CN112038261A - 基板干燥装置 - Google Patents

基板干燥装置 Download PDF

Info

Publication number
CN112038261A
CN112038261A CN202010501307.5A CN202010501307A CN112038261A CN 112038261 A CN112038261 A CN 112038261A CN 202010501307 A CN202010501307 A CN 202010501307A CN 112038261 A CN112038261 A CN 112038261A
Authority
CN
China
Prior art keywords
substrate
supercritical fluid
drying
supply
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010501307.5A
Other languages
English (en)
Chinese (zh)
Inventor
申熙镛
李泰京
尹炳文
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mujin Electronics Co ltd
Original Assignee
Mujin Electronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mujin Electronics Co ltd filed Critical Mujin Electronics Co ltd
Publication of CN112038261A publication Critical patent/CN112038261A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CN202010501307.5A 2019-06-04 2020-06-04 基板干燥装置 Pending CN112038261A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2019-0065809 2019-06-04
KR1020190065809A KR102254186B1 (ko) 2019-06-04 2019-06-04 기판 건조 장치

Publications (1)

Publication Number Publication Date
CN112038261A true CN112038261A (zh) 2020-12-04

Family

ID=73579691

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010501307.5A Pending CN112038261A (zh) 2019-06-04 2020-06-04 基板干燥装置

Country Status (2)

Country Link
KR (1) KR102254186B1 (ko)
CN (1) CN112038261A (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112242323A (zh) * 2019-07-19 2021-01-19 无尽电子有限公司 基板干燥装置
WO2024078217A1 (zh) * 2022-10-14 2024-04-18 盛美半导体设备(上海)股份有限公司 使用超临界流体对基板进行干燥的干燥装置及方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102596286B1 (ko) * 2021-03-15 2023-11-01 세메스 주식회사 기판 처리 방법 및 기판 처리 장치
KR20230158214A (ko) 2022-05-11 2023-11-20 세메스 주식회사 가스공급장치 및 방법과 기판처리설비

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120033220A (ko) * 2010-09-29 2012-04-06 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치 및 기판처리방법
CN103219165A (zh) * 2012-01-24 2013-07-24 绿点高新科技股份有限公司 超级电容模块及其制作方法
KR20140112638A (ko) * 2013-03-12 2014-09-24 삼성전자주식회사 초임계 유체를 이용하는 기판 처리 장치, 이를 포함하는 기판 처리 시스템, 및 기판 처리 방법
KR20150069510A (ko) * 2013-12-13 2015-06-23 아드반스 덴키 고교 가부시키가이샤 유량 제어 밸브 및 이것을 사용한 유량 제어 장치
CN106552517A (zh) * 2015-09-30 2017-04-05 东京应化工业株式会社 屏障过滤器及过滤方法、光刻用药液纯化品的制造方法以及抗蚀剂图案形成方法
KR20180077949A (ko) * 2016-12-29 2018-07-09 삼성전자주식회사 기판 처리 장치 및 이를 포함한 기판 처리 시스템
KR20180136927A (ko) * 2018-12-17 2018-12-26 세메스 주식회사 기판 처리 장치 및 기판 처리 방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101681190B1 (ko) 2015-05-15 2016-12-02 세메스 주식회사 기판 건조 장치 및 방법
KR101856606B1 (ko) 2016-06-02 2018-05-15 세메스 주식회사 기판 처리 장치 및 방법

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120033220A (ko) * 2010-09-29 2012-04-06 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치 및 기판처리방법
CN103219165A (zh) * 2012-01-24 2013-07-24 绿点高新科技股份有限公司 超级电容模块及其制作方法
KR20140112638A (ko) * 2013-03-12 2014-09-24 삼성전자주식회사 초임계 유체를 이용하는 기판 처리 장치, 이를 포함하는 기판 처리 시스템, 및 기판 처리 방법
KR20150069510A (ko) * 2013-12-13 2015-06-23 아드반스 덴키 고교 가부시키가이샤 유량 제어 밸브 및 이것을 사용한 유량 제어 장치
CN106552517A (zh) * 2015-09-30 2017-04-05 东京应化工业株式会社 屏障过滤器及过滤方法、光刻用药液纯化品的制造方法以及抗蚀剂图案形成方法
KR20180077949A (ko) * 2016-12-29 2018-07-09 삼성전자주식회사 기판 처리 장치 및 이를 포함한 기판 처리 시스템
KR20180136927A (ko) * 2018-12-17 2018-12-26 세메스 주식회사 기판 처리 장치 및 기판 처리 방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112242323A (zh) * 2019-07-19 2021-01-19 无尽电子有限公司 基板干燥装置
WO2024078217A1 (zh) * 2022-10-14 2024-04-18 盛美半导体设备(上海)股份有限公司 使用超临界流体对基板进行干燥的干燥装置及方法

Also Published As

Publication number Publication date
KR20200139378A (ko) 2020-12-14
KR102254186B1 (ko) 2021-05-21

Similar Documents

Publication Publication Date Title
CN112038261A (zh) 基板干燥装置
TWI749446B (zh) 基板乾燥腔
CN112117212A (zh) 基板干燥腔室
KR102355357B1 (ko) 기판 건조 장치
CN112242323A (zh) 基板干燥装置
KR102357843B1 (ko) 기판 건조 장치
KR102327873B1 (ko) 기판 건조 챔버
KR102357842B1 (ko) 기판 건조 장치
KR20220021491A (ko) 기판 건조 장치
KR20220014061A (ko) 기판 건조 챔버
KR102383007B1 (ko) 기판 건조 챔버
KR102320033B1 (ko) 기판 건조 챔버
KR102283290B1 (ko) 기판 건조 챔버
KR102398794B1 (ko) 기판 건조 챔버
KR102285672B1 (ko) 기판 건조 챔버
KR102345971B1 (ko) 기판 건조 챔버
KR102309272B1 (ko) 기판 건조 챔버
KR102391208B1 (ko) 기판 건조 챔버
KR102398793B1 (ko) 기판 건조 챔버
KR20200111468A (ko) 기판 건조 챔버
KR102345972B1 (ko) 기판 건조 챔버
KR102178594B1 (ko) 기판 건조 챔버
KR102210830B1 (ko) 기판 건조 챔버
KR102258986B1 (ko) 기판 건조 챔버
US20220367213A1 (en) Apparatus for treating substrate

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination