CN112044873A - Laser removal method for waterproof material on surface of electronic element - Google Patents
Laser removal method for waterproof material on surface of electronic element Download PDFInfo
- Publication number
- CN112044873A CN112044873A CN202011014224.XA CN202011014224A CN112044873A CN 112044873 A CN112044873 A CN 112044873A CN 202011014224 A CN202011014224 A CN 202011014224A CN 112044873 A CN112044873 A CN 112044873A
- Authority
- CN
- China
- Prior art keywords
- laser
- electronic component
- product
- processed
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
- B08B15/04—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area from a small area, e.g. a tool
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/04—Cleaning by suction, with or without auxiliary action
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a laser removing method of a waterproof material on the surface of an electronic element, which comprises the following steps: putting an electronic component product to be processed into a clamp; identifying the electronic component product to be processed, and planning the area in which the film layer needs to be removed; setting infrared laser parameters; the method can remove the organic waterproof film layer on the surface of the electronic element product by an ablation principle, can accurately control the laser spot size and the laser energy output by adopting an infrared laser film removal method, has the advantages of accurate and controllable whole process, micron-order precision control, high-precision removal of the waterproof material and high removal speed, and can remove the laser gasified material by the aid of the negative-pressure air extractor of the laser machine during removal, so that the film removal process is free of pollution.
Description
Technical Field
The invention belongs to the field of waterproof material removal, and particularly relates to a laser removal method for a waterproof material on the surface of an electronic element.
Background
In the existing life, the waterproof material is a general name of a class of substances, which has the performances of good high and low temperature resistance, excellent insulation, moisture resistance, electric leakage prevention, shock resistance, dust prevention, corrosion prevention, aging resistance, corona resistance and the like, and mainly comprises the following three main materials: 1. the three-proofing paint is a coating with a special formula and is used for protecting a circuit board and related equipment from being corroded by the environment, and the three-proofing paint material can be acrylate, epoxy resin, organic silicon resin, polyurethane and the like from the chemical composition; 2. the low surface energy material is a material with the surface energy lower than 100mN m, the low surface energy polymer is an important class of the low surface energy material, and the representative low surface energy polymer mainly comprises three types of fluorocarbon resin, organic silicon resin and fluorine silicon resin; 3. parylene is a polymer of p-xylene, and Parylene can be classified into various types such as N type, C type, D type, F type, HT type and the like according to the difference of molecular structures.
The removal mode of the three-proofing paint mainly comprises a heating method, a micro-grinding method and a chemical solvent corrosion method. The heating method is to heat the product of coating three proofings lacquer to very high temperature, make three proofings lacquer evaporation, but because electronic components general temperature resistant can not be very high, three proofings lacquer can not evaporate generally in the temperature can be born at components and parts, in addition, the heating method often can't go on in specific area, therefore the three proofings lacquer of normal region also can receive the influence and cause ageing failure during the heating, consequently the use of this method receives very big restriction, little grinding method needs special equipment, if it removes the lacquer to realize grinding hardly in the region that components and parts are densely covered, therefore this method is also commonly used, chemical solvent corrosion method corrodes with different chemical solvents to the three proofings lacquer of different compositions, can get rid of the three proofings lacquer of corresponding region. The method is simple, but common stripping agents have certain toxicity, the operation needs special care, the use of the method is limited from the environmental protection perspective, low-surface-energy materials and parylene materials can be removed in a micro-grinding or blade cutting and scraping mode due to low hardness of the film layer and low bonding force between the film layer and a base material, but the high-precision removal of a local area cannot be achieved in the two modes, and the cutting and scraping mode is easy to damage a circuit board or a component, so that the method is not suitable for high-precision film removal.
The invention content is as follows:
the present invention aims to solve the above problems by providing a laser removal method for a water-repellent material on the surface of an electronic component, which solves the problems mentioned in the background art.
In order to solve the above problems, the present invention provides a technical solution:
a laser removing method for a waterproof material on the surface of an electronic component comprises the following steps:
s1, placing the electronic component product to be processed into a clamp;
s2, identifying the electronic component product to be processed, and planning the area where the film layer needs to be removed;
s3, setting infrared laser parameters;
and S4, performing film removing operation, and simultaneously independently designing an air extractor to move along the laser film removing route so as to timely extract the laser gasified material.
Preferably, the jig for placing the electronic component product in step S1 should ensure that the maximum deformation of the product is controlled within +/-0.5 mm.
Preferably, in step S2, the product may be identified by using an automatic image recognition system of the laser machine.
Preferably, the step S2 can plan the area of the laser machine software where the film layer needs to be removed.
Preferably, the setting of the infrared laser parameters in step S3 can be performed by a laser machine, while ensuring that the laser etching energy is higher than the ablation threshold of the removed material.
Preferably, the ablation threshold can be determined through an early test, different materials have different absorption mechanisms for laser, and a mode of bulk absorption, surface absorption and the like exists, so that the ablation threshold of the material is determined through a design experiment mainly according to the characteristic of the irradiation effect of the laser on the material.
Preferably, the air extractor in the step S4 is 1-50mm away from the electronic component product.
Preferably, the gas extracted in step S4 needs to be treated by a gas-collecting filter before being discharged.
The invention has the beneficial effects that: the invention removes the organic waterproof film on the surface of the electronic element product by the ablation principle, can accurately control the laser spot size and the laser energy output by adopting an infrared laser film removing method, has the advantages of accurate and controllable whole process, micron-sized precision control, high-precision removal of waterproof materials and high removal speed, and simultaneously, in the removal process, the material gasified by the laser is pumped away by the negative pressure air extractor arranged on the laser machine, thereby ensuring no pollution in the film removing process.
Description of the drawings:
for ease of illustration, the invention is described in detail by the following detailed description and the accompanying drawings.
FIG. 1 is a block diagram of a laser ablation process of the present invention.
The specific implementation mode is as follows:
as shown in fig. 1, the following technical solutions are adopted in the present embodiment:
example (b):
a laser removing method for a waterproof material on the surface of an electronic component comprises the following steps:
s1, placing the electronic component product to be processed into a clamp;
s2, identifying the electronic component product to be processed, and planning the area where the film layer needs to be removed;
s3, setting infrared laser parameters;
and S4, performing film removing operation, and simultaneously independently designing an air extractor to move along the laser film removing route so as to timely extract the laser gasified material.
The fixture for placing the electronic component product in step S1 is required to ensure that the maximum deformation of the product is controlled within +/-0.5mm, so as to more stably clamp and fix the electronic component product, and further improve the accuracy of the subsequent film removing operation.
In step S2, the automatic image recognition system of the laser machine can be used to recognize the product, and the automatic image recognition system of the laser machine can be used to better recognize the whole electronic component product, thereby facilitating better subsequent planning operations.
In step S2, the laser machine software can plan the area where the film layer needs to be removed, and plan the area where the film layer needs to be removed, so as to better control the device to perform the film removal operation on the electronic component product.
Wherein, set for infrared laser parameter accessible laser machine to operate in step S3, should guarantee laser etching energy and be higher than the ablation threshold value of removing the material simultaneously, set for the parameter through the laser machine, be convenient for better assurance the ablation effect of removing the membrane.
The ablation threshold can be determined through early-stage tests, different materials have different absorption mechanisms on laser, and modes such as body absorption and surface absorption exist, so that the ablation threshold of the material is determined through design experiments mainly according to the characteristics of the irradiation effect of the laser on the material, the ablation threshold of the removed material can be determined better, and the laser etching energy can be set better.
Wherein, the distance between the air extractor and the electronic component product in the step S4 is 1-50mm, which is convenient for being better close to the electronic component product which is undergoing the film removing operation.
The gas pumped in step S4 needs to be processed by the gas collection and filtration device before being discharged, so that the laser gasified material can be better processed, and pollution is prevented.
The working principle is as follows: the method for removing the waterproof material by the infrared laser comprises the steps of utilizing infrared laser, all lasers containing far infrared, middle infrared and near infrared bands, emitting infrared radiation or far infrared radiation, interacting with organic molecules to cause multi-photon excitation on a vibration manifold in a ground electronic state, then carrying out thermal decomposition, when the infrared laser irradiates the surface of the waterproof material, generating thermal decomposition reaction after the material absorbs photons, gasifying solid matters, and pumping generated gas away by a negative pressure air pumping device carried by a laser machine, so that the waterproof material on the surface can be removed.
Example (b):
step one, placing an electronic element product to be processed into a fixture, and simultaneously ensuring that the maximum deformation of the product is controlled within +/-0.5mm, so that the electronic element product is more stably clamped and fixed, and the subsequent film removing operation is more accurate;
step two, an automatic image recognition system of the laser machine is used for recognizing the electronic element product to be processed, the whole electronic element product can be better recognized through the automatic image recognition system of the laser machine, so that subsequent planning operation can be better performed, meanwhile, the area of the film layer to be removed is planned in the laser machine software, the area of the film layer to be removed is planned through the laser machine software, and film removal operation of the electronic element product can be better controlled through better control equipment;
setting infrared laser parameters through a laser machine, and simultaneously ensuring that the laser etching energy is higher than the ablation threshold of the removed material, wherein the ablation threshold can be determined through early-stage tests, different materials have different absorption mechanisms of laser, and the modes of body absorption, surface absorption and the like exist, so that the ablation threshold of the material is determined through design experiments mainly according to the characteristics of the irradiation effect of the laser on the material;
and fourthly, performing film removal operation, simultaneously independently designing an air extractor to enable the air extractor to move along a laser film removal route, simultaneously enabling the air extractor to be 1-50mm away from an electronic element product, being convenient for better approaching the electronic element product undergoing the film removal operation, timely extracting the laser gasified material, and then exhausting the extracted gas after the gas is processed by a gas collection filtering device, so that the laser gasified material can be better processed, and pollution is prevented.
While there have been shown and described what are at present considered to be the fundamental principles of the invention and its essential features and advantages, it will be understood by those skilled in the art that the invention is not limited by the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the invention as defined by the appended claims and their equivalents.
Claims (8)
1. A laser removing method for a waterproof material on the surface of an electronic element is characterized by comprising the following steps:
s1, placing the electronic component product to be processed into a clamp;
s2, identifying the electronic component product to be processed, and planning the area where the film layer needs to be removed;
s3, setting infrared laser parameters;
and S4, performing film removing operation, and simultaneously independently designing an air extractor to move along the laser film removing route so as to timely extract the laser gasified material.
2. The method for removing the water-repellent material on the surface of the electronic component by using the laser as claimed in claim 1, wherein the fixture for placing the electronic component product in the step S1 is required to ensure that the maximum deformation of the product is controlled within +/-0.5 mm.
3. The method as claimed in claim 1, wherein the step S2 is performed by using an automatic image recognition system of a laser machine to identify the product.
4. The method as claimed in claim 1, wherein the step S2 is performed by planning the area of the film to be removed in the laser machine software.
5. The method as claimed in claim 1, wherein the setting of the infrared laser parameters in step S3 is performed by a laser machine while ensuring that the laser etching energy is higher than the ablation threshold of the removed material.
6. The method for removing the waterproof material on the surface of the electronic element by using the laser as claimed in claim 5, wherein the ablation threshold can be determined by early stage experiments, different materials have different absorption mechanisms to the laser, and the modes of body absorption, surface absorption and the like exist, so that the ablation threshold of the material is determined by designing experiments mainly according to the characteristics of the irradiation effect of the laser to the material.
7. The laser removing method for the waterproof material on the surface of the electronic component as claimed in claim 1, wherein the air extractor in the step S4 is 1-50mm away from the electronic component product.
8. The laser removing method for water-proof material on surface of electronic component as claimed in claim 1, wherein the gas extracted in step S4 is processed by gas-collecting filter before being exhausted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011014224.XA CN112044873A (en) | 2020-09-23 | 2020-09-23 | Laser removal method for waterproof material on surface of electronic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011014224.XA CN112044873A (en) | 2020-09-23 | 2020-09-23 | Laser removal method for waterproof material on surface of electronic element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112044873A true CN112044873A (en) | 2020-12-08 |
Family
ID=73604480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011014224.XA Pending CN112044873A (en) | 2020-09-23 | 2020-09-23 | Laser removal method for waterproof material on surface of electronic element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112044873A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112756801A (en) * | 2020-12-18 | 2021-05-07 | 浙江泰仑电力集团有限责任公司 | Laser foreign matter removing device and method based on lens micro-vibration and steering control |
| CN113853063A (en) * | 2021-09-09 | 2021-12-28 | 深圳市海目星激光智能装备股份有限公司 | Dielectric material removing method, laser removing apparatus and electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10117488A1 (en) * | 2001-04-07 | 2002-11-07 | Bosch Gmbh Robert | Flushing gas flow distributor for laser ablation, comprises a tube with spaced inlets at its closed end to give laminar flow towards its open end |
| CN103264227A (en) * | 2013-04-11 | 2013-08-28 | 温州大学 | Method of removing metal film covering surface of polymer substrate by direct laser etching |
| CN110013999A (en) * | 2019-05-17 | 2019-07-16 | 电子科技大学 | A kind of tritium pollution lossless minimizing technology of optical film based on inert ion beam etching |
| CN110102902A (en) * | 2019-05-09 | 2019-08-09 | 武汉华工激光工程有限责任公司 | A kind of excessive film plating layer process of laser ablation AF |
| CN110695535A (en) * | 2019-09-17 | 2020-01-17 | 广东工业大学 | Thin film material special-shaped structure and laser processing method thereof |
-
2020
- 2020-09-23 CN CN202011014224.XA patent/CN112044873A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10117488A1 (en) * | 2001-04-07 | 2002-11-07 | Bosch Gmbh Robert | Flushing gas flow distributor for laser ablation, comprises a tube with spaced inlets at its closed end to give laminar flow towards its open end |
| CN103264227A (en) * | 2013-04-11 | 2013-08-28 | 温州大学 | Method of removing metal film covering surface of polymer substrate by direct laser etching |
| CN110102902A (en) * | 2019-05-09 | 2019-08-09 | 武汉华工激光工程有限责任公司 | A kind of excessive film plating layer process of laser ablation AF |
| CN110013999A (en) * | 2019-05-17 | 2019-07-16 | 电子科技大学 | A kind of tritium pollution lossless minimizing technology of optical film based on inert ion beam etching |
| CN110695535A (en) * | 2019-09-17 | 2020-01-17 | 广东工业大学 | Thin film material special-shaped structure and laser processing method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112756801A (en) * | 2020-12-18 | 2021-05-07 | 浙江泰仑电力集团有限责任公司 | Laser foreign matter removing device and method based on lens micro-vibration and steering control |
| CN112756801B (en) * | 2020-12-18 | 2023-08-04 | 浙江泰仑电力集团有限责任公司 | Laser foreign matter removing device and method based on lens micro-vibration and steering control |
| CN113853063A (en) * | 2021-09-09 | 2021-12-28 | 深圳市海目星激光智能装备股份有限公司 | Dielectric material removing method, laser removing apparatus and electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112044873A (en) | Laser removal method for waterproof material on surface of electronic element | |
| JP5395405B2 (en) | Substrate cleaning method and apparatus | |
| JP6006711B2 (en) | Photoresist stripping composition for LCD production containing primary alkanolamine | |
| CN104181781B (en) | Device and method for cleaning photo masks | |
| JP2007256955A (en) | Chemical rinse composition for cleaning resist stripper | |
| CN101817108A (en) | Method and device for realizing photoelectrochemical micro-etch processing of masked electrode | |
| CN105233891A (en) | Micro-fluidic chip used for capturing and rotating micro-size particles and preparation method and application of micro-fluidic chip | |
| CN103100539A (en) | Device and method for decontaminating surface of optical element | |
| CN111993287A (en) | Regeneration method of anodic oxidation part in dry etching equipment for semiconductor | |
| CN102989720A (en) | Method and device for eliminating nanoparticles on surfaces of substrates under assistance of laser | |
| CN103575486B (en) | A kind of clamping method of bare chip impact shock test fixture and bare chip | |
| JP2004115918A (en) | Control loop | |
| US20150136170A1 (en) | Method for removing adhesive agent | |
| JP3265340B2 (en) | Resist removal method and resist stripper | |
| Kohli et al. | Developments in Surface Contamination and Cleaning, Volume 8: Cleaning Techniques | |
| RU2572290C1 (en) | Method for depackaging integrated microcircuits | |
| CA2305980A1 (en) | A method for cleaning electrodes in measuring equipment | |
| JPH0774135A (en) | Dry-cleaning method of substrate surface | |
| KR102372922B1 (en) | Resist stripper composition | |
| CN109758789A (en) | A method of preparing super hydrophilic/underwater superoleophobic aluminium net | |
| CN102489471A (en) | Method for cleaning sampling bottles | |
| CN114414711B (en) | Identification method of onium salt photoacid generator in photoresist | |
| US7081209B2 (en) | Solder mask removal method | |
| CN110408260A (en) | A kind of chemical reagent and stripping means for removing pcb board solder mask | |
| Fulla et al. | Backside Preparation by Milling Approach of Module Device for Failure Analysis |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201208 |
|
| RJ01 | Rejection of invention patent application after publication |