Disclosure of Invention
Technical problem to be solved
The invention can solve the problems that the existing mainboard chip cleaning equipment cannot deeply clean the uneven characteristics of the surface of the mainboard, the cleaning is incomplete, the heat dissipation effect of the mainboard chip is influenced, the elasticity is poor during cleaning, the mainboard chip is easily scratched and damaged during cleaning, and the service life of the mainboard chip is influenced, and can also solve the problems that most of the existing mainboard chip cleaning equipment adopts a brush and a blowing device to directly clean dust, the dust is scattered randomly, the dust is easily sucked by people or falls back onto the mainboard chip again, the cleaning effect is influenced, and the clean and tidy environment of the cleaning equipment is influenced.
(II) technical scheme
In order to achieve the above purpose, the invention adopts the following technical scheme that the computer motherboard chip surface cleaning equipment comprises a supporting device, a movable sucker device and a cleaning device, wherein the movable sucker device is installed on the supporting device in a threaded fit manner, the cleaning device is arranged below the movable sucker device, and the cleaning device is installed on the supporting device.
The supporting device comprises a bottom plate, a supporting seat, a supporting frame, a connecting column, an adjusting cylinder and ventilation holes, wherein the supporting seat is installed on the bottom plate in a fixed mode, the supporting seat is of a T-shaped structure with an upward opening, the supporting frame is symmetrically installed on the supporting seat through the connecting column, the connecting column is located between the supporting seat and the supporting frame, a groove is formed in the connecting column, the adjusting cylinder is installed in the groove through a cylinder seat, and the ventilation holes are symmetrically formed in the supporting frame;
the movable sucker device comprises a driving motor, a lead screw rotating seat, a movable sliding rod buffer mechanism and a sucker mechanism, wherein the driving motor is installed on the outer side surface of the support frame through the motor seat;
cleaning device include cleaning box, baffle, adsorption equipment structure, drying-machine, dust containing box and clean the mechanism, cleaning box fixed mounting on the bottom plate, the cleaning incasement evenly is provided with the baffle, baffle quantity is four, is provided with adsorption equipment between two baffles on the left side, installs the drying-machine between two middle baffles, is provided with the dust containing box between two baffles on the right, is provided with in the dust containing box and cleans the mechanism.
As a preferred technical scheme of the invention: buffer gear include connecting plate, buffering post, slow indent, buffer spring and T type movable rod, connecting plate up end and removal sliding rod connection, evenly be provided with the buffering post under the connecting plate on the terminal surface, the buffering post is the matrix arrangement under the connecting plate on the terminal surface, the inside slow indent of having seted up of buffering post is provided with buffer spring in the slow indent, buffer spring is connected with T type movable rod, T type movable rod passes through sliding fit's mode and installs on the buffering post.
As a preferred technical scheme of the invention: sucking disc mechanism include telescopic link, expanding spring, electric putter, arc dish and flexible sucking disc, the telescopic link be connected with T type movable rod through fixed mode, the telescopic link outside is provided with expanding spring, telescopic link internally mounted has electric putter, electric putter's expansion end is connected with the arc dish, is provided with flexible sucking disc on the arc dish.
As a preferred technical scheme of the invention: adsorption device include pump, connecting pipe, gas tube, flexible gasbag and adsorb the gel piece, pump fixed mounting on the bottom plate, be provided with the connecting pipe on the pump, install the gas tube in the connecting pipe, the gas tube is connected with flexible gasbag, flexible gasbag skin evenly is provided with the absorption gel piece that is used for adsorbing the dust along its circumference.
As a preferred technical scheme of the invention: cleaning the mechanism including rotating motor, fan frame, flabellum, rotating electrical machines, cleaning the roller and cleaning the brush, the rotation motor pass through the motor cabinet and install under the dust containing box on the terminal surface, the output shaft that rotates the motor passes through the spline and is connected with the fan frame, evenly be provided with the flabellum in the fan frame, the rotating electrical machines passes through motor cabinet fixed mounting on the bottom plate, the output shaft of rotating electrical machines passes through the shaft coupling and installs the cleaning roller, cleaning the roller and being located fan frame top, evenly be provided with on the cleaning roller outer wall and clean the brush, clean and be provided with the vent between the brush.
As a preferred technical scheme of the invention: the dust containing box is of a U-shaped structure, and the inner sides of the left end face and the right end face of the dust containing box are evenly provided with a soaking sponge layer 351 for adhering dust.
(III) advantageous effects
1. The computer motherboard chip surface cleaning equipment provided by the invention can solve the problems that the existing motherboard chip cleaning equipment cannot deeply clean the rugged characteristics of the motherboard surface, so that the cleaning is not thorough, the heat dissipation effect of the motherboard chip is influenced, the flexibility during cleaning is poor, the motherboard chip is easily scratched and damaged during cleaning, the service life of the motherboard chip is influenced, dust is scattered randomly, the motherboard chip is easily sucked by people or falls back onto the motherboard chip again, the cleaning effect is influenced, and the clean and tidy environment of the cleaning equipment is influenced.
2. According to the computer motherboard chip surface cleaning equipment provided by the invention, the adsorption mechanism can deeply clean the rugged characteristics of the motherboard surface, the motherboard chip can be prevented from being scratched and damaged during cleaning, and meanwhile, the sucking disc mechanism is matched with the buffer mechanism, so that the buffer elasticity during cleaning is favorably improved, the protection of the motherboard chip is favorably improved, and the service life of the motherboard chip is favorably prolonged.
3. According to the computer motherboard chip surface cleaning equipment provided by the invention, the cleaning mechanism and the buffer mechanism are matched to thoroughly clean the motherboard chip, and meanwhile, swept dust can be contained and processed, so that the situation that the swept dust is scattered randomly can be avoided, the cleaning effect on the motherboard chip can be improved, and the clean and tidy environmental state of the cleaning equipment can be maintained.
Detailed Description
The embodiments of the invention will be described in detail below with reference to the drawings, but the invention can be implemented in many different ways as defined and covered by the claims.
As shown in fig. 1 to 6, a computer motherboard chip surface cleaning apparatus includes a supporting device 1, a movable suction cup device 2 and a cleaning device 3, the supporting device 1 is provided with the movable suction cup device 2 in a screw-thread fit manner, the cleaning device 3 is arranged below the movable suction cup device 2, and the cleaning device 3 is installed on the supporting device 1.
The supporting device 1 comprises a bottom plate 11, a supporting seat 12, a supporting frame 13, a connecting column 14, an adjusting cylinder 15 and a vent hole 16, the bottom plate 11 is fixedly provided with a support seat 12, the support seat 12 is of a T-shaped structure with an upward opening, the support seat 12 is symmetrically provided with support frames 13 through a connecting column 14, the connecting column 14 is positioned between the support seat 12 and the support frames 13, the connecting column 14 is internally provided with a groove, an adjusting cylinder 15 is arranged in the groove through a cylinder seat, the support frames 13 are symmetrically provided with vent holes 16, during the specific work, the adjusting cylinder 15 is used for adjusting the height of the movable sucker device 2, plays a role in adjusting the main board chip before cleaning, is beneficial to preventing the main board chip from being damaged by rigid pressure due to the fact that the main board chip cannot be mortared by the flexible air bag 334 during cleaning, and is beneficial to improving the protection of the main board chip.
The movable sucker device 2 comprises a driving motor 21, a lead screw 22, a lead screw rotating seat 23, a movable sliding rod 24, a buffer mechanism 25 and a sucker mechanism 26, wherein the driving motor 21 is arranged on the outer side surface of the support frame 13 through a motor seat, an output shaft of the driving motor 21 is connected with the lead screw 22 through a spline, the lead screw rotating seat 23 is symmetrically arranged on the lead screw 22 in a thread fit mode, the lead screw rotating seat 23 is fixedly arranged on the inner side surface of the support frame 13, the movable sliding rod 24 is arranged in the middle of the lead screw 22 in a thread fit mode, the buffer mechanism 25 is arranged on the movable sliding rod 24, the sucker mechanism 26 is arranged in the buffer mechanism 25 in a sliding fit mode, and during specific work, the driving motor 21 and the lead screw 22 are mutually matched to change the horizontal position of the movable sliding rod 24, so that a mainboard chip, drying process and cleaning process, be favorable to improving the clearance effect, buffer gear 25 can play the effect of buffering when the clearance, be favorable to the protection to the mainboard chip, avoid causing the condition appearance of scratch and damage to the mainboard chip to mainboard unevenness's structural feature in the clearance process, sucking disc mechanism 26 plays and adsorbs fixed effect to the mainboard chip, and simultaneously, sucking disc mechanism 26 and buffer gear 25 cooperation can provide the effect of vibrations from top to bottom when the clearance, be favorable to improving the clearance effect.
The buffer mechanism 25 comprises a connecting plate 251, buffer posts 252, buffer pressure grooves 253, buffer springs 254 and T-shaped movable rods 255, the upper end face of the connecting plate 251 is connected with the movable slide rods 24, the buffer posts 252 are uniformly arranged on the lower end face of the connecting plate 251, the buffer posts 252 are arranged on the lower end face of the connecting plate 251 in a matrix manner, the buffer pressure grooves 253 are formed in the buffer posts 252, the buffer springs 254 are arranged in the buffer pressure grooves 253, the buffer springs 254 are connected with the T-shaped movable rods 255, the T-shaped movable rods 255 are arranged on the buffer posts 252 in a sliding fit manner, during specific work, the connecting plate 251 is connected with the movable slide rods 24, so that the main board chip can perform horizontal movement under the action of the driving motor 21 and the lead screw 22, the T-shaped movable rods 255 can slide up and down in the buffer posts 252, and the T-shaped movable rods 255 and the buffer springs 254 can provide a buffer effect during cleaning, the protection to the mainboard chip is improved and the cleaning effect is improved.
Sucking disc mechanism 26 include telescopic link 261, expanding spring 262, electric putter 263, arc dish 264 and flexible sucking disc 265, telescopic link 261 be connected with T type movable rod 255 through fixed mode, telescopic link 261 outside is provided with expanding spring 262, telescopic link 261 internally mounted has electric putter 263, electric putter 263's expansion end is connected with arc dish 264, be provided with flexible sucking disc 265 on the arc dish 264, during specific work, when mainboard chip and arc dish 264 contact, electric putter 263 can provide weak decurrent pressure, and then can increase the laminating degree of arc dish 264 and mainboard chip, make flexible sucking disc 265 thoroughly adsorb with the mainboard chip laminating, reach the fixed purpose of many mainboard chip adhesion, simultaneously expanding spring 262 and the cooperation of telescopic link are favorable to improving the elasticity effect when clearing up.
The cleaning device 3 comprises a cleaning box 31, partition plates 32, an adsorption mechanism 33, a dryer 34, a dust storage box 35 and a cleaning mechanism 36, wherein the cleaning box 31 is fixedly installed on the bottom plate 11, the partition plates 32 are uniformly arranged in the cleaning box 31, the number of the partition plates 32 is four, the adsorption mechanism 33 is arranged between the two partition plates 32 on the left side, the dryer 34 is installed between the two partition plates 32 in the middle, the dust storage box 35 is arranged between the two partition plates 32 on the right side, the cleaning mechanism 36 is arranged in the dust storage box 35, during specific work, the adsorption mechanism 33 can perform primary cleaning of surface dust on the main board chip through the adhesion effect of the main board chip, the dryer 34 plays a role in cleaning and drying the adhesion mechanism 33, the dust storage box 35 is used for collecting cleaned dust, the cleaning mechanism 36 can thoroughly clean the main board chip, and is favorable for improving the cleaning effect, the heat dissipation capability of the mainboard chip is improved, and the service life of the mainboard chip is prolonged.
The adsorption mechanism 33 comprises an inflator 331, a connecting pipe 332, an inflation pipe 333, a flexible air bag 334 and an adsorption gel block 335, the inflator 331 is fixedly installed on the bottom plate 11, the connection pipe 332 is arranged on the inflator 331, the inflation pipe 333 is installed in the connection pipe 332, the inflation pipe 333 is connected with the flexible airbag 334, the outer layer of the flexible airbag 334 is evenly provided with the adsorption gel blocks 335 for adsorbing dust along the circumferential direction, when in specific work, when the main board chip moves to the position right above the flexible air bag 334 through the adjusting action of the driving motor 21 and the lead screw 22, the inflator 331 is activated to inflate the flexible bladder 334 through the inflation tube 33, so as to cause the flexible bladder 334 to be in contact with the uneven surface of the motherboard chip as the amount of gas filled inside the flexible bladder 334 increases, the purpose of cleaning dust on the surface of the main board chip for the first time is achieved through the adhesive capacity of the adsorption gel block.
Dust containing box 35 be U type structure, and the terminal surface inboard evenly is provided with the sponge layer 351 that soaks that is used for the adhesion dust about dust containing box 35, concrete during operation, owing to clean the effect that brush 366 and fan leaf 363 blow, the dust that drops drifts about easily, gentle according to being inhaled by the people and still can possibly trickling down the mainboard chip surface again simultaneously, influence clearance effect, also do not be favorable to maintaining the clean and tidy state in mainboard chip clearance back, dust containing box 35 can play the effect of collecting the dust that sweeps, the sponge layer 351 that soaks simultaneously can be at the dust with it when the contact with water adhesion dust, can avoid the dust to drift everywhere.
The cleaning mechanism 36 comprises a rotating motor 361, a fan frame 362, fan blades 363, a rotating motor 364, a cleaning roller 365 and a cleaning brush 366, the rotating motor 361 is installed on the lower end face of the dust containing box 35 through a motor base, an output shaft of the rotating motor 361 is connected with the fan frame 362 through a spline, the fan blades 363 are evenly arranged in the fan frame 362, the rotating motor 364 is fixedly installed on the bottom plate 11 through the motor base, the cleaning roller 365 is installed on the output shaft of the rotating motor 364 through a coupler, the cleaning roller 365 is located above the fan frame 362, the cleaning brush 366 is evenly arranged on the outer wall of the cleaning roller 365, a vent is arranged between the cleaning brushes 366, when the mainboard chip moves right above the cleaning roller 365 during specific work, the rotating motor 361 and the rotating motor 364 are started to provide blowing force through the fan blades 363, and as the cleaning roller 364 rotates, the cleaning brush 366 can deeply clean the inside of the mainboard chip, can not have the stubborn dust that the adhesion dropped to adsorb gel piece 335 and thoroughly clean, be favorable to the dust to drop on the sponge layer that soaks in dust containing box 35, simultaneously owing to receive the effect of blowing in the wind direction, can make the action that the mainboard chip slightly trembled with buffer gear 25 and the cooperation of sucking disc mechanism 26, be favorable to improving the speed that the dust dropped, be favorable to improving the clearance effect to the mainboard chip.
The steps of the invention in specific use are as follows:
s1 standing and solidifying: the mainboard chip is manually placed right above the adsorption mechanism, the height of the support frame 13 is adjusted through the adjusting cylinder 15, so that the sucker mechanism 26 is just in contact with the back of the mainboard chip, when the mainboard chip is in contact with the arc-shaped disc 264, the electric push rod 263 can provide weak downward pressure, the attaching degree of the arc-shaped disc 264 and the mainboard chip can be further increased, the flexible sucker 265 is thoroughly attached and adsorbed with the mainboard chip, the purpose of adhering and fixing the multiple mainboard chips is achieved, and meanwhile, the telescopic spring 262 is matched with the telescopic rod, so that the elastic effect during cleaning is improved;
s2: adhesion cleaning: when the adhesion and fixation of the mainboard chip are completed, the inflator pump 331 starts to inflate the flexible airbag 334 through the inflation tube 33, the flexible airbag 334 is urged to be in contact with the uneven part on the surface of the mainboard chip along with the increasing amount of gas filled in the flexible airbag 334, and the purpose of primary cleaning of surface dust of the mainboard chip is achieved through the adhesion capability of the adsorption gel block;
s3: drying treatment: when the adhesion cleaning operation is completed, the main board chip moves to a position right above the dryer 34 under the adjusting action of the driving motor 21 and the lead screw 22, the dryer 34 can rapidly dry a small amount of moisture left when the adsorption mechanism 33 is adhered, and the drying operation of the main board chip is accelerated by matching with wind power provided by the cleaning mechanism 36;
s4: and (4) thoroughly cleaning: when the mainboard chip moves over the cleaning roller 365, the rotating motor 361 and the rotating motor 364 start, the function of blowing is provided through the fan blades 363, the rotating roller 364 rotates, the cleaning brush 366 can go deep into the mainboard chip to clean, stubborn dust that the adhesion of the adsorption gel block 335 does not drop can be thoroughly cleaned, the dust is favorably dropped on the soaking sponge layer in the dust containing box 35, meanwhile, the action of blowing in the wind direction is received, the mainboard chip can be slightly shaken by matching with the buffer mechanism 25 and the sucking disc mechanism 26, the dropping speed of the dust is favorably improved, and the cleaning effect of the mainboard chip is favorably improved.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.