CN110408260A - A kind of chemical reagent and stripping means for removing pcb board solder mask - Google Patents
A kind of chemical reagent and stripping means for removing pcb board solder mask Download PDFInfo
- Publication number
- CN110408260A CN110408260A CN201910752074.3A CN201910752074A CN110408260A CN 110408260 A CN110408260 A CN 110408260A CN 201910752074 A CN201910752074 A CN 201910752074A CN 110408260 A CN110408260 A CN 110408260A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- solder mask
- board solder
- chemical reagent
- removing pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 48
- 239000003153 chemical reaction reagent Substances 0.000 title claims abstract description 25
- 150000001875 compounds Chemical class 0.000 claims abstract description 13
- 239000003513 alkali Substances 0.000 claims abstract description 12
- -1 alcohol compound Chemical class 0.000 claims abstract description 10
- 238000005260 corrosion Methods 0.000 claims abstract description 9
- 230000007797 corrosion Effects 0.000 claims abstract description 9
- 239000011259 mixed solution Substances 0.000 claims abstract 2
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 30
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 25
- 235000019441 ethanol Nutrition 0.000 claims description 22
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 12
- 239000000126 substance Substances 0.000 claims description 8
- 238000002791 soaking Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 2
- 150000001298 alcohols Chemical class 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 10
- 239000000428 dust Substances 0.000 abstract description 6
- 239000004615 ingredient Substances 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 4
- 239000002904 solvent Substances 0.000 description 7
- 238000007654 immersion Methods 0.000 description 5
- 238000010297 mechanical methods and process Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 150000005622 tetraalkylammonium hydroxides Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D9/00—Chemical paint or ink removers
- C09D9/005—Chemical paint or ink removers containing organic solvents
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The present invention relates to a kind of chemical reagent for removing pcb board solder mask, and the method for removing pcb board solder mask.The chemical reagent of the removing pcb board solder mask, is a kind of mixed solution, comprising: alkali compounds and alcohol compound.The chemical reagent of removing pcb board solder mask provided by the invention, ingredient is simple, easy to operate for removing pcb board solder mask, and faster, labor intensity is small, without dust pollution, and is not limited by workpiece shapes for speed；And really pcb board solder mask can be removed with fast accurate, removing is complete；And this method auxiliary implement, material and the corrosion reagent that use are easy to obtain and low in cost, substantial saved the cost of solder mask removing, have huge market prospects and application value.
Description
Technical field
The invention belongs to chemical reagent technical fields, and in particular, to a kind of chemical reagent for removing pcb board solder mask,
And the method for removing pcb board solder mask.
Background technique
Printed circuit board (pcb board) be it is a kind of be widely used in various electronics, the important component in electrical equipment, for holding
Carry the various components for realizing functions of the equipments, such as resistance, capacitor, integrated circuit.Various components on pcb board in order to prevent
It is influenced by steam, dust, external impacts etc., solder mask is usually coated on pcb board, can insulate, is moisture-proof, is anticreep, is anti-
Shake, dust-proof, anticorrosion, anti-aging, to protect pcb board from the erosion in bad border, improve and prolong the service life, it is ensured that PCB
The safety and reliability that plate uses.
When being routed (trace) short-circuit failure on pcb board, it is necessary first to remove pcb board solder mask, then can incite somebody to action
Trace carries out physical observation on pcb board.The method for being currently available for removing solder mask mainly includes Mechanical Method and chemical solvent stripping
From method.Wherein Mechanical Method paint stripping rate is slow, large labor intensity, easily causes dust pollution, and limited by workpiece shapes, it is difficult to
For complex-shaped pcb board.Chemical solvent stripping means method is for Mechanical Method, and faster, labor intensity is small, nothing for speed
Dust pollution, and do not limited by workpiece shapes, therefore become solder mask stripping means more commonly used at present.
Chinese patent application CN02142279.6 provides a kind of photoresist stripper, wherein containing (a) carboxylic acid
At least one kind of alkali compounds (such as the monoethanol selected in property compound, (b) ethyl alcohol amine and specific quaternary ammonium hydroxide
Amine, tetraalkylammonium hydroxide etc.), (c) sulfur-bearing anticorrosive and (d) water, and pH value is 3.5~5.5.In addition, the present invention is also
The photoresist lift off method for using the stripper is provided.The problem of this method is: stripper ingredient is more complex, can only remove specific
Photoresist.
Therefore, if the chemical reagent and stripping means of a kind of special removing pcb board solder mask can be developed, ingredient is simply easy
Operation, faster, labor intensity is small, without dust pollution, and is not limited by workpiece shapes, it will has huge market prospects for speed
And application value.
Summary of the invention
In order to solve the above-mentioned technical problem, one of the objects of the present invention is to provide a kind of changes for removing pcb board solder mask
Learn reagent.The chemical reagent composition is simple, easy to operate for removing pcb board solder mask, and faster, labor intensity is small, without powder for speed
Dustiness dye, and do not limited by workpiece shapes.
To achieve the goals above, a kind of chemical reagent for removing pcb board solder mask provided by the invention, is a kind of mixing
Solution, comprising: alkali compounds and alcohol compound.
Wherein, the alkali compounds is potassium hydroxide or sodium hydroxide.
Wherein, the alcohol compound is ethyl alcohol.
Wherein, the volume ratio of the alkali compounds and alcohol compound is 1~8:1, preferably 1~4:1, more preferable 1:1.
Wherein, the concentration of the alkali compounds is 2~10mol/L, preferably 4~8mol/L, more preferable 6mol/L.
Wherein, the mass percent of the alcohol compound is greater than 95%.
Another object of the present invention is to provide a kind of stripping means of pcb board solder mask, comprising: is soaked in pcb board
In the chemical reagent of above-mentioned any one removing pcb board solder mask, the pcb board of corrosion is rinsed with ultrasonic then, is rushed
It is dried again after wash clean.
Wherein, the temperature of the chemical reagent of removing pcb board solder mask used is 90~120 degrees Celsius, and preferably 90~110 take the photograph
Family name's degree, more preferable 100 degrees Celsius.
Wherein, soaking time is 8~15 minutes, preferably 8~12 minutes, more preferable 10 minutes.
Using stripping means of the invention, physical analysis observation effectively and rapidly can be carried out to substrate invalid position.
The invention has the following advantages: the chemical reagent of removing pcb board solder mask provided by the invention, ingredient letter
Single, easy to operate for removing pcb board solder mask, faster, labor intensity is small, without dust pollution, and not by workpiece shapes for speed
Limitation；And really pcb board solder mask can be removed with fast accurate, removing is complete；And this method use auxiliary implement,
Material and corrosion reagent be easy to obtain and it is low in cost, substantial saved solder mask removing cost, have huge market before
Scape and application value.
Specific embodiment
The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention..
Unmentioned operation is the routine operation of this field in the present invention, does not refer to the material in specific source in the present invention
It is the conventional material that can commercially obtain.
Embodiment 1
The pcb board solder mask of the present embodiment removes chemical solvent, by the KOH and mass percent of 6mol/L greater than 95%
Ethyl alcohol is formulated according to volume ratio for 1:1.Sample is soaked in the KOH of 100 degrees Celsius of 6mol/L and the mixing of ethyl alcohol
10 minutes or so in solution；The sample of immersion corrosion is rinsed with ultrasonic；Clean examination is rinsed to ultrasonic
Sample is dried, and the removing of pcb board solder mask is completed.
Embodiment 2
The pcb board solder mask of the present embodiment removes chemical solvent, is greater than 98% by the NaOH and mass percent of 4mol/L
Ethyl alcohol be formulated according to volume ratio for 2:1.Sample is soaked in the NaOH of 110 degrees Celsius of 4mol/L and mixing for ethyl alcohol
It closes in solution 12 minutes or so；The sample of immersion corrosion is rinsed with ultrasonic；Ultrasonic is rinsed clean
Sample is dried, and the removing of pcb board solder mask is completed.
Embodiment 3
The pcb board solder mask of the present embodiment removes chemical solvent, by the KOH and mass percent of 8mol/L greater than 98%
Ethyl alcohol is formulated according to volume ratio for 4:1.By sample be soaked in 90 degrees Celsius of 8mol/L KOH and ethyl alcohol mixing it is molten
8 minutes or so in liquid；The sample of immersion corrosion is rinsed with ultrasonic；To ultrasonic be rinsed clean sample into
Row drying, completes the removing of pcb board solder mask.
Embodiment 4
The pcb board solder mask of the present embodiment removes chemical solvent, by the KOH and mass percent of 8mol/L greater than 95%
Ethyl alcohol is formulated according to volume ratio for 6:1.Sample is soaked in the KOH of 110 degrees Celsius of 8mol/L and the mixing of ethyl alcohol
15 minutes or so in solution；The sample of immersion corrosion is rinsed with ultrasonic；Clean examination is rinsed to ultrasonic
Sample is dried, and the removing of pcb board solder mask is completed.
Embodiment 5
The pcb board solder mask of the present embodiment removes chemical solvent, by the KOH and mass percent of 8mol/L greater than 95%
Ethyl alcohol is formulated according to volume ratio for 8:1.Sample is soaked in the KOH of 100 degrees Celsius of 8mol/L and the mixing of ethyl alcohol
15 minutes or so in solution；The sample of immersion corrosion is rinsed with ultrasonic；Clean examination is rinsed to ultrasonic
Sample is dried, and the removing of pcb board solder mask is completed.
Although above the present invention is described in detail with a general description of the specific embodiments,
On the basis of the present invention, it can be made some modifications or improvements, this will be apparent to those skilled in the art.Cause
This, these modifications or improvements, fall within the scope of the claimed invention without departing from theon the basis of the spirit of the present invention.
Claims (9)
1. a kind of chemical reagent for removing pcb board solder mask, is a kind of mixed solution, comprising: alkali compounds and alcohols chemical combination
Object.
2. the chemical reagent of removing pcb board solder mask according to claim 1, which is characterized in that the alkali compounds
For potassium hydroxide or sodium hydroxide.
3. the chemical reagent of removing pcb board solder mask according to claim 1, which is characterized in that the alcohol compound
For ethyl alcohol.
4. the chemical reagent of removing pcb board solder mask according to any one of claims 1 to 3, which is characterized in that described
The volume ratio of alkali compounds and alcohol compound is 1~8:1；The concentration of alkali compounds is 2~10mol/L.
5. the chemical reagent of removing pcb board solder mask according to any one of claims 1 to 3, which is characterized in that described
The volume ratio of alkali compounds and alcohol compound is 1~4:1, and the concentration of alkali compounds is 4~8mol/L.
6. the chemical reagent of removing pcb board solder mask according to any one of claims 1 to 3, which is characterized in that described
The mass percent of alcohol compound is greater than 95%.
7. a kind of stripping means of pcb board solder mask, comprising: pcb board is soaked in stripping described in claim 1~6 any one
In chemical reagent from pcb board solder mask, then the pcb board of corrosion is rinsed with ultrasonic, is carried out again after rinsing well
Drying.
8. the stripping means of pcb board solder mask according to claim 7, which is characterized in that removing pcb board solder mask used
Chemical reagent temperature be 90~120 degrees Celsius, soaking time be 8~15 minutes.
9. the stripping means of pcb board solder mask according to claim 7, which is characterized in that removing pcb board solder mask used
Chemical reagent temperature be 90~110 degrees Celsius, soaking time be 8~12 minutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910752074.3A CN110408260A (en) | 2019-08-15 | 2019-08-15 | A kind of chemical reagent and stripping means for removing pcb board solder mask |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910752074.3A CN110408260A (en) | 2019-08-15 | 2019-08-15 | A kind of chemical reagent and stripping means for removing pcb board solder mask |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110408260A true CN110408260A (en) | 2019-11-05 |
Family
ID=68367539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910752074.3A Pending CN110408260A (en) | 2019-08-15 | 2019-08-15 | A kind of chemical reagent and stripping means for removing pcb board solder mask |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110408260A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1831052A (en) * | 2005-03-11 | 2006-09-13 | 佛山市顺德区汉达精密电子科技有限公司 | Paint remover and method for removing paint from surface of plastic articles |
| CN1887979A (en) * | 2006-07-14 | 2007-01-03 | 北京科技大学 | Green alkaline paint remover for eliminating coating from electronic circuit board and its prepn and usage |
| CN101709175A (en) * | 2009-11-12 | 2010-05-19 | 国家纳米技术与工程研究院 | Cleaning agent of alkali finishing coat and preparation method |
| CN102433043A (en) * | 2011-09-13 | 2012-05-02 | 天津德高化成电子材料有限公司 | Epoxy resin and silicon resin cured coating and package removing agent and preparation method thereof |
| CN105255248A (en) * | 2015-12-03 | 2016-01-20 | 关勇河 | Environment-friendly aqueous paint remover and preparation method thereof |
| CN106497213A (en) * | 2016-12-20 | 2017-03-15 | 粟飞 | A kind of alkali paint remover |
| CN109111785A (en) * | 2017-06-22 | 2019-01-01 | 海门市源美美术图案设计有限公司 | A kind of environment protection oil paint cleaning agent |
-
2019
- 2019-08-15 CN CN201910752074.3A patent/CN110408260A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1831052A (en) * | 2005-03-11 | 2006-09-13 | 佛山市顺德区汉达精密电子科技有限公司 | Paint remover and method for removing paint from surface of plastic articles |
| CN1887979A (en) * | 2006-07-14 | 2007-01-03 | 北京科技大学 | Green alkaline paint remover for eliminating coating from electronic circuit board and its prepn and usage |
| CN101709175A (en) * | 2009-11-12 | 2010-05-19 | 国家纳米技术与工程研究院 | Cleaning agent of alkali finishing coat and preparation method |
| CN102433043A (en) * | 2011-09-13 | 2012-05-02 | 天津德高化成电子材料有限公司 | Epoxy resin and silicon resin cured coating and package removing agent and preparation method thereof |
| CN105255248A (en) * | 2015-12-03 | 2016-01-20 | 关勇河 | Environment-friendly aqueous paint remover and preparation method thereof |
| CN106497213A (en) * | 2016-12-20 | 2017-03-15 | 粟飞 | A kind of alkali paint remover |
| CN109111785A (en) * | 2017-06-22 | 2019-01-01 | 海门市源美美术图案设计有限公司 | A kind of environment protection oil paint cleaning agent |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191105 |