CN111958069A - Method and device for grinding micro-groove on surface by electric spark - Google Patents
Method and device for grinding micro-groove on surface by electric spark Download PDFInfo
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- CN111958069A CN111958069A CN202010785647.5A CN202010785647A CN111958069A CN 111958069 A CN111958069 A CN 111958069A CN 202010785647 A CN202010785647 A CN 202010785647A CN 111958069 A CN111958069 A CN 111958069A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H5/00—Combined machining
- B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
- B23H5/08—Electrolytic grinding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H5/00—Combined machining
- B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
Abstract
The application belongs to the technical field of electric spark grinding, and particularly relates to a method and a device for grinding a surface micro-groove by using an electric spark, wherein the method for grinding the surface micro-groove by using the electric spark comprises the following steps: providing a disc electrode, a workpiece and a processing table; first abrasive particles are plated on the surface of the disc electrode; the workpiece and the disc electrode are arranged on the processing table, the pulse power supply is connected, the working table is started, the rotary driving mechanism drives the disc electrode to rotate, and meanwhile, the second moving driving mechanism drives the workpiece to move along the radial direction of the disc electrode, so that a surface micro-groove is processed on the workpiece; and after the surface micro-groove reaches the preset depth, turning off the pulse power supply, adding second abrasive particles into the working solution, starting the first moving driving mechanism to drive the rotating disc electrode to move back and forth, and removing a recasting layer on the processing surface of the surface micro-groove through the first abrasive particles on the surface of the disc electrode and the second abrasive particles in the working solution, thereby obtaining the high-quality surface micro-groove.
Description
Technical Field
The application belongs to the technical field of electric spark grinding, and particularly relates to a method and a device for grinding surface micro-grooves by electric sparks.
Background
The surface micro-groove is an important surface functional structure, and cutting machining, grinding machining, laser machining, electrolytic machining and electric spark machining are typical machining modes for obtaining the surface microstructure. Laser processing is difficult to process deep and narrow surface micro-grooves; the size precision of electrolytic machining is difficult to control; cutting/grinding processes can achieve high quality surfaces, but it is difficult to process deep and narrow surface micro-grooves. The electric discharge machining is a non-contact machining, has no macroscopic cutting force, can machine any high-strength and high-hardness conductive material, has high machining precision, and is often used for machining a surface microstructure. However, in the electric spark machining, materials are removed through instantaneous high temperature, and a recast layer is generated on the machined surface, so that the surface quality and the service life of the microstructure are influenced.
Disclosure of Invention
The application aims to provide a method and a device for grinding and processing micro grooves on a surface by electric spark, and aims to solve the technical problem that a recast layer generated in electric spark processing in the prior art influences the surface quality and the service life of a microstructure.
In order to achieve the purpose, the technical scheme adopted by the application is as follows: a method for grinding and processing micro grooves on a surface by electric spark comprises the following steps:
s10: providing a disc electrode, a workpiece and a processing table;
first abrasive particles are plated on the surface of the disc electrode;
the processing table is provided with a working platform, and a working cavity for loading working liquid is arranged on the working platform;
the machining table is also provided with a pulse power supply, a first moving driving mechanism, a rotating driving mechanism and a second moving driving mechanism, wherein the positive pole of the pulse power supply is electrically connected with the disc electrode, and the negative pole of the pulse power supply is electrically connected with the workpiece; the driving end of the first movement driving mechanism is connected with the rotation driving mechanism and is used for driving the rotation driving mechanism to move along the axial direction of the disc electrode;
the driving end of the second movement driving mechanism is positioned in the working liquid and is connected with the workpiece so as to drive the workpiece to move along the radial direction of the disc electrode;
s20: starting a workbench, wherein the rotary driving mechanism drives the disc electrode to rotate, and meanwhile, the second movable driving mechanism drives the workpiece to move along the radial direction of the disc electrode, so that a surface micro-groove is machined on the workpiece;
after the surface micro-groove reaches a preset depth, a second abrasive particle is added into the working liquid after the pulse power supply is turned off, and after the second abrasive particle is added, the first moving driving mechanism is started and drives the rotating disk electrode to move back and forth.
Optionally, the first abrasive particles and the second abrasive particles are both diamond abrasive particles, boron carbide abrasive particles, or boron nitride abrasive particles.
Optionally, the first abrasive particles have a particle size of 5 μm to 10 μm.
Optionally, the second abrasive particles have a particle size of 1 μm to 5 μm.
Optionally, the disc electrode is plated with the first abrasive particles in a machining area for machining the workpiece.
Optionally, the first abrasive particles are plated on the surface of the disk electrode to form a plating layer with a thickness of 10 μm.
Optionally, a plurality of protrusions are arranged on the outer peripheral wall of the disk electrode, and the protrusions are uniformly spaced along the circumferential direction of the disk electrode.
Optionally, the disk electrode is a copper foil, a yellow copper foil, a beryllium copper foil, or a tungsten copper foil.
Optionally, the thickness of the disc electrode is 50 μm to 200 μm.
One or more technical schemes in the method for grinding and processing the surface micro-groove by the electric spark at least have one of the following technical effects: when the device is used, the rotary driving mechanism drives the disc electrode to rotate, meanwhile, the workpiece is driven by the second moving driving mechanism to move towards the disc electrode along the radial direction of the disc electrode, in the process, the pulse power supply provides electric energy for the workpiece and the disc electrode, and after the distance between the workpiece and the rotating disc electrode is reduced to generate spark discharge, the workpiece still continues to reciprocate along the radial direction of the disc electrode, so that a surface micro-groove is prepared on the surface of the workpiece; after the depth of the surface micro-groove is machined to a preset depth, a pulse power supply is turned off, second abrasive particles are added into the working liquid, then a first moving driving mechanism is started, the first moving driving mechanism drives a rotating disc electrode to move along the axial direction of the disc electrode, namely the first moving driving mechanism drives the disc electrode to move back and forth along the width direction of the surface micro-groove, so that the first abrasive particles on the surface of the disc electrode perform micro-grinding on the side wall of the surface micro-groove to remove a recasting layer, meanwhile, the rotating disc electrode drives the second abrasive particles in the working liquid to move to perform micro-grinding on the side wall and the bottom of the surface micro-groove, and therefore the recasting layer on the machined surface of the surface micro-groove is removed, the high-quality surface micro-groove is obtained, and the technical problem that the recasting layer affects the surface quality and the service life of the microstructure is solved.
Another technical scheme adopted by the application is as follows: a device for grinding and processing micro grooves on a surface by electric spark is applied to the method for grinding and processing the micro grooves on the surface by the electric spark.
The utility model provides a device of little groove of electric spark abrasive machining surface for make foretell little groove of electric spark abrasive machining surface, after the little groove of disc electrode machining surface, first grit on first actuating mechanism drive disc electrode surface carries out little grinding to the little groove lateral wall of surface in order to get rid of the recast layer, and simultaneously, rotatory disc electrode drives the second grit in the working solution and moves, in order to carry out little grinding to the little groove lateral wall of surface and bottom, thereby get rid of the recast layer of the little groove machining surface of surface, obtain high-quality little groove of surface, so just solved recast layer and influenced the surface quality of micro-structure and life's technical problem.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a method for electric discharge machining of a micro groove on a surface according to an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a device for electric discharge machining of micro grooves on a machined surface according to another embodiment of the present application.
Fig. 3 is a schematic view showing a structure of the apparatus for electric discharge machining of micro grooves on a surface to remove a recast layer shown in fig. 2.
Fig. 4 is a structural diagram illustrating a view of a disk electrode in the apparatus for spark erosion machining of micro grooves on a surface shown in fig. 2.
Fig. 5 is a schematic structural view of another perspective of the disc electrode in the apparatus for spark erosion machining of micro grooves on a surface shown in fig. 4.
Wherein, in the figures, the respective reference numerals:
10-disc electrode 11-first abrasive particles 12-protrusions
20-workpiece 21-surface micro-groove 22-recast layer
31-working liquid 32-pulse power supply 33-second abrasive particles.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to fig. 1-5 are exemplary and intended to be used to illustrate the present application and should not be construed as limiting the present application.
In the description of the present application, it is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings, which is for convenience and simplicity of description, and does not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, is not to be considered as limiting.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
As shown in fig. 1 to 3, in an embodiment of the present application, a method for electric spark grinding surface micro grooves is provided, which is suitable for surface micro grooves 21 made of hard alloy or other high-hardness conductive metal;
the method for grinding and processing the micro-groove on the surface by the electric spark comprises the following steps:
s10: providing a disc electrode 10, a workpiece 20 and a processing table;
the surface of the disc electrode 10 is plated with first abrasive particles 11;
the processing table is provided with a working platform (not shown), and a working cavity (not shown) for loading working liquid 31 is arranged on the working platform;
the processing table is further provided with a pulse power supply 32, a first movement driving mechanism (not shown), a rotation driving mechanism (not shown) and a second movement driving mechanism (not shown), wherein the positive pole of the pulse power supply 32 is electrically connected with the disc electrode 10, and the negative pole of the pulse power supply 32 is electrically connected with the workpiece 20; the driving end of the rotary driving mechanism is connected with the disc electrode 10 and is used for driving the disc electrode 10 to rotate, and the driving end of the first mobile driving mechanism is connected with the rotary driving mechanism and is used for driving the rotary driving mechanism to move along the axial direction of the disc electrode 10;
the driving end of the second movement driving mechanism is positioned in the working liquid 31 and connected with the workpiece 20, so as to drive the workpiece 20 to move along the radial direction of the disc electrode 10;
s20: connecting the disc electrode 10 with the positive pole of a pulse power supply 32, and connecting the workpiece 20 with the negative pole of the pulse power supply 32;
s30: starting the workbench, driving the disc electrode 10 to rotate by the rotary driving mechanism, and driving the edge of the disc electrode 10 on the workpiece 20 to face in the radial direction of the disc electrode 10 by the second movable driving mechanism, so as to machine a surface micro-groove 21 on the workpiece 20;
after the surface micro-grooves 21 reach the preset depth, the pulse power supply 32 is turned off, the first abrasive particles 11 are added into the working liquid 31, and after the first abrasive particles 11 are added, the first moving driving mechanism is started, and the first moving driving mechanism drives the rotating disk electrode 10 to move back and forth.
After the surface micro-grooves 21 reach the preset depth, the pulse power supply 32 is turned off, the second abrasive particles 33 are added into the working liquid 31, and after the second abrasive particles 33 are added, the first moving driving mechanism is started, and the first moving driving mechanism drives the rotating disk electrode 10 to move back and forth.
Specifically, in the method for grinding and processing the surface micro-groove by using the electric spark according to the embodiment of the present application, when in use, the rotary driving mechanism drives the disk electrode 10 to rotate, and meanwhile, the workpiece 20 is driven by the second mobile driving mechanism to move towards the disk electrode 10 along the radial direction of the disk electrode 10, and in the process, the pulse power supply provides electric energy for the workpiece and the disk electrode, and after the distance between the workpiece 20 and the rotating disk electrode 10 is reduced to generate the spark discharge, the workpiece 20 still continues to reciprocate back and forth along the radial direction of the disk electrode 10, so that the surface micro-groove 21 is prepared on the surface of the workpiece 20; after the depth of the surface micro-groove 21 is processed to a preset depth, the pulse power supply 32 is turned off, the second abrasive particles 33 are added into the working liquid 31, then, the first moving driving mechanism is started, the first moving driving mechanism drives the rotating disk electrode 10 to move along the axial direction of the disk electrode 10, namely, the first moving driving mechanism drives the disc electrode 10 to move back and forth along the width direction of the surface micro-groove 21, so that the first abrasive particles 11 on the surface of the disc electrode 10 micro-grind the side walls of the surface micro-grooves 21 to remove the recast layer 22, meanwhile, the rotating disk electrode 10 drives the second abrasive particles 33 in the working liquid 31 to move so as to perform micro-grinding on the side walls and the bottom of the surface micro-grooves 21, thereby removing the recast layer 22 on the processing surface of the surface micro-groove 21, obtaining the surface micro-groove 21 with high quality, therefore, the technical problem that the recast layer 22 influences the surface quality and the service life of the microstructure is solved.
It should be noted that, the disc electrode 10 is usually driven by the rotation driving mechanism to rotate at a high speed, the rotation speed of the disc electrode 10 is high, the working fluid 31 flows fast, and the processing quality is good, in addition, the displacement amplitude of the disc electrode 10 driven by the first movement driving mechanism can be determined according to the width of the surface micro-groove 21, the thickness of the disc electrode 10, and the thickness of the recast layer 22, so that it is only necessary to ensure that the recast layer 22 on the side wall of the surface micro-groove 21 can be completely removed by the first abrasive particles 11, and the displacement amplitude of the disc electrode 10 driven by the first movement driving mechanism is usually small, but the specific movement amplitude thereof can be set according to actual needs, and is not limited herein.
In this embodiment, when the surface micro-grooves 21 are machined, the first abrasive particles 11 on the surface of the disk electrode 10 can enhance the capability of the disk electrode 10 to drive the working solution 31, and can also effectively weaken the side discharge of the disk electrode 10, thereby reducing the side machining gap of the surface micro-grooves 21 and improving the machining precision.
In this embodiment, the first driving moving mechanism and the second driving moving mechanism may be linear modules or cylinders, but in other embodiments, the first driving moving mechanism and the second driving moving mechanism may also be mechanisms that drive the components to make linear motion.
In this embodiment, the rotation driving mechanism is a hollow rotation platform or a motor, so as to directly drive the disk electrode 10 to rotate, but in other embodiments, the rotation driving mechanism may also be a mechanism that drives the disk electrode 10 to rotate around its center.
In another embodiment of the present application, the first abrasive grain 11 and the second abrasive grain 33 in the method for electrospark grinding of the micro grooves on the surface are both diamond abrasive grains, boron carbide abrasive grains or boron nitride abrasive grains.
Specifically, the first abrasive grains 11 and the second abrasive grains 33 are made of a diamond material, a boron carbide material or a boron nitride material, and the diamond material, the boron carbide material or the boron nitride material is hard, so that the recast layer 22 on the workpiece 20 can be quickly ground, and the production efficiency is improved.
In another embodiment of the present application, there is provided the method for electrospark grinding of micro grooves on a surface, wherein the first abrasive grains 11 have a grain size of 5 μm to 10 μm. Specifically, the particle size of the first abrasive grains 11 is 5 μm, 5.5 μm, 6 μm, 6.5 μm, 7 μm, 7.5 μm, 8 μm, 8.5 μm, 9 μm, 9.5 μm, or 10 μm, and setting the particle size of the first abrasive grains 11 within the above range ensures good machining accuracy of the surface micro-grooves 21, prevents large machining dimensional deviation of the surface micro-grooves 21 due to excessively large particle size, prevents excessive grinding of the material from causing waste of the material, and prevents failure of good grinding due to excessively small particle size.
In another embodiment of the present application, the method for electrospark grinding of micro grooves on a surface is provided, wherein the second abrasive particles 33 have a particle size of 1 μm to 5 μm. Specifically, the second abrasive grains 33 have a particle size of 1 μm, 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, or 5 μm, and when the particle size of the second abrasive grains 33 is set within the above range, the recast layer 22 in the surface micro-grooves 21 can be effectively removed, and it is possible to avoid that the grain size is too large to move in the working liquid 31 and the recast layer 22 cannot be removed, and that it is also possible to prevent that a good grinding effect cannot be achieved due to too small grain size.
In another embodiment of the present application, referring to fig. 2, 3 and 5, the disc electrode 10 of the method for spark erosion machining of micro grooves on a surface is provided with a first abrasive particle 11 coated in a machining region for machining a workpiece 20. During specific machining, the peripheral edge area of the disc electrode 10 is in contact with the workpiece 20, so that the workpiece 20 is machined, and the first abrasive particles 11 are plated only on the peripheral edge area, so that on the basis of ensuring normal machining, the maximum limit can be reduced, the plating area of the first abrasive particles 11 is reduced, the waste of materials is reduced, and the cost is saved.
In another embodiment of the present application, the method for electrospark machining of micro grooves on a surface is provided, in which the first abrasive particles 11 are plated on the surface of the disk electrode 10 to a thickness of 10 μm. The thickness of the coating is set to ensure that the first abrasive can be stably fixed on the surface of the disc electrode 10, and in addition, the situation that the material is wasted due to too many first abrasive grains 11, and the good grinding effect cannot be achieved due to too few first abrasive grains 11 can be avoided.
Further, both opposite surfaces of the disc electrode 10 are plated with the first abrasive grains 11.
In another embodiment of the present application, referring to fig. 4 and 5, a plurality of protrusions 12 are disposed on the outer circumferential wall of the disk electrode 10 in the method for electric discharge machining of micro grooves on the surface, the protrusions 12 are uniformly spaced along the circumferential direction of the disk electrode 10, the disk electrode 10 is toothed, and the protrusions 12 are spaced, so that when the disk electrode 10 rotates, the working fluid 31 can be effectively driven to flush the machining surface of the workpiece 20, discharge of chips in the machining gap is promoted, and a good electric discharge machining state is ensured.
It should be noted that, the distance between the protrusions 12, the height and the width of the protrusions 12 can be set according to actual production requirements, so as to meet different processing requirements of the workpiece.
In another embodiment of the present application, the disc electrode 10 in the method for spark-erosion machining of surface micro-grooves is a copper foil, a yellow copper foil, a beryllium copper foil, or a tungsten copper foil. The disc electrode 10 is made of copper foil, yellow copper foil, beryllium copper foil or tungsten copper foil, so that the disc electrode 10 has good conductivity, and the processing quality and the processing precision are effectively improved.
Further, the disc electrode 10 is formed by installing and fixing a copper foil on a fixture, then setting the center position of the disc electrode 10, and then machining the inner hole diameter phi on the copper foil by adopting wire electrical discharge machining1Is 34mm, and the diameter of the outer circle is phi2A disc electrode 10 having a height H of the projection 12 of 1mm and a width L of the projection 12 of 2.8mm, which is 53 mm.
In another embodiment of the present application, the thickness of the disc electrode 10 in the method for spark-erosion machining of surface micro-grooves is 50 μm to 200 μm. Specifically, the thickness of the disc electrode 10 may be 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, 160 μm, 170 μm, 180 μm, 190 μm, or 200 μm, and setting the thickness of the disc electrode 10 within the above range ensures that the disc electrode 10 has good strength, and can stably grind away the material on the workpiece 20 to form the surface micro grooves 21; if the thickness is set to be too large, the thickness of the disk electrode 10 is too large, and the width of the surface micro-groove 21 is too large, so that the processing and manufacturing requirements are not met; if the thickness is set too small, the disk electrode 10 is easily damaged and the surface micro-grooves 21 cannot be machined.
In another embodiment of the present application, the working fluid 31 in the method for electric spark grinding surface micro grooves is electric spark oil. The electric spark oil is an indispensable discharge medium liquid for electric spark machining, can insulate and deion, cool the high temperature during electric spark machining and remove carbon slag, ensures the machining precision, has relatively high transparency and is convenient for manual operation; in addition, the odor is light, belongs to an environment-friendly material, and can effectively reduce the manufacturing pollution and protect the environment.
In another embodiment of the present application, referring to fig. 2 and 3, an apparatus for spark milling a micro-groove on a surface is provided, which is applied to the above-mentioned method for spark milling a micro-groove on a surface.
Specifically, the device for electric spark grinding of the surface micro-groove according to the embodiment of the present application is used for manufacturing the above-mentioned electric spark grinding surface micro-groove 21, after the surface micro-groove 21 is machined by the disk electrode 10, the first driving mechanism drives the first abrasive particles 11 on the surface of the disk electrode 10 to perform micro-grinding on the side wall of the surface micro-groove 21 so as to remove the recast layer 22, and at the same time, the rotating disk electrode 10 drives the second abrasive particles 33 in the working solution 31 to perform micro-grinding on the side wall and the bottom of the surface micro-groove 21, so as to remove the recast layer 22 on the machined surface of the surface micro-groove 21 and obtain a high-quality surface micro-groove 21, thereby solving the technical problem that the recast layer 22 affects the surface quality and the service life of the microstructure.
The present invention is not intended to be limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed.
Claims (10)
1. A method for grinding and processing micro grooves on a surface by electric spark is characterized in that: the method comprises the following steps:
s10: providing a disc electrode, a workpiece and a processing table;
first abrasive particles are plated on the surface of the disc electrode;
the processing table is provided with a working platform, and a working cavity for loading working liquid is arranged on the working platform;
the machining table is also provided with a pulse power supply, a first moving driving mechanism, a rotating driving mechanism and a second moving driving mechanism, wherein the positive pole of the pulse power supply is electrically connected with the disc electrode, and the negative pole of the pulse power supply is electrically connected with the workpiece; the driving end of the first movement driving mechanism is connected with the rotation driving mechanism and is used for driving the rotation driving mechanism to move along the axial direction of the disc electrode;
the driving end of the second movement driving mechanism is positioned in the working liquid and is connected with the workpiece so as to drive the workpiece to move along the radial direction of the disc electrode;
s20: starting a workbench, wherein the rotary driving mechanism drives the disc electrode to rotate, and meanwhile, the second movable driving mechanism drives the workpiece to move along the radial direction of the disc electrode, so that a surface micro-groove is machined on the workpiece;
after the surface micro-groove reaches a preset depth, a second abrasive particle is added into the working liquid after the pulse power supply is turned off, and after the second abrasive particle is added, the first moving driving mechanism is started and drives the rotating disk electrode to move back and forth.
2. The method of spark erosion machining a surface microchannel as set forth in claim 1, wherein: the first abrasive grain and the second abrasive grain are diamond abrasive grains, boron carbide abrasive grains or boron nitride abrasive grains.
3. The method of spark erosion machining a surface microchannel as set forth in claim 1, wherein: the first abrasive grains have a grain size of 5 to 10 μm.
4. The method of spark erosion machining a surface microchannel as set forth in claim 1, wherein: the second abrasive grains have a grain size of 1 to 5 μm.
5. The method for electric discharge machining of a micro groove in a surface according to any one of claims 1 to 3, characterized in that: the disc electrode is used for plating the first abrasive particles in a processing area of the workpiece.
6. The method for electric discharge machining of a micro groove in a surface according to any one of claims 1 to 3, characterized in that: the thickness of a plating layer plated on the surface of the disc electrode by the first abrasive particles is 10 microns.
7. The method for electric discharge machining of a micro groove in a surface according to any one of claims 1 to 3, characterized in that: the outer peripheral wall of the disk electrode is provided with a plurality of bulges, and the bulges are uniformly arranged at intervals along the circumferential direction of the disk electrode.
8. The method for electric discharge machining of a micro groove in a surface according to any one of claims 1 to 3, characterized in that: the disc electrode is a copper foil, a yellow copper foil, a beryllium copper foil or a tungsten copper foil.
9. The method for electric discharge machining of a micro groove in a surface according to any one of claims 1 to 3, characterized in that: the thickness of the disc electrode is 50-200 μm.
10. An apparatus for electric spark grinding of surface micro-grooves, characterized in that it is applied to the method of electric spark grinding of surface micro-grooves according to any of claims 1 to 9.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010785647.5A CN111958069A (en) | 2020-08-06 | 2020-08-06 | Method and device for grinding micro-groove on surface by electric spark |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010785647.5A CN111958069A (en) | 2020-08-06 | 2020-08-06 | Method and device for grinding micro-groove on surface by electric spark |
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| CN202010785647.5A Pending CN111958069A (en) | 2020-08-06 | 2020-08-06 | Method and device for grinding micro-groove on surface by electric spark |
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