CN111970855A

CN111970855A - Vacuum fixing and mounting system for integrated circuit

Info

Publication number: CN111970855A
Application number: CN202010899139.XA
Authority: CN
Inventors: 隋心怡
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-08-31
Filing date: 2020-08-31
Publication date: 2020-11-20

Abstract

The invention discloses an integrated circuit vacuum fixing and mounting system which comprises a fixing module, an adsorption module, a positioning module, a silicon wafer and a PCB. According to the invention, the fixing module is arranged, so that the PCB can be fixed on the upper surface of the heating table and can be heated, manual pressing of the PCB is replaced, the phenomenon that an operator is scalded is further avoided, and the adsorption module is arranged, so that the clamp is replaced by an adsorption mode, and the problem that the clamp is easy to scratch the surface of the silicon wafer in the process of clamping the silicon wafer is solved.

Description

Vacuum fixing and mounting system for integrated circuit

Technical Field

The invention relates to the technical field of product production, in particular to a vacuum fixed mounting system for an integrated circuit.

Background

After the invention of the transistor is produced in large quantities, various solid semiconductor components such as diodes, transistors and the like are used in large quantities, and the functions and roles of the vacuum tube in the circuit are replaced. By the middle and late 20 th century, semiconductor manufacturing technology advances, making integrated circuits possible. It is a great advance that integrated circuits can integrate a very large number of micro-transistors into a single small chip, as opposed to manually assembling the circuits using individual discrete electronic components. The scale production capacity and reliability of the integrated circuit and the modular method of circuit design ensure that the standardized integrated circuit is quickly adopted to replace the design of using discrete transistors, but the integrated circuit of the transistors can normally work only by being connected with a loaded PCB, and the traditional installation mode can increase the assembly error to a certain extent due to manual intervention.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides an integrated circuit vacuum fixed mounting system, which solves the problem that the assembly error is increased to a certain extent due to manual intervention in the traditional mounting mode.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides an integrated circuit vacuum fixed mounting system, includes fixed module, adsorption module, orientation module, silicon wafer and PCB board, fixed module include warm table, warm table support, fixed plate, spacing, pressure pole, dead lever, stationary blade, fixed spring limiting plate, preforming and heater strip, the equal fixedly connected with warm table support in four corners department of warm table lower surface, the middle part fixedly connected with heater strip of warm table lower surface, the middle part overlap joint of warm table upper surface has the PCB board, and the both sides of PCB board all are provided with spacing, two spacing all is connected with the last fixed surface of warm table, the last fixed surface overlap joint of PCB board has the fixed plate, and the left end of fixed plate passes through fixed plate support swing joint with the warm table.

The adsorption module include the exhaust bucket, the bucket cover of bleeding, the bucket cover support of bleeding, breathing pipe, inhale the gas stopper, adsorb fan support, adsorb the fan, adsorb drive gear, adsorb middle gear support, adsorb linkage gear, adsorb middle driven gear, adsorb the gear ring, adsorb motor and adsorb the drive gear, the top of PCB board is provided with the silicon wafer, and the upper surface overlap joint of silicon wafer has the gas stopper, and the last fixed surface of inhaling the gas stopper is connected with the breathing pipe, the top fixedly connected with exhaust bucket of breathing pipe, and the bottom of exhaust bucket inner wall is connected with the absorption fan through adsorbing fan support rotation, adsorbs the last fixed surface of fan and is connected with and adsorbs drive gear, the surface of exhaust bucket has cup jointed the bucket cover of bleeding, and the below of the bucket cover of bleeding is through the bucket cover support fixedly connected with orientation module of bleeding.

The positioning module include lead screw, gag lever post, elevating platform, transmitting gear, location middle driven gear, location middle driving gear, location middle gear support, positioning motor and location driving gear, the below of the barrel casing of bleeding is through the barrel casing support fixedly connected with elevating platform that bleeds, and the elevating platform cup joints at the surface of breathing pipe, and the elevating platform passes through gag lever post sliding connection with the heating platen, the one end threaded connection that the barrel was bled far away from to the elevating platform has the lead screw, the bottom fixedly connected with transmitting gear of lead screw, transmitting gear rotates with the upper surface of heating platen and is connected.

Preferably, the fixed plates are two, the right ends of the two fixed plates are fixedly connected through a pressure rod, the middle of the pressure rod is fixedly connected with a pressing sheet, a fixing sheet is lapped on the upper surface of the pressing sheet, and the fixing sheet is connected with the heating table in a sliding mode through a fixing rod.

Preferably, the top end fixedly connected with fixed spring limiting plate of dead lever is provided with fixed spring between the opposite face of fixed spring limiting plate and stationary blade, and fixed spring encircles the outside at the dead lever, fixed spring's top and bottom respectively with fixed spring limiting plate and stationary blade fixed connection.

Preferably, the internal gear of the adsorption driving gear is connected with an adsorption middle driving gear, an adsorption middle driven gear is fixedly connected above the adsorption middle driving gear through a connecting shaft, and the adsorption middle driven gear and the adsorption middle driving gear are rotatably connected with the air extraction barrel through an adsorption middle gear support.

Preferably, the outer surface gear of the adsorption middle driven gear is connected with an adsorption linkage gear, the outer surface gear of the adsorption linkage gear is connected with an adsorption gear ring, and the adsorption gear ring is rotatably connected with the inner wall of the air suction barrel.

Preferably, the inner ring gear of the adsorption gear ring is connected with an adsorption driving gear, an adsorption motor is arranged above the adsorption driving gear, an output shaft of the adsorption motor is fixedly connected with the adsorption driving gear, and the adsorption motor is fixedly connected with the inner wall of the air extraction barrel.

Preferably, the outer surface gear of the rotating gear is connected with a positioning middle driving gear, a positioning middle driven gear is fixedly connected above the positioning middle driving gear through a connecting shaft, and the positioning middle driven gear and the positioning middle driving gear are rotatably connected with the heating table through a positioning middle gear support.

Preferably, the outer surface gear of the middle positioning driven gear is connected with a positioning driving gear, a positioning motor is arranged below the positioning driving gear, an output shaft of the positioning motor is fixedly connected with the positioning driving gear, and the positioning motor is fixedly connected with the heating table.

Compared with the prior art, the invention provides an integrated circuit vacuum fixing and mounting system, which has the following beneficial effects: according to the invention, the fixing module is arranged, so that the PCB can be fixed on the upper surface of the heating table and can be heated, manual pressing of the PCB is replaced, the phenomenon that an operator is scalded is further avoided, and the adsorption module is arranged, so that the clamp is replaced by an adsorption mode, and the problem that the clamp is easy to scratch the surface of the silicon wafer in the process of clamping the silicon wafer is solved.

Drawings

FIG. 1 is a schematic view of the structure of the present invention.

Fig. 2 is a schematic structural diagram of a position-limiting plate for fixing a spring according to the present invention.

FIG. 3 is a schematic view of the present invention.

FIG. 4 is a schematic structural diagram of a positioning module according to the present invention.

Fig. 5 is a schematic structural view of the heating wire of the present invention.

FIG. 6 is a schematic view of the adsorption module structure of the present invention.

FIG. 7 is a schematic view of an adsorption module according to the present invention.

In the figure: 1-a fixed module; 101-a heating table; 102-a heating table support; 103-fixing the plate holder; 104-a fixing plate; 105-a stop bar; 106-pressure rod; 107-fixing rods; 108-a fixing sheet; 109-a fixed spring; 110-fixed spring limit plate; 111-tabletting; 112-heating wires; 2-an adsorption module; 201-an air extraction barrel; 202-an air extraction barrel sleeve; 203-an air extraction barrel sleeve bracket; 204-suction pipe; 205-suction plug; 206-adsorption fan support; 207-adsorption fan; 208-suction drive gear; 209-adsorption intermediate driving gear; 210-adsorption intermediate gear support; 211-adsorption linkage gear; 212-adsorption intermediate driven gear; 213-adsorption gear ring; 214-a sorption motor; 215-adsorption driving gear; 3-a positioning module; 301-lead screw; 302-a limiting rod; 303-a lifting platform; 304-a rotating gear; 305-positioning the intermediate driven gear; 306-positioning the intermediate drive gear; 307-positioning the intermediate gear support; 308-positioning the motor; 309-positioning a driving gear; a 4-silicon wafer; 5-PCB board.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1, fig. 2, fig. 3, fig. 4, fig. 5, fig. 6, and fig. 7, the present invention provides a technical solution: an integrated circuit vacuum fixed mounting system comprises a fixed module 1, an adsorption module 2, a positioning module 3, a silicon wafer 4 and a PCB 5, as shown in figure 1, figure 2 and figure 5, wherein the fixed module 1 comprises a heating table 101, a heating table bracket 102, a fixed plate bracket 103, a fixed plate 104, a limiting strip 105, a pressure rod 106, a fixed rod 107, a fixed sheet 108, a fixed spring 109, a fixed spring limiting plate 110, a pressing sheet 111 and a heating wire 112, the four corners of the lower surface of the heating table 101 are fixedly connected with the heating table bracket 102, the middle of the lower surface of the heating table 101 is fixedly connected with the heating wire 112, the PCB 5 is lapped on the middle of the upper surface of the heating table 101, the limiting strips 105 are arranged on two sides of the PCB 5, the two limiting strips 105 are fixedly connected with the upper surface of the heating table 101, the fixed plate 104 is lapped on the upper surface of the PCB 5, the left end of the fixed plate 104 is movably connected, fixing plate 104 is two, the right-hand member of two fixing plates 104 passes through pressure pole 106 fixed connection, the middle part fixedly connected with preforming 111 of pressure pole 106, the upper surface overlap joint of preforming 111 has the stationary blade 108, stationary blade 108 passes through dead lever 107 sliding connection with warm table 101, the top fixedly connected with fixed spring limiting plate 110 of dead lever 107, be provided with fixed spring 109 between the opposite face of fixed spring limiting plate 110 and stationary blade 108, fixed spring 109 encircles the outside at dead lever 107, fixed spring 109's top and bottom respectively with fixed spring limiting plate 110 and stationary blade 108 fixed connection.

Referring to fig. 6 and 7, which are structural diagrams of an adsorption module of the present invention, an adsorption module 2 includes an air suction barrel 201, an air suction barrel sleeve 202, an air suction barrel sleeve support 203, an air suction pipe 204, an air suction plug 205, an adsorption fan support 206, an adsorption fan 207, an adsorption drive gear 208, an adsorption intermediate drive gear 209, an adsorption intermediate gear support 210, an adsorption linkage gear 211, an adsorption intermediate driven gear 212, an adsorption gear ring 213, an adsorption motor 214 and an adsorption drive gear 215, a silicon wafer 4 is disposed above a PCB 5, the air suction plug 205 is mounted on the upper surface of the silicon wafer 4, the air suction pipe 204 is fixedly connected to the upper surface of the air suction plug 205, the top end of the air suction pipe 204 is fixedly connected to the air suction barrel 201, the bottom of the inner wall of the air suction barrel 201 is rotatably connected to the adsorption fan 207 through the adsorption fan support 206, the adsorption drive gear 208 is fixedly connected to, the lower part of the air extraction barrel sleeve 202 is fixedly connected with a positioning module 3 through an air extraction barrel sleeve support 203, an internal gear of an adsorption driving gear 208 is connected with an adsorption middle driving gear 209, the upper part of the adsorption middle driving gear 209 is fixedly connected with an adsorption middle driven gear 212 through a connecting shaft, the adsorption middle driven gear 212 and the adsorption middle driving gear 209 are rotatably connected with the air extraction barrel 201 through an adsorption middle gear support 210, an outer surface gear of the adsorption middle driven gear 212 is connected with an adsorption linkage gear 211, an outer surface gear of the adsorption linkage gear 211 is connected with an adsorption gear ring 213, the adsorption gear ring 213 is rotatably connected with the inner wall of the air extraction barrel 201, an inner ring gear of the adsorption gear ring 213 is connected with an adsorption driving gear 215, an adsorption motor 214 is arranged above the adsorption driving gear 215, an output shaft of the adsorption motor 214 is fixedly connected with the adsorption driving gear 215.

Referring to fig. 3 and 4, the positioning module 3 includes a screw 301, a limiting rod 302, a lifting platform 303, a rotating gear 304, a positioning intermediate driven gear 305, a positioning intermediate driving gear 306, a positioning intermediate gear bracket 307, a positioning motor 308 and a positioning driving gear 309, the lower portion of the air pumping barrel casing 202 is fixedly connected with the lifting platform 303 through the air pumping barrel casing bracket 203, the lifting platform 303 is sleeved on the outer surface of the air suction pipe 204, the lifting platform 303 is slidably connected with the heating platform 101 through the limiting rod 302, one end of the lifting platform 303 far away from the air pumping barrel 201 is in threaded connection with the screw 301, the bottom end of the screw 301 is fixedly connected with the rotating gear 304, the rotating gear 304 is rotatably connected with the upper surface of the heating platform 101, the outer surface of the rotating gear 304 is in gear connection with the positioning intermediate driving gear 306, the upper portion of the positioning intermediate driving gear, the middle positioning driven gear 305 and the middle positioning driving gear 306 are rotatably connected with the heating table 101 through a middle positioning gear bracket 307, the outer surface of the middle positioning driven gear 305 is connected with a positioning driving gear 309 through a gear, a positioning motor 308 is arranged below the positioning driving gear 309, an output shaft of the positioning motor 308 is fixedly connected with the positioning driving gear 309, and the positioning motor 308 is fixedly connected with the heating table 101.

When the adsorption type PCB heating device is used, a user firstly places a PCB 5 on the upper surface of a heating table 101, the PCB 5 is fixed on the upper surface of the heating table 101 through a fixing plate 104, the heating wire 112 is electrified, the heating wire 112 generates heat, the heating wire 112 heats the PCB 5, solder paste is coated on the upper surface of the PCB 5, then the adsorption motor 214 is started, an output shaft of the adsorption motor 214 drives an adsorption gear ring 213 to rotate, the adsorption gear ring 213 rotates to drive an adsorption linkage gear 211 to rotate, the adsorption linkage gear 211 rotates to drive an adsorption middle driven gear 212 to rotate, the adsorption middle driven gear 212 rotates to drive an adsorption middle driving gear 209 to rotate, the adsorption middle driving gear 209 rotates to drive an adsorption driving gear 208 to rotate, the adsorption driving gear 208 rotates to drive an adsorption fan 207 to rotate, and the adsorption fan 207 rotates to enable the interior of the extraction barrel 201 to be in a low-pressure state, and adsorb silicon wafer 4 on the lower surface of the air suction plug 205 through the air suction pipe 204 and the air suction plug 205, at this time, the user starts the positioning motor 308, the output shaft of the positioning motor 308 drives the positioning driving gear 309 to rotate, the positioning driving gear 309 rotates to drive the positioning middle driven gear 305 to rotate, the positioning middle driven gear 305 rotates to drive the positioning middle driving gear 306 to rotate, the positioning middle driving gear 306 rotates to drive the rotating gear 304 to rotate, the rotating gear 304 rotates to drive the screw 301 to rotate, the screw 301 rotates to drive the adsorption module 2 to integrally and linearly move through the lifting platform 303, the adsorption module 2 integrally and linearly moves to enable the silicon wafer 4 to move along with the adsorption module 2, and the silicon wafer 4 is attached to the upper surface of the PCB 5.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An integrated circuit vacuum fixed mounting system comprises a fixing module (1), an adsorption module (2), a positioning module (3), a silicon wafer (4) and a PCB (printed circuit board) 5, and is characterized in that: the fixing module (1) comprises a heating table (101), a heating table bracket (102), a fixing plate bracket (103), a fixing plate (104), a limiting strip (105), a pressure rod (106), a fixing rod (107), a fixing sheet (108), a fixing spring (109), a fixing spring limiting plate (11), a pressing sheet (111) and a heating wire (112), four corners of the lower surface of the heating table (101) are fixedly connected with heating table brackets (102), the middle part of the lower surface of the heating table (101) is fixedly connected with a heating wire (112), the middle part of the upper surface of the heating table (101) is lapped with a PCB (5), both sides of the PCB (5) are provided with limiting strips (105), both limiting strips (105) are fixedly connected with the upper surface of the heating table (101), a fixing plate (104) is lapped on the upper surface of the PCB (5), and the left end of the fixing plate (104) is movably connected with the heating table (101) through a fixing plate bracket (103).

2. The adsorption module (2) comprises an air suction barrel (201), an air suction barrel sleeve (202), an air suction barrel sleeve support (203), an air suction pipe (204), an air suction plug (205), an adsorption fan support (206), an adsorption fan (207), an adsorption driving gear (208), an adsorption middle driving gear (209), an adsorption middle gear support (210), an adsorption linkage gear (211), an adsorption middle driven gear (212), an adsorption gear ring (213), an adsorption motor (214) and an adsorption driving gear (215), wherein a silicon wafer (4) is arranged above the PCB (5), the upper surface of the silicon wafer (4) is lapped with the air suction plug (205), the upper surface of the air suction plug (205) is fixedly connected with the air suction pipe (204), the top end of the air suction pipe (204) is fixedly connected with the air suction barrel (201), and the bottom of the inner wall of the air suction barrel (201) is rotatably connected with the adsorption fan (207) through, the upper surface of the adsorption fan (207) is fixedly connected with an adsorption driving gear (208), the outer surface of the air suction barrel (201) is sleeved with an air suction barrel sleeve (202), and a positioning module (3) is fixedly connected below the air suction barrel sleeve (202) through an air suction barrel sleeve support (203).

3. Positioning module (3) including lead screw (301), gag lever post (302), elevating platform (303), rotating gear (304), driven gear (305) in the middle of the location, driving gear (306) in the middle of the location, location middle gear support (307), positioning motor (308) and location driving gear (309), the below of the bucket cover (202) of bleeding is through the bucket cover support (203) fixedly connected with elevating platform (303) of bleeding, and elevating platform (303) cup joint the surface at breathing pipe (204), elevating platform (303) and heating station (101) are through gag lever post (302) sliding connection, the one end threaded connection who keeps away from aspirating bucket (201) of elevating platform (303) has lead screw (301), the bottom fixedly connected with rotating gear (304) of lead screw (301), rotating gear (304) rotate with the upper surface of heating station (101) and be connected.

4. An integrated circuit vacuum mounting system according to claim 1, wherein: the heating table is characterized in that the number of the fixing plates (104) is two, the right ends of the two fixing plates (104) are fixedly connected through a pressure rod (106), the middle of the pressure rod (106) is fixedly connected with a pressing sheet (111), a fixing sheet (108) is lapped on the upper surface of the pressing sheet (111), and the fixing sheet (108) is connected with the heating table (101) in a sliding mode through a fixing rod (107).

5. An integrated circuit vacuum mounting system according to claim 1, wherein: the top fixedly connected with fixed spring limiting plate (110) of dead lever (107), be provided with fixed spring (109) between the opposite face of fixed spring limiting plate (110) and stationary blade (108), fixed spring (109) encircle the outside at dead lever (107), the top and the bottom of fixed spring (109) respectively with fixed spring limiting plate (110) and stationary blade (108) fixed connection.

6. An integrated circuit vacuum mounting system according to claim 1, wherein: the internal gear of the adsorption driving gear (208) is connected with an adsorption middle driving gear (209), the upper part of the adsorption middle driving gear (209) is connected with an adsorption middle driven gear (212) through a connecting shaft fixedly, and the adsorption middle driven gear (212) and the adsorption middle driving gear (209) are rotatably connected with the air extraction barrel (201) through an adsorption middle gear support (210).

7. An integrated circuit vacuum mounting system according to claim 1, wherein: the outer surface gear of adsorbing middle driven gear (212) is connected with adsorbs linkage gear (211), and the outer surface gear of adsorbing linkage gear (211) is connected with adsorbs ring gear (213), adsorbs ring gear (213) and rotates with the inner wall of exhaust bucket (201) and is connected.

8. An integrated circuit vacuum mounting system according to claim 1, wherein: an inner ring gear of the adsorption gear ring (213) is connected with an adsorption driving gear (215), an adsorption motor (214) is arranged above the adsorption driving gear (215), an output shaft of the adsorption motor (214) is fixedly connected with the adsorption driving gear (215), and the adsorption motor (214) is fixedly connected with the inner wall of the air extraction barrel (201).

9. An integrated circuit vacuum mounting system according to claim 1, wherein: the outer surface gear of the rotating gear (304) is connected with a positioning middle driving gear (306), a positioning middle driven gear (305) is fixedly connected above the positioning middle driving gear (306) through a connecting shaft, and the positioning middle driven gear (305) and the positioning middle driving gear (306) are rotatably connected with the heating table (101) through a positioning middle gear bracket (307).

10. An integrated circuit vacuum mounting system according to claim 1, wherein: the outer surface gear of the middle positioning driven gear (305) is connected with a positioning driving gear (309), a positioning motor (308) is arranged below the positioning driving gear (309), an output shaft of the positioning motor (308) is fixedly connected with the positioning driving gear (309), and the positioning motor (308) is fixedly connected with the heating table (101).