CN111987011B - Air curtain control system - Google Patents
Air curtain control system Download PDFInfo
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- CN111987011B CN111987011B CN201910425585.4A CN201910425585A CN111987011B CN 111987011 B CN111987011 B CN 111987011B CN 201910425585 A CN201910425585 A CN 201910425585A CN 111987011 B CN111987011 B CN 111987011B
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- 238000010926 purge Methods 0.000 claims description 13
- 238000001914 filtration Methods 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 81
- 239000007789 gas Substances 0.000 description 52
- 238000000034 method Methods 0.000 description 21
- 230000008569 process Effects 0.000 description 19
- 238000007664 blowing Methods 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 238000007789 sealing Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Ventilation (AREA)
Abstract
An air curtain control system is coupled to a wafer carrier that includes at least a door assembly. The air curtain control system comprises a blowing-off module, a humidity sensing unit and a control unit. The blowing-off module includes: the air curtain module is arranged above the door assembly corresponding to the wafer carrying device, and the blowing-off module provides air flow for the air curtain module; the air purifying pipeline is used for enabling air flow to the air curtain module; and a mass flow controller connected with the air curtain module through the air purifying pipeline. The humidity sensing unit is used for detecting the humidity value of the gas in the wafer box; the control unit receives the humidity value detected by the humidity sensing unit, and compares the received humidity value with a preset value to control the mass flow controller to adjust the flow rate of the air flow provided with the air curtain module.
Description
Technical Field
The present invention relates to a wafer loading system in the field of semiconductor technology, and more particularly, to a system for blowing out an external environment using an air curtain module when a wafer cassette is used for carrying wafers.
Background
The utility model discloses a gas curtain device for among wafer production facility, for example in taiwan novel patent publication No. M565395 specifically discloses a gas curtain device, can simply install in the place ahead of wafer box and form the air current wall, see through the blowing-off of air current wall, particle, the dirty etc. of external environment will be difficult for getting into the wafer box, in order to improve the wafer and receive the pollution of external environment.
The patent provides that when the control module controls the opening of the wafer box, the inflation module is controlled to inflate the inside of the wafer box, and the air curtain device is controlled to act at the same time, so that the air curtain device blows out the opening position of the wafer box. However, for convenience, the air flow used by the air curtain device for blowing is fixed, cannot be regulated and controlled, and cannot monitor the humidity of the air in the wafer box to adjust the air flow. In order to maintain the optimal humidity state of the wafer and prevent particles and dirt from entering the wafer box during the use process, a great amount of air flow needs to be consumed for a long time, and the problem of high use cost exists.
Disclosure of Invention
In view of the shortcomings of the prior art, a primary object of the present invention is to provide an air curtain control system for improving the problem of excessive consumption of the air flow used for blowing.
According to the above object, the present invention provides an air curtain control system connected to a wafer carrier apparatus, the wafer carrier apparatus at least comprises: the bearing unit is used for bearing the wafer box with the movable door, and is provided with at least one exhaust port used for exhausting the gas flowing in the wafer box; and a door assembly for opening/closing a movable door of the wafer cassette, wherein the air curtain control system comprises a blowing-out module, a humidity sensing unit and a control unit.
The blowing-off module is arranged in the wafer carrying device and comprises an air curtain module, at least one air purifying pipeline and at least one mass flow controller, wherein the air curtain module is arranged above a door assembly corresponding to the wafer carrying device, and the blowing-off module provides air flow for the air curtain module; the air flow flows to the air curtain module through at least one clean air pipeline; the mass flow controller is connected with the air curtain module through the air purifying pipeline. The humidity sensing unit is used for detecting the humidity value of the gas in the wafer box; the control unit receives the humidity value detected by the humidity sensing unit, compares the received humidity value with a preset value, and controls the mass flow controller to adjust the flow rate of the air flow provided with the air curtain module, so that the humidity value of the air in the wafer box is lower than the preset value.
The humidity sensing unit of the air curtain control system is arranged on the exhaust pipeline of the wafer carrying device and is close to the exhaust port, so that the humidity value of the gas in the exhaust pipeline can be conveniently detected at any time, after the test verification, the change of the humidity value of the gas in the exhaust pipeline to the blowing-out time is similar to the change of the humidity value of the gas in the wafer box to the blowing-out time, and therefore, the detected result of the humidity sensing unit can represent the humidity value of the gas in the wafer box. The air curtain control system can improve the control convenience and the operation simplicity of controlling the flow rate of the air flow provided to the air curtain module.
Drawings
Fig. 1A and 1B are schematic diagrams illustrating configurations of an air curtain control system and a wafer carrier apparatus according to the present invention.
FIG. 2 is a block diagram of an air curtain control system and a wafer carrier apparatus for performing an inflation process and a purge process according to the present invention.
Fig. 3 is a schematic view showing the structure of an air curtain module in an air curtain control system according to the technology of the present invention.
FIG. 4 is a block diagram illustrating a purge flow of an air curtain control system in accordance with the teachings of the present invention.
Detailed Description
So that the manner in which the above recited objects, features and advantages of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. The drawings referred to below are illustrative of features of the present invention and are not necessarily drawn to scale. The description of the embodiments related to the technology known to those skilled in the art will not be further described.
First, referring to fig. 1A and 1B, fig. 1A and 1B are schematic diagrams illustrating the configuration of the air curtain control system and the wafer carrier apparatus, respectively. The wafer carrier apparatus 100 of the present invention may at least comprise a carrying unit a and a door assembly A1, wherein the carrying unit a comprises a contact surface 112 for carrying a front opening unified pod 300 (FOUP, hereinafter simply referred to as "wafer pod"); the door assembly A1 is used to open the movable door 301 of the wafer cassette 300 disposed on the contact tray surface 112 and to bring the movable door 301 away from the wafer cassette 300, so as to communicate the interior of the wafer cassette 300 with the external environment. Accordingly, an external robot or personnel may pick and place wafers (not shown) from the cassette 300 as desired; actuation of the door assembly A1 may be in accordance with control instructions of a user or end-user. In addition, the air curtain control system 200 of the present invention further includes an air curtain module 21, which is particularly suitable for the wafer carrier apparatus 100. The air curtain module 21 may be fixedly disposed on one side of the wafer carrier apparatus 100, and is preferably disposed correspondingly above the door assembly A1 of the wafer carrier apparatus 100. When the door assembly A1 drives the movable door 301 of the wafer cassette 300 to open, the air curtain module 21 continuously and uniformly discharges the air flow provided by the first air supply device 24 (refer to fig. 2) in a predetermined direction (for example, in a direction towards the door assembly A1), so that, in a process that the internal space of the wafer cassette 300 is communicated with the external environment, an air flow wall AF is formed around (for example, in front of) a position where the movable door 301 is originally provided in the wafer cassette 300 by the air curtain module 21, thereby greatly reducing the probability that external dirt directly enters the interior of the wafer cassette 300.
The wafer carrier 100 has a frame 110, and the frame 110 is divided into a lower half 110B and an upper half 110A at a first side 111. The upper half 110A has a receiving space SF for receiving the wafer cassette 300, and a door assembly A1 is disposed on the other side of the receiving space SF of the upper half 110A. In addition, a purge module 201 is disposed in the lower half 110B of the wafer carrier apparatus 100. After the contact tray surface 112 is contacted and fixed with the wafer cassette 300, the contact tray surface 112 may be driven to partially move toward the door assembly A1 so that the movable door 301 of the wafer cassette 300 can be contacted with the door assembly A1 to open the movable door 301 of the wafer cassette 300.
The contact disc surface 112 comprises two protruding air charging nozzles 41 and two protruding air discharging openings 31, and the air charging nozzles 41 and the air discharging openings 31 are arranged on the periphery of the contact disc surface 112; and the charging nozzle 41 is connected with the charging pipe 40 (refer to fig. 2); the exhaust port 31 is connected to an exhaust line 30 (refer to fig. 2).
Referring to fig. 2, fig. 2 is a block diagram illustrating an air curtain control system and a wafer carrier apparatus according to the present invention for performing an air charging process, an air discharging process and a blowing process. Note that the gas filling process refers to introducing a gas into the wafer cassette 300; the exhaust flow refers to exhausting the gas AR from the inside of the wafer cassette 300; the blowing-out process is to form an air flow wall AF by using the air curtain module 21 to the position corresponding to the original position of the wafer box 300 where the movable door 301 is provided, for example, the front, and the purpose of the blowing-out process is to isolate the wafer box 300 from the external environment, so that the air AR in the wafer box 300 can be prevented from being polluted, the humidity is kept low, and the moisture and pollutants in the wafer box 300 can be taken away.
First, the flow of gas filling in the wafer carrier apparatus will be described. The wafer carrier apparatus 100 has an inflation process performed by an inflation line 40, an inflation nozzle 41, a second air supply device 42, and an inflation switch 43. The second gas supply device 42, the gas charging switch 43 and the gas charging nozzle 41 are connected by using the gas charging pipeline 40, in this embodiment, the gas is introduced into the gas charging pipeline 40 by the second gas supply device 42, the flow rate of the gas entering and exiting the gas charging pipeline 40 is controlled by the gas charging switch 43, and finally the gas is introduced into the gas charging nozzle 41, and the flow rate of the gas charging to the wafer box 300 by the gas charging nozzle 41 is regulated by a valve assembly (not shown).
Next, an exhaust flow of the wafer transfer apparatus 100 will be described. The exhaust flow of the wafer carrier apparatus 100 is achieved by the exhaust pipe 30, the exhaust port 31, the auxiliary exhaust unit 32 and the exhaust unit 33, and the exhaust port 31, the auxiliary exhaust unit 32 and the exhaust unit 33 are connected by the exhaust pipe 30. In the above-mentioned inflation process, after the gas is inflated into the wafer cassette 300 by the inflation nozzle 41 through the inflation tube 40, the inflation nozzle 41, the second gas supply device 42 and the inflation switch 43, the gas in the wafer cassette 300 enters the gas outlet 31 provided on the contact plate surface 112 and enters the gas outlet tube 30. In the embodiment of the present invention, the humidity sensing unit 1 is disposed at the exhaust duct 30 and close to the exhaust port 31 on the contact tray surface 112. The exhaust unit 33 is used for exhausting the gas in the exhaust pipeline 30 towards the direction away from the inner space of the wafer box 300. In another embodiment, the auxiliary exhaust unit 32 is communicated with the charging pipeline 40, and the gas in the charging pipeline 40 can enter the auxiliary exhaust unit 32, so that the auxiliary exhaust unit 32 accelerates the gas in the exhaust pipeline 30 to enter the exhaust unit 33 and is discharged outwards.
Next, a blowing-out process is described, which is performed by the air curtain control system 200, and the air curtain control system 200 includes a blowing-out module 201, a humidity sensing unit 1, and a control unit 2. The purge module 201 is composed of a purge line 20 connecting a gas curtain module 21, a mass flow controller 22, a purge switch assembly 23, a first gas supply device 24, a purge pressure detection unit 25, and a gas filter unit 26. The first air supply device 24 is used for supplying air flow, and the air flow sequentially flows through the air purifying pipeline 20 and comprises an air purifying pressure detecting unit 25, an air purifying switch assembly 23, a mass flow controller 22 and an air filtering unit 26, and finally flows to the air curtain module 21 to be converged and discharged, so as to form an air flow wall AF as shown in FIG. 1A.
The humidity sensor 1 is configured to detect a humidity value of the gas AR in the wafer cassette 300 and transmit the humidity value to the control unit 2. The humidity of the gas AR in the wafer cassette 300 is preferably not more than a predetermined value; the preset value is preferably in the range of 5% to 10%, more preferably in the range of 5% to 7%, and most preferably in the range of 5%. After receiving the humidity value detected by the humidity sensing unit 1, the control unit 2 compares the received humidity value with a preset value to control the mass flow controller 22 to adjust the flow rate of the air flow provided with the air curtain module 21, so that the humidity value of the air AR in the wafer box 300 can be below the preset value. For example, when the preset value is 5%, the control unit 2 determines that the received humidity value is higher than 5%, and controls the mass flow controller 22 to gradually increase the flow rate of the air flow provided to the air curtain module 21; otherwise, when the received humidity value is below 5%, the mass flow controller 22 is controlled to gradually decrease the flow rate of the air flow supplied to the air curtain module 21. In one embodiment, the first gas supply device 24 can generate a predetermined gas flow into the clean gas line 20, for example, the first gas supply device 24 can provide various clean gases (such as XCDA, CDA) or inert gases (such as nitrogen). The air pressure detecting unit 25 is used for measuring the air pressure value of the air flow supplied from the first air supply device 24, and optionally comprises an air pressure valve. The mass flow controller 22 is electrically connected to the control unit 2, and can cooperate with the flow control mechanism of the first air supply device 24 to control the air flow rate of the air purifying pipe 20 connected thereto more finely and precisely.
Referring next to fig. 3, fig. 3 is a schematic structural diagram of an air curtain module in the air curtain control system according to the present invention. The air curtain module 21 comprises a body 10, two filter plates 12, and two purge lines 20. The body 10 may be hollow, and one side of the body 10 may be sealingly and fixedly provided with the cover 11. In practical applications, the cover 11 may be matched with a plurality of screws (not shown in the drawings) and related sealing members so as to be fixedly arranged on one side of the body 10 in a sealing manner; alternatively, the cover 11 may be adhered to one side of the body 10 by an adhesive.
The two filter plates 12 are sealingly fixed to the opposite side of the body 10 to the cover 11, and the two filter plates 12, the cover 11 and the inner side wall of the body 10 form a closed space SP inside the body 10. The two filter plates 12 may be sealingly fixed in the body 10 by using an adhesive, or the periphery of the two filter plates 12 may be sleeved with a sealing ring, and the two filter plates 12 may be sealingly fixed on one side of the body 10 through the sealing ring.
A side wall of the body 10 has two air intake holes 101, and the closed space SP can communicate with the outside through the two air intake holes 101. In the present embodiment, two air intake holes 101 are provided on one of the long side walls of the main body 10, but the two air intake holes 101 may be provided on one long side wall and one short side wall of the main body 10, or may be provided on different short side walls, or may be provided on the same short side wall. One end of the two air purifying pipelines 20 is correspondingly connected with the two air inlet holes 101, and the other end of each air purifying pipeline 20 is connected with the first air supply device 24. The first air supply device 24 provides an air flow continuously into the closed space SP of the air curtain module 21 through the air cleaning line 20, and when the air flow pressure in the closed space SP is greater than a predetermined pressure, the air flow in the closed space SP will pass through a plurality of air holes (not shown) of the respective filter plates 12 to uniformly discharge the air flow wall AF outwardly from the side of the air curtain module 21 where the filter plates 12 are disposed, performing a cleaning process on the position of the movable door 301 of the wafer cassette 300.
Referring to fig. 4, fig. 4 is a block diagram illustrating a blowing process performed by the air curtain control system according to the present invention. As shown in fig. 4, the blowing-off module 201 in the air curtain control system 200 of the present invention may include a secondary air purifying pipe 230 separated from the side of the air purifying pipe 20, where the secondary air purifying pipe 230 has a function of making the air flow passing through the air purifying pressure detecting unit 25 not directly flow into the mass flow controller 22, but making the air flow enter the air purifying switch assembly 23 first, where the air purifying switch assembly 23 receives the opening control signal of the control unit 2, and then continues to flow to the mass flow controller 22. The air-purifying switch assembly 23 is a switch that drives the flow of air to continue to the mass flow controller 22, and the air-purifying switch assembly 23 includes a secondary air-purifying line 230, an electric switch 231, a pneumatic switch 232, and a pressure valve 233. The auxiliary air purifying pipeline 230 is provided with a pressure valve 233 and an electric switch 231, one end of the auxiliary air purifying pipeline 230 is communicated with the air purifying pipeline 20, and the other end of the auxiliary air purifying pipeline 230 is connected with a pneumatic switch 232 arranged on the air purifying pipeline 20. The pressure valve 233 may be used to regulate the pressure of the airflow in the secondary air intake line 230.
The control unit 2 can control the opening and closing of the electric switch 231. When the control unit 2 controls the electric switch 231 to be turned on, two ends of the auxiliary air purifying pipeline 230 are mutually communicated, and air flows from the air purifying pipeline 20 into the auxiliary air purifying pipeline 230, so that a sensor (not shown) of the air purifying switch 232 can sense the air flow entering the auxiliary air purifying pipeline 230, and then the air purifying switch 232 arranged on the air purifying pipeline 20 is started, so that the air purifying pipeline 20 is in a communicated state. In other words, the pneumatic switch 232 is required to be turned on when the secondary air line 230 is not opened (i.e. the control unit 2 controls the electric switch 231 to be turned off), and the pneumatic switch 232 is turned off when the secondary air line 230 is not opened. Of course, in different applications, the pneumatic switch 232 may be activated by directly connecting the air purifying pipe 20 under specific conditions. In detail, the pneumatic switch 232 can connect the air purifying pipe 20 under the condition of inputting a specific air pressure, and when the air pressure entering the pneumatic switch 232 is lower than a preset pressure value, the pneumatic switch 232 is closed to block the connection of the air purifying pipe 20, and at this time, the air in the air purifying pipe 20 cannot flow into the enclosed space SP of the air curtain module 21.
It should be noted that, the first air supply device 24 may be connected to the air switch 232 through a single air purifying pipeline 20, and the air switch 232 may be connected to the air curtain module 21 through two air purifying pipelines 20, so that the pressure caused when the air flows into the enclosed space SP of the air curtain module 21 through the two air purifying pipelines 20 can be averaged. When two air purifying pipelines 20 are connected between the air switch 232 and the air curtain module 21, the two air purifying pipelines 20 are respectively provided with a mass flow controller 22 and an air filtering unit 26, and the air filtering unit 26 is used for filtering the air flow to be introduced into the air curtain module 21.
Specifically, the electric switch 231 and the pneumatic switch 232 may be kept in a normally-off state without being controlled by the control unit 2, and the clean air line 20 will be correspondingly in a non-communication state. In an embodiment, when the control unit 2 receives the actuating signal of the door assembly A1, the electric switch 231 disposed on the auxiliary air inlet pipe 230 is controlled to be turned on, so that the air flow passes through the auxiliary air inlet pipe 230 and the pneumatic switch 232 is activated, and the air purifying pipe 20 is switched from the non-communicating state to the communicating state, so that the air flow provided by the first air supply device 24 can flow into the enclosed space SP of the air curtain module 21 through the air purifying pipe 20.
In contrast, the control unit 2 may control the electric switch 231 to be turned off, so that the secondary air purifying pipe 230 is not opened, and the air switch 232 is turned off. The clean air line 20 is changed from the connected state to the disconnected state, so that the air flow provided by the first air supply device 24 can not continuously enter the closed space SP of the air curtain module 21, the air flow stops being discharged from the air curtain module 21, and the blowing process is stopped at the position of the movable door 301 of the wafer cassette 300.
The following provides details of an embodiment of the blowing process performed by the air curtain control system 200 of the present invention on the position of the movable door 301 of the wafer cassette 300 by using the air curtain module 21 to more clearly describe the present invention, but the present invention is not limited to the following embodiments.
When the door assembly A1 of the wafer carrier apparatus 100 opens the movable door 301 of the wafer cassette 300, the control unit 2 of the air curtain control system 200 receives the actuation signal of the door assembly A1, and then controls the electric switch 231 of the clean air switch assembly 23 to be turned on, so that the air flow supplied by the first air supply device 24 flows into the closed space SP of the air curtain module 21 through the cleaner pipeline 20 to be converged, and the air flow wall AF is discharged from the side of the air curtain module 21 where the filter plate 12 is disposed, and the position of the movable door 301 of the wafer cassette 300 is blown clean.
The humidity sensing unit 1 disposed on the exhaust pipe 30 of the wafer carrier apparatus 100 detects the humidity value of the gas at all times and transmits the first humidity value to the control unit 2. When the control unit 2 receives the first humidity value detected by the humidity sensing unit 1, the received first humidity value is compared with 5%, and if the first humidity value is 12%, it is determined that the first humidity value is higher than 5%, that is, the mass flow controller 22 is controlled to adjust the flow rate of the air flow provided to the air curtain module 21, and the flow rate of the air flow is adjusted to 300-400L/min for performing a blowing process, so that the humidity value of the air AR in the wafer box 300 is reduced.
Then, when the control unit 2 continuously receives the second humidity value detected by the humidity sensing unit 1, the received second humidity value is compared with 5%, and if the second humidity value is 5%, it is determined that the second humidity value is equal to 5%, that is, the mass flow controller 22 is controlled to adjust the flow rate of the air flow provided to the air curtain module 21, and the flow rate of the air flow is adjusted to 100-200L/min for a blowing process, so as to save the consumption of the air flow.
Then, when the control unit 2 continuously receives the third humidity value detected by the humidity sensing unit 1, the received third humidity value is compared with 5%, and if the third humidity value is 3%, it is determined that the third humidity value is lower than 5%, that is, the mass flow controller 22 is controlled to adjust the flow rate of the air flow provided to the air curtain module 21, and the flow rate of the air flow is adjusted to 50-100L/min for a blowing process, so as to save the consumption of the air flow.
The humidity sensing unit 1 of the air curtain control system 200 of the present invention is preferably disposed in the exhaust pipe 30 and close to the exhaust port 31, so as to measure the humidity of the air in the exhaust pipe 30. The test tray is placed in the wafer cassette 300 to measure the humidity value of the gas AR in the wafer cassette 300. After a plurality of tests using the test tray, the humidity value of the gas AR in the wafer cassette 300 measured by the test tray is compared with the humidity value detected by the humidity sensing unit 1. The following results were obtained: the humidity value detected by the humidity sensing unit 1 is the humidity value of the gas in the exhaust pipeline 30, the humidity value of the gas AR in the wafer box 300 is measured by the test disc, although the initial values of the two values are slightly different, the humidity value measured by the test disc is quickly reduced to 5% of the ideal humidity value, and the humidity value detected by the humidity sensing unit 1 is slowly reduced to 5% of the ideal humidity value. In order to obtain the reference humidity value at any time, and not always to place the test tray in the wafer cassette 300, so as to simplify the operation, the humidity value detected by the humidity sensing unit 1 may be referred to, and even if the response is slow, the trend of the change of the humidity value is similar to the humidity value of the gas AR in the wafer cassette 300 measured by the test tray. As soon as the humidity value detected by the humidity sensing unit 1 is reduced to 5%, it can be represented that the humidity value of the gas AR in the wafer cassette 300 measured by the test tray has been reduced to 5% in advance. Therefore, the humidity value detected by the humidity sensor unit 1 is used to represent the humidity value of the gas AR in the wafer cassette 300, which is not a problem, and can further enhance the operation simplicity of the air curtain control system 200 for measurement and monitoring.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the claims; while the foregoing is directed to embodiments and methods of the present invention, other and further embodiments and methods of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
Claims (10)
1. An air curtain control system applied to wafer production equipment is connected with a wafer carrying device, and the wafer carrying device at least comprises: the wafer box comprises a bearing unit, a first air inlet, a second air inlet and a first air outlet, wherein the bearing unit is used for bearing a wafer box with a movable door, and is provided with at least one air outlet which is used for discharging air flowing in the wafer box; and a door assembly for opening/closing the movable door of the wafer cassette, wherein the air curtain control system comprises:
the blowing-off module is arranged in the wafer carrying device, and comprises:
the air curtain module is arranged above the door assembly corresponding to the wafer carrying device, and the blowing-off module provides air flow for the air curtain module;
a clean air line through which the air flow flows to the air curtain module; and
the mass flow controller is connected with the air curtain module through the air purifying pipeline;
a humidity sensing unit for detecting a humidity value of the gas in the wafer cassette; and
and the control unit is used for receiving the humidity value detected by the humidity sensing unit, comparing the received humidity value with a preset value, and controlling the mass flow controller to adjust the flow rate of the air flow provided by the air curtain module so that the humidity value of the air in the wafer box is lower than the preset value.
2. The air curtain control system of claim 1, wherein the wafer carrier further comprises an exhaust line coupled to the exhaust port, the humidity sensing unit being disposed in the exhaust line and proximate to the exhaust port.
3. The air curtain control system of claim 1, wherein the purge module further comprises a purge switch assembly and a first air supply device, the purge switch assembly and the first air supply device being connected to the air curtain module through the purge line.
4. The air curtain control system of claim 3, wherein the air cleaner switch assembly comprises at least a secondary air cleaner line connected to the air cleaner line, and an electric switch disposed on the secondary air cleaner line.
5. The air curtain control system as claimed in claim 4, wherein when the control unit controls the electric switch to be turned on, both ends of the auxiliary air cleaning pipe are communicated with each other so that the air cleaning pipe assumes a communicated state.
6. The air curtain control system of claim 1, wherein the control unit regulates down the flow of the air flow providing the air curtain module when the received humidity value is below the preset value.
7. The air curtain control system of claim 1, wherein the control unit regulates the flow rate of the air flow providing the air curtain module when the received humidity value is above the preset value.
8. The air curtain control system of claim 1 or 7, wherein the preset value is in the range of 5% -10%.
9. The air curtain control system of claim 1, wherein the air curtain module comprises:
the body is provided with an air inlet hole, and the air inlet hole penetrates through the body; and
the filter plates are fixedly arranged in the body, a closed space is formed in the body by the filter plates, the air inlet holes are communicated with the air purifying pipeline of the blowing-out module, and the air flow of the air curtain module flows into the closed space through the air purifying pipeline and the air inlet holes;
each filter plate is provided with a plurality of air holes, and the air flow for providing the air curtain module is discharged outwards from one side of the body through the air holes.
10. The air curtain control system of claim 9, wherein the blow-down module further comprises a gas filtration unit coupled to the purge line to filter the flow of gas providing the air curtain module.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910425585.4A CN111987011B (en) | 2019-05-21 | 2019-05-21 | Air curtain control system |
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|---|---|---|---|
| CN201910425585.4A CN111987011B (en) | 2019-05-21 | 2019-05-21 | Air curtain control system |
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| CN111987011B true CN111987011B (en) | 2024-03-12 |
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| CN116659593B (en) * | 2023-08-01 | 2023-10-20 | 浙江果纳半导体技术有限公司 | Wafer storage detection method |
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|---|---|---|---|---|
| JP2012248887A (en) * | 2010-09-30 | 2012-12-13 | Shibaura Mechatronics Corp | Hermetically sealed container and semiconductor manufacturing apparatus |
| CN203325853U (en) * | 2012-06-19 | 2013-12-04 | 圣凰科技有限公司 | Humidity feedback control flow correction system |
| CN106505023A (en) * | 2015-09-08 | 2017-03-15 | 古震维 | A kind of with the wafer handler for blowing off function |
| CN207602538U (en) * | 2017-10-23 | 2018-07-10 | 华景电通股份有限公司 | Wafer cassette carrier system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011016255A1 (en) * | 2009-08-07 | 2011-02-10 | 株式会社ニコン | Exposure apparatus, exposure method, and device manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012248887A (en) * | 2010-09-30 | 2012-12-13 | Shibaura Mechatronics Corp | Hermetically sealed container and semiconductor manufacturing apparatus |
| CN203325853U (en) * | 2012-06-19 | 2013-12-04 | 圣凰科技有限公司 | Humidity feedback control flow correction system |
| CN106505023A (en) * | 2015-09-08 | 2017-03-15 | 古震维 | A kind of with the wafer handler for blowing off function |
| CN207602538U (en) * | 2017-10-23 | 2018-07-10 | 华景电通股份有限公司 | Wafer cassette carrier system |
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