CN112025519B - Detect polishing integration smart machine - Google Patents
Detect polishing integration smart machine Download PDFInfo
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- CN112025519B CN112025519B CN202010914282.1A CN202010914282A CN112025519B CN 112025519 B CN112025519 B CN 112025519B CN 202010914282 A CN202010914282 A CN 202010914282A CN 112025519 B CN112025519 B CN 112025519B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
- B24B49/045—Specially adapted gauging instruments
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- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The invention provides a detection and polishing integrated intelligent device, which comprises a detection system and a CNC polishing machine, wherein the detection system consists of a PC-BASED machine vision system and is used for detecting a workpiece to be polished, the CNC polishing machine is used for being matched with the detection system to perform rough polishing, middle polishing and fine polishing on the workpiece, a detection table for fixing the workpiece is arranged in the CNC polishing machine, a measuring frame is arranged on the detection table, and a transfer manipulator structure is arranged in the CNC polishing machine The success rate of product output and production efficiency are improved.
Description
Technical Field
One or more embodiments of this description relate to the automatic polishing equipment field, especially relate to detect polishing integration smart machine.
Background
Modern processing is developed towards line production to improve production efficiency, and mass production tasks and various complex production processes inevitably damage the surface of a product in the production process. It is important to find these defective products in a timely manner and to solve such problems from the standpoint of flow line and industrial control. At present, the automation of mass production and production is improved continuously, one of the development trends of product quality control is zero waste requirement, and the product inspection is not offline spot inspection, but online inspection and investigation one by one, so that the detection technology of the surface defects of the polished workpieces is provided.
The surface defect detection technology of the polished workpiece is realized by matching a machine vision image recognition technology with detection equipment.
It has become a trend to use machine vision instead of human eyes to detect defects on the surface of a product. The application of the vision of the outdoor machine on the production line is quite mature, and the domestic start is relatively late, and the development of the related technology is gradually carried out by introducing the methods of the advanced machine and self-learning in the country nowadays. Machine vision is centered on a computer and consists of a vision sensor, an image acquisition and system and image processing software. In the last century, the application of machine vision in production has technical problems of large image data quantity, low imaging quality of a detected object, small storage space, complex image processing and the like. In this century, the visual theory has been developed rapidly, and with the continuous improvement of network transmission and storage technology in recent years, the factors limiting the wide application of machine vision have been solved, which paves the way for the application of machine vision in industrial detection and nondestructive detection.
In China, aiming at the defect problem in the aspect of workpiece appearance, a common method is to visually inspect the workpiece through manual sampling. Whether the workpiece has defects and defect types is judged by comparing the difference between the product and the genuine product through eyes of production personnel, and the efficiency and the precision are not ensured. The labor intensity of the mode is overlarge and depends on the proficiency level and the detection experience of detection workers to a great extent, the misjudgment generated in the detection process is inevitable, and the improvement of the production efficiency is limited. Therefore, the manual detection method cannot meet the requirement of modern industrial production. In addition, under some severe conditions, the manual detection method is adopted to generate adverse effects on the body and mind of personnel, and the machine vision detection method can adapt to various complex environments and excellently complete detection tasks.
The traditional nondestructive detection comprises ray detection, acoustic detection, electrical detection, magnetic detection, thermal detection, permeation and leakage detection and microwave and dielectric measurement detection. The detection methods are influenced by use occasions, detection accuracy and cost for workpiece detection application, have certain limitations in practical application, and are not widely applied. Aiming at the surface detection of a curved surface workpiece, the method adopts an image processing technology to find a proper edge detection and defect extraction algorithm. Compared with the traditional manual detection method, the visual detection method has obvious advantages in detection efficiency and cost investment. The defects of the curved surface workpiece are identified by combining the machine vision and the image processing method, so that the production efficiency can be improved, the image information acquisition can be easily realized, and the production digitization can be realized.
With the high-efficiency processing of automatic numerical control machine tools and the continuous emergence of various complex parts, the design and manufacture of precise measuring equipment for quickly and reliably detecting the parts are urgently needed, and the progress of optical, numerical control and computer technologies provides required technical support for the further research of the detecting instrument. The intelligent precision detection instrument can be specially designed, technologies such as visual identification and the like are applied to the precision detection instrument, detection of various complex parts is completed, information exchange can be carried out between the precision detection instrument and a numerical control machine tool, and the processing production process of the parts is controlled.
In summary, the present application now proposes an integrated smart device for detecting and polishing to solve the above-mentioned problems.
Disclosure of Invention
In view of the above, an object of one or more embodiments of the present disclosure is to provide an intelligent device for detecting and polishing integration, so as to solve the problems in the background art.
BASED on above-mentioned purpose, one or more embodiments of this specification provide detect polishing integration intelligent equipment, including detecting system and CNC burnishing machine, detecting system comprises PC-BASED machine vision system, and detecting system is used for treating the detection of polishing the work piece, the CNC burnishing machine is used for with detecting system cooperation, carries out rough polishing, well throwing and fine polishing to the work piece, CNC burnishing machine is inside to be provided with the test table that is used for fixed work piece, and is provided with the measuring rack on the test table, and the inside transfer manipulator structure that is provided with of CNC burnishing machine.
Preferably, the detecting system comprises a measuring head, a camera, a lighting lamp, a displacement sensor, vision processing software, a control unit and a PC platform, wherein the measuring head is movably connected on a measuring frame, the camera is matched with the lighting lamp through a lens to shoot the surface of a workpiece sent into the CNC polishing machine, the angle of the lens of the camera can be adjusted, an image acquisition card inside the camera is used for acquiring images with the defects of the surface of the workpiece and preprocessing the acquired images, the image preprocessing comprises graying, filtering, enhancing, Hough detecting and mask operation on the images, the integrity and the definition of image information are improved to the maximum extent, the camera and the lighting lamp are arranged on the measuring head and can move on the measuring frame through the measuring head, the displacement sensor is used for measuring the displacement of the camera, the vision processing software is used for visually processing the images acquired by the image acquisition card inside the camera, and a marking device is arranged in the visual processing software and used for marking the workpiece with the defect exceeding the polishing removal range, the control unit is used for controlling the operation of the camera, the lighting lamp, the displacement sensor and the visual processing software, and the PC platform controls the operation of the camera, the lighting lamp, the displacement sensor and the visual processing software through manual operation.
More preferably, the number of the cameras is two, and the cameras are all CCD cameras.
More preferably, the measuring frame adopts a moving bridge type to realize the rotation and the movement of the measuring head under a Cartesian coordinate system.
More preferably, the displacement sensor is a capacitive grating sensor, and the capacitive grating sensor consists of a movable grating and a fixed grating;
the movable grid plate is a two-layer PCB circuit board, the front of the movable grid plate is provided with a capacitance grid special integrated circuit, a liquid crystal display component and a corresponding peripheral resistance-capacitance application circuit, the back of the movable grid plate is divided into two large parts, namely an emitter and a receiver, the emitter consists of 48 small emitters and is divided into 6 groups, each group is provided with 8 small emitters, the width of each small emitter is l0, each group of 8 small emitters forms an emission cycle, the occupied width of the emission cycle is 1 pitch s, therefore, the width of each small emitter is one eighth of the pitch, namely s is 8l0, the receiver on the movable grid plate is a long metal strip, the receiver is positioned below the emitters, the length of the receiver is 5 pitches, the receiver corresponds to 5 groups of emitters in the middle of the upper part, and the left and right parts of the receivers are respectively provided with 4 emitters for eliminating the edge effect;
the structure of the fixed grid plate is that rectangular grids which have half pitch width and half pitch interval and are insulated with other parts are corroded on an epoxy copper-clad plate, an insulating protective layer is pasted on the surface of the grid plate, scales are arranged on the grid plate, and the grid plate is installed on a caliper handle;
the signals of the capacitive gate sensor are transmitted to a chip, are subjected to forward amplification filtering of the chip, are sampled through AD conversion and are converted into digital signals, then the digital signals are interpolated through digital interpolation to improve the resolution ratio, the obtained digital signals are input into the phase discrimination part, gate lines of the phase discrimination are calculated, and finally a displacement value result is obtained;
the digital interpolation internal algorithm moves the noise outside the frequency band based on the characteristic of the triangular integral modulation function, filters the noise outside the frequency band by a digital filter, and then interpolates the digital signal by using digital interpolation to improve the resolution by 10 times, so that the resolution is greatly improved;
the AD conversion adopts a thermal disturbance calibration technology, and each bit weight value is updated by using LMS iterative operation approximation, so that the complex operation of matrix solution and inversion and possible solution-free conditions are avoided, and the ADC can reach a higher effective digit after the calibration is finished.
More preferably, the light source of the lighting lamp is an ultraviolet light source, ultraviolet reflection imaging is realized, ultraviolet light with shorter wavelength has stronger scattering performance than visible light and near infrared light, under the condition that the visible light and the near infrared light are difficult to image, a clearer image can be obtained by utilizing the ultraviolet light, and scratches and nano particles on the silicon wafer can be found better than visible light imaging;
the arrangement type of the ultraviolet light source is a shadowless annular light source, so that reflection and highlight can be avoided to the maximum extent.
The detection polishing method comprises the following steps:
S1the transfer manipulator conveys the workpiece to be polished to a detection frame, and a detection system is utilized to perform first defect detection on the workpiece;
S21if the defects of the workpieces are large, the workpieces are moved out of the CNC polishing machine by the transferring manipulator structure and are scrapped;
S22if the defects of the workpieces meet the requirements, the workpieces are conveyed into a CNC polishing machine by the transferring mechanical arm structure to be roughly polished;
S3performing secondary defect detection on the workpiece after rough polishing by using a detection system;
S4and after the detection is finished, the transferring mechanical arm structure sends the workpiece into the CNC polishing machine, and if the workpiece defect does not meet the requirement, the step S is returned22If the workpiece defect meets the requirement, the step S is proceeded to5；
S5The roughly polished workpiece is sent into a CNC polishing machine for middle polishing by a transferring manipulator structure;
S6the transfer manipulator structure sends the polished workpiece back to the detection frame, and the detection system is used for carrying out third defect detection on the polished workpiece;
S71if the workpiece defect does not meet the requirement, returning to the step S5;
S72and if the defects of the workpieces meet the requirements, the transfer manipulator sends the polished workpieces into the CNC polishing machine for finish polishing.
More preferably, the method comprises the following steps:
S1manually operating a control unit through a PC platform to control equipment to operate, moving a measuring head on a measuring frame, driving a camera and a lighting lamp to move to proper positions by the measuring head, acquiring images of a workpiece on the measuring frame, adjusting the angle of an inner lens of the camera and the angle of the lighting lamp, and detecting the displacement of the camera by a displacement sensor;
S2step S1The image information collected in the image collecting card is transmitted to the image collecting card for pretreatment；
S3The image acquisition card and the displacement sensor transmit information to the inside of the vision processing software, and the vision processing software compares the defects and feeds the defects back to the transferring mechanical arm structure to control the transferring mechanical arm structure to operate.
More preferably, the image preprocessing in step S2 includes the following steps:
S1graying the image;
S2filtering the image;
S3enhancing the image;
S4carrying out Hough detection on the image;
S5and performing a masking operation on the image.
More preferably, the displacement sensor is a capacitive gate sensor, signals of the capacitive gate sensor are transmitted to a chip, and are subjected to pre-amplification filtering of the chip, so that the signals are directly subjected to AD conversion sampling and converted into digital signals, then the digital signals are subjected to interpolation through digital interpolation to improve the resolution, the obtained digital signals are input to a gate line for phase discrimination, and finally a displacement result is obtained.
From the above, it can be seen that the beneficial effects of the present invention are: according to the invention, the CCD camera is used for carrying out image acquisition on the surface of the workpiece, the double CCD cameras are used for acquiring the image, so that errors and missed detection caused by a single camera can be effectively avoided, the position, the area and the depth of a defect are obtained through calculation of an image processing technology, the workpiece with the defect depth exceeding the polishing removal depth is subjected to abandonment treatment, the workpiece with the defect depth within an allowable range enters a polishing link, the whole process comprises three polishing links of rough polishing, middle polishing and fine polishing, and surface defect detection is carried out before each polishing and defective goods are removed, so that the energy can be greatly saved, and the product output success rate and the production efficiency can be improved.
Drawings
In order to more clearly illustrate one or more embodiments or prior art solutions of the present specification, reference will now be made briefly to the attached drawings, which are used in the description of the embodiments or prior art, and it should be apparent that the drawings in the description below are merely one or more embodiments of the present specification and that other drawings may be derived from those drawings by one of ordinary skill in the art without inventive faculty.
FIG. 1 is a block flow diagram of the present invention;
FIG. 2 is a schematic view of the CNC polishing machine of the present invention;
FIG. 3 is a block flow diagram of a detection system of the present invention;
FIG. 4 is a schematic diagram of the detection process of the present invention;
FIG. 5 is a schematic view of the structure of the measuring stand according to the present invention;
FIGS. 6-10 are schematic structural views of a capacitive-gate sensor according to the present invention;
FIG. 11 is a block diagram of signal processing for a capacitive sensor according to the present invention;
FIG. 12 is a schematic diagram of the trigonometric integral modulation function of the digital interpolation algorithm of the present invention;
FIGS. 13 and 14 are linear model diagrams of the digital interpolation internal algorithm of the present invention;
FIG. 15 is a diagram showing a distribution of light sources of the floodlight of the present invention;
FIG. 16 is a block diagram of the image pre-processing flow of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present disclosure more apparent, the present disclosure is further described in detail below with reference to specific embodiments.
It is to be noted that unless otherwise defined, technical or scientific terms used in one or more embodiments of the present description shall have the ordinary meaning as understood by those of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in one or more embodiments of the specification is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item preceding the word covers the element or item listed after the word and its equivalent, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
Examples
Referring to fig. 1-16, the intelligent device for integrated detection and polishing includes a detection system and a CNC polishing machine, the detection system is composed of a PC-BASED machine vision system, and the detection system is used for detecting a workpiece to be polished, the CNC polishing machine is used for cooperating with the detection system to perform rough polishing, middle polishing and fine polishing on the workpiece, a detection table for fixing the workpiece is arranged inside the CNC polishing machine, a measurement frame is arranged on the detection table, and a transfer manipulator structure (as shown in fig. 1-3) is arranged inside the CNC polishing machine.
As an improvement of the above scheme, the detection system comprises a measuring head, a camera, a lighting lamp, a displacement sensor, vision processing software, a control unit and a PC platform, wherein the measuring head is movably connected to a measuring frame, the camera is matched with the lighting lamp through a lens to shoot the surface of a workpiece sent into the CNC polishing machine, the angle of the lens of the camera can be adjusted, an image acquisition card inside the camera is used for acquiring images of surface defects of the workpiece and preprocessing the acquired images, the image preprocessing comprises graying, filtering, enhancing, Hough detecting and mask operation on the images, the integrity and the definition of image information are improved to the maximum extent (as shown in figure 16), the camera and the lighting lamp are arranged on the measuring head and can move on the measuring frame through the measuring head, and the displacement sensor is used for measuring the displacement of the camera, the vision processing software is used for performing vision processing on images acquired by an image acquisition card in the camera, a marking device is arranged in the vision processing software and used for marking workpieces with defects exceeding the polishing removal amount range, the control unit is used for controlling the camera, the lighting lamp, the displacement sensor and the vision processing software to operate, and the PC platform is manually operated to enable the control unit to control the camera, the lighting lamp, the displacement sensor and the vision processing software to operate (as shown in figure 4).
As an improvement of the scheme, the number of the cameras is two, and the cameras are both CCD cameras.
As a modification of the above solution, the measuring frame uses a moving bridge to implement the rotation and movement of the measuring head in the cartesian coordinate system (as shown in fig. 5).
As an improvement of the above scheme, the displacement sensor is a capacitive grating sensor, and the capacitive grating sensor is composed of a movable grating and a fixed grating;
the movable grid plate is a two-layer PCB circuit board, the front of the movable grid plate is provided with a capacitance grid special integrated circuit, a liquid crystal display component and a corresponding peripheral resistance-capacitance application circuit, the back of the movable grid plate is divided into two large parts, namely an emitter and a receiver, the emitter consists of 48 small emitters and is divided into 6 groups, each group is provided with 8 small emitters, the width of each small emitter is l0, each group of 8 small emitters forms an emission cycle, the occupied width of the emission cycle is 1 pitch s, therefore, the width of each small emitter is one eighth of the pitch, namely s is 8l0, the receiver on the movable grid plate is a long metal strip, the receiver is positioned below the emitters, the length of the receiver is 5 pitches, the receiver corresponds to 5 groups of emitters in the middle of the upper part, and the left and right parts of the receivers are respectively provided with 4 emitters for eliminating the edge effect;
the structure of the fixed grid plate is that rectangular grids which have half pitch width and half pitch interval and are insulated with other parts are corroded on an epoxy copper-clad plate, an insulating protective layer is pasted on the surface of the grid plate, scales are arranged on the grid plate, and the grid plate is installed on a caliper handle;
the signals of the capacitive gate sensor are transmitted to a chip, are subjected to forward amplification filtering of the chip, are subjected to AD conversion sampling, are converted into digital signals, and then are subjected to digital interpolation to improve the resolution, the obtained digital signals are input into the phase discrimination part, and gate lines of the phase discrimination part are calculated, so that a displacement value result is finally obtained (shown in fig. 6-11);
each variable capacitorIs a function C of the displacement xi(x)。Ci(x) Can be determined by the geometrical relationship of the moving grid when the moving grid is displaced x relative to the fixed grid. Ci(x) And x is a phase shift relation in a spatial domain, and the capacitance values of two adjacent variable capacitors are spatially different by a phase of W/8 by taking the pitch W as a period, and can be expressed as:
as can be seen from the above formula, the capacitance of the parallel metal plate variable capacitor formed by the moving grid and the fixed grid is a trapezoidal graph in space, where R is the slope of the oblique side of the trapezoid, and w isi(i is 1,2,3,4) is the x coordinate position of each moving grid edge.
According to the equivalent circuit, the output function of the capacitive grating sensor can be deduced, and in practical operation, the spatial position of the capacitive grating sensor is changed, so that the output function u of the capacitive grating sensor is changedo(x, t) is not a function of time, but is also a function of position x. From the impedance analysis it is possible to obtain:
the capacitive grating sensor distance measurement is based on the phase discrimination principle, and the detected phase is only directed at the phase of the fundamental wave, so that only the fundamental wave of the signal can be considered when the capacitive grating principle is analyzed. The excitation signal ui (t) is a modulated pulse signal, which is Fourier-transformed into
From the equation (1), it can be seen that the capacitance function Ci(x) Is an even function, so its Fourier transform
Only looking at the fundamental wave and neglecting the constant coefficient before the fundamental wave, the following is obtained:
ui(t)＝a1cos(ωut-iπ/4)+b1sin(ωut-iπ/4) i＝0,1,2L 7
ci(t)＝cos(ωcx-iπ/4) i＝0,1,2L 7
the output function of the sensor can be written as
After finishing to obtain
In the above formula, it can be clearly seen that the phase of the output signal of the capacitive grating sensor and the spatial position thereof are in a linear relationship, so that the phase difference can be found out by a phase discrimination method, thereby obtaining the displacement difference in space and achieving the purpose of distance measurement;
the digital interpolation internal algorithm moves the noise outside the frequency band based on the characteristics of the trigonometric integral modulation function, filters the noise outside the frequency band by a digital filter, and then interpolates the digital signal by using the digital interpolation to improve the resolution by 10 times, so that the resolution is greatly improved (as shown in fig. 12 and 13);
the AD conversion adopts a thermal disturbance calibration technology, and each bit weight value is updated by using LMS iterative operation approximation, so that the complex operation of matrix solution and inversion and possible solution-free conditions are avoided, and the ADC can reach a high effective digit after the calibration is finished (as shown in FIG. 14).
As an improvement of the above scheme, the light source of the illuminating lamp is an ultraviolet light source, so that ultraviolet reflection imaging is realized, ultraviolet light with shorter wavelength has stronger scattering performance than visible light and near infrared light, under the condition that the visible light and the near infrared light are difficult to image, a clearer image can be obtained by using the ultraviolet light, and scratches and nano particles on a silicon wafer can be found better than visible light imaging;
the ultraviolet light source is arranged in a shadowless ring light source, so as to avoid reflection and high light to the maximum extent (as shown in fig. 15).
The detection polishing method comprises the following steps:
S1the transfer manipulator conveys the workpiece to be polished to a detection frame, and a detection system is utilized to perform first defect detection on the workpiece;
S21if the defects of the workpieces are large, the workpieces are moved out of the CNC polishing machine by the transferring manipulator structure and are scrapped;
S22if the defects of the workpieces meet the requirements, the workpieces are conveyed into a CNC polishing machine by the transferring mechanical arm structure to be roughly polished;
S3performing secondary defect detection on the workpiece after rough polishing by using a detection system;
S4and after the detection is finished, the transferring mechanical arm structure sends the workpiece into the CNC polishing machine, and if the workpiece defect does not meet the requirement, the step S is returned22If the workpiece defect meets the requirement, the step S is proceeded to5；
S5The roughly polished workpiece is sent into a CNC polishing machine for middle polishing by a transferring manipulator structure;
S6the transfer manipulator structure sends the polished workpiece back to the detection frame, and the detection system is used for carrying out third defect detection on the polished workpiece;
S71if the workpiece defect does not meet the requirement, returning to the step S5;
S72and if the defects of the workpieces meet the requirements, the transfer manipulator sends the polished workpieces into the CNC polishing machine for finish polishing.
As a modified scheme of the scheme, the method comprises the following steps:
S1the operation of the equipment is controlled manually through a PC platform operation control unit, the measuring head is moved on the measuring frame, the measuring head drives the camera and the lighting lamp to move to a proper position, and workpieces on the measuring frame are subjected toAcquiring an image, adjusting the angle of a lens in the camera and the angle of a lighting lamp, and detecting the displacement of the camera by a displacement sensor;
S2step S1The image information collected in the step (1) is transmitted to an image collecting card for pretreatment;
S3the image acquisition card and the displacement sensor transmit information to the inside of the vision processing software, and the vision processing software compares the defects and feeds the defects back to the transferring mechanical arm structure to control the transferring mechanical arm structure to operate.
As a modification of the above, the image preprocessing in step S2 includes the following steps:
S1graying the image;
S2filtering the image;
S3enhancing the image;
S4carrying out Hough detection on the image;
S5and performing a masking operation on the image.
As an improvement scheme of the scheme, the displacement sensor is a capacitive gate sensor, signals of the capacitive gate sensor are transmitted to a chip, and are directly subjected to AD conversion sampling and converted into digital signals through pre-amplification filtering of the chip, then the digital signals are subjected to interpolation through digital interpolation to improve the resolution, the obtained digital signals are input to a gate line for phase discrimination, and finally a displacement result is obtained.
It is intended that the one or more embodiments of the present specification embrace all such alternatives, modifications and variations as fall within the broad scope of the appended claims. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of one or more embodiments of the present disclosure are intended to be included within the scope of the present disclosure.
Claims (8)
1. Detect polishing integration smart machine which characterized in that includes:
detection system and CNC burnishing machine, detection system comprises PC-BASED machine vision system, and detection system is used for treating the detection of polishing the work piece, detection system includes:
the measuring head is movably connected to the measuring frame;
the camera and the lighting lamp are arranged on the measuring head and move on the measuring frame through the measuring head; the camera is used for sending into through camera lens and the cooperation of lamp of polishing workpiece surface in the CNC burnishing machine shoots, and the camera lens of camera can angle regulation, and the inside image acquisition card of camera is used for the image acquisition to workpiece surface defect to carry out the preliminary treatment to the image of gathering, image preliminary treatment includes: graying, filtering, enhancing, Hough detecting and masking operation of the image;
a displacement sensor for measuring a displacement amount of the camera;
the visual processing software is used for carrying out visual processing on the image acquired by the image acquisition card in the camera to obtain the position, the area and the depth of the defect, and a marking device is arranged in the visual processing software and is used for marking the workpiece with the defect depth exceeding the range of the polishing removal amount;
the control unit is used for controlling the operation of the camera, the lighting lamp, the displacement sensor and the vision processing software;
the PC platform enables the control unit to control the operation of the camera, the lighting lamp, the displacement sensor and the vision processing software through manual operation; and
the CNC polishing machine is used for being matched with a detection system to perform rough polishing, middle polishing and fine polishing on workpieces, a detection table for fixing the workpieces is arranged inside the CNC polishing machine, a measurement frame is arranged on the detection table, and a transfer manipulator structure is arranged inside the CNC polishing machine.
2. The intelligent detection and polishing integrated device according to claim 1, wherein two cameras are provided, and both cameras are CCD cameras.
3. The intelligent detection and polishing integrated device according to claim 1, wherein the measuring frame adopts a mobile bridge type to realize rotation and movement of the measuring head in a Cartesian coordinate system.
4. The integrated intelligent detecting and polishing device as claimed in claim 1, wherein the displacement sensor is a capacitive grating sensor.
5. The intelligent detection and polishing integrated equipment according to claim 1, wherein the light source of the lighting lamp is an ultraviolet light source, and the arrangement type of the ultraviolet light source is a shadowless annular light source.
6. The detection and polishing method of the intelligent integrated detection and polishing device as claimed in any one of claims 1 to 5, comprising the steps of:
s1, conveying the workpiece to be polished to a detection frame by the transfer manipulator structure, and performing primary defect detection on the workpiece by using the detection system;
s21, if the defect depth of the workpiece exceeds the polishing removal depth, the workpiece is moved out of the CNC polishing machine by the transferring manipulator structure and scrapped;
s22, if the defect of the workpiece meets the requirement, the workpiece is conveyed to a CNC polishing machine by the transfer manipulator structure to be roughly polished;
s3, performing secondary defect detection on the workpiece after rough polishing by using the detection system;
s4, after the detection is finished, the transferring manipulator structure sends the workpiece into the CNC polishing machine, if the defect of the workpiece does not meet the requirement, the step S22 is returned, and if the defect of the workpiece meets the requirement, the step S5 is carried out;
s5, conveying the workpiece subjected to rough polishing to a CNC polishing machine by using a manipulator structure for middle polishing;
s6, the transfer manipulator structure sends the polished workpiece back to the detection frame, and the detection system is used for carrying out third defect detection on the polished workpiece;
s71, if the workpiece defect does not meet the requirement, returning to the step S5;
and S72, if the defects of the workpieces meet the requirements, the transfer manipulator structure sends the polished workpieces into a CNC polishing machine for finish polishing.
7. The method of claim 6, wherein said defect detection comprises the steps of:
s701, manually operating a control unit through a PC platform to control equipment to operate, moving a measuring head on a measuring frame, driving a camera and a lighting lamp to move to proper positions by the measuring head, collecting images of a workpiece on the measuring frame, adjusting the angle of an inner lens of the camera and the angle of the lighting lamp, and detecting the displacement of the camera by a displacement sensor;
s702, the image information collected in the step S701 is transmitted to an image collection card for preprocessing;
and S703, the image acquisition card and the displacement sensor transmit information to the inside of the visual processing software, and the visual processing software compares the defects and feeds the defects back to the transferring manipulator structure to control the transferring manipulator structure to operate.
8. The method as claimed in claim 7, wherein the displacement sensor is a capacitive grating sensor, the signal of the capacitive grating sensor is transmitted to a chip, and after pre-amplification filtering of the chip, it is directly sampled by AD conversion and converted into digital signal, and then digital interpolation is performed to interpolate the digital signal to increase resolution, and the obtained digital signal is input to a gate line for phase discrimination to calculate the displacement, and finally the displacement result is obtained.
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