CN111988951A - Vapor Chamber Capillary Support Structure - Google Patents
Vapor Chamber Capillary Support Structure Download PDFInfo
- Publication number
- CN111988951A CN111988951A CN201910436932.3A CN201910436932A CN111988951A CN 111988951 A CN111988951 A CN 111988951A CN 201910436932 A CN201910436932 A CN 201910436932A CN 111988951 A CN111988951 A CN 111988951A
- Authority
- CN
- China
- Prior art keywords
- plate
- capillary
- capillary support
- support
- support structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
一种均温板毛细支撑结构,包括一板状壳体、以及一设于板状壳体内的毛细支撑板,毛细支撑板以其厚度而区隔有一上层部与一下层部,上层部以一第一方向于毛细支撑板上形成彼此相邻排列的上支撑部与上裸空部,而下层部以一第二方向于毛细支撑板上形成彼此相邻排列的下支撑部与下裸空部,且上支撑部与下支撑部上皆设有毛细通道。藉此可在薄化的要求下,同时提供均温板内毛细与支撑的效果。
A capillary support structure for a temperature-vaporizing plate includes a plate-shaped shell and a capillary support plate disposed in the plate-shaped shell. The capillary support plate is divided into an upper layer and a lower layer by its thickness. The upper layer forms an upper support portion and an upper bare portion arranged adjacent to each other on the capillary support plate in a first direction, and the lower layer forms a lower support portion and a lower bare portion arranged adjacent to each other on the capillary support plate in a second direction, and capillary channels are disposed on both the upper support portion and the lower support portion. Thus, the capillary and support effects in the temperature-vaporizing plate can be provided at the same time under the requirement of thinness.
Description
技术领域technical field
本发明涉及一种热传结构,尤其涉及一种均温板毛细支撑结构。The invention relates to a heat transfer structure, in particular to a capillary support structure for a temperature chamber.
背景技术Background technique
由于现今3C电子产品薄型化的需求,作为其内部进行散热、传热元件的均温板等元件,也被要求必须薄型化。然而,一般的均温板,除了其上、下板体的厚度外,最重要的是内部的蒸气空间必须足够,且以往通常会于蒸气空间内设置支撑结构,以确保蒸气空间存在并避免影响内部的热交换作用。Due to the demand for thinning of 3C electronic products today, components such as vapor chambers that are used as heat dissipation and heat transfer components inside are also required to be thinned. However, in addition to the thickness of the upper and lower plates, the most important thing for a general temperature chamber is that the internal vapor space must be sufficient. In the past, a support structure was usually installed in the vapor space to ensure the existence of the vapor space and avoid influence. Internal heat exchange.
但在上述薄化的要求下,目前许多均温板除了上、下板体的厚度更薄外,其内部的蒸气空间也将支撑结构予以省略。如此,往往因蒸气空间呈真空状,造成过薄的板体无法承受外部的压力而向内凹入,影响蒸气空间的存在。However, under the requirements of the above-mentioned thinning, in addition to the thinner upper and lower plate bodies of many current vapor chambers, the support structure is also omitted in the internal vapor space. In this way, because the vapor space is in a vacuum shape, the too thin plate body cannot withstand the external pressure and is concave inward, which affects the existence of the vapor space.
发明内容SUMMARY OF THE INVENTION
本发明的主要目的,在于可提供一种均温板毛细支撑结构,其可在薄化的要求下,设于均温板内并同时提供毛细与支撑的效果。The main purpose of the present invention is to provide a capillary support structure for the vapor chamber, which can be installed in the vapor chamber under the requirement of thinning and simultaneously provide capillary and support effects.
为了达成上述的目的,本发明提供一种均温板毛细支撑结构,包括一板状壳体、以及一设于板状壳体内的毛细支撑板,毛细支撑板以其厚度而区隔有一上层部与一下层部,上层部以一第一方向于毛细支撑板上形成彼此相邻排列的上支撑部与上裸空部,而下层部以一第二方向于毛细支撑板上形成彼此相邻排列的下支撑部与下裸空部,且上支撑部与下支撑部上皆设有毛细通道。In order to achieve the above-mentioned purpose, the present invention provides a capillary support structure for a vapor chamber, which includes a plate-shaped shell and a capillary support plate disposed in the plate-shaped shell, and the capillary support plate is divided into an upper layer by its thickness. and the lower layer part, the upper layer part forms an upper support part and an upper bare part adjacent to each other on the capillary support plate in a first direction, and the lower layer part forms an adjacent arrangement on the capillary support plate in a second direction The lower support part and the lower bare hollow part are provided with capillary channels on both the upper support part and the lower support part.
以下结合附图和具体实施例对本发明进行详细描述,但不作为对本发明的限定。The present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not intended to limit the present invention.
附图说明Description of drawings
图1为本发明的立体分解示意图;Fig. 1 is the three-dimensional exploded schematic diagram of the present invention;
图2为图1的A部分放大详图;Fig. 2 is the enlarged detail view of A part of Fig. 1;
图3为本发明的立体组合示意图;Fig. 3 is the stereoscopic combination schematic diagram of the present invention;
图4为图3的B部分放大详图;Fig. 4 is the enlarged detailed view of B part of Fig. 3;
图5为本发明的平面组合示意图;Fig. 5 is the plane combination schematic diagram of the present invention;
图6为图5的6-6断面剖示图;Fig. 6 is the sectional view of 6-6 of Fig. 5;
图7为图5的7-7断面剖示图。FIG. 7 is a cross-sectional view taken along the line 7-7 of FIG. 5 .
其中,附图标记where the reference number
板状壳体 1plate shell 1
底板 10
顶板 11
毛细支撑板 2
上层部 20 上支撑部 200
上裸空部 201 毛细通道 202Upper Bare Hole 201 Capillary Channel 202
下层部 21 下支撑部 210
下裸空部 211 毛细通道 212Lower Bare Hole 211 Capillary Channel 212
框边 22
具体实施方式Detailed ways
为了能更进一步了解本发明的特征及技术内容,请参阅以下有关本发明的详细说明与附图,然而所附的附图仅提供参考与说明用,并非用来对本发明加以限制。In order to further understand the features and technical content of the present invention, please refer to the following detailed description of the present invention and the accompanying drawings, however, the accompanying drawings are only for reference and description, and are not intended to limit the present invention.
请参阅图1及图2,分别为本发明的立体分解示意图及图1的A部分放大详图。本发明提供一种均温板毛细支撑结构,包括一板状壳体1、以及一设于该板状壳体1内的毛细支撑板2;其中:Please refer to FIG. 1 and FIG. 2 , which are an exploded perspective view of the present invention and an enlarged detailed view of part A of FIG. 1 , respectively. The present invention provides a capillary support structure for a uniform temperature plate, comprising a plate-shaped shell 1 and a
该板状壳体1可分为一底板10与一顶板11,并用以上、下夹置上述毛细支撑板2后,使三层板相贴接并通过如电焊等加工而封边,进而能将该毛细支撑板2密闭于该板状壳体1内并加以真空化。The plate-shaped shell 1 can be divided into a
如图3及图4所示,该毛细支撑板2可为一金属板构成,例如铜板,设于上述板状壳体1内,并可于其外周缘形成一框边22,以供底板10与顶板11夹置于该毛细支撑板2的框边22上,而能进行封边时一并被密封于板状壳体1内。该毛细支撑板2可通过如蚀刻等加工制成而构成以下结构:以毛细支撑板2的厚度而区隔有一上层部20与一下层部21,上层部20以一第一方向于毛细支撑板2上形成彼此相邻排列的上支撑部200与上裸空部201,而下层部21以一第二方向于毛细支撑板2上形成彼此相邻排列的下支撑部210与下裸空部211,且上支撑部200与下支撑部210上皆设有毛细通道202、212。As shown in FIG. 3 and FIG. 4 , the
再请参阅图5、6及所示,更详细地,上述上层部20超过毛细支撑板2的厚度一半以上,而下层部21同样超过毛细支撑板2的厚度一半以上;如此,上、下层部20、21仍可维持着上、下支撑部200、210相互重叠的部分而构成毛细支撑板2一体的型态。此外,位于上、下支撑部200、210上的毛细通道202、212,亦可分别配合所述第一方向与第二方向而构成沟槽状者,进而便于封存于容置空间100内的工作流体(图略),可依循着所述第一或第二方向进行毛细作用而扩散或分布于板状壳体1的板面上,以达到均匀热传的效果。5, 6 and shown, in more detail, the
再者,请一并参阅图5及7所示,由于所述第一方向与所述第二方向是在上述板状壳体1的板面投影上呈彼此交错,因此毛细支撑样2的上层部20的上裸空部201,会与下层部21的下裸空部211相互重叠,故其彼此相互重叠的部分,可构成直接连通板状壳体1的底板10与顶板11的蒸气空间,以在维持最短的距离内(即毛细支撑板2的厚度)保持蒸气流通的顺畅且无阻碍,进而便于均温板进行热交换而确保其作用与效果。尤其在上述毛细支撑板2以其上层部20贴接顶板11内面、下层部21贴接底板10内面的前题下,本发明可有效维特所述蒸气空间的存在,防止板状壳体1内凹等问题产生。Furthermore, please refer to FIGS. 5 and 7 together, since the first direction and the second direction are staggered on the projection of the plate surface of the plate shell 1, the upper layer of the
所以,藉由上述的构造组成,即可得到本发明均温板毛细支撑结构。Therefore, the capillary support structure of the vapor chamber of the present invention can be obtained by the above structure.
当然,本发明还可有其它多种实施例,在不背离本发明精神及其实质的情况下,熟悉本领域的技术人员当可根据本发明作出各种相应的改变和变形,但这些相应的改变和变形都应属于本发明所附的权利要求的保护范围。Of course, the present invention can also have other various embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding Changes and deformations should belong to the protection scope of the appended claims of the present invention.
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910436932.3A CN111988951A (en) | 2019-05-23 | 2019-05-23 | Vapor Chamber Capillary Support Structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910436932.3A CN111988951A (en) | 2019-05-23 | 2019-05-23 | Vapor Chamber Capillary Support Structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN111988951A true CN111988951A (en) | 2020-11-24 |
Family
ID=73436930
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910436932.3A Pending CN111988951A (en) | 2019-05-23 | 2019-05-23 | Vapor Chamber Capillary Support Structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111988951A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20240060723A1 (en) * | 2022-08-19 | 2024-02-22 | Simmonds Precision Products, Inc. | Phase change material (pcm) heatsinks |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200912237A (en) * | 2007-09-13 | 2009-03-16 | Univ Tamkang | Thermal spreader with enhancement of support strength and capillarity |
CN101472450A (en) * | 2007-12-29 | 2009-07-01 | 私立淡江大学 | Soaking device capable of enhancing supporting strength and capillary action |
US20110027738A1 (en) * | 2009-07-30 | 2011-02-03 | Meyer Iv George Anthony | Supporting structure with height difference and vapor chamber having the supporting structure |
CN104994704A (en) * | 2015-03-16 | 2015-10-21 | 中航光电科技股份有限公司 | Cold plate radiator |
TW201621253A (en) * | 2014-12-05 | 2016-06-16 | Asia Vital Components Co Ltd | Supporting structure for vapor chamber |
-
2019
- 2019-05-23 CN CN201910436932.3A patent/CN111988951A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200912237A (en) * | 2007-09-13 | 2009-03-16 | Univ Tamkang | Thermal spreader with enhancement of support strength and capillarity |
CN101472450A (en) * | 2007-12-29 | 2009-07-01 | 私立淡江大学 | Soaking device capable of enhancing supporting strength and capillary action |
US20110027738A1 (en) * | 2009-07-30 | 2011-02-03 | Meyer Iv George Anthony | Supporting structure with height difference and vapor chamber having the supporting structure |
TW201621253A (en) * | 2014-12-05 | 2016-06-16 | Asia Vital Components Co Ltd | Supporting structure for vapor chamber |
CN104994704A (en) * | 2015-03-16 | 2015-10-21 | 中航光电科技股份有限公司 | Cold plate radiator |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20240060723A1 (en) * | 2022-08-19 | 2024-02-22 | Simmonds Precision Products, Inc. | Phase change material (pcm) heatsinks |
US12163740B2 (en) * | 2022-08-19 | 2024-12-10 | Simmonds Precision Products, Inc. | Phase change material (PCM) heatsinks |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6705423B2 (en) | Power converter | |
US11516940B2 (en) | Middle bezel frame with heat dissipation structure | |
US9664458B2 (en) | Supporting structure for vapor chamber | |
US20110315351A1 (en) | Vapor chamber having composite supporting structure | |
US20170010048A1 (en) | Thin vapor chamber and manufacturing method thereof | |
CN107801358B (en) | Pass-through structure of cooling unit | |
CN111988951A (en) | Vapor Chamber Capillary Support Structure | |
US10473404B2 (en) | Straight-through structure of heat dissipation unit | |
US20130092353A1 (en) | Vapor chamber structure and method of manufacturing same | |
CN112857110B (en) | Method for manufacturing flat heat pipe | |
US20240344774A1 (en) | Manufacturing method of heat pipe structure | |
TWM556466U (en) | Direct-through structure of heat-dissipation unit | |
TW202144724A (en) | Temperature-uniformizing board structure and temperature-uniformizing board panel | |
CN112867335B (en) | Temperature equalizing plate and assembling method thereof | |
TW201315359A (en) | Heat dissipation device and a manufacturing method thereof | |
TWI695962B (en) | Supportable wick structure of a vapor chamber | |
JPWO2023238681A5 (en) | ||
CN107846819A (en) | Airtight penetrating structure of heat dissipation device | |
CN207491438U (en) | Straight-through structure of cooling unit | |
TWM590263U (en) | Isothermal plate seal structure | |
TWI804767B (en) | Vapor chamber structure and capillary structure thereof | |
US20210088293A1 (en) | Heat transfer assembly | |
TWM593721U (en) | Thin vapor chamber | |
CN112665430A (en) | Thin type temperature-equalizing plate and manufacturing method thereof | |
TW201625893A (en) | Manufacturing method of flat-plate heat pipe structure |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
WD01 | Invention patent application deemed withdrawn after publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20201124 |