CN111947446A - Semiconductor oven nitrogen gas adjusting device - Google Patents
Semiconductor oven nitrogen gas adjusting device Download PDFInfo
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- CN111947446A CN111947446A CN202010849862.7A CN202010849862A CN111947446A CN 111947446 A CN111947446 A CN 111947446A CN 202010849862 A CN202010849862 A CN 202010849862A CN 111947446 A CN111947446 A CN 111947446A
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- wall
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- adjusting device
- nitrogen
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/14—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects using gases or vapours other than air or steam, e.g. inert gases
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/001—Drying-air generating units, e.g. movable, independent of drying enclosure
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Drying Of Solid Materials (AREA)
Abstract
The invention belongs to the technical field of semiconductor ovens, and particularly relates to a nitrogen adjusting device of a semiconductor oven, which aims at solving the problem that nitrogen is not heated. According to the invention, the heater, the electronic air pump, the heating box, the air injection disc, the spray head, the fifth conduit, the fourth conduit, the first electromagnetic valve and the second electromagnetic valve are arranged, when the semiconductor is dried, the heater and the electronic air pump are turned on, and heated nitrogen is introduced into the drying box, so that the effect of drying the semiconductor can be achieved, and the semiconductor can be prevented from being oxidized.
Description
Technical Field
The invention relates to the technical field of semiconductor ovens, in particular to a nitrogen adjusting device for a semiconductor oven.
Background
At present, when a semiconductor is produced, a semi-finished semiconductor product needs to be dried, and the semi-finished semiconductor product is dried in the air and is very easy to oxidize, so that when the semi-finished semiconductor product is industrially produced, nitrogen is added into an oven to prevent the semi-finished semiconductor product from being oxidized.
Through retrieval, the patent with the Chinese patent authorization number of CN104896908B discloses a nitrogen adjusting device for a semiconductor oven, which comprises a box body, a front door, a support, an inner container, an air inlet interface, a nitrogen adjusting valve, a fan and a tray.
The above patent also has the following disadvantages: when nitrogen is introduced into the oven, the temperature of the nitrogen just released is lower, the temperature inside the oven can be reduced, the effect of semiconductor drying is poor, the semiconductor cannot be well dried, and the drying quality of the oven is reduced.
Disclosure of Invention
Based on the technical problems that when nitrogen is introduced into an oven, the temperature of the nitrogen which is just released is low, the temperature in the oven can be reduced, the semiconductor drying effect is poor, the semiconductor cannot be dried well, and the drying quality of the oven is reduced, the nitrogen adjusting device for the semiconductor oven is provided.
The invention provides a nitrogen adjusting device for a semiconductor oven, which comprises a bottom plate, wherein a nitrogen bottle, a heating box and a drying box are arranged on the outer wall of the top of the bottom plate, an electronic air pump is arranged on the outer wall of one side of the heating box, the input end of the electronic air pump and the inner wall of one side of the heating box are provided with the same third guide roller, the output end of the nitrogen bottle and the inner wall of the top of the heating box are provided with the same first guide pipe, heaters are arranged on two sides of the inner wall of the heating box, air jet discs are arranged on two sides of the inner wall of the drying box, nozzles are distributed at equal intervals on the outer wall of one side of each air jet disc, the inclination angles of the nozzles are different, a second guide pipe is arranged on the inner wall of one side of each air jet disc, the other end of the second guide pipe is arranged at the output end of the electronic air, the outer wall of one side of the fourth conduit is provided with a first electromagnetic valve and a second electromagnetic valve respectively.
Preferably, the inner wall of the top of the drying box is provided with a temperature sensor, the outer wall of one side of the drying box is provided with a display screen, the signal input end of the display screen is connected with a processor through a signal line, and the signal output end of the temperature sensor is connected with the signal input end of the processor through a signal line.
Preferably, the bottom inner wall both sides of stoving case all are provided with the fan, and the fan is the slope structure.
Preferably, the inner wall of stoving case is provided with the ventilative board of placing that the equidistance distributes, and ventilative top outer wall of placing the board be provided with the semiconductor standing groove of big small dimension difference.
Preferably, the top outer wall of heating cabinet is provided with the motor, and the output shaft of motor has the bull stick through the coupling joint, and the outer wall both sides of bull stick all are provided with irregularly distributed's horizontal pole, and the other end of horizontal pole is provided with first puddler.
Preferably, the first stirring rod is of an arc-shaped structure, and a connecting plate is arranged on the outer wall of one side of the first stirring rod.
Preferably, the connecting plate is of a zigzag structure, and the outer wall of one side of the connecting plate is provided with filter holes which are distributed equidistantly and have different sizes.
Preferably, the outer wall of one side of horizontal pole is provided with the connecting rod, and the outer wall of one side of connecting rod is provided with the mutual crisscross stirring piece that distributes of big small dimension, and the opposite side outer wall of connecting rod is provided with Y shape puddler.
Preferably, the outer wall of one side of horizontal pole is provided with the stirring ring, and the outer wall of one side of horizontal pole is provided with the opposite arc pole of opening direction, and the stirring ring is triangular annular structure.
Preferably, the drying oven further comprises a flow blocking box arranged on the inner wall of one side of the drying box, the outer wall of the top and the outer wall of the bottom of the flow blocking box are respectively provided with an air outlet and an air inlet which are distributed equidistantly, the inner wall of the flow blocking box is provided with flow blocking channels which are distributed equidistantly, and the flow blocking channels are of a zigzag structure.
The beneficial effects of the invention are as follows:
1. this nitrogen gas adjusting device convenient to heat nitrogen gas, through being provided with the heater, the electron air pump, the heating cabinet, the jet-propelled dish, the shower nozzle, the fifth pipe, the fourth pipe, first solenoid valve and second solenoid valve, when drying to the semiconductor, open heater and electron air pump, nitrogen gas after will heating is leading-in to the drying cabinet in, both can play the effect of drying to the semiconductor and can prevent that the semiconductor from being oxidized, the angle diverse of shower nozzle can be dried the semiconductor of each place of drying cabinet inside, can be with the gaseous reintroduction to the heating cabinet after the heating through fifth pipe and fourth pipe, the stoving effect of semiconductor can be accelerated in the flow that the reuse of nitrogen gas produced.
2. This nitrogen gas adjusting device convenient to heat nitrogen gas, through being provided with the motor, the bull stick, the connecting plate, first puddler, the horizontal pole, the stirring frame, the stirring piece, arc ejector pin and Y shape puddler, open the motor, the motor drives the bull stick and rotates, and then horizontal pole and first puddler begin to rotate, can carry out abundant hybrid heating with nitrogen gas, the filtration hole of equidistance distribution's variation in size is seted up to one side outer wall of connecting plate, the annular structure that the puddler is triangle-shaped and Y shape puddler can produce the swirl of different size difference height and different shapes when rotating, can effectually mix nitrogen gas, the nitrogen gas of even heating can improve semiconductor's stoving effect.
3. This nitrogen gas adjusting device convenient to heat nitrogen gas, through being provided with the fan, the fan sets up in stoving bottom of the case inner wall both sides, it can carry out abundant mixture with the nitrogen gas after the heating in the inside of stoving case to open the fan, in addition through being provided with the choked flow passageway, the choked flow case, air inlet and gas outlet, the choked flow passageway is broken line type structure, choked flow case and choked flow passageway can effectively reduce the flow velocity of nitrogen gas, improve the dwell time of nitrogen gas in stoving incasement portion, further improvement semiconductor's stoving effect, the practicality of device has been improved.
The parts of the device not involved are the same as or can be implemented using prior art.
Drawings
Fig. 1 is a schematic structural diagram of a nitrogen gas regulating device of a semiconductor oven according to embodiment 1 of the present invention;
fig. 2 is a schematic structural diagram of a stirring frame of a nitrogen adjusting device of a semiconductor oven according to embodiment 1 of the present invention;
fig. 3 is a schematic structural diagram of a filter hole of a nitrogen adjusting device of a semiconductor oven according to embodiment 1 of the present invention;
fig. 4 is a schematic structural diagram of a semiconductor placing groove of the nitrogen adjusting device for a semiconductor oven in embodiment 1 of the present invention;
fig. 5 is a schematic structural diagram of a flow-resisting box of a nitrogen regulating device of a semiconductor oven in embodiment 2 of the present invention.
In the figure: 1 bottom plate, 2 nitrogen gas bottles, 3 first pipes, 4 heating boxes, 5 connecting plates, 6 heaters, 7 motors, 8 rotating rods, 9 first stirring rods, 10 second pipes, 11 cross rods, 12 third pipes, 13 electronic air pumps, 14 fourth pipes, 15 first electromagnetic valves, 16 second electromagnetic valves, 17 fifth pipes, 18 temperature sensors, 19 spray heads, 20 display screens, 21 air-jet discs, 22 fans, 23 air-permeable placing plates, 24 stirring frames, 25 arc-shaped rods, 26 stirring blocks, 27 connecting rods, 28Y-shaped stirring rods, 29 filtering holes, 30 semiconductor placing grooves, 31 air inlets, 32 air outlets, 33 flow-resisting boxes and 34 flow-resisting channels.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Example 1
Referring to fig. 1-4, a nitrogen adjusting device for a semiconductor oven comprises a bottom plate 1, a nitrogen bottle 2, a heating box 4 and a drying box are arranged on the outer wall of the top of the bottom plate 1, an electronic air pump 13 is fixed on the outer wall of one side of the heating box 4 through screws, the input end of the electronic air pump 13 and the inner wall of one side of the heating box 4 are connected with a same third guide roller 12 through flanges, the output end of the nitrogen bottle 2 and the inner wall of the top of the heating box 4 are connected with a same first conduit 3 through flanges, heaters 6 are fixed on both sides of the inner wall of the heating box 4 through screws, jet disks 21 are fixed on both sides of the inner wall of the drying box through screws, nozzles 19 are fixed on the outer wall of one side of the jet disks 21 through screws and distributed equidistantly, the inclination angles of the nozzles 19 are different, a second conduit 10 is connected on the inner wall of one side of the jet, the inner wall of one side of the drying box is connected with a fifth guide pipe 17 through a flange, the other end of the fifth guide pipe 17 is connected with two fourth guide pipes 14 with the same specification through a three-way pipe, and the outer wall of one side of each fourth guide pipe 14 is connected with a first electromagnetic valve 15 and a second electromagnetic valve 16 through flanges respectively.
In the invention, a temperature sensor 18 is fixed on the inner wall of the top of the drying box through a screw, a display screen 20 is fixed on the outer wall of one side of the drying box through a screw, the signal input end of the display screen 20 is connected with a processor through a signal wire, and the signal output end of the temperature sensor 18 is connected with the signal input end of the processor through a signal wire.
In the invention, the fans 22 are fixed on two sides of the inner wall of the bottom of the drying box through screws, and the fans 22 are all in an inclined structure.
According to the invention, the inner wall of the drying box is fixed with the air-permeable placing plates 23 which are distributed equidistantly through screws, the outer wall of the top of each air-permeable placing plate 23 is provided with the semiconductor placing grooves 30 which are different in size and specification, the outer wall of the top of the heating box 4 is fixed with the motor 7 through screws, the output shaft of the motor 7 is connected with the rotating rod 8 through the coupling, the two sides of the outer wall of the rotating rod 8 are welded with the cross rods 11 which are distributed irregularly, and the other end of each cross rod 11 is fixed with the first stirring rod 9 through.
In the invention, the first stirring rod 9 is of an arc structure, the outer wall of one side of the first stirring rod 9 is fixed with the connecting plate 5 through a screw, the connecting plate 5 is of a fold line structure, and the outer wall of one side of the connecting plate 5 is provided with filtering holes 29 which are distributed equidistantly and have different sizes.
In the invention, the outer wall of one side of the cross rod 11 is welded with a connecting rod 27, the outer wall of one side of the connecting rod 27 is welded with stirring blocks 26 which are distributed in a staggered manner in size, the outer wall of the other side of the connecting rod 27 is provided with a Y-shaped stirring rod 28, the outer wall of one side of the cross rod 11 is fixed with a stirring ring 24 through a screw, the outer wall of one side of the cross rod 11 is fixed with an arc-shaped rod 25 with opposite opening directions through a screw, and the stirring ring 24 is of a triangular.
Connect the power with equipment, firstly, open nitrogen cylinder 2 and lead in nitrogen gas to heating cabinet 4 through first pipe 3, open heater 6 and motor 7, motor 7 drives bull stick 8 and rotates, and then first puddler 9, horizontal pole 11, agitator frame 24 and arc pole 25 can carry out even heating to nitrogen gas, open electron air pump 13, nitrogen gas after will heating is leading-in to the drying cabinet through third pipe 12 and second pipe 10, carry out abundant stoving to the semiconductor through shower nozzle 19 of angle diverse, the temperature value of temperature sensor 18 detectable stoving incasement portion, temperature sensor 18 gives the treater with signal transmission, the treater acts on display screen 20, be convenient for accurately dry and learn the temperature of incasement portion, the nitrogen gas accessible fifth pipe 17 of derivation and fourth pipe 14 are reintroduced into heating cabinet 4.
Example 2
Referring to fig. 5, in this embodiment, compared with embodiment 1, the nitrogen adjusting device for a semiconductor oven further includes a flow blocking box 33 fixed to an inner wall of one side of the drying box by screws, an air outlet 32 and an air inlet 31 are respectively formed in an outer wall of the top and an outer wall of the bottom of the flow blocking box 33, the inner wall of the flow blocking box 33 is provided with flow blocking channels 34, the flow blocking channels 34 are equidistantly distributed, and the flow blocking channels 34 are of a zigzag structure.
The equipment is connected with a power supply, firstly, a nitrogen bottle 2 is opened to lead nitrogen into a heating box 4 through a first conduit 3, a heater 6 and a motor 7 are opened, the motor 7 drives a rotating rod 8 to rotate, then a first stirring rod 9, a cross rod 11, a stirring frame 24 and an arc rod 25 can uniformly heat the nitrogen, an electronic air pump 13 is opened, the heated nitrogen is led into the drying box through a third conduit 12 and a second conduit 10, the semiconductor is sufficiently dried through spray heads 19 with different angles, a temperature sensor 18 can detect the temperature value inside the drying box, the temperature sensor 18 transmits a signal to a processor, the processor acts on a display screen 20 to accurately know the temperature inside the drying box, the led nitrogen can be led into the heating box 4 again through a fifth conduit 17 and a fourth conduit 14, in addition, a flow blocking channel 34 is of a broken line type structure, the flow blocking box 33 and the flow blocking channel 34 can effectively reduce the flow speed of the nitrogen, improve the retention time of the nitrogen in the drying box, and further improve the drying effect of the semiconductor.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (10)
1. The nitrogen adjusting device for the semiconductor oven comprises a bottom plate (1) and is characterized in that a nitrogen bottle (2), a heating box (4) and a drying box are arranged on the outer wall of the top of the bottom plate (1), an electronic air pump (13) is arranged on the outer wall of one side of the heating box (4), the input end of the electronic air pump (13) and the inner wall of one side of the heating box (4) are provided with the same third guide roller (12), the output end of the nitrogen bottle (2) and the inner wall of the top of the heating box (4) are provided with the same first guide pipe (3), heaters (6) are arranged on two sides of the inner wall of the heating box (4), air jet discs (21) are arranged on two sides of the inner wall of the drying box, spray heads (19) are arranged on the outer wall of one side of each air jet disc (21) at equal intervals, the inclination angles of the spray heads (19) are different, the other end of the second conduit (10) is arranged at the output end of the electronic air pump (13), a fifth conduit (17) is arranged on the inner wall of one side of the drying box, the other end of the fifth conduit (17) is connected with two fourth conduits (14) with the same specification through a three-way pipe, and a first electromagnetic valve (15) and a second electromagnetic valve (16) are respectively arranged on the outer wall of one side of each fourth conduit (14).
2. The nitrogen adjusting device for the semiconductor oven as claimed in claim 1, wherein a temperature sensor (18) is arranged on the inner wall of the top of the drying oven, a display screen (20) is arranged on the outer wall of one side of the drying oven, a signal input end of the display screen (20) is connected with a processor through a signal line, and a signal output end of the temperature sensor (18) is connected with a signal input end of the processor through a signal line.
3. The nitrogen adjusting device for the semiconductor oven as claimed in claim 2, wherein the fans (22) are arranged on two sides of the inner wall of the bottom of the drying oven, and the fans (22) are of inclined structures.
4. The nitrogen adjusting device for the semiconductor oven according to claim 3, wherein the inner wall of the drying oven is provided with air-permeable placing plates (23) distributed at equal intervals, and the outer wall of the top of each air-permeable placing plate (23) is provided with semiconductor placing grooves (30) with different sizes and specifications.
5. The nitrogen adjusting device for the semiconductor oven according to claim 1, wherein a motor (7) is arranged on the outer wall of the top of the heating box (4), an output shaft of the motor (7) is connected with a rotating rod (8) through a coupler, cross rods (11) which are distributed irregularly are arranged on two sides of the outer wall of the rotating rod (8), and a first stirring rod (9) is arranged at the other end of each cross rod (11).
6. The nitrogen adjusting device for the semiconductor oven as claimed in claim 5, wherein the first stirring rod (9) is of an arc-shaped structure, and a connecting plate (5) is arranged on the outer wall of one side of the first stirring rod (9).
7. The nitrogen adjusting device for the semiconductor oven as claimed in claim 6, wherein the connecting plate (5) is of a zigzag structure, and the outer wall of one side of the connecting plate (5) is provided with filtering holes (29) which are distributed equidistantly and have different sizes.
8. The nitrogen adjusting device for the semiconductor oven according to claim 7, wherein a connecting rod (27) is arranged on the outer wall of one side of the cross rod (11), stirring blocks (26) with sizes and specifications which are distributed in a staggered mode are arranged on the outer wall of one side of the connecting rod (27), and a Y-shaped stirring rod (28) is arranged on the outer wall of the other side of the connecting rod (27).
9. The nitrogen adjusting device for the semiconductor oven according to claim 8, wherein the outer wall of one side of the cross rod (11) is provided with a stirring ring (24), the outer wall of one side of the cross rod (11) is provided with arc rods (25) with opposite opening directions, and the stirring ring (24) is of a triangular annular structure.
10. The nitrogen adjusting device for the semiconductor oven according to any one of claims 1 to 9, further comprising a flow blocking box (33) arranged on an inner wall of one side of the drying box, wherein an air outlet (32) and an air inlet (31) which are equidistantly distributed are respectively arranged on an outer wall of the top and an outer wall of the bottom of the flow blocking box (33), flow blocking channels (34) which are equidistantly distributed are arranged on the inner wall of the flow blocking box (33), and the flow blocking channels (34) are of a zigzag structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010849862.7A CN111947446A (en) | 2020-08-21 | 2020-08-21 | Semiconductor oven nitrogen gas adjusting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010849862.7A CN111947446A (en) | 2020-08-21 | 2020-08-21 | Semiconductor oven nitrogen gas adjusting device |
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| CN111947446A true CN111947446A (en) | 2020-11-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010849862.7A Pending CN111947446A (en) | 2020-08-21 | 2020-08-21 | Semiconductor oven nitrogen gas adjusting device |
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| CN (1) | CN111947446A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112683019A (en) * | 2020-12-29 | 2021-04-20 | 安徽泽升科技有限公司 | Multifunctional nuclear magnetic tube drying equipment |
| CN112833629A (en) * | 2020-12-29 | 2021-05-25 | 安徽泽升科技有限公司 | Nuclear-magnetism pipe drying system |
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| CN104896908A (en) * | 2015-05-11 | 2015-09-09 | 池州华钛半导体有限公司 | Semiconductor oven nitrogen adjusting device |
| CN109405440A (en) * | 2018-10-23 | 2019-03-01 | 四川深北电路科技有限公司 | A kind of printed circuit board baking equipment |
| CN208779819U (en) * | 2018-09-06 | 2019-04-23 | 广州能茵热泵科技有限公司 | A kind of heat pump dryer with dust reduction capability |
| WO2019120056A1 (en) * | 2017-12-22 | 2019-06-27 | 巨石集团有限公司 | Modular oven structure and tunnel oven |
| CN210154209U (en) * | 2019-03-26 | 2020-03-17 | 湖南三德科技股份有限公司 | Nitrogen-introducing drying device for sample drying |
| CN111070883A (en) * | 2019-12-16 | 2020-04-28 | 东莞市瑞冠彩印包装有限公司 | Printed matter drying-machine |
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2020
- 2020-08-21 CN CN202010849862.7A patent/CN111947446A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104896908A (en) * | 2015-05-11 | 2015-09-09 | 池州华钛半导体有限公司 | Semiconductor oven nitrogen adjusting device |
| WO2019120056A1 (en) * | 2017-12-22 | 2019-06-27 | 巨石集团有限公司 | Modular oven structure and tunnel oven |
| CN208779819U (en) * | 2018-09-06 | 2019-04-23 | 广州能茵热泵科技有限公司 | A kind of heat pump dryer with dust reduction capability |
| CN109405440A (en) * | 2018-10-23 | 2019-03-01 | 四川深北电路科技有限公司 | A kind of printed circuit board baking equipment |
| CN210154209U (en) * | 2019-03-26 | 2020-03-17 | 湖南三德科技股份有限公司 | Nitrogen-introducing drying device for sample drying |
| CN111070883A (en) * | 2019-12-16 | 2020-04-28 | 东莞市瑞冠彩印包装有限公司 | Printed matter drying-machine |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112683019A (en) * | 2020-12-29 | 2021-04-20 | 安徽泽升科技有限公司 | Multifunctional nuclear magnetic tube drying equipment |
| CN112833629A (en) * | 2020-12-29 | 2021-05-25 | 安徽泽升科技有限公司 | Nuclear-magnetism pipe drying system |
| CN112683019B (en) * | 2020-12-29 | 2022-03-11 | 安徽泽升科技有限公司 | Multifunctional nuclear magnetic tube drying equipment |
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Application publication date: 20201117 |
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