CN111999686A - Device and method for improving buckle plate communication stability - Google Patents
Device and method for improving buckle plate communication stability Download PDFInfo
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- CN111999686A CN111999686A CN202010726238.8A CN202010726238A CN111999686A CN 111999686 A CN111999686 A CN 111999686A CN 202010726238 A CN202010726238 A CN 202010726238A CN 111999686 A CN111999686 A CN 111999686A
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Abstract
The invention provides a device and a method for improving the communication stability of a buckle plate, wherein the device comprises a BMC, a light emitting module, a light receiving module, a first board card and a second board card; the first board card is provided with a high-density connector female part, the second board card is provided with a high-density connector male part, and the high-density connector female part and the high-density connector male part are matched to form buckling connection; one of the light emitting module and the light receiving module is arranged on the first board card, the other one of the light emitting module and the light receiving module is arranged on the second board card, and the light emitting module and the light receiving module are oppositely arranged to generate a light emitting and receiving group; the four corners of the first board card and the second board card are provided with light emitting and receiving groups, and the number of the light emitting and receiving groups is at least four; the BMC is connected with a switch module, and the switch module is connected with the light emitting module; the light receiving module is connected with a light amplification module, and the light amplification module is connected with the BMC; and the BMC judges whether the connection of the high-density connector has a fault or not and judges the fault type according to the voltage value fed back by each light emitting module.
Description
Technical Field
The invention belongs to the technical field of board card testing, and particularly relates to a device and a method for improving buckle plate communication stability.
Background
BMC, short for base Management Controller, substrate Management Controller.
PCBA, short for Printed Circuit Board Assembly, Circuit Board of the upper part.
With the rapid development of new technologies, such as VR (virtual reality) image processing, 5G communication, and the like, functional modules and power supply modules on a PCBA board are also more and more complex, and the size of the board is larger and larger, but the design concept conflicts with the current miniaturization concept, and more manufacturers select two PCBA boards to solve the above problems in a form of a snap-in card.
Communication signals between the two board cards are interconnected through a high-density board connector, such as network signals, PCIE, STAT, SAS signals and the like, power supply signals can be transmitted through the board connector, the board cards are fixedly selected to realize the metal frames on the two sides, and a module is assembled. Problems currently encountered: 1. after the two board cards are assembled, some PINs in the high-density connector are not contacted, and the high-density connector is normal after being plugged again; 2. after the initial assembly, the function test is normal, but some PINs cannot be communicated when reaching a customer site, the problem of PCIE bandwidth reduction occurs, after the examination, one side of the screw is not screwed down, and one foot of the upper layer board is tilted; 3. the power supply PIN between the board is not complete contact, and area of contact diminishes, and the electric current increases, increases the risk of burning the board.
The high-density connectors between boards are all used for carrying out function test on signals between the boards and the boards in production, such as PCIE signals, the bandwidth and the speed can be detected, if the test is passed, the assembly is considered to be normal, and actual detection is not carried out on actual assembly effect. After the board card is assembled for the first time, the normal condition is as shown in fig. 3, but the functional test is normal, and due to the connector, the structural tolerance or the incomplete assembling process, the following 3 conditions occur, and there is a serious quality risk in long-term use:
1. as shown in fig. 4, the connection between the two boards is not completely in place, and there may be a situation where the upper board is not parallel to the lower board, and one side of the upper board tilts;
2. as shown in fig. 5, the upper board card is parallel to the lower board card, but the upper board card is not completely aligned with the lower board card, and there is an offset;
3. as shown in fig. 6, the connectors of the upper board and the lower board are not inserted to the bottom, and the contact area is small.
The module of the high-density connector in the form of the buckle card is normal in factory function detection, but the problems of bandwidth reduction, speed reduction and the like occur at the site of a customer probabilistically, and the fundamental reason is that when two board cards are assembled, slight deviation occurs during matching due to the tolerance of the connector structure, but the function test is not covered.
This is a disadvantage of the prior art, and therefore, it is desirable to provide an apparatus and method for improving the communication stability of the buckle.
Disclosure of Invention
Aiming at the defects that in the prior art, due to the tolerance of a connecting structure, the matching is slight deviation, the function test is not covered, but the bandwidth and the speed are reduced probabilistically on the spot of a client, the invention provides a device and a method for improving the communication stability of a buckle plate, so as to solve the technical problems.
In a first aspect, the invention provides a device for improving the communication stability of a buckle plate, which comprises a BMC, a light emitting module, a light receiving module, a first board card and a second board card;
the first board card is provided with a high-density connector female part, the second board card is provided with a high-density connector male part, and the high-density connector female part and the high-density connector male part are matched to form buckling connection;
one of the light emitting module and the light receiving module is arranged on the first board card, the other one of the light emitting module and the light receiving module is arranged on the second board card, and the light emitting module and the light receiving module are oppositely arranged to generate a light emitting and receiving group; the four corners of the first board card and the second board card are provided with light emitting and receiving groups, and the number of the light emitting and receiving groups is at least four;
the BMC is connected with a switch module, and the switch module is connected with the light emitting module;
the light receiving module is connected with a light amplification module, and the light amplification module is connected with the BMC;
the BMC controls each light emitting module to emit light through the switch module, the corresponding light receiving module senses the light of the light emitting module to generate an induced current, and the light amplifying module amplifies the induced current, converts the amplified current into voltage and feeds the voltage back to the BMC;
the BMC judges whether the connection of the high-density connector between the first board card and the second board card has a fault and the fault type according to the voltage value fed back by each light emitting module through the light amplification module.
Further, the switch module comprises a first resistor R1, a second resistor R2, a third resistor R3, a switch tube Q1, a transient suppression diode D1 and an inductor L1;
the light emitting module adopts a laser diode D2;
the GPIO pin of the BMC is connected with a first resistor R1, the other end of the first resistor R1 is connected with a second resistor R2 and the base electrode of a switch tube Q1, and the other end of the second resistor R2 is grounded;
an emitter of the switching tube Q1 is connected with a third resistor R3, and the other end of the third resistor R3 is grounded;
the collector of the switching tube Q1 is connected to the anode of the transient suppression diode D1 and the cathode of the laser diode D2, the cathode of the transient suppression diode D1 is connected to the anode of the laser diode D2 and the inductor L1, and the other end of the inductor L1 is connected to the 5V power supply P5V _ AUX. In order to reduce power consumption, the BMC controls the switch module to perform detection once after the BMC is electrified for the first time, and then the BMC is closed, and controls the switch module to be opened again when the test is needed.
Further, the optical amplification module comprises an OP-amp 1;
the light receiving module adopts a photosensitive diode PD 1;
the positive power supply end of the operational amplifier OP1 is connected with a 5V power supply P5V _ AUX, and the negative power supply end of the operational amplifier OP1 is grounded;
the same-direction input end of the operational amplifier OP1 is grounded, the reverse input end of the operational amplifier OP1 is connected with a fourth resistor R4 and a sixth resistor R6, the reverse input end of the operational amplifier OP1 is also connected with the cathode of a photodiode PD1, and the anode of the photodiode PD1 is grounded;
the other end of the fourth resistor R4 is connected with the other end of the sixth resistor R6 and is connected with a fifth resistor R5, the other end of the fifth resistor R5 is connected with the output end of the operational amplifier OP1 and is connected with a seventh resistor R7, the other end of the seventh resistor R7 is connected with an eighth resistor R8, the other end of the seventh resistor R7 is connected with the BMC, and the other end of the eighth resistor R8 is grounded. The fourth resistor R4 and the sixth resistor R6 are matched with different resistance values to realize adjustment of amplification ratio, and the seventh resistor R7 and the eighth resistor R8 divide voltage to ensure that sampling voltage meets requirements.
Further, the ADC pin of the BMC is connected to a seventh resistor R7 and an eighth resistor R8. And the ADC pins of the BMC meet the sampling requirement when the number of the test points is small.
Further, the BMC is connected with the seventh resistor R7 and the eighth resistor R8 through the ADC chip, and the BMC is connected with the ADC chip through the I2C pin. When the number of sampling points is large, the sampling requirement is met by adding an ADC chip.
Further, the BMC is further connected with a fault alarm lamp, and the fault alarm lamp is used for indicating whether the connection of the high-density devices of the first board card and the second board card has a fault and corresponding fault types. Different fault alarm lamp flashing frequencies can indicate different types of faults.
Further, the number of the laser diodes D2 is four, and the laser diodes D2 are respectively arranged at four corners of the second board card;
the number of the photosensitive diodes PD1 is four, the photosensitive diodes PD1 are respectively arranged at four corners of the first board card, and the positions of the photosensitive diodes PD1 and the positions of the laser diodes D2 are in one-to-one correspondence, so that light emission and reception are realized;
the number of the switch modules is four, and the switch modules are respectively connected with one laser diode D2;
the number of the light amplification modules is four, and the light amplification modules are respectively connected with one photosensitive diode PD 1;
the BMC obtains four feedback voltage values through the four light amplification modules;
when the difference values of the four feedback voltage values and the standard value are larger than a first threshold value and the difference values are the same, determining that the high-density connector female piece and the high-density connector male piece are not in place in a contact manner;
when the four test values are smaller than the standard value, and the first difference value between two of the four test values and the standard value is larger than the second difference value between the other two test values and the standard value, and the difference value between the first difference value and the second difference value is larger than the second threshold value, it is determined that one side of the second board card where the high-density connector male piece is located is tilted, or the second board card is rotated and deviated in the horizontal plane.
In a second aspect, the present invention provides a method for improving the communication stability of a buckle plate, comprising the following steps:
s1, when a high-density connector female piece of a first board card is in standard connection with a high-density connector male piece of a second board card, a BMC is arranged to control four switch modules to be turned on, so that four light emitting modules can emit light, and four light receiving modules respectively receive light emitted by the corresponding light emitting modules to generate current;
s2, setting a BMC to acquire a voltage value of each light amplification module after amplifying and converting the current of the light receiving module, and acquiring four equal values which are recorded as standard values;
s3, when the connection of the high-density connector female piece of the first board card and the high-density connector male piece of the second board card is tested, the BMC is arranged to control the four switch modules to be turned on, so that the four light emitting modules can emit light, and the four light receiving modules receive the irradiation of the corresponding light emitting modules to generate current;
s4, setting a BMC to acquire a voltage value of each light amplification module after amplifying and converting the current of each light receiving module, and recording the voltage value as four test values;
and S5, setting the BMC to compare the four test values with the standard values, judging whether the connection of the high-density devices of the first board card and the second board card has a fault according to the comparison result, judging the fault type when the fault exists, and outputting the corresponding fault type.
Further, the step S5 specifically includes the following steps:
s51, setting a BMC to compare the four test values with a standard value;
when the four test values are smaller than the standard value, and the difference values between the four test values and the standard value are greater than the first threshold value and are the same, the step S52 is executed;
when the four test values are smaller than the standard value, and the first difference between two of the four test values and the standard value is larger than the second difference between the other two test values and the standard value, and the difference between the first difference and the second difference is larger than the second threshold, the step S53 is entered;
when the difference value between the four test values and the standard value is smaller than the third threshold value, the step S55 is entered;
s52, judging that the high-density connector female part and the high-density connector male part are not in place, and entering a step S54;
s53, judging that one side of a second board card where the high-density connector male piece is located is tilted or the second board card generates rotational deviation in a horizontal plane, and entering the step S54;
s54, setting the BMC to record the fault type to a log, outputting the fault type, and ending;
and S55, judging that the test is passed, and butting the high-density connector male part of the first board card with the high-density connector female part of the second board card to meet the test requirement. The light receiving module can generate different current values according to different irradiation intensities, and the light receiving module cannot accurately center the light emitting module no matter one side of a second board card where the male part of the high-density connector is located is tilted or the second board card rotates and deviates in a horizontal plane, so that the current value of the light receiving module becomes lower, the reduction amplitude of two test values on the non-deviated or non-tilted side is small, and the reduction amplitude of two test values on the deviated or tilted side is large; when the high-density connector female part and the high-density connector male part are not in contact with each other in place, the BMC detects that the four test values are compared with the standard value, and the reduction amplitudes are the same.
Further, the specific step of outputting the fault type in step S54 is as follows:
setting a BMC to indicate the fault type through a fault alarm lamp;
when the high-density connector female part and the high-density connector male part are not in place, setting a BMC to control a fault alarm lamp to flash according to an agreed first frequency;
when one side of the second board card where the high-density connector male piece is located is tilted, or the second board card is rotated and deviated in the horizontal plane, the BMC is set to control the fault alarm lamp to flash according to the appointed second frequency.
The beneficial effect of the invention is that,
the device and the method for improving the buckle plate communication stability make up for the structural integrity test of the buckle plate type high-density connector, enhance the detection of the interconnection of the board cards, further find the hidden problems of the deviation and the tilting of the board cards and the incomplete contact of the high-density connector under the condition that the functional test is passed, and avoid the problems of speed reduction and bandwidth reduction which are probabilistically caused in the site of a client; in the product design stage, the problems are found and optimized in advance, the occurrence in the mass production stage is avoided, the product quality is improved, and the rectification cost is reduced.
In addition, the invention has reliable design principle, simple structure and very wide application prospect.
Therefore, compared with the prior art, the invention has prominent substantive features and remarkable progress, and the beneficial effects of the implementation are also obvious.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic diagram of the control architecture of the present invention;
FIG. 3 is a schematic diagram of a high density connector according to the prior art;
FIG. 4 is a first diagram illustrating a failed connection of a high-density connector according to the prior art;
FIG. 5 is a second schematic diagram illustrating a failed connection of a high-density connector according to the prior art;
FIG. 6 is a third schematic diagram illustrating a failed connection of a high-density connector according to the prior art;
FIG. 7 is a schematic circuit diagram of an optical transmit module of the present invention;
FIG. 8 is a schematic circuit diagram of an optical amplification module of the present invention;
FIG. 9 is a schematic structural diagram of an embodiment of the present invention;
FIG. 10 is a first flowchart illustrating a method of the present invention;
FIG. 11 is a second flowchart illustrating the method of the present invention;
in the figure, 1-BMC; 2-an optical transmit module; 3-a light receiving module; 4-a first board card; 5-a second board card; 6-high density connector female; 7-high-density connector male piece; 8-a switch module; 9-a light amplification module; r1 — first resistance; r2 — second resistance; r3 — third resistance; r4-fourth resistor; r5-fifth resistor; r6-sixth resistance; r7 — seventh resistor; r8 — eighth resistance; q1-switching tube; d1-transient suppression diode; d2-laser diode; d2-1, a first laser diode; d2-2, a second laser diode; d2-3, a third laser diode; d2-4, a fourth laser diode; l1-inductance; PD 1-photodiode; PD1-1, a first photodiode; PD1-2, a second photodiode; PD1-3, a third photodiode; PD1-4, a fourth photodiode; OP 1-operational amplifier; P5V _ AUX, 5V power supply.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1:
as shown in fig. 1 and 2, the invention provides a device for improving the communication stability of a buckle, which comprises a BMC1, a light emitting module 2, a light receiving module 3, a first board card 4 and a second board card 5;
the first board card 4 is provided with a high-density connector female part 6, the second board card 5 is provided with a high-density connector male part 7, and the high-density connector female part 6 is matched with the high-density connector male part 7 to form buckling connection;
one of the light emitting module 2 and the light receiving module 3 is arranged on the first board card 4, the other is arranged on the second board card 5, and the light emitting module 2 and the light receiving module 3 are oppositely arranged to generate a light emitting and receiving group; the four corners of the first board card 4 and the second board card 5 are respectively provided with a light emitting and receiving group, and the number of the light emitting and receiving groups is at least four;
the BMC1 is connected with a switch module 8, and the switch module 8 is connected with the light emitting module 2;
the light receiving module 3 is connected with a light amplification module 9, and the light amplification module 9 is connected with the BMC 1;
the BMC1 controls each light emitting module 2 to emit light through the switch module 8, the corresponding light receiving module 3 senses the light of the light emitting module 2 to generate an induced current, and the light amplification module 9 amplifies the induced current, converts the amplified current into voltage and feeds the voltage back to the BMC 1;
the BMC1 judges whether the connection of the high-density connector between the first board card 4 and the second board card 5 has a fault and a fault type according to the voltage value fed back by each light emitting module 2 through the light amplification module 9.
In some embodiments, as shown in fig. 7, the switch module 8 includes a first resistor R1, a second resistor R2, a third resistor R3, a switch Q1, a transient suppression diode D1, and an inductor L1;
the light emitting module 2 adopts a laser diode D2;
a GPIO pin of the BMC1 is connected with a first resistor R1, the other end of the first resistor R1 is connected with a second resistor R2 and the base electrode of a switch tube Q1, and the other end of the second resistor R2 is grounded;
an emitter of the switching tube Q1 is connected with a third resistor R3, and the other end of the third resistor R3 is grounded;
the collector of the switching tube Q1 is connected to the anode of the transient suppression diode D1 and the cathode of the laser diode D2, the cathode of the transient suppression diode D1 is connected to the anode of the laser diode D2 and the inductor L1, and the other end of the inductor L1 is connected to the 5V power supply P5V _ AUX.
In some embodiments, as shown in fig. 8, the optical amplification module 9 comprises an OP-amp 1;
the light receiving module 3 employs a photodiode PD 1;
the positive power supply end of the operational amplifier OP1 is connected with a 5V power supply P5V _ AUX, and the negative power supply end of the operational amplifier OP1 is grounded;
the same-direction input end of the operational amplifier OP1 is grounded, the reverse input end of the operational amplifier OP1 is connected with a fourth resistor R4 and a sixth resistor R6, the reverse input end of the operational amplifier OP1 is also connected with the cathode of a photodiode PD1, and the anode of the photodiode PD1 is grounded;
the other end of the fourth resistor R4 is connected with the other end of the sixth resistor R6 and is connected with a fifth resistor R5, the other end of the fifth resistor R5 is connected with the output end of the operational amplifier OP1 and is connected with a seventh resistor R7, the other end of the seventh resistor R7 is connected with an eighth resistor R8, the other end of the seventh resistor R7 is connected with the BMC1, and the other end of the eighth resistor R8 is grounded;
the BMC1 may be connected to the seventh resistor R7 and the eighth resistor R8 through the ADC pin, and when the number of measurement points is more, the BMC1 may be connected to the seventh resistor R7 and the eighth resistor R8 through the ADC chip, and the BMC1 may be connected to the ADC chip through the I2C pin.
In some embodiments, the BMC1 is further connected to a fault warning lamp for indicating whether the high-density device connection of the first board 4 and the second board 5 is faulty and the corresponding fault type.
As shown in fig. 9, the number of the laser diodes D2 is four, which are respectively a first laser diode D2-1, a second laser diode D2-2, a third laser diode D2-3 and a fourth laser diode D2-4, and the four laser diodes are respectively disposed at four corners of the second board card 5;
the number of the photosensitive diodes PD1 is four, the photosensitive diodes PD1 are respectively a first photosensitive diode PD1-1, a second photosensitive diode PD1-2, a third photosensitive diode PD1-3 and a fourth photosensitive diode PD1-4, the four photosensitive diodes are respectively arranged at four corners of the first board card 4, the first photosensitive diode PD1-1 corresponds to the position of the first laser diode D2-1, the second photosensitive diode PD1-2 corresponds to the position of the second laser diode D2-2, the third photosensitive diode PD1-3 corresponds to the position of the third laser diode D2-3, and the fourth photosensitive diode PD1-4 corresponds to the position of the fourth laser diode D2-4, so that light emission and reception are realized;
the number of the switch modules 8 is four, and the switch modules are respectively connected with one laser diode D2;
the number of the light amplification modules 9 is four, and the light amplification modules are respectively connected with one photosensitive diode PD 1;
the BMC1 obtains four feedback voltage values through the four optical amplification modules 6;
when the difference values of the four feedback voltage values and the standard value are larger than a first threshold value and are the same, determining that the high-density connector female piece 6 and the high-density connector male piece 7 are not in place;
when the four test values are smaller than the standard value, and the first difference value between two of the four test values and the standard value is larger than the second difference value between the other two test values and the standard value, and the difference value between the first difference value and the second difference value is larger than the second threshold value, it is determined that one side of the second board card 5 where the high-density connector male piece 7 is located is tilted, or the second board card 5 generates rotational deviation in the horizontal plane.
Example 3:
as shown in fig. 10, the present invention provides a method for improving the communication stability of a buckle, which comprises the following steps:
s1, when a high-density connector female piece of a first board card is in standard connection with a high-density connector male piece of a second board card, a BMC is arranged to control four switch modules to be turned on, so that four light emitting modules can emit light, and four light receiving modules respectively receive light emitted by the corresponding light emitting modules to generate current;
s2, setting a BMC to acquire a voltage value of each light amplification module after amplifying and converting the current of the light receiving module, and acquiring four equal values which are recorded as standard values;
s3, when the connection of the high-density connector female piece of the first board card and the high-density connector male piece of the second board card is tested, the BMC is arranged to control the four switch modules to be turned on, so that the four light emitting modules can emit light, and the four light receiving modules receive the irradiation of the corresponding light emitting modules to generate current;
s4, setting a BMC to acquire a voltage value of each light amplification module after amplifying and converting the current of each light receiving module, and recording the voltage value as four test values;
and S5, setting the BMC to compare the four test values with the standard values, judging whether the connection of the high-density devices of the first board card and the second board card has a fault according to the comparison result, judging the fault type when the fault exists, and outputting the corresponding fault type.
Example 4:
as shown in fig. 10 and 11, the present invention provides a method for improving the communication stability of a buckle, which comprises the following steps:
s1, when a high-density connector female piece of a first board card is in standard connection with a high-density connector male piece of a second board card, a BMC is arranged to control four switch modules to be turned on, so that four light emitting modules can emit light, and four light receiving modules respectively receive light emitted by the corresponding light emitting modules to generate current;
s2, setting a BMC to acquire a voltage value of each light amplification module after amplifying and converting the current of the light receiving module, and acquiring four equal values which are recorded as standard values;
s3, when the connection of the high-density connector female piece of the first board card and the high-density connector male piece of the second board card is tested, the BMC is arranged to control the four switch modules to be turned on, so that the four light emitting modules can emit light, and the four light receiving modules receive the irradiation of the corresponding light emitting modules to generate current;
s4, setting a BMC to acquire a voltage value of each light amplification module after amplifying and converting the current of each light receiving module, and recording the voltage value as four test values;
s5, setting a BMC to compare the four test values with a standard value, judging whether the connection of the high-density devices of the first board card and the second board card has a fault according to a comparison result, judging a fault type when the fault exists, and outputting a corresponding fault type; the step S5 includes the following steps:
s51, setting a BMC to compare the four test values with a standard value;
when the four test values are smaller than the standard value, and the difference values between the four test values and the standard value are greater than the first threshold value and are the same, the step S52 is executed;
when the four test values are smaller than the standard value, and the first difference between two of the four test values and the standard value is larger than the second difference between the other two test values and the standard value, and the difference between the first difference and the second difference is larger than the second threshold, the step S53 is entered;
when the difference value between the four test values and the standard value is smaller than the third threshold value, the step S55 is entered;
s52, judging that the high-density connector female part and the high-density connector male part are not in place, and entering a step S54;
s53, judging that one side of a second board card where the high-density connector male piece is located is tilted or the second board card generates rotational deviation in a horizontal plane, and entering the step S54;
s54, setting the BMC to record the fault type to a log, outputting the fault type, and ending;
and S55, judging that the test is passed, and butting the high-density connector male part of the first board card with the high-density connector female part of the second board card to meet the test requirement.
In some embodiments, the specific steps of outputting the fault type in step S54 are as follows:
setting a BMC to indicate the fault type through a fault alarm lamp;
when the high-density connector female part and the high-density connector male part are not in place, setting a BMC to control a fault alarm lamp to flash according to an agreed first frequency;
when one side of the second board card where the high-density connector male piece is located is tilted, or the second board card is rotated and deviated in the horizontal plane, the BMC is set to control the fault alarm lamp to flash according to the appointed second frequency.
Although the present invention has been described in detail by referring to the drawings in connection with the preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and scope of the present invention, and these modifications or substitutions are within the scope of the present invention/any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A device for improving the communication stability of a buckle is characterized by comprising a BMC (1), a light emitting module (2), a light receiving module (3), a first board card (4) and a second board card (5);
a high-density connector female part (6) is arranged on the first board card (4), a high-density connector male part (7) is arranged on the second board card (5), and the high-density connector female part (6) is matched with the high-density connector male part (7) to form buckling connection;
one of the light emitting module (2) and the light receiving module (3) is arranged on the first board card (4), the other one is arranged on the second board card (5), and the light emitting module (2) and the light receiving module (3) are oppositely arranged to generate a light emitting and receiving group; light emitting and receiving groups are arranged at the four corners of the first board card (4) and the second board card (5), and the number of the light emitting and receiving groups is at least four;
the BMC (1) is connected with a switch module (8), and the switch module (8) is connected with the light emitting module (2);
the light receiving module (3) is connected with a light amplification module (9), and the light amplification module (9) is connected with the BMC (1);
the BMC (1) controls each light emitting module (2) to emit light through the switch module (8), the corresponding light receiving module (3) senses the light of the light emitting module (2) to generate an induced current, and the light amplification module (9) amplifies the induced current, converts the amplified current into voltage and feeds the voltage back to the BMC (1);
the BMC (1) judges whether the connection of the high-density connector between the first board card (4) and the second board card (5) has a fault and a fault type according to the voltage value fed back by each light emitting module (2) through the light amplification module (9).
2. The buckle communication stability improvement device according to claim 1, wherein the switch module (8) comprises a first resistor R1, a second resistor R2, a third resistor R3, a switch tube Q1, a transient suppression diode D1 and an inductor L1;
the light emitting module (2) adopts a laser diode D2;
a GPIO pin of the BMC (1) is connected with a first resistor R1, the other end of the first resistor R1 is connected with a second resistor R2 and a base electrode of a switch tube Q1, and the other end of the second resistor R2 is grounded;
an emitter of the switching tube Q1 is connected with a third resistor R3, and the other end of the third resistor R3 is grounded;
the collector of the switching tube Q1 is connected to the anode of the transient suppression diode D1 and the cathode of the laser diode D2, the cathode of the transient suppression diode D1 is connected to the anode of the laser diode D2 and the inductor L1, and the other end of the inductor L1 is connected to the 5V power supply P5V _ AUX.
3. The device for improving the communication stability of the pinch plate according to claim 2, wherein the optical amplification module (9) comprises an operational amplifier OP 1;
the light receiving module (3) adopts a photosensitive diode PD 1;
the positive power supply end of the operational amplifier OP1 is connected with a 5V power supply P5V _ AUX, and the negative power supply end of the operational amplifier OP1 is grounded;
the same-direction input end of the operational amplifier OP1 is grounded, the reverse input end of the operational amplifier OP1 is connected with a fourth resistor R4 and a sixth resistor R6, the reverse input end of the operational amplifier OP1 is also connected with the cathode of a photodiode PD1, and the anode of the photodiode PD1 is grounded;
the other end of the fourth resistor R4 is connected with the other end of the sixth resistor R6 and is connected with a fifth resistor R5, the other end of the fifth resistor R5 is connected with the output end of the operational amplifier OP1 and is connected with a seventh resistor R7, the other end of the seventh resistor R7 is connected with an eighth resistor R8, the other end of the seventh resistor R7 is connected with BMC (1), and the other end of the eighth resistor R8 is grounded.
4. The device for improving the communication stability of the pinch plate according to claim 3, wherein an ADC pin of the BMC (1) is connected with a seventh resistor R7 and an eighth resistor R8.
5. The buckle communication stability improvement device according to claim 3, wherein the BMC (1) is connected with the seventh resistor R7 and the eighth resistor R8 through an ADC chip, and the BMC (1) is connected with the ADC chip through an I2C pin.
6. The buckle communication stability improving device according to the claim 3, characterized in that the BMC (1) is further connected with a fault alarm lamp for indicating whether the high-density device connection of the first board card (4) and the second board card (5) is faulty or not and corresponding fault type.
7. The buckle communication stability improvement device according to claim 3, wherein the number of the laser diodes D2 is four, and the laser diodes D2 are respectively arranged at four corners of the second board card (5);
the number of the photosensitive diodes PD1 is four, the photosensitive diodes PD1 are respectively arranged at four corners of the first board card (4), and the positions of the photosensitive diodes PD1 and the positions of the laser diodes D2 are in one-to-one correspondence, so that light emission and reception are realized;
the number of the switch modules (8) is four, and the switch modules are respectively connected with one laser diode D2;
the number of the light amplification modules (9) is four, and the light amplification modules are respectively connected with one photosensitive diode PD 1;
the BMC (1) obtains four feedback voltage values through four optical amplification modules (6);
when the difference values of the four feedback voltage values and the standard value are larger than a first threshold value and the difference values are the same, determining that the high-density connector female piece (6) and the high-density connector male piece (7) are not in place;
when the four test values are smaller than the standard value, and the first difference value between two of the four test values and the standard value is larger than the second difference value between the other two test values and the standard value, and the difference value between the first difference value and the second difference value is larger than the second threshold value, it is judged that one side of the second board card (5) where the high-density connector male piece (7) is located is tilted, or the second board card (5) rotates and deviates in the horizontal plane.
8. A method for improving the communication stability of a buckle plate is characterized by comprising the following steps:
s1, when a high-density connector female piece of a first board card is in standard connection with a high-density connector male piece of a second board card, a BMC is arranged to control four switch modules to be turned on, so that four light emitting modules can emit light, and four light receiving modules respectively receive light emitted by the corresponding light emitting modules to generate current;
s2, setting a BMC to acquire a voltage value of each light amplification module after amplifying and converting the current of the light receiving module, and acquiring four equal values which are recorded as standard values;
s3, when the connection of the high-density connector female piece of the first board card and the high-density connector male piece of the second board card is tested, the BMC is arranged to control the four switch modules to be turned on, so that the four light emitting modules can emit light, and the four light receiving modules receive the irradiation of the corresponding light emitting modules to generate current;
s4, setting a BMC to acquire a voltage value of each light amplification module after amplifying and converting the current of each light receiving module, and recording the voltage value as four test values;
and S5, setting the BMC to compare the four test values with the standard values, judging whether the connection of the high-density devices of the first board card and the second board card has a fault according to the comparison result, judging the fault type when the fault exists, and outputting the corresponding fault type.
9. The method for improving the communication stability of the gusset plate according to claim 8, wherein the step S5 comprises the following steps:
s51, setting a BMC to compare the four test values with a standard value;
when the four test values are smaller than the standard value, and the difference values between the four test values and the standard value are greater than the first threshold value and are the same, the step S52 is executed;
when the four test values are smaller than the standard value, and the first difference between two of the four test values and the standard value is larger than the second difference between the other two test values and the standard value, and the difference between the first difference and the second difference is larger than the second threshold, the step S53 is entered;
when the difference value between the four test values and the standard value is smaller than the third threshold value, the step S55 is entered;
s52, judging that the high-density connector female part and the high-density connector male part are not in place, and entering a step S54;
s53, judging that one side of a second board card where the high-density connector male piece is located is tilted or the second board card generates rotational deviation in a horizontal plane, and entering the step S54;
s54, setting the BMC to record the fault type to a log, outputting the fault type, and ending;
and S55, judging that the test is passed, and butting the high-density connector male part of the first board card with the high-density connector female part of the second board card to meet the test requirement.
10. The method for improving the communication stability of the gusset plate according to claim 8, wherein the step of outputting the fault type in the step S54 comprises the following steps:
setting a BMC to indicate the fault type through a fault alarm lamp;
when the high-density connector female part and the high-density connector male part are not in place, setting a BMC to control a fault alarm lamp to flash according to an agreed first frequency;
when one side of the second board card where the high-density connector male piece is located is tilted, or the second board card is rotated and deviated in the horizontal plane, the BMC is set to control the fault alarm lamp to flash according to the appointed second frequency.
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| WO2016141619A1 (en) * | 2015-03-10 | 2016-09-15 | 深圳市贝沃德克生物技术研究院有限公司 | Board anti-disassembling device and method |
| CN106373330A (en) * | 2016-09-27 | 2017-02-01 | 山东建筑大学 | Safety belt buckle detection device and working method thereof |
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| EP2568547A1 (en) * | 2011-09-06 | 2013-03-13 | Leica Geosystems AG | Monitor diode-free laser driver |
| CN104408849A (en) * | 2014-12-23 | 2015-03-11 | 华南师范大学 | Door/window alarm equipment based on optical fiber sensing |
| WO2016141619A1 (en) * | 2015-03-10 | 2016-09-15 | 深圳市贝沃德克生物技术研究院有限公司 | Board anti-disassembling device and method |
| CN106373330A (en) * | 2016-09-27 | 2017-02-01 | 山东建筑大学 | Safety belt buckle detection device and working method thereof |
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