CN110224210B - Laminated dielectric filter comprising negative coupling structure - Google Patents
Laminated dielectric filter comprising negative coupling structure Download PDFInfo
- Publication number
- CN110224210B CN110224210B CN201910465026.6A CN201910465026A CN110224210B CN 110224210 B CN110224210 B CN 110224210B CN 201910465026 A CN201910465026 A CN 201910465026A CN 110224210 B CN110224210 B CN 110224210B
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- coupling structure
- dielectric filter
- negative coupling
- holes
- bonding surface
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- 230000008878 coupling Effects 0.000 title claims abstract description 56
- 238000010168 coupling process Methods 0.000 title claims abstract description 56
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 56
- 238000002955 isolation Methods 0.000 claims description 30
- 239000003990 capacitor Substances 0.000 claims description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 4
- 239000003989 dielectric material Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 238000005253 cladding Methods 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000005764 inhibitory process Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/207—Hollow waveguide filters
- H01P1/208—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure
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Abstract
The application discloses a laminated dielectric filter comprising a negative coupling structure, which comprises a first body and a second body which are mutually bonded, wherein the outer surfaces of the first body and the second body are respectively coated with a conductive layer, a first bonding surface of the first body is mutually bonded with a second bonding surface of the second body, and a plurality of resonant holes are formed in the second body. The application has the advantages that the combined blind hole is realized by using the two-piece assembled structure, the blind hole processing technology is simplified, and the blind hole processing precision is increased; the signals are transmitted in the two bodies, so that the leakage problem is avoided, and the far-end inhibition is improved; the internal coupling structure is flexible in implementation mode, and positive and negative coupling structures can be constructed at will.
Description
Technical Field
The present application relates to a filter, and more particularly, to a stacked dielectric filter including a negative coupling structure.
Background
The existing dielectric filter resonates by processing blind holes on a dielectric body to form a resonant cavity, the blind hole depth is high in controllability, the frequency fluctuation is high, and the consistency is poor; in addition, the negative coupling structure of the existing dielectric filter is difficult to realize, has a single negative coupling structure, and is not suitable for large-scale mass production.
Disclosure of Invention
The invention aims to provide a laminated dielectric filter comprising a negative coupling structure, which overcomes the defects of the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions.
The embodiment of the application discloses a laminated dielectric filter comprising a negative coupling structure, which comprises a first body and a second body which are mutually bonded, wherein the outer surfaces of the first body and the second body are respectively coated with a conductive layer, a first bonding surface of the first body is mutually bonded with a second bonding surface of the second body, and a plurality of resonant holes are formed in the second body.
Preferably, in the laminated dielectric filter including a negative coupling structure, the negative coupling structure is a conductive capacitor flying bar located on an adhesion surface of the first body and the second body, the conductive capacitor flying bar is a conductive layer printed or etched on the first adhesion surface, and the conductive capacitor flying bar and an adjacent resonant hole are electromagnetically coupled through a non-metallized slot.
Preferably, in the laminated dielectric filter including a negative coupling structure, the first body and the second body are respectively provided with a plurality of isolation structures which are correspondingly arranged, the isolation structures isolate the resonant holes, and the isolation structures are isolation through holes or isolation through grooves.
More preferably, in the laminated dielectric filter including a negative coupling structure, the first body is provided with two input/output holes, the conductive layer covers the isolation structure, the input/output holes and the inner surface of the resonance hole, an electrode ring is formed on the bottom surface of the first body around the input/output holes, and the first bonding surface and the second bonding surface are respectively formed with the input/output coupling structure on one side of the input/output holes.
Preferably, in the laminated dielectric filter including a negative coupling structure, the first bonding surface and the second bonding surface are respectively formed with a resonant disc at the resonant hole.
Preferably, in the laminated dielectric filter including the negative coupling structure, a circle of ground plane is formed on the periphery of the first bonding surface and the periphery of the second bonding surface.
Preferably, in the laminated dielectric filter including a negative coupling structure, the first bonding surface and the second bonding surface are bonded by high-temperature solder, and the high-temperature solder is high-temperature glass paste or silver paste.
More preferably, in the laminated dielectric filter including a negative coupling structure, a coupling adjustment surface is formed between each row of adjacent two resonant holes, and the isolation structure is located inside the coupling adjustment surface.
More preferably, in the laminated dielectric filter including a negative coupling structure, the resonant holes are opened by 6 and are sequentially arranged in two rows.
More preferably, in the laminated dielectric filter including a negative coupling structure, the first bonding surface and the second bonding surface form the conductive capacitor flying bar between the two middle resonance holes, respectively.
Preferably, in the laminated dielectric filter including the negative coupling structure, the first body and the second body are made of solid dielectric materials, respectively.
Compared with the prior art, the invention has the advantages that the combined blind hole is realized by using the two-piece assembled structure, the blind hole processing technology is simplified, and the blind hole processing precision is increased; the signals are transmitted in the two bodies, so that the leakage problem is avoided, and the far-end inhibition is improved; the internal coupling structure is flexible in implementation mode, and positive and negative coupling structures can be constructed at will.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings may be obtained according to the drawings without inventive effort to those skilled in the art.
FIG. 1 is a perspective view of a stacked dielectric filter incorporating a negative coupling structure when isolated via isolation is employed in an embodiment of the present invention;
FIG. 2 is a schematic view of the bottom surface of the first body according to an embodiment of the present invention;
FIG. 3 is a schematic view of a first bonding surface according to an embodiment of the present invention;
FIG. 4 is a schematic view of a second bonding surface according to an embodiment of the present invention;
FIG. 5 is a schematic top view of a second body according to an embodiment of the present invention;
Fig. 6 is a perspective view of a stacked dielectric filter including a negative coupling structure when isolated using isolation vias in an embodiment of the present invention.
Detailed Description
The following detailed description of the technical solutions according to the embodiments of the present invention will be given with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Taking a 6 resonant cavity laminated dielectric filter as an example for illustration, the isolation structure selects isolation through grooves, it should be noted that the scheme is also suitable for filters with other resonant cavities, and is combined with the laminated dielectric filter with a negative coupling structure as shown in fig. 1-5, and the laminated dielectric filter comprises a first body 100 and a second body 101 which are bonded with each other, wherein the outer surfaces of the first body 100 and the second body 101 are respectively coated with a conductive layer, a first bonding surface 200 of the first body 100 is bonded with a second bonding surface 300 of the second body 101, a plurality of isolation through grooves 103 which are correspondingly arranged are respectively formed on the first body 100 and the second body 101, the isolation through grooves 103 isolate the resonant holes 104, the first body 100 is provided with two input and output holes 102, the second body 101 is provided with 6 resonant holes 104, the two rows are sequentially arranged, the conductive layers are coated with the isolation through grooves 103, the input and output holes 102 and the inner surfaces of the resonant holes 104, an electrode ring 105 is formed around the input and output holes 102 on the bottom surface of the first body 100, the first bonding surface 200 and the second bonding surface 300 are respectively bonded with one side of the input and output bonding surfaces 102, the first coupling surface 200 and the second bonding surface 300 are respectively formed on the first bonding surface 300 and the outer peripheral bonding surface 107 are respectively bonded with the first bonding surface 300. The first bonding surface 200 and the second bonding surface 300 form a conductive capacitor flying bar 109 between the two middle resonance holes 104, respectively. A coupling adjusting surface 110 is formed between each row of two adjacent resonant holes 104, and the isolation through groove 103 is positioned inside the coupling adjusting surface 110. The number of the isolation through grooves 103 is 6, 1 isolation through groove 103 is arranged between every two adjacent rows of the resonant holes 104, and two isolation through grooves 103 are arranged on two sides of the conductor capacitor flying rod 109 in the two rows of the resonant holes 104. The first body 100 and the second body 101 are respectively made of solid dielectric materials. The input-output coupling structure 106, the resonant disk 107, the ground plane 108, and the conductive capacitor flying bar 109 are all conductive silver layers.
In the technical scheme, the combined blind hole is realized by using the two-piece assembled structure, the blind hole processing technology is simplified, and the blind hole processing precision is increased; the signals are transmitted in the two bodies, so that the leakage problem is avoided, and the far-end inhibition is improved; the internal coupling structure is flexible in implementation mode, and positive and negative coupling structures can be constructed at will;
In addition, the isolation through-grooves can be replaced by isolation through-holes, and the isolation through-grooves become adjacent isolation through-holes which are closely arranged, as shown in fig. 6, and all belong to the scope of the application;
it should be noted that the diameter of the resonant hole and the size and shape of the resonant disk can be adjusted to adjust the frequency of the single cavity; the arc length and the shape of the input-output coupling structure and the distance between the input-output coupling structure and the resonant disk can be adjusted, so that the input-output coupling structure is used for adjusting the input-output size; the length of the coupling adjusting surface and the size of the isolation through groove are adjustable, and the coupling adjusting surface is used for adjusting the coupling amount; the length of the capacitor flying rod and the distance between the capacitor flying rod and the resonant disk are adjustable, and the capacitor flying rod is used for adjusting the negative coupling strength; the position of the capacitor flying rod is adjustable and is used for adjusting the topological structure of the filter; the materials and dielectric constants of the first body and the second body may be different, and all the materials and dielectric constants are within the scope of the present application.
Further, the first bonding surface 200 and the second bonding surface 300 are bonded by high temperature solder, which is high temperature glass paste or silver paste.
In the technical scheme, silver can be selected as the conductive layer material, and the welding material is preferably high-temperature glass paste or silver paste, which belong to the scope of the application.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing is merely illustrative of the embodiments of this application and it will be appreciated by those skilled in the art that variations and modifications may be made without departing from the principles of the application, and it is intended to cover all modifications and variations as fall within the scope of the application.
Claims (9)
1. The utility model provides a laminate dielectric filter including negative coupling structure, its characterized in that includes first body and second body that bond each other, first body and second body surface cladding conducting layer respectively, the first bonding face of first body with the second bonding face of second body bonds each other, a plurality of resonance holes have been seted up to the second body, negative coupling structure is for being located the conductor electric capacity flying lever of first body and second body bonding face, conductor electric capacity flying lever is printing or etching conductor layer on first bonding face, conductor electric capacity flying lever carries out electromagnetic coupling with adjacent the resonance hole through non-metallized gap, first body and second body are made by solid dielectric material respectively.
2. The laminated dielectric filter comprising a negative coupling structure according to claim 1, wherein a plurality of isolation structures are respectively provided on the first body and the second body, the isolation structures isolate the resonance holes, and the isolation structures are isolation through holes or isolation through grooves.
3. The laminated dielectric filter with the negative coupling structure according to claim 2, wherein the first body is provided with two input/output holes, the conductive layer covers the isolation structure, the input/output holes and the inner surface of the resonance hole, an electrode ring is formed on the bottom surface of the first body around the input/output holes, and the first bonding surface and the second bonding surface are respectively formed with the input/output coupling structure on one side of the input/output holes.
4. The laminated dielectric filter comprising a negative coupling structure according to claim 1, wherein the first bonding surface and the second bonding surface are each formed with a resonator plate at the resonator hole.
5. The laminated dielectric filter comprising a negative coupling structure of claim 1, wherein a loop of ground plane is formed around the first and second bonding surfaces.
6. The laminated dielectric filter comprising a negative coupling structure according to claim 1, wherein the first bonding surface and the second bonding surface are bonded by a high temperature solder, the high temperature solder being a high temperature glass paste or a silver paste.
7. The laminated dielectric filter comprising a negative coupling structure according to claim 2, wherein a coupling adjustment surface is formed between each row of adjacent two of the resonance holes, and the isolation structure is located inside the coupling adjustment surface.
8. The laminated dielectric filter comprising a negative coupling structure according to claim 1, wherein the resonant holes are formed by 6, and are sequentially arranged in two rows.
9. The laminated dielectric filter comprising a negative coupling structure according to claim 1, wherein the first bonding surface and the second bonding surface form the conductor capacitor flying bar between the two middle resonance holes, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910465026.6A CN110224210B (en) | 2019-05-30 | 2019-05-30 | Laminated dielectric filter comprising negative coupling structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910465026.6A CN110224210B (en) | 2019-05-30 | 2019-05-30 | Laminated dielectric filter comprising negative coupling structure |
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| Publication Number | Publication Date |
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| CN110224210A CN110224210A (en) | 2019-09-10 |
| CN110224210B true CN110224210B (en) | 2024-04-26 |
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| CN201910465026.6A Active CN110224210B (en) | 2019-05-30 | 2019-05-30 | Laminated dielectric filter comprising negative coupling structure |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111446525B (en) * | 2020-02-19 | 2022-03-11 | 深圳市大富科技股份有限公司 | Dielectric resonator, dielectric filter, transceiver and base station |
| CN111393171A (en) * | 2020-03-24 | 2020-07-10 | 横店集团东磁股份有限公司 | Filter forming method and filter |
| WO2022067536A1 (en) * | 2020-09-29 | 2022-04-07 | 华为技术有限公司 | Filter, transmitter, receiver, and communication system |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106299558A (en) * | 2016-08-24 | 2017-01-04 | 张家港保税区灿勤科技有限公司 | high reliability dielectric waveguide filter |
| CN107069155A (en) * | 2017-01-12 | 2017-08-18 | 深圳三星通信技术研究有限公司 | A kind of dielectric waveguide filter and its coupling inversion structures |
| CN109509945A (en) * | 2018-12-28 | 2019-03-22 | 重庆思睿创瓷电科技有限公司 | Dielectric, dielectric waveguide filter, radio-frequency module and base station |
| CN109546269A (en) * | 2018-12-06 | 2019-03-29 | 京信通信系统（中国）有限公司 | Dielectric waveguide filter |
| CN210403987U (en) * | 2019-05-30 | 2020-04-24 | 江苏灿勤科技股份有限公司 | Laminated dielectric filter containing negative coupling structure |
-
2019
- 2019-05-30 CN CN201910465026.6A patent/CN110224210B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106299558A (en) * | 2016-08-24 | 2017-01-04 | 张家港保税区灿勤科技有限公司 | high reliability dielectric waveguide filter |
| CN107069155A (en) * | 2017-01-12 | 2017-08-18 | 深圳三星通信技术研究有限公司 | A kind of dielectric waveguide filter and its coupling inversion structures |
| CN109546269A (en) * | 2018-12-06 | 2019-03-29 | 京信通信系统（中国）有限公司 | Dielectric waveguide filter |
| CN109509945A (en) * | 2018-12-28 | 2019-03-22 | 重庆思睿创瓷电科技有限公司 | Dielectric, dielectric waveguide filter, radio-frequency module and base station |
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