CN111975216B - Multi-beam laser processing device and method - Google Patents

Multi-beam laser processing device and method Download PDF

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Publication number
CN111975216B
CN111975216B CN201910433934.7A CN201910433934A CN111975216B CN 111975216 B CN111975216 B CN 111975216B CN 201910433934 A CN201910433934 A CN 201910433934A CN 111975216 B CN111975216 B CN 111975216B
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annular
laser
auxiliary
central
loop
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CN111975216A (en
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张立新
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Petrochina Co Ltd
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Petrochina Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations

Abstract

The invention discloses a multi-beam laser processing device and a method, wherein the device comprises: a central annular light path, at least one auxiliary annular light path and a focusing lens; the central annular light path includes: the laser system comprises a central loop laser transmitter and a central loop conical lens group for converting laser beams emitted by the central loop laser transmitter into annular beams; each of the auxiliary annular light paths includes: the laser system comprises an auxiliary loop laser transmitter, an auxiliary loop conical lens group and a reflector group, wherein the auxiliary loop conical lens group is used for converting laser beams emitted by the auxiliary loop laser transmitter into annular beams; the central loop laser transmitter is used for adjusting the beam parameters of the laser beam transmitted by the central loop laser transmitter so as to adjust the focusing position of the central processing loop beam; the auxiliary loop laser transmitter is used for adjusting the beam parameters of the laser beam emitted by the auxiliary loop laser transmitter so as to adjust the position of the auxiliary processing annular beam focus. The invention solves the technical problem of short focal depth of laser processing in the prior art.

Description

Multi-beam laser processing device and method
Technical Field
The invention relates to the field of petroleum mechanical processing, in particular to a multi-beam laser processing device and method.
Background
In the petroleum field, the cutting of a transmission pipeline has strict requirements on the quality of a pipe cut, and the quality of the cut directly influences the groove processing and the pipe orifice assembly of the next procedure. Therefore, the cut surface is required to have high smoothness and good verticality. Laser cutting has received much attention since its appearance due to its excellent characteristics. The laser cutting has the advantages of small laser spot, high energy density, high cutting speed and the like. For laser cutting, to obtain better cutting quality, the laser beam is usually selected to be a fundamental mode gaussian beam. For a Gaussian beam with a waist spot radius of a constant value omega, the focal depth of laser focusing can be measured by twice the Rayleigh length, namely about 2 pi omega2And/lambda, when the radius of the waist spot is small, the focal depth is also short, which means that the laser is difficult to process thicker metal, one-time cutting cannot be completed, and the processing efficiency and the processing quality are reduced along with the laser. Thus, a laser beam with a large focal depth is required for processing.
In order to solve at least one technical problem in the prior art described above, the present invention proposes a multi-beam laser processing apparatus.
Disclosure of Invention
The invention mainly aims to provide a multi-beam laser processing device and a multi-beam laser processing method, which aim to solve the technical problem of short focal depth of laser processing in the prior art.
In order to achieve the above object, according to one aspect of the present invention, there is provided a multi-beam laser processing apparatus including: a central annular light path, at least one auxiliary annular light path and a focusing lens;
the central annular light path includes: the laser processing device comprises a central loop laser transmitter and a central loop conical lens group which converts laser beams emitted by the central loop laser transmitter into annular beams, wherein the annular beams output by the central loop conical lens group are incident to a focusing lens, and central processing annular beams irradiated on an object to be processed are generated through focusing of the focusing lens;
each of the auxiliary annular light paths includes: the laser processing device comprises an auxiliary loop laser transmitter, an auxiliary loop conical lens group and a reflector group, wherein laser beams emitted by the auxiliary loop laser transmitter are converted into annular beams, the reflector group is used for adjusting the beam direction, the annular beams output by the auxiliary loop conical lens group are incident to the reflector group and are incident to a focusing lens through the reflection of the reflector group, and the focusing lens focuses the annular beams output by the reflector group to generate auxiliary processing annular beams irradiating on an object to be processed;
the optical axis of the annular light beam output by the reflector group is superposed with the optical axis of the annular light beam output by the central loop conical lens group; the central loop laser transmitter is used for adjusting the beam parameters of the laser beam transmitted by the central loop laser transmitter so as to adjust the focusing position of the central processing annular beam; the auxiliary loop laser transmitter is used for adjusting the beam parameters of the laser beams transmitted by the auxiliary loop laser transmitter so as to adjust the focusing position of the auxiliary processing annular beam.
Further, a main optical axis of the focusing lens coincides with an optical axis of the annular light beam output by the reflector group.
Further, the focusing lens is configured to move along its main optical axis to adjust the focusing positions of the central processing annular beam and the auxiliary processing annular beam.
Further, the annular light beam output by the central loop conical lens group and the annular light beam output by the auxiliary loop conical lens group are straight annular light beams.
Further, the focal points of the central processing annular beam and the auxiliary processing annular beam at least partially coincide.
Further, the beam parameters include: laser wavelength, pulse width.
Further, the object to be processed is arranged on an object stage, and the object stage is used for adjusting the position of the object to be processed so as to adjust the positions of the focuses of the central processing annular beam and the auxiliary processing annular beam on the object to be processed.
Further, each of the central loop conical lens group and the auxiliary loop conical lens group includes at least one set of conical lenses, and each of the conical lenses includes: a conical convex lens and a conical concave lens.
Further, the mirror group comprises at least one group of mirrors.
In order to achieve the above object, according to another aspect of the present invention, there is also provided a multi-beam laser processing method including:
the central loop conical lens group converts laser beams emitted by the central loop laser emitter into annular beams and outputs the annular beams to the focusing lens, and the annular beams are focused by the focusing lens to generate central processing annular beams irradiating on an object to be processed;
the auxiliary loop conical lens group converts laser beams emitted by the auxiliary loop laser emitter into annular beams and outputs the annular beams to the reflector group, the annular beams are reflected by the reflector group and enter the focusing lens, and the focusing lens focuses the annular beams output by the reflector group to generate auxiliary processing annular beams irradiating on the object to be processed;
and the central loop laser transmitter and/or the auxiliary loop laser transmitter respectively adjust the beam parameters of the laser beams emitted by the central loop laser transmitter and/or the auxiliary loop laser transmitter so that the focuses of the central processing annular beam and the auxiliary processing annular beam are at least partially overlapped.
Further, the multi-beam laser processing method further includes:
the focusing lens moves along the optical axis of the annular beam output by the reflector group so as to adjust the focusing positions of the central processing annular beam and the auxiliary processing annular beam.
Further, the multi-beam laser processing method further includes:
and the object stage adjusts the position of the object to be processed according to the processing requirement, so that the focus points of the central processing annular beam and the auxiliary processing annular beam are positioned at different positions of the object to be processed.
The invention has the beneficial effects that: the central annular light path is arranged, the central annular light path converts the laser beam into the annular beam through the central annular conical lens group, and the annular beam is focused through the focusing lens and then irradiates on an object to be processed, so that the beneficial effect of increasing the focal depth of the output beam under the condition of not changing the input beam is achieved. In addition, the laser cutting device is also provided with at least one auxiliary annular light path, the auxiliary annular light path converts the laser beam into an annular beam, the annular beam is focused by the same focusing lens and then irradiates on an object to be processed, the annular beam output by the auxiliary annular light path and the annular beam output by the central annular light path are overlapped in time and space, the laser cutting quality optimization in space and time is realized, the processing effect is better, and the processing quality and the processing efficiency are improved. The central loop laser transmitter and the auxiliary loop laser transmitter can adjust the beam parameters of the laser beams transmitted by the central loop laser transmitter and the auxiliary loop laser transmitter so as to adjust the focusing positions of the central processing annular beam and the auxiliary processing annular beam irradiated on an object to be processed, and adjust the superposition of the central processing annular beam and the auxiliary processing annular beam on time and space, so that the annular beams have more parameters to be adjusted and controlled, the laser cutting quality optimization on space and time is realized, and a better processing effect is obtained.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts. In the drawings:
FIG. 1 is a schematic view of a first configuration of a multi-beam laser processing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic view of a second structure of a multi-beam laser processing apparatus according to an embodiment of the present invention;
FIG. 3 is a first flowchart of a multi-beam laser processing method according to an embodiment of the present invention;
fig. 4 is a second flowchart of a multi-beam laser processing method according to an embodiment of the present invention.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is noted that the terms "comprises" and "comprising," and any variations thereof, in the description and claims of the present invention and the above-described drawings are intended to cover non-exclusive inclusions, such that a product or device comprising a list of elements is not necessarily limited to those elements explicitly listed, but may include other elements not explicitly listed or inherent to such product or device.
In the present invention, the terms "upper", "lower", "middle", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the invention and its embodiments and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the present invention can be understood by those skilled in the art as appropriate.
Furthermore, the terms "disposed," "provided," and "connected" are to be construed broadly. For example, "connected" may be a fixed connection, a detachable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
Fig. 1 is a schematic view of a first structure of a multi-beam laser processing apparatus according to an embodiment of the present invention, and as shown in fig. 1, the multi-beam laser processing apparatus according to the embodiment of the present invention includes: a central annular light path, an auxiliary annular light path and a focusing lens 4. The central annular light path is used for converting the laser beam into an annular beam and inputting the annular beam to the focusing lens 4, the auxiliary annular light path is used for converting the laser beam into an annular beam and inputting the annular beam to the focusing lens 4, and the focusing lens 4 focuses the input annular beam to respectively generate a central processing annular beam and an auxiliary processing annular beam which are irradiated on the object 5 to be processed.
As shown in fig. 1, the central annular light path includes: a central loop laser transmitter and a central loop conical lens group 1 for converting laser beams emitted by the central loop laser transmitter into annular beams. In the embodiment shown in fig. 1, the central loop conical lens group 1 comprises a conical convex lens 11 and a conical convex lens 12 which are oppositely arranged, the central axes of the conical convex lens 11 and the conical convex lens 12 are coincident, and the conical parts are oppositely arranged. The laser beam emitted by the central loop laser transmitter is incident to the central loop conical lens group 1 and is converted into an annular beam by the central loop conical lens group 1. In the embodiment of the invention, the annular light beam output by the central loop conical lens group 1 of the central annular light path is directly irradiated on the focusing lens 4. The focusing lens 4 focuses the annular beam to generate a central processing annular beam which is irradiated on the object 5 to be processed.
As shown in fig. 1, the auxiliary annular light path includes: the laser system comprises an auxiliary loop laser transmitter, an auxiliary loop conical lens group 2 for converting a laser beam emitted by the auxiliary loop laser transmitter into an annular beam, and a reflector group 3 for adjusting the beam direction. In the embodiment shown in fig. 1, the secondary loop conical lens group 2 comprises a conical convex lens 21 and a conical convex lens 22 which are oppositely arranged, and the mirror group 3 comprises a mirror 31 and a mirror 32 which are arranged in parallel. The laser beam emitted by the auxiliary loop laser emitter is directly input to the auxiliary loop conical lens group 2, the auxiliary loop conical lens group 2 converts the laser beam into an annular beam and inputs the annular beam to the reflector group 3, and the annular beam is input to the focusing lens 4 through reflection of the reflector group 3. As shown in fig. 1, in the embodiment of the present invention, the annular light beam output by the secondary annular conical lens group 2 of the secondary annular light path cannot directly irradiate onto the focusing lens 4, and needs to be reflected by the mirror group 3 to irradiate onto the focusing lens 4. The focusing lens 4 focuses the annular beam to generate an auxiliary processing annular beam which is irradiated on the object 5 to be processed. The subsidiary processing annular beam and the above-described center processing annular beam are irradiated on the object to be processed 5 from the same direction.
In the embodiment shown in fig. 1, the annular light beam output by the mirror group 3 and the annular light beam output by the central ring cone group 1 impinge on the same surface of the focusing lens 4. In the preferred embodiment of the present invention, the optical axes of the annular light beam output by the reflector group 3 and the annular light beam output by the central annular conical mirror group 1 coincide. In the embodiment shown in fig. 1, the reflecting mirror 31 in the reflecting mirror group 3 is arranged in the annular light beam output by the central annular conical mirror group 1, so that the reflecting mirror 31 does not block the annular light beam output by the central annular conical mirror group 1. In other embodiments of the present invention, the optical axis of the annular light beam output by the reflector group 3 and the optical axis of the annular light beam output by the central loop conical lens group 1 are parallel, i.e. the two annular light beams are eccentric rings in cross section.
In the embodiment of the present invention, the central loop laser transmitter and the auxiliary loop laser transmitter may adjust beam parameters of laser beams emitted by themselves, so as to adjust the positions at which the central processing annular beam and the auxiliary processing annular beam irradiated on the object 5 to be processed are focused. Beam parameters may include laser wavelength, pulse width, etc. in embodiments of the present invention. In the embodiment of the invention, the central loop laser transmitter and/or the auxiliary loop laser transmitter can realize that the focuses of the central processing annular beam and the auxiliary processing annular beam are partially overlapped, completely overlapped or distributed at two different positions by adjusting the beam parameters of the laser beams transmitted by the central loop laser transmitter and/or the auxiliary loop laser transmitter so as to adapt to different processing purposes. In an alternative embodiment of the present invention, the central loop laser transmitter and the auxiliary loop laser transmitter may adjust parameters such as laser wavelength, emission time, pulse width, repetition frequency, laser power, etc. of the laser beams emitted by the central loop laser transmitter and the auxiliary loop laser transmitter, so as to adjust the superposition of the central processing annular beam and the auxiliary processing annular beam in time and space.
From the above description, it can be seen that the present invention realizes the beneficial effect of increasing the focal depth of the output light beam without changing the input light beam by providing the central annular light path which converts the laser light beam into the annular light beam through the central annular conical lens group, and further irradiating the annular light beam onto the object 5 to be processed after being focused by the focusing lens. In addition, the laser cutting device is also provided with at least one auxiliary annular light path, the auxiliary annular light path converts the laser beam into an annular beam, the annular beam is focused by the same focusing lens and then irradiates on the object 5 to be processed, the annular beam output by the auxiliary annular light path and the annular beam output by the central annular light path are overlapped in time and space, the laser cutting quality optimization in space and time is realized, the processing effect is better, and the processing quality and the processing efficiency are improved. The central loop laser transmitter and the auxiliary loop laser transmitter can adjust the beam parameters of the laser beams emitted by the central loop laser transmitter and the auxiliary loop laser transmitter so as to adjust the focusing positions of the central processing annular beam and the auxiliary processing annular beam irradiated on the object 5 to be processed and adjust the superposition of the central processing annular beam and the auxiliary processing annular beam on time and space. The invention is not only suitable for the multi-beam laser processing method of double beams (one central processing annular beam and one auxiliary processing annular beam), but also suitable for the multi-beam (one central processing annular beam and a plurality of auxiliary processing annular beams) processing, and the application field of the invention is not only suitable for laser cutting, but also can be applied to the related laser processing field.
In the present invention, it is known in the art to convert a laser beam into an annular beam by means of a conical mirror assembly. In the embodiment of the present invention, the central circular conical lens group 1 and the auxiliary circular conical lens group 2 may be conical convex lenses arranged oppositely (as in the embodiment shown in fig. 1). In other embodiments of the present invention, the central circular conical lens group 1 and the auxiliary circular conical lens group 2 may also be conical concave lenses arranged oppositely, or one conical concave lens and another conical convex lens (as in the embodiment shown in fig. 2). In other embodiments of the present invention, the central circular conical mirror group 1 and the auxiliary circular conical mirror group 2 may also be configured by using a conical convex mirror and a conical concave mirror.
In embodiments of the present invention, the laser beams emitted by the central loop laser transmitter and the auxiliary loop laser transmitter may be various types of laser beams, such as a flat beam, a gaussian beam, a ring beam, and the like.
In the embodiment of the present invention, the main optical axis of the focusing lens 4 coincides with the optical axes of the annular light beam output by the reflector group 3 and the annular light beam output by the central annular conical lens group 1, so that the focuses of the central processing annular light beam and the auxiliary processing annular light beam generated by the focusing of the focusing lens 4 are located on the main optical axis of the focusing lens 4.
In the embodiment of the present invention, the focusing lens 4 is disposed above the object 5 to be processed and can move up and down along the optical axes of the annular light beam output by the reflector group 3 and the annular light beam output by the central loop conical lens group 1 to adjust the positions of the central processing annular light beam and the auxiliary processing annular light beam output by the focusing lens 4.
In the preferred embodiment of the present invention, the annular light beam output by the central loop cone assembly 1 and the annular light beam output by the auxiliary loop cone assembly 2 are both flat annular light beams. In an embodiment of the invention, a flat ring beam means that the divergence angle of the ring beam is less than 1 degree. The flat annular light beam is irradiated on the focusing lens 4, and a central processing annular light beam with a certain divergence angle and an auxiliary processing annular light beam are formed through the focusing of the focusing lens 4.
In the embodiment of the invention, when laser cutting is carried out, the focuses of the central processing annular beam and the auxiliary processing annular beam are generally required to be positioned at the same position, so that the processing effect and the processing efficiency are improved. In the invention, the focal depth of the central processing annular beam and the auxiliary processing annular beam can be adjusted by adjusting the beam parameters of the laser beams emitted by the central loop laser transmitter and/or the auxiliary loop laser transmitter, so that the focal points of the central processing annular beam and the auxiliary processing annular beam are coincided or partially coincided.
In an embodiment of the invention, the position of the object 5 to be machined is adjustable to adapt to different machining modes. As shown in fig. 2, the object 5 to be processed is laser-processed by the focus of the center-processing annular beam and the auxiliary-processing annular beam at the position 2, and the object 5 to be processed is ring-processed, such as ring-cutting, by the center-processing annular beam and the auxiliary-processing annular beam at the positions 1 and 3. The object 5 to be processed can be moved up and down to adjust the position of the focus of the annular beam in the object 5 to be processed, and can be used for performing deep processing or internal processing or the like of the object 5 to be processed. In an embodiment of the present invention, the object 5 to be processed may be disposed on a stage, and the position of the object 5 to be processed may be adjusted by the stage.
As can be seen from the above description, the present invention has at least the following advantageous effects:
1. the central annular light path is arranged, the central annular light path converts the laser beam into the annular beam through the central annular conical lens group, and the annular beam is focused through the focusing lens and then irradiates on the object 5 to be processed, so that the beneficial effect of increasing the focal depth of the output beam under the condition of not changing the input beam is realized.
2. The laser cutting device is also provided with at least one auxiliary annular light path, the auxiliary annular light path converts the laser beam into an annular beam, the annular beam is focused by the same focusing lens and then irradiates on the object 5 to be processed, the annular beam output by the auxiliary annular light path and the annular beam output by the central annular light path are overlapped in time and space, the laser cutting quality optimization in space and time is realized, the processing effect is better, and the processing quality and the processing efficiency are improved.
3. The invention is not only suitable for the multi-beam laser processing method of double beams (one central processing annular beam and one auxiliary processing annular beam), but also suitable for the multi-beam (one central processing annular beam and a plurality of auxiliary processing annular beams) processing, and the application field of the invention is not only suitable for laser cutting, but also can be applied to the related laser processing field.
4. The central loop laser transmitter and the auxiliary loop laser transmitter can adjust the beam parameters of the laser beams emitted by the central loop laser transmitter and the auxiliary loop laser transmitter so as to adjust the focusing positions of the central processing annular beam and the auxiliary processing annular beam irradiated on the object 5 to be processed and adjust the superposition of the central processing annular beam and the auxiliary processing annular beam on time and space.
Based on the same inventive concept, embodiments of the present invention further provide a multi-beam laser processing method, which is applied to the multi-beam laser processing apparatus described in the above embodiments, as described in the following embodiments. Since the multi-beam laser processing method is similar to the multi-beam laser processing apparatus in the principle of solving the problem, the embodiment of the multi-beam laser processing method can be referred to the embodiment of the multi-beam laser processing apparatus, and repeated descriptions are omitted.
Fig. 3 is a schematic view of a first process of the multi-beam laser processing method according to the embodiment of the invention, and as shown in fig. 3, the multi-beam laser processing apparatus according to the embodiment of the invention includes steps S101 to S103.
And S101, converting a laser beam emitted by a central loop laser emitter into an annular beam by the central loop conical lens group, outputting the annular beam to a focusing lens, and generating a central processing annular beam irradiating on an object to be processed through focusing of the focusing lens.
And S102, converting the laser beam emitted by the auxiliary loop laser emitter into an annular beam by the auxiliary loop conical lens group and outputting the annular beam to the reflector group, wherein the annular beam is reflected by the reflector group and enters the focusing lens, and the focusing lens focuses the annular beam output by the reflector group to generate an auxiliary processing annular beam irradiating on the object to be processed.
Step S103, the central loop laser transmitter and/or the auxiliary loop laser transmitter respectively adjust beam parameters of laser beams emitted by the central loop laser transmitter and/or the auxiliary loop laser transmitter so that the focuses of the central processing annular beam and the auxiliary processing annular beam are at least partially overlapped.
Fig. 4 is a schematic view of a second flow chart of the multi-beam laser processing method according to the embodiment of the invention, and as shown in fig. 4, the multi-beam laser processing method according to the embodiment of the invention further includes step S201 and step S202.
Step S201, the focusing lens moves along the optical axis of the annular beam output by the reflector group to adjust the focusing positions of the central processing annular beam and the auxiliary processing annular beam.
Step S202, the position of the object to be processed is adjusted by the objective table according to the processing requirement, so that the focus points of the central processing annular beam and the auxiliary processing annular beam are located at different positions of the object to be processed.
It should be noted that, although a logical order is shown in the flow chart, in some cases, the steps shown or described may be performed in an order different than that shown or described herein.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (12)

1. A multi-beam laser processing apparatus, comprising: a central annular light path, at least one auxiliary annular light path and a focusing lens;
the central annular light path includes: the laser processing device comprises a central loop laser transmitter and a central loop conical lens group which converts laser beams emitted by the central loop laser transmitter into annular beams, wherein the annular beams output by the central loop conical lens group are incident to a focusing lens, and central processing annular beams irradiated on an object to be processed are generated through focusing of the focusing lens;
each of the auxiliary annular light paths includes: the device comprises an auxiliary loop laser transmitter, an auxiliary loop conical lens group and a reflecting lens group, wherein the auxiliary loop conical lens group is used for converting laser beams emitted by the auxiliary loop laser transmitter into annular beams, the reflecting lens group is used for adjusting the beam direction, the annular beams output by the auxiliary loop conical lens group are incident to the reflecting lens group and are reflected by the reflecting lens group to be incident to the focusing lens, and the focusing lens is used for focusing the annular beams output by the reflecting lens group to generate auxiliary processing annular beams irradiating on an object to be processed;
the optical axis of the annular light beam output by the reflector group is superposed with the optical axis of the annular light beam output by the central loop conical lens group; the central loop laser transmitter is used for adjusting the beam parameters of the laser beams emitted by the central loop laser transmitter to adjust the focusing position of the central processing annular beam, and the auxiliary loop laser transmitter is used for adjusting the beam parameters of the laser beams emitted by the auxiliary loop laser transmitter to adjust the focusing position of the auxiliary processing annular beam, so that the focusing position of the central processing annular beam and the focusing position of the auxiliary processing annular beam are partially overlapped, completely overlapped or distributed at two different positions.
2. The multiple-beam laser processing apparatus of claim 1 wherein a principal optical axis of the focusing lens coincides with an optical axis of the annular beam output by the mirror group.
3. The multi-beam laser processing apparatus according to claim 1 or 2, wherein the focus lens is configured to move along its main optical axis to adjust positions at which the central processing annular beam and the auxiliary processing annular beam are focused.
4. The multiple-beam laser processing apparatus of claim 1 wherein the annular beam output by the central set of loop tapers and the annular beam output by the set of secondary loop tapers are flat annular beams.
5. The multiple-beam laser processing apparatus of claim 1 wherein the focal points of the central processing annular beam and the auxiliary processing annular beam at least partially coincide.
6. The multiple-beam laser processing apparatus of claim 1 wherein the beam parameters include: laser wavelength, pulse width.
7. The multi-beam laser processing device according to claim 1, wherein the object to be processed is disposed on a stage for adjusting a position of the object to be processed to adjust positions of the focus points of the central processing annular beam and the auxiliary processing annular beam on the object to be processed.
8. The multi-beam laser processing apparatus of claim 1 wherein the central set of loop tapers and the set of secondary loop tapers each include at least one set of tapers, the tapers including: a conical convex lens and a conical concave lens.
9. The multiple-beam laser processing apparatus of claim 1 wherein the set of mirrors includes at least one set of mirrors.
10. A multi-beam laser processing method applied to the multi-beam laser processing apparatus according to any one of claims 1 to 9, comprising:
the central loop conical lens group converts laser beams emitted by the central loop laser emitter into annular beams and outputs the annular beams to the focusing lens, and the annular beams are focused by the focusing lens to generate central processing annular beams irradiated on an object to be processed;
the auxiliary loop conical lens group converts laser beams emitted by the auxiliary loop laser emitter into annular beams and outputs the annular beams to the reflector group, the annular beams are reflected by the reflector group and enter the focusing lens, and the focusing lens focuses the annular beams output by the reflector group to generate auxiliary processing annular beams irradiating on the object to be processed;
and the central loop laser transmitter and/or the auxiliary loop laser transmitter respectively adjust the beam parameters of the laser beams emitted by the central loop laser transmitter and/or the auxiliary loop laser transmitter so that the focuses of the central processing annular beam and the auxiliary processing annular beam are at least partially overlapped.
11. The multiple-beam laser processing method according to claim 10, further comprising:
the focusing lens moves along the optical axis of the annular beam output by the reflector group so as to adjust the focusing positions of the central processing annular beam and the auxiliary processing annular beam.
12. The multiple-beam laser processing method according to claim 10, further comprising:
and the object stage adjusts the position of the object to be processed according to the processing requirement, so that the focus points of the central processing annular beam and the auxiliary processing annular beam are positioned at different positions of the object to be processed.
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3972599A (en) * 1974-09-16 1976-08-03 Caterpillar Tractor Co. Method and apparatus for focussing laser beams
EP0005460A1 (en) * 1978-05-19 1979-11-28 International Business Machines Corporation Apparatus for material treatment
CN201940748U (en) * 2010-11-30 2011-08-24 武汉市楚源光电有限公司 Large power double-cavity parallel welding system
CN102508362A (en) * 2011-11-15 2012-06-20 深圳市光大激光科技股份有限公司 Double beam coupling device
CN106232283A (en) * 2014-02-28 2016-12-14 Ipg光子公司 Use the multi-beam laser processing of different wave length and/or multiple laser beams in pulse duration
CN106994564A (en) * 2017-04-27 2017-08-01 东莞市盛雄激光设备有限公司 A kind of laser cutting device and its cutting method
CN107363416A (en) * 2017-07-12 2017-11-21 上海柏楚电子科技有限公司 A kind of laser ring cutter device and its control method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3972599A (en) * 1974-09-16 1976-08-03 Caterpillar Tractor Co. Method and apparatus for focussing laser beams
EP0005460A1 (en) * 1978-05-19 1979-11-28 International Business Machines Corporation Apparatus for material treatment
CN201940748U (en) * 2010-11-30 2011-08-24 武汉市楚源光电有限公司 Large power double-cavity parallel welding system
CN102508362A (en) * 2011-11-15 2012-06-20 深圳市光大激光科技股份有限公司 Double beam coupling device
CN106232283A (en) * 2014-02-28 2016-12-14 Ipg光子公司 Use the multi-beam laser processing of different wave length and/or multiple laser beams in pulse duration
CN106994564A (en) * 2017-04-27 2017-08-01 东莞市盛雄激光设备有限公司 A kind of laser cutting device and its cutting method
CN107363416A (en) * 2017-07-12 2017-11-21 上海柏楚电子科技有限公司 A kind of laser ring cutter device and its control method

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