CN112059510A - High-density storage integrated chip welding device - Google Patents
High-density storage integrated chip welding device Download PDFInfo
- Publication number
- CN112059510A CN112059510A CN202011002027.6A CN202011002027A CN112059510A CN 112059510 A CN112059510 A CN 112059510A CN 202011002027 A CN202011002027 A CN 202011002027A CN 112059510 A CN112059510 A CN 112059510A
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- base
- plate
- groove
- clamping
- density storage
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- 238000003466 welding Methods 0.000 title claims abstract description 52
- 230000017525 heat dissipation Effects 0.000 claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000000741 silica gel Substances 0.000 claims description 7
- 229910002027 silica gel Inorganic materials 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 4
- 230000010354 integration Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 4
- 239000011111 cardboard Substances 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
- B23K37/0435—Clamps
- B23K37/0443—Jigs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention discloses a high-density storage integrated chip welding device which comprises a chip welding device main body, wherein a base is arranged on the outer surface of the lower end of the chip welding device main body, a heat dissipation plate is arranged on the outer surface of the upper end of the base, a placement groove is formed in the outer end of the heat dissipation plate, a sliding rail is arranged at the outer end of the placement groove, which corresponds to the outer surface of the upper end of the base, a sliding fixing plate is arranged at the outer end of the sliding rail, a fixing pad is arranged on the outer surface of the lower end of the center of the sliding fixing plate, a clamping plate is arranged on the outer surface of the. The high-density storage integrated chip welding device is provided with a device convenient for fixing the chip, so that the chip can be conveniently fixed in the welding operation process, and an operator can conveniently monitor the chip welding process through the observation window by arranging the device convenient for the user to observe.
Description
Technical Field
The invention relates to the field of chip welding devices, in particular to a high-density storage integrated chip welding device.
Background
The chip welding device in the prior patent CN210281005U has the disadvantages in the use process, and can not fix the chip welding when the chip is welded, so that the deviation of a welding point can occur during the chip welding, which is not beneficial to the accuracy of the chip welding, and secondly, the automatic welding can generate strong light when the chip is welded, which is very disadvantageous to an operator, therefore, the high-density storage integrated chip welding device is provided.
Disclosure of Invention
The invention mainly aims to provide a high-density storage integrated chip welding device which can effectively solve the problems in the background technology.
In order to achieve the purpose, the invention adopts the technical scheme that:
the high-density storage integrated chip welding device comprises a chip welding device main body, wherein a base is arranged on the outer surface of the lower end of the chip welding device main body, a heat dissipation plate is arranged on the outer surface of the upper end of the base, a placing groove is formed in the outer end of the heat dissipation plate, a slide rail is arranged at the outer end of the placing groove, corresponding to the outer surface of the upper end of the base, a sliding fixing plate is arranged at the outer end of the slide rail, a fixing pad is arranged on the outer surface of the lower end of the center of the sliding fixing plate, a clamping plate is arranged on the outer surface of the front end of the base, a clamping groove is formed in the inner surface of the rear end of the clamping plate, corresponding to the inner surface of the front end of the base, a through hole is formed in, and a handle is arranged at the upper end of the observation window corresponding to the upper end of the movable plate.
Preferably, the outer surface of the lower end of the chip welding device main body is fixedly connected with the base, the lower end of the base is provided with four groups of supporting legs, and the height of the base is smaller than that of the chip welding main body.
Preferably, fixed connection between the upper end surface of base and the heating panel, and the shape of heating panel is the rectangle that has the mesh, the number of piles of heating panel is two-layer, the heat dissipation integrated circuit board inlays in the inner of mounting groove, the mounting groove runs through in the upper and lower end surface of base, and the degree of depth of mounting groove equals the height of base, the heating panel is located the position that the upper end of mounting groove is close to base upper end surface.
Preferably, fixed connection between the upper end surface of base and the slide rail, and the length of slide rail is less than the length of base, the quantity of slide rail is two sets of, sliding connection between the outer end of slide rail and the sliding fixing plate, and the length of sliding fixing plate is good at the distance between the slide rail, fixed connection between the central authorities lower extreme surface of sliding fixing plate and the fixed bolster, and the length of fixed bolster equals the inner width of mounting groove, the material of fixed bolster is heat-resisting silica gel material.
Preferably, the outer surface of the front end of the base is movably connected with the clamping plate through a clamping groove, the cross sections of the outer surfaces of the two ends of the clamping plate are smaller than the cross sections of the clamping groove, the rear end of the clamping groove is movably connected with the through hole, the cross section of the clamping groove is larger than the cross section of the through hole, the cross section of the through hole is larger than the cross sections of the outer surfaces of the two ends of the clamping plate, and the through holes are respectively located at four corners of the moving plate.
Preferably, the movable groove is embedded in the inner surface of the front end of the base, the size of the section of the movable groove is equal to that of the section of the movable plate, the observation window is embedded in the outer surfaces of the front end and the rear end of the center of the movable plate, the observation window is blue-light-proof wafer glass, and the upper end of the movable plate is fixedly connected with the handle.
Preferably, the size of the cross-sectional area of the observation window is equal to one third of the size of the cross-sectional area of the moving plate, the number of the observation windows is two, the distance between the through holes on the same horizontal plane is greater than the width of the observation window, and the distance between the through holes on the same vertical plane is less than the height of the observation window
Compared with the prior art, the invention has the following beneficial effects: the high-density storage integrated chip welding device is provided with a mounting groove, a heat dissipation plate, a slide rail, a sliding fixing plate and a fixing pad, when a chip is required to be welded, the chip cannot be welded and fixed, so that the welding point can be deviated during the welding of the chip, and the accuracy of the welding of the chip is not facilitated, before the chip is welded, the chip is firstly placed in the heat dissipation plate in the mounting groove, then the sliding fixing plate slides along the slide rail, so that the fixing pad at the lower end of the sliding fixing plate slides to the inner end of the mounting groove, and the chip is extruded under the action of a silica gel material, so that the chip is fixed, and by arranging a movable plate, a movable groove, a handle, a through hole, an observation window, a clamping plate and a clamping groove, when the chip is welded, strong light can appear during automatic welding, to the very unfavorable of operator, consequently to accomplishing the welding operation's chip, when needing to carry out the eye protection to the operator in the welding operation, at first take out the cardboard from the draw-in groove, upwards pulling handle for the movable plate is followed the shifting chute and upwards stretched until the draw-in groove aligns between two through-holes that are located the movable plate lower extreme, inserts the cardboard, fixes the movable plate, makes the operator, observes the phenomenon to the chip welding through the observation window, and is comparatively convenient.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the high-density storage integrated chip welding device according to the present invention;
FIG. 2 is an enlarged structural diagram of a mounting groove of the high-density storage integrated chip bonding apparatus according to the present invention;
FIG. 3 is a schematic view of a partially enlarged structure of a slide rail and a slide fixing plate of the high-density storage integrated chip welding device according to the present invention;
FIG. 4 is a schematic view of a moving plate and a moving groove local amplifying mechanism of the high-density storage integrated chip welding device according to the present invention;
FIG. 5 is a partial front sectional side view of a card slot and a card board of the high-density storage integrated chip bonding apparatus of the present invention.
In the figure: 1. a chip bonding apparatus main body; 2. a base; 3. a placing groove; 4. a heat dissipation plate; 5. a slide rail; 6. a sliding fixing plate; 7. a fixing pad; 8. moving the plate; 9. a moving groove; 10. a handle; 11. a through hole; 12. an observation window; 13. clamping a plate; 14. a clamping groove.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
The first embodiment is as follows:
as shown in fig. 1, 2 and 3, the chip welding device comprises a chip welding device body 1, a base 2 is arranged on the outer surface of the lower end of the chip welding device body 1, a heat dissipation plate 4 is arranged on the outer surface of the upper end of the base 2, a placing groove 3 is arranged on the outer end of the heat dissipation plate 4, a slide rail 5 is arranged on the outer end of the placing groove 3 corresponding to the outer surface of the upper end of the base 2, a slide fixing plate 6 is arranged on the outer end of the slide rail 5, a fixing pad 7 is arranged on the outer surface of the lower end of the center of the slide fixing plate 6, a clamping plate 13 is arranged on the outer surface of the front end of the base 2, a clamping groove 14 is arranged on the inner surface of the front end of the base 2 corresponding to the rear end of the clamping plate 13, a through hole 11 is arranged on the, the upper end of the observation window 12 is provided with a handle 10 corresponding to the upper end of the moving plate 8, the clamping plate 13 can be conveniently inserted through the clamping groove 14 and the through hole 11, and the moving plate 8 can be fixed in the moving groove 9, so that the effects of simplicity in operation and convenience are achieved.
Fixed connection between the lower extreme surface of chip welding set main part 1 and base 2, and the lower extreme of base 2 is provided with the support leg post, the quantity of support leg post is four groups, base 2 highly be less than the height of chip welding main part, to the setting of support leg post, conveniently prescribe base 2, and simultaneously, protect base 2, when avoiding wholly removing the device, it is too big to the wearing and tearing of the lower extreme surface of base 2, make in the change process to base 2, very inconvenient.
Fixed connection between base 2's upper end surface and the heating panel 4, and the shape of heating panel 4 is the rectangle that has the mesh, the number of piles of heating panel 4 is two-layer, heating panel 4 inlay card is in the inner of mounting groove 3, mounting groove 3 runs through in base 2's upper and lower end surface, and the degree of depth of mounting groove 3 equals base 2's height, heating panel 4 is located the position that the upper end of mounting groove 3 is close to base 2 upper end surface, through being provided with mounting groove 3, the convenience is put to the chip, secondly carry out the inside running through about base 2 to mounting groove 3, the convenience dispels the heat to the heat that chip welded in-process produced, and to the unsettled processing of 2 lower extremes of base, also make things convenient for the circulation of inside air.
Fixed connection between base 2's the upper end surface and slide rail 5, and slide rail 5's length is less than base 2's length, slide rail 5's quantity is two sets of, sliding connection between slide rail 5's outer end and the sliding fixing plate 6, and sliding fixing plate 6's length is longer than the distance between slide rail 5, fixed connection between sliding fixing plate 6's central authorities lower extreme surface and the fixed bolster 7, and fixed bolster 7's length equals the width of laying groove 3 the inner, the material of fixed bolster 7 is heat-resisting silica gel material, through being provided with fixed bolster 7, conveniently utilize fixed bolster 7 to fix the chip that needs were laid, utilize the silica gel material also to want to protect the chip surface in order to use the softness of silica gel material simultaneously, avoid utilizing anchor clamps to fix time to chip surface damage.
Example two:
on the basis of the first embodiment, as shown in fig. 4 and 5, the front end outer surface of the base 2 is movably connected with the clamping plate 13 through the clamping groove 14, the cross-sectional sizes of the outer surfaces of the two ends of the clamping plate 13 are smaller than the cross-sectional size of the clamping groove 14, the rear end of the clamping groove 14 is movably connected with the through hole 11, the cross-sectional size of the clamping groove 14 is larger than the cross-sectional size of the through hole 11, the cross-sectional size of the through hole 11 is larger than the cross-sectional sizes of the outer surfaces of the two ends of the clamping plate 13, the through holes 11 are respectively located at the four corners of the moving plate 8, and the through hole 11 can be fixed by the clamping plate 13.
Moving groove 9 inlay card is in the front end internal surface of base 2, and moving groove 9's cross-section size equals moving plate 8's cross-section size, observation window 12 inlay card is in the central authorities front and back end surface of moving plate 8, and observation window 12 is for preventing blue light wafer glass, fixed connection between the upper end of moving plate 8 and the handle 10, through being provided with prevent blue light wafer glass to the additional installation of observation window 12, the convenience is to when the observer observes, makes when observing to the observer, weakens to the absorption of highlight.
The size of the cross-sectional area of the observation window 12 is equal to one third of the size of the cross-sectional area of the moving plate 8, the number of the observation windows 12 is two, the distance between the through holes 11 on the same horizontal plane is larger than the width of the observation window 12, the distance between the through holes 11 on the same vertical plane is smaller than the height of the observation window 12, and the observation is convenient for an observer by utilizing the relative area size of the observation windows.
It should be noted that, the invention is a high-density storage integrated chip welding device, when in use, when a user welds a chip, the user cannot fix the chip welding, so that a deviation to a welding point may occur during the chip welding, which is not beneficial to the accuracy of the chip welding, when the chip to be welded needs to be welded, the chip is firstly placed in the heat dissipation plate 4 in the placing groove 3, and then the sliding fixing plate 6 slides along the sliding rail, so that the fixing pad 7 at the lower end of the sliding fixing plate 6 slides to the inner end of the placing groove 3, so that the fixing pad presses the chip under the action of the silica gel material, thereby realizing the fixing of the chip, when the chip is welded, the automatic welding may generate strong light, which is very disadvantageous to the operator, so when the operator needs to perform eye protection during the welding operation, the user takes out cardboard 13 from draw-in groove 14 at first, upwards pulls handle 10 for movable plate 8 is aligned along moving slot 9 is upwards stretched until draw-in groove 14 and two through holes 11 that are located the movable plate 8 lower extreme, inserts cardboard 13, fixes movable plate 8, makes the operator observe the phenomenon to the chip bonding through observation window 12, and is comparatively convenient.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. High density storage integration chip welding set, including chip welding set main part (1), its characterized in that: the outer surface of the lower end of the chip welding device main body (1) is provided with a base (2), the outer surface of the upper end of the base (2) is provided with a heat dissipation plate (4), the outer end of the heat dissipation plate (4) is provided with a placement groove (3), the outer end of the placement groove (3) is provided with a slide rail (5) corresponding to the outer surface of the upper end of the base (2), the outer end of the slide rail (5) is provided with a sliding fixing plate (6), the outer surface of the lower end of the center of the sliding fixing plate (6) is provided with a fixing pad (7), the outer surface of the front end of the base (2) is provided with a clamping plate (13), the rear end of the clamping plate (13) is provided with a clamping groove (14) corresponding to the inner surface of the front end of the base (2), the rear end of the clamping groove (14) is provided with a through hole (11), the outer, an observation window (12) is arranged on the inner surface of the moving groove (9) corresponding to the center of the moving plate (8), and a handle (10) is arranged at the upper end of the observation window (12) corresponding to the upper end of the moving plate (8).
2. The high-density storage integrated chip bonding apparatus according to claim 1, wherein: the chip welding device is characterized in that the outer surface of the lower end of the chip welding device main body (1) is fixedly connected with the base (2), supporting foot columns are arranged at the lower end of the base (2), the number of the supporting foot columns is four, and the height of the base (2) is smaller than that of the chip welding main body.
3. The high-density storage integrated chip bonding apparatus according to claim 1, wherein: fixed connection between the upper end surface of base (2) and heating panel (4), and the shape of heating panel (4) is the rectangle that has the mesh, the number of piles of heating panel (4) is two-layer, heating panel (4) inlay card is in the inner of mounting groove (3), mounting groove (3) run through in the upper and lower end surface of base (2), and the degree of depth of mounting groove (3) equals the height of base (2), heating panel (4) are located the position that the upper end of mounting groove (3) is close to base (2) upper end surface.
4. The high-density storage integrated chip bonding apparatus according to claim 1, wherein: fixed connection between the upper end surface of base (2) and slide rail (5), and the length of slide rail (5) is less than the length of base (2), the quantity of slide rail (5) is two sets of, sliding connection between the outer end of slide rail (5) and sliding fixing plate (6), and the length of sliding fixing plate (6) is longer than the distance between slide rail (5), fixed connection between the central authorities lower extreme surface of sliding fixing plate (6) and fixed bolster (7), and the length of fixed bolster (7) equals mounting groove (3) inner width, the material of fixed bolster (7) is heat-resisting silica gel material.
5. The high-density storage integrated chip bonding apparatus according to claim 1, wherein: the movable clamping plate is characterized in that the outer surface of the front end of the base (2) is movably connected with the clamping plate (13) through a clamping groove (14), the cross sections of the outer surfaces of the two ends of the clamping plate (13) are smaller than the cross section of the clamping groove (14), the rear end of the clamping groove (14) is movably connected with the through hole (11), the cross section of the clamping groove (14) is larger than the cross section of the through hole (11), the cross section of the through hole (11) is larger than the cross sections of the outer surfaces of the two ends of the clamping plate (13), and the through holes (11) are respectively located at four corners of the movable plate (8.
6. The high-density storage integrated chip bonding apparatus according to claim 1, wherein: the movable groove (9) is embedded in the inner surface of the front end of the base (2) in a clamping mode, the size of the section of the movable groove (9) is equal to that of the section of the movable plate (8), the observation window (12) is embedded in the outer surfaces of the front end and the rear end of the center of the movable plate (8) in a clamping mode, the observation window (12) is blue-light-proof wafer glass, and the upper end of the movable plate (8) is fixedly connected with the handle (10).
7. The high-density storage integrated chip bonding apparatus according to claim 1, wherein: the size of the cross-sectional area of the observation windows (12) is equal to one third of the size of the cross-sectional area of the moving plate (8), the number of the observation windows (12) is two, the distance between the through holes (11) on the same horizontal plane is larger than the width of the observation windows (12), and the distance between the through holes (11) on the same vertical plane is smaller than the height of the observation windows (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011002027.6A CN112059510A (en) | 2020-09-22 | 2020-09-22 | High-density storage integrated chip welding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011002027.6A CN112059510A (en) | 2020-09-22 | 2020-09-22 | High-density storage integrated chip welding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112059510A true CN112059510A (en) | 2020-12-11 |
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ID=73682247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011002027.6A Pending CN112059510A (en) | 2020-09-22 | 2020-09-22 | High-density storage integrated chip welding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112059510A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112851099A (en) * | 2020-12-31 | 2021-05-28 | 武汉华工激光工程有限责任公司 | Chip glass packaging clamp |
-
2020
- 2020-09-22 CN CN202011002027.6A patent/CN112059510A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112851099A (en) * | 2020-12-31 | 2021-05-28 | 武汉华工激光工程有限责任公司 | Chip glass packaging clamp |
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Application publication date: 20201211 |