CN112038260A - 基板干燥腔室 - Google Patents
基板干燥腔室 Download PDFInfo
- Publication number
- CN112038260A CN112038260A CN202010494273.1A CN202010494273A CN112038260A CN 112038260 A CN112038260 A CN 112038260A CN 202010494273 A CN202010494273 A CN 202010494273A CN 112038260 A CN112038260 A CN 112038260A
- Authority
- CN
- China
- Prior art keywords
- substrate
- drying
- supercritical fluid
- placing plate
- lower case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 175
- 238000001035 drying Methods 0.000 title claims abstract description 118
- 239000012530 fluid Substances 0.000 claims abstract description 99
- 239000003960 organic solvent Substances 0.000 claims abstract description 22
- 239000002245 particle Substances 0.000 claims abstract description 22
- 230000008878 coupling Effects 0.000 claims description 32
- 238000010168 coupling process Methods 0.000 claims description 32
- 238000005859 coupling reaction Methods 0.000 claims description 32
- 238000007789 sealing Methods 0.000 claims description 13
- 230000005484 gravity Effects 0.000 claims description 6
- 238000005192 partition Methods 0.000 claims description 5
- 238000007599 discharging Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 27
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 24
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 16
- 229910002092 carbon dioxide Inorganic materials 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- 239000001569 carbon dioxide Substances 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 7
- 238000000352 supercritical drying Methods 0.000 description 5
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 i.e. Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Drying Of Solid Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2019-0065690 | 2019-06-04 | ||
KR1020190065690A KR102285672B1 (ko) | 2019-06-04 | 2019-06-04 | 기판 건조 챔버 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN112038260A true CN112038260A (zh) | 2020-12-04 |
Family
ID=73578830
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010494273.1A Pending CN112038260A (zh) | 2019-06-04 | 2020-06-03 | 基板干燥腔室 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR102285672B1 (ko) |
CN (1) | CN112038260A (ko) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20100030291A (ko) * | 2008-09-10 | 2010-03-18 | 세메스 주식회사 | 기판 건조 장치 |
KR20130063813A (ko) * | 2011-12-07 | 2013-06-17 | 삼성전자주식회사 | 기판 건조 장치 및 방법 |
US20140262024A1 (en) * | 2013-03-12 | 2014-09-18 | Yong-jhin Cho | Substrate treatment systems using supercritical fluid |
KR20160147162A (ko) * | 2015-06-12 | 2016-12-22 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
CN108257893A (zh) * | 2016-12-29 | 2018-07-06 | 三星电子株式会社 | 基板处理装置和包括其的基板处理系统 |
KR20180125764A (ko) * | 2017-05-16 | 2018-11-26 | 주식회사 케이씨텍 | 기판 처리용 챔버 |
KR20190002935A (ko) * | 2017-06-30 | 2019-01-09 | 주식회사 케이씨텍 | 기판 처리용 챔버 및 기판 처리용 챔버의 승강위치 제어 방법 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101027469B1 (ko) * | 2008-08-20 | 2011-04-06 | 엘아이지에이디피 주식회사 | 밀폐 챔버용 실링장치 및 이를 구비한 밀폐 챔버 조립체와 임프린트용 챔버 조립체, 그리고 이를 이용한 임프린트 방법 |
US20100184290A1 (en) | 2009-01-16 | 2010-07-22 | Applied Materials, Inc. | Substrate support with gas introduction openings |
KR101096122B1 (ko) * | 2009-11-25 | 2011-12-20 | 세메스 주식회사 | 기판 건조 장치 및 그의 기판 건조 방법 |
KR101619166B1 (ko) | 2015-06-12 | 2016-05-18 | 카즈오 스기하라 | 기판의 세정·건조 처리 장치 |
KR101856606B1 (ko) | 2016-06-02 | 2018-05-15 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
-
2019
- 2019-06-04 KR KR1020190065690A patent/KR102285672B1/ko active IP Right Grant
-
2020
- 2020-06-03 CN CN202010494273.1A patent/CN112038260A/zh active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20100030291A (ko) * | 2008-09-10 | 2010-03-18 | 세메스 주식회사 | 기판 건조 장치 |
KR20130063813A (ko) * | 2011-12-07 | 2013-06-17 | 삼성전자주식회사 | 기판 건조 장치 및 방법 |
US20140262024A1 (en) * | 2013-03-12 | 2014-09-18 | Yong-jhin Cho | Substrate treatment systems using supercritical fluid |
KR20140112638A (ko) * | 2013-03-12 | 2014-09-24 | 삼성전자주식회사 | 초임계 유체를 이용하는 기판 처리 장치, 이를 포함하는 기판 처리 시스템, 및 기판 처리 방법 |
KR20160147162A (ko) * | 2015-06-12 | 2016-12-22 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
CN108257893A (zh) * | 2016-12-29 | 2018-07-06 | 三星电子株式会社 | 基板处理装置和包括其的基板处理系统 |
KR20180125764A (ko) * | 2017-05-16 | 2018-11-26 | 주식회사 케이씨텍 | 기판 처리용 챔버 |
KR20190002935A (ko) * | 2017-06-30 | 2019-01-09 | 주식회사 케이씨텍 | 기판 처리용 챔버 및 기판 처리용 챔버의 승강위치 제어 방법 |
Also Published As
Publication number | Publication date |
---|---|
KR102285672B1 (ko) | 2021-08-06 |
KR20200139852A (ko) | 2020-12-15 |
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