CN112038260A - 基板干燥腔室 - Google Patents

基板干燥腔室 Download PDF

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Publication number
CN112038260A
CN112038260A CN202010494273.1A CN202010494273A CN112038260A CN 112038260 A CN112038260 A CN 112038260A CN 202010494273 A CN202010494273 A CN 202010494273A CN 112038260 A CN112038260 A CN 112038260A
Authority
CN
China
Prior art keywords
substrate
drying
supercritical fluid
placing plate
lower case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010494273.1A
Other languages
English (en)
Chinese (zh)
Inventor
申傛湜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mujin Electronics Co ltd
Original Assignee
Mujin Electronics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mujin Electronics Co ltd filed Critical Mujin Electronics Co ltd
Publication of CN112038260A publication Critical patent/CN112038260A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
CN202010494273.1A 2019-06-04 2020-06-03 基板干燥腔室 Pending CN112038260A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020190065690A KR102285672B1 (ko) 2019-06-04 2019-06-04 기판 건조 챔버
KR10-2019-0065690 2019-06-04

Publications (1)

Publication Number Publication Date
CN112038260A true CN112038260A (zh) 2020-12-04

Family

ID=73578830

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010494273.1A Pending CN112038260A (zh) 2019-06-04 2020-06-03 基板干燥腔室

Country Status (2)

Country Link
KR (1) KR102285672B1 (ko)
CN (1) CN112038260A (ko)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100030291A (ko) * 2008-09-10 2010-03-18 세메스 주식회사 기판 건조 장치
KR20130063813A (ko) * 2011-12-07 2013-06-17 삼성전자주식회사 기판 건조 장치 및 방법
US20140262024A1 (en) * 2013-03-12 2014-09-18 Yong-jhin Cho Substrate treatment systems using supercritical fluid
KR20160147162A (ko) * 2015-06-12 2016-12-22 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
CN108257893A (zh) * 2016-12-29 2018-07-06 三星电子株式会社 基板处理装置和包括其的基板处理系统
KR20180125764A (ko) * 2017-05-16 2018-11-26 주식회사 케이씨텍 기판 처리용 챔버
KR20190002935A (ko) * 2017-06-30 2019-01-09 주식회사 케이씨텍 기판 처리용 챔버 및 기판 처리용 챔버의 승강위치 제어 방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101027469B1 (ko) * 2008-08-20 2011-04-06 엘아이지에이디피 주식회사 밀폐 챔버용 실링장치 및 이를 구비한 밀폐 챔버 조립체와 임프린트용 챔버 조립체, 그리고 이를 이용한 임프린트 방법
US20100184290A1 (en) 2009-01-16 2010-07-22 Applied Materials, Inc. Substrate support with gas introduction openings
KR101096122B1 (ko) * 2009-11-25 2011-12-20 세메스 주식회사 기판 건조 장치 및 그의 기판 건조 방법
KR101619166B1 (ko) 2015-06-12 2016-05-18 카즈오 스기하라 기판의 세정·건조 처리 장치
KR101856606B1 (ko) 2016-06-02 2018-05-15 세메스 주식회사 기판 처리 장치 및 방법

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100030291A (ko) * 2008-09-10 2010-03-18 세메스 주식회사 기판 건조 장치
KR20130063813A (ko) * 2011-12-07 2013-06-17 삼성전자주식회사 기판 건조 장치 및 방법
US20140262024A1 (en) * 2013-03-12 2014-09-18 Yong-jhin Cho Substrate treatment systems using supercritical fluid
KR20140112638A (ko) * 2013-03-12 2014-09-24 삼성전자주식회사 초임계 유체를 이용하는 기판 처리 장치, 이를 포함하는 기판 처리 시스템, 및 기판 처리 방법
KR20160147162A (ko) * 2015-06-12 2016-12-22 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
CN108257893A (zh) * 2016-12-29 2018-07-06 三星电子株式会社 基板处理装置和包括其的基板处理系统
KR20180125764A (ko) * 2017-05-16 2018-11-26 주식회사 케이씨텍 기판 처리용 챔버
KR20190002935A (ko) * 2017-06-30 2019-01-09 주식회사 케이씨텍 기판 처리용 챔버 및 기판 처리용 챔버의 승강위치 제어 방법

Also Published As

Publication number Publication date
KR20200139852A (ko) 2020-12-15
KR102285672B1 (ko) 2021-08-06

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