CN112041991A

CN112041991A - Flexible cover plate, flexible component and electronic device

Info

Publication number: CN112041991A
Application number: CN201880090444.5A
Authority: CN
Inventors: 温胜山; 张琨; 施文杰
Original assignee: Shenzhen Royole Technologies Co Ltd
Current assignee: Shenzhen Royole Technologies Co Ltd
Priority date: 2018-03-20
Filing date: 2018-03-20
Publication date: 2020-12-04
Also published as: WO2019178744A1

Abstract

A flexible cover plate, a flexible component and an electronic device are provided. The flexible cover plate comprises a hard layer arranged on one side and a connecting layer arranged on the other side far away from the hard layer. One side of the flexible cover plate has the characteristics of hardness, abrasion resistance, scratch resistance and the like.

Description

Flexible cover plate, flexible component and electronic device

Technical Field

The invention relates to the technical field of flexible display, in particular to a flexible cover plate, a flexible component and an electronic device.

Background

The flexible display device is made of flexible materials, can be bent and bent, has the characteristics of low power consumption, light weight and the like, and has wide application prospect. The display panel of the flexible display device includes a flexible cover sheet for protection. However, the hardness, wear resistance and scratch resistance of the existing flexible cover plate are insufficient, and become one of the bottlenecks in the development of the flexible display technology.

Disclosure of Invention

In order to solve the above problems, embodiments of the present invention disclose a flexible cover plate, a flexible component and an electronic device.

A flexible cover plate comprises a hard layer arranged on one side and a connecting layer arranged on the other side far away from the hard layer.

Further, the connecting layer includes a tack reducing layer for reducing adhesion.

Further, the adhesion shape of the adhesion-reducing layer may be the whole surface or may be patterned.

Further, the adhesion reducing layer reduces the adhesion force when a first condition is satisfied, and the adhesion force remains unchanged when the first condition is not satisfied.

Further, the first condition includes at least one of ultraviolet light irradiation, infrared light irradiation, laser light irradiation, application of an electric field, application of a force field, application of a magnetic field, and heating.

Further, the flexible cover plate also comprises a protective layer for reducing energy transmission.

Further, the protective layer is used for reducing energy transmission along the stacking direction of the flexible cover plate.

Further, the protective layer is sandwiched between the anti-sticking layer and the hard layer.

Further, the protective layer includes an energy absorbing layer through which energy input under the first condition is absorbed.

Further, the protective layer includes polyethylene terephthalate added with a reinforcing fiber.

Further, the protective layer includes a heat dissipation layer, the energy input under the first condition includes heat, and the heat dissipation layer blocks the heat transmitted along the stacking direction of the flexible cover plate and dissipates the heat along a direction perpendicular to the stacking direction of the flexible cover plate.

Further, the heat dissipation layer is made of at least one of heat-conducting graphene, heat-conducting adhesives, heat-conducting silicon esters, heat-conducting silica gels, heat-conducting rubbers and heat-conducting molybdenum sulfide.

Furthermore, the material of the energy absorption layer comprises at least one of amorphous silicon, indium tin oxide, indium gallium zinc oxide, aluminum titanium oxide and porous silica gel.

Further, an organic heterocyclic compound is doped in the energy absorption layer.

Further, the flexible cover plate further comprises a base material, and the base material is clamped between the hard layer and the protective layer.

Furthermore, the flexible cover plate further comprises a shielding layer, the shielding layer is arranged on one side, far away from the anti-adhesion layer, of the protective layer and is in a patterned shape, and the base material is formed on the shielding layer and the protective layer.

The material of the substrate further comprises at least one of polyethylene terephthalate, polyimide, cyclic olefin polymer, polymethyl methacrylate, epoxy resin compound, organic alcohol ester, inorganic amine and the like.

Further, the flexible cover plate further comprises an optical adhesive layer, and the optical adhesive layer is formed between the hard layer and the protective layer.

Further, the viscosity reducing layer comprises at least one of an ultraviolet viscosity reducing layer, an infrared viscosity reducing layer, a laser viscosity reducing layer, a force viscosity reducing layer, an electric viscosity reducing layer, a magnetic viscosity reducing layer and a thermal viscosity reducing layer.

Further, the hard layer comprises at least one of acrylate, polyethylene terephthalate, titanium nitride, aluminum titanium carbonitride compound and tungsten sulfide.

Further, flexible apron still includes from the type rete, from the type rete laminating in the visbreaking layer is kept away from one side of hard layer.

Further, the flexible cover plate further comprises a protective film layer, and the protective film layer is attached to one side, far away from the connecting layer, of the hard layer.

A flexible component comprises a flexible module and the flexible cover plate, wherein the flexible cover plate and the flexible module are bonded together through the connecting layer.

Further, the flexible module comprises at least two functional layers which are stacked, the at least two functional layers comprise a display functional layer and a supporting layer which are stacked, and the display functional layer is arranged on one side, adjacent to the connecting layer, of the flexible module.

Furthermore, the display function layer comprises a polarization layer, a thin film transistor layer and an organic light emitting layer which are sequentially stacked, and the polarization layer is arranged adjacent to the connecting layer.

Furthermore, the at least two functional layers further comprise a touch layer, and the touch layer is arranged on one side of the display functional layer far away from the support layer and is bonded with the connecting layer.

An electronic device comprising a flexible component as described above.

According to the flexible cover plate, the flexible component and the electronic device, the hard layer and the connecting layer are respectively arranged on the two sides of the flexible cover plate, in other words, one side of the flexible cover plate has the characteristics of hardness, abrasion resistance, scratch resistance and the like, so that the flexible cover plate has the characteristics of hardness, abrasion resistance and scratch resistance meeting the requirements, and the service life of the flexible cover plate is prolonged. In addition, under the condition of applying a first condition (such as ultraviolet light/infrared light/laser irradiation/heating/pressurizing/electrifying/magnetizing and the like), the adhesion force of the adhesion-reducing layer adhered to the flexible module is reduced, and the flexible cover plate is convenient to replace for the flexible component.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic cross-sectional view of a flexible member according to a first embodiment of the present invention.

Fig. 2 is a schematic cross-sectional view of a flexible component according to an embodiment of the invention.

Fig. 3 is a schematic cross-sectional view of a flexible member according to a second embodiment of the present invention.

Fig. 4 is a schematic cross-sectional view of a flexible member according to a third embodiment of the present invention.

Fig. 5 is a schematic cross-sectional view of a flexible member according to a fourth embodiment of the present invention.

Fig. 6 is a schematic cross-sectional view of a flexible member according to a fifth embodiment of the present invention.

Fig. 7 is a schematic view of the flexible cover shown in fig. 6 with a release film layer and a protective film layer.

Fig. 8 is a schematic cross-sectional view of a flexible member according to a sixth embodiment of the present invention.

Fig. 9 is a schematic cross-sectional view of a flexible member according to a seventh embodiment of the present invention.

Fig. 10 is a schematic view of an electronic device having a flexible member.

Fig. 11 is a schematic flow chart of a peeling method according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, a flexible component 10 according to a first embodiment of the present invention includes a flexible cover 11 and a flexible module 13. The flexible cover 11 is attached to the flexible module 13 for protecting the flexible module 13. In this embodiment, the flexible module 13 is a flexible display module. In other embodiments, the flexible module 13 may be a flexible touch module or include both a flexible display module and a flexible touch module. Obviously, the flexible cover 13 can be attached to other modules or structures, such as a rigid display module, or a rigid touch module. In some embodiments, the flexible cover 11 may also be disposed on a rear case of an electronic device such as a mobile phone, a tablet computer, etc., and serves as a rear case protection cover.

One side of the flexible cover plate 11 is provided with a hard layer 111, and the other side of the flexible cover plate 11 far away from the hard layer 111 is provided with a connecting layer 116. The flexible cover 11 and the flexible module 13 are connected together by the connection layer 116. In this embodiment, the connection layer 116 includes a viscosity reducing layer 117, and the flexible cover 11 and the flexible module 13 are adhered together through the viscosity reducing layer 117. In other embodiments, the connecting layer 116 may be an adhesive layer, a support layer, or the like for connection.

In an embodiment, the flexible cover plate 11 further includes at least one of a substrate 113, an optical adhesive layer 114, and a protective layer 115, and the at least one of the substrate 113, the optical adhesive layer 114, and the protective layer 115 is sandwiched between the hard layer 111 and the adhesion reducing layer 117. The hard layer 111 may be formed by applying a hard coating material to a layer of the structure furthest from the adhesion-reducing layer 117 to enhance the strength, hardness, and wear resistance of the flexible cover sheet 11. The hard layer 117 includes organic compounds such as acrylates and polyethylene terephthalates, and inorganic compounds such as titanium nitride, aluminum titanium carbonitride, and tungsten sulfide. In this embodiment, the hard layer 111 is formed on the side of the substrate 113 away from the anti-sticking layer 117 by a Coating (Coating) technique, wherein the Coating technique may be: a Roll to Roll Coating technique, a Spin Coating (Spin Coating) method, a Slit and Spin Coating (Slit Coating) method, a Slit Coating (Slit Coating) method, and the like. When the hard layer 117 is made of an organic compound, a Chemical Vapor Deposition (CVD) technique or a Physical Vapor Deposition (PVD) technique may be used. When the material of the hard layer 117 has conductivity, a Sputtering (Sputtering) method, an Ink jet printing (Ink jet printing) method, a Screen printing (Screen printing) method, or the like may be used.

In the embodiment shown in fig. 1, the flexible cover 11 includes a hard layer 111, a substrate 113, an optical adhesive layer 114, a protective layer 115, and a connection layer 116, which are sequentially stacked. The hard layer 111 is formed by applying a hard coating material to the substrate 113, so as to enhance the strength, hardness, wear resistance, scratch resistance, and the like of the flexible cover plate 11.

In other embodiments, the flexible cover plate 11 may only include the substrate 113 and the optical adhesive layer 114 stacked between the hard layer 111 and the adhesion-reducing layer 117, or only include the protective layer 115 sandwiched between the hard layer 111 and the adhesion-reducing layer 117. Obviously, when the flexible cover plate 11 only includes the protective layer 115 sandwiched between the hard layer 111 and the adhesion reducing layer 117, the hard layer 111 is formed by applying a hard coating material on the protective layer 115. The material of the substrate 113 includes Polyethylene terephthalate (PET), and it is understood that the substrate 113 includes PET, Polyimide (PI), Cyclo-olefin polymer (COP), polymethyl methacrylate (PMMA), Cyclo-olefin polymer, polymethyl methacrylate, epoxy resin compound, organic alcohol ester and other organic compounds, and thinned glass and other inorganic materials.

The protective layer 115 serves to reduce energy transmission. Further, the protective layer 115 serves to reduce energy transmission in the stacking direction of the flexible cover sheet 11. The stacking direction is a stacking direction of each layer structure of the flexible cover plate 11, and in the present embodiment, the stacking direction is a direction in which the hard layer 111, the base material 113, the optical adhesive layer 114, the protective layer 115, and the adhesion-reducing layer 117 are stacked. The protection layer 115 is bonded to the substrate 113 through the optical adhesive layer 114, and is used to prevent excessive energy from entering the flexible module 13, so as to prevent damage to the functions/performances of the functional devices of the flexible module 13. The adhesion reducing layer 117 is adhered between the flexible module 13 and the protection layer 115 for adhering the flexible cover 11 to the flexible module 13. In this embodiment, the thickness of the flexible cover 11 can be made different according to the product requirement (the thickness of the flexible cover is preferably 200 μm or less), and the thickness of the hard layer 111 and the viscosity-reducing layer 117 can be made different according to the product requirement (the thickness of the flexible member is preferably 50 μm or less).

The adhesion-reducing layer 117 reduces the adhesion force when the first condition is satisfied, and the adhesion force remains unchanged when the first condition is not satisfied. The first condition is applied to provide energy to the adhesion-reducing layer 117, so that the adhesion force of the adhesion-reducing layer 117 to the flexible module 13 is reduced, and the adhesion-reducing layer 117 can be easily peeled off from the flexible module 13. In this embodiment, after the first condition is applied, the adhesion force of the anti-adhesion layer 117 adhered to the flexible module 13 is reduced from 0.1 to 3kg/inch to 100g/inch and below, for example, 8g/inch and 36g/inch, so as to ensure that the flexible cover plate 11 can be easily peeled off from the flexible module 13, the peeling method can be manual film tearing and automatic film tearing by a machine, the film tearing angle is in the range of 10 to 80 degrees (more preferred angle is 30 to 60 degrees), the film tearing speed is in the range of 100 to 1000mm/min (more preferred speed is 300 to 600mm/min), and the flexible module 13 cannot be damaged or partially remain on the flexible module 13 under the film tearing condition.

The first condition is applied, namely, the anti-adhesion layer 117 is placed in an optical field (such as ultraviolet light/infrared light/laser irradiation), and the anti-adhesion layer 117 absorbs certain energy, so that the adhesion force of the anti-adhesion layer 117 to the flexible module 13 is reduced; or the adhesion-reducing layer 117 is placed in an electric field (current voltage is applied, and heat is generated electrically), and the adhesion-reducing layer 117 absorbs a certain amount of energy, so that the adhesion force of the adhesion-reducing layer 117 to the flexible module 13 is reduced; or the anti-sticking layer 117 is placed in a magnetic field (a magnetic field is applied to convert the magnetic field into an electric field, and the electric field generates heat), and the anti-sticking layer 117 absorbs certain energy, so that the adhesion force of the anti-sticking layer 117 adhered to the flexible module 13 is reduced; or a force field, for example, the adhesion-reducing layer 117 is made of a piezoelectric material with viscosity, when a force is applied to the piezoelectric material, the piezoelectric material generates a voltage, which is equivalent to applying an electric field to the adhesion-reducing layer 117, and the adhesion-reducing layer 117 absorbs a certain amount of energy, resulting in a decrease in the adhesion force of the adhesion-reducing layer 117 to the flexible module 13; alternatively, the adhesion-reducing layer 117 is heated, and the adhesion-reducing layer 117 absorbs a certain amount of energy, so that the adhesion force of the adhesion-reducing layer 117 to the flexible module 13 is reduced. The first condition includes at least one of ultraviolet irradiation, infrared irradiation, laser irradiation, application of an electric field, application of a force field, application of a magnetic field, and heating.

In the present embodiment, the anti-adhesion layer 117 is an ultraviolet anti-adhesion layer capable of absorbing ultraviolet light with a certain wavelength, for example, a wavelength within a range of 200 to 400 nm. Specifically, in the present embodiment, the material of the anti-sticking layer 117 includes Pressure Sensitive Adhesive (PSA). The flexible module of the PSA is polyacrylate (commonly known as acrylic). The polyacrylate is a polymer, and when the polyacrylate is irradiated by ultraviolet light, the polyacrylate is decomposed, so that the adhesion force of the bonding interface of the adhesion-reducing layer 117 is greatly reduced, and the flexible module 13 is easy to separate.

It is understood that the uv adhesion reducing layer may be made of other acrylates, for example, an acrylate can release nitrogen under uv irradiation, i.e., a gas-generating type peeling mechanism is used to reduce the adhesion of the adhesion reducing layer 117 to the flexible module 13.

It is understood that the adhesion reducing layer 117 comprises one of acrylates, silicones, rubbers, polyurethanes doped with light responsive supramolecules, and the adhesion of the adhesion reducing layer 117 is reduced upon exposure to uv light. It is understood that the adhesion reducing layer includes one of acrylates, silicones, rubbers, and polyurethanes, and the acrylate reduces adhesion by generating nitrogen gas upon exposure to ultraviolet light.

It is understood that the adhesion reducing layer 117 may include at least one of an ultraviolet adhesion reducing layer, an infrared adhesion reducing layer, a laser adhesion reducing layer, a force adhesion reducing layer, an electrical adhesion reducing layer, a magnetic adhesion reducing layer, and a thermal adhesion reducing layer, and the adhesion reducing layer 117 may also be selected from other materials with reduced adhesion under the action of heat, and the heat may be realized by electrical conversion, magnetic conversion, force conversion, and the like.

Further, the protective layer 115 includes an energy absorbing layer 1151. The energy input in the first condition is absorbed by the energy absorption layer 1151, for example, the energy of the uv/ir/laser entering the flexible module 13 is reduced or decreased, so as to reduce the damage to the function/performance of the flexible module 13. The energy absorbing layer 1151 is made of amorphous silicon, indium tin oxide, indium gallium zinc oxide, aluminum titanium oxide, porous silica gel, or the like. For example, the energy absorption layer 1151 is amorphous silicon (α -Si), and since the amorphous silicon (α -Si) absorbs energy (laser/uv irradiation) and then converts into bond energy, the bonding condition between atoms is changed, so that the material property is changed to achieve the effect of the absorption layer (absorption of light/energy, etc.).

In one embodiment, the energy absorbing layer 1151 includes one of a polyethylene terephthalate compound, a cyclic olefin polymer, and a polymethyl methacrylate compound to which a reinforcing fiber is added.

In one embodiment, the energy absorbing layer 1151 may be formed by doping a material with an organic heterocyclic compound such as hydroxybenzotriazine, in which a chemical bond changes from a ground state (low energy level) to a non-ground state (high energy level) and generates ions when irradiated with ultraviolet light, and the process is a reversible chemical bond change; finally, the hydroxyl triazine organic heterocyclic compound can fully absorb ultraviolet light to achieve the effect of blocking the ultraviolet light.

Further, the protective layer 115 also includes a heat dissipation layer 1153 disposed in a stack with the energy absorbing layer 1151. The energy input in the first condition includes heat, and the heat dissipation layer 1153 blocks the heat transmitted in the stacking direction of the flexible cover plates 11 and dissipates the heat in a direction perpendicular to the stacking direction of the flexible cover plates 11. The heat dissipation layer 1153 is disposed between the energy absorption layer 1151 and the adhesion reduction layer 117 for dissipating heat so as to prevent excessive energy from entering the flexible module 13 and damaging the function/performance/structure of the flexible module 13. The heat dissipation layer 1153 is made of heat conductive graphene, heat conductive adhesives, heat conductive silicone esters, heat conductive silicone gels, heat conductive rubbers, heat conductive molybdenum sulfides, and the like, so that the effects of transverse heat dissipation/heat transfer and longitudinal non-heat dissipation/heat transfer are achieved, and the effects of two-dimensional plane heat dissipation and vertical heat insulation are achieved. The longitudinal direction is a direction substantially perpendicular to the flexible cover 11, and the lateral direction is a direction substantially parallel to the flexible cover 11.

Since the cap layer 115 has two energy-reducing layers, an energy absorbing layer 1151 and a heat sink layer 1153. Among these, when using ultraviolet radiation for detackification, the energy absorbing layer 1151 functions: firstly, the ultraviolet energy can be regulated and controlled; second, the heat dissipation layer 1153 can also be used as a passivation layer. When thermal excitation is used for viscosity reduction, the heat dissipation layer 1153 plays a role in protection; the energy absorbing layer 1151 and the heat dissipating layer 1153 may provide dual protection to the flex module 13. It is understood that the energy absorbing layer 1151 can be disposed between the heat spreading layer 1153 and the adhesion reducing layer 117.

It is understood that the protective layer 115 includes at least one of the energy absorbing layer 1151 and the heat spreading layer 1153, e.g., only the heat spreading layer 1153. The protection layer 115 may be configured according to the performance of the anti-adhesive layer 117, for example, if the anti-adhesive layer 117 is an infrared light anti-adhesive layer, the protection layer 115 is correspondingly configured to be a layer capable of blocking infrared light, so as to prevent the infrared light from entering the structure below the protection layer 115; for another example, in an application where the adhesion-reducing layer 117 is electrically heated for adhesion reduction, the protective layer 115 may be configured as a heat sink layer, and so on.

Further, the flexible cover plate 11 further includes a shielding layer 119, and the shielding layer 119 is formed on a side of the optical adhesive layer 114 away from the protection layer 115. The shielding layer 119 is disposed at the edge region of the optical adhesive layer 114 to shield the routing structure disposed at the edge region of the flexible module 13, so as to improve the appearance of the flexible component 10, and further improve the user experience. In this embodiment, the ink is applied to the optical adhesive layer 114 to form a patterned mask layer 119, and then the base material 113 is formed on the optical adhesive layer 114 and the mask layer 119. It can be understood that the shielding layer 119 can be made of other opaque materials or materials with low transmittance, so as to achieve the purpose of shielding. It is understood that the shielding layer 119 can also be formed by applying ink to the substrate 113 away from the hard layer 111. In other words, the shielding layer 119 has a patterned shape, and may be formed on the base material 113 of the flexible cover sheet 11, or may be formed on another film material.

The flexible module 13 includes at least two functional layers 130 stacked together, and the at least two functional layers 130 include a display functional layer 135 and a support layer 137. The display function layer 135 includes a polarizing layer 1351, a thin-film-transistor layer 1353, and an organic light-emitting layer 1355, which are sequentially stacked, wherein the polarizing layer 1351 is disposed adjacent to the anti-stiction layer 117.

The at least two functional layers 130 further include a touch layer 131. The touch layer 131 is disposed on a side of the polarizing layer 1351 of the display function layer 135 away from the support layer 137. The touch layer 131 is adhered to the anti-adhesion layer 117. In other words, the anti-adhesion layer 117 is adhered between the touch layer 131 and the protection layer 115, and the side of the anti-adhesion layer 117 away from the protection layer 115 is adhered to the touch layer 131. The touch layer 131 is used for providing a touch input function.

When the flexible cover 11 needs to be replaced due to excessive wear, breakage, air bubbles, etc. after the flexible component 10 is used for a period of time, the first condition (for example, ultraviolet light/infrared light/laser irradiation/heating/pressurizing/energizing/magnetizing, etc.) is applied to the flexible component 10 to provide energy, and after the adhesion-reducing layer 117 absorbs a certain amount of energy, the adhesion force of the adhesion-reducing layer 117 adhering to the flexible module 13 is reduced, and the flexible cover 11 is peeled off from the flexible module 13 by equipment or manually. And then the new flexible cover plate 11 is attached to the flexible module 13 through equipment or manual work.

Because the hard layer 111 and the anti-sticking layer 117 are respectively disposed on two sides of the flexible cover plate 11, in other words, one side of the flexible cover plate 11 has the characteristics of hardness, wear resistance, scratch resistance, etc., and the other side has the characteristics of viscosity, flexibility, etc., the flexible cover plate 11 is resistant to bending while having the characteristics of hardness, wear resistance, scratch resistance, etc., which meet the requirements, and the service lives of the flexible cover plate 11 and the flexible component 10 are also prolonged. In addition, under the first condition (for example, ultraviolet light/infrared light/laser irradiation/heating/pressurizing/energizing/magnetizing, etc.), the adhesion force of the adhesion-reducing layer 117 adhering to the flexible module 13 is reduced, which facilitates the flexible cover 11 to be replaced by the flexible component 10. Further, the flexible cover 11 is provided with a protective layer 115 to prevent excessive energy from entering the flexible module 13 during the process of providing energy to the adhesion reducing layer 117 to damage the function/performance of the flexible module 13.

The anti-adhesion layer 117 is applied over the entire surface or patterned. In other words, the adhesion shape of the adhesion-reducing layer 117 may be the whole surface or may be patterned, that is, at least a portion of the adhesion-reducing layer 117 is adhered to the flexible module 13, for example, the adhesion-reducing layer 117 completely covers the touch layer 131; alternatively, referring to fig. 2, the adhesion-reducing layer 117 is patterned by forming at least one trench 1171 in the adhesion-reducing layer 117. The channel 1171 can be disposed through the entire adhesion-reducing layer 117 or can be disposed without extending through the entire adhesion-reducing layer 117. The formation of the at least one channel 1171 by the adhesion-reducing layer 117 can enhance the flexibility of the flexible cover sheet 11.

Referring to fig. 3, a flexible member 20 according to a second embodiment of the present invention includes a flexible cover 21 and a flexible module 23 adhered to the flexible cover 21. The structure of the flexible cover 21 is substantially the same as that of the flexible cover 11 provided in the first embodiment. The flexible cover 21 includes a hard layer 211, a base 213, a protective layer 215, and an adhesion reducing layer 217 stacked in this order. The difference is that the optical glue layer is omitted from the flexible cover 21, and the protective layer 215 is in direct contact with the substrate 213, thereby reducing the thickness of the flexible cover 21. The material of the substrate 213 includes polyethylene terephthalate, polymethyl methacrylate, polyimide, cyclic olefin polymer, polymethyl methacrylate, epoxy resin compound, and a mixture of organic alcohol esters and inorganic amines, etc. to ensure sufficient strength and hardness of the flexible cover 21. In this embodiment, the protective layer 215 is a heat dissipation layer, and it implements the effects of lateral heat dissipation/heat transfer and longitudinal non-heat dissipation/heat transfer by using heat conductive graphene, heat conductive adhesives, heat conductive silicone esters, heat conductive silicone gels, heat conductive rubbers, heat conductive molybdenum sulfides, etc., and implements the effects of two-dimensional planar heat dissipation and vertical heat insulation.

Further, the flexible cover 21 further includes a shielding layer 219 formed on the protective layer 215 away from the anti-sticking layer 217.

Referring to fig. 4, a flexible component 30 according to a third embodiment of the present invention includes a flexible cover 31 and a flexible module 33. The flexible cover 31 is adhered to the flexible module 33 to protect the flexible module 33.

The flexible cover 31 includes a hard layer 311 and a viscosity reducing layer 317 stacked in this order. In this embodiment, the adhesion reducing layer 317 includes a base layer 3171 and an adhesive layer 3173, which are stacked, in other words, the adhesion reducing layer 317 is a single-sided adhesive, and the hard layer 311 is formed on a side of the base layer 3171 away from the adhesive layer 3173. It is understood that the adhesion reducing layer 317 may be a double-sided adhesive layer, and the hard layer 311 is directly disposed on one of the adhesive surfaces of the adhesion reducing layer 317.

The flexible module 33 includes a protective layer 331 and a functional layer 333 which are stacked. The adhesive layer 3173 is bonded to the side of the protective layer 331 away from the functional layer 333. The protective layer 331 serves to prevent excessive energy from entering the functional layer 333 to damage the functional layer 333. The functional layer 333 may include a touch layer, a display functional layer, a support layer, and the like, which are stacked and are not described herein.

Compared with the flexible component 10 provided in the first embodiment, in the flexible component 30 provided in the third embodiment, the flexible cover plate 31 is only provided with the hard layer 311 and the viscosity reducing layer 317, so as to reduce the thickness of the flexible cover plate 30, but at the same time, the flexible cover plate 31 has certain hardness, wear resistance and scratch resistance, and the flexible cover plate 31 is convenient to replace the flexible cover plate 31 by the flexible component 30, and the protective layer 331 is disposed on one side of the flexible module 33 adjacent to the flexible cover plate 31, so that the functional layer 333 is prevented from being damaged due to excessive energy entering the functional layer 333. In addition, the flexible cover plate 31 is only provided with the hard layer 311 and the viscosity reducing layer 317, the flexibility of the flexible cover plate is high, and the protection layer 331 is arranged on the flexible module 33, so that the flatness of the flexible cover plate 31 attached to the flexible module 33 can be improved, and bubbles can be avoided.

Further, the flexible module 33 further includes a shielding layer 339. The shielding layer 339 is formed in the edge area of the protection layer 331 away from one side of the flexible cover plate 31, in other words, the shielding layer 339 is arranged corresponding to the edge area of the functional layer 333 to shield the routing structures and the like of the flexible module 33, so that the appearance of the flexible component 30 is improved, and the use experience of a user is further improved. In this embodiment, the shielding layer 339 is formed by applying ink to the edge region of the protective layer 331 on the side away from the flexible cover 31.

Referring to fig. 5, a flexible member 40 according to a fourth embodiment of the present invention includes a flexible cover 41 and a flexible module 43. The flexible cover 41 is adhered to the flexible module 43 to protect the flexible module 43. The flexible cover 41 includes a hard layer 411, and the flexible module 43 includes a stacked anti-adhesion layer 431 and a functional layer 433. The adhesion reducing layer 431 is formed on the functional layer 433. The flexible cover 41 is bonded to the flexible module 43 by the adhesion reducing layer 431. The anti-sticking layer 431 is disposed on the flexible module 43, which is beneficial to reducing the thickness of the flexible cover plate 41. The functional layer 443 may include at least one of a touch layer, a display functional layer, a support layer, and an optical adhesive layer.

Further, the flexible module 43 further includes a shielding layer 439. A shielding layer 439 is formed at an edge region of the adhesion reducing layer 431 on the side away from the flexible cover plate 41, in other words, the shielding layer 439 is disposed corresponding to the edge region of the functional layer 433.

Further, the flexible cover 41 further includes a base 413, and in the present embodiment, the hard layer 411 is formed on the base 413, and it is understood that the base 413 may be replaced by at least one of an optical adhesive layer and a protective layer.

Referring to fig. 6, a flexible member 50 according to a fifth embodiment of the present invention includes a flexible cover 51 and a flexible module 53, in which the flexible display cover 51 includes a substrate 511 and an adhesion-reducing layer 513 stacked on each other. The flexible module 53 includes a protective layer 530 and at least one functional layer 531. The at least one functional layer 531 includes a first optical adhesive layer 533, a touch layer 534, a second optical adhesive layer 535, and a display functional layer 537 sequentially stacked. The protective layer 530 is adhered to the anti-adhesive layer 513.

It is understood that the thickness of each layer of the flexible cover 51, the thickness of the protective layer 530 in the flexible module 53 and the thickness of each functional layer are set according to the actual application.

In this embodiment, the anti-adhesion layer 513 is an ultraviolet anti-adhesion layer capable of absorbing ultraviolet light with a certain wavelength, such as a wavelength in the range of 200-400 nm. Specifically, in the present embodiment, the material of the anti-sticking layer 513 includes a pressure sensitive adhesive. The flexible module component of the pressure-sensitive adhesive is polyacrylate. When irradiated by ultraviolet light, the polyacrylate decomposes, so that the anti-adhesive layer 513 easily detaches from the flexible mold 53. It is understood that the uv detackifying layer may be made of other acrylates, for example, an acrylate which releases nitrogen under uv irradiation, i.e., a gas-generating type peeling mechanism is used to reduce the adhesion of the detackifying layer 513 to the flexible mold 53.

The protection layer 530 includes an ultraviolet light absorption layer. In this embodiment, the material of the protection layer 530 includes PET. PET has excellent mechanical property and friction and abrasion performance. By adding reinforcing fibers (e.g., uv absorbers) to the PET, the heat resistance and uv resistance of the PET are improved, thereby blocking excessive uv light from entering the underside of the protective layer 530. It is understood that adding different additives to PET, or blending PET with other materials (e.g., by blending to form a polymer alloy), improves the properties of PET, enhances desired properties, such as heat dissipation, uv light resistance, ir light resistance, and the like. It is understood that the material of the protection layer 530 includes at least one of PET, PI, COP, and PMMA with the reinforced fiber.

It is understood that the protection layer 530 may be configured according to the performance of the anti-adhesion layer 513, for example, if the anti-adhesion layer 513 includes an infrared light anti-adhesion film layer, the protection layer 530 is correspondingly configured as a film layer capable of blocking infrared light, so as to prevent the infrared light from entering into the structure below the protection layer 530; for another example, in an application where the adhesion-reducing layer 513 is electrically heated for adhesion reduction, the protective layer 530 may be configured as a heat sink layer, and so on.

In one embodiment, referring to fig. 7, the flexible cover 51 further includes a release film layer 515. The release film layer 515 covers a side of the adhesion-reducing layer 513 away from the substrate 511, and is used for protecting the adhesion-reducing layer 513, so as to prevent the adhesion-reducing layer 513 (for example, when the flexible cover plate 51 is not used) from being contaminated when the flexible cover plate 51 is not attached to the flexible module 53, that is, other impurities are adhered, thereby preventing the adhesion-reducing layer 513 from being badly attached to the flexible module 53, and preventing the use effect of the flexible component 50 from being affected.

Further, the flexible cover plate 51 further includes a hard layer 517, and the hard layer 517 is disposed on a side of the substrate 511 away from the adhesion-reducing layer 513. In this embodiment, the hard layer 517 may be formed by applying a hard coating material to a side of the substrate 511 away from the adhesion-reducing layer 513. In this embodiment, the hard layer 517 is formed on the side of the substrate 511 away from the adhesion-reducing layer 513 by a Coating technique, such as a Roll to Roll Coating technique, a Spin Coating technique, a Slit Coating technique, or the like. When the hard layer 117 is made of an organic compound, a Chemical Vapor Deposition (CVD) technique or a Physical Vapor Deposition (PVD) technique may be used. When the material of the hard layer 117 has conductivity, Sputtering (Sputtering), inkjet printing (Ink jet printing), Screen printing (Screen printing), or the like can be used.

Further, the flexible cover plate 51 further includes a protection film layer 519, and the protection film layer 519 covers a side of the hard layer 517 far from the base material 511, so as to protect the hard layer 517, thereby preventing the hard layer 517 of the flexible cover plate 51 (for example, when the flexible cover plate 51 is not used) from being scratched due to abrasion, and affecting the appearance of the flexible component 50.

Further, referring to fig. 6 again, the flexible module 53 further includes a shielding layer 539, the shielding layer 539 is formed at an edge region of the protection layer 530 on a side away from the flexible cover plate 51, and the shielding layer 539 is disposed around the first optical adhesive layer 533. In this embodiment, the shielding layer 539 is formed by printing ink on the edge region of the protective layer 530 on the side away from the flexible cover 51. The protective layer 530 and the blocking layer 539 are well bonded together.

An anti-sticking layer 513 is added on the flexible cover 51, and the anti-sticking layer 513 ensures that the flexible cover 51 can be easily peeled off from the flexible module 53. In addition, a protective layer 530 is additionally arranged on one side of the flexible module 53 adjacent to the flexible cover plate 51, and in the process of ultraviolet light/infrared light/laser irradiation, the protective layer 530 prevents excessive energy from entering the functional layer 531 and the structure on the lower side of the protective layer 530, so that the temperature is too high, the performance and the function of each functional layer 550 are affected, or the structure of each functional layer 550 is damaged; or the protective layer 530 only transfers heat in the transverse direction under the thermal excitation effect, so as to prevent the heat from transferring in the longitudinal direction to affect the performance and function of each functional layer 550, or damage to the structure of each functional layer 550. Further, in the process of peeling the flexible cover 51 from the flexible module 53, the protective layer 530 can prevent the other functional layers 531 on the lower side of the protective layer 530 from being adhered by the adhesion-reducing layer 513 and not damaged.

Referring to fig. 8, a flexible member 60 according to a sixth embodiment of the present invention includes a flexible cover 61 and a flexible module 63. The flexible cover 61 is adhered to the flexible module 63 to protect the flexible module 63. The structure of the flexible cover 61 is substantially the same as that of the flexible cover 21 provided in the second embodiment. The flexible cover 61 includes a hard layer 611, an optical adhesive layer 613, a protective layer 615, and a tack-reducing layer 617, which are sequentially stacked. The flexible cover 61 is clearly distinguished from the flexible cover 21 in that the base material 213 is replaced by an optical glue layer 613. The flexible cover 61 has excellent bending performance, and the cost of the flexible cover 61 can be reduced.

Further, the flexible cover plate 61 also includes a shielding layer 619. The shielding layer 619 is formed on the side of the protection layer 615 away from the anti-adhesive layer 617.

Referring to fig. 9, a seventh embodiment of the invention provides a flexible component 70, which includes a flexible cover 71 and a flexible module 73. The flexible cover 71 is adhered to the flexible module 73 to protect the flexible module 73. The structure of the flexible cover 71 is substantially the same as that of the flexible cover 21 provided in the second embodiment. The flexible cover 71 includes a hard layer 711, a protective layer 713, a substrate 715, and an adhesion-reducing layer 717 sequentially stacked. It is clear that the flexible cover 71 differs from the flexible cover 21 in that the substrate 715 is sandwiched between the protective layer 713 and the adhesion-reducing layer 717.

In summary of the discussion of the flexible component 10 according to the first embodiment, the flexible component 20 according to the second embodiment, the flexible component 30 according to the third embodiment, the flexible component 40 according to the fourth embodiment, the flexible component 50 according to the fifth embodiment, the flexible component 60 according to the sixth embodiment, and the flexible component 70 according to the seventh embodiment of the present invention, it is obvious that the adhesion reducing layer may be provided on the flexible cover plate and the flexible module, in other words, one of the flexible cover plate and the flexible module includes the adhesion reducing layer to adhere the flexible cover plate to the flexible module.

It can be understood that the protection layer may be disposed on the flexible cover plate or on the flexible module, in other words, at least one of the flexible cover plate and the flexible module includes the protection layer, so as to prevent excessive energy from entering the flexible module and affecting the structure/function/performance of the flexible module, and thus the quality of the flexible component.

In summary, in the flexible component, the adhesion reducing layer is stacked on the protective layer, the adhesion reducing layer may be stacked directly on the protective layer, or the adhesion reducing layer may be stacked indirectly on the protective layer, in other words, the adhesion reducing layer may directly contact with the protective layer, or the adhesion reducing layer may not contact with the protective layer.

Referring to fig. 10, the present invention further provides an electronic device 200 having a flexible component, where the flexible component may be one of the flexible component 10 provided in the first embodiment, the flexible component 20 provided in the second embodiment, the flexible component 30 provided in the third embodiment, the flexible component 40 provided in the fourth embodiment, the flexible component 50 provided in the fifth embodiment, the flexible component 60 provided in the sixth embodiment, and the flexible component 70 provided in the seventh embodiment, and the electronic device 200 may be a mobile phone, a tablet computer, a television, a reader, a navigator, a game console, and the like.

Referring to fig. 11, the present invention further provides a method for peeling off the flexible cover plate, which specifically includes the following steps:

step 201, applying a first condition to a component with the flexible cover plate, providing energy to a viscosity reducing layer of the component, wherein the adhesion force of the viscosity reducing layer is reduced, and the first condition comprises at least one of ultraviolet light irradiation, infrared light irradiation, laser light irradiation, electric field application, force field application, magnetic field application and heating;

step 202, peeling the flexible cover plate from the component.

The component is the flexible component, the flexible component comprises the flexible module, and the flexible cover plate is bonded with the flexible module through the flexible module. It is understood that in one embodiment, the components may include a flexible cover and a rigid module, such as a rigid display module, or a rigid touch module, or a rigid display touch module, etc.

Wherein in the step of reducing the adhesion of the anti-adhesive layer, the adhesion of the anti-adhesive layer is reduced from 0.1-3 kg/inch to 100g/inch or less.

Wherein, will flexible apron is followed the part is peeled off, peel off the mode and can adopt artifical manual dyestripping and the automatic dyestripping of board, will flexible apron follow the dyestripping angle that the part was peeled off is in 10 ~ 80 degrees (more preferred angle 30 ~ 60 degrees) within ranges, also can not cause any damage or part to flexible part under this dyestripping condition on the flexible part.

Further, the film tearing speed for peeling the flexible cover plate from the component is within the range of 100-1000 mm/min (more preferably 300-600 mm/min).

While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention.

Claims

The flexible cover plate is characterized by comprising a hard layer arranged on one side and a connecting layer arranged on the other side far away from the hard layer.
The flexible cover sheet of claim 1, wherein the tie layer comprises a tack-reducing layer for reducing adhesion.
The flexible cover sheet of claim 2, wherein the anti-tack layer is applied over the entire surface or patterned and then applied.
The flexible cover sheet of claim 2, wherein the adhesion-reducing layer reduces in adhesion when a first condition is met and remains unchanged when the first condition is not met.
The flexible cover of claim 4, wherein the first condition comprises at least one of ultraviolet light irradiation, infrared light irradiation, laser light irradiation, application of an electric field, application of a force field, application of a magnetic field, and heating.
The flexible cover of claim 1, further comprising a protective layer for reducing energy transmission.
The flexible cover sheet of claim 6, wherein the protective layer is configured to reduce energy transmission in a stacking direction of the flexible cover sheet.
The flexible cover sheet of claim 6, wherein the protective layer is sandwiched between the adhesion-reducing layer and the stiff layer.
The flexible cover of claim 6, wherein the protective layer comprises an energy absorbing layer through which energy input under a first condition is absorbed.
The flexible cover sheet of claim 6, wherein the protective layer comprises polyethylene terephthalate with added reinforcing fibers.
The flexible cover sheet of claim 6, wherein the protective layer comprises a heat dissipation layer, the energy input under the first condition comprises heat, and the heat dissipation layer blocks heat transmitted in a stacking direction of the flexible cover sheet and dissipates heat in a direction perpendicular to the stacking direction of the flexible cover sheet.
The flexible cover sheet of claim 11, wherein the heat dissipation layer is made of at least one material selected from the group consisting of thermally conductive graphene, thermally conductive adhesives, thermally conductive silicones, thermally conductive rubbers, and thermally conductive molybdenum sulfides.
The flexible cover sheet of claim 9, wherein the energy absorbing layer comprises at least one of amorphous silicon, indium tin oxide, indium gallium zinc oxide, aluminum titanium oxide, and porous silica gel.
The flexible cover sheet of claim 12, wherein the energy absorbing layer is doped with an organic heterocyclic compound.
The flexible cover sheet of claim 6, further comprising a substrate sandwiched between the rigid layer and the protective layer.
The flexible cover sheet of claim 15, further comprising a masking layer disposed on a side of the protective layer away from the anti-adhesive layer and having a patterned shape, wherein the substrate is formed on the masking layer and the protective layer.
The flexible cover sheet of claim 15, wherein the substrate comprises at least one of polyethylene terephthalate, polyimide, cyclic olefin polymer, polymethyl methacrylate, epoxy resin compound, organic alcohol ester, and inorganic amine.
The flexible cover of claim 6, further comprising an optical glue layer formed between the rigid layer and the protective layer.
The flexible cover sheet of any one of claims 2-18, wherein the adhesion-reducing layer comprises at least one of an ultraviolet adhesion-reducing layer, an infrared adhesion-reducing layer, a laser adhesion-reducing layer, a force adhesion-reducing layer, an electrical adhesion-reducing layer, a magnetic adhesion-reducing layer, and a thermal adhesion-reducing layer.
The flexible cover sheet of any one of claims 1-18, wherein the hard layer comprises at least one of acrylates, polyethylene terephthalate, titanium nitride, aluminum titanium carbonitride, tungsten sulfide.
The flexible cover of any one of claims 1-18, further comprising a release film layer attached to a side of the tie layer remote from the stiff layer.
The flexible cover of any one of claims 1-18, further comprising a protective film layer attached to a side of the rigid layer remote from the attachment layer.
A flexible component comprising a flexible mold and a flexible cover according to any one of claims 1 to 20, wherein the flexible cover and the flexible mold are bonded together by the bonding layer.
The flexible component of claim 23, wherein the flex module comprises at least two functional layers in a stacked arrangement, the at least two functional layers comprising a display functional layer and a support layer in a stacked arrangement, the display functional layer disposed on a side of the flex module adjacent to the tie layer.
The flexible component of claim 24, wherein the display function layer comprises a polarizing layer, a thin-film transistor layer, and an organic light-emitting layer, which are sequentially stacked, the polarizing layer being disposed adjacent to the connection layer.
The flexible component of claim 24, wherein the at least two functional layers further comprise a touch layer disposed on a side of the display functional layer remote from the support layer and bonded to the connection layer.
An electronic device, characterized in that the electronic device comprises a flexible part according to any of claims 23-26.