CN112037674B - Area light source, manufacturing method thereof and display device - Google Patents
Area light source, manufacturing method thereof and display device Download PDFInfo
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- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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Abstract
The invention relates to a surface light source, a preparation method thereof and a display device. The surface light source includes: the light conversion device comprises a substrate, a first light emitting diode chip, a first light ray adjusting structure and a first light conversion structure, wherein the first light emitting diode chip is positioned on the substrate and is used for emitting light of a first color; the first light adjusting structure is positioned on the substrate and adjacent to the first light emitting diode chip and used for uniformly emitting the light of the first color received from the first light emitting diode chip from the surface far away from the substrate; the first light conversion structure is located on one side, far away from the substrate, of the first light adjustment structure and used for converting the light of the first color received from the first light adjustment structure into light of a second color and emitting the light from the surface far away from the substrate, and the color of the light of the first color is different from that of the light of the second color. According to the embodiment of the invention, the yield of the display device can be improved, and the cost can be reduced.
Description
Technical Field
The invention relates to the technical field of display, in particular to a surface light source, a preparation method thereof and a display device.
Background
In the related art, the MiniLED and the micro led display panels all emit light by using a red chip, a green chip and a blue chip, but the red chip has a low yield, a high price and a high cost because the light emitting layer of the red chip is made of AlGaInP (indium gallium aluminum phosphide).
Disclosure of Invention
The invention provides a surface light source, a preparation method thereof and a display device, aiming at solving the defects in the related art.
According to a first aspect of embodiments of the present invention, there is provided a surface light source including:
a substrate;
a first light emitting diode chip on the substrate for emitting light of a first color;
the first light adjusting structure is positioned on the substrate and adjacent to the first light emitting diode chip and used for uniformly emitting the light of the first color received from the first light emitting diode chip from the surface far away from the substrate;
the first light conversion structure is positioned on one side, far away from the substrate, of the first light ray adjustment structure and is used for converting the light of the first color received from the first light ray adjustment structure into light of a second color and emitting the light from the surface, far away from the substrate, of the first color, and the color of the light of the second color is different from that of the light of the first color.
In one embodiment, the first led chip is a blue chip, and the first color light is blue light; the light of the second color is green or red light.
In one embodiment, the height of the first light adjusting structure is greater than the height of the first led chip; the height of the first light ray adjusting structure is more than or equal to 1.1 times of the height of the first light emitting diode chip; a gap is formed between the first light ray adjusting structure and the first light emitting diode chip; the first light ray adjusting structure comprises a plurality of mesh points, and the mesh points are positioned on one side, close to the substrate, of the first light ray adjusting structure.
In one embodiment, the first light converting structure comprises quantum dots, phosphors and/or perovskites.
In one embodiment, the display panel further includes a first retaining wall, where the first retaining wall is located on a side of the first led chip away from the first light adjustment structure, and is used to reflect the light of the first color from the first led chip to the first light adjustment structure.
In one embodiment, the first retaining wall includes an arc surface, and a spherical center of a sphere where the arc surface is located on one side of the first retaining wall close to the first led chip; the projection of the first light-emitting diode chip on the substrate is positioned in the projection of the cambered surface on the substrate; the height of the first retaining wall is greater than or equal to that of the first light adjusting structure.
In one embodiment, the display panel further includes a second retaining wall, the second retaining wall is located on one side of the first retaining wall away from the substrate, and the second retaining wall is used for shading light; the height of the second retaining wall is less than or equal to that of the first light conversion structure; the surface of the second blocking wall far away from the substrate is flush with the surface of the first light conversion structure far away from the substrate.
According to a second aspect of embodiments of the present invention, there is provided a display device including:
a substrate;
at least one pixel on the substrate; wherein the pixel comprises a first sub-pixel, the first sub-pixel comprises a first LED chip, a first light adjusting structure and a first light converting structure, the first LED chip is located on the substrate, the first light adjusting structure is located on the substrate and adjacent to the first LED chip, for uniformly emitting light of a first color received from the first led chip out of a surface remote from the substrate, the first light conversion structure is positioned on one side of the first light ray adjusting structure far away from the substrate, for converting light of a first color received from the first light adjusting structure into light of a second color, and is emitted from a surface remote from the substrate, the color of the first color light being different from the color of the second color light.
In one embodiment, the first led chip is a blue chip, and the first color light is blue light; the light of the second color is red light.
In one embodiment, the pixel further includes a second sub-pixel including a second light emitting diode chip, a second light adjusting structure and a second light converting structure, the second light emitting diode chip being located on the substrate, the second light adjusting structure is located on the substrate and adjacent to the second LED chip, for uniformly emitting light of the first color received from the second light emitting diode chip from a surface remote from the substrate, the second light conversion structure is positioned on one side of the second light ray adjusting structure far away from the substrate, for converting light of the first color received from the second light-adjusting structure into light of a third color, and is emitted from a surface remote from the substrate, the color of the light of the first color being different from the color of the light of the third color; the second light emitting diode chip is a blue light chip, and the light of the third color is green light.
In one embodiment, the pixel further comprises a second sub-pixel including a second light emitting diode chip on the substrate for emitting light of a third color, a second light adjusting structure on the substrate adjacent to the second light emitting diode chip for uniformly emitting the light of the third color received from the second light emitting diode chip from a surface remote from the substrate, and a first scattering film on a side of the second light adjusting structure remote from the substrate for uniformly emitting the light of the third color received from the second light adjusting structure from the surface remote from the substrate; the second light emitting diode chip is a green chip, and the light of the third color is green light.
In one embodiment, the pixel further comprises a third sub-pixel including a third led chip on the substrate for emitting light of the first color, a third light adjustment structure on the substrate and adjacent to the third led chip for uniformly emitting light of the first color received from the third led chip away from the surface of the substrate, and a second scattering film on a side of the third light adjustment structure away from the substrate for uniformly emitting light of the first color received from the third light adjustment structure away from the surface of the substrate; the third light emitting diode chip is a blue light chip.
In one embodiment, the first sub-pixel further includes a first bank and a second bank; the first retaining wall is positioned on one side of the first light emitting diode chip far away from the first light adjusting structure and is used for reflecting the light of the first color from the first light emitting diode chip to the first light adjusting structure; the second retaining wall is positioned on one side of the first retaining wall far away from the substrate and is used for shading light; the second sub-pixel also comprises a third retaining wall and a fourth retaining wall; the third baffle wall is positioned on one side of the second light-emitting diode chip far away from the second light adjusting structure and used for reflecting light from the second light-emitting diode chip to the second light adjusting structure; the fourth retaining wall is positioned on one side of the third retaining wall, which is far away from the substrate, and is used for shading light; the third sub-pixel further comprises a fifth retaining wall and a sixth retaining wall; the fifth retaining wall is located on one side of the third light emitting diode chip far away from the third light adjusting structure and used for reflecting the light of the first color from the third light emitting diode chip to the third light adjusting structure; the sixth retaining wall is located the fifth retaining wall is kept away from one side of the substrate, and the sixth retaining wall is used for shading.
In one embodiment, the display panel further includes an encapsulation layer, and the encapsulation layer is located on a side of the pixel away from the substrate.
According to a third aspect of embodiments of the present invention, there is provided a method of manufacturing a surface light source, including:
forming a first light emitting diode chip on a substrate, the first light emitting diode chip for emitting light of a first color;
forming a first light adjusting structure on the substrate and adjacent to the first led chip for uniformly emitting light of the first color received from the first led chip out of a surface away from the substrate;
and forming a first light conversion structure, wherein the first light conversion structure is positioned on one side of the first light ray adjusting structure far away from the substrate and is used for converting the light of the first color received from the first light ray adjusting structure into the light of the second color and emitting the light from the surface far away from the substrate, and the color of the light of the first color is different from that of the light of the second color.
According to the above embodiment, since the first led chip is disposed on the substrate for emitting the light of the first color, the first light adjusting structure is disposed on the substrate and adjacent to the first led chip for uniformly emitting the light of the first color received from the first led chip from the surface away from the substrate, and the first light converting structure is disposed on the side of the first light adjusting structure away from the substrate for converting the light of the first color received from the first light adjusting structure into the light of the second color and emitting the light of the second color from the surface away from the substrate, the light of the second color can be obtained by using the first led chip for emitting the light of the first color and the first light converting structure for converting the light of the first color into the light of the second color when the yield of the led chip for emitting the light of the second color is low and the cost is high, and the LED chip emitting the light of the second color is not needed, so that the yield of the surface light source can be improved, the cost of the surface light source can be reduced, and the yield of the display device can be improved, and the cost can be reduced.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic structural view of a surface light source according to an embodiment of the present invention;
fig. 2 is a schematic structural view of another surface light source according to an embodiment of the present invention;
fig. 3 is a schematic view illustrating the structure of another surface light source according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a display device according to an embodiment of the present invention;
FIG. 5 is a schematic diagram illustrating the luminous efficacy of a display device according to an embodiment of the present invention;
fig. 6 is a schematic structural view showing another display device according to an embodiment of the present invention;
fig. 7 is a flowchart illustrating a method of fabricating a surface light source according to an embodiment of the present invention.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. The following description refers to the accompanying drawings in which the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the invention, as detailed in the appended claims.
The embodiment of the invention provides a surface light source. As shown in fig. 1, the surface light source includes a substrate 11, a first led chip 12, a first light adjusting structure 13, and a first light converting structure 14.
As shown in fig. 1, in the present embodiment, a first led chip 12 is located on a substrate 11 for emitting light of a first color. The first light adjusting structure 13 is disposed on the substrate 11 and adjacent to the first led chip 12, and the first light adjusting structure 13 is configured to uniformly emit the light of the first color received from the first led chip 12 out of the surface away from the substrate 11. The first light conversion structure 14 is located on a side of the first light adjustment structure 13 away from the substrate 11, and the first light conversion structure 14 is configured to convert the light of the first color received from the first light adjustment structure 13 into light of a second color and emit the light from a surface away from the substrate 11, where the color of the light of the first color is different from the color of the light of the second color.
In this embodiment, since the first led chip is disposed on the substrate for emitting the light of the first color, the first light adjusting structure is disposed on the substrate and adjacent to the first led chip for uniformly emitting the light of the first color received from the first led chip from the surface away from the substrate, and the first light converting structure is disposed at a side of the first light adjusting structure away from the substrate for converting the light of the first color received from the first light adjusting structure into the light of the second color and emitting the light from the surface away from the substrate, the light of the second color can be obtained by using the first led chip for emitting the light of the first color and the first light converting structure for converting the light of the first color into the light of the second color without using the led chip for emitting the light of the second color when the led chip for emitting the light of the second color is low in cost, therefore, the yield of the surface light source can be improved, the cost of the surface light source can be reduced, and the yield of the display device can be improved and the cost can be reduced.
The above briefly introduces the planar light source provided by the embodiment of the present invention, and the following describes the planar light source provided by the embodiment of the present invention in detail.
The embodiment of the invention also provides a surface light source. The surface light source, as shown in fig. 1, includes: the light source module includes a substrate 11, a first led chip 12, a first light adjusting structure 13, a first light converting structure 14, a first retaining wall 15 and a second retaining wall 16.
As shown in fig. 1, in the present embodiment, a first led chip 12 is located on a substrate 11 for emitting light of a first color. The first led chip 12 may be a blue chip, and the first color light is blue light. That is, the first light emitting diode chip 12 is for emitting blue light. The blue chip may include a substrate and an epitaxial layer on the substrate. Wherein the material of the epitaxial layer comprises GaN (gallium nitride). The yield of the blue light chip is higher than that of the red light chip, so the cost of the blue light chip is lower than that of the red light chip.
As shown in fig. 1, in the present embodiment, the first light adjusting structure 13 is located on the substrate 11, the first light adjusting structure 13 is adjacent to the first led chip 12, and a gap exists between the first light adjusting structure 13 and the first led chip 12. The first light adjusting structure 13 is used for uniformly emitting the light of the first color received from the first led chip 12 out of the surface S1 away from the substrate 11. Thus, the point light source can be changed into a surface light source.
In this embodiment, the height of the first light adjusting structure 13 is greater than the height of the first led chip 12. For example, the height of the first light adjusting structure 13 is equal to 1.1 times the height of the first led chip 12. Of course, the height of the first light adjusting structure 13 may also be greater than 1.1 times the height of the first led chip 12. Therefore, the light emitted by the first light-emitting diode chip can be received as much as possible, or the whole light is received, so that the utilization efficiency of the first light-emitting diode chip is improved.
In the present embodiment, as shown in fig. 2, the first light adjusting structure 13 includes a plurality of dots 131, and the plurality of dots 131 are located on a side of the first light adjusting structure 13 close to the substrate 11. As shown in fig. 2, each dot 131 may be a hemisphere, and as shown in fig. 3, the projection on the substrate 11 is a circle. Of course, the dots 131 may have other three-dimensional structures, for example, the dots 131 may have a cone shape, the cross section of the dots 131 may be a triangle shape, the heights of the dots 131 are the same, and for example, the cross section of the dots 131 may also be a zigzag shape, and the heights of the dots 131 may not be completely the same.
In this embodiment, the first light adjusting structure 13 may be formed by 3D printing or inkjet printing, and the dots 131 may be formed by mask (mask) exposure. The material of the first light adjusting structure 13 may be polyimide or melamine resin in consideration of the bonding force and adhesion with the first light conversion structure 14, but is not limited thereto.
In the present embodiment, the first light conversion structure 14 is located on a side of the first light adjustment structure 13 away from the substrate 11, and the first light conversion structure 14 is configured to convert the light of the first color received from the first light adjustment structure 13 into the light of the second color, and emit the light of the first color from the surface S2 away from the substrate 11, where the color of the light of the first color is different from the color of the light of the second color.
In this embodiment, the light of the second color is red light. Of course, the light of the second color may also be green light, or light of other colors.
In the present embodiment, the first light conversion structure 14 may include quantum dots. The material of the quantum dots is CdSe (cadmium selenide) or InP (indium phosphide), but is not limited thereto. When the first light converting structure 14 is used to convert blue light into red light, the particle size of the quantum dots is about 9 nm to 10 nm. When the first light converting structure 14 is used to convert blue light into green light, the particle size of the quantum dots is about 3 nm. The half-wave peak of the light penetrating through the quantum dots is narrow, which is beneficial to improving the color purity of the light emitted by the surface light source and reducing the crosstalk with other color lights.
In this embodiment, the light emitted from the first light adjusting structure 13 is uniform, and when the light emitted from the first light adjusting structure 13 excites the quantum dots, the illumination radiation density of the blue light can be greatly reduced, and the reliability of the surface light source is improved.
Of course, in another embodiment, the first light conversion structure 14 may also include phosphor. For example, when the first light conversion structure 14 is used to convert blue light into red light, the first light conversion structure 14 may also include a red phosphor, for example, the material of the red phosphor may be (Sr, Ca) Al Si N 3 ∶Eu 2+ . When the first light converting structure 14 is used for converting blue light into green light, the first light converting structure 14 may also compriseThe green phosphor, for example, may be gamma-sialon.
In another embodiment, the first light converting structure 14 may also comprise a perovskite.
In this embodiment, as shown in fig. 1, the first retaining wall 15 is located on a side of the first led chip 12 away from the first light adjusting structure 13, and the first retaining wall 15 is used for reflecting the light of the first color from the first led chip 12 to the first light adjusting structure 13. Therefore, the utilization rate of the first LED chip 12 can be improved, and the light efficiency is improved.
In this embodiment, the first retaining wall 15 may be a transparent adhesive layer added with reflective particles, and the reflective particles are made of TiO 2 Or SiO 2 The reflectivity for the blue light band of 460nm can be improved, but is not limited to this.
In the present embodiment, as shown in fig. 1, the first retaining wall 15 includes an arc surface S3, a spherical center of the sphere where the arc surface S3 is located at a side of the first retaining wall 15 close to the first led chip 12, that is, the arc surface S3 is curved in a direction away from the first led chip 12. The central angle corresponding to the cambered surface S3 is less than or equal to 90 degrees. The projection of the first led chip 12 on the substrate 11 is located within the projection of the curved surface S3 on the substrate 11. The height of the first retaining wall 15 is greater than that of the first light adjustment structure. Of course, the height of the first retaining wall 15 can also be equal to the height of the first light adjustment structure.
In this embodiment, the first retaining wall 15 may be implemented by printing, for example, an arc surface facing the first led chip 12 may be implemented by stacking layers, and a curvature radius of the arc surface may be adjusted according to a size of the actual first led chip 12.
In one embodiment, the second retaining wall 16 is located on a side of the first retaining wall 15 away from the substrate 11, and the second retaining wall 16 is used for shielding light. The material of the second retaining wall 16 may be epoxy resin doped with melanin for blocking or absorbing visible light. When the area light source is not bright, the structure between the second blocking wall 16 and the substrate 11 is prevented from being observed by a user, and the appearance is prevented from being influenced.
In the present embodiment, as shown in fig. 1, the height of the second retaining wall 16 is less than the height of the first light conversion structure 14. Of course, the height of the second retaining wall 16 may also be equal to the height of the first light conversion structure 14. The surface of the second retaining wall 16 away from the substrate 11 and the surface of the first light conversion structure 14 away from the substrate 11 may be flush, but are not limited thereto.
The area light source provided by the embodiment of the present invention is described in detail above, and a blue light chip with a width of 89 μm (micrometer) and a length of 150 μm of the first light emitting diode chip is taken as an example for description. The first led chip is a miniLED chip, as shown in fig. 1, the length direction is an x direction, the width direction is a y direction, the height direction is a z direction, and O is an origin of a coordinate system.
As shown in fig. 1, a gap exists between the first led chip 12 and the first retaining wall 15, a distance L1 between the first led chip 12 and the first retaining wall 15 is 10 μm, a distance L2 between the first led chip 12 and the first light adjusting structure 13 is 20 μm, and since the length of the first led chip is 150 μm, the half-arc width of the arc surface S3 is 190 μm.
As shown in fig. 1, the total height of the first led chip 12 is 90 μm, the height of the first light adjusting structure 13 is 100 μm, and the height of the first light adjusting structure 13 is 10 μm greater than the total height of the first led chip 12, so that total light collection can be achieved. Considering the manufacturing accuracy tolerance of ± 10 μm, the height of the arc surface S3 is 20 μm greater than the height of the first light adjustment structure 13, i.e., the height of the arc surface S3 is 120 μm, i.e., the height of the first retaining wall 15 is about 120 μm, and the height of the first retaining wall 15 is 20 μm greater than the height of the first light adjustment structure 13. Wherein the total height of the first led chip 12 includes the height of the first led chip 12, the height of the solder, and the height of the adhesive, which may be, but is not limited to, sap.
Therefore, when the arc S3 is designed, the size of the arc S3 in the length direction of the first led chip 12 is the sum of the length of the first led chip 12 and 30 μm, the size of the arc S3 in the width direction of the first led chip 12 is the sum of the width of the first led chip 12 and 30 μm, and the size of the arc S3 in the height direction of the first led chip 12 is the sum of the total height of the first led chip 12 and 30 μm.
The height of the second wall 16 is about 10 to 30 μm, that is, the conversion efficiency of the quantum dot ink is considered, if the second wall 16 is too thick, light is absorbed by the quantum dot particles, the brightness is reduced, if the second wall 16 is too thin, the color conversion of the quantum dots is insufficient, and the blue light remains, which affects the overall color point and color gamut.
The blue light chip with the width of 15 μm and the length of 30 μm of the first LED chip is taken as an example for description. The first light emitting diode chip is a micro LED chip.
As shown in fig. 1, a gap exists between the first led chip 12 and the first retaining wall 15, a distance L1 between the first led chip 12 and the first retaining wall 15 may be 2 μm, a distance L2 between the first led chip 12 and the first light adjusting structure 13 is 5 μm, and since the length of the first led chip is 30 μm, the half arc width of the arc surface S3 may be 37 μm.
As shown in fig. 1, the total height of the first led chip 12 is 7 to 8 μm, the height of the first light adjusting structure 13 is 9 to 10 μm, and the height of the first light adjusting structure 13 is 2 μm greater than the total height of the first led chip 12, so that the total light receiving can be realized. Considering the manufacturing accuracy tolerance of ± 2 μm, the height of the arc surface S3 is 4 μm greater than the height of the first light adjustment structure 13, i.e. the height of the arc surface S3 is 13-14 μm, i.e. the height of the first retaining wall 15 is 4 μm greater than the height of the first light adjustment structure 13. Wherein the total height of the first led chip 12 includes the height of the first led chip 12 and the height of the adhesive, and the material of the adhesive may be ACF (anisotropic conductive film), but is not limited thereto.
Therefore, when designing the arc surface S3, the size of the arc surface S3 in the length direction of the first led chip 12 is the sum of the length of the first led chip 12 and 7 μm, the size of the arc surface S3 in the width direction of the first led chip 12 is the sum of the width of the first led chip 12 and 7 μm, and the size of the arc surface S3 in the height direction of the first led chip 12 is the sum of the total height of the first led chip 12 and 6 μm.
In this embodiment, since the first led chip is disposed on the substrate for emitting the light of the first color, the first light adjusting structure is disposed on the substrate and adjacent to the first led chip for uniformly emitting the light of the first color received from the first led chip from the surface away from the substrate, and the first light converting structure is disposed on the side of the first light adjusting structure away from the substrate for converting the light of the first color received from the first light adjusting structure into the light of the second color and emitting the light of the second color from the surface away from the substrate, the light of the second color can be obtained by using the first led chip for emitting the light of the first color and the first light converting structure for converting the light of the first color into the light of the second color without using the led chip for emitting the light of the second color when the yield of the led chip for emitting the light of the second color is low and the cost is high, therefore, the yield of the surface light source can be improved, the cost of the surface light source can be reduced, and the yield of the display device can be improved and the cost can be reduced.
The embodiment of the invention also provides a display device. As shown in fig. 4, the display device includes a substrate 11, at least one pixel (not shown), and an encapsulation layer 44.
As shown in fig. 4, the at least one pixel is located on the substrate 11. Each pixel includes a first sub-pixel 41, a second sub-pixel 42, and a third sub-pixel 43. The first subpixel 41 is for emitting red light, the second subpixel 42 is for emitting green light, and the third subpixel 43 is for emitting blue light.
As shown in fig. 4, the first sub-pixel 41 includes a first led chip 12, a first light adjusting structure 13 and a first light converting structure 14. The first sub-pixel 41 in this embodiment is similar to the surface light source, the first led chip 12 is located on the substrate 11 and is configured to emit light of a first color, the first light adjusting structure 13 is located on the substrate 11 and is adjacent to the first led chip 12 and is configured to uniformly emit the light of the first color received from the first led chip 12 out of the surface away from the substrate 11, the first light converting structure 14 is located on a side of the first light adjusting structure 13 away from the substrate 11 and is configured to convert the light of the first color received from the first light adjusting structure 13 into light of a second color and emit the light of the second color out of the surface away from the substrate 11, and the color of the light of the first color is different from the color of the light of the second color.
In this embodiment, the first led chip 12 is a blue chip, the first color light is blue light, and the second color light is red light. That is, the first led chip 12 is configured to emit blue light, and the first light conversion structure 14 is configured to convert the blue light into red light.
As shown in fig. 4, the first sub-pixel 41 further includes a first wall 15 and a second wall 16; the first retaining wall 15 is located on a side of the first led chip 12 away from the first light adjusting structure 13, and is used for reflecting the light of the first color from the first led chip 12 to the first light adjusting structure 13; the second retaining wall 16 is located on a side of the first retaining wall 15 away from the substrate 11, and the second retaining wall 16 is used for shielding light.
As shown in fig. 4, the second sub-pixel 42 is similar to the first sub-pixel 41, and the second sub-pixel 42 includes a second light emitting diode chip 22, a second light adjusting structure 23 and a second light converting structure 24, wherein the second light emitting diode chip 22 is located on the substrate 11 for emitting light of the first color, i.e., for emitting blue light. The second light adjusting structure 23 is located on the substrate 11 and adjacent to the second led chip 22, and is configured to uniformly emit the light of the first color received from the second led chip 22 from the surface far away from the substrate 11, the second light converting structure 24 is located on a side of the second light adjusting structure 23 far away from the substrate 11, and is configured to convert the light of the first color received from the second light adjusting structure 23 into the light of the third color and emit the light of the third color from the surface far away from the substrate 11, and a color of the light of the first color is different from a color of the light of the third color. The second led chip 22 is a blue chip and the third color light is green light. That is, the second light converting structure 24 serves to convert blue light into green light.
As shown in fig. 4, the second sub-pixel 42 further includes a third wall 25 and a fourth wall 26. The third retaining wall 25 is identical in structure to the first retaining wall 15, and the fourth retaining wall 26 is identical in structure to the second retaining wall 16. The third retaining wall 25 is located on a side of the second led chip 22 away from the second light adjusting structure 23, and is used for reflecting light from the second led chip 22 to the second light adjusting structure 23; the fourth retaining wall 26 is located on a side of the third retaining wall 23 away from the substrate 11, and the fourth retaining wall 26 is used for shading light.
As shown in fig. 4, the third sub-pixel 43 includes a third led chip 32, a third light adjusting structure 33 and a second scattering film 34, wherein the third led chip 32 is disposed on the substrate 11 for emitting the light of the first color, i.e., the third led chip 32 is configured for emitting blue light. The third light adjusting structure 33 is disposed on the substrate 11 and adjacent to the third led chip 32 for uniformly emitting the light of the first color received from the third led chip 32 from the surface far from the substrate 11, and the second scattering film 34 is disposed on a side of the third light adjusting structure 33 far from the substrate 11 for uniformly emitting the light of the first color received from the third light adjusting structure 33 from the surface far from the substrate 11. The third led chip 32 is a blue chip.
In this embodiment, the second scattering film 34 is a transparent adhesive layer including scattering particles. Wherein the scattering particles may be TiO 2 Or SiO 2 . The second scattering film 34 makes the distribution of light emitted by the third sub-pixel 43 the same as the distribution of light emitted by the first sub-pixel 41 and the distribution of light emitted by the second sub-pixel 42, both of which are gaussian distributions, which is beneficial to improving the display effect.
As shown in fig. 4, the third sub-pixel 43 further includes a fifth bank 35 and a sixth bank 36. The fifth wall 35 is identical to the first wall 15, and the sixth wall 36 is identical to the second wall 16. The fifth retaining wall 35 is located on a side of the third led chip 32 away from the third light adjustment structure 33, and is used for reflecting the light of the first color from the third led chip 32 to the third light adjustment structure 33; the sixth retaining wall 36 is located on a side of the fifth retaining wall 35 away from the substrate 11, and the sixth retaining wall 36 is used for shielding light.
In the embodiment, the second wall 16, the fourth wall 26 and the sixth wall 36 can prevent the color crosstalk of the light emitted by the first sub-pixel 41, the second sub-pixel 42 and the third sub-pixel 43, thereby reducing the color gamut of the display device.
In the present embodiment, the first light adjusting structure 13, the second light adjusting structure 23 and the third light adjusting structure 33 are fabricated by a process in the manufacturing process of the display device, rather than being separately fabricated and then placed on the substrate 11.
In this embodiment, the blue chip is a flip chip. Thus, the blue chip can emit blue light to the periphery.
Because the characteristic of the material itself of quantum dot, it is very sensitive to blue light irradiation, and long-time high energy blue light irradiation can cause the injury to the material of quantum dot, and display device makes as the structure shown in fig. 4, can increase the optical path on the one hand, reduces blue light chip to the performance damage of quantum dot, and on the other hand has the signal in fig. 5, can make full use of flip chip's the light of side, and the promotion efficiency reduces whole consumption.
In this embodiment, the encapsulation layer 44 is located on a side of the pixel away from the substrate 11 for isolating water and oxygen. The material of the encapsulation layer 44 may be silicon nitride. Because silicon nitride has a relatively good compactness, the encapsulation layer 44 can isolate water and oxygen, protect pixels, and prolong the service life of the display device.
In the present embodiment, the encapsulation layer 44 is realized by magnetron sputtering or low temperature Chemical Vapor Deposition (CVD).
In the embodiment, the first sub-pixel 41 uses a blue chip instead of a red chip, and the yield of the blue chip is higher than that of the red chip, so that the yield of the display device can be increased and the cost can be reduced.
In the present embodiment, the first sub-pixel 41, the second sub-pixel 42, and the third sub-pixel 43 in each pixel all use blue chips, so that the productivity and efficiency can be improved.
In this embodiment, the third retaining wall 25 can also reflect the light emitted by the first led chip 12 to the first light adjusting structure 13, so as to improve the utilization efficiency of the blue light. Similarly, the fifth retaining wall 35 can also reflect the light emitted by the second led chip 22 to the second light adjusting structure 23, so as to improve the utilization efficiency of the blue light.
The embodiment of the invention also provides a display device. The present embodiment is different from the above-described embodiments in that in the present embodiment, the second light emitting diode chip 22 is used to emit green light.
As shown in fig. 6, the second sub-pixel 27 includes a second led chip 22, a second light adjusting structure 23 and a first scattering film 27. The second led chip 22 is disposed on the substrate 11 for emitting light of a third color, the second light adjusting structure 23 is disposed on the substrate 11 and adjacent to the second led chip 22 for emitting the light of the third color received from the second led chip 22 uniformly from the surface far from the substrate 11, and the first scattering film 27 is disposed on the side of the second light adjusting structure 22 far from the substrate 11 for emitting the light of the third color received from the second light adjusting structure 23 uniformly from the surface far from the substrate 11. The second light emitting diode chip 22 is a green chip and the light of the third color is green light. I.e. the second sub-pixel 27 is arranged to emit green light. The second light-emitting diode chip 22 is intended to emit green light.
In the present embodiment, the first scattering film 27 is a transparent adhesive layer including scattering particles, similar to the second scattering film 34. Wherein the scattering particles can be TiO 2 Or SiO 2 。
The embodiment of the invention also provides a preparation method of the surface light source, which is used for preparing the surface light source. As shown in FIG. 7, the method comprises the following steps 701-703:
in step 701, a first led chip for emitting light of a first color is formed on a substrate.
In step 702, a first light adjusting structure is formed, the first light adjusting structure being located on the substrate and adjacent to the first led chip for emitting the light of the first color received from the first led chip uniformly from the surface away from the substrate.
In step 703, a first light conversion structure is formed, where the first light conversion structure is located on a side of the first light adjustment structure away from the substrate, and is used to convert the light of the first color received from the first light adjustment structure into light of a second color, and emit the light of the second color from a surface away from the substrate, where the color of the light of the first color is different from the color of the light of the second color.
In this embodiment, since the first led chip is located on the substrate for emitting the light of the first color, the first light adjusting structure is located on the substrate and adjacent to the first led chip for emitting the light of the first color received from the first led chip uniformly from the surface far from the substrate to form the surface light source, and the first light converting structure is located at a side of the first light adjusting structure far from the substrate for converting the light of the first color received from the first light adjusting structure into the light of the second color and emitting the light from the surface far from the substrate, the light of the second color can be obtained by using the first led chip for emitting the light of the first color and the first light converting structure for converting the light of the first color into the light of the second color when the yield of the led chip for emitting the light of the second color is low and the cost is high, and the light emitting diode chip emitting the light of the second color is not required to be used, so that the yield of the surface light source can be improved, the cost of the surface light source can be reduced, and the yield of the display device can be improved, and the cost can be reduced.
It should be noted that, the display device in this embodiment may be: any product or component with a display function, such as electronic paper, a mobile phone, a tablet computer, a television, a notebook computer, a digital photo frame, a navigator and the like.
The forming process adopted by the above process may include, for example: deposition, sputtering and other film forming processes and etching and other patterning processes.
It is noted that in the drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. Also, it will be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element or layer or intervening layers may also be present. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it can be directly under the other element or intervening layers or elements may also be present. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it can be the only layer between the two layers or elements, or more than one intermediate layer or element may also be present. Like reference numerals refer to like elements throughout.
In the present invention, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The term "plurality" means two or more unless expressly limited otherwise.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. The invention is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.
Claims (13)
1. A surface light source, comprising:
a substrate;
a first light emitting diode chip on the substrate for emitting light of a first color;
the first light adjusting structure is positioned on the substrate and adjacent to the first light emitting diode chip and used for uniformly emitting the light of the first color received from the first light emitting diode chip from the surface far away from the substrate;
the first light conversion structure is positioned on one side, far away from the substrate, of the first light ray adjustment structure and is used for converting the light of the first color received from the first light ray adjustment structure into light of a second color and emitting the light from the surface far away from the substrate, and the color of the light of the first color is different from that of the light of the second color;
the first retaining wall is positioned on one side, far away from the first light adjusting structure, of the first light emitting diode chip and used for reflecting the light of the first color from the first light emitting diode chip to the first light adjusting structure; the first retaining wall comprises an arc surface, and the spherical center of a sphere where the arc surface is located on one side, close to the first light-emitting diode chip, of the first retaining wall; the projection of the first LED chip on the substrate is positioned in the projection of the cambered surface on the substrate;
the second retaining wall is positioned on one side of the first retaining wall, which is far away from the substrate, and is used for shading light;
the height of the second retaining wall is less than or equal to that of the first light conversion structure;
the surface of the second retaining wall far away from the substrate is flush with the surface of the first light conversion structure far away from the substrate.
2. The area light source of claim 1, wherein the first led chip is a blue chip and the first color light is blue light; the light of the second color is green or red light.
3. The area light source of claim 1, wherein the first light adjusting structure has a height greater than a height of the first light emitting diode chip;
the height of the first light ray adjusting structure is more than or equal to 1.1 times of the height of the first light emitting diode chip;
a gap is formed between the first light ray adjusting structure and the first light emitting diode chip;
the first light adjusting structure comprises a plurality of dots, and the dots are positioned on one side of the first light adjusting structure close to the substrate.
4. A surface light source according to claim 1, wherein the first light converting structure comprises quantum dots, phosphors and/or perovskites.
5. The area light source of claim 1, wherein the height of the first retaining wall is greater than or equal to the height of the first light adjusting structure.
6. A display device, comprising:
a substrate;
at least one pixel on the substrate; wherein the pixel comprises a first sub-pixel, the first sub-pixel comprises a first LED chip, a first light adjusting structure and a first light converting structure, the first LED chip is located on the substrate, the first light adjusting structure is located on the substrate and adjacent to the first LED chip, for uniformly emitting light of a first color received from the first LED chip out of a surface remote from the substrate, the first light conversion structure is positioned on one side of the first light ray adjusting structure far away from the substrate, for converting light of a first color received from the first light adjusting structure into light of a second color, and is emitted from a surface remote from the substrate, the color of the first color light being different from the color of the second color light;
the first sub-pixel also comprises a first retaining wall; the first retaining wall is positioned on one side of the first light emitting diode chip far away from the first light adjusting structure and used for reflecting the light with the first color from the first light emitting diode chip to the first light adjusting structure; the first retaining wall comprises an arc surface, and the center of a sphere where the arc surface is located on one side, close to the first light-emitting diode chip, of the first retaining wall; the projection of the first LED chip on the substrate is positioned in the projection of the cambered surface on the substrate;
the first sub-pixel further comprises a second retaining wall, the second retaining wall is positioned on one side, away from the substrate, of the first retaining wall, and the second retaining wall is used for shading light;
the height of the second retaining wall is less than or equal to that of the first light conversion structure;
the surface of the second retaining wall far away from the substrate is flush with the surface of the first light conversion structure far away from the substrate.
7. The display device according to claim 6, wherein the first light emitting diode chip is a blue light chip, and the light of the first color is blue light; the light of the second color is red light.
8. The display device according to claim 7, wherein the pixel further comprises a second sub-pixel, the second sub-pixel comprises a second light emitting diode chip, a second light adjusting structure and a second light converting structure, the second light emitting diode chip is located on the substrate, the second light adjusting structure is located on the substrate and adjacent to the second LED chip, for uniformly emitting light of the first color received from the second light emitting diode chip from a surface remote from the substrate, the second light conversion structure is positioned on one side of the second light ray adjusting structure far away from the substrate, for converting light of the first color received from the second light-adjusting structure into light of a third color, and is emitted from a surface remote from the substrate, the color of the light of the first color being different from the color of the light of the third color;
the second light emitting diode chip is a blue light chip, and the light of the third color is green light.
9. The display device of claim 7, wherein the pixel further comprises a second sub-pixel comprising a second LED chip on the substrate for emitting light of a third color, a second light-modifying structure on the substrate and adjacent to the second LED chip for uniformly emitting light of the third color received from the second LED chip out of the surface remote from the substrate, and a first diffuser film on the side of the second light-modifying structure remote from the substrate for uniformly emitting light of the third color received from the second light-modifying structure out of the surface remote from the substrate;
the second light emitting diode chip is a green chip, and the light of the third color is green light.
10. The display device of claim 8 or 9, wherein the pixel further comprises a third sub-pixel comprising a third light emitting diode chip on the substrate for emitting light of the first color, a third light adjusting structure on the substrate and adjacent to the third light emitting diode chip for uniformly emitting the light of the first color received from the third light emitting diode chip out of the surface remote from the substrate, and a second scattering film on the side of the third light adjusting structure remote from the substrate for uniformly emitting the light of the first color received from the third light adjusting structure out of the surface remote from the substrate;
the third light emitting diode chip is a blue light chip.
11. The display device according to claim 10, wherein the second sub-pixel further comprises a third bank and a fourth bank; the third baffle wall is positioned on one side of the second light-emitting diode chip far away from the second light adjusting structure and used for reflecting light from the second light-emitting diode chip to the second light adjusting structure; the fourth retaining wall is positioned on one side of the third retaining wall, which is far away from the substrate, and is used for shading light;
the third sub-pixel further comprises a fifth retaining wall and a sixth retaining wall; the fifth retaining wall is located on one side of the third light emitting diode chip far away from the third light adjusting structure and used for reflecting the light of the first color from the third light emitting diode chip to the third light adjusting structure; the sixth retaining wall is located the fifth retaining wall is kept away from one side of the substrate, and the sixth retaining wall is used for shading.
12. The display device according to claim 6, further comprising an encapsulation layer on a side of the pixel remote from the substrate.
13. A method for manufacturing a surface light source, comprising:
forming a first light emitting diode chip on a substrate, the first light emitting diode chip for emitting light of a first color;
forming a first light adjusting structure on the substrate and adjacent to the first led chip for uniformly emitting the light of the first color received from the first led chip out of the surface away from the substrate;
forming a first light conversion structure, located on a side of the first light ray adjustment structure away from the substrate, for converting light of a first color received from the first light ray adjustment structure into light of a second color and emitting the light from a surface away from the substrate, wherein the color of the light of the first color is different from the color of the light of the second color;
forming a first retaining wall, wherein the first retaining wall is positioned on one side of the first light emitting diode chip far away from the first light adjusting structure and is used for reflecting the light with the first color from the first light emitting diode chip to the first light adjusting structure; the first retaining wall comprises an arc surface, and the center of a sphere where the arc surface is located on one side, close to the first light-emitting diode chip, of the first retaining wall; the projection of the first LED chip on the substrate is positioned in the projection of the cambered surface on the substrate;
forming a second retaining wall, wherein the second retaining wall is positioned on one side of the first retaining wall, which is far away from the substrate, and is used for shading light; the height of the second retaining wall is less than or equal to that of the first light conversion structure; the surface of the second retaining wall far away from the substrate is flush with the surface of the first light conversion structure far away from the substrate.
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