CN111988951A - Capillary supporting structure of temperature equalizing plate - Google Patents
Capillary supporting structure of temperature equalizing plate Download PDFInfo
- Publication number
- CN111988951A CN111988951A CN201910436932.3A CN201910436932A CN111988951A CN 111988951 A CN111988951 A CN 111988951A CN 201910436932 A CN201910436932 A CN 201910436932A CN 111988951 A CN111988951 A CN 111988951A
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- CN
- China
- Prior art keywords
- plate
- capillary
- supporting
- capillary support
- support structure
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000005530 etching Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A capillary supporting structure of a temperature equalizing plate comprises a plate-shaped shell and a capillary supporting plate arranged in the plate-shaped shell, wherein the capillary supporting plate is divided into an upper layer part and a lower layer part by the thickness of the capillary supporting plate, the upper layer part forms an upper supporting part and an upper naked hollow part which are arranged adjacent to each other on the capillary supporting plate in a first direction, the lower layer part forms a lower supporting part and a lower naked hollow part which are arranged adjacent to each other on the capillary supporting plate in a second direction, and capillary channels are arranged on the upper supporting part and the lower supporting part. Therefore, the effect of capillary and support in the temperature-uniforming plate can be provided simultaneously under the requirement of thinning.
Description
Technical Field
The present invention relates to a heat transfer structure, and more particularly, to a capillary support structure of a vapor chamber.
Background
Due to the demand for thinner 3C electronic products, elements such as temperature equalization plates, which are used as internal heat dissipation and heat transfer elements, are also required to be thinner. However, in a typical vapor chamber, in addition to the thickness of the upper and lower plate bodies, it is important that the vapor space inside the vapor chamber is sufficient, and conventionally, a support structure is usually provided in the vapor space to ensure the existence of the vapor space and avoid affecting the heat exchange effect inside the vapor chamber.
However, under the above-mentioned requirement of thinning, many of the vapor chambers have a thinner thickness and no supporting structure for the vapor space inside the vapor chambers. Thus, the vapor space is often in a vacuum state, so that the excessively thin plate body cannot bear the external pressure and is recessed inwards, and the existence of the vapor space is influenced.
Disclosure of Invention
The primary objective of the present invention is to provide a capillary support structure for a vapor chamber, which can be disposed in the vapor chamber and provide both capillary and support effects.
In order to achieve the above object, the present invention provides a capillary support structure of a temperature equalization plate, comprising a plate-shaped housing and a capillary support plate disposed in the plate-shaped housing, wherein the capillary support plate is divided into an upper layer portion and a lower layer portion by its thickness, the upper layer portion forms an upper support portion and an upper empty portion arranged adjacent to each other on the capillary support plate in a first direction, the lower layer portion forms a lower support portion and a lower empty portion arranged adjacent to each other on the capillary support plate in a second direction, and the upper support portion and the lower support portion are both provided with capillary channels.
The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.
Drawings
FIG. 1 is an exploded perspective view of the present invention;
FIG. 2 is an enlarged detail view of section A of FIG. 1;
FIG. 3 is a perspective assembly view of the present invention;
FIG. 4 is an enlarged detail view of portion B of FIG. 3;
FIG. 5 is a schematic plan view of the present invention;
FIG. 6 is a cross-sectional view taken along line 6-6 of FIG. 5;
fig. 7 is a cross-sectional view of fig. 5 taken along line 7-7.
Wherein the reference numerals
Plate-shaped housing 1
Upper bare hollow 201 capillary channel 202
Lower bare hollow 211 capillary channel 212
Detailed Description
For a better understanding of the nature and technical aspects of the present invention, reference should be made to the following detailed description of the invention, taken in conjunction with the accompanying drawings, which are provided for purposes of illustration and description, and are not intended to limit the invention.
Please refer to fig. 1 and fig. 2, which are a schematic exploded view of the present invention and an enlarged detail view of a portion a of fig. 1, respectively. The invention provides a capillary supporting structure of a temperature-uniforming plate, which comprises a plate-shaped shell 1 and a capillary supporting plate 2 arranged in the plate-shaped shell 1; wherein:
The plate-shaped casing 1 can be divided into a bottom plate 10 and a top plate 11, and after the capillary support plate 2 is clamped up and down, three layers of plates are attached and sealed by processing such as electric welding, and the capillary support plate 2 can be sealed in the plate-shaped casing 1 and subjected to vacuum cavitation.
As shown in fig. 3 and 4, the capillary support plate 2 may be a metal plate, such as a copper plate, disposed in the plate-shaped housing 1, and a frame 22 may be formed at an outer periphery thereof, so that the bottom plate 10 and the top plate 11 are clamped on the frame 22 of the capillary support plate 2 and can be sealed in the plate-shaped housing 1 when sealing is performed. The capillary support plate 2 can be fabricated by processes such as etching to form the following structure: the capillary support plate 2 is divided into an upper portion 20 and a lower portion 21 by the thickness of the capillary support plate 2, the upper portion 20 forms an upper support portion 200 and an upper bare portion 201 arranged adjacent to each other on the capillary support plate 2 in a first direction, the lower portion 21 forms a lower support portion 210 and a lower bare portion 211 arranged adjacent to each other on the capillary support plate 2 in a second direction, and the upper support portion 200 and the lower support portion 210 are both provided with capillary channels 202 and 212.
Referring to fig. 5 and 6, in more detail, the upper portion 20 exceeds the thickness of the capillary support plate 2 by more than half, and the lower portion 21 also exceeds the thickness of the capillary support plate 2 by more than half; thus, the upper and lower layers 20 and 21 can maintain the overlapped portion of the upper and lower supports 200 and 210 to form the integral state of the capillary support plate 2. In addition, the capillary channels 202 and 212 on the upper and lower supporting portions 200 and 210 may also be configured as grooves respectively matching with the first direction and the second direction, so that the working fluid (not shown) sealed in the accommodating space 100 can be spread or distributed on the plate surface of the plate-shaped housing 1 by performing capillary action along the first or second direction, thereby achieving the effect of uniform heat transfer.
As shown in fig. 5 and 7, since the first direction and the second direction are staggered on the projection of the plate surface of the plate-shaped shell 1, the upper empty portion 201 of the upper portion 20 of the capillary support sample 2 overlaps with the lower empty portion 211 of the lower portion 21, and the overlapped portions thereof form a vapor space directly communicating the bottom plate 10 and the top plate 11 of the plate-shaped shell 1, so as to maintain the vapor flow smoothly and without obstruction within the shortest distance (i.e., the thickness of the capillary support plate 2), thereby facilitating the heat exchange of the temperature equalization plate and ensuring the function and effect thereof. Particularly, the present invention can effectively maintain the existence of the vapor space and prevent the occurrence of problems such as the concave of the plate-like casing 1, under the precondition that the upper part 20 of the capillary support plate 2 is attached to the inner surface of the top plate 11 and the lower part 21 is attached to the inner surface of the bottom plate 10.
Therefore, the capillary supporting structure of the temperature equalization plate can be obtained by the above structural composition.
The present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof, and it should be understood that various changes and modifications can be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (9)
1. A vapor plate capillary support structure, comprising:
a plate-shaped housing; and
the capillary supporting plate is arranged in the plate-shaped shell and is divided into an upper layer part and a lower layer part by the thickness of the capillary supporting plate, the upper layer part forms an upper supporting part and an upper naked hollow part which are arranged adjacently with each other on the capillary supporting plate in a first direction, the lower layer part forms a lower supporting part and a lower naked hollow part which are arranged adjacently with each other on the capillary supporting plate in a second direction, and the upper supporting part and the lower supporting part are both provided with capillary channels.
2. The vapor plate capillary support structure of claim 1, wherein the plate-like housing has a bottom plate and a top plate.
3. The capillary support structure of claim 2, wherein the capillary support plate has a rim formed on the outer periphery thereof, and the bottom plate and the top plate are clamped to the rim of the capillary support plate and sealed.
4. The vapor plate capillary support structure of claim 1, wherein the capillary support plate is a metal plate.
5. The vapor chamber capillary support structure of claims 1 or 4, wherein the capillary support plate is formed by etching.
6. The vapor plate capillary support structure of claim 1, wherein the upper layer portion exceeds more than half of the thickness of the capillary support plate.
7. The vapor plate capillary support structure of claim 1 or 6, wherein the lower layer portion exceeds more than half of the thickness of the capillary support plate.
8. The capillary support structure of claim 1, wherein the capillary channels of the upper and lower support members are configured as grooves corresponding to the first and second directions, respectively.
9. The vapor chamber capillary support structure of claim 1, wherein the first direction and the second direction are staggered with respect to each other in a projection of a plate surface of the plate-shaped housing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910436932.3A CN111988951A (en) | 2019-05-23 | 2019-05-23 | Capillary supporting structure of temperature equalizing plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910436932.3A CN111988951A (en) | 2019-05-23 | 2019-05-23 | Capillary supporting structure of temperature equalizing plate |
Publications (1)
Publication Number | Publication Date |
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CN111988951A true CN111988951A (en) | 2020-11-24 |
Family
ID=73436930
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910436932.3A Pending CN111988951A (en) | 2019-05-23 | 2019-05-23 | Capillary supporting structure of temperature equalizing plate |
Country Status (1)
Country | Link |
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CN (1) | CN111988951A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20240060723A1 (en) * | 2022-08-19 | 2024-02-22 | Simmonds Precision Products, Inc. | Phase change material (pcm) heatsinks |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200912237A (en) * | 2007-09-13 | 2009-03-16 | Univ Tamkang | Thermal spreader with enhancement of support strength and capillarity |
CN101472450A (en) * | 2007-12-29 | 2009-07-01 | 私立淡江大学 | Soakage device capable of reinforcing supporting strength and capillary action |
US20110027738A1 (en) * | 2009-07-30 | 2011-02-03 | Meyer Iv George Anthony | Supporting structure with height difference and vapor chamber having the supporting structure |
CN104994704A (en) * | 2015-03-16 | 2015-10-21 | 中航光电科技股份有限公司 | Cold plate radiator |
TW201621253A (en) * | 2014-12-05 | 2016-06-16 | Asia Vital Components Co Ltd | Supporting structure for vapor chamber |
-
2019
- 2019-05-23 CN CN201910436932.3A patent/CN111988951A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200912237A (en) * | 2007-09-13 | 2009-03-16 | Univ Tamkang | Thermal spreader with enhancement of support strength and capillarity |
CN101472450A (en) * | 2007-12-29 | 2009-07-01 | 私立淡江大学 | Soakage device capable of reinforcing supporting strength and capillary action |
US20110027738A1 (en) * | 2009-07-30 | 2011-02-03 | Meyer Iv George Anthony | Supporting structure with height difference and vapor chamber having the supporting structure |
TW201621253A (en) * | 2014-12-05 | 2016-06-16 | Asia Vital Components Co Ltd | Supporting structure for vapor chamber |
CN104994704A (en) * | 2015-03-16 | 2015-10-21 | 中航光电科技股份有限公司 | Cold plate radiator |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20240060723A1 (en) * | 2022-08-19 | 2024-02-22 | Simmonds Precision Products, Inc. | Phase change material (pcm) heatsinks |
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Application publication date: 20201124 |
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