CN112025469A - 一种用于角抛光硅片样品的装置、设备及方法 - Google Patents
一种用于角抛光硅片样品的装置、设备及方法 Download PDFInfo
- Publication number
- CN112025469A CN112025469A CN202010944806.1A CN202010944806A CN112025469A CN 112025469 A CN112025469 A CN 112025469A CN 202010944806 A CN202010944806 A CN 202010944806A CN 112025469 A CN112025469 A CN 112025469A
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- CN
- China
- Prior art keywords
- polishing
- silicon wafer
- polishing plate
- jig
- wafer sample
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/32—Polishing; Etching
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Ceramic Engineering (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010944806.1A CN112025469B (zh) | 2020-09-10 | 2020-09-10 | 一种用于角抛光硅片样品的装置、设备及方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010944806.1A CN112025469B (zh) | 2020-09-10 | 2020-09-10 | 一种用于角抛光硅片样品的装置、设备及方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112025469A true CN112025469A (zh) | 2020-12-04 |
CN112025469B CN112025469B (zh) | 2022-06-10 |
Family
ID=73585340
Family Applications (1)
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CN202010944806.1A Active CN112025469B (zh) | 2020-09-10 | 2020-09-10 | 一种用于角抛光硅片样品的装置、设备及方法 |
Country Status (1)
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CN (1) | CN112025469B (zh) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5733954A (en) * | 1980-07-29 | 1982-02-24 | Murata Mfg Co Ltd | Grinding method of end surface of ceramic unit |
CN102042798A (zh) * | 2009-10-19 | 2011-05-04 | 中芯国际集成电路制造(上海)有限公司 | 一种扩展电阻测试样品制备方法及样品研磨固定装置 |
KR20140086476A (ko) * | 2012-12-28 | 2014-07-08 | 강원대학교산학협력단 | 시편제조장치의 회전보조기구 |
CN107614200A (zh) * | 2015-05-13 | 2018-01-19 | 3M创新有限公司 | 抛光垫和使用抛光垫的系统和方法 |
CN207077303U (zh) * | 2017-07-25 | 2018-03-09 | 蒋南 | 一种自动锯片抛光机 |
CN108544305A (zh) * | 2018-04-24 | 2018-09-18 | 广东工业大学 | 一种集群磁流变辅助v型槽高效高精度抛光陶瓷球的装置 |
CN110634776A (zh) * | 2019-09-18 | 2019-12-31 | 西安奕斯伟硅片技术有限公司 | 一种硅片样品的制备装置及制备方法 |
JP2020011363A (ja) * | 2018-07-20 | 2020-01-23 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
-
2020
- 2020-09-10 CN CN202010944806.1A patent/CN112025469B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5733954A (en) * | 1980-07-29 | 1982-02-24 | Murata Mfg Co Ltd | Grinding method of end surface of ceramic unit |
CN102042798A (zh) * | 2009-10-19 | 2011-05-04 | 中芯国际集成电路制造(上海)有限公司 | 一种扩展电阻测试样品制备方法及样品研磨固定装置 |
KR20140086476A (ko) * | 2012-12-28 | 2014-07-08 | 강원대학교산학협력단 | 시편제조장치의 회전보조기구 |
CN107614200A (zh) * | 2015-05-13 | 2018-01-19 | 3M创新有限公司 | 抛光垫和使用抛光垫的系统和方法 |
CN207077303U (zh) * | 2017-07-25 | 2018-03-09 | 蒋南 | 一种自动锯片抛光机 |
CN108544305A (zh) * | 2018-04-24 | 2018-09-18 | 广东工业大学 | 一种集群磁流变辅助v型槽高效高精度抛光陶瓷球的装置 |
JP2020011363A (ja) * | 2018-07-20 | 2020-01-23 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
CN110634776A (zh) * | 2019-09-18 | 2019-12-31 | 西安奕斯伟硅片技术有限公司 | 一种硅片样品的制备装置及制备方法 |
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Publication number | Publication date |
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CN112025469B (zh) | 2022-06-10 |
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PB01 | Publication | ||
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Effective date of registration: 20211027 Address after: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder |
Address after: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi 710065 Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |