CN111964502A - Heat dissipation device and manufacturing method thereof - Google Patents
Heat dissipation device and manufacturing method thereof Download PDFInfo
- Publication number
- CN111964502A CN111964502A CN202010825015.7A CN202010825015A CN111964502A CN 111964502 A CN111964502 A CN 111964502A CN 202010825015 A CN202010825015 A CN 202010825015A CN 111964502 A CN111964502 A CN 111964502A
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- Prior art keywords
- pipe
- heat
- heat dissipation
- radiating
- heated
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat dissipation device and a manufacturing method thereof, wherein the heat dissipation device comprises a heated tube and a plurality of heat dissipation tubes, each heat dissipation tube is arranged on the side wall of the heated tube and is communicated with the heated tube, copper powder is arranged on the inner wall of the heated tube, and the copper powder in the heated tube is used for adsorbing a heat dissipation medium; mounting holes are formed in the upper side of the heated tube, and bolts are screwed into the mounting holes; drawing the bolt; one end of the radiating pipe is embedded into the annular flanging and sealed and fixed. In the use, the produced heat transfer of heat source is to receiving the heat pipe to make the heat dissipation medium evaporation in the heat pipe become the gaseous state, gaseous state heat dissipation medium gets into in the cooling tube, releases away the heat through the cooling tube, and gaseous state heat dissipation medium can be at the internal face condensation backward flow of cooling tube to the cooling tube, thereby forms the cyclic utilization of heat dissipation medium, can effectively improve the radiating efficiency through a plurality of cooling tubes like this.
Description
Technical Field
The invention is used in the field of heat dissipation devices, and particularly relates to a heat dissipation device and a manufacturing method thereof.
Background
At present, a common heat dissipation device is generally formed by bending a pipeline, and the heat dissipation device has a single mechanism and poor heat dissipation performance.
Disclosure of Invention
The present invention is directed to at least one of the problems of the prior art, and provides a heat dissipation device and a method for manufacturing the same, which has a better heat dissipation performance.
The technical scheme adopted by the invention for solving the technical problems is as follows: the utility model provides a heat radiating device, is including receiving heat pipe and a plurality of cooling tube, each the cooling tube is installed receive the heat pipe lateral wall and with receive the heat pipe intercommunication, it is equipped with the copper powder to receive the heat pipe inner wall, the copper powder in the heat pipe is used for adsorbing the radiating medium, and the radiating medium can carry the heat and get into the cooling tube dispels the heat, and the radiating medium after the heat dissipation can flow back extremely in the copper powder in the heat pipe.
Further as an improvement of the technical scheme of the invention, copper powder is arranged in the radiating pipe.
Further as an improvement of the technical scheme of the invention, the inner wall of the heat radiating pipe is provided with a groove structure.
As a further improvement of the technical scheme of the invention, one end of the radiating pipe is communicated with the heated pipe, and the other end of the radiating pipe is closed.
Further as an improvement of the technical scheme of the invention, the heat radiating pipes are arranged at intervals along the length direction of the heated pipe.
As a further improvement of the technical scheme of the invention, a sealing device is arranged at the joint of the radiating pipe and the heated pipe.
Further as an improvement of the technical scheme of the invention, the copper powder arranged in the heated tube is connected with the copper powder arranged in the radiating tube.
Further as an improvement of the technical scheme of the invention, the radiating pipe and the heated pipe also comprise a square pipe made of a soaking plate.
A method of manufacturing a heat sink comprising the steps of:
manufacturing a radiating pipe and a heated pipe with copper powder inside;
mounting holes are formed in the side wall of the heated tube;
bolts are screwed into the mounting holes;
drawing the bolt to turn the orifice of the mounting hole outwards to form an annular flanging for assembling the radiating pipe;
one end of the radiating pipe is embedded into the annular flanging and sealed and fixed.
As a further improvement of the technical scheme of the invention, a mounting hole is formed in the side wall of the heated pipe, and a steel column is used for propping from the inside of the heated pipe to the outside of the heated pipe at the mounting hole, so that the orifice of the mounting hole is protruded to form an annular flanging capable of assembling the radiating pipe.
One of the above technical solutions has at least one of the following advantages or beneficial effects: in the use process, the heated tube is close to the heat source, the heat generated by the heat source is transferred to the heated tube, so that the heat dissipation medium adsorbed on the copper powder in the heated tube is slowly evaporated to become a gaseous state, the gaseous heat dissipation medium carries the heat to enter the heat dissipation tube for heat dissipation, the heat is released through the heat dissipation tube, the gaseous heat dissipation medium after the heat is released can be condensed on the inner wall surface of the heat dissipation tube, the condensed heat dissipation medium can flow back to the copper powder in the heat dissipation tube for cyclic utilization, and therefore the heat dissipation efficiency can be effectively improved through the plurality of heat dissipation tubes.
Drawings
The invention will be further described with reference to the accompanying drawings in which:
FIG. 1 is a schematic block diagram of one embodiment of the present invention;
FIG. 2 is a side view of the embodiment shown in FIG. 1;
FIG. 3 is a sectional view taken along line A-A of FIG. 2;
fig. 4 is a partially enlarged view at B in fig. 3.
Detailed Description
Reference will now be made in detail to the present preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout.
In the present invention, if directions (up, down, left, right, front, and rear) are described, it is only for convenience of describing the technical solution of the present invention, and it is not intended or implied that the technical features referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, it is not to be construed as limiting the present invention.
In the invention, the meaning of "a plurality" is one or more, the meaning of "a plurality" is more than two, and the terms of "more than", "less than", "more than" and the like are understood to exclude the number; the terms "above", "below", "within" and the like are understood to include the instant numbers. In the description of the present invention, if there is description of "first" and "second" only for the purpose of distinguishing technical features, it is not to be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating the precedence of the indicated technical features.
In the present invention, unless otherwise specifically limited, the terms "disposed," "mounted," "connected," and the like are to be understood in a broad sense, and for example, may be directly connected or indirectly connected through an intermediate; can be fixedly connected, can also be detachably connected and can also be integrally formed; may be mechanically coupled, may be electrically coupled or may be capable of communicating with each other; either as communication within the two elements or as an interactive relationship of the two elements. The specific meaning of the above-mentioned words in the present invention can be reasonably determined by those skilled in the art in combination with the detailed contents of the technical solutions.
Referring to fig. 1 to 4, an embodiment of the present invention provides a heat dissipation apparatus, which mainly includes a heated tube 1 and a plurality of heat dissipation tubes 2, each heat dissipation tube 2 is installed on an upper side of the heated tube 1 and is communicated with the heated tube 1, copper powder 3 is disposed on an inner wall surface of the heated tube 1, the copper powder 3 in the heated tube 1 is used to adsorb a heat dissipation medium, the heat dissipation medium can carry heat to enter the heat dissipation tube 2 for heat dissipation, and the heat dissipation medium after heat dissipation can flow back to the copper powder 3 in the heated tube 1.
In the use process, the heated tube 1 is close to a heat source, heat generated by the heat source is transferred to the heated tube 1, so that the heat dissipation medium adsorbed on the copper powder 3 in the heated tube 1 is slowly evaporated to become a gaseous state, the gaseous heat dissipation medium carries the heat to enter the heat dissipation tube 2 for heat dissipation, the heat is released out through the heat dissipation tube 2, the gaseous heat dissipation medium after the heat is released can be condensed on the inner wall surface of the heat dissipation tube 2, the condensed heat dissipation medium can flow back to the heat dissipation tube 2 under the action of gravity, and therefore the cyclic utilization of the heat dissipation medium is formed, and therefore the heat dissipation efficiency can be effectively improved through the heat dissipation tubes.
Referring to fig. 3, before use, a filling nozzle 11 for filling a heat dissipation medium is disposed at one end of the heated tube 1, and the heat dissipation medium is filled into the heated tube 1 through the filling nozzle 11, so that the heat dissipation medium is adsorbed on the copper powder 3 in the radiating tube 2 until the copper powder 3 in the radiating tube 2 is adsorbed and saturated, specifically, the heat dissipation medium is a liquid substance with a large specific heat capacity, such as water.
In some embodiments, the heat dissipation pipe 2 is also provided with copper powder 3, the heat dissipation medium is condensed into a liquid state after dissipating heat in the heat dissipation pipe 2 and enters the copper powder 3 in the heat dissipation pipe 2, and the heat dissipation medium is guided to the copper powder in the heated pipe 1 through the copper powder 3 in the heat dissipation pipe 2.
In other embodiments, besides the function of sintering the copper powder 3 in the heat dissipation pipe 2 to achieve the diversion, a groove structure or a capillary structure may be provided in the heat dissipation pipe 2, and the function of diversion after condensation of the heat dissipation medium can also be achieved through the groove structure or the capillary structure.
Referring to fig. 3 and 4, in some embodiments, the copper powder 3 arranged in the heated tube 1 is connected with the copper powder 3 arranged in the radiating tube 2, and the gaseous radiating medium carrying heat is condensed and then enters the copper powder 3 in the radiating tube 2, and flows to the copper powder 3 in the heated tube 1 along the copper powder 3 under the action of gravity, so that the smooth backflow path of the condensed radiating medium is ensured.
Referring to fig. 1 and 3, in some embodiments, a plurality of radiating pipes 2 on a heated pipe 1 are arranged side by side at intervals along the length direction of the heated pipe 1, and the radiating efficiency of the radiating pipes 2 is increased by arranging the radiating pipes at intervals, for example, in the illustrated embodiment of the present invention, 5 radiating pipes 2 are arranged side by side at intervals on the top end of the heated pipe 1, and the intervals between each radiating pipe 2 are equal.
Referring to fig. 3, further, each radiating pipe 2 is vertically connected to the heated pipe 1, so that the condensed radiating medium can flow into the heated pipe 1 more quickly under the action of gravity, and the circulation speed of the radiating medium is increased.
Further, the radiating pipe 2 and the heated pipe 1 may be provided not only in a circular structure in the illustrated embodiment of the present invention but also in a square pipe structure made by a soaking plate.
Referring to fig. 1 and 3, in some embodiments, the bottom end of the radiating pipe 2 is communicated with the heated pipe 1, and the top end of the radiating pipe 2 is closed, so that a gaseous radiating medium carrying heat is prevented from flowing away from the top of the radiating pipe 2, the radiating medium is ensured to be always kept in the radiating pipe 2 for radiating, and the utilization rate of the radiating medium is improved.
Referring to fig. 4, in some embodiments, a sealing device is disposed at a joint of the radiating pipe 2 and the heated pipe 1, and a joint gap between the radiating pipe 2 and the heated pipe 1 is sealed by the sealing device, so that a radiating medium is effectively prevented from flowing away from an assembly gap between the radiating pipe 2 and the heated pipe 1, and the utilization rate of a radiating value is further improved.
The embodiment of the invention also provides a manufacturing method of the heat dissipation device, which comprises the following steps:
firstly, copper powder 3 is sintered on the inner wall surface of a heated pipe 1 and the inner wall surfaces of radiating pipes 2, so that the copper powder 3 is fixed on the inner wall surfaces of the heated pipe 1 and the radiating pipes 2, then an installation hole with the aperture larger than the pipe diameter of the radiating pipes 2 is formed in the upper side of the heated pipe 1, a threaded opening is formed in the orifice of the installation hole in a tapping mode, a bolt is screwed into the tapped installation hole, then the bolt is pulled out, the orifice of the installation hole is pulled outwards through the bolt, so that the orifice of the installation hole extends upwards to form a raised annular flanging 12, one end of the radiating pipe 2 is embedded into the annular flanging 12 and fixed in a sealing mode, the stretched annular flanging 12 is matched and connected with the radiating pipes 2, the radiating pipes 2 and the heated pipe 1 can be assembled more tightly, the outer diameter of the bolt is slightly larger than the pipe diameter of the radiating pipes 2, and.
In other embodiments, after the upper side of the heated tube 1 is provided with the mounting hole, a steel column is used for supporting the heated tube 1 from the inside of the heated tube 1 to the outside of the heated tube 1 at the mounting hole, so that the opening of the mounting hole is extended to form a raised annular flange 12.
In the operation process, a worker stretches a steel column into the heated pipe 1, so that one end of the steel column is propped against the opening of the mounting hole from the inside of the heated pipe 1, then the steel column is knocked at the other end of the steel column to be propped at the opening of the mounting hole, and therefore the annular flanging 12 is machined, wherein the diameter of the steel column is slightly larger than the pipe diameter of the radiating pipe 2, and the machined mounting hole facilitates the installation of the radiating pipe 2.
The invention is not limited to the above embodiments, and those skilled in the art can make equivalent modifications or substitutions without departing from the spirit of the invention, and such equivalent modifications or substitutions are included in the scope defined by the claims of the present application.
Claims (10)
1. A heat dissipation device, characterized in that: including receiving heat pipe and a plurality of cooling tube, each the cooling tube is installed receive the heat pipe lateral wall and with receive the heat pipe intercommunication, it is equipped with the copper powder to receive the heat pipe inner wall, the copper powder in the heat pipe is used for adsorbing the radiating medium, and the radiating medium carries the heat and gets into the cooling tube dispels the heat, the radiating medium after the heat dissipation backward flow extremely in the copper powder in the heat pipe.
2. The heat dissipating device of claim 1, wherein: copper powder is arranged in the radiating pipe.
3. The heat dissipating device of claim 1, wherein: the inner wall of the heat radiating pipe is provided with a groove structure.
4. The heat dissipating device of claim 1, wherein: one end of the radiating pipe is communicated with the heated pipe, and the other end of the radiating pipe is sealed.
5. The heat dissipating device of claim 1, wherein: the heat dissipation pipes are arranged at intervals along the length direction of the heated pipe.
6. The heat dissipating device of claim 4, wherein: and a sealing device is arranged at the joint of the radiating pipe and the heated pipe.
7. The heat dissipating device of claim 2, wherein: and copper powder arranged in the heated tube is connected with copper powder arranged in the radiating tube.
8. The heat dissipating device of claim 1, wherein: the radiating pipe and the heated pipe also comprise a square pipe made of a soaking plate.
9. A method for manufacturing a heat dissipation device is characterized by comprising the following steps:
manufacturing a radiating pipe and a heated pipe with copper powder inside;
mounting holes are formed in the side wall of the heated tube;
bolts are screwed into the mounting holes;
drawing the bolt to turn the orifice of the mounting hole outwards to form an annular flanging for assembling the radiating pipe;
one end of the radiating pipe is embedded into the annular flanging and sealed and fixed.
10. The method for manufacturing a heat dissipating device according to claim 9, wherein: the side wall of the heated pipe is provided with a mounting hole, and a steel column is used for propping from the inside of the heated pipe to the outside of the heated pipe at the mounting hole so that the hole opening of the mounting hole is protruded to form an annular flanging capable of assembling the radiating pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010825015.7A CN111964502A (en) | 2020-08-17 | 2020-08-17 | Heat dissipation device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010825015.7A CN111964502A (en) | 2020-08-17 | 2020-08-17 | Heat dissipation device and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111964502A true CN111964502A (en) | 2020-11-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010825015.7A Pending CN111964502A (en) | 2020-08-17 | 2020-08-17 | Heat dissipation device and manufacturing method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN111964502A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115091153A (en) * | 2022-07-05 | 2022-09-23 | 珠海市斗门区宇博电子科技有限公司 | Manufacturing process of radiator |
-
2020
- 2020-08-17 CN CN202010825015.7A patent/CN111964502A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115091153A (en) * | 2022-07-05 | 2022-09-23 | 珠海市斗门区宇博电子科技有限公司 | Manufacturing process of radiator |
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