CN112038432B - Photovoltaic module, photovoltaic adhesive film and preparation method thereof - Google Patents
Photovoltaic module, photovoltaic adhesive film and preparation method thereof Download PDFInfo
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- CN112038432B CN112038432B CN202010955250.6A CN202010955250A CN112038432B CN 112038432 B CN112038432 B CN 112038432B CN 202010955250 A CN202010955250 A CN 202010955250A CN 112038432 B CN112038432 B CN 112038432B
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- 239000002313 adhesive film Substances 0.000 title claims abstract description 105
- 238000002360 preparation method Methods 0.000 title abstract description 12
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 22
- 239000002002 slurry Substances 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 18
- 238000000859 sublimation Methods 0.000 claims description 18
- 230000008022 sublimation Effects 0.000 claims description 18
- 238000003475 lamination Methods 0.000 claims description 16
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 12
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 claims description 11
- 239000003292 glue Substances 0.000 claims description 9
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 8
- 239000002033 PVDF binder Substances 0.000 claims description 8
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 8
- 239000002270 dispersing agent Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910052718 tin Inorganic materials 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052745 lead Inorganic materials 0.000 description 3
- 239000002210 silicon-based material Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention provides a photovoltaic module, a photovoltaic adhesive film and a preparation method thereof.
Description
Technical Field
The embodiment of the invention relates to the technical field of photovoltaics, in particular to a photovoltaic module, a photovoltaic adhesive film and a preparation method of the photovoltaic module.
Background
With the increasingly deep humanity of the concept of green environmental protection, the photovoltaic industry develops vigorously. The photovoltaic module mainly comprises a panel, a first adhesive film, a battery piece, a second adhesive film, a back plate and the like. The first adhesive film is a bonding material between the battery piece and the panel, and the second adhesive film is a bonding material between the battery piece and the back plate.
In the prior art, the first adhesive film and the second adhesive film are non-adhesive at normal temperature and can be crosslinked at a curing temperature, and a stable and reliable adhesive film layer can be effectively formed by an extrusion forming method, so that the effect of connecting the battery, the glass and the back plate is achieved.
However, in the process of manufacturing the photovoltaic module, the first adhesive film and the second adhesive film are prone to slip, thereby affecting the manufacturing speed and yield of the photovoltaic module.
Disclosure of Invention
The embodiment of the invention aims to provide a photovoltaic module, a photovoltaic adhesive film and a preparation method thereof, and aims to solve the problems that the adhesive film is easy to slip in the preparation process of the photovoltaic module, and the preparation speed and the yield of the photovoltaic module are influenced.
In order to solve the above technical problem, an embodiment of the present invention provides a photovoltaic adhesive film, including:
the adhesive film body is provided with a first surface; and the number of the first and second groups,
the anti-skidding structure is arranged on the first surface, and the sublimation temperature of the anti-skidding structure is smaller than the maximum temperature during lamination.
According to the embodiment of the invention, the anti-slip structure is arranged on the first surface of the photovoltaic adhesive film, so that the effect of increasing the friction force between the photovoltaic adhesive film and the contact surface can be achieved, the photovoltaic adhesive film and the battery piece are further prevented from slipping in the process of preparing the photovoltaic module, the sublimation temperature of the anti-slip structure is lower than the maximum temperature in the lamination process, the anti-slip structure can be rapidly gasified when the photovoltaic module is in a high-temperature and vacuum environment in the lamination process, and therefore, the seamless fit between the photovoltaic adhesive film and the contact surface is ensured.
Preferably, in the photovoltaic adhesive film, the sublimation temperature of the anti-slip structure is less than 200 ℃.
Preferably, in the photovoltaic adhesive film, the material of the anti-slip structure includes one or more of naphthalene, aluminum trichloride or anthracene.
Preferably, in the photovoltaic adhesive film, the anti-slip structure is a convex part, and the convex part is a convex column which is mutually separated and/or a plurality of convex ribs which are arranged in parallel.
Preferably, in the photovoltaic adhesive film, the convex part is in a wave shape, a trapezoid shape, or a zigzag shape.
The invention also provides a photovoltaic module which comprises a panel, a first adhesive film, a cell piece, a second adhesive film and a back plate which are sequentially stacked, wherein the first adhesive film and/or the second adhesive film is the photovoltaic adhesive film, and the anti-skid structure on the first adhesive film and/or the second adhesive film is arranged towards the cell piece.
Preferably, in the photovoltaic module, two adjacent semiconductor sheets in the cell sheet are arranged at intervals to form a gap;
the anti-skid structure extends into the gap from the first surface towards the direction opposite to the gap.
The invention provides a preparation method of the photovoltaic adhesive film, which comprises the following steps:
dissolving a sublimable material in a preset dispersing agent to form slurry, wherein the sublimation temperature of the sublimable material is lower than the maximum temperature during lamination;
and coating the slurry on a glue film body according to a preset shape so as to form an anti-skidding structure on the glue film body.
Preferably, in the method for manufacturing a photovoltaic adhesive film, the step of coating the slurry on an adhesive film body according to a preset shape to form an anti-slip structure on the adhesive film body includes:
sticking a hollow sticking film which is hollow according to a preset shape on the glue film body;
adding the slurry into the hollow part of the hollow sticking film;
and after the slurry is cured, removing the hollowed-out adhesive film so as to form an anti-skidding structure on the adhesive film body.
Preferably, in the preparation method of the photovoltaic adhesive film, the easily sublimable material is one or more of naphthalene, aluminum trichloride or anthracene; and/or the preset dispersant comprises N-methyl pyrrolidone solvent of polyvinylidene fluoride.
According to the preparation method of the photovoltaic adhesive film, the anti-slip structure is arranged on the adhesive film body, so that the effect of increasing the friction force between the photovoltaic adhesive film and the contact surface can be achieved, the photovoltaic adhesive film and the battery piece are prevented from slipping in the process of preparing the photovoltaic assembly, the sublimation temperature of the anti-slip structure is lower than the maximum temperature during lamination, the photovoltaic assembly is at a higher temperature and under a vacuum environment during lamination, the anti-slip structure can be rapidly gasified, and therefore seamless fit between the photovoltaic adhesive film and the contact surface is guaranteed.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.
FIG. 1 is a schematic structural diagram of a photovoltaic adhesive film according to an embodiment of the present invention;
FIG. 2 is a flow chart of an embodiment of a method for manufacturing a photovoltaic adhesive film according to the present invention;
fig. 3 is an exploded view of a laminated structure of a photovoltaic module according to the present invention.
The invention is illustrated by the reference numerals:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 1 | |
4 | The first |
| 11 | |
5 | |
| 2 | |
6 | Second |
| 3 | |
7 | Back plate |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The embodiment of the invention provides a photovoltaic adhesive film, please refer to fig. 1, which includes an adhesive film body 1 and an anti-slip structure 2, wherein the adhesive film body 1 has a first surface 11, the anti-slip structure 2 is disposed on the first surface 11, and a sublimation temperature of the anti-slip structure 2 is lower than a maximum temperature during lamination. When the battery pack is specifically arranged, the first surface 11 is arranged towards the battery piece 5, so that slippage can be effectively prevented during manufacturing.
According to the embodiment of the invention, the anti-skid structure 2 is arranged on the first surface 11 of the photovoltaic adhesive film, so that the effect of increasing the friction force between the photovoltaic adhesive film and the contact surface can be achieved, the photovoltaic adhesive film and the battery piece 5 are further prevented from slipping in the process of preparing the photovoltaic module, the sublimation temperature of the anti-skid structure 2 is lower than the maximum temperature during lamination, the anti-skid structure 2 can be rapidly gasified when the photovoltaic module is in a high temperature and vacuum environment during lamination, and the photovoltaic adhesive film and the contact surface are ensured to be attached seamlessly.
Specifically, in the present embodiment, the sublimation temperature of the anti-slip structure 2 is less than 200 ℃, and may be 100 ℃, 150 ℃, 180 ℃, and the like, and is not particularly limited herein. The anti-slip structure 2 may be an easily sublimable material having a sublimation temperature lower than the maximum temperature during lamination, for example, one or more of naphthalene, aluminum trichloride, or anthracene, and in other embodiments, the easily sublimable material may also be another easily sublimable material having a sublimation temperature lower than the maximum temperature during lamination, and which is difficult to react with the surface of the silicon-based battery piece 5 in the photovoltaic module, conductive silver paste (Al, Ag), tin-coated copper tape (Sn, Pb), and other substances.
Naphthalene, aluminium trichloride and the silicon material's in the photovoltaic module battery piece 5, electrically conductive silver thick liquid (Al, Ag), tin-coated copper strips (Sn, Pb) material all are difficult to take place chemical reaction, and through the lamination flow, naphthalene or aluminium trichloride sublime the back, breaks away from the photovoltaic module with gaseous form, can effectively avoid the residual to cause the influence to the performance of photovoltaic module.
The anti-slip structure 2 has various forms, in this embodiment, the anti-slip structure 2 is a convex part, and the convex part is a convex pillar and/or a plurality of convex ribs arranged in parallel. The shape of the convex part can be selected to be convenient for forming, and can also be selected according to the requirement, and in the embodiment, the convex part is in a wave shape, a trapezoid shape or a sawtooth shape. Wherein the preferred is the wave form, convenient manufacturing.
The invention also provides a photovoltaic module which comprises the photovoltaic adhesive film. It should be noted that the embodiments of the photovoltaic module provided by the present invention include embodiments corresponding to the photovoltaic adhesive film, and therefore, the details of the related art mentioned in the embodiments of the photovoltaic adhesive film are still valid in the photovoltaic module, and are not repeated for reducing the repetition.
Specifically, referring to fig. 3, the photovoltaic module includes a panel 3 (in this embodiment, the panel 3 is a glass panel), a first adhesive film 4, the battery piece 5, a second adhesive film 6, and a back plate 7, which are stacked in sequence, wherein the first adhesive film 4 and/or the second adhesive film 6 are the above-mentioned photovoltaic adhesive films, and the anti-slip structure 2 on the first adhesive film 4 and/or the second adhesive film 6 is disposed toward the battery piece 5, in other words, when the photovoltaic module is mounted, the first surface 11 of the first adhesive film 4 and the first surface 11 of the second adhesive film 6 are disposed toward the battery piece 5.
The invention further provides a preparation method of the photovoltaic adhesive film, please refer to fig. 2, which comprises the following steps:
step S210: dissolving a sublimable material in a preset dispersing agent to form slurry, wherein the sublimation temperature of the sublimable material is lower than the maximum temperature during lamination;
specifically, easily sublime the material and be one or more in naphthalene, aluminium trichloride or anthracene, through setting up naphthalene, aluminium trichloride and the surface of the battery piece 5 of silicon material, material such as electrically conductive silver thick liquid (Al, Ag), tin-coated copper strips (Sn, Pb) are difficult to take place the reaction, and through the lamination flow, naphthalene or aluminium trichloride sublime the back, breaks away from the subassembly system with gaseous form, can effectively avoid the residual matter to cause the influence to photovoltaic module's performance. Correspondingly, the preset dispersant includes an N-methylpyrrolidone solvent (NMP solvent) of polyvinylidene fluoride (PVDF).
Preferably, the sublimation temperature of the sublimation-prone material is less than 200 ℃, and may be 100 ℃, 150 ℃, 180 ℃, and the like, without being particularly limited herein.
Step S220: and coating the sizing agent on the adhesive film body 1 according to a preset shape so as to form an anti-skid structure 2 on the adhesive film body 1.
Specifically, the step S220 includes:
step S221: sticking a hollow sticking film which is hollow according to a preset shape on the glue film body 1;
step S222: adding the slurry into the hollow part of the hollow sticking film;
step S223: and after the slurry is cured, removing the hollowed-out adhesive film to form an anti-skidding structure 2 on the adhesive film body 1.
The preset shape may be a wave shape, a trapezoid shape, or a zigzag shape, or may be other shapes, and is not limited herein.
Several specific examples of the preparation of the photovoltaic adhesive film are given below:
example 1
(1) Preparing anti-skid pattern slurry:
dissolving 10g of naphthalene (sublimation occurs at 25 ℃ at room temperature) in 20ml of N-methylpyrrolidone solvent (NMP solvent) of polyvinylidene fluoride (PVDF), fully stirring and uniformly mixing to form slurry;
(2) preparing an anti-skid pattern type photovoltaic adhesive film:
pasting a hollowed-out adhesive film hollowed out according to a preset shape on an adhesive film body 1(EVA), adding the slurry at the hollowed-out position of the hollowed-out adhesive film, and removing the hollowed-out adhesive film after the slurry is solidified so as to form an anti-skidding structure 2 on the adhesive film body 1, wherein the preset shape is a wave shape.
Example 2
(1) Preparing anti-skid pattern slurry:
dissolving 10g of aluminum trichloride (sublimation temperature 178 ℃) in 20ml of N-methylpyrrolidone solvent (NMP solvent) of polyvinylidene fluoride (PVDF), fully stirring and uniformly mixing to form slurry;
(2) preparing an anti-skid pattern type photovoltaic adhesive film:
pasting on glued membrane body 1(POE) and covering the fretwork pad pasting according to predetermineeing the shape fretwork, wherein the fretwork position sets up the clearance that forms to two adjacent semiconductor sheet intervals add the fretwork department of fretwork pad pasting thick liquids wait after the thick liquids solidification, get rid of the fretwork pad pasting, with form anti-skidding structure 2 on glued membrane body 1, wherein, should predetermine the shape and be the wave.
Example 3
(1) Preparing anti-skid pattern slurry:
dissolving 10g of anthracene (sublimation temperature 160-;
(2) preparing an anti-skid pattern type photovoltaic adhesive film:
pasting a hollowed-out adhesive film hollowed out according to a preset shape on an adhesive film body 1(EVA), setting a gap formed at the hollowed-out position at an interval of two adjacent semiconductor sheets, adding the slurry into the hollowed-out position of the hollowed-out adhesive film, and removing the hollowed-out adhesive film after the slurry is cured so as to form an anti-skidding structure 2 on the adhesive film body 1, wherein the preset shape is a wave shape.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A photovoltaic adhesive film, comprising:
the adhesive film body is provided with a first surface; and the number of the first and second groups,
the anti-skidding structure is arranged on the first surface, and the sublimation temperature of the anti-skidding structure is smaller than the maximum temperature during lamination.
2. The photovoltaic adhesive film of claim 1, wherein the anti-slip structure has a sublimation temperature of less than 200 ℃.
3. The photovoltaic adhesive film of claim 2, wherein the anti-slip structure is made of one or more of naphthalene, aluminum trichloride or anthracene.
4. The photovoltaic adhesive film according to claim 1, wherein the anti-slip structure is a protrusion, and the protrusion is a plurality of mutually discrete protruding columns and/or a plurality of parallel ribs.
5. The photovoltaic adhesive film of claim 4, wherein the convex portion is in a wave shape, a trapezoid shape, or a zigzag shape.
6. A photovoltaic module is characterized by comprising a panel, a first adhesive film, a cell piece, a second adhesive film and a back plate which are sequentially stacked, wherein the first adhesive film and/or the second adhesive film is the photovoltaic adhesive film according to any one of claims 1 to 5, and the anti-skid structure on the first adhesive film and/or the second adhesive film is arranged towards the cell piece.
7. The photovoltaic module of claim 6, wherein two adjacent semiconductor sheets in the cell are spaced apart to form a gap;
the anti-skid structure extends into the gap from the first surface towards the direction opposite to the gap.
8. A method for preparing a photovoltaic glue film according to any one of claims 1 to 5, characterized in that it comprises the following steps:
dissolving a sublimable material in a preset dispersing agent to form slurry, wherein the sublimation temperature of the sublimable material is lower than the maximum temperature during lamination;
and coating the slurry on a glue film body according to a preset shape so as to form an anti-skidding structure on the glue film body.
9. The method for preparing a photovoltaic adhesive film according to claim 8, wherein the step of coating the paste on the adhesive film body according to a predetermined shape to form an anti-slip structure on the adhesive film body comprises:
sticking a hollow sticking film which is hollow according to a preset shape on the glue film body;
adding the slurry into the hollow part of the hollow sticking film;
and after the slurry is cured, removing the hollowed-out adhesive film so as to form an anti-skidding structure on the adhesive film body.
10. The method for preparing a photovoltaic adhesive film according to claim 8, wherein the sublimable material is one or more of naphthalene, aluminum trichloride or anthracene; and/or the preset dispersant comprises N-methyl pyrrolidone solvent of polyvinylidene fluoride.
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| CN107017315B (en) * | 2017-02-17 | 2019-01-08 | 中国电子科技集团公司第五十研究所 | The manufacturing method of the blocking impurity band detector of back electrode structure |
| CN209323893U (en) * | 2018-11-16 | 2019-08-30 | 深圳市德派装饰设计工程有限公司 | A kind of water-proof skid-proof ground structure |
| CN110581193A (en) * | 2019-09-25 | 2019-12-17 | 常州斯威克光伏新材料有限公司 | Convex dot-shaped embossing POE adhesive film |
| CN110649116B (en) * | 2019-09-30 | 2023-06-09 | 常州斯威克光伏新材料有限公司 | Multilayer packaging adhesive film for solar cell |
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