphragm, sound production device and electronic device |
| PCT/CN2020/134124 WO2021196699A1 (en) | 2020-03-31 | 2020-12-05 | Diaphragm, sound generating device and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010248898.XA CN111263274B (en) | 2020-03-31 | 2020-03-31 | Vibrating diaphragm, sound production device and electronic device |
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| Publication Number | Publication Date |
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| CN111263274A CN111263274A (en) | 2020-06-09 |
| CN111263274B true CN111263274B (en) | 2021-11-30 |
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| CN202010248898.XA Active CN111263274B (en) | 2020-03-31 | 2020-03-31 | Vibrating diaphragm, sound production device and electronic device |
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| CN (1) | CN111263274B (en) |
| WO (1) | WO2021196699A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111263274B (en) * | 2020-03-31 | 2021-11-30 | 歌尔股份有限公司 | Vibrating diaphragm, sound production device and electronic device |
| CN212344045U (en) * | 2020-06-30 | 2021-01-12 | 歌尔股份有限公司 | Vibrating diaphragm and sound production device using same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201146596Y (en) * | 2008-01-23 | 2008-11-05 | 横店集团浙江英洛华电声有限公司 | Plate diaphragm |
| CN202395974U (en) * | 2011-06-10 | 2012-08-22 | 宁波升亚电子有限公司 | Loudspeaker based on injection molding technique |
| CN109151676A (en) * | 2018-11-09 | 2019-01-04 | 歌尔股份有限公司 | It is a kind of applied to the reinforcement part of the diaphragm of loudspeaker, vibrating diaphragm and loudspeaker |
| CN109266275A (en) * | 2018-09-12 | 2019-01-25 | 苏州赛伍应用技术股份有限公司 | Microspeaker vibrating diaphragm ball high temperature resistant type bonds glue film and top dome module |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4410768A (en) * | 1980-07-23 | 1983-10-18 | Nippon Gakki Seizo Kabushiki Kaisha | Electro-acoustic transducer |
| CN102685649A (en) * | 2012-05-30 | 2012-09-19 | 常州市友晟电子有限公司 | Novel dome |
| US20150078611A1 (en) * | 2013-09-16 | 2015-03-19 | Apple Inc. | Joint speaker surround and gasket, and methods of manufacture thereof |
| CN109246553B (en) * | 2018-11-09 | 2021-03-30 | 歌尔股份有限公司 | Be applied to reinforcement portion and vibrating diaphragm of speaker vibrating diaphragm |
| CN109151687B (en) * | 2018-11-09 | 2020-10-27 | 歌尔股份有限公司 | Be applied to reinforcement portion, vibrating diaphragm and speaker of speaker vibrating diaphragm |
| CN109451400B (en) * | 2018-11-09 | 2020-06-02 | 歌尔股份有限公司 | Be applied to reinforcement portion, vibrating diaphragm and speaker of speaker vibrating diaphragm |
| CN209283495U (en) * | 2018-12-14 | 2019-08-20 | 深圳市冠旭电子股份有限公司 | Vibrating diaphragm and loudspeaker |
| CN111263274B (en) * | 2020-03-31 | 2021-11-30 | 歌尔股份有限公司 | Vibrating diaphragm, sound production device and electronic device |
-
2020
- 2020-03-31 CN CN202010248898.XA patent/CN111263274B/en active Active
- 2020-12-05 WO PCT/CN2020/134124 patent/WO2021196699A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201146596Y (en) * | 2008-01-23 | 2008-11-05 | 横店集团浙江英洛华电声有限公司 | Plate diaphragm |
| CN202395974U (en) * | 2011-06-10 | 2012-08-22 | 宁波升亚电子有限公司 | Loudspeaker based on injection molding technique |
| CN109266275A (en) * | 2018-09-12 | 2019-01-25 | 苏州赛伍应用技术股份有限公司 | Microspeaker vibrating diaphragm ball high temperature resistant type bonds glue film and top dome module |
| CN109151676A (en) * | 2018-11-09 | 2019-01-04 | 歌尔股份有限公司 | It is a kind of applied to the reinforcement part of the diaphragm of loudspeaker, vibrating diaphragm and loudspeaker |
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|---|---|
| WO2021196699A1 (en) | 2021-10-07 |
| CN111263274A (en) | 2020-06-09 |
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