CN111993294B - Preparation method of ceramic bond diamond grinding wheel with low-temperature thermosetting type adhesion layer - Google Patents
Preparation method of ceramic bond diamond grinding wheel with low-temperature thermosetting type adhesion layer Download PDFInfo
- Publication number
- CN111993294B CN111993294B CN202010911708.8A CN202010911708A CN111993294B CN 111993294 B CN111993294 B CN 111993294B CN 202010911708 A CN202010911708 A CN 202010911708A CN 111993294 B CN111993294 B CN 111993294B
- Authority
- CN
- China
- Prior art keywords
- grinding wheel
- layer
- grinding
- abrasive
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
- B24D3/18—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings for porous or cellular structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
Abstract
The invention discloses a preparation method of a ceramic bond diamond grinding wheel with a low-temperature thermosetting type adhesion layer, which comprises the steps of adding a mixture of resin powder, common abrasive, aluminum oxide and zinc oxide into a mold with a substrate, and carrying out hot pressing to obtain the substrate with the adhesion layer; mixing and sieving a diamond grinding material, a ceramic bonding agent, carbon powder and resin liquid, and pressing to prepare a green body; preparing a grinding wheel abrasive layer after sintering the green body; and (3) bonding the grinding wheel abrasive layer with the substrate with the attached layer to obtain the ceramic bond diamond grinding wheel with the low-temperature thermosetting type attached layer. The ceramic bond grinding wheel with the attached layer can effectively improve the utilization rate of a grinding layer of the grinding wheel and reduce the knocking-over probability of the grinding wheel, and the heat conduction coefficient of the disclosed attached layer is much lower than that of superhard grinding materials and a metal base, so that the problem of expansion crack of the grinding wheel caused by the heat conduction of a grinding interface to the grinding base during grinding can be avoided.
Description
The invention belongs to a ceramic bond diamond grinding wheel with a low-temperature thermosetting type adhesion layer and a preparation method thereof, and belongs to divisional application of invention application with application date of 2018, 6 and 29 and application number of 2018107123320, and belongs to a part of a product preparation method.
Technical Field
The invention relates to a technology for adding an auxiliary layer of a composite material between a ceramic bond diamond grinding wheel abrasive layer and a substrate, belonging to the technical field of diamond grinding wheel preparation.
Background
In the prior art, the layer-attached grinding wheel mainly uses resin binder, and has little application to ceramic binder and great technical difficulty. The traditional preparation process of the ceramic bond diamond grinding wheel comprises the steps of cold pressing to form a green body, then carrying out curing sintering, matching a sintered abrasive layer with a substrate, then carrying out bonding molding, and finishing to obtain the required shape and size. The deformation of the vitrified bonded grinding wheel often occurs during the sintering process. Therefore, in the using process of the grinding wheel, the grinding layer is separated from the matrix and can not be used continuously when the last few millimeters of the grinding layer are left, so that the waste of grinding materials is caused, and the heat of a grinding interface is conducted to the grinding wheel matrix during grinding to easily cause the spalling of the grinding wheel.
Disclosure of Invention
The invention aims to provide a ceramic bond diamond grinding wheel with a low-temperature thermosetting type adhesion layer and a preparation process thereof.
In order to achieve the purpose of the invention, the technical scheme adopted by the invention is as follows: a ceramic bond diamond grinding wheel with a low-temperature thermosetting type adhesion layer comprises a base body, a grinding wheel abrasive layer and an adhesion layer positioned between the base body and the grinding wheel abrasive layer; the raw materials for preparing the grinding wheel grinding material layer comprise diamond grinding materials, ceramic bonding agents, carbon powder and resin liquid; the preparation raw materials of the additional layer comprise resin powder, grinding materials, aluminum oxide and zinc oxide.
The invention also discloses a low-temperature thermosetting adhesive layer for the ceramic bond diamond grinding wheel, and the preparation raw materials of the low-temperature thermosetting adhesive layer comprise resin powder, common abrasive, aluminum oxide and zinc oxide.
In the technical scheme, the thickness of the attached layer is the same as that of the grinding wheel abrasive layer, and the width of the attached layer is 1/5 of the thickness of the grinding wheel abrasive layer. The auxiliary layer is an abrasive layer and a base body middle transition layer, the manufacturing process of the low-temperature thermosetting auxiliary layer is simple and efficient, the applicability is strong, the ceramic bond grinding wheel with the auxiliary layer can effectively improve the utilization rate of the grinding wheel abrasive layer, the grinding wheel knocking-over probability is reduced, the heat conduction coefficient of the disclosed auxiliary layer is much lower than that of the superhard abrasive material and the metal base body, and therefore the problem of abrasive wheel spalling caused by heat conduction of a grinding interface during grinding for the grinding wheel base body can be avoided.
In the technical scheme, in the preparation raw materials of the auxiliary layer, the resin powder is phenolic resin powder, and the grinding material is white corundum; in the grinding wheel abrasive layer, the ceramic binder is prepared from the raw materials of aluminum oxide, zinc oxide, sodium tetraborate, lithium hydroxide and silicon dioxide; the substrate is a metal substrate.
The invention also discloses a preparation method of the ceramic bond diamond grinding wheel with the low-temperature thermosetting type adhesion layer, which comprises the following steps,
(1) adding a mixture of resin powder, an abrasive, aluminum oxide and zinc oxide into a mold with a substrate, and carrying out hot pressing to obtain the substrate with the attached layer;
(2) mixing and sieving a diamond grinding material, a ceramic bonding agent, carbon powder and resin liquid, and pressing to prepare a green body; preparing a grinding wheel abrasive layer after sintering the green body;
(3) and (3) bonding the grinding wheel abrasive layer with the substrate with the attached layer to obtain the ceramic bond diamond grinding wheel with the low-temperature thermosetting type attached layer.
In the invention, the preparation of the substrate coating is that white corundum, alumina, zinc oxide and phenolic resin powder in the coating raw materials are uniformly mixed, and then the substrate is put into a mould, so that the coating material can be directly contacted with the excircle of the substrate; and then feeding the materials with the molding density of rho =1.8, and carrying out hot pressing on the materials on a hot press at the pressure of 30t and the temperature of 200 ℃ for 20 minutes, so that the coating material is solidified on the excircle of the substrate, and the substrate with the coating is obtained.
Manufacturing a grinding material layer of the diamond grinding wheel: weighing diamond grinding materials, ceramic bond powder, carbon powder and resin liquid according to the required mass ratio, putting the materials into a beaker, pouring a certain amount of acetone solution into the beaker, uniformly stirring, sieving the acetone solution by using a 80-mesh screen after the acetone solution is completely volatilized, boxing the acetone solution for standby, pressing the boxed materials into a ring-shaped green blank by using a mold according to rho =2.0, putting the green blank into a muffle furnace, and sintering the green blank by using a flow of keeping the temperature at 760 ℃ for 3 hours; and preparing a grinding wheel abrasive layer.
And after the diamond grinding wheel is taken out of the furnace, the grinding material layer of the grinding wheel is bonded with the attached layer substrate by using the existing high-strength structural adhesive, so that the ceramic bond diamond grinding wheel with the low-temperature thermosetting attached layer is obtained.
In the invention, the grinding material layer is directly finished by one-section heat preservation, solidification and sintering; the auxiliary layer is a low-temperature mouldable material formed by mixing resin powder, white corundum, aluminum oxide, zinc oxide and the like; the auxiliary layer and the base body are directly hot-pressed and molded together; the abrasive layer and the attached layer matrix are directly bonded by a high-strength structure.
Preferably, the outer diameter of the grinding wheel abrasive layer is phi 205 mm; the thickness of the grinding wheel abrasive layer is 10-20mm, and the thickness of the corresponding attached layer is 2-4 mm.
Preferably, the mass ratio of the white corundum to the phenolic resin powder to the aluminum oxide to the zinc oxide is 1:6:5: 3; the mass ratio of the aluminum oxide to the zinc oxide to the sodium tetraborate to the lithium hydroxide to the silicon dioxide is 2-8:5-10:4-10:6-12: 40-60; the mass ratio of the diamond abrasive to the ceramic bond to the carbon powder to the resin liquid is 15-25:5-10:2-5:3-8, the ratio improves the finished product rate of the grinding wheel, and the stability of the grinding wheel is enhanced when the grinding wheel is used.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
the invention discloses a ceramic bond diamond grinding wheel with an attached layer for the first time, overcomes the problem that the existing attached layer can only be used for a resin bond grinding layer, overcomes the defect that the ceramic bond raw material composition cannot be effectively matched with the attached layer in the prior art, and improves the utilization rate of the grinding layer.
The adhesive layer greatly improves the integral stability of the grinding wheel, the adhesion between the grinding material layer and the adhesive layer is firmer than the direct adhesion between the grinding material layer and the metal matrix, and the knocking-over probability of the grinding wheel is reduced; and the grinding wheel has simple structure, convenient operation and convenient popularization.
The composite material formed at low temperature adopted by the auxiliary layer is lower in cost than the grinding material of the grinding material layer, so that the production cost can be effectively saved, and the heat conduction coefficient of the composite material is much lower than that of the superhard grinding material and the metal matrix, so that the problem of expansion crack of the grinding wheel caused by the heat conduction of a grinding interface to the grinding wheel matrix during grinding can be avoided.
Drawings
FIG. 1 is a schematic view of the construction of the grinding wheel of the present invention;
FIG. 2 is a schematic cross-sectional view of the grinding wheel of the present invention;
the adhesive comprises a base body 1, a low-temperature thermosetting adhesive layer 2, an abrasive layer 3 and a high-strength structural adhesive 4.
Detailed Description
The invention is further described with reference to the following figures and examples:
example one
Referring to fig. 1-2, the ceramic bond diamond grinding wheel with the low-temperature thermosetting type adhesion layer comprises a base body 1, a low-temperature thermosetting type adhesion layer 2, an abrasive layer 3 and high-strength structural adhesive 4.
The preparation method of the ceramic bond diamond grinding wheel with the low-temperature thermosetting type adhesion layer comprises the following steps:
manufacturing a substrate attached layer, namely putting a substrate into a mould, and enabling an attached layer material to be directly contacted with the excircle of the substrate; white corundum, aluminum oxide, zinc oxide and phenolic resin powder in the raw materials of the additional layer are uniformly mixed according to the mass ratio of 1:6:5:3, then the materials are fed into a mould with the forming density of rho =1.8, and then the materials are hot-pressed for 20 minutes at 200 ℃ on a hot press under the pressure of 30t, so that the additional layer is solidified on the excircle of the base body, the thickness of the additional layer is 3mm, and the width of the additional layer is the same as that of the abrasive layer.
Preparing ceramic bond powder, namely uniformly mixing alumina, zinc oxide, sodium tetraborate, lithium hydroxide and silicon dioxide in a mass ratio of 5:8:6:10:50, and screening by using a 80-mesh screen; putting the mixed material into a smelting furnace at 1500 ℃, and performing cold extraction treatment on the molten liquid to obtain ceramic glass material; then, putting the glass frit into a ball mill according to the ball-to-material ratio of 1:7 for ball milling of component powder; drying the powder, ball-milling and sieving by a 200-mesh screen.
Manufacturing a grinding material layer of the diamond grinding wheel: weighing diamond abrasive, ceramic bond powder, carbon powder and phenolic resin liquid according to the mass ratio of 20:6:5:7, putting the materials into a beaker, pouring 20ml of acetone solution into the beaker, and uniformly stirring; after the acetone solution is completely volatilized, sieving the acetone solution by using a 80-mesh sieve and packing the acetone solution for later use. Pressing the boxed material into a green body in a required annular shape by using a mold according to the forming density of rho =2.0, putting the green body into a muffle furnace, and sintering the green body by using a flow of keeping the temperature of 760 ℃ for 3 hours to obtain a diamond grinding wheel abrasive layer with the outer diameter of phi 205mm and the thickness of 15 mm.
And after the diamond grinding wheel is taken out of the furnace, the grinding material layer and the attached layer substrate of the diamond grinding wheel are bonded by high-strength structural adhesive, so that the ceramic bond diamond grinding wheel with the low-temperature thermosetting type attached layer is obtained.
The results of the performance comparison, which is shown in Table 1, are obtained by comparing the adhesion of the substrate without the deposit to the abrasive layer of the grinding wheel, and the results of the performance comparison show that the grinding wheel with the deposit is superior to the structure without the deposit in terms of roughness, dressing interval, and life (number of workpieces) under the same conditions.
In the attached layer disclosed by the invention, the structural adhesive can permeate into the attached layer, so that the adhesion between the attached layer and the diamond grinding wheel is improved, if no zinc oxide is added, the service life is reduced to about 6888, and if no zinc oxide is added, the service life is reduced to about 7012; if the overlayer thickness exceeds 25% of the abrasive layer, the lifetime is reduced, approximately 6563; if the thickness of the overlayer is less than 15% of the abrasive layer, the lifetime is reduced, at about 5806. Compared with the method for directly bonding the base body and the grinding wheel, the bonding strength of the invention is improved by 5 times, and the structure formed between the auxiliary layer and the adhesive layer has low heat conductivity and certain toughness, so that the conditions that the base body cracks the grinding wheel under the condition of high temperature and the grinding wheel is knocked off under the condition of low temperature are effectively avoided, and the service life and the correction interval are greatly improved. Compared with the existing grinding wheel, in practical application, the conditions of the cracking and the ring-releasing of the grinding wheel are reduced by 95 percent, and the invention has the shock absorption effect and improves the roughness during processing. Effectively improving the quality of the grinding wheel. The method has the advantages of simple operation, strong practicability and high yield; particularly, the grinding wheel has large outer diameter, has obvious effects of ring removal, expansion and cracking of the grinding wheel and improvement of processing precision, effectively improves the quality of the grinding wheel, and is suitable for wide application.
In the ceramic bond diamond grinding wheel with the low-temperature thermosetting type adhesion layer, the adhesion layer is made of a low-temperature forming composite material, and is firmly combined with a substrate after hot pressing for 20 minutes at the pressure of 30t and the temperature of 200 ℃; the abrasive layer and the auxiliary layer are bonded together by high-strength structural adhesive; after the structural adhesive is completely cured, the grinding wheel is trimmed to the required size and shape for use. In view of the defects of the prior art, the invention firstly develops a preparation process of the low-temperature thermosetting type layer-attached ceramic bond diamond, and a low-temperature thermosetting type layer is added between the abrasive layer of the ceramic bond grinding wheel and the matrix, so that the problems of superhard abrasive waste, grinding wheel knocking-over and abrasive layer spalling in the prior art are solved, and the preparation process is obviously of positive significance.
Claims (3)
1. A preparation method of a ceramic bond diamond grinding wheel with a low-temperature thermosetting type adhesion layer comprises the following steps of (1) adding a mixture of resin powder, common abrasive, aluminum oxide and zinc oxide into a mold with a substrate, carrying out hot pressing to obtain the substrate with the adhesion layer, and carrying out hot pressing for 20 minutes at 200 ℃ under the pressure of 30 tons; (2) mixing and sieving a diamond grinding material, a ceramic bonding agent, carbon powder and resin liquid, and pressing to prepare a green body; preparing a grinding wheel abrasive layer after sintering the green body; the ceramic binder is prepared from the raw materials of aluminum oxide, zinc oxide, sodium tetraborate, lithium hydroxide and silicon dioxide; sintering for 3 hours at 760 ℃; (3) bonding the grinding wheel abrasive layer with a substrate with an attached layer to obtain the ceramic bond diamond grinding wheel with the low-temperature thermosetting attached layer; the attached layer is positioned between the base body and the grinding wheel abrasive layer, and the width of the attached layer is the same as that of the grinding wheel abrasive layer; the thickness of the attached layer is 1/5 of the thickness of the grinding wheel abrasive layer; the mass ratio of the common abrasive to the resin powder to the aluminum oxide to the zinc oxide is 1:6:5: 3; the mass ratio of the aluminum oxide to the zinc oxide to the sodium tetraborate to the lithium hydroxide to the silicon dioxide is 2-8:5-10:4-10:6-12: 40-60; the mass ratio of the diamond abrasive to the ceramic bond to the carbon powder to the resin liquid is 15-25:5-10:2-5: 3-8.
2. The method for preparing a vitrified bond diamond grinding wheel with a low-temperature thermosetting type adhesion layer according to claim 1, wherein the molding density of the adhesion layer is 1.8; the molding density of the grinding wheel abrasive layer is 2.0.
3. The method for preparing a vitrified bond diamond grinding wheel with a low-temperature thermosetting type adhesion layer according to claim 1, wherein the resin liquid is a phenolic resin liquid; the resin powder is phenolic resin powder; the common abrasive is white corundum; the substrate is a metal substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010911708.8A CN111993294B (en) | 2018-06-29 | 2018-06-29 | Preparation method of ceramic bond diamond grinding wheel with low-temperature thermosetting type adhesion layer |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810712332.0A CN108747854B (en) | 2018-06-29 | 2018-06-29 | Ceramic bond diamond grinding wheel with low-temperature thermosetting type adhesion layer and preparation method thereof |
| CN202010911708.8A CN111993294B (en) | 2018-06-29 | 2018-06-29 | Preparation method of ceramic bond diamond grinding wheel with low-temperature thermosetting type adhesion layer |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810712332.0A Division CN108747854B (en) | 2018-06-29 | 2018-06-29 | Ceramic bond diamond grinding wheel with low-temperature thermosetting type adhesion layer and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111993294A CN111993294A (en) | 2020-11-27 |
| CN111993294B true CN111993294B (en) | 2022-04-15 |
Family
ID=63975533
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010911708.8A Active CN111993294B (en) | 2018-06-29 | 2018-06-29 | Preparation method of ceramic bond diamond grinding wheel with low-temperature thermosetting type adhesion layer |
| CN201810712332.0A Active CN108747854B (en) | 2018-06-29 | 2018-06-29 | Ceramic bond diamond grinding wheel with low-temperature thermosetting type adhesion layer and preparation method thereof |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810712332.0A Active CN108747854B (en) | 2018-06-29 | 2018-06-29 | Ceramic bond diamond grinding wheel with low-temperature thermosetting type adhesion layer and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN111993294B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113635226B (en) * | 2021-08-19 | 2022-11-29 | 江苏赛扬精工科技有限责任公司 | Ceramic internal grinding wheel grinding complex, double-layer grinding wheel and preparation method |
| CN113732965A (en) * | 2021-09-03 | 2021-12-03 | 柳州凯通新材料科技有限公司 | Ceramic-metal composite binding agent diamond grinding wheel and preparation method thereof |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4157897A (en) * | 1977-04-14 | 1979-06-12 | Norton Company | Ceramic bonded grinding tools with graphite in the bond |
| US4131436A (en) * | 1977-09-12 | 1978-12-26 | Wiand Ronald C | Ophthalmic flat roughing wheel |
| JPS5633162U (en) * | 1979-08-22 | 1981-04-01 | ||
| ZA862903B (en) * | 1985-04-29 | 1987-11-25 | Smith International | Composite polycrystalline diamond compact |
| JPH0757473B2 (en) * | 1987-06-23 | 1995-06-21 | 三井研削砥石株式会社 | Super Abrasive Wheel |
| JPH03104566A (en) * | 1989-09-13 | 1991-05-01 | Noritake Co Ltd | Grinding wheel |
| WO2005068099A1 (en) * | 2003-12-23 | 2005-07-28 | Diamond Innovations Inc. | Grinding wheel for roll grinding application and method of roll grinding thereof |
| CN100551879C (en) * | 2006-12-11 | 2009-10-21 | 湖南大学 | Cubic boron nitride surface sol-gal process plating TiO 2/ Al 2O 3Laminated film technology |
| CN201073749Y (en) * | 2007-07-27 | 2008-06-18 | 张广政 | Consumption-reduction abrasion wheel |
| EP2178951B1 (en) * | 2007-08-03 | 2016-10-19 | Saint-Gobain Abrasives, Inc. | Abrasive article with adhesion promoting layer |
| CN101353258B (en) * | 2008-08-07 | 2013-04-24 | 沈阳中科超硬磨具磨削研究所 | CBN grinding wheel of low temperature vitrified bond and preparation technique thereof |
| CN101362316A (en) * | 2008-10-06 | 2009-02-11 | 天津大学 | Low-temperature high-strength devitrified glass ceramics bond cubic boron nitride grinding wheel |
| JP5369654B2 (en) * | 2008-12-04 | 2013-12-18 | 株式会社ジェイテクト | Vitrified bond whetstone |
| CN101704225B (en) * | 2009-04-22 | 2012-05-09 | 厦门东南新石材工具有限公司 | Elastic grindstone and manufacturing method thereof |
| CN102229122A (en) * | 2011-06-29 | 2011-11-02 | 苏州赛力精密工具有限公司 | Special ceramic bond diamond grinding wheel for grinding diamond |
| JP2014172146A (en) * | 2013-03-12 | 2014-09-22 | Disco Abrasive Syst Ltd | Grinding wheel |
| CN103495938B (en) * | 2013-10-16 | 2016-04-20 | 广东奔朗新材料股份有限公司 | The compound Elastic abrasive body of resin metallic and make mould and preparation method |
| CN103551996B (en) * | 2013-10-28 | 2016-04-20 | 博深工具股份有限公司 | A kind of ceramic base diamond grinding block and preparation method |
| CN204686679U (en) * | 2014-12-15 | 2015-10-07 | 郑州凯达金刚石工具有限公司 | A kind of carbide alloy emery wheel |
| CN104669129B (en) * | 2015-02-11 | 2018-06-22 | 河南富莱特超硬磨具有限公司 | A kind of ceramics titanizing CBN grinding wheels and preparation method thereof |
| CN105058248A (en) * | 2015-08-04 | 2015-11-18 | 蓬莱市超硬复合材料有限公司 | Compound metal and ceramic bonding agent diamond grinding wheel |
| CN106392908A (en) * | 2016-05-30 | 2017-02-15 | 广东工业大学 | Diamond grinding wheel with ceramic binders and production method thereof |
-
2018
- 2018-06-29 CN CN202010911708.8A patent/CN111993294B/en active Active
- 2018-06-29 CN CN201810712332.0A patent/CN108747854B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN108747854A (en) | 2018-11-06 |
| CN108747854B (en) | 2020-09-25 |
| CN111993294A (en) | 2020-11-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111217611B (en) | Aluminum nitride and boron nitride composite ceramic material and preparation method thereof | |
| CN104440597B (en) | Diamond grinding wheel made of resin and ceramic composite materials and manufacturing method thereof | |
| CN102814759A (en) | Diamond resin grinding wheel and preparation method thereof | |
| CN111993294B (en) | Preparation method of ceramic bond diamond grinding wheel with low-temperature thermosetting type adhesion layer | |
| CN102825557A (en) | Polyvinyl acetal resin grinding wheel and production method thereof | |
| CN102814745A (en) | Fused zirconia alumina resin grinding wheel and method for preparing same | |
| CN104669129A (en) | Ceramics titanizing CBN (cubic boron nitride) grinding wheel and preparation method thereof | |
| CN113788680B (en) | Nano ceramic bond cBN pore grinding wheel and preparation method thereof | |
| CN109262477B (en) | Ceramic-metal composite bonding agent, diamond dressing roller obtained by using same and preparation method of roller | |
| CN111975659B (en) | Method for preparing cold saw grinding wheel with single bevel edge structure | |
| CN107398836A (en) | A kind of bonding agent, semiconductor packages processing ultra-thin emery wheel and preparation method thereof | |
| CN105538175A (en) | Polymer composite grinding wheel substrate and preparation method thereof | |
| CN104440610A (en) | High-precision drum-type resin binder diamond grinding wheel and manufacturing method thereof | |
| CN104772693A (en) | Diamond grinding pad for processing super-hard ceramics and preparation method for diamond grinding pad | |
| CN107378802B (en) | A kind of grinding wheel and preparation method thereof for QFN encapsulation chip cutting | |
| CN113635226B (en) | Ceramic internal grinding wheel grinding complex, double-layer grinding wheel and preparation method | |
| CN114478054B (en) | Porous ceramic and preparation method thereof | |
| CN115415944A (en) | Silicon carbide wafer thinning grinding wheel, preparation method and processing equipment comprising silicon carbide wafer thinning grinding wheel | |
| CN216327673U (en) | Embedded transition layer ceramic CBN circular arc grinding wheel | |
| CN103624701A (en) | Method for manufacturing grinding wheel for polishing rail | |
| CN113319746A (en) | Embedded transition layer ceramic CBN arc grinding wheel and preparation method thereof | |
| CN111702670A (en) | Ultrathin ceramic diamond grinding wheel and preparation method thereof | |
| CN112140014A (en) | Resin centerless grinding CBN grinding wheel for electrochemical auxiliary machining and preparation method thereof | |
| CN111300288B (en) | Grinding wheel for grinding electronic packaging substrate material and preparation method thereof | |
| CN112476256B (en) | Method for manufacturing composite binder grinding wheel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |