CN112038738B - Filter and manufacturing method thereof - Google Patents
Filter and manufacturing method thereof Download PDFInfo
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- CN112038738B CN112038738B CN202010870390.3A CN202010870390A CN112038738B CN 112038738 B CN112038738 B CN 112038738B CN 202010870390 A CN202010870390 A CN 202010870390A CN 112038738 B CN112038738 B CN 112038738B
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- coupling groove
- negative coupling
- filter
- debugging
- filter body
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 230000008878 coupling Effects 0.000 claims abstract description 127
- 238000010168 coupling process Methods 0.000 claims abstract description 127
- 238000005859 coupling reaction Methods 0.000 claims abstract description 127
- 238000012360 testing method Methods 0.000 claims abstract description 30
- 238000004891 communication Methods 0.000 claims abstract description 24
- 239000010410 layer Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 15
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 11
- 239000012790 adhesive layer Substances 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 239000004332 silver Substances 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 239000000919 ceramic Substances 0.000 claims description 9
- 239000011265 semifinished product Substances 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 8
- 238000005245 sintering Methods 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 229910010293 ceramic material Inorganic materials 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000007598 dipping method Methods 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 238000010923 batch production Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000012545 processing Methods 0.000 abstract description 3
- 230000009471 action Effects 0.000 description 4
- 238000002955 isolation Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P7/00—Resonators of the waveguide type
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
The filter provided by the invention comprises at least two resonators, two communicated negative coupling grooves and a conducting layer, wherein the projection of the lower surface of the test block on the lower surface of the filter completely covers the projection of the second negative coupling groove on the lower surface of the filter body through arranging the test block on the inner wall of the first negative coupling groove, so that a communication cavity extending along the horizontal direction is formed between the lower surface of the test block and the bottom of the first negative coupling groove, and capacitive coupling between the two resonators is realized through the first negative coupling groove, the second negative coupling groove and the communication cavity, so that the filter body with good consistency can be manufactured in batches firstly, then the test blocks with different sizes are manufactured to change the size of the communication cavity, thereby adjusting the electrical performance of the filter, the test block is free from grooves or holes, the error is small, the precision is high, the reproducibility is strong, the efficiency is high, the cost is low when the filter is manufactured, and the filter is suitable for batch production; the manufacturing method provided by the invention has the advantages of simple processing technology and high yield.
Description
Technical Field
The application relates to the field of electronic communication equipment, in particular to a filter and a manufacturing method thereof.
Background
With the advent of the "big explosion" age of 5G communication, electronic communication devices are gradually popularized worldwide, and filters are an important ring in electronic communication devices, which determine key factors such as radiation range and signal strength of electronic base stations.
The traditional filter has the defects of large volume, high loss, low dielectric constant and the like, and cannot meet the requirement of 5G communication. Thus, waveguide filters have been developed that have higher dielectric constants and smaller volumes of materials at the same resonant frequency. With the continuous improvement of the performance of the base station, the performance requirement on the filter is higher and higher, the traditional waveguide filter mostly adopts an inductive coupling mode, and is difficult to meet the specific electrical performance requirements such as suppression of the near end of a filter frequency band, and in order to solve the problem, a filter adopting capacitive coupling appears in the market, as in international patent application WO 2018148905 A1, a filter for realizing capacitive coupling between resonant cavities by arranging through holes and conductive isolation layers on a block is disclosed, but the scheme needs to additionally arrange conductive isolation layers, the process is complex, additional equipment is needed, the cost is high, as in chinese patent CN111403872a, a dielectric filter capable of realizing capacitive coupling without arranging conductive isolation layers is disclosed, but when the scheme is matched with different electrical performances, the scheme is realized by adjusting the size of a first negative coupling groove and/or a second negative coupling groove, the distance between the first negative coupling groove and the first debugging hole, and the diameter and the length of the negative coupling hole, and the single trial manufacture is required to manufacture a whole filter, the efficiency is low, the cost is high, and the error is not caused when the size of the negative coupling groove or the negative coupling hole is adjusted, and the error is produced in batch production.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a filter which has high efficiency and low cost in trial production and can be conveniently produced in batches and a manufacturing method thereof.
In order to achieve the above purpose, the filter according to the technical scheme adopted by the invention comprises at least two resonators, wherein each resonator comprises a resonator body made of ceramic material and a test hole positioned on the upper surface of the resonator body, and the test hole is a blind hole and is used for testing the resonance frequency of the resonator where the test hole is positioned; all the resonator bodies constitute a filter body extending in a horizontal direction, the filter further comprising:
The first negative coupling groove is formed in the upper surface of the filter body and extends downwards, and the first negative coupling groove is a blind groove;
the second negative coupling groove is formed in the lower surface of the filter body and extends upwards, the second negative coupling groove is a blind groove, and the second negative coupling groove is communicated with the first negative coupling groove;
A conductive layer covering the surface of the filter body, the inner wall surface of the debug hole, and the inner wall surface of the second negative coupling groove;
The inner wall of the first negative coupling groove is provided with a debugging block, the upper surface of the debugging block is positioned in an opening area of the upper surface of the filter body, the projection of the lower surface of the debugging block on the lower surface of the filter body completely covers the projection of the second negative coupling groove on the lower surface of the filter body, and a communication cavity extending along the horizontal direction is formed between the lower surface of the debugging block and the groove bottom of the first negative coupling groove;
The conductive layer is also covered on the inner wall surface of the first negative coupling groove and the outer wall surface of the debugging block, and the joint surface of the first negative coupling groove and the debugging block does not cover the conductive layer;
At least one of the first negative coupling groove, the second negative coupling groove and the communication cavity is positioned at the connecting position of the two resonator bodies and is connected with the two resonators, and the first negative coupling groove, the second negative coupling groove and the communication cavity are used for realizing capacitive coupling between the two resonators.
Preferably, an adhesive layer is disposed on the joint surface of the debugging block and the first negative coupling groove, and the adhesive layer is used for fixing the debugging block on the inner wall of the first negative coupling groove and preventing the conductive layer from entering.
Further preferably, the adhesive layer is sintered from an adhesive.
Preferably, the debugging block is embedded in the first negative coupling groove, and the debugging block is provided with at least one side wall which is not attached to the inner wall of the first negative coupling groove.
Preferably, the material of the tuning block is the same as the material of the resonator body.
Preferably, the axes of the tuning holes on the two resonators are parallel, and the center line of the first negative coupling groove and the center line of the second negative coupling groove are parallel to the axes of the tuning holes.
Further preferably, the axis of the test hole, the center line of the first negative coupling groove, and the center line of the second negative coupling groove are located in the same plane.
Preferably, the opening of the first negative coupling groove on the upper surface of the filter body is rectangular, and the opening of the second negative coupling groove on the lower surface of the filter body is also rectangular.
Further preferably, the conductive layer is silver.
In order to achieve the above purpose, the method in the technical scheme adopted by the invention is a manufacturing method for manufacturing the filter, comprising the following steps:
a. Dry-pressing ceramic powder to form a green body of the filter body with the first negative coupling groove, the second negative coupling groove and the two test holes; dry-pressing ceramic powder to form a green body of the debugging block;
b. Sintering the green blanks of the filter body and the green blanks of the debugging blocks into ceramics to manufacture the filter body and the debugging blocks;
c. Bonding the debugging block in the first negative coupling groove through an adhesive, sintering and forming, and solidifying the adhesive into an adhesive layer to prepare a semi-finished product of the filter;
d. And carrying out silver dipping or silver spraying treatment on the semi-finished product, and forming the conducting layer on the semi-finished product to obtain the filter.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
The filter provided by the invention comprises at least two resonators, a first negative coupling groove, a second negative coupling groove and a conducting layer, wherein the two negative coupling grooves are communicated, and the inner wall of the first negative coupling groove is provided with a debugging block, so that the projection of the lower surface of the debugging block on the lower surface of the filter completely covers the projection of the second negative coupling groove on the lower surface of the filter body, a communication cavity extending along the horizontal direction is formed between the lower surface of the debugging block and the groove bottom of the first negative coupling groove, and capacitive coupling between the two resonators is realized through the first negative coupling groove, the second negative coupling groove and the communication cavity; the manufacturing method provided by the invention has the advantages of simple processing technology and high yield.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings may be obtained according to the drawings without inventive effort to those skilled in the art.
Fig. 1 is a schematic perspective view of a preferred embodiment of the present invention.
Fig. 2 is a schematic top view of fig. 1.
FIG. 3 is a schematic cross-sectional view taken in the direction A-A of FIG. 2.
Fig. 4 is a partial enlarged view at B in fig. 3.
Fig. 5 is a schematic cross-sectional view in the direction A-A of fig. 2, where only the filter body and the tuning hole are shown.
Fig. 6 is a process flow diagram of a method of manufacture in the present invention.
Wherein: 10. a filter; 101. a filter body; 20. a first resonator; 201. a first resonator body; 202. a first test hole; 30. a second resonator; 301. a second resonator body; 302. a second test hole; 41. a first negative coupling groove; 42. a second negative coupling groove; 43. a test block; 431. a communication chamber; 50. an adhesive layer; 60. and a conductive layer.
Detailed Description
The following detailed description of the technical solutions according to the embodiments of the present invention will be given with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in fig. 1, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1-5, the filter 10 provided by the present invention includes a first resonator 20 and a second resonator 30, where the first resonator 20 includes a first resonator body 201 made of a ceramic material and a first tuning hole 202 located on an upper surface of the first resonator body 201, the first tuning hole 202 is a blind hole, and the first tuning hole 202 is used for tuning a resonance frequency of the first resonator 20; the second resonator 30 includes a second resonator body 301 made of a ceramic material and a second tuning hole 302 located on an upper surface of the second resonator body 301, the second tuning hole 302 being a blind hole, the second tuning hole 302 being for tuning a resonance frequency of the second resonator 30; the first resonator body 201 and the second resonator body 301 together constitute the filter body 101 of the filter 10, the filter body 101 extending in the horizontal direction; the filter 10 further includes a first negative coupling groove 41, a second negative coupling groove 42 and a conductive layer 60, wherein the first negative coupling groove 41 is opened on the upper surface of the filter body 101 and extends downwards, and the first negative coupling groove 41 is a blind groove; the second negative coupling groove 42 is formed in the lower surface of the filter body 101 and extends upwards, the second negative coupling groove 42 is a blind groove, and the second negative coupling groove 42 is communicated with the first negative coupling groove 41; the conductive layer 60 is made of silver, and the conductive layer 60 covers the surface of the filter body 101 of the filter 10, the inner wall surfaces of the debugging holes 201 and 301 and the inner wall surface of the second negative coupling groove 42; the axial lines of the first and second test holes 202 and 302 are parallel, and the central lines of the first and second negative coupling grooves 41 and 42 are parallel to the axial lines of the first and second test holes 202 and 302.
As shown in fig. 2-4, the inner wall of the first negative coupling groove 41 is further provided with a debugging block 43, the upper surface of the debugging block 43 is located in the opening area of the first negative coupling groove 41 on the upper surface of the filter body 101, the projection of the lower surface of the debugging block 43 on the lower surface of the filter body 101 completely covers the projection of the second negative coupling groove 42 on the lower surface of the filter body 101, and a communication cavity 431 extending along the horizontal direction is formed between the lower surface of the debugging block 43 and the groove bottom of the first negative coupling groove 41; the conductive layer 60 also covers the inner wall surface of the first negative coupling groove 41 and the outer wall surface of the debug block 43, but the joint surface of the first negative coupling groove 41 and the debug block 43 does not cover the conductive layer 60; at least one of the first negative coupling groove 41, the second negative coupling groove 42 and the communication cavity 431 is located at a connection position of the first resonator 20 and the second resonator 30, in this embodiment, the first negative coupling groove 41 and the communication cavity 431 are located at the connection position and connect the first resonator 20 and the second resonator 30, and the first negative coupling groove 41, the second negative coupling groove 42 and the communication cavity 431 cooperate to realize capacitive coupling between the first resonator 20 and the second resonator 30.
In this embodiment, the materials of the test block 43 and the first resonator body 201 and the second resonator body 301 are the same, and are ceramic materials, as shown in fig. 3-4, the bonding surface between the test block 43 and the first negative coupling groove 41 is provided with the bonding layer 50, the bonding layer 50 is formed by sintering an adhesive, the bonding layer 50 is used for bonding the test block 43 to the inner wall of the first negative coupling groove 41, the bonding layer 50 sintered by the adhesive can further enhance the fixing effect of the test block 43 to the inner wall of the first negative coupling groove 41, and the bonding layer 50 fills the bonding portion between the test block 43 and the first negative coupling groove 41, so that the conductive layer 60 is difficult to enter, and cannot cover the bonding surface between the test block 43 and the first negative coupling groove 41.
As shown in fig. 1-4, the opening of the first negative coupling groove 41 on the upper surface of the filter body 101 is rectangular, the opening of the second negative coupling groove 42 on the lower surface of the filter body 101 is also rectangular, the debugging block 43 is embedded in the first negative coupling groove 41, and the embedding means that three side surfaces of the debugging block 43 are all connected with the inner wall of the first negative coupling groove 41 through the adhesive layer 50, and the remaining side surface of the debugging block 43 is not attached to the inner wall of the first negative coupling groove 41.
According to the filter provided by the invention, capacitive coupling between the first resonator 20 and the second resonator 30 is realized through the combined action of the first negative coupling groove 41, the second negative coupling groove 42 and the communication cavity 431, the filter body 101 with good consistency can be manufactured in batches, and then the size of the communication cavity 431 is changed by manufacturing the test blocks 43 with different sizes, so that the electrical performance of the filter 10 is changed, different electrical performance requirements are matched, the test blocks 43 are not provided with grooves or holes, the error in sintering is small, the precision is high, the reproducibility is strong, and the filter has high efficiency and low cost in test production and is suitable for batch production.
The invention also provides a manufacturing method for manufacturing the filter, the process flow of which is shown in figure 6, and the method specifically comprises the following steps:
a. Dry-pressing the ceramic powder to form a green body of the filter body 101 having the first and second negative coupling grooves 41 and 42 and the first and second test holes 201 and 301; dry-pressing the ceramic powder to prepare a green body of the test block 43;
b. Sintering the green body of the filter body 101 and the green body of the debugging block 43 into ceramic to manufacture the filter body 101 and the debugging block 43;
c. bonding the test block 43 in the first negative coupling groove 41 by an adhesive, sintering and molding the test block, and solidifying the adhesive into an adhesive layer 50 to prepare a semi-finished product of the filter 10;
d. The semi-finished product is subjected to silver dipping or silver spraying treatment, and a conductive layer 60 is formed on the semi-finished product, and the bonding surface of the debugging block 43 and the first negative coupling groove 41 is difficult to process during silver dipping or silver spraying due to the existence of the bonding layer 50, so that the conductive layer 60 cannot cover the bonding surface of the debugging block 43 and the first negative coupling groove 41, and the filter 10 is obtained.
The manufacturing method has the advantages of simple processing technology and high yield, and is suitable for mass production.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing is merely illustrative of the embodiments of this application and it will be appreciated by those skilled in the art that variations and modifications may be made without departing from the principles of the application, and it is intended to cover all modifications and variations as fall within the scope of the application.
Claims (8)
1. The filter comprises at least two resonators, wherein each resonator comprises a resonator body made of ceramic materials and a debugging hole positioned on the upper surface of the resonator body, and the debugging hole is a blind hole and is used for debugging the resonance frequency of the resonator where the debugging hole is positioned; all the resonator bodies constitute a filter body extending in a horizontal direction, the filter further comprising:
The first negative coupling groove is formed in the upper surface of the filter body and extends downwards, and the first negative coupling groove is a blind groove;
the second negative coupling groove is formed in the lower surface of the filter body and extends upwards, the second negative coupling groove is a blind groove, and the second negative coupling groove is communicated with the first negative coupling groove;
A conductive layer covering the surface of the filter body, the inner wall surface of the debug hole, and the inner wall surface of the second negative coupling groove;
The method is characterized in that:
The inner wall of the first negative coupling groove is provided with a debugging block, the upper surface of the debugging block is positioned in an opening area of the upper surface of the filter body, the projection of the lower surface of the debugging block on the lower surface of the filter body completely covers the projection of the second negative coupling groove on the lower surface of the filter body, and a communication cavity extending along the horizontal direction is formed between the lower surface of the debugging block and the groove bottom of the first negative coupling groove;
The conductive layer is also covered on the inner wall surface of the first negative coupling groove and the outer wall surface of the debugging block, and the joint surface of the first negative coupling groove and the debugging block does not cover the conductive layer;
at least one of the first negative coupling groove, the second negative coupling groove and the communication cavity is positioned at the connecting position of the two resonator bodies and is connected with the two resonators, and the first negative coupling groove, the second negative coupling groove and the communication cavity are used for realizing capacitive coupling between the two resonators;
An adhesive layer is arranged on the joint surface of the debugging block and the first negative coupling groove, and the adhesive layer is used for fixing the debugging block on the inner wall of the first negative coupling groove and preventing the conductive layer from entering; the debugging block is embedded in the first negative coupling groove and is provided with at least one side wall which is not attached to the inner wall of the first negative coupling groove.
2. The filter of claim 1, wherein the adhesive layer is sintered from an adhesive.
3. The filter of claim 1, wherein the tuning block is of the same material as the resonator body.
4. The filter of claim 1, wherein the axes of the tuning holes on the two resonators are parallel, and the center line of the first negative coupling groove and the center line of the second negative coupling groove are parallel to the axis of the tuning hole.
5. The filter of claim 4, wherein an axis of the tuning hole, a center line of the first negative coupling groove, and a center line of the second negative coupling groove are located in the same plane.
6. The filter of claim 1, wherein the first negative coupling groove has a rectangular opening at the upper surface of the filter body and the second negative coupling groove has a rectangular opening at the lower surface of the filter body.
7. The filter of any of claims 1-6, wherein the conductive layer is silver.
8. A method of making the filter of claim 7, comprising the steps of:
a. Dry-pressing ceramic powder to form a green body of the filter body with the first negative coupling groove, the second negative coupling groove and the two test holes; dry-pressing ceramic powder to form a green body of the debugging block;
b. Sintering the green blanks of the filter body and the green blanks of the debugging blocks into ceramics to manufacture the filter body and the debugging blocks;
c. Bonding the debugging block in the first negative coupling groove through an adhesive, sintering and forming, and solidifying the adhesive into an adhesive layer to prepare a semi-finished product;
d. And carrying out a silver dipping or silver spraying process on the semi-finished product, and forming the conducting layer on the semi-finished product to obtain the filter.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010870390.3A CN112038738B (en) | 2020-08-26 | 2020-08-26 | Filter and manufacturing method thereof |
| CN202410551012.7A CN118336320A (en) | 2020-08-26 | 2020-08-26 | Filter with high efficiency during trial production and suitable for mass production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010870390.3A CN112038738B (en) | 2020-08-26 | 2020-08-26 | Filter and manufacturing method thereof |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202410551012.7A Division CN118336320A (en) | 2020-08-26 | 2020-08-26 | Filter with high efficiency during trial production and suitable for mass production |
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| Publication Number | Publication Date |
|---|---|
| CN112038738A CN112038738A (en) | 2020-12-04 |
| CN112038738B true CN112038738B (en) | 2024-04-26 |
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| CN202410551012.7A Pending CN118336320A (en) | 2020-08-26 | 2020-08-26 | Filter with high efficiency during trial production and suitable for mass production |
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| CN202410551012.7A Pending CN118336320A (en) | 2020-08-26 | 2020-08-26 | Filter with high efficiency during trial production and suitable for mass production |
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| CN112563698B (en) * | 2020-12-18 | 2024-05-14 | 江苏灿勤科技股份有限公司 | Dielectric duplexer and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210074109U (en) * | 2019-07-12 | 2020-02-14 | 苏州捷频电子科技有限公司 | Negative coupling structure and dielectric filter |
| CN111211387A (en) * | 2019-12-31 | 2020-05-29 | 江苏灿勤科技股份有限公司 | Dielectric filter and radio transmitting/receiving device |
| CN111244590A (en) * | 2019-12-31 | 2020-06-05 | 江苏灿勤科技股份有限公司 | Dielectric filter and radio transmitting/receiving apparatus |
| CN212230586U (en) * | 2020-08-26 | 2020-12-25 | 江苏灿勤科技股份有限公司 | Filter |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS583301A (en) * | 1981-06-30 | 1983-01-10 | Fujitsu Ltd | Dielectric substance filter |
| CN107069155B (en) * | 2017-01-12 | 2019-07-30 | 深圳三星通信技术研究有限公司 | A kind of dielectric waveguide filter and its coupling inversion structures |
| CN110690542A (en) * | 2019-10-29 | 2020-01-14 | 苏州海瓷达材料科技有限公司 | Dielectric filter comprising a capacitive coupling structure |
| CN210576353U (en) * | 2019-12-06 | 2020-05-19 | 薛冰 | Dielectric filter with novel negative coupling structure |
-
2020
- 2020-08-26 CN CN202010870390.3A patent/CN112038738B/en active Active
- 2020-08-26 CN CN202410551012.7A patent/CN118336320A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210074109U (en) * | 2019-07-12 | 2020-02-14 | 苏州捷频电子科技有限公司 | Negative coupling structure and dielectric filter |
| CN111211387A (en) * | 2019-12-31 | 2020-05-29 | 江苏灿勤科技股份有限公司 | Dielectric filter and radio transmitting/receiving device |
| CN111244590A (en) * | 2019-12-31 | 2020-06-05 | 江苏灿勤科技股份有限公司 | Dielectric filter and radio transmitting/receiving apparatus |
| CN211182468U (en) * | 2019-12-31 | 2020-08-04 | 江苏灿勤科技股份有限公司 | Dielectric filter and radio transmitting/receiving device |
| CN212230586U (en) * | 2020-08-26 | 2020-12-25 | 江苏灿勤科技股份有限公司 | Filter |
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| Publication number | Publication date |
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| CN118336320A (en) | 2024-07-12 |
| CN112038738A (en) | 2020-12-04 |
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