CN111970910B

CN111970910B - Electronic heat load liquid cooling heat dissipation system

Info

Publication number: CN111970910B
Application number: CN202010892283.0A
Authority: CN
Inventors: 徐小平; 陈寅; 蔡志海
Original assignee: Jiangsu Pengjiang Electronic Technology Co ltd
Current assignee: Jiangsu Pengjiang Electronic Technology Co ltd
Priority date: 2020-08-28
Filing date: 2020-08-28
Publication date: 2023-05-05
Anticipated expiration: 2040-08-28
Also published as: CN111970910A

Abstract

The invention relates to the technical field of electronic heat dissipation and discloses an electronic heat load liquid cooling heat dissipation system which comprises a mounting plate and a heat exchanger, wherein a first mounting frame and a second mounting frame are fixedly mounted in the middle of the mounting plate, a rectangular shell is fixedly mounted between the first mounting frame and the second mounting frame, a heat exchanger water outlet pipe is fixedly mounted at the output end of the heat exchanger, a water outlet main pipe is fixedly mounted at the other end of the heat exchanger water outlet pipe, an input pipe is fixedly mounted on the side wall of the water outlet main pipe, the other end of the input pipe is fixedly mounted on one side of the first mounting frame, a heat conducting column is arranged in the middle of the rectangular shell, and the first mounting frame and the second mounting frame are communicated with the rectangular shell through a pipeline. This electron thermal load liquid cooling system adopts the cooling system of cooling many times, can be timely discharges the heat for the temperature on the electronic component can be discharged, guarantees can the radiating in-process of electronic component heat dissipation mechanism hug closely in the position that needs radiating, guarantees to export the efficiency of heat higher.

Description

Electronic heat load liquid cooling heat dissipation system

Technical Field

The invention relates to the technical field of electronic heat dissipation, in particular to an electronic heat load liquid cooling heat dissipation system.

Background

Along with the development of electronic product assembly technology, the application of power elements is more and more, and in addition, the development of semiconductor manufacturing technology is added, more transistors are integrated in a single chip, various high-current, high-speed and high-power density electronic components such as resistors, transistors, high-power integrated circuits and the like are widely applied in various aspects of the control field, so that the overall power consumption and the heating value of the electronic elements are increased, the temperature of the electronic elements is continuously increased, and the electronic elements are invalid or damaged if heat is not dissipated in time.

In the heat dissipation treatment process of the heat generated by the electrons, the common cold heat dissipation system is adopted for treatment in the traditional way, the heat cannot be timely discharged, the temperature on the electronic element cannot be discharged, the damage is caused by the fact that the temperature of the electronic element is high, the service life of the electronic element is reduced, the heat dissipation part cannot be tightly attached to the heat dissipation part in the heat dissipation process of the electronic element, the heat conduction treatment degree of the heat is poor, the heat conduction efficiency cannot be guaranteed, and therefore, the electronic heat load liquid cooling heat dissipation system is provided.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides the electronic heat load liquid cooling heat dissipation system, which adopts a heat dissipation system with multiple cooling, can timely drain heat, so that the temperature on an electronic element can be drained, the normal working environment of the electronic element is convenient to achieve, the service life of the electronic element is prolonged, a heat dissipation mechanism can be tightly attached to a part needing heat dissipation in the process of dissipating the electronic element, the heat conduction performance is improved, the heat dissipation efficiency is ensured to be higher, and the like.

In order to achieve the purposes that the bearing assembly efficiency is high, the stability of the assembly process is high, the bearing is not easy to deform in the assembly process, the fitting degree of the inner ring of the bearing and the movable shaft is further greatly improved, and the radial external force born by the movable shaft during rotation is reduced, the invention provides the following technical scheme: the utility model provides an electron thermal load liquid cooling system, includes mounting panel and heat exchanger, the middle part fixed mounting of mounting panel has first installing frame and second installing frame, fixed mounting has the rectangle shell between first installing frame and the second installing frame, the output fixed mounting of heat exchanger has the heat exchanger outlet pipe, the other end fixed mounting of heat exchanger outlet pipe has the water outlet to be responsible for, the lateral wall fixed mounting who goes out the water to be responsible for has the input tube, the other end fixed mounting of input tube is in one side of first installing frame, the middle part of rectangle shell is provided with the heat conduction post, first installing frame and second installing frame are linked together with the rectangle shell through the pipeline, the input fixed mounting of heat exchanger inlet tube has, the other end fixed mounting of heat exchanger inlet tube has the water inlet to be responsible for, the lateral wall fixed mounting of water inlet to have the output tube, the other end fixed mounting of output tube is at the lateral wall of second installing frame.

Preferably, a first coil is fixedly arranged in the first mounting frame, a connecting pipe is fixedly arranged on the side wall of the first coil, the connecting pipe penetrates through the first mounting frame, and a water-cooling resistor is fixedly arranged at the other end of the connecting pipe.

Preferably, the side wall fixedly connected with slip ring of heat conduction post, just slip ring matches sliding connection inside the rectangle shell, the side wall fixedly connected with sealing ring of heat conduction post, the sealing ring supports the inner wall at the rectangle shell.

Preferably, the heat exchanger comprises a mounting box, a heat collecting disc is fixedly connected to the inside of the mounting box, a heat conducting frame is fixedly installed at the top end and the bottom end of the mounting box, a plurality of second heat conducting fins are fixedly connected to the middle of the heat conducting frame, and a heat conducting rod is fixedly installed between the heat collecting disc and the heat conducting frame.

Preferably, the middle part of the top end of the rectangular shell is fixedly connected with a heat conducting disc, the top end of the heat conducting disc is fixedly connected with a plurality of first heat conducting fins, both sides of the top end of the rectangular shell are fixedly connected with mounting columns, and an axial flow fan is fixedly installed between the two mounting columns.

Compared with the prior art, the invention provides an electronic heat load liquid cooling heat dissipation system, which has the following beneficial effects:

1. this electron thermal load liquid cooling system carries out the in-process that carries in first coil through liquid and utilizes the water-cooling resistor to cool down and handle, thereby then the input takes away the heat at the inside heat conduction post of rectangle shell, when liquid carries the heat to the heat exchanger inside, absorb the heat through the heat collecting disc, then carry the heat to the heat conduction frame in through the heat-conducting rod, carry out the heat dissipation through the second conducting strip again, adopt the cooling system of cooling down many times, can be timely discharge the heat, make the temperature on the electronic component can be discharged, be convenient for reach electronic component's normal operational environment, electronic component's life has been improved.

2. According to the electronic heat load liquid cooling heat dissipation system, the heat conduction column can be tightly attached to the target position needing heat conduction under the supporting action of the supporting spring in the rectangular shell, so that the heat dissipation mechanism can be tightly attached to the position needing heat dissipation in the heat dissipation process of an electronic element, the heat conduction performance is improved, and the heat conduction efficiency is high.

3. This electron heat load liquid cooling system utilizes axial fan to drive the air and flows when position in the rectangle shell, then the heat of heat conduction dish derived a part heat conduction post, then first conducting strip carries out heat dissipation through the air that flows, can further carry out heat dissipation, is convenient for reach the cooling fast for the cooling effect reaches the best.

Drawings

FIG. 1 is a schematic diagram of the structure of the present invention;

FIG. 2 is a side cross-sectional view of the structure of the present invention;

FIG. 3 is a schematic view of the internal structure of the heat exchanger of the present invention;

FIG. 4 is a top view of the thermally conductive plate of the present invention;

fig. 5 is an enlarged view of the portion a of fig. 2 in accordance with the present invention.

In the figure: 1. a mounting plate; 2. a first mounting frame; 3. a second mounting frame; 4. a rectangular shell; 5. a heat exchanger; 51. a mounting box; 52. a heat collecting tray; 53. a heat conduction frame; 54. a second heat conductive sheet; 55. a heat conduction rod; 56. a circulating water pipe; 6. a water outlet pipe of the heat exchanger; 7. a water outlet main pipe; 8. an input tube; 9. a heat exchanger water inlet pipe; 10. a water inlet main pipe; 11. an output pipe; 12. a first coil; 13. a connecting pipe; 14. a water-cooling resistor; 15. a stabilizing strip; 16. a second coil; 17. a mounting ring; 18. a heat conducting column; 19. a slip ring; 20. a seal ring; 21. a support spring; 22. a heat conduction plate; 23. a first heat conductive sheet; 24. a mounting column; 25. an axial flow fan.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

Referring to fig. 1-5, an electronic heat load liquid cooling heat dissipation system comprises a mounting plate 1 and a heat exchanger 5, wherein a first mounting frame 2 and a second mounting frame 3 are fixedly mounted in the middle of the mounting plate 1, a rectangular shell 4 is fixedly mounted between the first mounting frame 2 and the second mounting frame 3, a heat exchanger water outlet pipe 6 is fixedly mounted at the output end of the heat exchanger 5, a water outlet main pipe 7 is fixedly mounted at the other end of the heat exchanger water outlet pipe 6, an input pipe 8 is fixedly mounted on the side wall of the water outlet main pipe 7, the other end of the input pipe 8 is fixedly mounted on one side of the first mounting frame 2, a heat conducting column 18 is arranged in the middle of the rectangular shell 4, the first mounting frame 2 and the second mounting frame 3 are communicated with the rectangular shell 4 through pipelines, a heat exchanger water inlet pipe 9 is fixedly mounted at the input end of the heat exchanger 5, a water inlet main pipe 10 is fixedly mounted at the other end of the heat exchanger water inlet pipe 9, an output pipe 11 is fixedly mounted at the side wall of the water inlet main pipe 10, and the other end of the output pipe 11 is fixedly mounted at the side wall of the second mounting frame 3.

This electron thermal load liquid cooling system adopts the cooling system of cooling many times, can be timely discharges the heat for the temperature on the electronic component can be discharged, the normal operational environment who reaches electronic component of being convenient for has improved electronic component's life, guarantees can the radiating mechanism hugs closely at the radiating position of needs to electronic component radiating in-process, has improved the performance of heat conduction, guarantees to export the efficiency of heat higher.

The inside of the first mounting frame 2 is fixedly provided with a first coil pipe 12, the side wall of the first coil pipe 12 is fixedly provided with a connecting pipe 13, the connecting pipe 13 penetrates through the first mounting frame 2, and the other end of the connecting pipe 13 is fixedly provided with a water cooling resistor 14; the side wall of the heat conduction column 18 is fixedly connected with a sliding ring 19, the sliding ring 19 is matched and slidingly connected inside the rectangular shell 4, the side wall of the heat conduction column 18 is fixedly connected with a sealing ring 20, and the sealing ring 20 is supported on the inner wall of the rectangular shell 4; the heat exchanger 5 comprises a mounting box 51, a heat collecting disc 52 is fixedly connected inside the mounting box 51, heat conducting frames 53 are fixedly arranged at the top end and the bottom end of the mounting box 51, a plurality of second heat conducting fins 54 are fixedly connected with the middle part of the heat conducting frames 53, and heat conducting rods 55 are fixedly arranged between the heat collecting disc 52 and the heat conducting frames 53; the middle part of the top end of the rectangular shell 4 is fixedly connected with a heat conducting disc 22, the top end of the heat conducting disc 22 is fixedly connected with a plurality of first heat conducting fins 23, both sides of the top end of the rectangular shell 4 are fixedly connected with mounting columns 24, and an axial flow fan 25 is fixedly installed between the two mounting columns 24.

When the heat-conducting system works, firstly, the heat-conducting column 18 in the system is aligned to a target position needing heat dissipation, then the heat-conducting column 18 can be installed and fixed by using the mounting plate 1, the heat-conducting column 18 can be tightly attached to the target position needing heat conduction by the supporting effect of the supporting spring 21 in the rectangular shell 4, then the liquid in the input pipe 8 is driven by using the external driving pump, the liquid is cooled by using the water-cooling resistor 14 in the process of conveying in the first coil 12, then is input into the rectangular shell 4 so as to take away heat through the heat-conducting column 18, is conveyed through the second coil 16, and is driven by the axial flow fan 25 to flow when the part in the rectangular shell 4 is positioned, then the heat-conducting disc 22 conducts part of the heat-conducting column 18, then the first heat-conducting disc 23 conducts heat dissipation through the flowing air, and absorbs the heat through the heat-collecting disc 52 when the heat-conducting disc is conveyed into the heat-conducting frame 53, then conducts heat through the heat-conducting rod 55, and then conducts heat through the second disc 54, and then the treated liquid is conveyed through the circulating water pipe 56, the water outlet pipe 6, the main pipe 7 and the main pipe 8, and the cooled heat is cooled.

In summary, the liquid in the first coil 12 can be cooled by the water-cooling resistor 14; the fixing strip 15 is fixedly connected to one end of the first installation frame 2, and the fixing strip 15 can be used for enabling the installation of the water-cooling resistor 14 to be more stable; mounting rings 17 are fixedly mounted on the side wall of the first coil pipe 12 and the side wall of the second coil pipe 16, the mounting rings 17 are respectively supported on the inner walls of the first mounting frame 2 and the second mounting frame 3, and the first coil pipe 12 and the second coil pipe 16 can be fixedly mounted by the aid of the mounting rings 17; the side wall of the heat conduction column 18 is fixedly connected with the sealing ring 20, the sealing ring 20 is supported on the inner wall of the rectangular shell 4, the side wall of the heat conduction column 18 is fixed by the sealing ring 20, and the sealing ring 20 is supported on the inner wall of the rectangular shell 4, so that the tightness of the heat conduction column is ensured, and the outflow of liquid is avoided; the heat conduction column 18 is supported at one end of the heat conduction column 18 through the support spring 21, and the heat conduction column 18 is driven to move by the support spring 21, so that the heat conduction column 18 can be tightly attached to a heat conduction target; when the liquid carries heat and is conveyed into the heat exchanger 5, the heat is absorbed through the heat collecting disc 52, then the heat is conveyed into the heat conducting frame 53 through the heat conducting rod 55, then the heat is radiated through the second heat conducting sheet 54, and then the radiated liquid is circularly cooled through the circulating water pipe 56 through the heat exchanger water outlet pipe 6, the water outlet main pipe 7 and the input pipe 8; when the rectangular shell 4 is positioned, the air is driven to flow by the axial flow fan 25, then the heat conducting disc 22 conducts out part of heat of the heat conducting column 18, and then the first heat conducting fin 23 carries out heat dissipation treatment through the flowing air.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an electron thermal load liquid cooling system, includes mounting panel (1) and heat exchanger (5), its characterized in that: the heat exchanger is characterized in that a first mounting frame (2) and a second mounting frame (3) are fixedly mounted in the middle of the mounting plate (1), a rectangular shell (4) is fixedly mounted between the first mounting frame (2) and the second mounting frame (3), a heat exchanger water outlet pipe (6) is fixedly mounted at the output end of the heat exchanger (5), a water outlet main pipe (7) is fixedly mounted at the other end of the heat exchanger water outlet pipe (6), an input pipe (8) is fixedly mounted at the side wall of the water outlet main pipe (7), an output pipe (11) is fixedly mounted at the other end of the input pipe (8) at one side of the first mounting frame (2), a heat conducting column (18) is arranged in the middle of the rectangular shell (4), the first mounting frame (2) and the second mounting frame (3) are communicated with the rectangular shell (4) through a pipeline, a heat exchanger water inlet pipe (9) is fixedly mounted at the input end of the heat exchanger (5), a water inlet main pipe (10) is fixedly mounted at the other end of the heat exchanger water inlet pipe (9), an output pipe (11) is fixedly mounted at the side wall of the water inlet main pipe (10), and an output pipe (11) is fixedly mounted at the other end of the heat exchanger water inlet pipe (9) at the side wall of the heat exchanger water pipe.

2. The electronic heat load liquid cooled heat dissipating system of claim 1, wherein: the novel solar energy water heater is characterized in that a first coil pipe (12) is fixedly arranged in the first mounting frame (2), a connecting pipe (13) is fixedly arranged on the side wall of the first coil pipe (12), the connecting pipe (13) penetrates through the first mounting frame (2), and a water cooling resistor (14) is fixedly arranged at the other end of the connecting pipe (13).

3. The electronic heat load liquid cooled heat dissipating system of claim 1, wherein: the side wall fixedly connected with slip ring (19) of heat conduction post (18), just slip ring (19) match sliding connection inside rectangle shell (4), the side wall fixedly connected with sealing ring (20) of heat conduction post (18), sealing ring (20) support the inner wall at rectangle shell (4).

4. The electronic heat load liquid cooled heat dissipating system of claim 1, wherein: the heat exchanger (5) comprises an installation box (51), a heat collecting disc (52) is fixedly connected to the inside of the installation box (51), a heat conducting frame (53) is fixedly installed at the top end and the bottom end of the installation box (51), a plurality of second heat conducting fins (54) are fixedly connected to the middle of the heat conducting frame (53), and a heat conducting rod (55) is fixedly installed between the heat collecting disc (52) and the heat conducting frame (53).

5. The electronic heat load liquid cooled heat dissipating system of claim 1, wherein: the novel heat-conducting structure is characterized in that a heat-conducting disc (22) is fixedly connected to the middle of the top end of the rectangular shell (4), a plurality of first heat-conducting fins (23) are fixedly connected to the top end of the heat-conducting disc (22), mounting columns (24) are fixedly connected to two sides of the top end of the rectangular shell (4), and an axial flow fan (25) is fixedly installed between the two mounting columns (24).